LH531000B-S [SHARP]

CMOS 1M (128K x 8) 3 V-Drive MROM; CMOS 1M ( 128K ×8 ) 3 V驱动器MROM
LH531000B-S
型号: LH531000B-S
厂家: SHARP ELECTRIONIC COMPONENTS    SHARP ELECTRIONIC COMPONENTS
描述:

CMOS 1M (128K x 8) 3 V-Drive MROM
CMOS 1M ( 128K ×8 ) 3 V驱动器MROM

驱动器
文件: 总5页 (文件大小:42K)
中文:  中文翻译
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LH531000B-S  
CMOS 1M (128K × 8) 3 V-Drive MROM  
FEATURES  
DESCRIPTION  
The LH531000B-S is a mask-programmable ROM  
organized as 131,072 × 8 bits. It is fabricated using  
silicon-gate CMOS process technology.  
131,072 words × 8 bit organization  
Access time: 500 ns (MAX.)  
Power consumption:  
PIN CONNECTIONS  
Operating: 64.8 mW (MAX.)  
Standby: 108 µW (MAX.)  
28-PIN SOP  
TOP VIEW  
Mask-programmable control pin:  
28  
27  
26  
25  
A15  
A12  
1
2
VCC  
A14  
Pin 20 = CE/OE/OE  
A13  
A8  
A7  
A6  
3
4
Static operation  
Three-state outputs  
A5  
A4  
A9  
5
6
24  
23  
A11  
Low power supply: 2.6 V to 3.6 V  
Package: 28-pin, 450-mil SOP  
22  
21  
20  
A3  
A2  
A1  
7
8
9
A16  
A10  
CE/OE/OE  
A0 10  
11  
19  
18  
17  
16  
15  
D7  
D6  
D5  
D4  
D3  
D0  
D1 12  
D2 13  
GND 14  
531000BS-1  
Figure 1. Pin Connections for DIP Package  
1
LH531000B-S  
CMOS 1M MROM  
22  
1
A16  
A15  
A14  
27  
26  
2
A13  
MEMORY  
MATRIX  
(131,072 x 8)  
A12  
A11  
23  
A10 21  
A9  
A8  
A7  
A6  
24  
25  
3
4
5
6
A5  
A4  
A3  
COLUMN SELECTOR  
7
A2  
A1  
A0  
8
9
10  
SENSE AMPLIFIER  
CE  
TIMING  
BUFFER  
GENERATOR  
20  
CE/OE/OE  
OE  
BUFFER  
OUTPUT BUFFER  
19  
D7  
28  
VCC GND  
18  
D6  
14  
11  
D0  
12  
D1  
13  
D2  
15  
D3  
17  
D5  
16  
D4  
531000BS-2  
Figure 2. LH531000B-S Block Diagram  
PIN DESCRIPTION  
SIGNAL  
PIN NAME  
NOTE  
SIGNAL  
PIN NAME  
NOTE  
A0 – A16  
D0 – D7  
Address input  
Power supply  
(2.6 V to 3.6 V)  
VCC  
Data output  
GND  
Ground  
Chip Enable input or  
Output Enable input  
CE/OE/OE  
1
NOTE:  
1. Active level of CE/OE/OE is mask-programmable.  
2
CMOS 1M MROM  
LH531000B-S  
TRUTH TABLE  
CE  
OE/OE  
MODE  
SUPPLY CURRENT  
H
L
High-Z  
Output  
High-Z  
Output  
Standby  
Operating  
L/H  
H/L  
Operating  
ABSOLUTE MAXIMUM RATINGS  
PARAMETER  
SYMBOL  
RATING  
UNIT  
Supply voltage  
VCC  
VIN  
–0.3 to +7.0  
–0.3 to VCC + 0.3  
–0.3 to VCC + 0.3  
0 to +70  
V
V
Input voltage  
Output voltage  
VOUT  
Topr  
Tstg  
V
Operating temperature  
Storage temperature  
°C  
°C  
65 to +150  
RECOMMENDED OPERATING CONDITIONS (TA = 0°C to +70°C)  
PARAMETER  
SYMBOL  
MIN.  
TYP.  
MAX.  
UNIT  
Supply voltage  
VCC  
2.6  
3.6  
V
DC CHARACTERISTICS (V = 2.6 V to 3.6 V, T = 0°C to +70°C)  
CC  
A
PARAMETER  
SYMBOL  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
NOTE  
Input ‘Low’ voltage  
Input ‘High’ voltage  
Output ‘Low’ voltage  
Output ‘High’ voltage  
Input leakage current  
Output leakage current  
Operating current  
VIL  
VIH  
–0.3  
0.4  
VCC + 0.3  
0.4  
V
V
0.8 × VCC  
VOL  
VOH  
V
IOL = 400 µA  
IOH = –100 µA  
0.8 × VCC  
V
VIN = 0 V to VCC  
VOUT = 0 V to VCC  
tRC = 500 ns  
| ILI  
| ILO  
ICC  
|
10  
10  
18  
30  
10  
10  
µA  
µA  
mA  
µA  
pF  
pF  
|
1
2
Standby current  
ISB  
CE = VCC – 0.2 V  
Input capacitance  
Output capacitance  
CIN  
f = 1 MHz  
TA = 25°C  
COUT  
NOTE:  
1. CE/OE = VIH, OE = VIL  
2. Outputs open  
AC CHARACTERISTICS (V = 2.6 V to 3.6 V, T = 0°C to +70°C)  
CC  
A
PARAMETER  
SYMBOL  
MIN.  
MAX.  
UNIT  
NOTE  
Read cycle time  
tRC  
tAA  
tACE  
tOE  
500  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Address access time  
Chip enable access time  
Output enable delay time  
Output hold time  
500  
500  
200  
tOH  
10  
CE to output in High-Z  
OE to output in High-Z  
tCHZ  
tOHZ  
150  
1
NOTE:  
1. This is the time required for the output to become high-impedance.  
3
LH531000B-S  
CMOS 1M MROM  
AC TEST CONDITIONS  
PARAMETER  
RATING  
Input voltage amplitude  
Input rise/fall time  
0.4 V to (0.8 × VCC) V  
10 ns  
Input/output reference level  
Output load condition  
1.5 V  
1TTL + 100 pF  
CAUTION  
To stabilize the power supply, it is recommended that a high-frequency bypass capacitor be connected between  
the VCC pin and the GND pin.  
tRC  
A0 - A16  
tAA  
(NOTE)  
CE  
tACE  
tCHZ  
(NOTE)  
OE  
OE  
tOHZ  
tOE  
(NOTE)  
tOH  
D0 - D7  
DATA VALID  
NOTE: The output data becomes valid when the last  
intervals, tAA, tACE, or tOE, have concluded.  
531000BS-3  
Figure 3. Timing Diagram  
4
CMOS 1M MROM  
LH531000B-S  
PACKAGE DIAGRAM  
28SOP (SOP028-P-0450)  
1.27 [0.050]  
TYP.  
0.50 [0.020]  
0.30 [0.012]  
1.70 [0.067]  
28  
15  
8.80 [0.346]  
8.40 [0.331]  
12.40 [0.488]  
11.60 [0.457]  
10.60 [0.417]  
1
14  
1.70 [0.067]  
0.20 [0.008]  
0.10 [0.004]  
18.20 [0.717]  
17.80 [0.701]  
0.15 [0.006]  
1.025 [0.040]  
2.40 [0.094]  
2.00 [0.079]  
0.20 [0.008]  
0.00 [0.000]  
1.025 [0.040]  
MAXIMUM LIMIT  
MINIMUM LIMIT  
DIMENSIONS IN MM [INCHES]  
28SOP  
28-pin, 450-mil SOP  
ORDERING INFORMATION  
LH531000B  
Device Type  
N
- S  
Package  
Low-Voltage Operation  
28-pin, 450-mil SOP (SOP028-P-0450)  
CMOS 1M (128K x 8) Mask-Programmable ROM  
Example: LH531000BN-S (CMOS 1M (128K x 8) Mask-Programmable ROM, Low-Voltage Operation,  
28-pin, 450-mil SOP)  
531000BS-4  
5

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