GW5SMC40P05 [SHARP]
Single Color LED Display Cluster,;
| 型号： | GW5SMC40P05 |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | Single Color LED Display Cluster, |
| 文件： | 总19页 (文件大小：255K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Technical Document
LED Specification
EC/Opto Group
GW5SMCxxP05 Series LED Module
for Lighting Applications
Product Specification
November 2011
4 W “Petite Zenigata” Family, Ra = 82; Rjc = 11.5 K/W
CCT
(K)
Current Voltage
Luminous
Flux (lm)
352
Efficacy
(lm/W)
76.9
Part No.
(mA)
460
400
460
400
460
400
460
400
480
400
(V)
9.95
9.8
GW5SMC50P05
GW5SMC40P05
GW5SMC35P05
GW5SMC30P05
GW5SMC27P05
4850
3950
3400
3000
2730
320
81.6
9.95
9.8
352
76.9
320
81.6
9.95
9.8
330
72.1
300
76.5
9.95
9.8
330
72.1
300
76.5
9.95
9.8
308
64.5
280
71.4
Spec No.
Issue
DGꢀ11Y002
01ꢀNovꢀ11
S P E C I F I C A T I O N S
Product Type
Model No.
ZENIGATA LED
GW5SMC**P05
** : 27, 30, 35, 40, 50
※These specifications contain 17 pages including the cover and appendix.
If you have any objections, please contact us before issuing purchasing order.
CUSTOMERS ACCEPTANCE
Reference
DATE:
BY:
PRESENTED
BY:
Y. Ohiwane
Dept. General Manager
REVIEWED BY:
PREPARED BY:
Development DepartmentⅡ
Lighting Device Division
Electronic Components And Devices Group
SHARP CORPORATION
Model No.
GW5SMC**P05
● Handle this document carefully for it contains material protected by international
copyright law. Any reproduction, full or in part, of this material is prohibited
without the express written permission of the company.
● When using the products covered herein, please observe the conditions written herein
and the precautions outlined in the following paragraphs. In no event shall the
company be liable for any damages resulting form failure to strictly adhere to these
conditions and precautions.
(1) Please do verify the validity of this part after assembling it in customer’s products, when customer
wants to make catalogue and instruction manual based on the specification sheet of this part.
(2) The products covered herein are designed and manufactured for the following
application areas. When using the products covered herein for the equipment
listed in paragraph (3), even for the following application areas, be sure
to observe the precautions given in Paragraph (3). Never use the products
for the equipment listed in Paragraph (4).
･Office electronics
･Instrumentation and measuring equipment
･Machine tools
･Audiovisual equipment
･Home appliances
･Communication equipment other than for trunk lines
(3) These contemplating using the products covered herein for the following
equipment which demands high reliability, should first contact a sales
representative of the company and then accept responsibility for incorporating
into the design failꢀsafe operation, redundancy, and other appropriate
measures for ensuring reliability and safety of the equipment and the overall system.
･Control and safety devices for airplanes, trains, automobiles, and other
transportation equipment
･Mainframe computers
･traffic control systems
･Gas leak detectors and automatic cutoff devices
･Rescue and security equipment
･Other safety devices and safety equipment, etc.
(4) Do not use the products covered herein for the following equipment which
demands extremely high performance in terms of functionality, reliability, or accuracy.
･Aerospace equipment
･Communications equipment for trunk lines
･Control equipment for the nuclear power industry
･Medical equipment related to life support, etc.
(5) please direct all queries and comments regarding the interpretation of the
above four Paragraphs to a sales representative of the company.
● Please direct all queries regarding the products covered herein to a sales
representative of the company.
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GW5SMC**P05 specifications
1. Application
These specifications apply to the light emitting diode module Model No. GW5SMC**P05.
[ LED module (InGaN Blue LED chip + Phosphor) ]
Main application : Lighting
2. External dimensions and equivalent circuit ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ Refer to Page 2.
3. Ratings and characteristics ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ Refer to Page 3 ꢀ 5.
3ꢀ1. Absolute maximum ratings
3ꢀ2. Electroꢀoptical characteristics
3ꢀ3. Derating curve
4. Reliability ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ Refer to Page 6.
4ꢀ1. Test items and test conditions
4ꢀ2. Failure criteria
5. Quality level ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ Refer to Page 7.
5ꢀ1. Applied standard
5ꢀ2. Sampling inspection
5ꢀ3. Inspection items and defect criteria
6. Supplementsꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ Refer to Page 8 ꢀ 12.
6ꢀ1. Chromaticity rank table
7. Precautions ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ Refer to Page 13 ꢀ 15.
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2. External dimensions and equivalent circuit
Unit = mm
12.0 + 0.50 / ꢀ 0.05ꢀ①
( 9.4 )
( 5.7 )
Top view
8.0
( 3.3 )
+ 0.50 / ꢀ 0.05
②
Side view
( 1.8 )
1.0
± 0.1
(Note) Values inside parentheses are reference values.
External dimension of ceramic substrate is the indication of maximum length at each side.
Equivalent circuit
+ connection terminal
- connection terminal
(Note) 3 series × 3 parallel = 9 pcs of LEDs
Unit
mm
Material
Drawing No.
52311002
Substrate : Alumina Ceramic
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3. Ratings and characteristics
3ꢀ1. Absolute maximum ratings
Item
Symbol
Rating
Unit
Power Dissipation *1,4
Forward Current *1,4
Reverse Voltage *2,4
Operating Temperature *3
Storage Temperature
P
IF
5.0
460
W
mA
V
VR
Topr
Tstg
ꢀ15
ꢀ 30 ～ + 100
ꢀ 40 ～ + 100
℃
℃
*1 Power dissipation and forward current are the value when the module temperature
is set lower than the rating by using an adequate heat sink.
*2 Voltage resistible at initial connection error
(Not dealing with the possibility of alwaysꢀon reverse voltage.)
*3 Case temperature Tc (Refer to measuring point for case temperature in the next page.)
Refer to "Derating curve" in the next page as for operating current.
*4 Tc = 25 ℃
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3ꢀ2. Electroꢀoptical characteristics
Item
(Tc = 25 ℃)
Symbol
Condition
**
MIN.
TYP.
(9.8)
MAX. Unit
VF
Ф
x
IF =
common Forward Voltage *5
Luminous Flux *6
400 mA
8.6
11
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
V
lm
ꢀ
250
(280)
ꢀ
(0.460)
(0.410)
(2730)
(82)
Chromaticity Coordinates *7
IF =
IF =
IF =
IF =
IF =
27
30
35
40
50
y
400 mA
ꢀ
ꢀ
ꢀ
Color Temperature
ꢀ
K
ꢀ
Ra
Ф
x
General Color Rendering Index *8
Luminous Flux *6
80
270
ꢀ
lm
ꢀ
(300)
(0.434)
(0.403)
(3000)
(82)
Chromaticity Coordinates *7
y
400 mA
400 mA
400 mA
400 mA
ꢀ
ꢀ
Color Temperature
ꢀ
K
ꢀ
ꢀ
Ra
Ф
x
General Color Rendering Index *8
Luminous Flux *6
80
270
ꢀ
lm
ꢀ
(300)
(0.413)
(0.400)
(3400)
(82)
Chromaticity Coordinates *7
y
ꢀ
ꢀ
Color Temperature
ꢀ
K
ꢀ
ꢀ
Ra
Ф
x
General Color Rendering Index *8
Luminous Flux *6
80
290
ꢀ
lm
ꢀ
(320)
(0.385)
(0.385)
(3950)
(82)
Chromaticity Coordinates *7
y
ꢀ
ꢀ
Color Temperature
ꢀ
K
ꢀ
ꢀ
Ra
Ф
x
General Color Rendering Index *8
Luminous Flux *6
80
290
ꢀ
lm
ꢀ
(320)
(0.351)
(0.364)
(4850)
(82)
Chromaticity Coordinates *7
y
ꢀ
ꢀ
Color Temperature
ꢀ
K
ꢀ
ꢀ
Ra
General Color Rendering Index *8
80
(Note) Values inside parentheses are shown for reference purpose only.
*5 (After 20 ms drive, Measurement tolerance: ± 3 %)
*6 Monitored by Sharp's 8 inch integrating sphere and Otsuka electronics MCPDꢀLE3400
(After 20 ms drive, Measurement tolerance: ± 10 %)
*7 Monitored by Sharp's 8 inch integrating sphere and Otsuka electronics MCPDꢀLE3400
(After 20 ms drive, Measurement tolerance: ± 0.005)
*8 Monitored by Sharp's 8 inch integrating sphere and Otsuka electronics MCPDꢀLE3400
(After 20 ms drive, Measurement tolerance: ± 2)
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3ꢀ3. Derating curve
Forward Current Derating Curve
500
400
300
200
100
0
ꢀ30 ꢀ20 ꢀ10
0
10 20 30 40 50 60 70 80 90 100 110
Case Temperature Tc [℃]
(Note) To keep the case temperature lower than the rating, enough heatꢀradiation performance needs to
be secured by using an adequate heat sink.
For soldering connection, please evaluate in your circumstance to make sure soldering reliability.
( Above derating curve is specified to LED device, not for soldering connection )
And please consider to avoid physical stress between wire and substrate,
and some protection like silicon bond on top of soldered wire is recommended.
Please ensure the maintenance of heat radiation not to exceed case temperature over the rating
in operation.
（Measuring point for case temperature）
measuring point
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4. Reliability
ꢀꢀThe reliability of products shall be satisfied with items listed below.
4ꢀ1. Test items and test conditions
Confidence level: 90 %
No.
Test item
Test conditions
Samples Defective LTPD
n
C
0
0
0
0
0
(%)
20
20
20
20
20
1
Temperature Cycle
ꢀ 40 ℃(30 min) ～ + 100 ℃(30 min), 100 cycles
11
11
11
11
11
2
Temperature Humidity Tstg = + 60 ℃, RH = 90 %, Time = 1000 h
Storage
3
High Temperature
Storage
Low Temperature
Storage
Tstg = + 100℃, Time = 1000 h
Tstg = ꢀ 40 ℃, Time = 1000 h
4
5
Steady State Operating Tc = 60 ℃, IF = 460 mA, Time = 1000 h
Life
6
Shock
Acceleration: 15000 m/s2, Pulse width: 0.5 ms
Direction: 3 directions (X, Y and Z)
3 trials in each direction
5
5
0
0
50
50
7
Vibration
Frequency: 100 to 2000 Hz for 4 minutes per trial
Acceleration: 200 m/s2
Direction: 3 directions (X, Y and Z)
4 trials in each direction
4ꢀ2. Failure criteria
No.
1
Parameter
Symbol
VF
Failure criteria
VF ＞ Initial value × 1.1
Ф＜ Initial value × 0.7
Forward Voltage
Luminous Flux
2
Ф
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5. Quality level
5ꢀ1. Applied standard
ISO2859ꢀ1
5ꢀ2. Sampling inspection
A single normal sampling plan, level Sꢀ4.
5ꢀ3. Inspection items and defect criteria
No.
Item
Defect criteria
Classification
Major
AQL
0.1
1
No radiation
No light emitting
defect
2
3
4
Electroꢀoptical Not conforming to the specification
characteristics (Forward voltage, Luminous flux and Chromaticity)
External
Not conforming to the specified dimensions
dimensions
Appearance
(External dimensions of ① and ② shown in Page 2)
Nonconformity observed in product appearance is determined
as defective only when electroꢀoptical characteristics is affected by.
<If any question arises regardless of above mentioned criterion>
■Foreign material, scratch, or bubble at emitting area: 0.8 mm φ
■Fiber generation at emitting area: 0.2 mm in width and 2.5 mm in length
■Foreign material at connection terminal: 0.8 mm φ
Minor
defect
0.4
■Substrate burr on edge: Over dimension tolerance
(Note) Products with removable foreign material attached on is not determined to be defective.
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6. Supplements
6ꢀ1. Chromaticity rank table
**： 27
(Tolerance: x,y ± 0.005）
（IF =
mA, Tc = 25 ℃）
400
Chromaticity coordinates
Rank
1
Point 1 Point 2 Point 3 Point 4
0.4579 0.4526 0.4624 0.4681
0.4200 0.4100 0.4100 0.4200
x
y
Chromaticity Diagram
0.430
0.420
0.410
0.400
0.390
1
2600K
2700K
2800K
0.440
0.450
0.460
x
0.470
0.480
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(Tolerance: x,y ± 0.005）
（IF =
mA, Tc = 25 ℃）
400
**： 30
Chromaticity coordinates
Rank
1
Point 1 Point 2 Point 3 Point 4
0.4386 0.4339 0.4422 0.4473
0.4150 0.4050 0.4050 0.4150
x
y
Chromaticity Diagram
0.430
0.420
0.410
0.400
0.390
1
3100K
3000K
2900K
0.420
0.430
0.440
0.450
0.460
x
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(Tolerance: x,y ± 0.005）
（IF =
mA, Tc = 25 ℃）
400
**： 35
Chromaticity coordinates
Rank
1
Point 1 Point 2 Point 3 Point 4
0.4107 0.4069 0.4155 0.4196
0.4050 0.3950 0.3950 0.4050
x
y
Chromaticity Diagram
0.420
0.410
0.400
0.390
0.380
1
3500K
3400K
3300K
0.390
0.400
0.410
x
0.420
0.430
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(Tolerance: x,y ± 0.005）
（IF =
mA, Tc = 25 ℃）
400
**： 40
Chromaticity coordinates
Rank
1
Point 1 Point 2 Point 3 Point 4
0.3821 0.3795 0.3870 0.3900
0.3900 0.3800 0.3800 0.3900
x
y
Chromaticity Diagram
0.400
0.390
0.380
0.370
0.360
1
3900K
4000K
4100K
0.360
0.370
0.380
x
0.390
0.400
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(Tolerance: x,y ± 0.005）
（IF =
mA, Tc = 25 ℃）
400
**： 50
Chromaticity coordinates
Rank
1
Point 1 Point 2 Point 3 Point 4
0.3452 0.3437 0.3556 0.3585
0.3680 0.3500 0.3595 0.3788
x
y
Chromaticity Diagram
0.380
0.370
0.360
0.350
0.340
1
4600K
4800K
5000K
0.330
0.340
0.350
x
0.360
0.370
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7. Precautions
① Storage conditions
Please follow the conditions below.
・Before opened: Temperature 5 ～ 30 ℃, Relative humidity less than 60 %.
(Before opened LED should be used within a year)
・After opened: Temperature 5 ～ 30 ℃, Relative humidity less than 60 %.
(Please apply soldering within 1 week)
・After opened LED should be kept in an aluminum moisture proof bag with a moisture
absorbent material (silica gel).
・Avoid exposing to air with corrosive gas.
If exposed, electrode surface would be damaged, which may affect soldering.
② Usage conditions
This product is not designed for the use under any of the following conditions.
Please confirm performance and reliability well enough if you use under any of the following conditions;
・In a place with a lot of moisture, dew condensation, briny air, and corrosive gas.
(Cl, H2S, NH3, SO2, NOX, etc.)
・Under the direct sunlight, outdoor exposure, and in a dusty place.
・In water, oil, medical fluid, and organic solvent.
③ Heat radiation
If forward current (IF) is applied to singleꢀstate module at any current, there is a risk of damaging LED
or emitting smoke.
Equip with specified heat radiator, and avoid heat stuffed inside the module.
④ Installation
Material of board is alumina ceramic. If installed inappropriately, trouble of no radiation may occur due to
board crack or overheat. Please take particular notice for installation.
Refer to the following cautions on installation.
・ Apply thermolysis adhesive, adhesive sheet or peculiar connector when mounted on heat radiator.
In case of applying adhesive or adhesive sheet only, check the effectiveness and reliability before fixing.
If LED comes off from heat radiator, unusual temperature rise entails hazardous phenomena including
device deterioration, coming off of solder at leads, and emitting smoke.
・ When LED device is mechanically fixed or locked, Please take into consideration regarding the method of
attachment due to fail from stress.
・ Avoid convexly uneven boards.
Convex board is subject to substrate cracking or debasement of heat release.
・ It is recommended to apply adhesive or adhesive sheet with high thermal conductivity
for radiation of heat effectively.
・ Please take care about the influence of color change of adhesive or adhesive sheet in initial and long term
period, which may affect light output or color due to change of reflectance from backside.
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・ Do not touch resin part including white resin part on the surface of LED.
No light emission may occur due to damage of resin or cutting wire of LEDs by outer force.
When using tweezers, please handle by ceramic substrate part and avoid touching resin part.
For mounting, please handle by side part of ceramic or the specified area shown below.
Handling area
⑤ Connecting method
In case of solder connecting method, follow the conditions mentioned below.
・Use Soldering iron with thermo controller (tip temperature 380 ℃), within 5 seconds per one place.
・Secure the solderwettability on whole solder pad and leads.
・During the soldering process, put the ceramic board on materials whose conductivity is poor enough
not to radiate heat of soldering.
・Warm up (with using a heated plate) the substrate is recommended before soldering.
( preheat condition: 100 ℃ ～ 150 ℃, within 60 sec )
・Avoid touching a part of resin with soldering iron.
・This product is not designed for reflow and flow soldering.
・Avoid such lead arrangement as applying stress to solderꢀapplied area.
・Please do not detach solder and make reꢀsolder.
・Please solder evenly on each electrodes.
・Please prevent flux from touching to resin.
⑥ Static electricity
This product is subject to static electricity, so take measures to cope with it.
Install circuit protection device to drive circuit, if necessary.
⑦ Drive method
・Any reverse voltage cannot be applied to LEDs when they are in operation or not.
Design a circuit so that any flow of reverse or forward voltage can not be applied to LEDs
when they are out of operation.
・Module is composed of LEDs connected in both series and parallel.
Constant voltage power supply runs off more than specified current amount due to lowered V F
caused by temperature rise.
Constant current power supply is recommended to drive.
⑧ Cleaning
Avoid cleaning, since silicone resin is eroded by cleaning.
⑨ Colorꢀtone variation
Chromaticity of this product is monitored by integrating sphere right after the operation.
Chromaticity varies depending on measuring method, light spread condition, or ambient temperature.
Please verify your actual conditions before use.
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⑩ Safety
･Looking directly at LEDs for a long time may result in hurt your eyes.
･In case that excess current (over ratings) are supplied to the device, hazardous phenomena including
abnormal heat generation, emitting smoke, or catching fire can be caused.
Take appropriate measures to excess current and voltage.
・In case of solder connecting method, there is a possibility of fatigue failure by heat.
Please fix the leads in such case to protect from short circuit or leakage of electricity caused by contact.
・Please confirm the safety standards or regulations of application devices.
・Please careful not to injure your hand by edge of ceramic substrate.
⑪ Other cautions
Guarantee covers the compliance to the quality standards mentioned in the Specifications,
however it does not cover the compatibility with application of the endꢀuse, including assembly
and usage environment.
In case any quality problems occurred in the application of endꢀuse, details will be separately discussed
and determined between the parties hereto.
Technical Document
Opto Specification
Opto/EC Group
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New Territories, Hong Kong
Phone: (852) 28229311
8F-A, No. 16, Sec. 4, Nanking E. Rd.
Taipei, Taiwan, Republic of China
Phone: (886) 2-2577-7341
Fax: (886) 2-2577-7326/2-2577-7328
Singapore 119967
Phone: (65) 271-3566
Fax: (65) 271-3855
Fax: (852) 28660779
CHINA
www.sharp.com.hk
Sharp Microelectronics of China
(Shanghai) Co., Ltd.
KOREA
Shenzhen Representative Office:
Room 602-603, 6/F.,
Sharp Electronic Components
(Korea) Corporation
28 Xin Jin Qiao Road King Tower 16F
Pudong Shanghai, 201206 P.R. China
Phone: (86) 21-5854-7710/21-5834-6056
Fax: (86) 21-5854-4340/21-5834-6057
Head Office:
International Chamber of Commerce Tower, 168
Fuhua Rd. 3, CBD,
RM 501 Geosung B/D, 541
Dohwa-dong, Mapo-ku
Seoul 121-701, Korea
Phone: (82) 2-711-5813 ~ 8
Fax: (82) 2-711-5819
Futian District, Shenzhen 518048,
Guangdong, P.R. China
Phone: (86) 755-88313505
Fax: (86) 755-88313515
No. 360, Bashen Road,
Xin Development Bldg. 22
Waigaoqiao Free Trade Zone Shanghai
200131 P.R. China
Email: smc@china.global.sharp.co.jp
SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE.
Suggested applications (if any) are for standard use; See Important Restrictions for
limitations on special applications. See Limited Warranty for SHARP’s product warranty.
The Limited Warranty is in lieu, and exclusive of, all other warranties, express or implied.
ALL EXPRESS AND IMPLIED WARRANTIES, INCLUDING THE WARRANTIES OF
MERCHANTABILITY, FITNESS FOR USE AND FITNESS FOR A PARTICULAR PURPOSE,
ARE SPECIFICALLY EXCLUDED. In no event will SHARP be liable, or responsible in
any way, for any incidental or consequential economic or property damage.
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