概述
数据手册GP1USC34XP 概述
Infrared Detector for Remote Control 红外探测器远程控制
GP1USC34XP 数据手册
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PDF下载Preliminary
GP1USC3xXP (Series)
Infrared Detector
for Remote Control
GP1USC3xXP
(Series)
■ Features
■ Agency Approvals/Compliance
1. Compact size: (mounting area 5.0 × 4.5; and
1.35 mm tall)
1. Compliant with RoHS directive (2002/95/EC)
2. Content information about the six substances
specified in “Management Methods for Control of
Pollution Caused by Electronic Information Prod-
ucts Regulation” (popular name: China RoHS)
2. SMD (Surface Mount Device), reflow capable
3. Low power dissipation: 0.6 mA MAX.
4. Wide operating temperature range: -30 to + 85°C
5. Five parts, offering a number of center frequencies:
(Chinese:
);
refer to page 12.
Center Bandpass
Part Number
Frequency (TYP.)
■ Applications
1. Automotive audio
2. Personal Computers
3. Audio visual equipment
GP1USC30XP
GP1USC31XP
GP1USC32XP
GP1USC33XP
GP1USC34XP
36 kHz
38 kHz
36.7 kHz
32.75 kHz
40 kHz
Notice The content of this Data Sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, Sharp takes no responsibility for any defects that may occur in equipment using any Sharp
devices shown in catalogs, data books, etc. Contact Sharp in order to obtain the latest device specification sheets before using any Sharp device.
1
Sheet No.: OP08905
July, 2009
Preliminary
GP1USC3xXP Series
■ External Dimensions
4.5
2.2
GND
GND
PD Center
Vout
Vcc
Marking Area
2.0
1.1
1.1
1.1
7
1.1
Model No.
Stamp
R
4
9
1 4
GP1USC30XP
GP1USC31XP
GP1USC32XP
R0
R1
Day (01 - 31)
NOTES:
1. Units: mm
R2
R3
R4
Month (1 - 9, X, Y, Z)
GP1USC33XP
GP1USC34XP
2. Unspecified tolerance: 0.3
3. Case and lead material: Cu (Au, Pd plating)
4. Mold resin: Epoxy resin
5. Product mass: Approx 0.06 g
Year (2009: 9)
Model Number
GP1USC3XP-1
Sheet No.: OP08905
July, 2009
2
Preliminary
GP1USC3xXP Series
■ Block Diagram
RL
Amp
Amp
B.P.F.
Demodulator Integrator Comparator
Oscillator
Control Circuit
GP1USC3XP-4
GND
VCC
VOUT
■ Absolute Maximum Ratings
Parameter
Supply voltage
Symbol
VCC
Rating
Unit
V
Notes
0 to 6
Operating temperature
Storage temperature
Topr
-30 to +85
-40 to +85
°C
°C
*1
Tstg
255 (peak)
230
Soldering temperature
Tsol
°C
*2
1 Non-condensing: humidity kept above dew point.
2 255°C is a peak maximum value when flow-soldering; for hand soldering, 230°C and apply heat no more than 40 seconds.
*
*
Sheet No.: OP08905
July, 2009
3
Preliminary
GP1USC3xXP Series
■ Electro-optical Characteristics
Parameter
Operating supply voltage
Current dissipation
Symbol
VCC
ICC
Condition
Min.
2.7
Typ.
Max.
Unit
V
5.5
0.6
EV = 0 lx (no light)
—
0.35
—
mA
V
Output HIGH voltage
Output LOW voltage
Output HIGH pulse width
Output LOW pulse width
VOH
VOL
T1
See Note 1
VCC – 0.5
—
IOL = 1.6 mA*1
See Figure 2
See Figure 2
GP1USC30XP
GP1USC31XP
GP1USC32XP
GP1USC33XP
GP1USC34XP
—
0.45
1200
1000
V
600
400
µs
T2
µs
36
38
kHz
kHz
kHz
kHz
kHz
k
Bandpass Frequency center
Output pullup resistance
ƒo
36.7
32.75
40
RL
50
1 The waveform shown in Fig. 1 was transmitted at the test part’s center frequency.
Reception measurements were begun at transmission start and ended at pulse 50.
*
Fig. 1. Transmitted and Received Pulses
Transmitted signal
600 µs
1000 µs
Output signal
T2
T1
GP1USC3XP-5
Sheet No.: OP08905
July, 2009
4
Preliminary
GP1USC3xXP Series
2. Reception Angle Sensitivity: Distance between
transmitter and receiver: 0.2 to 12 meters; detector
face illumination: Ev < 10 lx, 30°
3. Transmitter Test Setup: In Fig. 2, the transmitter is
set so that Vout will be 180 mV p-p. The PD49PI
has a short-circuit current ISC = 2.6 µA at Ev = 100
lx.
● Performance Measurements
The parameters in the Characteristics tables were
gathered using the transmitter jig in Fig. 2, along with
the receiver jig in Fig. 3.
1. Linear Reception: Distance between transmitter
and receiver: 0.2 to 15.0 meters; detector face illu-
mination: Ev < 10 lx, = 0°
Fig. 2. Transmitter Test Setup
20 cm
10 kΩ
+5 V
10 µF
PD49I
Transmitter
ƒo: (Note 1)
Duty cycle: 50%
10 kΩ
VOUT
Oscilloscope
NOTE: 1. The BPF center frequency ƒo varies with model, as shown in
the Electro-optical Characteristics
GP1USC3XP-6
Fig. 3. Receiver Test Setup
Detector face Illuminance: Ev
φ
φ
VOUT
Transmitter
Reception Distance: L
NOTE: φ: Indicates horizontal and vertical directions
GP1USC3XP-7
Sheet No.: OP08905
July, 2009
5
Preliminary
GP1USC3xXP Series
■ Design Considerations
Design Guidelines
1. This product is not designed to be electromagnetic- and ionized-particle-radiation resistant.
2. Avoid placing mechanical stress upon this part, whether to the case or terminals. Such stresses may crack the
molding material, possibly breaking internal wire bonds in the part.
3. Conductive thermoplastics are used in the second mold resin of this part. Do not allow this resin to come in con-
tact with the PCB landing or any circuit runs.
4. When using this part in a remote control detector, the incoming signal must be managed so that Tdata is less
than 100 ms and Toff (suspend time) is more than 25 ms; and the minimum pulse width of modulated IR data
is 250 µs during Ton. Should the signal format fail to meet these conditions, the reception distance or device
output may be compromised. See Fig. 4.
Fig. 4. Transmit Time for One Signal Block
Transmitting time for 1 block: T
Suspendx Period: TOFF
Data Period: Tdata
TON
. .. ..
. .. ..
GP1USC3XP-2
5. Output noise may be caused by environmental factors, even in the absence of a received signal. If the device
is used in the presence of strong external light, this may show up as noise in the detector. Sharp recommends
checking the layout and structure so as to reduce the amount of external light interference. Also, confirm the
device’s performance in actual operation, as the output may be affected by signal format, temperature, and the
distance from the transmitter.
6. This device may have degraded optical performance if the detector surface becomes dirty or coated with any
foreign substance. This may happen through the use of process chemicals, including washing; it is for this rea-
son that Sharp does not recommend washing this part. If the detector surface becomes contaminated, use a
soft cloth to wipe it clean.
7. Sharp recommends a circuit similar to the one shown in Fig. 5 to accompany this device. The values should be
adjusted to reflect the actual circuit conditions, and be placed as physically close to the device as possible.
Fig. 5. Device Connection
R1
VCC
V
e
+
C1
GND
GND
VO
VOUT
NOTES:
R1 = 47 Ω 5%
C1 = 47 µF
GP1USC3XP-3
Sheet No.: OP08905
July, 2009
6
Preliminary
GP1USC3xXP Series
8. This device has a parallel transistor internally to protect it against static. However, the internal protection should
not be counted upon to protect the device against overvoltage or noise spikes in the power supply, as the transistor
could experience a secondary breakdown short. Sharp recommends decoupling the power supply near the device
with a 47 (1/10 W) resistor and 10 µF capacitor.
9. This part is not highly tolerant of condensing conditions. Condensation can degrade the case and lead connec-
tions, leading to degraded electrical characteristics.
■ Manufacturing Guidelines
● Storage and Handling
1. Moisture-proofing: These parts are shipped in vacuum-sealed packaging to keep them dry and ready for use.
2. Store these parts between 10°C and 30°C, at a relative humidity of less than 70%, for up to a year.
3. After breaking the package seal, maintain the environment within 10°C to 30°C, at a relative humidity of less
than 70%. Mount the parts within 2 days.
4. If the parts will not be used immediately, repack them in a dry box, or re-vacuum-seal them with a desiccant.
Store them as above, but since the seal has been broken, the parts must be used within 4 weeks.
5. If the parts are exposed to air for more than 3 days, if there are more than 3 days between reflow operations, or
if the silica gel telltale indicates moisture contamination, bake the parts. If these parts will undergo a second
reflow operation, and if they have exceeded the open time as noted above, they must be baked.
In all cases, these parts may be baked only once:
• When in the tape carrier, bake them at a temperature of 65°C for 48 hours. Bake only one reel at a time; reels
will become deformed if stacked.
• When loose on a metal tray or on a PCB, bake them at a temperature of 100°C to 110°C, for 12 to 24 hours.
Temporary mounting on a PCB must be using an adhesive and not by soldering.
Baking these particular parts in the reels is to be avoided if at all possible. To properly bake these parts, they
should be mounted to a PCB with adhesive (not soldered) or placed in a metal tray.
Sheet No.: OP08905
July, 2009
7
Preliminary
GP1USC3xXP Series
● Soldering Instructions
1. Sharp recommends soldering this part no more than twice and at the profile shown in Fig. 6. Reflow should occur
within three days, after storing at 10°C to 30°C, and at no more than 70% relative humidity.
2. When preheating this part with infrared, localized high temperatures can be generated in the resin of this part;
therefore the process should be confirmed that it remains within the limits shown in Fig. 6.
3. When hand soldering, use a temperature-controlled iron with the point < 350°C < 5 seconds.
4. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or
defects in plated connections. Internal connections may be severed due to mechanical force placed on the
device due to the PCB flexing during the soldering process.
5. Sharp recommends handling this part in a static-controlled work area.
Fig. 6. Soldering Profile
255°C MAX.
230°C
1 - 3°C/s
180°C
150°C
1 - 5°C/s
1 - 3°C/s
25°C
90 30 s
40 s MAX.
GP1USC3XP-8
● Soldering Mask
Fig. 7 shows the recommended solder mask for this device.
Fig. 7. Soldering Mask
2.0
1.7
2.0
GND
GND
VOUT
VCC
0.7
5.7
2.0
2.0
GP1USC3XP-13
Sheet No.: OP08905
July, 2009
8
Preliminary
GP1USC3xXP Series
● Cleaning Instructions
1. If the detector face becomes contaminated, the optical characteristics of this part will be affected. Do not wash
this part, as residue left from solvents may be left behind. Only clean the part with a soft cloth.
2. Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol.
■ Tape Specifications
Fig. 8 Tape Shape and Dimensions
+0.10
-0.00
2.0 0.05
4.0 0.10
8.0 0.10
φ1.5
1.65 0.10
φ1.5 min
4.8 0.10
GP1USC3XP-9
Sheet No.: OP08905
July, 2009
9
Preliminary
GP1USC3xXP Series
■ Reel Specifications
Fig. 9 Reel Shape and Dimensions
18.5 1.0
φ21.0 0.8
φ13.0 0.2
g
254.0 1.0
13.5 1.0
GP1USC3XP-10
■ Product Insertion Direction
Fig. 10 shows the orientation of the device in the tape.
Fig. 10 Product Insertion
Indicator
Pull out
Label
Chip
GP1USC3XP-11
Sheet No.: OP08905
July, 2009
10
Preliminary
GP1USC3xXP Series
● Packing Information
Product is sealed in laminated aluminum bags with 2000 pieces per reel, silica gel desiccant, and humidity telltale.
The EIAJ C-3 compliant label is filled out and affixed to the bag. Four of these packaged reels of product are then
placed in the shipping box with pads separating them, as well as a pad on both the top and bottom. The boxes are
then sealed with kraft tape, indicating number, quantity, and lot number.
Each box carries 8000 pieces for a total mass of approximately 2 kg; the mass of each part is approximately
0.05 g.
Fig. 11 Shipping Package Drawing
Pad (5 Sheets Total)
Reels in
Moisture-proof Bags
Taped Product in Reel
Indicator
Silica Gel
Label
Damp Proof Bag
Packing Case
Tape-reel in
a Moisture-proof Bag
Label
Packing Case
440 mm TYP.
370 mm TYP.
NOTES:
1. Units: mm
Label
2. Quantity: 8000 pcs/package
4. Regular packaged mass: Approximately 2.0 kg
5. Shipping Label: Model No., Quantity, and Lot No.
GP1USC3XP-12
Sheet No.: OP08905
July, 2009
11
Preliminary
GP1USC3xXP Series
■ Presence of ODCs (RoHS Compliance)
This product shall not contain the following materials, and they are not used in the production process for this
product:
• Regulated substances: CFCs, Halon, Carbon tetrachloride, 1,1,1-Trichloroethane (Methylchloroform). Specific
brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
• Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl
ethers (PBDE).
• Content information about the six substances specified in “Management Methods for Control of Pollution
Caused by Electronic Information Products Regulation” (Chinese:
)
Toxic and Hazardous Substances
Polybrominated
diphenyl ethers
(PBDE)
Category
Hexavalent
Polybrominated
biphenyls (PBB)
Lead (Pb) mercury (Hg) Cadmium (Cd)
chromium (Cr6+
)
Infrared Detectors
✓
✓
✓
✓
✓
✓
NOTE: ✓ indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement
as described in SJ/T 11363-2006 standard.
Sheet No.: OP08905
July, 2009
12
Preliminary
GP1USC3xXP Series
--- Transportation control and safety equipment
(i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
■ Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems
related to any intellectual property right of a third party
resulting from the use of SHARP’s devices.
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high
level of reliability and safety such as:
--- Space applications
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data materials, struc-
ture, and other contents described herein at any time
without notice in order to improve design or reliability.
Manufacturing locations are also subject to change
without notice.
--- Telecommunication equipment (trunk lines)
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.
scuba)
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or
in part, without the express written permission of
SHARP. Express written permission is also required
before any use of this publication may be made by a
third party.
--- Office automation equipment
--- Telecommunication equipment (terminal)
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliabilty such as:
Sheet No.: OP008905
July 2009
13
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