SGM8416-4 [SGMICRO]
24V, 800mA Peak Output Current Rail-to-Rail I/O Operational Amplifier;
| 型号： | SGM8416-4 |
| 厂家： | 
Shengbang Microelectronics Co, Ltd |
| 描述： | 24V, 800mA Peak Output Current Rail-to-Rail I/O Operational Amplifier |
| 文件： | 总12页 (文件大小：730K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SGM8416-1/SGM8416-2/SGM8416-4
24V, 800mA Peak Output Current
Rail-to-Rail I/O Operational Amplifiers
GENERAL DESCRIPTION
FEATURES
The SGM8416-1(single), SGM8416-2 (dual) and
SGM8416-4 (quad) are high slew rate, low power
operational amplifiers optimized for high voltage
systems. These devices can operate on single or dual
power supply. They support rail-to-rail input and output
operation.
● Peak Output Current: 800mA
● High Slew Rate: 65V/µs
● Unity-Gain Stable
● Rail-to-Rail Input and Output
● Supply Voltage Range: 4.5V to 26.5V
● -40℃ to +85℃ Operating Temperature Range
● Small Packaging:
The SGM8416-1/2/4 feature 10mV maximum offset
voltage, 800mA peak output current, and 65V/μs high
slew rate. The combination of characteristics makes
them suitable for TFT-LCDs.
SGM8416-1 Available in a Green TDFN-3×3-8L
Package
SGM8416-2 Available in a Green MSOP-8
(Exposed Pad) Package
The SGM8416-1 is available in a Green TDFN-3×3-8L
package. The SGM8416-2 is available in a Green
MSOP-8 (Exposed Pad) package. The SGM8416-4 is
available in a Green TSSOP-14 (Exposed Pad) package.
They are specified over the -40℃ to +85℃ temperature
range.
SGM8416-4 Available in a Green TSSOP-14
(Exposed Pad) Package
APPLICATIONS
TFT-LCD Panels
LCD TVs
Monitors
Laptops
SG Micro Corp
MARCH2022–REV. A.3
www.sg-micro.com
SGM8416-1/SGM8416-2
SGM8416-4
24V, 800mA Peak Output Current
Rail-to-Rail I/O Operational Amplifiers
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
SGM
SGM8416-1
SGM8416-2
SGM8416-4
TDFN-3×3-8L
SGM8416-1YTDB8G/TR
G69DB
XXXXX
Tape and Reel, 4000
Tape and Reel, 4000
Tape and Reel, 4000
-40℃ to +85℃
-40℃ to +85℃
-40℃ to +85℃
SGM84162
YPMS8
XXXXX
MSOP-8
(Exposed Pad)
SGM8416-2YPMS8G/TR
SGM8416-4YPTS14G/TR
SGM84164
YPTS14
XXXXX
TSSOP-14
(Exposed Pad)
MARKING INFORMATION
NOTE: XXXXX = Date Code and Vendor Code.
X X X X X
Vendor Code
Date Code - Week
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
OVERSTRESS CAUTION
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
Supply Voltage, +VS to -VS................................. -0.3V to 28V
Input/Output Voltage to -VS...................-0.3V to (+VS) + 0.3V
+IN to -IN .........................................................................±5V
Package Thermal Resistance
TDFN-3×3-8L, θJA...................................................... 84℃/W
MSOP-8 (Exposed Pad), θJA...................................... 82℃/W
TSSOP-14 (Exposed Pad), θJA .................................. 50℃/W
Junction Temperature.................................................+150℃
Storage Temperature Range.......................-65℃ to +150℃
Lead Temperature (Soldering, 10s)............................+260℃
ESD Susceptibility
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
HBM.............................................................................8000V
MM.................................................................................300V
CDM ............................................................................1000V
RECOMMENDED OPERATING CONDITIONS
Supply Voltage Range ......................................4.5V to 26.5V
Operating Temperature Range .......................-40℃ to +85℃
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
SG Micro Corp
MARCH 2022
www.sg-micro.com
2
SGM8416-1/SGM8416-2
SGM8416-4
24V, 800mA Peak Output Current
Rail-to-Rail I/O Operational Amplifiers
PIN CONFIGURATIONS
FUNCTIONAL BLOCK DIAGRAMS
SGM8416-1 (TOP VIEW)
SGM8416-1
7
NC
-IN
1
2
3
4
8
7
6
5
NC
+VS
OUT
2
3
_
-IN
6
+VS
OUT
NC
-VS
+IN
-VS
+
+IN
-VS
4
TDFN-3×3-8L
SGM8416-2 (TOP VIEW)
SGM8416-2
1
OUTA
8
7
1
2
3
4
8
7
6
5
+VS
OUTA
-INA
+INA
-VS
+VS
2
3
_
-INA
OUTB
OUTB
-INB
+INB
-VS
+
6
5
+INA
_
-INB
4
+
-VS
+INB
MSOP-8 (Exposed Pad)
SGM8416-4 (TOP VIEW)
SGM8416-4
1
14
OUTA
-INA
1
2
3
4
5
6
7
OUTD
-IND
+IND
-VS
14
13
12
11
OUTA
OUTD
2
3
13
12
_
_
-INA
+INA
+VS
-IND
+IND
-VS
+INA
+VS
+
+
4
11
-VS
5
6
10
9
+INB
-INB
+INC
-INC
OUTC
10
9
+INB
-INB
+INC
-INC
+
+
_
_
7
8
OUTB
OUTC
OUTB
8
TSSOP-14 (Exposed Pad)
NOTE: For all packages, connect thermal die pad to -VS. Connect it to -VS plane to maximize thermal performance.
SG Micro Corp
MARCH 2022
www.sg-micro.com
3
SGM8416-1/SGM8416-2
SGM8416-4
24V, 800mA Peak Output Current
Rail-to-Rail I/O Operational Amplifiers
ELECTRICAL CHARACTERISTICS
(+VS = 16V, -VS = 0V, +VIN = VOUT = +VS/2, typical values are at TA = +25℃, unless otherwise specified.)
PARAMETER
Input Characteristics
Input Offset Voltage
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
VOS
VCM = +VS/2
2
3.6
1
10
mV
μV/℃
nA
Input Offset Voltage Drift
Input Bias Current
ΔVOS/ΔT VCM = +VS/2
IB
VCM = +VS/2
IOUT = 0mA to -80mA
IOUT = 0mA to 80mA
0.01
-0.01
Load Regulation
ΔVLOAD
mV/mA
Input Common Mode Voltage Range
Common Mode Rejection Ratio
Open-Loop Voltage Gain
VCM
CMRR
AOL
-0.1
(+VS) + 0.1
V
-0.1V ≤ VCM ≤ (+VS) + 0.1V
0.5V ≤ VOUT ≤ (+VS) - 0.5V
72
dB
dB
120
Output Characteristics
Low Output Voltage Swing from Rail
High Output Voltage Swing from Rail
Transient Peak Output Current
Continuous Output Current
Power Supply
VOL
VOH
IPK
IL = -50mA
IL = 50mA
0.26
0.34
V
V
(+VS) - 0.55 (+VS) - 0.42
±800
±300
mA
mA
IOUT
Supply Voltage Range
4.5
26.5
V
Power Supply Rejection Ratio
Quiescent Current/Amplifier
Dynamic Performance
PSRR
IQ
+VS = 4.5V to 26.5V, VCM = 3V
No load
94
dB
mA
2.6
4V step, CL = 50pF, RL = 10kΩ,
20% to 80%, AV = 1
AV = 1, VOUT = 2V step, RL = 10kΩ,
CL = 10pF
Slew Rate
SR
tS
65
V/µs
ns
Settling Time to ±0.1%
160
-3dB Bandwidth
BW
RL = 10kΩ, CL = 10pF
RL = 10kΩ, CL = 10pF
RL = 10kΩ, CL = 10pF
50
25
30
MHz
MHz
°
Gain-Bandwidth Product
Phase Margin
GBP
Noise Performance
Input Voltage Noise Density
Thermal Protection
en
f = 1kHz
115
nV/ Hz
√
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
TSHDN
150
25
℃
℃
ΔTSHDN
SG Micro Corp
MARCH 2022
www.sg-micro.com
4
SGM8416-1/SGM8416-2
SGM8416-4
24V, 800mA Peak Output Current
Rail-to-Rail I/O Operational Amplifiers
TYPICAL PERFORMANCE CHARACTERISTICS
At TA = +25℃, +VS = 16V, -VS = 0V, unless otherwise specified.
Large-Signal Transient Response
Large-Signal Transient Response
V+INA
V+INA
VOUTA
VOUTA
AV = 1
AV = 1
RL = 10kΩ
CL = 10pF
RL = 10kΩ
CL = 10pF
Time (50ns/div)
Time (50ns/div)
Small-Signal Transient Response
Small-Signal Transient Response
V+INA
V+INA
VOUTA
VOUTA
AV = 1
AV = 1
RL = 10kΩ
RL = 10kΩ
CL = 10pF
CL = 10pF
Time (50ns/div)
Time (50ns/div)
SG Micro Corp
www.sg-micro.com
MARCH 2022
5
SGM8416-1/SGM8416-2
SGM8416-4
24V, 800mA Peak Output Current
Rail-to-Rail I/O Operational Amplifiers
APPLICATION INFORMATION
It is recommended that the junction temperature should
not exceed +125℃ for normal operation. The parameter
of ambient thermal resistance is determined by the
width of trace in PCB layout.
The SGM8416-1/2/4 are specifically designed to drive
high current load. These devices support rail-to-rail
input and output operation, and consume low quiescent
current. They can also provide a high slew rate. The
combination of characteristics makes SGM8416-1/2/4
suitable for LCD applications.
In addition, the ambient temperature and thermal
resistance will affect the power dissipation of
SGM8416-1/2/4.
Operating Voltage
The SGM8416-1/2/4 are guaranteed to operate from
4.5V to 26.5V, and the operation is extremely stable
over the whole specified range of the temperature. The
output voltage swing can be closer to the supply rail by
reducing the load current.
Layout
For the circuits with high power path, a good PCB
design is essential. It is recommended to use the
following layout method to improve the performance of
SGM8416-1/2/4 at most.
The power component should be close enough to
SGM8416-1/2/4 for better performance. Also, if the high
current is necessary, the corresponding trace in PCB
should be short and wide.
LCD Panel Application
The SGM8416-1/2/4 can provide optimal performance
in LCD VCOM buffer. They feature ±800mA transient peak
source/sink current.
For some applications such as filtering, a series
resistor is necessary to be added at the output of the
devices.
Output Current Limit
The SGM8416-1/2/4 can drive ±800mA transient peak
output current. These devices have a ±800mA (TYP)
current limit, which is accomplished with the characteristics
of the internal metal interconnects. Maximum reliability
is maintained if the output continuous current never
exceeds ±300mA.
Choosing a suitable bypass capacitor can enhance
the stability when driving the loads with high transient.
For single-supply operation, the bypass capacitor
should be placed as close to +VS pin as possible. For
dual-supply operation, both +VS and -VS supplies
should be bypassed to ground with separate 0.1μF
ceramic capacitors. Using a 10μF tantalum capacitor is
a good choice to improve the operating stability of the
devices when driving high transient load.
Thermal Consideration
When operating the devices, the users need to make
sure that the junction temperature is below the absolute
maximum one. The junction temperature is increasing
because the power dissipation is higher than before. And
a lot of possibilities can cause the thermal considerations,
such as the width of trace in PCB, the package of the
devices, the gap between ambient and junction
temperature and rate of environmental airflow.
A 0.1μF capacitor should be connected with +IN pin
to GND for better operation of SGM8416-1/2/4 and the
distance between this capacitor and +IN pin should be
minimized.
It is recommended to connect exposed pad to -VS
The following equation indicates the calculation of power
dissipation:
directly in the PCB.
PD(MAX) = (TJ(MAX) - TA)/θJA
(1)
where:
TJ(MAX) = Maximum junction temperature.
TA = Ambient temperature.
θJA = Junction to ambient thermal resistance.
SG Micro Corp
MARCH 2022
www.sg-micro.com
6
SGM8416-1/SGM8416-2
SGM8416-4
24V, 800mA Peak Output Current
Rail-to-Rail I/O Operational Amplifiers
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
MARCH 2022 ‒ REV.A.2 to REV.A.3
Page
Updated Tape and Reel Information section......................................................................................................................................................11
JULY 2021 ‒ REV.A.1 to REV.A.2
Page
Added Output Current Limit section .....................................................................................................................................................................6
Updated TSSOP-14 (Exposed Pad) package ....................................................................................................................................................10
JULY 2020 ‒ REV.A to REV.A.1
Page
Updated TSSOP-14 (Exposed Pad) package ......................................................................................................................................................9
Updated Tape and Reel Information section......................................................................................................................................................10
Changes from Original (MAY 2016) to REV.A
Page
Changed from product preview to production data.............................................................................................................................................All
SG Micro Corp
MARCH 2022
www.sg-micro.com
7
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TDFN-3×3-8L
D
e
N8
D1
k
E
E1
N4
N1
L
b
BOTTOM VIEW
TOP VIEW
2.3
1.5 2.725
A
A1
A2
0.675
SIDE VIEW
0.65
0.24
RECOMMENDED LAND PATTERN (Unit: mm)
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
0.800
0.050
MIN
0.028
0.000
MAX
0.031
0.002
A
A1
A2
D
0.700
0.000
0.203 REF
0.008 REF
2.900
2.200
2.900
1.400
3.100
2.400
3.100
1.600
0.114
0.087
0.114
0.055
0.122
0.094
0.122
0.063
D1
E
E1
k
0.200 MIN
0.650 TYP
0.008 MIN
0.026 TYP
b
0.180
0.375
0.300
0.575
0.007
0.015
0.012
0.023
e
L
NOTE: This drawing is subject to change without notice.
SG Micro Corp
TX00058.000
www.sg-micro.com
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
MSOP-8 (Exposed Pad)
D1
1.80
E1
E
E2
1.55 4.8
1.02
b
e
0.65
0.41
RECOMMENDED LAND PATTERN (Unit: mm)
D
L
A
c
A1
θ
A2
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
MIN
MAX
0.043
0.006
0.037
0.015
0.009
0.122
0.075
A
A1
A2
b
0.820
0.020
0.750
0.250
0.090
2.900
1.700
1.100
0.150
0.950
0.380
0.230
3.100
1.900
0.032
0.001
0.030
0.010
0.004
0.114
0.067
c
D
D1
e
0.65 BSC
0.026 BSC
E
2.900
4.750
1.450
0.400
0°
3.100
5.050
1.650
0.800
6°
0.114
0.187
0.057
0.016
0°
0.122
0.199
0.065
0.031
6°
E1
E2
L
θ
NOTES:
1. Body dimensions do not include mode flash or protrusion.
2. This drawing is subject to change without notice.
SG Micro Corp
TX00016.000
www.sg-micro.com
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TSSOP-14 (Exposed Pad)
D
3.56
D1
E1
E
3.05
5.94
E2
1.78
0.42
b
e
0.65
RECOMMENDED LAND PATTERN (Unit: mm)
L1
A
A1
L
θ
A2
c
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
MIN
MAX
0.047
0.006
0.041
0.012
0.008
0.201
0.144
0.177
0.258
0.124
A
A1
A2
b
1.200
0.150
1.050
0.300
0.200
5.100
3.660
4.500
6.550
3.150
0.050
0.800
0.190
0.090
4.900
3.300
4.300
6.250
2.900
0.002
0.031
0.007
0.004
0.193
0.130
0.169
0.246
0.114
c
D
D1
E
E1
E2
e
0.650 BSC
0.026 BSC
L
1.000
0.750
8°
0.039
0.030
8°
L1
θ
0.450
0°
0.018
0°
NOTES:
1. Body dimensions do not include mode flash or protrusion.
2. This drawing is subject to change without notice.
SG Micro Corp
TX00107.002
www.sg-micro.com
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
TDFN-3×3-8L
13″
13″
13″
13″
12.4
12.4
16.4
12.4
3.35
5.20
6.80
6.80
3.35
3.30
5.40
5.40
1.13
1.50
1.30
1.30
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
2.0
2.0
2.0
2.0
12.0
12.0
16.0
12.0
Q1
Q1
Q1
Q1
MSOP-8
(Exposed Pad)
TSSOP-14
(Exposed Pad)
TSSOP-14
(Exposed Pad)
SG Micro Corp
TX10000.000
www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
13″
386
280
370
5
SG Micro Corp
www.sg-micro.com
TX20000.000
相关型号：
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