SGM48010 [SGMICRO]
Power MOSFET and IGBT Gate Driver with Comprehensive Protections;
| 型号： | SGM48010 |
| 厂家： | 
Shengbang Microelectronics Co, Ltd |
| 描述： | Power MOSFET and IGBT Gate Driver with Comprehensive Protections 栅 双极性晶体管 |
| 文件： | 总6页 (文件大小：471K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SGM48010
Power MOSFET and IGBT Gate Driver
with Comprehensive Protections
GENERAL DESCRIPTION
FEATURES
The SGM48010 is a high-speed gate driver capable of
effectively driving MOSFET and IGBT power switches.
It allows for up to 8A source and 12A sink peak currents
at VDD = 20V. The SGM48010 provides a comprehensive
set of protection features such as over-voltage
protection, thermal shutdown protection, under-voltage
lockout and short-circuit protection. It operates with a
wide supply voltage of 4.5V to 20V.
• Simple and Reliable
• 8A Source and 12A Sink Peak Drive Currents
• Wide Supply Voltage Range: 4.5V to 20V
• Fast Propagation Delays: 35ns (TYP)
• Fast Rise Time: 10ns (TYP)
• Fast Fall Time: 10ns (TYP)
• Ringing Suppression
• Self-Holding Logic Inputs (IN and SYNC Pins)
• Negative Voltage Capability on IN and SYNC Pins:
-10V (VDD - VIN_MIN ≤ 22V and VDD - VSYNC_MIN ≤ 22V)
• Negative Voltage Capability on GD Pin:
-5V (500ns Pulse)
The SGM48010 is available in a Green TDFN-2×2-6L
package. It operates over a temperature range of -40℃
to +125℃.
• Comprehensive Protection Features
Over-Voltage Protection
APPLICATIONS
Thermal Shutdown Protection
Power MOSFETs
Under-Voltage Lockout
IGBT Driving for Power Supplies
Motor Drivers
Short-Circuit Protection
• -40℃ to +125℃ Operating Temperature Range
• Available in a Green TDFN-2×2-6L Package
TYPICAL APPLICATIONS
IGBT
Power MOSFET
4.5V to 20V
4.5V to 20V
5
1
2
5
1
2
VDD
VDD
IN
GD
VDD
VDD
IN
GD
CIN
CIN
3
4
6
3
4
6
SYNC
SOV
SYNC
SOV
IN
IN
GND
GND
Figure 1. Typical Application Circuits
SG Micro Corp
www.sg-micro.com
MARCH 2020 – REV. A. 1
Power MOSFET and IGBT Gate Driver
with Comprehensive Protections
SGM48010
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
CB3
XXXX
SGM48010
TDFN-2×2-6L
SGM48010XTDI6G/TR
Tape and Reel, 3000
-40℃ to +125℃
MARKING INFORMATION
NOTE: XXXX = Date Code and Trace Code.
Serial Number
Y Y Y
X X X X
Trace Code
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
ABSOLUTE MAXIMUM RATINGS
OVERSTRESS CAUTION
VDD................................................................... -0.3V to 22V
SOV.........................................................-0.3V to VDD + 0.3V
IN (DC, VDD - VIN_MIN ≤ 22V)
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
..................................................................-10V to VDD + 0.3V
SYNC (DC, VDD - VSYNC_MIN ≤ 22V)
..................................................................-10V to VDD + 0.3V
GD (DC)...................................................-0.3V to VDD + 0.3V
GD (Pulse < 500ns)....................................-5V to VDD + 0.3V
Package Thermal Resistance
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
TDFN-2×2-6L, θJA.................................................... 107℃/W
Junction Temperature .................................................+150℃
Storage Temperature Range........................-65℃ to +150℃
Lead Temperature (Soldering, 10s) ............................+260℃
ESD Susceptibility
HBM.............................................................................8000V
CDM ............................................................................1000V
RECOMMENDED OPERATING CONDITIONS
Supply Voltage Range .........................................4.5V to 20V
Operating Junction Temperature Range......-40℃ to +125℃
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
SG Micro Corp
www.sg-micro.com
MARCH 2020
2
Power MOSFET and IGBT Gate Driver
with Comprehensive Protections
SGM48010
PIN CONFIGURATION
(TOP VIEW)
VDD
IN
1
2
3
6
5
4
GND
GD
SYNC
SOV
TDFN-2×2-6L
PIN DESCRIPTION
PIN
NAME
TYPE
FUNCTION
Power Supply Input for Driver. Place a decoupling capacitor (CIN = 4.7μF) between this pin and GND pin
close to the device.
1
VDD
P
Logic Input for Gate Control. A logic high forces the GD output low if driving is not disabled by SOV or
SYNC. This pin is a self-holding input and its status changes only when both input current and voltage
exceed the desired thresholds.
Deadtime Lock Input to Prevent Shoot Through. If SYNC is high, the GD output is inhibited. Similar to IN,
this input is also self-holding and its status changes only when both input current and voltage exceed the
desired thresholds.
2
3
IN
I
I
SYNC
1. Input for MOSFET/IGBT On and Off Over-Voltage Detection. When the over-voltage of MOSFET
drain/IGBT collector is sensed, the GD output temporarily goes low after a blanking time.
2. Output for Protection Status Indication. If any protection is in action, including over-voltage protection,
thermal shutdown protection, under-voltage lockout and short-circuit protection, the pin is driven high.
4
SOV
IO
5
6
GD
GND
—
O
G
Gate Drive Output. Connect it to the gate of the switch.
Ground.
Exposed
Pad
—
The exposed pad should be soldered to the ground plane.
NOTE:
P: power supply; I: input; O: output; IO: input or output; G: ground.
FUNCTION TABLE
SYNC
IN
GD
L
L
H
L
L
H
L
H
H
H
L
L
SG Micro Corp
www.sg-micro.com
MARCH 2020
3
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TDFN-2×2-6L
D
e
N6
D1
L
E1
E
SEE DETAIL A
k
N3
N1
b
BOTTOM VIEW
TOP VIEW
1.40
0.65
A
A1
0.80
2.60
A2
SIDE VIEW
0.24
0.65
N2
N1
N2
N1
RECOMMENDED LAND PATTERN (Unit: mm)
DETAIL A
Pin #1 ID and Tie Bar Mark Options
NOTE: The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
0.800
0.050
MIN
0.028
0.000
MAX
0.031
0.002
A
A1
A2
D
0.700
0.000
0.203 REF
0.008 REF
1.900
1.100
1.900
0.600
2.100
1.450
2.100
0.850
0.075
0.043
0.075
0.024
0.083
0.057
0.083
0.034
D1
E
E1
k
0.200 MIN
0.650 TYP
0.008 MIN
0.026 TYP
b
0.180
0.250
0.300
0.450
0.007
0.010
0.012
0.018
e
L
SG Micro Corp
www.sg-micro.com
TX00055.001
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
TDFN-2×2-6L
7″
9.5
2.30
2.30
1.10
4.0
4.0
2.0
8.0
Q1
SG Micro Corp
TX10000.000
www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
7″ (Option)
7″
368
442
227
410
224
224
8
18
SG Micro Corp
www.sg-micro.com
TX20000.000
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