PC123X1YIP0F [SHARP]
DIP 4pin Reinforced Insulation Type Photocoupler; DIP 4PIN加强绝缘型光电耦合器
| 型号： | PC123X1YIP0F |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | DIP 4pin Reinforced Insulation Type Photocoupler |
| 文件： | 总16页 (文件大小：287K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PC123XNNSZ0F Series
DIP 4pin Reinforced Insulation Type
Photocoupler
PC123XNNSZ0F
Series
Description
Agency approvals/Compliance
■
■
PC123XNNSZ0F Series contains an IRED optically
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC123)
2. Approved by BSI, BS-EN60065, file No. 7087, BS-
EN60950 file No. 7409, (as model No. PC123)
3. Approved by SEMKO, EN60065, EN60950, (as mod-
el No. PC123)
coupled to a phototransistor.
It is packaged in a 4-pin DIP, available in wide-lead
spacing option and SMT gullwing lead-form option.
Input-output isolation voltage(rms) is 5kV.
CTR is 50% to 400% at input current of 5mA
4. Approved by DEMKO, EN60065, EN60950, (as mod-
el No. PC123)
Features
■
5. Approved by NEMKO, EN60065, EN60950, (as mod-
el No. PC123)
1. 4-pin DIP package
2. Double transfer mold package (Ideal for Flow Solder-
ing)
6. Approved by FIMKO, EN60065, EN60950, (as model
No. PC123)
3. Current transfer ratio (CTR : MIN. 50% at I 5 mA,
=
F
7. Recognized by CSA file No. CA95323, (as model No.
VCE 5V)
=
PC123)
4. Several CTR ranks available
8. Approved by VDE, DIN EN60747-5-2(∗) (as an op-
tion), file No. 40008087 (as model No. PC123)
9. Package resin : UL flammability grade (94V - 0)
5. Reinforced insulation type (Isolation distance : MIN.
0.4mm)
6. Long creepage distance type (wide lead-form type
only : MIN. 8mm)
(∗) DIN EN60747-5-2 : successor standard of DIN VDE0884.
7. High isolation voltage between input and output
(Viso(rms) : 5kV)
Applications
■
8. Lead-free and RoHS directive compliant
1. I/O isolation for MCUs (Micro Controller Units)
2. Noise suppression in switching circuits
3. Signal transmission between circuits of different po-
tentials and impedances
4. Over voltage detection
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A09501EN
Date Sep. 1. 2006
© SHARP Corporation
1
PC123XNNSZ0F Series
Internal Connection Diagram
■
■
1
2
3
4
Anode
1
4
Cathode
Emitter
Collector
2
3
(Unit : mm)
Outline Dimensions
1. Through-Hole [ex. PC123XNNSZ0F]
2. Through-Hole (VDE option)
[ex. PC123XNYSZ0F]
Rank mark
Rank mark
Factory identification mark
Factory identification mark
Anode mark
Anode mark
Date code
Date code
1
2
4
1
2
4
3
PC123
PC123
3
4
SHARP mark "S"
6.5±0.3
6.5±0.3
VDE idenfication mark
4.58±0.30
7.62±0.30
4.58±0.30
7.62±0.30
Epoxy resin
0.26±0.10
Epoxy resin
0.26±0.10
0.5±0.1
0.5±0.1
θ
θ
θ
θ
θ : 0 to 13˚
θ : 0 to 13˚
Product mass : approx. 0.23g
Product mass : approx. 0.23g
3. Wide Through-Hole Lead-Form
4. Wide Through-Hole Lead-Form (VDE option)
[ex. PC123XNNFZ0F]
[ex. PC123XNYFZ0F]
Factory identification mark
Factory identification mark
Rank mark
Anode mark
Rank mark
Anode mark
Date code
Date code
1
2
1
2
4
4
3
3
P C 1 2 3
P C 1 2 3
4
SHARP mark "S"
6.5±0.3
6.5±0.3
7.62±0.30
VDE idenfication mark
7.62±0.30
4.58±0.30
4.58±0.30
Epoxy resin
10.16±0.50
0.26±0.10
Epoxy resin
10.16±0.50
0.26±0.10
0.5±0.1
0.5±0.1
Product mass : approx. 0.23g
Product mass : approx. 0.23g
Sheet No.: D2-A09501EN
2
PC123XNNSZ0F Series
(Unit : mm)
5. SMT Gullwing Lead-Form (VDE option)
6. Wide SMT Gullwing Lead-Form
[ex. PC123XNYIP0F]
[ex. PC123XNNUP0F]
Rank mark
Anode mark
Factory identification mark
Rank mark
Anode mark
Factory identification mark
Date code
Date code
1
2
4
4
1
2
3
3
P C 1 2 3
P C 1 2 3
4
SHARP mark "S"
6.5±0.3
6.5±0.3
VDE
idenfication mark
7.62±0.30
4.58±0.30
7.62±0.30
4.58±0.30
Epoxy resin
0.5±0.1
0.75±0.25
10.16±0.50
12MAX
0.75±0.25
2.54±0.25
+0.4
−0.0
+0.4
−0.0
Epoxy resin
1.0
1.0
+0.0
−0.5
10.0
Product mass : approx. 0.22g
Product mass : approx. 0.22g
7. Wide SMT Gullwing Lead-Form (VDE option)
[ex. PC123XNYUP0F]
Rank mark
Anode mark
Factory identification mark
Date code
1
2
4
3
P C 1 2 3
4
SHARP mark "S"
6.5±0.3
VDE
idenfication mark
7.62±0.30
4.58±0.30
Epoxy resin
0.5±0.1
0.75±0.25
10.16±0.50
12MAX
0.75±0.25
Product mass : approx. 0.22g
Sheet No.: D2-A09501EN
3
PC123XNNSZ0F Series
Date code (2 digit)
1st digit
2nd digit
Year of production
Month of production
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
Mark
A
B
A.D.
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
:
Mark
P
Month
Mark
1
January
February
March
R
2
C
S
3
D
E
T
April
4
U
V
W
X
A
B
May
5
F
June
6
H
J
July
7
August
September
October
November
December
8
K
L
9
O
N
D
M
N
C
:
repeats in a 20 year cycle
Factory identification mark and Plating material
Factory identification Mark
Country of origin
Plating material
no mark
Japan
SnCu (Cu : TYP. 2%)
or
or
Indonesia
China
SnBi (Bi : TYP. 2%)
SnCu (Cu : TYP. 2%)*
SnCu (Cu : TYP. 2%)
* Up to Date code "T4" (April 2005), SnBi (Bi : TYP. 2%).
** This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see the actural status of the production.
Rank mark
Refer to the Model Line-up table.
Sheet No.: D2-A09501EN
4
PC123XNNSZ0F Series
Absolute Maximum Ratings
■
(T 25̊C)
=
a
Parameter
Symbol
Rating
50
1
Unit
mA
A
Forward current
*1 Peak forward current
IF
IFM
VR
P
Input
Reverse voltage
6
V
Power dissipation
70
70
6
mW
V
Collector-emitter voltage
Emitter-collector voltage
Collector current
VCEO
VECO
IC
V
Output
50
150
200
5
mA
mW
mW
kV
̊C
Collector power dissipation
PC
Total power dissipation
*2 Isolation voltage
Ptot
V (rms)
iso
Operating temperature
Storage temperature
*2 Soldering temperature
Topr
Tstg
Tsol
30 to 100
+
−
−
55 to 125
̊C
+
260
̊C
*1 Pulse width≤100ms, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1 minute, f = 60Hz
*3 For 10s
Electro-optical Characteristics
■
(T 25̊C)
=
a
Parameter
Symbol
VF
Condition
20mA
MIN.
−
TYP. MAX.
Unit
V
Forward voltage
I
1.2
−
1.4
10
250
100
−
=
F
Input Reverse current
Terminal capacitance
IR
VR 4V
A
μ
=
−
Ct
V 0, f 1kHz
30
−
pF
nA
V
=
=
−
Collector dark current
Output Collector-emitter breakdown voltage
Emitter-collector breakdown voltage
Collector current
ICEO
BVCEO
BVECO
IC
VCE 50V, I 0
= =
F
−
IC 0.1mA, I
0
70
6
=
=
−
F
I
10 A, I
0
=
F
nA
mA
V
=
μ
−
−
E
I
5mA, V 5V
2.5
20
0.2
−
=
=
CE
−
F
Collector-emitter saturation voltage VCE(sat)
I
20mA, I 1mA
0.1
=
=
C
−
F
Transfer Isolation resistance
Floating capacitance
RISO
Cf
fC
DC500V, 40 to 60%RH
V 0, f 1MHz
5×1010 1×1011
Ω
charac
0.6
80
4
1
pF
kHz
−
=
=
−
−
−
−
teristics Cut-off frequency
VCE 5V, I 2mA, R 100 , 3dB
Ω −
=
=
C
=
L
−
Rise time
Fall time
tr
18
18
s
s
μ
Response time
VCE 2V, I 2mA, R 100
Ω
=
=
=
L
C
tf
3
μ
Sheet No.: D2-A09501EN
5
PC123XNNSZ0F Series
Model Line-up
■
Lead Form
Through-Hole
Wide Through-Hole
IC[mA]
Sleeve
(I 5mA,
Package
DIN
=
F
Rank mark
100pcs/sleeve
VCE 5V,
=
T 25˚C)
=
a
Approved
Approved
EN60747-5-2
With or without
2.5 to 20
2.5 to 7.5
5 to 12.5
10 to 20
5 to 10
PC123XNNSZ0F PC123XNYSZ0F PC123XNNFZ0F PC123XNYFZ0F
PC123X1NSZ0F PC123X1YSZ0F PC123X1NFZ0F PC123X1YFZ0F
PC123X2NSZ0F PC123X2YSZ0F PC123X2NFZ0F PC123X2YFZ0F
PC123X5NSZ0F PC123X5YSZ0F PC123X5NFZ0F PC123X5YFZ0F
PC123X8NSZ0F PC123X8YSZ0F PC123X8NFZ0F PC123X8YFZ0F
L
M
N
E
Model No.
Lead Form
Package
SMT Gullwing
Wide SMT Gullwing
IC[mA]
Taping
(I 5mA,
=
F
Rank mark
2 000pcs/reel
VCE 5V,
=
DIN
T 25˚C)
=
Approved
Approved
a
EN60747-5-2
With or without
2.5 to 20
2.5 to 7.5
5 to 12.5
10 to 20
5 to 10
PC123XNYIP0F PC123XNNUP0F PC123XNYUP0F
PC123X1YIP0F PC123X1NUP0F PC123X1YUP0F
PC123X2YIP0F PC123X2NUP0F PC123X2YUP0F
PC123X5YIP0F PC123X5NUP0F PC123X5YUP0F
PC123X8YIP0F PC123X8NUP0F PC123X8YUP0F
L
M
N
E
Model No.
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: D2-A09501EN
6
PC123XNNSZ0F Series
Fig.1 Forward Current vs. Ambient
Temperature
Fig.2 Diode Power Dissipation vs.
Ambient Temperature
50
40
30
20
100
80
70
60
40
10
0
20
0
−30
0
25
50 55 75
100
125
−30
0
25
50 55 75
100
125
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.3 Collector Power Dissipation vs.
Fig.4 Total Power Dissipation vs. Ambient
Ambient Temperature
Temperature
250
250
200
150
100
200
150
100
50
0
50
0
−30
0
25
50
75
100
125
−30
0
25
50
75
100
125
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.5 Peak Forward Current vs. Duty Ratio
Fig.6 Forward Current vs. Forward Voltage
10 000
Ta=75˚C
Pulse width≤100μs
Ta=25˚C
50˚C
25˚C
100
0˚C
1 000
−25˚C
10
100
10
1
10−3
10−2
Duty ratio
10−1
1
0
0.5
1
1.5
2
2.5
3
3.5
Forward voltage VF (V)
Sheet No.: D2-A09501EN
7
PC123XNNSZ0F Series
Fig.7 Current Transfer Ratio vs.
Fig.8 Collector Current vs.
Forward Current
Collector-emitter Voltage
300
Ta=25˚C
V
CE=5V
60
54
Ta=25˚C
250
200
150
100
PC (MAX.)
48
42
36
30
24
18
12
50
0
6
0
0
1
2
3
4
5
6
7
8
9
10
0.1
1
10
100
Forward current IF (mA)
Collector-emitter voltage VCE (V)
Fig.9 Relative Current Transfer Ratio vs.
Ambient Temperature
Fig.10 Collector - emitter Saturation Voltage
vs. Ambient Temperature
150
0.16
IF=5mA
IF=20mA
VCE=5V
IC=1mA
0.14
0.12
0.1
100
0.08
0.06
0.04
50
0
0.02
0
−30
0
25
50
75
100
−30
0
20
40
60
80
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.11 Collector Dark Current vs.
Fig.12 Response Time vs.
Load Resistance
1 000
Ambient Temperature
10−5
VCE=50V
V
CE=2V
IC=2mA
Ta=25˚C
10−6
10−7
10−8
10−9
100
tr
tf
10
td
ts
1
10−10
10−11
0.1
0.01
0.1
1
10
100
−30
0
20
40
60
80
100
Load resistance (kΩ)
Ambient temperature Ta (˚C)
Sheet No.: D2-A09501EN
8
PC123XNNSZ0F Series
Fig.13 Test Circuit for Response Time
Fig.14 Frequency Response
5
0
V
CE=5V
IC=2mA
Ta=25˚C
Input
VCC
Output
Output
VCE
RL
Input RD
10%
90%
tf
−5
td
ts
tr
−10
Please refer to the conditions in Fig.12.
RL=10kΩ
100Ω
1kΩ
−15
−20
0.1
1
10
100
1 000
Frequency (kHz)
Fig.15 Collector-emitter Saturation Voltage vs.
Forward Current
Ta=25˚C
5
IC=0.5mA
1mA
3mA
4.5
5mA
7mA
4
3.5
3
2.5
2
1.5
1
0.5
0
0
2
4
6
8
10 12 14 16 18 20
Forward current IF (mA)
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D2-A09501EN
9
PC123XNNSZ0F Series
Design Considerations
■
●
Design guide
While operating at IF<1mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
●
●
Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
Recommended foot print (reference)
SMT Gullwing lead-form
Wide SMT Gullwing lead-form
8.2
10.2
2.2
2.2
(Unit : mm)
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
✩
Sheet No.: D2-A09501EN
10
PC123XNNSZ0F Series
Manufacturing Guidelines
■
●
Soldering Method
Reflow Soldering :
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
(package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
100
150 to 180˚C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the be-
low listed guidelines.
Flow soldering should be completed below 270̊C and within 10s.
Preheating is within the bounds of 100 to 150̊C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400̊C.
Please don't solder more than twice
Other notice
Please test the soldering method in actual condition and make sure the soldering works fine, since the im-
pact on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A09501EN
11
PC123XNNSZ0F Series
●
Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.
Ultrasonic cleaning :
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-
tual using conditions since some materials may erode the packaging resin.
●
Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBB and PBDE are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
Sheet No.: D2-A09501EN
12
PC123XNNSZ0F Series
Package specification
■
●
Sleeve package
1. Through-Hole
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless
stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12
6.7
(Unit : mm)
2. Wide Through-Hole
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless
stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
15
6.35
(Unit : mm)
Sheet No.: D2-A09501EN
13
PC123XNNSZ0F Series
●
Tape and Reel package
1. SMT Gullwing
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
D
J
G
E
I
K
Dimensions List
(Unit : mm)
A
B
C
D
E
F
G
+0.1
16.0±0.3
7.5±0.1
1.75±0.10
8.0±0.1
2.0±0.1
4.0±0.1
φ1.5
−0.0
H
I
J
K
10.4±0.1 0.40±0.05
4.2±0.1
5.1±0.1
Reel structure and Dimensions
e
d
g
Dimensions List
(Unit : mm)
a
b
c
d
φ330
17.5±1.5
φ100±1 φ13.0±0.5
f
e
f
g
b
φ23±1
2.0±0.5
2.0±0.5
a
Direction of product insertion
Pull-out direction
[Packing : 2 000pcs/reel]
Sheet No.: D2-A09501EN
14
PC123XNNSZ0F Series
2. Wide SMT Gullwing
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
D
J
G
C
I
E
K
Dimensions List
(Unit : mm)
A
B
C
D
E
F
G
+0.1
24.0±0.3
11.5±0.1 1.75±0.10
8.0±0.1
2.0±0.1
4.0±0.1
φ1.5
−0.0
H
I
J
K
12.4±0.1 0.40±0.05
4.1±0.1
5.1±0.1
Reel structure and Dimensions
e
d
g
Dimensions List
(Unit : mm)
a
b
c
d
φ330
25.5±1.5
φ100±1 φ13.0±0.5
f
e
f
g
b
φ23±1
2.0±0.5
2.0±0.5
a
Direction of product insertion
Pull-out direction
[Packing : 2 000pcs/reel]
Sheet No.: D2-A09501EN
15
PC123XNNSZ0F Series
Important Notices
■
· The circuit application examples in this publication
are provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related
to any intellectual property right of a third party resulting
from the use of SHARP's devices.
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials, structure,
and other contents described herein at any time
without notice in order to improve design or reliability.
Manufacturing locations are also subject to change
without notice.
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
· Contact and consult with a SHARP representative
if there are any questions about the contents of this
publication.
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
Sheet No.: D2-A09501EN
[E253]
16
相关型号：
©2020 ICPDF网 联系我们和版权申明