GM5BW97331A [SHARP]
Single Color LED, White, 2.4mm, ROHS COMPLIANT PACKAGE-2;
| 型号： | GM5BW97331A |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | Single Color LED, White, 2.4mm, ROHS COMPLIANT PACKAGE-2 光电 |
| 文件： | 总18页 (文件大小：1051K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Preliminary
GM5BW97331A
Light Emitting Diode
GM5BW97331A
■ Features
■ Agency Approvals/Compliance
1. 3-chip device, the given output at IF = 20 mA/chip
2. White Color (achieved via InGaN Blue LED chips in
combination with Yellow Phosphor)
1. RoHS compliant
■ Applications
3. Other parts in this family:
1. General indication (indoor)
2. Office Automation equipment
3. Audio/visual equipment
4. Home appliances
Color
Part
Chromaticity
Coordinates
Luminous
Temperature
(K)
Number
Intensity (cd)
GM5BW97330A 0.338, 0.356
GM5BW97331A 0.335, 0.344
GM5BW97332A 0.312, 0.311
GM5BW97333A 0.283, 0.262
5300
5000
6700
11500
6.4
(7.0)
5.8
5. Telecommunications equipment
6. Measuring equipment
7. Machine tools
5.1
8. Computers
This Data Sheet is for reference. Be sure to contact Sharp before beginning a design to obtain the latest informaiton.
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Date March, 2009
©SHARP Corporation
Preliminary
GM5BW97331A
■ External Dimensions
A
B
3.5
3.2
(2.4)
C
3
4
2
1
Pin 1 Indicator
D
Tc
(Note 4)
Equivalent Circuit
4 Cathode
1 Anode
3
4
2
1
Pin Arrangement
No.
1
Name
Anode
(1.9)
2
Cathode
NOTES:
1. Units: mm
2. Unspecified tolerence: ±0.3 mm
3. ( ): Reference dimensions
3
Cathode
Cathode
4
4. Case temperature (Tc) measurement point
5. Materials: Leads: Copper Alloy, Ag Plating
Package: Nylon Silicone Resin
GM5BW97331A-1
2
Preliminary
GM5BW97331A
■ Absolute Maximum Ratings
(Tc = 25°C)
Unit
mW
°C
Parameter
Symbol
P
Rating
300
Power dissipation (Package total)
Junction temperature
TJ
125
Thermal resistance (junction-to-case)
Forward current *1
K
95
°C/W
mA
IF
30
Peak pulsed forward current *1, *2
IFM
DC
Pulse
VR
100
mA
0.50
mA/°C
mA/°C
V
Forward current derating factor *1, 2
1.67
Reverse voltage *1
5
Operating temperature *3
Storage temperature *4
Soldering temperature *5
Tc
-30 to +100
-40 to +100
295
°C
Tstg
Tsol
°C
°C
1 Rating for single chip (die) operation.
*
2 Duty ratio = 1/10, Pulse width = 0.1 ms.
*
3 Case temperature (See External Dimensions on page 2).
4 Do not exceed these temperatures under any condition while in packing. Refer to Storage and Handling.
5 Each terminal must be soldered with a 30 W soldering iron within 3 seconds under 295°C.
For Reflow Soldering information, see Fig. 19.
*
*
*
6 Operating current values here follow the derating curves shown in Fig. 1 through Fig. 3.
*
7 This device uses the leads for heat sinking, therefore the operating temperature range is prescribed by Tc.
*
■ Electro-optical Characteristics
(Tc = 25°C)
Parameter
Forward voltage *1
Symbol
Conditions
MIN.
TYP.
(3.2)
MAX.
Unit
V
VF
IV
IF = 20 mA (per chip)
3.0
3.4
Luminous intensity *1, *2
(7.0)
cd
IF = 20 mA
(per chip, all chips on)
Chromaticity coordinates *1, *3
x, y
IR
(0.335, 0.344)
—
Reverse current *1
VR = 4 V (per chip)
—
10
µA
1 Rating for three-chip (die) operation.
*
*
*
2 Measured by EG&G Model 550 (Radiometer/Photometer) after 20 ms drive (Tolerance: ±15%) See the Luminosity Rank table for ranking range details.
3 Measured by Otuka Electronics Model MCPD-2000 after 20 ms drive (Tolerance: x, y: ±0.02). All chips (die) operating. See the Chromaticity Rank
table for ranking range details.
*4 Parens indicate reference values.
3
Preliminary
GM5BW97331A
■ Derating Curves
Figures 1, 2, and 3 apply to single-chip operation
only. Figure 4 applies to three chip operation; however
each chip must follow the limitiations for the Forward
Current Derating Curve (Forward Current vs. Case
Temperature).
Fig. 1 Forward Current vs.
Fig. 3 Peak Pulsed Forward Current
vs. Case Temperature
Case Temperature
70
Duty ratio: 1/10, Pulse width 0.1 ms
120
100
80
60
40
20
0
60
50
40
30
20
10
0
-40 -20
-30
0
20
40
60
80 100 120
-40 -20
0
20
40
60
80 100 120
-30
Case Temperature Tc (°C)
Case Temperature Tc (°C)
GM5BW97331A-4
GM5BW97331A-5
Fig. 2 Peak Pulsed Forward Current
vs. Duty Ratio
Fig. 4 Power Dissipation
vs. Case Temperature
350
(Tc = 25°C)
120
300
250
100
80
200
150
60
40
20
0
100
50
0
-40 -20
-30
0
20
40
60
80 100 120
1/100
1/10
1
Duty Ratio
Case Temperature Tc (°C)
GM5BW97331A-6
GM5BW97331A-7
4
Preliminary
GM5BW97331A
■ Characteristic Diagrams (TYP.)
Characteristics data are typical data and so are not
guaranteed data.
Fig. 7 Relative Luminous Intensity
vs. Case Temperature
Fig. 5 Relative Luminous Intensity
vs. Forward Current
(IF = 20 mA/chip)
(Tc = 25°C)
1000
1000
100
100
10
1
10
-40
-20
0
20
40
60
80
100
0.1
1
10
100
Case Temperature Tc (°C)
Forward Current IF (mA)
GM5BW97331A-9
GM5BW97331A-8
Fig. 8 Forward Voltage
vs. Case Temperature
Fig. 6 Forward Current vs. Forward Voltage
(Tc = 25°C)
(IF = 20 mA/chip)
100
4.0
3.8
10
1
3.6
3.4
3.2
3.0
2.8
0.1
2.2
2.7
3.2
3.7
2.6
-40
-20
0
20
40
60
80
100
Forward Voltage VF (V)
Case Temperature Tc (°C)
GM5BW97331A-10
GM5BW97331A-11
5
Preliminary
GM5BW97331A
Fig. 9 Chromaticity vs. Forward Current
Fig. 10 Chromaticity Coordinates
vs. Case Temperature
(Tc = 25°C)
0.01
0.00
-0.01
(IF = 20 mA/chip)
0.02
0.01
30 mA
20 mA
15 mA
-30°C
Δ y
0°C
25°C
Δ y
0.00
-0.01
-0.02
5 mA
60°C
85°C
-0.01
-0.01
0.00
0.01
-0.02
0.00
Δ x
0.01
0.02
Δ x
GM5BW97331A-12
GM5BW97331A-13
■ Luminous Intensity Rank Table
(Tc = 25°C)
Rank
Range
Unit
Conditions
Y
Z
6.0 to 6.4
6.4 to 6.8
6.8 to 7.2
7.2 to 7.6
7.6 to 8.0
8.0 to 8.4
A
B
C
D
IF = 20 mA
(per chip, all 3 chips on)
cd
*1 Shipment quantities of each rank may not be specified by the Customer.
■ Chromaticity Rank Table
(Tc = 25°C)
Chromaticity Coordinates (x, y)
Point 2 Point 3
Point 1
Point 4
Condition
x
y
x
y
x
y
x
y
IF = 20 mA
(per chip, all 3 chips on)
0.320
0.347
0.320
0.317
0.350
0.340
0.350
0.370
1 Tolerance: ±0.02.
*
6
Preliminary
GM5BW97331A
Fig. 11 Chromaticity Diagram
0.40
0.38
0.36
f
e
GM5BW97331A
0.34
d
0.32
y
0.30
c
0.28
b
0.26
a
0.24
0.22
0.24
0.28
0.26
0.30
0.32
0.34
0.36
0.38
x
GM5BW97330A
GM5BW97332A
GM5BW97333A
6.40 cd (C, D, E, F)
0.338, 0.356 (e, f)
5300 K
5.80 cd (B, C, D, E)
0.312, 0.311 (c, d)
6700 K
5.10 cd (A, B, C, D)
0.283, 0.262 (a, b)
11500 K
Luminous Intensity (Rank)
Chromaticity (Rank)
Color Temperature
■ Forward Voltage Rank Table
(Tc = 25°C)
Rank
Range
Unit
Conditions
2
3
4
5
3.0 to 3.1
3.1 to 3.2
3.2 to 3.3
3.3 to 3.4
IF = 20 mA
(per chip, all 3 chips on)
V
1 Tolerance: ±0.1 V; measured 20 ms after the chip turns on.
*
2 Shipment quantities of each rank may not be specified by the Customer.
*
7
Preliminary
GM5BW97331A
■ Reliability and Quality Information
Sharp tests to a Reliability Confidence Level of 90%. These tables illustrate the test criteria and conditions, along
with the Number of Samples, the Number of Defectives, and the Lot Tolerance Percent Defective.
Samples Defective LTPD
No.
Test items
Temperature cycle
Test Conditions
(n)
22
22
22
22
22
(C)
(%)
10
10
10
10
10
1
2
3
4
5
-40°C (30 min) to +100°C (30 min), 100 cycles
0
High temp and high humidity storage Tstg = +60°C, RH = 90%, t = 1000 hr
0
High temperature storage
Low temperature storage
Operating test
Tstg = +100°C, t = 1000 hr
0
Tstg = -40°C, t = 1000 hr
0
Tc = +40°C, IF = 25 mA/chip, t = 1000 hr
0
15000 m/s2, 0.5 ms ±± ꢀ ±Y ꢀ ±Z direction,
3 times (Tc = 25°C)
6
Mechanical shock
11
0
20
200 m/s2, 100 to 2000 to 100 Hz / sweep for
4 min. ± ꢀ Y ꢀ Z direction, 4 times (Tc = 25°C)
7
8
Variable frequency vibration
11
11
0
0
20
20
Resistance to soldering temperatures Refer to the Soldering Profile; Performed twice
Solder/flux M705/ESR250 (Senju Metal Indus-
9
Solderability
try Co. Ltd.) Soldering temperature 245°C ±5°;
solder time 3 sec, 1 hr after Test 2 (above)
11
0
20
● Failure Judgement Criteria
No.
1
Items
Symbol
Failure judgment criteria (*2)
VF > U.S.L × 1.2
Forward voltage
Reverse current
VF
IR
Iv
2
IR > U.S.L × 2.0
2
Luminous intensity (*3)
Iv < Initial value × 0.5, Iv > Initial value × 2.0
*1 Measuring condition is in accordance with specification.
*2 U.S.L.: Upper Specification Limit.
*3 Solderability failure criterion: Fail if >90% solderability in plated test areas are not soldered.
Judgement areas are the bottom and sides as shown in Fig. 12.
Fig. 12 Solderability Judgment Areas
0.3
0.3
0.3
Lead Bends
NOTE: Units: mm
GM5BW97331A-14
8
Preliminary
GM5BW97331A
● Quality Level
Sharp utilizes the IS02859-1 standard when measuring product quality. The method is a single sampling plan,
following normal inspection level S-4. This table lists the Defect Judgment Criteria and Defect Classifications.
No.
1
Test items
Light emission
Defect Judgment
Defect
AQL
No light emission
2
Radiation color
Taping
Different color vs. that prescribed in the Chromaticity Chart
Product inserted incorrectly (anything not as specified)
Major defect .0.1%
Minor defect 0.4%
3
4
Electro-optical characteristics Does not fully conform to specification values for VF, IR, Iv
Does not fully conform to specification values for
5
External dimensions
External Dimensions
Foreign substances and flaws which affect the appearance:
6
Appearance
Resin burr which exceeds tolerance, (0.3 mm MA±.)
More than 0.4 mm cracks in resin or terminal
9
Preliminary
GM5BW97331A
■ Tape Specifications
Fig. 13 Tape Shape and Dimensions
P0
Pin 1 Mark
t1
A
D0
P2
t3
t2
P1
GM5BW97331A-15
■ Tape Dimension Specifications
Dimension
(mm)
Parameter
Symbol
Remarks
Vertical
Horizontal
Pitch
A
B
3.0
3.7
4.0
1.5
4.0
1.75
2.0
3.5
5.4
0.1
8.0
0.3
2.6
Measured at inside bottom square corner
Embossed pocket
P1
D0
P0
E
Diameter
Pitch
Sprocket hole
Accumulated error ±0.5 mm/10 pitch
Position
Vertical
Horizontal
Width
Distance between the edge of the tape and center of the hole
P2
F
Distance between center lines of the concave square hole and
round sprocket hole
Pocket Position
Cover tape
W1
t3
Thickness
Width
W0
t1
Carrier tape
Thickness
Overall thickness
t2
Includes thickness of cover tape and carrier tape
10
Preliminary
GM5BW97331A
■ Reel Specifications
Fig. 14 Reel Shape and Dimensions
0.8
0.6
0.4
0.2
E
U
C
SHIPMENT TABLE
PART No.
QUANTITY
LOT No.ꢀꢀꢀ RANK ꢀ
ꢀꢀꢀ〈EIAJ C-3〉MADE IN PHILIPPINES
Label
t
W
GM5BW97331A-16
■ Reel Dimension Specifications
Parameter
Diameter
Symbol Dimension (mm)
Remarks
A
t
180
1.3
9.5
60
Flange Thickness
Flange spacing
External diameter
W
B
C
E
U
Shaft core dimension
Spindle hole diameter
13
Hub
Key slit width
2.0
4
Key slit depth
*1 Label on side of flange: part number, quantity, lot number, and rank.
*2 Material: described on flange.
11
Preliminary
GM5BW97331A
■ Taping Specifications
1. Leader tape standard: JIS C0806
Fig. 15 Leader Tape
Pull out
Beginning
End
Empty
Stuffed
Leader (Empty)
40 mm MIN.
400 mm MIN.
GM5BW97331A-17
2. Cover tape peel resistance: F = 0.1 to 1.0 N (θ = 10° or less). See Fig. 10.
Fig. 16 Tape Separation
F
Cover tape
0 ~ 10°
Tape speed: 5 mm/s
Forward
Carrier tape
GM5BW97331A-18
3. Tape bending resistance: Cover tape will remain in place on radii of 30 mm or more. Under 30 mm radii,
the cover may separate.
4. Joints are not allowed in the cover tape.
5. Parts are packed with an average quantity of 2000 pieces per reel.
6. Product mass: 30 mg (approximately)
7. Sharp guarantees the following:
a. No contiguous empty spaces in the tape
b. Missing parts will not make up more than 0.1% of the total quantity.
c. Parts will be easily removed from the tape.
8. Parts will not stick to the cover tape as it is peeled.
12
Preliminary
GM5BW97331A
■ Label and Marking Information
Fig. 17 Label Contents
SHIPMENT TABLE
GM5BW97331A
PART No.
Model Number
(GM5BW97331AM)
Quantity
RANK
QUANTITY 2000
LOT No. 5087G07031A
Lot number and rank
EIAJ C-3 Bar code
SHARP CORPORATION
MADE IN PHILIPPINES
R.C.
Production country
RANK
SHARP LABEL
Forward Voltage rank
Luminous intensity rank
SHIPMENT TABLE
PART No.
Model Number
Quantity
GM5BW97331A
(GM5BW97331AM)
QUANTITY 2000
DATE
2008-01-01
Production date
RANK
HF-05O3NM-3±1
Rank
HF - 05 O 3NM - 3±1
Code
M-1
Code
Forward voltage rank
Lumninous intensity rank
GM5BW97331A-19
13
Preliminary
GM5BW97331A
■ Design Notes
1. Do not allow the circuit to apply any reverse voltage to the LEDs at any time, operating or not. Do not bias this
part in any manner when it is not operating. Reverse voltage can also be induced via EMF, generated by ambi-
ent light falling on this part. When these parts are operated in series, connect a zener diode parallel to each part
to protect them from reverse voltage.
2. This part can be damaged by mechanical stress. Be certain that assembly steps do not stress this part; pay
particular attention to pick-and-place equipment. Verify placing pressure and do not allow the collet to contact
the resin of this part.
3. This product uses blue LED chips in combination with yellow phosphor to achieve its color. There may be some
slight color change due to afterglow of the phosphor when driving this part with pulsed power.
4. This part has a high light output. Looking directly at it during full power output may cause injury.
5. Sharp recommends taking proper personal and environmental static control precautions when handling this part.
6. This device incorporates thermally conductive materials to allow heat to be transferred from it to the circuit
board. For best reliability, do not locate other sources of heat near the LED, and design the circuit board for
effective heat dissipation. Keep the part’s case temperature under 100°C (LED ON) including self-heating.
7. Handle these parts in a clean environment; dust may be difficult to remove and can affect optical performance.
8. Confirm the part’s performance, reliability, and resistance to degradation, if exposing it to these environments:
ꢀ Direct sunlight, outdoor exposure, dusty conditions
ꢀ In water, oil, medical fluids, and organic solvents
ꢀ Excessive moisture, such as dew or condensation
ꢀ Corrosive (salt) air or corrosive gases, such as Cl, H2S, NH3, SO2, NO±
■ Manufacturing Guidelines
● Storage and Handling
1. Moisture-proofing: These parts are shipped in vacuum-sealed bags to keep them dry and ready for use.
See Fig. 18.
2. Store these parts between 5°C and 30°C, at a relative humidity of less than 70%; for no more than one year
from the production date.
3. After breaking the package seal, maintain the environment within 5°C to 30°C, at a relative humidity of less than
60%. Solder the parts within 3 days.
4. If the parts will not be used immediately, repack them in a dry box, or re-vacuum-seal them with a desiccant.
5. If the parts are exposed to air for more than 3 days, or if the silica gel telltale indicates moisture contamination,
bake the parts:
ꢀ When in the tape carrier, bake them at a temperature of 95°C to 100°C, for 16 to 24 hours.
ꢀ When loose or on a PCB, bake them at a temperature of 110°C to 120°C, for 8 to 12 hours.
ꢀ Note that the reels may become distorted if they are in a stack when baking. Confirm that the parts have cooled
to room temperature after baking.
● Cleaning Instructions
1. Sharp does not recommend cleaning printed circuit boards containing this device, or cleaning this device with
ultrasonic methods. Process chemicals will affect the structural and optical characteristics of this device.
2. Sharp recommends the use of a solder paste that does not require cleaning.
3. Do not clean this part ultrasonically.
14
Preliminary
GM5BW97331A
Fig. 18 Factory Moisture-proof Packing
Aluminum Bag Label
(Sharp Materials Flow Label)
SHIPMENT TABLE
GM5BW97331A
QUANTITY **** RANK
Management
PART No.
Label
LOT No.
xxxxxxxxxx
Aluminum
SHARP CORPORATION
MADE IN PHILIPPINES
R. C.
Reel
Bag
Silica
Gel
Lot number is used as serial number
Management
Label
Reel Label
(EIAJ C-3 Bar Codes)
SHIPMENT TABLE
PART No.
QUANTITY
DATE
RANK
GM5BW97331A
SHARP CORPORATION
PART No. GM5BW97331A
QUANTITY
****
YYYY-MM-DD
HF-05ONM-3±1
Carton Box
****
Code M-1
LOT No. xxxxxxx RANK
<EIAJ C-3 MADE IN PHILIPPINES
>
Label
SHIPMENT TABLE
GM5BW97331A
****
xxxxxxx
Maximum of 10 Reels
PART No.
QUANTITY
LOT No.
(20,000 pieces)
RANK
Management Label
(also attached on the opposite side)
SHARP CORPORATION
MADE IN PHILIPPINES
R. C.
Maximum of 4 Boxes
(80,000 pieces)
Carton Box
SHIPMENT TABLE
PART No.
GM5BW97331A
QUANTITY
****
DATE
RANK
YYYY-MM-DD
HF-05ONM-3±1
Management Label
(attached on all 4 sides,
No Label on Top or Bottom)
Code M-1
GM5BW97331A-20
15
Preliminary
GM5BW97331A
● Soldering Instructions
1. When soldering with reflow methods, Sharp recommends following the soldering profile in Fig. 19.
2. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or
defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-
age due to the PCB flexing during the soldering process.
3. When using a second reflow, the second process should be carried out as soon as possible after the first. Stor-
age in a dry box is recommended between reflows.
4. Electrodes on this part are silver-plated. If the part is exposed to a corrosive environment, the plating may be
damaged, thereby affecting solderability.
5. The Reflow Profile shown in Fig. 19 should be considered as a set of maximum parameters. Since this part uses
the leads for heatsinking, the peak temperature should be kept as cool as possible and the cooldown period
lengthened as much as possible. Thermal conduction into the LED will be affected by the performance of the
reflow process, so verification of the reflow process is recommended. These parts may be used in a nitrogen
reflow process.
Fig. 19 Temperature Profile
260 (MA±)
1 ~ 2.5°C/s
1 ~ 4°C/s
220
200
60s (MA±)
150
60 ~ 120s
5s (MA±)
1 ~ 4°C/s
25
Time (s)
GM5BW97331A-21
16
Preliminary
GM5BW97331A
● Recommended Solder Pad Design
1. Solderability depends on reflow conditions, solder paste, and circuit board materials. Check the entire process
before production commences.
2. Fig. 20 shows the recommended solder pad design for this part.
3. When using backside dip methods, Sharp recommends checking the process carefully: board warping from heat
can cause mechanical failure in these parts, in addition to the high heat conducted into the part through the
leads. Performing reflow after dip is recommended, with the interval between the two as short as possible.
Fig. 20 Recommended Solder Pad Design
Center of Product
1.5
1.5
4.5
NOTE: Unit: mm
GM5BW97331A-22
■ Presence of ODCs
This product shall not contain the following materials, and they are not used in the production process for this
product:
ꢀ Regulated substances: CFCs, Halon, Carbon tetrachloride, and 1,1,1-Trichloroethane (Methylchloroform).
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
ꢀ Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl
ethers (PBDE).
17
Preliminary
GM5BW97331A
--- Transportation control and safety equipment
(i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
■ Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems
related to any intellectual property right of a third party
resulting from the use of SHARP’s devices.
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high
level of reliability and safety such as:
--- Space applications
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data materials, struc-
ture, and other contents described herein at any time
without notice in order to improve design or reliability.
Manufacturing locations are also subject to change
without notice.
--- Telecommunication equipment (trunk lines)
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.
scuba)
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or
in part, without the express written permission of
SHARP. Express written permission is also required
before any use of this publication may be made by a
third party.
--- Office automation equipment
--- Telecommunication equipment (terminal)
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliabilty such as:
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