SGM8600 [SGMICRO]
2.2mA, 11MHz, Low Noise, Rail-to-Rail I/O Tiny Package, CMOS Operational Amplifier;
| 型号： | SGM8600 |
| 厂家： | 
Shengbang Microelectronics Co, Ltd |
| 描述： | 2.2mA, 11MHz, Low Noise, Rail-to-Rail I/O Tiny Package, CMOS Operational Amplifier |
| 文件： | 总15页 (文件大小：980K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SGM8600
2.2mA, 11MHz, Low Noise, Rail-to-Rail I/O
Tiny Package, CMOS Operational Amplifier
GENERAL DESCRIPTION
FEATURES
The SGM8600 is a dual, low voltage, low noise and low
power operational amplifier, which can operate from
2.1V to 5.5V single supply, while consuming only
2.2mA quiescent current at 5V.
● Offset Voltage Range: 0mV to 4mV
● High Gain-Bandwidth Product: 11MHz
● High Slew Rate: 8.5V/μs
● Settling Time to 0.1% with 2V Step: 0.21μs
● Overload Recovery Time: 0.6μs
The minimum input common mode voltage is within
0.1V below the negative rail, and the output swing is
rail-to-rail with heavy loads. The SGM8600 features a
4mV maximum input offset voltage. The SGM8600
exhibits a high gain-bandwidth product of 11MHz and a
slew rate of 8.5V/μs. These specifications make the
operational amplifier appropriate for various applications.
● Low Noise: 8.5nV/ Hz at 10kHz
√
● Rail-to-Rail Input and Output
● Supply Voltage Range: 2.1V to 5.5V
● Input Common Mode Voltage Range:
-0.1V to 5.6V with VS = 5.5V
● Low Power: 2.2mA (TYP) Supply Current
● -40℃ to +125℃ Operating Temperature Range
● Available in Green SOIC-8 and TDFN-2×2-8L
Packages
The SGM8600 is available in Green SOIC-8 and
TDFN-2×2-8L packages. It is specified over the extended
-40℃ to +125℃ industrial temperature range.
APPLICATIONS
Sensors
Audio
Active Filters
A/D Converters
Communications
Test Equipment
Cellular and Cordless Phones
Laptops and PDAs
Photodiode Amplification
Battery-Powered Instrumentation
SG Micro Corp
SEPTEMBER2015–REV. A
www.sg-micro.com
2.2mA, 11MHz, Low Noise, Rail-to-Rail I/O
Tiny Package, CMOS Operational Amplifier
SGM8600
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
SGM
SOIC-8
SGM8600XS8G/TR
8600XS8
XXXXX
Tape and Reel, 2500
Tape and Reel, 3000
-40℃ to +125℃
-40℃ to +125℃
SGM8600
8600
XXXX
TDFN-2×2-8L
SGM8600XTDE8G/TR
MARKING INFORMATION
NOTE: XXXX = Date Code. XXXXX = Date Code and Vendor Code.
TDFN-2×2-8L
SOIC-8
X X X X
X X X X X
Vendor Code
Date Code - Week
Date Code - Year
Date Code - Week
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
ABSOLUTE MAXIMUM RATINGS
ESD SENSITIVITY CAUTION
Supply Voltage, +VS to -VS ................................................6V
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
Input Common Mode Voltage Range
.......................................................(-VS) - 0.3V to (+VS) + 0.3
Junction Temperature.................................................+150℃
Storage Temperature Range.......................-65℃ to +150℃
Lead Temperature (Soldering, 10s)............................+260℃
ESD Susceptibility
HBM.............................................................................8000V
MM.................................................................................400V
CDM ............................................................................1000V
DISCLAIMER
SG Micro Corp reserves the right to make any change in
RECOMMENDED OPERATING CONDITIONS
Input Voltage Range...........................................2.1V to 5.5V
Operating Temperature Range.....................-40℃ to +125℃
circuit design, or specifications without prior notice.
OVERSTRESS CAUTION
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
SG Micro Corp
www.sg-micro.com
SEPTEMBER 2015
2
2.2mA, 11MHz, Low Noise, Rail-to-Rail I/O
Tiny Package, CMOS Operational Amplifier
SGM8600
PIN CONFIGURATIONS
(TOP VIEW)
(TOP VIEW)
8
7
6
5
+VS
OUTA
-INA
+INA
-VS
1
2
3
4
-INA
+INA
-INB
+INB
1
2
3
4
8
7
6
5
OUTA
-VS
OUTB
-INB
+INB
-
Expose Pad (1)
+VS
+
-
OUTB
+
TDFN-2×2-8L
SOIC-8
NOTE 1: Exposed pad can be connected to -VS or left floating.
SG Micro Corp
www.sg-micro.com
SEPTEMBER 2015
3
2.2mA, 11MHz, Low Noise, Rail-to-Rail I/O
Tiny Package, CMOS Operational Amplifier
SGM8600
ELECTRICAL CHARACTERISTICS
(At TA = +25℃, VS = +5V, VCM = VS/2 and RL = 600Ω, unless otherwise noted.)
SGM8600
TYP
MIN/MAX OVER TEMPERATURE
PARAMETER
CONDITIONS
-40℃ to -40℃ to
MIN/
MAX
UNITS
+25℃
+25℃
+85℃
+125℃
Input Characteristics
Input Offset Voltage (VOS
0
4
mV
mV
pA
pA
V
MIN
MAX
TYP
TYP
TYP
MIN
MIN
)
2
4.5
5
Input Bias Current (IB)
Input Offset Current (IOS
1
)
1
-0.1 to +5.6
82
Input Common Mode Voltage Range (VCM
)
VS = 5.5V
VS = 5.5V, VCM = -0.1V to 4V
VS = 5.5V, VCM = -0.1V to 5.6V
RL = 600Ω,
67
59
66
58
65
57
dB
dB
Common Mode Rejection Ratio (CMRR)
70
92
84
96
74
87
65
72
dB
MIN
V
OUT = 0.15V to 4.85V
RL = 10kΩ ,
OUT = 0.05V to 4.95V
Open-Loop Voltage Gain (AOL
)
105
8.7
dB
MIN
TYP
V
Input Offset Voltage Drift (ΔVOS/ΔT)
μv/℃
Output Characteristics
RL = 600Ω
RL = 10kΩ
76
7
90
11
50
110
13
135
18
mV
mV
mA
Ω
MAX
MAX
MIN
Output Voltage Swing from Rail
Output Current (IOUT
)
63
8.5
41
36
Closed-Loop Output Impedance
f = 1MHz, G = 1
TYP
Power Supply
2.1
5.5
2.1
5.5
2.1
5.5
2.1
5.5
V
V
MIN
Operating Voltage Range
MAX
VS = +2.1V to +5.5V,
Power Supply Rejection Ratio (PSRR)
79
69
68
3
64
dB
MIN
V
CM = (-VS) + 0.5V
Quiescent Current (IQ)
Dynamic Performance
Gain-Bandwidth Product (GBP)
Phase Margin (φO)
IOUT = 0
2.2
2.7
3.5
mA
MAX
RL = 10kΩ
11
62
MHz
°
TYP
TYP
TYP
TYP
TYP
TYP
Full Power Bandwidth (BWP)
Slew Rate (SR)
< 1% distortion
400
8.5
0.21
0.6
kHz
V/μs
μs
G = 1, 2V output step
G = 1, 2V output step
VIN × G = VS
Settling Time to 0.1% (tS)
Overload Recovery Time
Noise Performance
μs
Hz
f = 1kHz
12.5
8.5
nV/
nV/
TYP
TYP
Input Voltage Noise Density (en)
Hz
f = 10kHz
SG Micro Corp
www.sg-micro.com
SEPTEMBER 2015
4
2.2mA, 11MHz, Low Noise, Rail-to-Rail I/O
Tiny Package, CMOS Operational Amplifier
SGM8600
TYPICAL PERFORMANCE CHARACTERISTICS
At TA = +25℃, VCM = VS/2 and RL = 600Ω, unless otherwise noted.
CMRR vs. Frequency
PSRR vs. Frequency
120
100
80
60
40
20
0
120
100
80
60
40
20
0
VS = 5V
VS = 5V
PSRR-
PSRR+
1
10
100
Frequency (kHz)
1000
10000
1
10
100
1000
10000
Frequency (kHz)
Channel Separation vs. Frequency
Channel B to A
Channel Separation vs. Frequency
Channel A to B
150
120
90
60
30
0
150
120
90
60
30
0
Channel A to B
Channel B to A
V
S = 2.1V
VS = 5V
RL = 620Ω
TA = +25℃
G = 1
RL = 620Ω
TA = +25℃
G = 1
0.1
1
10
100
1000
0.1
1
10
100
1000
Frequency (kHz)
Frequency (kHz)
Closed-Loop Output Voltage Swing
Closed-Loop Output Voltage Swing
2.5
2.0
1.5
1.0
0.5
0.0
6
5
4
3
2
1
0
VS = 2.1V
VS = 5V
VIN = 2.1VP-P
TA = +25℃
RL = 2kΩ
G = 1
VIN = 4.9VP-P
TA = +25℃
RL = 2kΩ
G = 1
10
100
1000
10000
10
100
1000
10000
Frequency (kHz)
Frequency (kHz)
SG Micro Corp
www.sg-micro.com
SEPTEMBER 2015
5
2.2mA, 11MHz, Low Noise, Rail-to-Rail I/O
Tiny Package, CMOS Operational Amplifier
SGM8600
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
At TA = +25℃, VCM = VS/2 and RL = 600Ω, unless otherwise noted.
Small-Signal Overshoot vs. Load Capacitance
Small-Signal Overshoot vs. Load Capacitance
S = 5V
RL = 10kΩ
TA = +25℃
G = 1
50
40
30
20
10
0
50
40
30
20
10
0
V
V
S = 2.1V
RL = 10kΩ
TA = +25℃
G = 1
10
100
1000
10
100
1000
Load Capacitance (pF)
Load Capacitance (pF)
Output Impedance vs. Frequency
S = 2.1V
Output Impedance vs. Frequency
S = 5V
60
60
50
40
30
20
10
0
V
V
50
40
30
20
10
0
G = 100
G = 100
G = 10
G = 10
G = 1
G = 1
1
10
100
Frequency (kHz)
1000
10000
1
10
100
Frequency (kHz)
1000
10000
Large-Signal Step Response
Large-Signal Step Response
G = 1
G = 1
CL = 200pF
RL = 10kΩ
VS = 2.1V
CL = 200pF
RL = 10kΩ
VS = 5V
Time (1μs/div)
Time (1μs/div)
SG Micro Corp
www.sg-micro.com
SEPTEMBER 2015
6
2.2mA, 11MHz, Low Noise, Rail-to-Rail I/O
Tiny Package, CMOS Operational Amplifier
SGM8600
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
At TA = +25℃, VCM = VS/2 and RL = 600Ω, unless otherwise noted.
Small-Signal Step Response
Small-Signal Step Response
G = 1
G = 1
CL = 100pF
RL = 10kΩ
VS = 2.1V
CL = 100pF
RL = 10kΩ
VS = 5V
Time (200ns/div)
Time (200ns/div)
Positive Overload Recovery
Negative Overload Recovery
0V
VIN
0V
VIN
V
S = 5V
VS = 5V
VIN = 50mV
RL = 10kΩ
G = -100
VIN = 50mV
RL = 10kΩ
G = -100
VOUT
0V
0V
VOUT
Time (1μs/div)
Time (1μs/div)
Supply Current vs. Temperature
VS = 2.1V
Input Voltage Noise Spectral Density vs. Frequency
VS = 5V
3
2.6
2.2
1.8
1.4
1
1000
100
10
VS = 5V
VS = 3V
1
10
100
1000
10000
-50
-25
0
25
50
75
100 125
Frequency (Hz)
Temperature (℃)
SG Micro Corp
www.sg-micro.com
SEPTEMBER 2015
7
2.2mA, 11MHz, Low Noise, Rail-to-Rail I/O
Tiny Package, CMOS Operational Amplifier
SGM8600
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
At TA = +25℃, VCM = VS/2 and RL = 600Ω, unless otherwise noted.
CMRR vs. Temperature
PSRR vs. Temperature
VS = 2.1V to 5.5V
110
100
90
120
110
100
90
V
S = 5.5V
VCM = -0.1V to 4V
80
70
80
VCM = -0.1V to 5.6V
70
60
60
50
-50
-25
0
25
50
75
100 125
-50
-25
0
25
50
75
100 125
Temperature (℃)
Temperature (℃)
Open-Loop Voltage Gain vs. Temperature
RL = 10kΩ
Open-Loop Voltage Gain vs. Temperature
RL = 600Ω
110
100
90
120
110
100
90
VS = 5V
VS = 5V
VS = 2.1V
VS = 2.1V
80
70
80
60
70
-50
-25
0
25
50
75
100 125
-50
-25
0
25
50
75
100 125
Temperature (℃)
Temperature (℃)
Output Voltage Swing vs. Output Current
Output Voltage Swing vs. Output Current
2.5
2.0
1.5
1.0
0.5
0.0
5
4
3
2
1
0
Sourcing Current
VS = 2.1V
Sourcing Current
VS = 5V
-40℃
+125℃ +25℃
+125℃
+25℃
-40℃
Sinking Current
Sinking Current
0
10
20
30
40
50
60
70
80
0
5
10
15
20
25
30
35
40
Output Current (mA)
Output Current (mA)
SG Micro Corp
www.sg-micro.com
SEPTEMBER 2015
8
2.2mA, 11MHz, Low Noise, Rail-to-Rail I/O
Tiny Package, CMOS Operational Amplifier
SGM8600
APPLICATION INFORMATION
Rail-to-Rail Input
Power Supply Decoupling and Layout
When SGM8600 works at the power supply between
2.1V and 5.5V, the input common mode voltage range
is from (-VS) - 0.1V to (+VS) + 0.1V. In Figure 1, the ESD
diodes between the inputs and the power supply rails
will clamp the input voltage not to exceed the rails.
A clean and low noise power supply is very important in
amplifier circuit design, besides of input signal noise,
the power supply is one of important source of noise to
the amplifier through +VS and -VS pins. Power supply
bypassing is an effective method to clear up the noise
at power supply, and the low impedance path to ground
of decoupling capacitor will bypass the noise to GND.
In application, 10μF ceramic capacitor paralleled with
0.1μF or 0.01μF ceramic capacitor is used in Figure 3.
The ceramic capacitors should be placed as close as
possible to +VS and -VS power supply pins.
+VS
VP
+
_
VN
+VS
+VS
-VS
10μF
10μF
Figure 1. Input Equivalent Circuit
0.1μF
0.1μF
Rail-to-Rail Output
The SGM8600 supports rail-to-rail output operation. In
single power supply application, for example, when +VS
= 5V, -VS = GND, 10kΩ load resistor is tied from OUT
pin to ground, the typical output swing range is from
0.007V to 4.993V.
_
_
VN
VP
VN
VP
VOUT
VOUT
+
+
10μF
-VS (GND)
Driving Capacitive Loads
0.1μF
The SGM8600 is designed for unity-gain stable for
capacitive load up to 4700pF. If greater capacitive load
must be driven in application, the circuit in Figure 2 can
be used. In this circuit, the IR drop voltage generated
by RISO is compensated by feedback loop.
-VS
Figure 3. Amplifier Power Supply Bypassing
Grounding
RF
CF
In low speed application, one node grounding technique
is the simplest and most effective method to eliminate
the noise generated by grounding. In high speed
application, the general method to eliminate noise is to
use a complete ground plane technique, and the whole
ground plane will help distribute heat and reduce EMI
noise pickup.
_
RISO
VOUT
CL
VIN
+
Reduce Input-to-Output Coupling
Figure 2. Circuit to Drive Heavy Capacitive Load
To reduce the input-to-output coupling, the input traces
must be placed as far away from the power supply or
output traces as possible. The sensitive trace must not
be placed in parallel with the noisy trace in same layer.
They must be placed perpendicularly in different layers
to reduce the crosstalk. These PCB layout techniques
will help to reduce unwanted positive feedback and
noise.
SG Micro Corp
www.sg-micro.com
SEPTEMBER 2015
9
2.2mA, 11MHz, Low Noise, Rail-to-Rail I/O
Tiny Package, CMOS Operational Amplifier
SGM8600
APPLICATION INFORMATION (continued)
Active Low-Pass Filter
Typical Application Circuits
The circuit in Figure 6 is a design example of active
low-pass filter, the DC gain is equal to -R2/R1 and the
-3dB corner frequency is equal to 1/2πR2C. In this
design, the filter bandwidth must be less than the
bandwidth of the amplifier, the resistor values must be
selected as low as possible to reduce ringing or
oscillation generated by the parasitic parameters in
PCB layout.
Difference Amplifier
The circuit in Figure 4 is a design example of classical
difference amplifier. If R4/R3 = R2/R1, then VOUT = (VP -
VN) × R2/R1 + VREF
.
R2
R1
_
VN
VOUT
C
R3
VP
+
R2
R4
R1
_
VIN
VREF
VOUT
+
Figure 4. Difference Amplifier
R3 = R1 // R2
High Input Impedance Difference Amplifier
The circuit in Figure 5 is a design example of high input
impedance difference amplifier, the added amplifiers at
the input are used to increase the input impedance and
eliminate drawback of low input impedance in Figure 4.
Figure 6. Active Low-Pass Filter
_
R1
R2
VN
+
_
VOUT
+
VP
+
R3
_
R4
VREF
Figure 5. High Input Impedance Difference Amplifier
SG Micro Corp
www.sg-micro.com
SEPTEMBER 2015
10
2.2mA, 11MHz, Low Noise, Rail-to-Rail I/O
Tiny Package, CMOS Operational Amplifier
SGM8600
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (SEPTEMBER 2015) to REV.A
Page
Changed from product preview to production data.............................................................................................................................................All
SG Micro Corp
www.sg-micro.com
SEPTEMBER 2015
11
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TDFN-2×2-8L
D
e
N8
E1
D1
L
E
k
N4
N1
b
BOTTOM VIEW
TOP VIEW
1.20
0.65
0.60 1.95
A
A1
A2
SIDE VIEW
0.24
0.50
RECOMMENDED LAND PATTERN (Unit: mm)
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
0.800
0.050
MIN
0.028
0.000
MAX
0.031
0.002
A
A1
A2
D
0.700
0.000
0.203 REF
0.008 REF
1.900
1.100
1.900
0.500
2.100
1.300
2.100
0.700
0.075
0.043
0.075
0.020
0.083
0.051
0.083
0.028
D1
E
E1
k
0.200 MIN
0.500 TYP
0.008 MIN
0.020 TYP
b
0.180
0.250
0.300
0.450
0.007
0.010
0.012
0.018
e
L
SG Micro Corp
www.sg-micro.com
TX00056.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
SOIC-8
0.6
D
e
2.2
E1
E
5.2
b
1.27
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
A1
c
θ
A2
Dimensions
In Millimeters
Dimensions
In Inches
Symbol
MIN
MAX
1.750
0.250
1.550
0.510
0.250
5.100
4.000
6.200
MIN
MAX
0.069
0.010
0.061
0.020
0.010
0.200
0.157
0.244
A
A1
A2
b
1.350
0.100
1.350
0.330
0.170
4.700
3.800
5.800
0.053
0.004
0.053
0.013
0.006
0.185
0.150
0.228
c
D
E
E1
e
1.27 BSC
0.050 BSC
L
0.400
0°
1.270
8°
0.016
0°
0.050
8°
θ
SG Micro Corp
www.sg-micro.com
TX00010.000
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
P0
W
Q2
Q4
Q2
Q4
Q2
Q4
Q1
Q3
Q1
Q3
Q1
Q3
B0
Reel Diameter
P1
A0
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel Width
Reel
Diameter
A0
B0
K0
P0
P1
P2
W
Pin1
Package Type
W1
(mm)
(mm) (mm) (mm) (mm) (mm) (mm) (mm) Quadrant
TDFN-2×2-8L
SOIC-8
7″
9.5
2.30
6.40
2.30
5.40
1.10
2.10
4.0
4.0
4.0
8.0
2.0
2.0
8.0
Q1
Q1
13″
12.4
12.0
SG Micro Corp
TX10000.000
www.sg-micro.com
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Reel Type
Pizza/Carton
7″ (Option)
368
442
386
227
410
280
224
224
370
8
18
5
7″
13″
SG Micro Corp
www.sg-micro.com
TX20000.000
相关型号：
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