SGM6601 [SGMICRO]
Low-Power DC-DC Boost Converter;
| 型号： | SGM6601 |
| 厂家： | 
Shengbang Microelectronics Co, Ltd |
| 描述： | Low-Power DC-DC Boost Converter |
| 文件： | 总11页 (文件大小：706K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SGM6601
Low-Power DC-DC Boost Converter
FEATURES
GENERAL DESCRIPTION
Input Voltage Range: 1.8V to 5.5V
The SGM6601 is a high-frequency boost converter. The
input voltage accepts a range of 1.8V to 5.5V. It is
specified for small to medium LCD bias supply and
white LED backlight supplies. The switching frequency
can reach up to 1MHz, which supports both ceramic
output capacitors and tantalum output capacitors.
Maximum 38V Adjustable Output Voltage
400mA Internal Switch Current
Maximum 1MHz Switching Frequency
20μA (TYP) Low Quiescent Current
0.1μA (TYP) Shutdown Current
Internal Soft-Start Function
-40℃ to +85℃ Operating Temperature Range
The internal 400mA switch current limit provides a low
output voltage ripple. For low-power applications, this
device allows the use of a small form factor inductor. A
typical low quiescent current of 20μA together with an
optimized control scheme allows the device to achieve
very high efficiency over the whole load current.
Available in Green TSOT-23-5 and TDFN-2×2-6L
Packages
APPLICATIONS
LCD Bias Supply
White-LED Supply for LCD Backlights
Mobile Phones
The adjustable output voltage can reach a maximum of
38V ideally with a dual cell NiMH/NiCd battery or a
single cell Li-ion battery. And a standard 3.3V/5V to 12V
power conversion can also be achieved.
Audio Player
Digital Camera
PDAs and Handheld PCs
The SGM6601 is available in TDFN-2×2-6L and
TSOT-23-5 packages. It operates over an ambient
temperature range of -40℃ to +85℃.
SG Micro Corp
FEBRUARY 2014 – REV. A
www.sg-micro.com
SGM6601
Low-Power DC-DC Boost Converter
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
6601
XXXX
SGM6601YTDI6G/TR
SGM6601YTN5G/TR
-40℃ to +85℃
-40℃ to +85℃
TDFN-2×2-6L
TSOT-23-5
Tape and Reel, 3000
Tape and Reel, 3000
SGM6601
SG4XX
MARKING INFORMATION
NOTE: XXXX = Date Code. XX = Date Code
SG4
X X
Date code - Month ("A" = Jan. "B" = Feb. … "L" = Dec.)
Date code - Year ("A" = 2010, "B" = 2011 …)
Chip I.D.
For example: SG4CA (2012, January)
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
OVERSTRESS CAUTION
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
Input Supply Voltage.............................................. -0.3V to 6V
EN and FB Pin Voltages........................................ -0.3V to VIN
SW Switch Voltage............................................................ 40V
Operating Temperature Range.........................-40℃ to +85℃
Junction Temperature.....................................................150℃
Storage Temperature Range..........................-65℃ to +150℃
Package Thermal Resistance
ESD SENSITIVITY CAUTION
TDFN-2×2-6L, θJA.................................................... 124℃/W
TSOT-23-5, θJA ........................................................ 250℃/W
Lead Temperature (Soldering, 10s)..............................260℃
ESD Susceptibility
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
HBM.............................................................................4000V
MM.................................................................................200V
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
SG Micro Corp
www.sg-micro.com
FEBRUARY 2014
2
SGM6601
Low-Power DC-DC Boost Converter
PIN CONFIGURATION
(TOP VIEW)
(TOP VIEW)
1
2
3
5
4
VIN
EN
SW
GND
FB
SW
1
2
3
6
5
4
GND
VIN
EN
NC
FB
TDFN-2×2-6L
TSOT-23-5
PIN DESCRIPTION
PIN
NAME
FUNCTION
TDFN-2×2-6L
TSOT-23-5
Switch Pin. It is connected to the drain of the internal power MOSFET.
Connect this pin to the inductor and Schottky diode.
SW
GND
FB
6
1
4
1
2
3
Ground.
Feedback Pin. Connect this pin to the external voltage divider to
program the desired output voltage.
Enable Pin. Connect this pin to ground to make the device enter
shutdown mode. Do not leave it floating.
EN
3
2
4
5
VIN
NC
Power Supply. Place it closely decoupled to GND with a capacitor.
5
—
—
No Connection.
Exposed
Pad
GND
Power Ground Exposed Pad. Must be connected to GND.
SG Micro Corp
www.sg-micro.com
FEBRUARY 2014
3
SGM6601
Low-Power DC-DC Boost Converter
ELECTRICAL CHARACTERISTICS
(VIN = 2.4V, EN = VIN, CIN = 4.7μF, COUT = 1μF, L = 10μH, TA = -40℃ to +85℃. Typical values are at TA = +25℃, unless otherwise
noted.)
PARAMETER
SUPPLY CURRENT
Input Voltage Range
Shutdown Current
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
VIN
ISD
IQ
1.8
5.5
1
V
EN = GND
IOUT = 0mA, not switching, VFB = 1.3V
0.1
20
μA
μA
Operating Quiescent Current
35
Under-Voltage Lockout
Threshold
VUVLO
1.5
1.65
V
ENABLE
EN Input High Voltage
EN Input Low Voltage
EN Input Leakage Current
VIH
VIL
1.3
V
V
0.4
1
EN = GND or VIN
0.1
µA
POWER SWITCH AND CURRENT LIMIT
Maximum Switch Voltage
Minimum Off Time
VSW
tOFF
39
570
8.5
1100
1
V
270
4
430
6
ns
Maximum On Time
MOSFET On-Resistance
MOSFET Leakage Current
Switch Current Limit
OUTPUT
tON
μs
RDS(ON)
VIN = 2.4V, ISW = 200mA
VSW = 38V
660
mΩ
μA
mA
ILIM
210
VIN
400
500
Adjustable Output Voltage
Range
VOUT
38
V
Feedback Reference Voltage
Feedback Leakage Current
VFB
IFB
1.202 1.229 1.253
1
V
TA = 25℃
VFB = 1.3V
μA
VIN = 1.8V to 5.5V, VOUT = 18V, ILOAD
10mA,
CFF = not connected
VIN = 2.4V, VOUT = 18V, IOUT = 0mA to
30mA
=
Output Voltage Line Regulation
ΔVOUT
0.04
0.15
%/V
Output Voltage Load
Regulation
%/mA
SG Micro Corp
www.sg-micro.com
FEBRUARY 2014
4
SGM6601
Low-Power DC-DC Boost Converter
TYPICAL PERFORMANCE CHARACTERISTICS
Efficiency vs. Output Current
Efficiency vs. Load Current
100
90
80
70
60
100
90
80
70
60
VIN = 5V
L = 10μH
L = 3.3μH
VIN = 3.6V
VIN = 2.4V
VIN = 3.6V
VOUT = 18V
VOUT = 18V
L = 10μH
0.1
1
10
100
0.1
1
10
100
Load Current (mA)
Output Current (mA)
Quiescent Current vs. Input Voltage
No Sw itching
Efficiency vs. Input Voltage
IOUT = 10mA
30
25
20
15
100
+85℃
90
80
70
60
50
IOUT = 5mA
+25℃
VOUT = 18V
L = 10μH
-40℃
1.5
2
2.5
3
3.5
4
4.5
5
5.5
1.5
2
2.5
3
3.5
4
4.5
5
5.5
Input Voltage (V)
Input Voltage (V)
RDS(ON) vs. Temperature
Sw itch Current Limit vs. Temperature
1000
900
800
700
600
500
400
300
200
500
450
400
350
300
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Temperature (℃)
Temperature (℃)
SG Micro Corp
www.sg-micro.com
FEBRUARY 2014
5
SGM6601
Low-Power DC-DC Boost Converter
TYPICAL PERFORMANCE CHARACTERISTICS
Feedback Voltage vs. Temperature
1.240
1.235
1.230
1.225
1.220
1.215
VIN = 2.4V
1.210
-50
-25
0
25
50
75
100
Temperature (℃)
SG Micro Corp
www.sg-micro.com
FEBRUARY 2014
6
SGM6601
Low-Power DC-DC Boost Converter
TYPICAL APPLICATIONS
L1
10μH
D1
VOUT 18V
VIN
COUT
1μF
CFF
22pF
1.8V to 5.5V
R1
2.2MΩ
VIN
EN
SW
FB
CIN
4.7μF
10kΩ
SGM6601
R2
160kΩ
GND
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
FEBRUARY 2014 ‒ REV.A to REV.1
Page
Updated Electrical Characteristics data .............................................................................................................................................................All
Changes from Original (SEPTEMBER 2012) to REV.A
Page
Changed from product preview to production data.............................................................................................................................................All
SG Micro Corp
www.sg-micro.com
FEBRUARY 2014
7
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TDFN-2×2-6L
D
e
N6
D1
L
E1
E
SEE DETAIL A
k
N3
N1
b
BOTTOM VIEW
TOP VIEW
1.40
0.65
A
A1
0.80
2.60
A2
SIDE VIEW
0.24
0.65
N2
N1
N2
N1
RECOMMENDED LAND PATTERN (Unit: mm)
DETAIL A
Pin #1 ID and Tie Bar Mark Options
NOTE: The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
0.800
0.050
MIN
0.028
0.000
MAX
0.031
0.002
A
A1
A2
D
0.700
0.000
0.203 REF
0.008 REF
1.900
1.100
1.900
0.600
2.100
1.450
2.100
0.850
0.075
0.043
0.075
0.024
0.083
0.057
0.083
0.034
D1
E
E1
k
0.200 MIN
0.650 TYP
0.008 MIN
0.026 TYP
b
0.180
0.250
0.300
0.450
0.007
0.010
0.012
0.018
e
L
NOTE: This drawing is subject to change without notice.
SG Micro Corp
TX00055.001
www.sg-micro.com
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TSOT-23-5
D
1.90
e1
E1
E
2.59
0.99
b
e
0.69
0.95
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
A1
A2
θ
0.25
c
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
0.900
0.100
0.800
0.500
0.200
3.020
1.700
2.950
MIN
MAX
0.035
0.004
0.031
0.020
0.008
0.119
0.067
0.116
A
A1
A2
b
0.700
0.000
0.700
0.350
0.080
2.820
1.600
2.650
0.028
0.000
0.028
0.014
0.003
0.111
0.063
0.104
c
D
E
E1
e
0.950 BSC
1.900 BSC
0.037 BSC
0.075 BSC
e1
L
0.300
0°
0.600
8°
0.012
0°
0.024
8°
θ
NOTES:
1. Body dimensions do not include mode flash or protrusion.
2. This drawing is subject to change without notice.
SG Micro Corp
TX00037.000
www.sg-micro.com
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
TDFN-2×2-6L
TSOT-23-5
7’’
7’’
9.50
9.5
2.30
3.17
2.30
3.1
1.10
1.10
4.00
4.0
4.00
4.0
2.00
2.0
8.00
8.0
Q1
Q3
SG Micro Corp
TX10000.000
www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
7” (Option)
7”
368
442
227
410
224
224
8
18
SG Micro Corp
www.sg-micro.com
TX20000.000
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