GM2BB65GT1C [SHARP]
Single Color LED,;型号: | GM2BB65GT1C |
厂家: | SHARP ELECTRIONIC COMPONENTS |
描述: | Single Color LED, |
文件: | 总23页 (文件大小:2444K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ZENIGATA LED
July 30, 2014
SPECIFICATIONS
Pico ZENIGATA-LED
GM2BB50GT1C
**:50,57,65
Notice
Contents in this technical document be changed without any notice due to the product modification.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
defects that may occur in wquipment using any SHARP devices shown in catalogs, data books, etc.
Development DepartmentⅡ
Lighting Device Division
Electronic Components And Devices Group
SHARP CORPORATION
http://www.sharp-world.com/products/device/
sharp LD-E7-2-14-A
Model No. GM2BB**GT1C
http://www.sharp-world.com/products/device/
“Contents in this technical document be changed without any notice due to the product modification.”
●Handle this document carefully it contains material protected by international
copyright law. Any reproduction, full or in part, of this material is prohibited
without the express written permission of the company.
●When using the products covered herein,please observe the conditions written herein
and the precautions outlined in the following paragraphs. In no event shall the
company be liable for any damages resulting from failure to strictly adhere to these conditions and precautions.
(1) Please do verify the validity of this part after assembling it in customerʼs products,when
customer wants to make catalogue and instruction manual based on the specification sheet of this part.
(2) The products covered herein are desigd and manufactured for the following application areas.
When using the products covered herein for the equipment listed in paragraph(3),even for the following
application areas, be sure to observe the precautions given in Paragraph(3).
Never use the products for the equipment listed in Paragraph(4).
・Office electronics
・Instrumentation and measuring equipment
・Machine tools
・Audiovisual equipment
・Home appliances
・Communication equipment other than for trunk lines
(3) These contemplating using the products covered herein for the following equipment which demands
high reliability, should first contact a sales representative of the company and then accept responsibility
for incorporating into the design fail-safe operation,redundansy, and other appropriate measures for
ensuring reliability and safety of the equipment and the overall system.
・Control and safety devices for airplanes, trains,automobiles, and other transportation equipment
・Mainframe computers
・Traffic control systems
・Gas leak detectors and automatic cutoff devices
・Rescue and security equipment
・Other safety devices and safety equipment, etc.
(4) Do not use the products covered herein for the followin equipment which demands extremely
high performance in terms of functionality, reliability, or accuracy.
・Aerospace equipment
・Communications equipment for trunk lines
・Control equipment for the nuclear power industry
・Medical equipment related to life support, etc.
(5) Please direct all queries and comments regarding the interpretation of the above four Paragraphs to
a sales representative of the company.
sharp LD-E7-2-14-A
Model No. GM2BB**GT1C
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GM2BB**GT1C Technical literature
1.Application
These technical literatures apply to light emitting diode Model No.GM2BB**GT1C.
[ LED module (InGaN Blue LED chip + Phosphor) ]
Main application : Lighting
Refer to Page 2.
2. External dimensions and equivalent circuit
3. Ratings and characteristics
Refer to Page 3-6.
3-1. Absolute maximum ratings
3-2. Electro-optical characteristics
3-3. Derating curve
3-4. Characteristics diagram (TYP.)
4. Reliability
Refer to Page 7-8.
Refer to Page 9.
4-1. Test items and test conditions
4-2. Failure criteria
5. Quality level
5-1. Applied standard
5-2. Sampling inspection
5-3. Inspection items and defect criteria
6. Supplements
Refer to Page 10-16.
6-1. Chromaticity rank table
6-2. Taping
6-3. Label
6-4. Packing
6-5. Indication printed on product
7. Precautions
Refer to Page 17-20.
1
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2. External dimensions and equivalent circuit
②
(0.6)
(1.9)
①
2.8
TC
Equivalent circuit
②
-Cathode
2.8
(2.4)
+Anode
①
・ Unspecified tolerance to be ±0.2
This tolerance does not include dimensions of resin and substrate burr remained on edge.
・ Values inside parentheses are reference values.
・ Tc: Measurement point of case temperature
Unit
Material
Finish
Substrate : Ceramics
Lens : Silicone resin
Terminal:Au plating
mm
2
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3. Ratings and characteristics
3-1. Absolute maximum ratings
Applied temperature
Parameter
Symbol
Tc
Rating
Unit
℃
[℃]
Operating temperature
-30 to +100
-40 to +100
-
(Note 1)
Storage temperature
(Note 2)
Tstg
℃
-
P
384
15.6
120
4.7
-30 ≦ Topr ≦ 85
85 < Topr ≦ 100
-30 ≦ Topr ≦ 85
85 < Topr ≦ 100
-30 ≦ Topr ≦ 85
85 < Topr ≦ 100
mW
mW/℃
mA
Power dissipation (Note 3)
Derating factor
-
IF
-
Forward current (Note 4)
Derating factor
mA/℃
IFM
mA
Peak pulsed forward current
Derating factor
200
8.0
-
mA/℃
VR
Tc=25
-
V
5
Derating factor
Tsol
Soldering temperature
(Note 5)
350
℃
(Note 1) The range of operating temperature is prescribed by case temperature,
Case temperature (Refer to Page 2, External dimensions and equivalent circuit)
(Note 2)Do not exceed specified temperature range under any packing condition.
(Except when baking and soldering)
(Note 3) The operating current value follows the derating curve. (Refer to Page5)
(Note 4) Duty ratio = 1/10, Pulse width = 100 μs.
(Note 5) Each terminal must be soldered with the soldering iron (under 60W) within 3 seconds
(only once). Solder tip temperature: under 350℃
As for the reflow soldering profile, please refer to Page 19.
3
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3-2. Electro-optical characteristics
(Tc=25℃)
Parameter
Symbol
VF
Conditions
MIN.
TYP.
MAX.
Unit
V
Forward voltage
3.2
3.0
-
-
Luminous flux
(Note 1)
Φv
lm
-
-
-
-
See diagram below
I
F =50mA
-
x
y
3-2.1
Chromaticity coordinates
(Note 2)
-
Color rendering index
Ra
65
(70)
(Note 3)
3-2.1 Fundamental characteristics in all models
(Tc=25℃)
Typical of chromaticity
coordinates Typ.
Colortemperature
Typ.
Chromaticity
diagram
Luminous flux
Model No.
Typ.
GM2BB65GT1C
GM2BB57GT1C
GM2BB50GT1C
(6 500)
(5 700)
(5 000)
(0.3123,0.3282)
(0.3287,0.3417)
(0.3447,0.3553)
(21.5)
(22.5)
(22.5)
6-1
Page 10
(I =50mA)
F
(Note 1)ꢀMonitored by 8 inch integrating sphere of Sharp Standard. (After 20 ms drive) (Tolerance: ±10%)
(Note 2) Measured by 8 inch integrating sphere of Sharp Standard. (After 20ms drive) (Tolerance: ±0.01)
(Note 3) Measured by 8 inch integrating sphere of Sharp Standard. (After 20ms drive) (Tolerance: ±5)
(Note 4) Values inside parentheses are indicated only for reference, and are not guaranteed.
4
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3-3. Derating Curve
Peak Pulsed Forward Current Derating Curve
Forward Current Derating Curve
150
250
200
150
100
50
120
100
80
80
50
0
0
85
-30
-30
85
-40 -20 0 20 40 60 80 100 120
-40 -20 0 20 40 60 80 100 120
Case Temperature Tc (℃)
Case Temperature Tc (℃)
Peak Pulsed Forward Current vs. Duty Ratio
(Tc=25 ℃)
250
200
150
120
100
50
0
1/10
1/10
1
Duty Ratio
5
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ꢀꢀ3-4.Characteristics Diagram (TYP.)
Forward Current vs. Forward Voltage
Relative Luminous flux vs. Forward Current
(Tc=25 ℃)
(Tc=25 ℃)
250
140
120
100
80
60
40
20
0
150
100
50
0
0
50
100
150
2.0
2.5
3.0
3.5
(V)
4.0
Forward Voltage V
F
Forward Current I (mA)
F
Relative Luminous flux vs. Case Temperature
(I = 50 mA)
F
150
140
130
120
110
100
90
80
70
60
50
-40
-20
0
20
40
60
80
100
120
Case Temperature Tc (℃)
6
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4.Reliability
ꢀꢀ4-1. Test items and test conditions
ꢀ
(Confidence level:90%)
Samples Defective
LTPD
No.
1
Test items
Test conditions
(%)
n
C
22
0
10
-40℃(30min)to +100℃(30min),100cycles
Tstg = +60℃,RH = 90%,Time = 1 000h
Temperature cycle
Temperature humidity storage
2
22
22
0
0
10
10
3
High temperature storage
Low temperature storage
Tstg = +100℃,Time = 1 000h
Tstg = -40℃,Time = 1 000h
4
5
22
22
0
0
10
10
Steady state operating life
at room temperature
Tc =25℃,IF = 120 mA,Time = 1 000h
Tc = +100℃,I F= 50mA,Time = 1 000h
6
7
Steady state operating life
at high temperature
22
22
0
0
10
10
Steady state operating life
at high temperature and
elevated humidity
Tc = +60℃,RH=90%,I F= 120 mA,Time = 500h
2
Acceleration: 15 000 m/s2, Pulse width: 0.5 ms,
8
11
0
20
Shock
Tc = +25 ℃
Direction: X, Y and Z, 3 trials in each direction
7
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Acceleration: 200 m/s2
Frequency: 100 to 2 000 Hz (round-trip) 4 min
Tc = +25 ℃
Direction: X, Y and Z
4 trials in each direction
9
Vibration
11
11
0
0
20
20
2 trials, under the reflow condition
mentioned in Page 23.
10 Resistance to soldering heat
M705/ESR-250
Solder/ Flux: M705/ ESR 250
(SENJU METAL INDUSTRY CO., LTD)
Pretreatment
①High temp. storage : 150℃, 1h
②PCT(105℃, 100%RH, 1.22×105Pa, 4h)
Applied only to terminal part
Solderability
(Solder dip)
11
11
0
20
Soldering Temperature:Tsol=240℃±2℃, 3s,
Dipping depth:0.2~0.25mm
(After pretreatment, leave 2h or more at room
temperature and humidity. Dipping
flux in 3~5s and soldering)
M705-221BM5-42-11
Solder: M705-221BM5-42-11
(SENJU METAL INDUSTRY CO., LTD)
under the reflow condition mentioned
in Page 23
Solder joint strength
12
11
0
20
Temperature cycle
-40℃~+100℃(30min.), 100cycles
8
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5.Quality level
ꢀꢀ5-1. Applied standard(ISO 2859-1)
ꢀꢀ5-2. Sampling inspection(A single normal sampling plan, level S-4)
ꢀꢀ5-3. Inspection items and defect criteria
No.
1
Inspection items
Defect criteria
Classification
AQL
No light emitting
No radiation
2
Different from the specified color
Radiation color
Major defect
0.1
Not conforming to the inserted direction shown
in the specification
Taping
3
4
5
Not satisfied with specified values for VF, IR,
φ and chromaticity coordinates mentioned in Page 4
Electro-optical
characteristics
Not satisfied with specified dimensions in Page 2
External dimensions
Minor defect
0.4
Foreign substances and scratches of light
emitting face which are obstructed light
emitting condition.
(Except removable foreign substance)
6
Appearance
Resin or substrate burr which is over 0.3mm
Resin crack and terminal crack, which are over φ0.3 mm
9
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6.Supplements
ꢀꢀ6-1. Chromaticity diagram of each model
ꢀꢀ
(Tc=25℃)
Point1
Point2
Point3
Point4
Rank
x
y
x
y
x
y
x
y
0.3205
0.3376
0.3551
0.3481
0.3616
0.3760
0.3208
0.3207
0.3376
0.3304
0.3462
0.3616
0.3068
0.3222
0.3366
0.3113
0.3243
0.3369
0.3221
0.3366
0.3515
0.3261
0.3369
0.3487
GM2BB65GT1C
GM2BB57GT1C
GM2BB50GT1C
(IF=50mA Tolerance:±0.01)
0.380
0.370
0.360
0.350
0.340
0.330
0.320
0.310
GM2BB50GT1C(5000K)
GM2BB57GT1C(5700K)
GM2BB65GT1C(6500K)
0.300
0.290
0.300
0.310
0.320
0.330
CIE x
0.340
0.350
0.360
0.370
10
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6-2.Taping
6.2.1 Shape and dimensions of tape (Ref.)
P2
P
A
0
t
1
Feeding direction
t
3
Cathode Mark
t2
P
1
Symbol Dimension [mm]
Remarks
Parameter
A
B
3.13
3.13
4.0
Length
Width
Pitch
Measured at inside bottom
square corner
Pocket
(embossed)
P1
D0
P0
1.5
Diameter
Pitch
Sprocket hole
4.0
Accumulated error ±0.5 mm/ 10 pitch
Dimension from the edge of the tape
to the center of the sprocket hole
E
1.75
Sprocket hole position
P2
F
2.0
Dimension at the extension of the
center lines of the pocket to the
center line of the sprocket hole
Pocket position
3.5
5.3
0.1
8.0
W1
t3
Width
Cover tape
Thickness
Width
W0
t1
Carrier tape
0.25
Thickness
Including the thickness of cover and
carrier tape
t2
2.6
Overall thickness of the taping
11
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6-2-2.Shape and dimensions of reel (Ref.)
E
t
Label
W
Parameter
Symbol
Dimension [mm]
Remarks
Diameter
Thickness
A
t
180
Flange
1.5
Dimension measured close to the core
Clearance between the flanges
External diameter
W
B
10
60
13
Spindle hole diameter
C
Hub
Width
Key slit
E
2.0
Depth
U
4.5
Indication of Model No. etc.
Label attached on flange (Model No., quantity, Lot No. etc.)
Materials: Polystyrene
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6-2-3.Taping technical specification
Feeding direction
Empty
LEDs inside
Leader(Empty)
MIN. 160mm
MIN. 400mm
F
Cover tape separation
Cover Tape
Tape speed:5mm/s
0.1N ~ 1.0N(Θ=10°以下)
0 ~ 10°
Forward
Carrier Tape
(1)Tape strength against bending: The radius of curvature should be more than 30 mm.
If i bent at less than 30 mm, the cover may peel off.
(2) Joint of the tape: No joint of cover tape or carrier tape in one reel
(3) Quantity: 2 000 pcs. per reel (standard)
(4) Product mass: Approx. 30mg (One piece of LED/ Reference value)
(5) Others:
①There are no continuous empty pockets except leader and trailer part.
ꢀ②The quantity of the products lacking should be less than 0.1% of total product quantity.
ꢀ③Products should not be attached to the cover tape when it peeled off.
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6-3.Label (on reel)
EIAJC-3 compliant bar code (format e) label is attached on each reel.
<Example>
SHARP CORPORATION
Model No.
←
PART No.
GM2BB**GT1C
2 000
← Product quantity
QUANTITY
←
EIAJ C-3 Bar codes
← LOT number and rank
← Production country
LOT No. XX12J19/ RANK ○△△-□
〈EIAJ C-3〉 MADE IN XXXX
<LOT Number>
XX
12
J
19
④
①
②
③
① Production plant code (to be indicated alphabetically)
② Year of production (the last two figures of the year)
③ Month of production
(to be indicated alphabetically with January corresponding to A)
④ Date of production (01 to 31)
<Rank>
RANK○△△-□:○ꢀ Luminous flux rank
ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ△△ Chromaticity rank
ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ□ꢀ Forward voltage rank
14
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6-4.Packing
6-4-1.Moisture proof packing
In order to avoid the absorption of humidity while transport and storage,
the devices are packed in moisture proof aluminum bags.
SHIPMENTꢀTABLE
PART No. GM2BB**GT1C
Aluminum bag
Label
QUANTITY. 2000
RANK ○△△-□
LOT No.
XXXXXXXXXXX
SHARP CORPORATION
MADE IN XXXX
(※1)
R.C.
Silica gel
SHARP LABEL
Label(EIAJ C-3 compliant)
Reel
(Note 1) This mark indicates that this product is RoHS compliant product designed and
manufactured in accordance with Sharp's Green Device Guidelines.
6-4-2.Recommended storage conditions
Temperature: 5℃to 30 ℃ Relative humidity: 85% or less
6-4-3.Precautions after opening aluminum bags
①Please be sure to give them the soldering within 7 days under the following
conditions. Temperature: 5 ℃to 30 ℃ Relative humidity: 60% or less
②Storage in a dry box is recommended in case that the products are not used for
a long time after opened. Or repack the reels with a desiccative by the sealer
and store them under the same conditions mentioned in 5.3.2.
③Please perform the baking treatment under the recommended conditions in the
following cases;
・ The blue indicator of silica gel changes its color or fades.
・ 7days passed after opened under the specified storage conditions.
・ Products were stored out of storage condition.
(Recommended baking conditions)
・ Products with taping
ꢀTemperature: 60 ℃to 65 ℃, Time: 36 to 48 hours
・ Single piece of the products (on PCB or metallic tray)
ꢀTemperature: 100 ℃to 120 ℃, Time: 2 to 3 hours.
ꢀAvoid piling up the reels or applying stress to them during baking so as to protect from
ꢀdeformation. Please be sure to cool them to room temperature after baking.
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6-5.Information on environmental impact substances
6-5-1.RoHS compliant product
ꢀꢀꢀꢀꢀꢀThis product complies with the RoHS Directive (2011/65/EU) and manufactured
in accordance with Sharp's Green Device Guidelines.
6-5-2. Information relating to China RoHS
ꢀꢀꢀꢀꢀꢀProduct Information Notification based on Chinese law, Management Methods for
Controlling Pollution by Electronic Information Products.
Names and Contents of the Toxic and Hazardous Substances or Elements in the Products.
Toxic and Hazardous Substances or Elements.
Hexavalent
Chromium
Polybrominated
Biphenyls
Polybrominated Diphenyl
Ethers
Lead
Mercury
Cadmium
(Pb)
(Hg)
(Cd)
(Cr(VI))
(PBB)
(PBDE)
○
○
○
○
○
○
○:indicates that the content of the toxic and hazardous substance in all the homogeneous
materials of the part is below the concentration limit requirement as described in SJ/T 11363-2006.
×:indicates that the content of the toxic and hazardous substance in at least one
homogeneous material of the part exceeds the concentration limit requirement
as described in SJ/T 11363-2006 standard.
6-5-3.Ozone Depleting Substances
・ This product does not contain the following Ozone Depleting Substances.
・ This product does not have a production line whose process requires the
following Ozone Depleting Substances.
・ Restricted substances: CFCs, Halones, CCl4, and 1, 1, 1-Trichloroethane
(Methyl chloroform)
16
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7 Precautions
7-1.General handling
① The voltage must be applied to LED only as a forward direction. Moreover, please design
circuit diagram considering no voltage gap between Anode and Cathode during off state.
If the reverse voltage is applied to LED for a long term, the electro-migration is generated
and there is a possibility of the short-circuit of the circuit.
ꢀꢀꢀꢀ
② This product is sensitive for electrostatic voltageand surge voltage.Static electricity or surge
voltage can deteriorate product and its reliability. Please make sure that all devices and
equipments must be grounded.
We recommend to built in zener diode or TVS(Transient Voltage Suppression) as
protectioncircuit against static electricity.
③ This product is composed of blue LED chip and special phosphor.
Color tone is possibleto vary in some degree, depending on the operating conditions such
as ambient temperature or current amount. Also it is subject to variation due to the
afterglow of the phosphor in pulse drive.
So please verify the performancebefore use.
④ Do not look directly at LEDs with unshielded eyes, or damage to your eyes may result.
⑤ Materials with high thermal conductivity are used in this product in order to allow generated
heat to escape effectively out of the product.Avoid locating other heat sources
(ex. resistance, etc.) near the products on circuit board to protect the devices from the
heatdamage. Please make sure that case temperature is always under 100 ℃
during operation, including the self-heating.
⑥ Since dust on the surface of the radiation part is hard to remove and may decrease the
luminous intensity, please handle the products in a clean, non-dusty condition.
⑦ The lensof this product is formed with silicone resin. In the case of handling this device,
please do not push the lens portion by the sharp tools. The crackandpeeloffof the lens,
and the wire deformation are generated and it causes not lighting.
・ Especially do not apply the load from horizontal direction to the side of the lens of this product.
・ Please do not apply the static loadof 2.5N or more (1.4mmφor less)fromthe diagonal 45
degrees of this productslens portion to the direction of an optical axis.
⑧ This product is the small size andthe lens portion is formed by silicone resin, there isa
possibilityto have damage by the external stress.
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・ In the case of the handling withthe tweezers
In the case of the handling with the tweezers, please pick up the products with the sides of the
ꢀ
ceramic substrate and do not touch the lens portion .
・ In the case of the mount of the product
ꢀPlease use this productafter confirming the mounting condition,
because there is a possibility to have damage by the external stress
when the load is applied by the collet of the mounter.
Please see the recommended collet of this product as right picture.
1.66mm
1.2mm
2.6mm
3.2mm
⑨ Please make sure not to apply any external stress to resin after mounted as well.When the
substrate bends after mounted, the product might be applied by an external stress, and
thecrack will be generated in the soldering part.
Please arrange the product in the direction not stressed for thewarp of the substrate after
mounted.
⑩ Please do not pile the substrate after this product is mounted.This product will be damaged
by the substrate, and it causes the crack ofthe lens and not lighting bythe inner-wire
deformation or wiringdisconnection.
⑪ The products are not designed for the use under any of the following conditions. Please verify
their performance and reliability well enough if you use under any of the following conditions;
(1) In a place with a lot of moisture, dew condensation, briny air, and corrosive gas
(Cl, H2S, NH3, SO2, NOX, etc.)
(2) Under the direct sunlight, outdoor exposure, and in a dusty place
(3) In water, oil, medical fluid, and organic solvents
⑫ Guarantee covers the compliance to the quality standards mentioned in the Specifications;
however it does not cover the compatibility with application in the end-use, including assembly
and usage environment.
In case any quality problems occurred in the application of end-use, details will be separately
discussed and determined between the parties hereto.
18
sharp LD-E7-2-14-A
Model No. GM2BB**GT1C
“Contents in this technical document be changed without any notice due to the product modification.”
http://www.sharp-world.com/products/device/
7-2 Soldering
This product is reflow ready model (within 2 times), but it is not ready for solder dipping.
ꢀ
Reflow
① Package temperature at reflow soldering is defined in the Fig. below. However, even
when it is under the profile condition, external stress can damage the internal packages.
Please test your reflow method and verify the solderability before use.
② Giving the soldering process promptly after opened aluminum package is recommended.
Soldering process must be completed including 2ndreflow as repairing within 7 days
(Temperature: 5 ℃ to 30 ℃ Relative humidity: 60% or less) after opened.
(Storage in a dry box after the first reflow is recommended.)
③ Recommended solder paste
Solder paste : M705-221BM5-42-11(SENJU METAL INDUSTRY CO., LTD)
④ Recommended Temperature Profile
260( MAX)
1 to 2.5℃/s
1 to 4℃/s
220
200
150
60s (MAX)
60 to 120s
5s (MAX)
1 to 4℃/s
25
Time [second]
In order to secure the product reliability, it is recommended to control the peak temperature
and temperature gradient. Moreover, since the thermal conduction to the products depends
on the specification of the reflow machine, and the size and layout of the PCBs please test
your solder conditions carefully.
Moreover, after the reflow process, if the activator remains in the flux between anode and
cathode, the remaining activator might react during high temperature operation, and the
electro-migration is generated and there will be a possibility of a short-circuit. Please use
it after confirming the electro-migration is not generated while mounted actual.
19
sharp LD-E7-2-14-A
Model No. GM2BB**GT1C
“Contents in this technical document be changed without any notice due to the product modification.”
http://www.sharp-world.com/products/device/
⑤ Recommended solder pad design
ꢀ
We recommend the metal mask of thickness 0.15mm for screen-printing. Solderability
depends on the reflow conditions, solder paste, and materials of the PCBs etc. Please test
and verify the solderability under the actual solder method.
Moreover, it might have a risk of short-circuit (leakage) with the electro-migration by the
remaining activator in the flux. Please make a suitable selection and test of the metal mask
in terms of pitch size and thickness before mass production.
2.8
1.15
0.25
(Unit:mm)
0.5
⑥ Precautions for PCB backside dip process
ꢀ
Please verify your conditions carefully in giving the dip process on the backside of the
PCBs, since the warped boards caused by heat and heat itself affect the inside of the
package. It is recommended to give the reflow process after dip process.
Though it is also available to give the reflow process before the dip process, the interval
of the two processes should be as short as possible.
7-3 Cleaning
・ Avoid cleaning the PCBs, since packages and resin are eroded by cleaning.
Please use the soldering paste without need of cleaning.
・ Avoid ultrasonic cleaning.
20
sharp LD-E7-2-14-A
http://www.sharp-world.com/products/device/
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