PC354NJ0000F [SHARP]
Mini-flat Package, AC Input Photocoupler; 微型扁平封装， AC输入光耦合器
| 型号： | PC354NJ0000F |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | Mini-flat Package, AC Input Photocoupler |
| 文件： | 总14页 (文件大小：223K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PC354NJ0000F Series
Mini-flat Package,
AC Input Photocoupler
PC354NJ0000F
Series
■ Description
PC354NJ0000F Series contains an IRED optically
coupled to a phototransistor.
■ Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC354)
It is packaged in a 4-pin Mini-flat package.
Input-output isolation voltage(rms) is 3.75kV.
Collector-emitter voltage is 80V and CTR is 20% to
400% at input current of ±1mA.
2. Package resin : UL flammability grade (94V-0)
■ Applications
1. Hybrid substrates that require high density mounting.
2. Programmable controllers
■ Features
1. 4-pin Mini-flat package
2. Double transfer mold package (Ideal for Flow
Soldering)
3. AC input type
4. High collector-emitter voltage (VCEO : 80V)
5. High isolation voltage between input and output
(Viso(rms) : 3.75kV)
6. Lead-free and RoHS directive compliant
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A00602EN
1
Date Jun. 30. 2005
© SHARP Corporation
PC354NJ0000F Series
■ Internal Connection Diagram
1
4
3
1
2
3
4
Anode/Cathode
Cathode/Anode
Emitter
Collector
2
■ Outline Dimensions
(Unit : mm)
3.6±0.3
2.54±0.25
4
3
Date code
SHARP mark
"S"
Primary
side mark
354
Rank mark
Factory identification mark
1
2
0.4±0.1
5.3±0.3
Epoxy resin
45˚
+0.4
0.5
−0.2
+0.2
−0.7
7.0
Product mass : approx. 0.1g
Plating material : SnCu (Cu : TYP. 2%)
Sheet No.: D2-A00602EN
2
PC354NJ0000F Series
Date code (2 digit)
1st digit
2nd digit
Year of production
Month of production
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
Mark
P
Month
Mark
1
Mark
A
B
January
February
March
R
2
S
3
C
T
April
4
D
E
U
May
5
F
V
June
6
H
J
W
X
July
7
August
September
October
November
December
8
K
L
A
9
B
O
N
D
M
N
C
·
·
·
·
·
·
repeats in a 20 year cycle
Factory identification mark
Factory identification Mark
Country of origin
no mark
Japan
Indonesia
China
* This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see
the actual status of the production.
Rank mark
Refer to the Model Line-up table
Sheet No.: D2-A00602EN
3
PC354NJ0000F Series
■ Absolute Maximum Ratings
(Ta=25˚C)
Unit
mA
A
Parameter
Symbol
IF
Rating
Forward current
±50
*1 Peak forward current
IFM
±1
Power dissipation
P
70
mW
V
Collector-emitter voltage
Emitter-collector voltage
Collector current
VCEO
VECO
IC
80
6
50
V
mA
mW
mW
˚C
Collector power dissipation
Total power dissipation
Operating temperature
Storage temperature
*2 Isolation voltage
*3 Soldering temperature
PC
150
Ptot
170
Topr
Tstg
−30 to +100
−40 to +125
3.75
˚C
Viso (rms)
kV
Tsol
260
˚C
*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1 minute, f=60Hz
*3 For 10s
■ Electro-optical Characteristics
(Ta=25˚C)
Parameter
Symbol
VF
Conditions
MIN.
TYP.
MAX.
1.4
250
100
−
Unit
V
Forward voltage
Terminal capacitance
Collector dark current
IF=±20mA
V=0, f=1kHz
−
1.2
Input
Ct
−
30
pF
nA
V
ICEO
VCE=50V, IF=0
−
−
Output Collector-emitter breakdown voltage BVCEO
IC=0.1mA, IF=0
IE=10µA, IF=0
80
−
−
Emitter-collector breakdown voltage
BVECO
IC
6
−
V
Collector current
IF=±1mA, VCE=5V
IF=±20mA, IC=1mA
DC500V, 40 to 60%RH
V=0, f=1MHz
0.2
−
4.0
0.2
−
mA
V
Collector-emitter saturation voltage VCE (sat)
−
0.1
1×1011
0.6
4
Transfer
charac-
teristics
Isolation resistance
Floating capacitance
RISO
Cf
tr
5×1010
Ω
−
−
−
1.0
18
pF
µs
µs
Rise time
Response time
VCE=2V, IC=2mA, RL=100Ω
Fall time
tf
3
18
Sheet No.: D2-A00602EN
4
PC354NJ0000F Series
■ Model Line-up
Taping
3 000 pcs/reel 750 pcs/reel
IC [mA]
Package
Rank mark
(
I =±1mA, V =5V, T =25˚C)
F
CE
a
PC354NJ0000F PC354NTJ000F
PC354N1J000F PC354N1TJ00F
0.2 to 4.0
0.5 to 1.5
with or without
A
Model No.
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: D2-A00602EN
5
PC354NJ0000F Series
Fig.1 Forward Current vs. Ambient
Fig.2 Diode Power Dissipation vs. Ambient
Temperature
Temperature
120
70
60
50
40
30
20
10
0
100
80
70
60
40
20
0
−30
0
50 55
100
−30
0
25
50
75
100
125
Ambient temperature Ta (˚C)
Ambient temperature Ta(˚C)
Fig.3 Collector Power Dissipation vs.
Fig.4 Total Power Dissipation vs. Ambient
Ambient Temperature
200
Temperature
300
250
150
100
50
200
170
150
100
50
0
0
−30
0
25
50
75
100
125
−30
0
25
50
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.5 Peak Forward Current vs. Duty Ratio
Fig.6 Forward Current vs. Forward Voltage
10 000
Ta=75˚C
Pulse width≤100µs
Ta=25˚C
50˚C
25˚C
100
0˚C
1 000
100
10
−25˚C
10
1
− 3
− 2
− 1
10
10
10
1
0
0.5
1
1.5
2
2.5
3
3.5
Duty ratio
Forward voltage VF (V)
Sheet No.: D2-A00602EN
6
PC354NJ0000F Series
Fig.7 Current Transfer Ratio vs. Forward
Fig.8 Collector Current vs. Collector-emitter
Voltage
Current
500
50
Ta=25˚C
VCE=5V
Ta=25˚C
400
300
200
100
0
40
IF=30mA
PC (MAX.)
20mA
10mA
30
20
10
0
5mA
1mA
0.1
1
10
100
0
1
2
3
4
5
6
7
8
9
10
Forward current IF (mA)
Collector-emitter voltage VCE (V)
Fig.9 Relative Current Transfer Ratio vs.
Ambient Temperature
Fig.10 Collector - emitter Saturation Voltage
vs. Ambient Temperature
0.16
150
IF=5mA
VCE=5V
IF=20mA
IC=1mA
0.14
0.12
0.1
100
0.08
0.06
0.04
50
0
0.02
0
−30
0
20
40
60
80
100
−30
0
20
40
60
80
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.11 Collector Dark Current vs. Ambient
Temperature
Fig.12 Response Time vs. Load Resistance
10−5
VCE=2V
IC=2mA
VCE=50V
10−6
10−7
10−8
10−9
Ta=25˚C
100
tr
tf
10
td
ts
1
10−10
10−11
0.1
0.01
0.1
1
10
−30
0
20
40
60
80
100
Load resistance RL (kΩ)
Ambient temperature Ta (˚C)
Sheet No.: D2-A00602EN
7
PC354NJ0000F Series
Fig.13 Test Circuit for Response Time
Fig.14 Collector-emitter Saturation Voltage
vs. Forward Current
5.6
VCC
Ta=25˚C
Input
Output
Output
IC=0.5mA
RL
Input
RD
4.2
1mA
3mA
5mA
10%
90%
7mA
VCE
2.8
td
ts
tr
tf
1.4
0
Please refer to the conditions in Fig.12
0
1
2
3
4
5
6
7
8
9
10
Forward current IF (mA)
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D2-A00602EN
8
PC354NJ0000F Series
■ Design Considerations
● Design guide
While operating at IF<1.0mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
● Recommended Foot Print (reference)
6.3
1.5
(Unit : mm)
✩
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A00602EN
9
PC354NJ0000F Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
( package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
100
150 to 180˚C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 260˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A00602EN
10
PC354NJ0000F Series
● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
Sheet No.: D2-A00602EN
11
PC354NJ0000F Series
■ Package specification
● Tape and Reel package
1. 3 000pcs/reel
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
E
D
G
J
I
M A X .
K
5 ˚
Dimensions List
(Unit : mm)
A
B
C
D
E
F
G
+0.1
12.0±0.3
5.5±0.1
1.75±0.1
8.0±0.1
2.0±0.1
4.0±0.1
φ1.5
−0
H
I
J
K
7.4±0.1
0.3±0.05
3.1±0.1
4.0±0.1
Reel structure and Dimensions
e
d
g
Dimensions List
(Unit : mm)
a
b
c
d
370
e
13.5±1.5
80±1.0
g
13±0.5
f
f
21±1.0
2.0±0.5
2.0±0.5
a
b
Direction of product insertion
Pull-out direction
[Packing : 3 000pcs/reel]
Sheet No.: D2-A00602EN
12
PC354NJ0000F Series
2. 750pcs/reel
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
E
D
G
J
I
M A X .
K
5 ˚
Dimensions List
(Unit : mm)
A
B
C
D
E
F
G
+0.1
12.0±0.3
5.5±0.1
1.75±0.1
8.0±0.1
2.0±0.1
4.0±0.1
φ1.5
−0
H
I
J
K
7.4±0.1
0.3±0.05
3.1±0.1
4.0±0.1
Reel structure and Dimensions
e
d
g
Dimensions List
(Unit : mm)
a
b
c
d
180
e
13.5±1.5
80±1.0
g
13±0.5
f
f
21±1.0
2.0±0.5
2.0±0.5
a
b
Direction of product insertion
Pull-out direction
[Packing : 750pcs/reel]
Sheet No.: D2-A00602EN
13
PC354NJ0000F Series
■ Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems
related to any intellectual property right of a third party
resulting from the use of SHARP's devices.
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials,
structure, and other contents described herein at any
time without notice in order to improve design or
reliability. Manufacturing locations are also subject to
change without notice.
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in
whole or in part, without the express written permission
of SHARP. Express written permission is also required
before any use of this publication may be made by a
third party.
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
· Contact and consult with a SHARP representative if
there are any questions about the contents of this
publication.
[E181]
Sheet No.: D2-A00602EN
14
相关型号：
©2020 ICPDF网 联系我们和版权申明