SGM8250-2 [SGMICRO]

High Voltage, Micro-Power, Zero-Drift, CMOS Operational Amplifier;
SGM8250-2
型号: SGM8250-2
厂家: Shengbang Microelectronics Co, Ltd    Shengbang Microelectronics Co, Ltd
描述:

High Voltage, Micro-Power, Zero-Drift, CMOS Operational Amplifier

文件: 总17页 (文件大小:981K)
中文:  中文翻译
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SGM8250-1/SGM8250-2  
High Voltage, Micro-Power, Zero-Drift,  
CMOS Operational Amplifiers  
GENERAL DESCRIPTION  
FEATURES  
The single SGM8250-1 and dual SGM8250-2 are high  
voltage, high precision CMOS operational amplifiers,  
which can operate from 3V to 24V single supply or from  
±1.5V to ±12V dual power supplies, while consuming  
only 50μA quiescent current per amplifier. The  
SGM8250-1/2 support rail-to-rail input and output  
operation. The input common mode voltage range is  
from (-VS) - 0.1V to (+VS) + 0.1V, and the output range is  
from (-VS) + 0.037V to (+VS) - 0.065V.  
Low Input Offset Voltage: 50μV (MAX)  
Low Noise: 0.85μVP-P at 0.1Hz to 10Hz  
Rail-to-Rail Input and Output  
Support Single or Dual Power Supplies:  
3V to 24V or ±1.5V to ±12V  
Quiescent Current: 50μA/Amplifier (TYP)  
-40to +125Operating Temperature Range  
Small Packaging:  
SGM8250-1 Available in Green SOT-23-5, SC70-5  
and SOIC-8 Packages  
The SGM8250-1/2 have high impedance inputs and  
zero-drift 50μV (MAX) offset voltage. These specifications  
make SGM8250-1/2 appropriate for a wide range of  
applications requiring high precision.  
SGM8250-2 Available in Green TDFN-3×3-8L and  
SOIC-8 Packages  
The SGM8250-1 is available in Green SOT-23-5,  
SC70-5 and SOIC-8 packages. The SGM8250-2 is  
available in Green TDFN-3×3-8L and SOIC-8 packages.  
They are specified over -40to +125temperature  
range.  
APPLICATIONS  
Industrial Equipment  
Battery-Powered Equipment  
Sensor Signal Conditioning  
SG Micro Corp  
DECEMBER 2017 - REV. A  
www.sg-micro.com  
SGM8250-1  
SGM8250-2  
High Voltage, Micro-Power, Zero-Drift,  
CMOS Operational Amplifiers  
PACKAGE/ORDERING INFORMATION  
SPECIFIED  
TEMPERATURE  
RANGE  
PACKAGE  
DESCRIPTION  
ORDERING  
NUMBER  
PACKAGE  
MARKING  
PACKING  
OPTION  
MODEL  
SOT-23-5  
SC70-5  
SGM8250-1XN5G/TR  
SGM8250-1XC5G/TR  
GSCXX  
GS3XX  
Tape and Reel, 3000  
Tape and Reel, 3000  
-40to +125℃  
-40to +125℃  
SGM8250-1  
SGM  
82501XS8  
XXXXX  
SGM  
82502DB  
XXXXX  
SGM  
SOIC-8  
TDFN-3×3-8L  
SOIC-8  
SGM8250-1XS8G/TR  
SGM8250-2XTDB8G/TR  
SGM8250-2XS8G/TR  
Tape and Reel, 4000  
Tape and Reel, 4000  
Tape and Reel, 4000  
-40to +125℃  
-40to +125℃  
-40to +125℃  
SGM8250-2  
82502XS8  
XXXXX  
MARKING INFORMATION  
NOTE: XX = Date Code. XXXXX = Date Code and Vendor Code.  
SOT-23-5/SC70-5  
SOIC-8/TDFN-3×3-8L  
YYY X X  
X X X X X  
Date Code - Month  
Date Code - Year  
Serial Number  
Vendor Code  
Date Code - Week  
Date Code - Year  
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If  
you have additional comments or questions, please contact your SGMICRO representative directly.  
ABSOLUTE MAXIMUM RATINGS  
ESD SENSITIVITY CAUTION  
Supply Voltage..............................................................26.4V  
This integrated circuit can be damaged if ESD protections are  
not considered carefully. SGMICRO recommends that all  
integrated circuits be handled with appropriate precautions.  
Failureto observe proper handlingand installation procedures  
can cause damage. ESD damage can range from subtle  
performance degradation tocomplete device failure. Precision  
integrated circuits may be more susceptible to damage  
because even small parametric changes could cause the  
device not to meet the published specifications.  
Input Common Mode Voltage Range  
.................................................... (-VS) - 0.3V to (+VS) + 0.3V  
Junction Temperature.................................................+150℃  
Storage Temperature Range........................-65to +150℃  
Lead Temperature (Soldering, 10s)............................+260℃  
ESD Susceptibility  
HBM.............................................................................8000V  
MM.................................................................................250V  
CDM ............................................................................1000V  
DISCLAIMER  
SG Micro Corp reserves the right to make any change in  
RECOMMENDED OPERATING CONDITIONS  
Specified Voltage Range ........................................3V to 24V  
Operating Temperature Range ....................-40to +125℃  
circuit design, or specifications without prior notice.  
OVERSTRESS CAUTION  
Stresses beyond those listed in Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to  
absolute maximum rating conditions for extended periods  
may affect reliability. Functional operation of the device at any  
conditions beyond those indicated in the Recommended  
Operating Conditions section is not implied.  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2017  
2
SGM8250-1  
SGM8250-2  
High Voltage, Micro-Power, Zero-Drift,  
CMOS Operational Amplifiers  
PIN CONFIGURATIONS  
SGM8250-1 (TOP VIEW)  
SGM8250-1 (TOP VIEW)  
OUT  
-VS  
1
2
5
+VS  
-IN  
+IN  
-VS  
1
2
5
4
+VS  
_
+
-IN  
3
OUT  
+IN  
3
4
SOT-23-5  
SC70-5  
SGM8250-1 (TOP VIEW)  
SGM8250-2 (TOP VIEW)  
NC  
1
2
3
4
8
NC  
OUTA  
1
2
3
4
8
+VS  
_
_
-IN  
+IN  
-VS  
7
6
5
+VS  
OUT  
NC  
-INA  
+INA  
-VS  
7
6
5
OUTB  
-INB  
+INB  
+
_
+
NC = NO CONNECT  
SOIC-8  
SOIC-8  
SGM8250-2 (TOP VIEW)  
OUTA  
-INA  
+INA  
-VS  
1
8
7
6
5
+VS  
2
3
4
OUTB  
-INB  
+INB  
-VS  
TDFN-3×3-8L  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2017  
3
SGM8250-1  
SGM8250-2  
High Voltage, Micro-Power, Zero-Drift,  
CMOS Operational Amplifiers  
ELECTRICAL CHARACTERISTICS  
(At TA = +25, +VS = 5V, -VS = 0V, VCM = +VS/2, VOUT = +VS/2 and RL = 10kΩ to +VS/2, Full = -40to +125, unless otherwise  
noted.)  
PARAMETER  
SYMBOL  
CONDITIONS  
TEMP  
MIN  
TYP  
MAX  
UNITS  
Input Characteristics  
10  
50  
90  
+25  
Full  
Input Offset Voltage  
VOS  
μV  
Input Offset Voltage Drift  
Input Bias Current  
ΔVOS/ΔT  
IB  
Full  
0.11  
60  
μV/℃  
pA  
+25℃  
Full  
Input Common Mode Voltage Range  
VCM  
(-VS) - 0.1  
95  
(+VS) + 0.1  
V
112  
131  
+25℃  
Full  
Common Mode Rejection Ratio  
CMRR  
(-VS) - 0.1V < VCM < (+VS) + 0.1V  
(-VS) + 0.1V < VOUT < (+VS) - 0.1V  
dB  
dB  
92  
108  
+25℃  
Full  
Open-Loop Voltage Gain  
AOL  
105  
Output Characteristics  
14  
8
25  
30  
16  
20  
+25℃  
Full  
VOH  
Output Voltage Swing from Rail  
mV  
+25℃  
Full  
VOL  
ISC  
Output Short-Circuit Current  
Power Supply  
±17  
mA  
+25℃  
Operating Voltage Range  
VS  
IQ  
Full  
+25℃  
Full  
3
24  
60  
80  
V
45  
Quiescent Current/Amplifier  
IOUT = 0  
μA  
116  
113  
142  
+25℃  
Full  
Power Supply Rejection Ratio  
PSRR  
VS = 3V to 24V  
dB  
Dynamic Performance  
Gain-Bandwidth Product  
Slew Rate  
GBP  
SR  
G = +100, CL = 100pF  
350  
0.1  
kHz  
V/μs  
ms  
+25℃  
+25℃  
+25℃  
G = +1, VOUT = 2VP-P, CL = 100pF  
Turn-On Time  
0.75  
Noise  
Input Voltage Noise  
Input Voltage Noise Density  
f = 0.1Hz to 10Hz  
f = 1kHz  
0.85  
40  
μVP-P  
+25℃  
+25℃  
en  
nV/Hz  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2017  
4
SGM8250-1  
SGM8250-2  
High Voltage, Micro-Power, Zero-Drift,  
CMOS Operational Amplifiers  
ELECTRICAL CHARACTERISTICS (continued)  
(At TA = +25, +VS = 24V, -VS = 0V, VCM = +VS/2, VOUT = +VS/2 and RL = 10kΩ to +VS/2, Full = -40to +125, unless  
otherwise noted.)  
PARAMETER  
SYMBOL  
CONDITIONS  
TEMP  
MIN  
TYP  
MAX  
UNITS  
Input Characteristics  
10  
50  
90  
+25℃  
Full  
Input Offset Voltage  
VOS  
μV  
Input Offset Voltage Drift  
Input Bias Current  
ΔVOS/ΔT  
IB  
Full  
0.11  
80  
μV/℃  
pA  
850  
+25℃  
Full  
Input Common Mode Voltage Range  
VCM  
(-VS) - 0.1  
112  
(+VS) + 0.1  
V
130  
145  
+25℃  
Full  
Common Mode Rejection Ratio  
CMRR  
(-VS) - 0.1V < VCM < (+VS) + 0.1V  
(-VS) + 0.1V < VOUT < (+VS) - 0.1V  
dB  
dB  
107  
120  
+25℃  
Full  
Open-Loop Voltage Gain  
AOL  
110  
Output Characteristics  
65  
37  
95  
130  
60  
+25℃  
Full  
VOH  
Output Voltage Swing from Rail  
mV  
+25℃  
Full  
VOL  
ISC  
85  
Output Short-Circuit Current  
Power Supply  
±17  
mA  
+25℃  
Operating Voltage Range  
VS  
IQ  
Full  
+25℃  
Full  
3
24  
64  
84  
V
50  
Quiescent Current/Amplifier  
IOUT = 0  
μA  
116  
113  
142  
+25℃  
Full  
Power Supply Rejection Ratio  
PSRR  
VS = 3V to 24V  
dB  
Dynamic Performance  
Gain-Bandwidth Product  
Slew Rate  
GBP  
SR  
G = +100, CL = 100pF  
350  
0.09  
1.5  
kHz  
V/μs  
ms  
+25℃  
+25℃  
+25℃  
G = +1, VOUT = 2VP-P, CL = 100pF  
Turn-On Time  
Noise  
Input Voltage Noise  
Input Voltage Noise Density  
f = 0.1Hz to 10Hz  
f = 1kHz  
0.85  
40  
μVP-P  
+25℃  
+25℃  
en  
nV/Hz  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2017  
5
SGM8250-1  
SGM8250-2  
High Voltage, Micro-Power, Zero-Drift,  
CMOS Operational Amplifiers  
TYPICAL PERFORMANCE CHARACTERISTICS  
At TA = +25, +VS = 5V, -VS = 0V, RL = 10kΩ and CL = 0pF, unless otherwise noted.  
Quiescent Current vs. Temperature  
Small-Signal Overshoot vs. Load Capacitance  
70  
60  
50  
40  
30  
20  
50  
40  
30  
20  
10  
0
-50  
-25  
0
25  
50  
75  
100 125  
10  
100  
1000  
Load Capacitance (pF)  
Temperature ()  
Common Mode Rejection Ratio vs. Frequency  
Power Supply Rejection Ratio vs. Frequency  
120  
100  
80  
60  
40  
20  
0
150  
120  
90  
60  
30  
0
0.01  
0.1  
1
10  
100  
1000 10000  
0.01  
0.1  
1
10  
100  
1000 10000  
Frequency (kHz)  
Frequency (kHz)  
Settling Time vs. Closed-Loop Gain  
Open-Loop Gain and Phase vs. Frequency  
Open-Loop Gain  
120  
90  
0
100  
80  
60  
40  
20  
0
60  
30  
-30  
-60  
-90  
-120  
-150  
-180  
0
Phase  
-30  
-60  
-90  
0.1  
1
10  
100  
1000  
1
10  
100  
Frequency (kHz)  
Closed-Loop Gain (dB)  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2017  
6
SGM8250-1  
SGM8250-2  
High Voltage, Micro-Power, Zero-Drift,  
CMOS Operational Amplifiers  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
At TA = +25, +VS = 5V, -VS = 0V, RL = 10kΩ and CL = 0pF, unless otherwise noted.  
Large-Signal Step Response  
G = +1, CL = 100pF  
Small-Signal Step Response  
G = +1, CL = 100pF  
Time (100μs/div)  
Time (100μs/div)  
Positive Overload Recovery  
Negative Overload Recovery  
G = -10, f = 1kHz  
G = -10, f = 1kHz  
VIN  
0V  
0V  
0V  
VIN  
VOUT  
VOUT  
0V  
Time (50μs/div)  
Time (50μs/div)  
Turn-On Time  
0.1Hz to 10Hz Noise  
G = +1, VIN+ = 0.1V  
VS  
0V  
VOUT  
0V  
Time (1s/div)  
Time (200μs/div)  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2017  
7
SGM8250-1  
SGM8250-2  
High Voltage, Micro-Power, Zero-Drift,  
CMOS Operational Amplifiers  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
At TA = +25, +VS = 5V, -VS = 0V, RL = 10kΩ and CL = 0pF, unless otherwise noted.  
Input Voltage Noise Density vs. Frequency  
Offset Voltage Production Distribution  
1000  
100  
10  
15  
12  
9
19300 Samples  
1 Production Lot  
Continues with no 1/f (flicker) noise.  
6
3
1
0
10  
100  
1000  
10000  
Frequency (Hz)  
Offset Voltage (μV)  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2017  
8
SGM8250-1  
SGM8250-2  
High Voltage, Micro-Power, Zero-Drift,  
CMOS Operational Amplifiers  
APPLICATION INFORMATION  
Rail-to-Rail Input  
Driving Capacitive Loads  
When SGM8250-1/2 work at the power supply between  
3V and 24V, the input common mode voltage range is  
from (-VS) - 0.1V to (+VS) + 0.1V. In Figure 1, the ESD  
diodes between the inputs and the power supply rails  
will clamp the input voltage not to exceed the rails.  
The SGM8250-1/2 are unity-gain stable with heavy  
capacitive load. If greater capacitive load must be  
driven in application, the circuit in Figure 3 can be used.  
In this circuit, the IR drop voltage generated by RISO is  
compensated by feedback loop.  
+VS  
RF  
CF  
VP  
+
_
_
RISO  
VN  
VOUT  
CL  
VIN  
+
-VS  
Figure 1. Input Equivalent Circuit  
Figure 3. Circuit to Drive Heavy Capacitive Load  
Input Current-Limit Protection  
Power Supply Decoupling and Layout  
For ESD diode clamping protection, when the current  
flowing through ESD diode exceeds the maximum  
rating value, the ESD diode and amplifier will be  
damaged, so current-limit protection will be added in  
some applications. One resistor is selected to limit the  
current not to exceed the maximum rating value. In  
Figure 2, a series input resistor is used to limit the input  
current to less than 10mA, but the drawback of this  
current-limit resistor is that it contributes thermal noise  
at the amplifier input. If this resistor must be added, its  
value must be selected as small as possible.  
A clean and low noise power supply is very important in  
amplifier circuit design, besides of input signal noise,  
the power supply is one of important source of noise to  
the amplifiers through +VS and -VS pins. Power supply  
bypassing is an effective method to clear up the noise  
at power supply, and the low impedance path to ground  
of decoupling capacitor will bypass the noise to GND.  
In application, 10μF ceramic capacitor paralleled with  
0.1μF or 0.01μF ceramic capacitor is used in Figure 4.  
The ceramic capacitors should be placed as close as  
possible to +VS and -VS power supply pins.  
+VS  
+VS  
+VS  
10μF  
10μF  
_
IOVERLOAD  
10mA MAX  
VOUT  
0.1μF  
0.1μF  
VIN  
+
_
_
VN  
VP  
VN  
VP  
VOUT  
VOUT  
+
+
Figure 2. Input Current-Limit Protection  
10μF  
-VS (GND)  
Rail-to-Rail Output  
The SGM8250-1/2 support rail-to-rail output operation.  
In single power supply application, for example, when  
+VS = 24V, -VS = GND, 10kΩ load resistor is tied from  
OUT pin to +VS/2, the typical output swing range is from  
0.037V to 23.935V.  
0.1μF  
-VS  
Figure 4. Amplifier Power Supply Bypassing  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2017  
9
 
 
 
 
SGM8250-1  
SGM8250-2  
High Voltage, Micro-Power, Zero-Drift,  
CMOS Operational Amplifiers  
APPLICATION INFORMATION (continued)  
the input are used to increase the input impedance and  
eliminate drawback of low input impedance in Figure 5.  
Grounding  
In low speed application, one node grounding technique  
is the simplest and most effective method to eliminate  
the noise generated by grounding. In high speed  
application, the general method to eliminate noise is to  
use a complete ground plane technique, and the whole  
ground plane will help distribute heat and reduce EMI  
noise pickup.  
_
R1  
R2  
VN  
+
_
VOUT  
+
VP  
+
Reduce Input-to-Output Coupling  
R3  
To reduce the input-to-output coupling, the input traces  
must be placed as far away from the power supply or  
output traces as possible. The sensitive trace must not  
be placed in parallel with the noisy trace in same layer.  
They must be placed perpendicularly in different layers  
to reduce the crosstalk. These PCB layout techniques  
will help to reduce unwanted positive feedback and  
noise.  
_
R4  
VREF  
Figure 6. High Input Impedance Difference Amplifier  
Active Low-Pass Filter  
The circuit in Figure 7 is a design example of active  
low-pass filter, the DC gain is equal to -R2/R1 and the  
-3dB corner frequency is equal to 1/2πR2C. In this design,  
the filter bandwidth must be less than the bandwidth of  
the amplifier, the resistor values must be selected as  
low as possible to reduce ringing or oscillation generated  
by the parasitic parameters in PCB layout.  
Typical Application Circuits  
Difference Amplifier  
The circuit in Figure 5 is a design example of classical  
difference amplifier. If R4/R3 = R2/R1, then VOUT = (VP -  
VN) × R2/R1 + VREF  
.
C
R2  
R2  
R1  
_
VN  
R1  
_
VOUT  
VIN  
R3  
VP  
VOUT  
+
+
R4  
R3 = R1 // R2  
VREF  
Figure 5. Difference Amplifier  
Figure 7. Active Low-Pass Filter  
High Input Impedance Difference Amplifier  
The circuit in Figure 6 is a design example of high input  
impedance difference amplifier, the added amplifiers at  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2017  
10  
 
 
 
 
SGM8250-1  
SGM8250-2  
High Voltage, Micro-Power, Zero-Drift,  
CMOS Operational Amplifiers  
REVISION HISTORY  
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.  
Changes from Original (DECEMBER 2017) to REV.A  
Page  
Changed from product preview to production data.............................................................................................................................................All  
SG Micro Corp  
www.sg-micro.com  
DECEMBER 2017  
11  
PACKAGE INFORMATION  
PACKAGE OUTLINE DIMENSIONS  
SOT-23-5  
1.90  
D
e1  
2.59  
E1  
E
0.99  
b
e
0.95  
0.69  
RECOMMENDED LAND PATTERN (Unit: mm)  
L
A
A1  
c
θ
0.2  
A2  
Dimensions  
In Millimeters  
Dimensions  
In Inches  
Symbol  
MIN  
MAX  
1.250  
0.100  
1.150  
0.500  
0.200  
3.020  
1.700  
2.950  
MIN  
MAX  
0.049  
0.004  
0.045  
0.020  
0.008  
0.119  
0.067  
0.116  
A
A1  
A2  
b
1.050  
0.000  
1.050  
0.300  
0.100  
2.820  
1.500  
2.650  
0.041  
0.000  
0.041  
0.012  
0.004  
0.111  
0.059  
0.104  
c
D
E
E1  
e
0.950 BSC  
1.900 BSC  
0.037 BSC  
0.075 BSC  
e1  
L
0.300  
0°  
0.600  
8°  
0.012  
0°  
0.024  
8°  
θ
SG Micro Corp  
www.sg-micro.com  
TX00033.000  
PACKAGE INFORMATION  
PACKAGE OUTLINE DIMENSIONS  
SC70-5  
D
e1  
0.65  
e
1.9  
E1  
E
0.75  
b
0.4  
1.3  
RECOMMENDED LAND PATTERN (Unit: mm)  
L
L1  
A
A1  
A2  
c
θ
0.20  
Dimensions  
In Millimeters  
Dimensions  
In Inches  
Symbol  
MIN  
MAX  
1.100  
0.100  
1.000  
0.350  
0.150  
2.200  
1.350  
2.450  
MIN  
MAX  
A
A1  
A2  
b
0.900  
0.000  
0.900  
0.150  
0.080  
2.000  
1.150  
2.150  
0.035  
0.000  
0.035  
0.006  
0.003  
0.079  
0.045  
0.085  
0.043  
0.004  
0.039  
0.014  
0.006  
0.087  
0.053  
0.096  
c
D
E
E1  
e
0.65 TYP  
1.300 BSC  
0.525 REF  
0.026 TYP  
0.051 BSC  
0.021 REF  
e1  
L
L1  
θ
0.260  
0°  
0.460  
8°  
0.010  
0°  
0.018  
8°  
SG Micro Corp  
www.sg-micro.com  
TX00043.000  
PACKAGE INFORMATION  
PACKAGE OUTLINE DIMENSIONS  
TDFN-3×3-8L  
D
e
N8  
D1  
k
E
E1  
N4  
N1  
L
b
BOTTOM VIEW  
TOP VIEW  
2.3  
1.5 2.725  
A
A1  
A2  
0.675  
SIDE VIEW  
0.65  
0.24  
RECOMMENDED LAND PATTERN (Unit: mm)  
Dimensions  
In Millimeters  
Dimensions  
In Inches  
Symbol  
MIN  
MAX  
0.800  
0.050  
MIN  
0.028  
0.000  
MAX  
0.031  
0.002  
A
A1  
A2  
D
0.700  
0.000  
0.203 REF  
0.008 REF  
2.900  
2.200  
2.900  
1.400  
3.100  
2.400  
3.100  
1.600  
0.114  
0.087  
0.114  
0.055  
0.122  
0.094  
0.122  
0.063  
D1  
E
E1  
k
0.200 MIN  
0.650 TYP  
0.008 MIN  
0.026 TYP  
b
0.180  
0.375  
0.300  
0.575  
0.007  
0.015  
0.012  
0.023  
e
L
SG Micro Corp  
www.sg-micro.com  
TX00058.000  
PACKAGE INFORMATION  
PACKAGE OUTLINE DIMENSIONS  
SOIC-8  
0.6  
D
e
2.2  
E1  
E
5.2  
b
1.27  
RECOMMENDED LAND PATTERN (Unit: mm)  
L
A
A1  
c
θ
A2  
Dimensions  
In Millimeters  
Dimensions  
In Inches  
Symbol  
MIN  
MAX  
1.750  
0.250  
1.550  
0.510  
0.250  
5.100  
4.000  
6.200  
MIN  
MAX  
0.069  
0.010  
0.061  
0.020  
0.010  
0.200  
0.157  
0.244  
A
A1  
A2  
b
1.350  
0.100  
1.350  
0.330  
0.170  
4.700  
3.800  
5.800  
0.053  
0.004  
0.053  
0.013  
0.006  
0.185  
0.150  
0.228  
c
D
E
E1  
e
1.27 BSC  
0.050 BSC  
L
0.400  
0°  
1.270  
8°  
0.016  
0°  
0.050  
8°  
θ
SG Micro Corp  
www.sg-micro.com  
TX00010.000  
PACKAGE INFORMATION  
TAPE AND REEL INFORMATION  
REEL DIMENSIONS  
TAPE DIMENSIONS  
P2  
P0  
W
Q2  
Q4  
Q2  
Q4  
Q2  
Q4  
Q1  
Q3  
Q1  
Q3  
Q1  
Q3  
B0  
Reel Diameter  
P1  
A0  
K0  
Reel Width (W1)  
DIRECTION OF FEED  
NOTE: The picture is only for reference. Please make the object as the standard.  
KEY PARAMETER LIST OF TAPE AND REEL  
Reel Width  
Reel  
Diameter  
A0  
B0  
K0  
P0  
P1  
P2  
W
Pin1  
Package Type  
W1  
(mm)  
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant  
SOT-23-5  
SC70-5  
7″  
7″  
9.5  
9.5  
3.20  
2.25  
3.35  
6.40  
3.20  
2.55  
3.35  
5.40  
1.40  
1.20  
1.13  
2.10  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
2.0  
2.0  
2.0  
2.0  
8.0  
8.0  
Q3  
Q3  
Q1  
Q1  
TDFN-3×3-8L  
SOIC-8  
13″  
13″  
12.4  
12.4  
12.0  
12.0  
SG Micro Corp  
TX10000.000  
www.sg-micro.com  
PACKAGE INFORMATION  
CARTON BOX DIMENSIONS  
NOTE: The picture is only for reference. Please make the object as the standard.  
KEY PARAMETER LIST OF CARTON BOX  
Length  
(mm)  
Width  
(mm)  
Height  
(mm)  
Reel Type  
Pizza/Carton  
7″ (Option)  
368  
442  
386  
227  
410  
280  
224  
224  
370  
8
18  
5
7″  
13″  
SG Micro Corp  
www.sg-micro.com  
TX20000.000  

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