PC3SD21YXPC [SHARP]
Triac Output Optocoupler With Zero CRSVR, 1-Element, 5000V Isolation, SMT, PLASTIC, DIP-6/5;
| 型号： | PC3SD21YXPC |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | Triac Output Optocoupler With Zero CRSVR, 1-Element, 5000V Isolation, SMT, PLASTIC, DIP-6/5 |
| 文件： | 总17页 (文件大小：335K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PC3SD21NTZ Series
VDRM : 600V
Zero cross type
DIP 6pin
PC3SD21NTZ
Series
Phototriac Coupler for triggering
∗Non-zero cross type is also available.
(PC3SD11NTZ Series)
■ Description
■ Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. 3SD21)
2. Approved by CSA, file No. CA95323 (as model No.
3SD21)
PC3SD21NTZ Series Phototriac Coupler include an
infrared emitting diode (IRED) optically coupled to an
output Phototriac.
These devices feature full wave control and are
ideal isolated drivers for medium to high current Triacs.
DIP package provides 5.0kV isolation from input to
output with superior commutative noise immunity.
∗
3. Optionary available VDE Approved ( )(DIN EN
60747-5-2), file No. 4008189 (as model No. 3SD21)
4. Package resin : UL flammability grade (94V-0)
(∗)
DIN EN60747-5-2 : succesor standard of DIN VDE0884.
Up to Date code "RD" (December 2003), approval of DIN
VDE0884.
■ Features
From Date code "S1" (January 2004), approval of DIN
EN60747-5-2.
1. High repetitive peak off-state voltage (VDRM : 600V)
2. Zero crossing functionality (VOX : MAX. 20V)
3. IFT ranks available (see Model Line-up section in this
datasheet)
(∗∗) Reinforced insulation type is also available.
(PC3SF21YVZ Series)
4. 6 pin DIP package
■ Applications
5. Superior noise immunity (dV/dt : MIN. 1 000V/µs)
6. Lead-free components are also available (see Model
Line-up section in this datasheet)
7. Double transfer mold construction (Ideal for Flow
Soldering)
1. Triggering for Triacs used to switch on and off
devices which require AC Loads.
For example heaters, fans, motors, solenoids, and
valves.
2. AC line control in power supply applications.
8. High isolation voltage between input and output
(Viso(rms) : 5.0kV)
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A07601EN
1
Date Mar. 31. 2004
© SHARP Corporation
PC3SD21NTZ Series
■ Internal Connection Diagram
1
2
3
4
5
6
Anode
Cathode
NC
Anode/Cathode
No external connection
Cathode/Anode
1
2
6
5
3
4
Zero Crossing Circuit
(Unit : mm)
■ Outline Dimensions
1. Through-Hole [ex. PC3SD21NTZ]
2. Wide Through-Hole Lead-Form [ex. PC3SD21NVZ]
1.2±0.3
1.2±0.3
0.6±0.2
0.6±0.2
6
4
5
Model No.
Model No.
Rank mark
6
5
4
SHARP
mark
"S"
SHARP
mark
"S"
Rank mark
3 S D 2 1
3 S D 2 1
Anode
mark
Anode
mark
Date code (2 digit)
Date code (2 digit)
1
2
3
1
3
Factory identification mark
2
Factory identification mark
7.62±0.3
7.12±0.5
7.12±0.5
7.62±0.3
Epoxy resin
Epoxy resin
10.16±0.5
0.26±0.1
0.5±0.1
2.54±0.25
2.54±0.25
θ
θ
0.5±0.1
θ : 0 to 13˚
Product mass : approx. 0.35g
Product mass : approx. 0.35g
3. SMT Gullwing Lead-Form [ex. PC3SD21NXP]
4. Wide SMT Gullwing Lead-Form [ex. PC3SD21NWP]
1.2±0.3
0.6±0.2
0.6±0.2
1.2±0.3
6
5
4
Model No.
Rank mark
6
5
4
Model No.
Rank mark
SHARP
mark
"S"
SHARP
mark
"S"
3 S D 2 1
3 S D 2 1
Anode
mark
Anode
mark
Date code (2 digit)
Date code (2 digit)
1
2
3
1
2
3Factory identification mark
7.62±0.3
Factory identification mark
7.12±0.5
7.12±0.5
7.62±0.3
Epoxy resin
2.54±0.25
Epoxy resin
2.54±0.25
+0.4
+0.4
1.0
1.0
−0
−0
+0
10.0
−0.5
0.75±0.25
10.16±0.5
12.0MAX.
0.75±0.25
Product mass : approx. 0.33g
Product mass : approx. 0.34g
Sheet No.: D2-A07601EN
2
PC3SD21NTZ Series
(Unit : mm)
■ Outline Dimensions
5. Through-Hole VDE option [ex. PC3SD21YTZ]
6. Wide Through-Hole Lead-Form VDE option
[ex. PC3SD21YVZ]
1.2±0.3
1.2±0.3
0.6±0.2
0.6±0.2
6
4
5
Model No.
Model No.
Rank mark
SHARP
mark
"S"
6
5
4
SHARP
mark
"S"
Rank mark
3 S D 2 1
3 S D 2 1
Anode
mark
Anode
mark
4
4
Date code (2 digit)
Date code (2 digit)
1
2
3
VDE
identification mark
Factory identification mark
1
3
2
VDE
Factory identification mark
7.62±0.3
identification mark
7.12±0.5
7.62±0.3
7.12±0.5
Epoxy resin
0.5±0.1
Epoxy resin
10.16±0.5
2.54±0.25
0.26±0.1
θ
θ
2.54±0.25
θ : 0 to 13˚
0.5±0.1
Product mass : approx. 0.35g
Product mass : approx. 0.35g
7. SMT Gullwing Lead-Form VDE option
8. Wide SMT Gullwing Lead-Form VDE option
[ex. PC3SD21YXP]
[ex. PC3SD21YWP]
1.2±0.3
0.6±0.2
0.6±0.2
1.2±0.3
6
5
4
6
5
4
Model No.
Rank mark
Model No.
Rank mark
SHARP
mark
"S"
SHARP
mark
"S"
3 S D 2 1
3 S D 2 1
Anode
mark
Anode
mark
4
4
Date code (2 digit)
Date code (2 digit)
1
2
3
1
2
3
Factory identification mark
VDE
identification mark
Factory identification mark
7.62±0.3
VDE
identification mark
7.12±0.5
7.12±0.5
7.62±0.3
Epoxy resin
2.54±0.25
Epoxy resin
2.54±0.25
+0.4
+0.4
1.0
1.0
−0
−0
+0
10.0
−0.5
0.75±0.25
10.16±0.5
12.0MAX.
0.75±0.25
Product mass : approx. 0.33g
Product mass : approx. 0.34g
5
∗Pin is not allowed external connection
Sheet No.: D2-A07601EN
3
PC3SD21NTZ Series
Date code (2 digit)
1st digit
2nd digit
Year of production
Month of production
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
Mark
P
Month
Mark
1
Mark
A
B
January
February
March
R
2
S
3
C
T
April
4
D
E
U
May
5
F
V
June
6
H
J
W
X
July
7
August
September
October
November
December
8
K
L
A
9
B
O
N
D
M
N
C
·
·
·
·
·
·
repeats in a 20 year cycle
Factory identification mark
Factory identification Mark
Country of origin
no mark
Japan
Indonesia
Philippines
China
* This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see the actural status of the
production.
Rank mark
Refer to the Model Line-up table
Sheet No.: D2-A07601EN
4
PC3SD21NTZ Series
■ Absolute Maximum Ratings
(Ta=25˚C)
Parameter
Symbol
IF
VR
Rating
50
6
Unit
mA
V
Forward current
Input
Reverse voltage
IT(rms)
Isurge
0.1
A
RMS ON-state current
Peak one cycle surge current
Repetitive peak OFF-state voltage
Output
1.2 *3
A
VDRM
Viso(rms)
Topr
600
V
*1Isolation voltage
5.0
kV
˚C
˚C
˚C
−30 to +100
−55 to +125
270*4
Operating temperature
Storage temperature
*2Soldering temperature
Tstg
Soldering area
Tsol
*1 40 to 60%RH, AC for 1minute, f=60Hz
*2 For 10s
*3 f=50Hz sine wave
*4 Lead solder plating models: 260˚C
■ Electro-optical Characteristics
(Ta=25˚C)
Parameter
Symbol
VF
Conditions
IF=20mA
VR=3V
MIN. TYP. MAX. Unit
−
−
1.2
−
1.4
10
1
V
µA
µA
V
Forward voltage
Input
IR
Reverse current
IDRM
VT
VD=VDRM
IT=0.1A
−
−
Repentitive peak OFF-state current
ON-state voltage
−
−
2.5
3.5
−
IH
VD=4V
0.1
−
mA
V/µs
Holding current
−
dV/dt
VD=1/√2 ·VDRM
Critical rate of rise of OFF-state voltage
Rank B
1 000 2 000
Output
IF=15mA, Resistance load
VOX
Zero cross voltage
Rank C
−
−
20
V
IF=8mA, Resistance load
Rank D
−
−
−
−
−
−
7
5
Rank B
IFT
VD=4V, RL=100Ω
Minimum trigger current
Rank C
mA
Transfer
charac-
teristics
3
Rank D
Isolation resistance
RISO
ton
DC500V,40 to 60%RH
5
×
1010 1011
−
Ω
VD=4V, RL=100Ω, IF=20mA
Turn-on time
−
−
50
µs
Sheet No.: D2-A07601EN
5
PC3SD21NTZ Series
■ Model Line-up (1) (Lead-free components)
Lead Form
Through-Hole
SMT Gullwing
Sleeve
Wide Through-Hole
Approved
IFT[mA]
Shipping Package
50pcs/sleeve
(VD=4V,
Rank mark
RL=100Ω)
DIN
Approved
Approved
EN60747-5-2
MAX.7
MAX.5
MAX.3
PC3SD21NTZBF PC3SD21YTZBF PC3SD21NXZBF PC3SD21YXZBF PC3SD21NVZBF PC3SD21YVZBF
PC3SD21NTZCF PC3SD21YTZCF PC3SD21NXZCF PC3SD21YXZCF PC3SD21NVZCF PC3SD21YVZCF
PC3SD21NTZDF PC3SD21YTZDF PC3SD21NXZDF PC3SD21YXZDF PC3SD21NVZDF PC3SD21YVZDF
B
C
D
Model No.
Lead Form
Wide SMT Gullwing
Sleeve
SMT Gullwing
Wide SMT Gullwing
Taping
1 000pcs/reel
IFT[mA]
(VD=4V,
RL=100Ω)
Shipping Package
50pcs/sleeve
Rank mark
DIN
Approved
Approved
Approved
EN60747-5-2
MAX.7
MAX.5
MAX.3
PC3SD21NWZBF PC3SD21YWZBF PC3SD21NXPBF PC3SD21YXPBF PC3SD21NWPBF PC3SD21YWPBF
PC3SD21NWZCF PC3SD21YWZCF PC3SD21NXPCF PC3SD21YXPCF PC3SD21NWPCF PC3SD21YWPCF
PC3SD21NWZDF PC3SD21YWZDF PC3SD21NXPDF PC3SD21YXPDF PC3SD21NWPDF PC3SD21YWPDF
B
C
D
Model No.
■ Model Line-up (2) (Lead solder plating components)
Lead Form
Through-Hole
SMT Gullwing
Sleeve
Wide Through-Hole
Approved
IFT[mA]
(VD=4V,
RL=100Ω)
Shipping Package
50pcs/sleeve
Rank mark
DIN
Approved
Approved
EN60747-5-2
MAX.7
MAX.5
MAX.3
PC3SD21NTZB PC3SD21YTZB PC3SD21NXZB PC3SD21YXZB PC3SD21NVZB PC3SD21YVZB
PC3SD21NTZC PC3SD21YTZC PC3SD21NXZC PC3SD21YXZC PC3SD21NVZC PC3SD21YVZC
PC3SD21NTZD PC3SD21YTZD PC3SD21NXZD PC3SD21YXZD PC3SD21NVZD PC3SD21YVZD
B
C
D
Model No.
Lead Form
Wide SMT Gullwing
Sleeve
SMT Gullwing
Wide SMT Gullwing
Taping
1 000pcs/reel
IFT[mA]
(VD=4V,
RL=100Ω)
Shipping Package
50pcs/sleeve
Rank mark
DIN
Approved
Approved
Approved
EN60747-5-2
MAX.7
MAX.5
MAX.3
PC3SD21NWZB PC3SD21YWZB PC3SD21NXPB PC3SD21YXPB PC3SD21NWPB PC3SD21YWPB
PC3SD21NWZC PC3SD21YWZC PC3SD21NXPC PC3SD21YXPC PC3SD21NWPC PC3SD21YWPC
PC3SD21NWZD PC3SD21YWZD PC3SD21NXPD PC3SD21YXPD PC3SD21NWPD PC3SD21YWPD
B
C
D
Model No.
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: D2-A07601EN
6
PC3SD21NTZ Series
Fig.2 RMS ON-state Current vs.
Fig.1 Forward Current vs. Ambient
Temperature
Ambient Temperature
175
70
150
125
100
75
60
50
40
30
20
50
25
0
10
0
−30
0
50
100
−30
0
50
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.3-a Forward Current vs. Forward
Voltage (Rank B)
Fig.3-b Forward Current vs. Forward
Voltage (Rank C, Rank D)
100
100
Ta=75˚C
Ta=100°C
50
50
50˚C
75°C
50°C
25°C
25˚C
0˚C
0°C
10
5
10
−30°C
5
−25˚C
1
1
0.9
1
1.1
1.2
1.3
1.4
1.5
0
0.5
1
1.5
2
2.5
3
Forward voltage VF (V)
Forward voltage VF (V)
Fig.4-a Minimum Trigger Current vs.
Fig.4-b Minimum Trigger Current vs. Ambient
Temperature (Rank C, Rank D)
Ambient Temperature (Rank B)
10
10
VD=4V
RL=100Ω
VD=4V
RL=100Ω
9
9
8
7
6
5
4
3
2
8
7
6
5
4
3
2
1
0
1
0
−40 −20
0
20
40
60
80
100
−40 −20
0
20
40
60
80
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Sheet No.: D2-A07601EN
7
PC3SD21NTZ Series
Fig.6 ON-state Voltage vs.
Fig.5 Relative Repetitive Peak OFF-state
Voltage vs. Ambient Temperature
Ambient Temperature
1.3
IT=100mA
2.4
2.2
2
1.2
1.1
1
1.8
1.6
1.4
0.9
0.8
0.7
1.2
1
−40 −20
0
20
40
60
80
100
−40 −20
0
20
40
60
80
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.7 Holding Current vs.
Fig.8 Repetitive Peak OFF-state Current vs.
Ambient Temperature
Ambient Temperature
10−5
1
VD=4V
VD=600V
10−6
10−7
0.1
10−8
10−9
0.01
−40 −20
0
20
40
60
80
100
−40 −20
0
20
40
60
80
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.9-a Turn-on Time vs. Forward Current
(Rank B)
Fig.9-b Turn-on Time vs. Forward Current
(Rank C, Rank D)
1 000
1 000
VD=4V
VD=4V
RL=100Ω
Ta=25˚C
RL=100Ω
Ta=25˚C
100
100
10
10
1
10
100
1
10
100
Forward current IF (mA)
Forward current IF (mA)
Sheet No.: D2-A07601EN
8
PC3SD21NTZ Series
Fig.10-a Zero-cross Voltage vs. Ambient
Fig.10-b Zero-cross Voltage vs. Ambient
Temperature (Rank B)
Temperature (Rank C, Rank D)
20
20
Resistance load,
IF=15mA
Resistance load,
IF=8mA
18
18
16
14
12
10
8
16
14
12
10
8
6
6
4
4
2
0
2
0
−40 −20
0
20
40
60
80
100
−40 −20
0
20
40
60
80
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Remarks : Please be aware that all data in the graph are just for reference.
Sheet No.: D2-A07601EN
9
PC3SD21NTZ Series
■ Design Considerations
● Design guide
In order for the Phototriac to turn off, the triggering current (IF) must be 0.1mA or less.
Please refrain from using these devices in a direct drive configuration. These Phototriac Coupler are
intended to be used as triggering device for main Triacs. Please ensure that the output rating of these
devices will be sufficient for triggering the main output Triac of your choice. Failure to do may result in
malfunctions.
For applications with inductive loads such as motors,please use caution in utilizing a zero crossing type
Phototraiac Coupler as this may cause undesired operations due to the phase difference between voltage
and current of load.
For designs that will experience excessive noise or sudden changes in load voltage, please include an
appropriate snubber circuit as shown in the below circuit. Please keep in mind the Sharp Phototriac Coupler
incorporate superrior dV/dt ratings which can eliminate the need for a snubber circuit.
For over voltage protection, a Varistor may be used.
● Degradation
In general, the emission of the IRED used in Phototriac Couplers will degrade over time.
In the case where long term operation and / or constant extreme temperature fluctuations will be applied to
the devices, please allow for a worst case scenario of 50% degradation over 5years.
Therefore in order to maintain proper operation, a design implementing these Phototriac Couplers should
provide at least twice the minimum required triggering current from initial operation.
● Recommended Foot Print (reference)
SMT Gullwing Lead-form
Wide SMT Gullwing Lead-form
10.2
8.2
2.2
2.2
(Unit : mm)
Sheet No.: D2-A07601EN
10
PC3SD21NTZ Series
● Standard Circuit (Medium/High Power Triac Drive Circuit)
PC3SD21NTZ
1
2
6
5
4
Load
AC Line
Triac
3
Zero Crossing
Circuit
Note) Please add the snubber circuit according to a condition.
Any snubber or varistor used for the above mentioned scenarios should be located
as close to the main output triac as possible.
✩
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A07601EN
11
PC3SD21NTZ Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
( package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
100
150 to 180˚C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A07601EN
12
PC3SD21NTZ Series
● Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less.
Ultrasonic cleaning :
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
Sheet No.: D2-A07601EN
13
PC3SD21NTZ Series
■ Package specification
● Sleeve package
1. Through-Hole or SMT Gullwing
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0
6.7
(Unit : mm)
2. Wide Through-Hole or Wide SMT Gullwing
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
15.0
6.35
(Unit : mm)
Sheet No.: D2-A07601EN
14
PC3SD21NTZ Series
● Tape and Reel package
1. SMT Gullwing
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
J
F
D
G
I
E
K
Dimensions List
(Unit:mm)
A
B
C
D
E
F
G
+0.1
16.0±0.3
7.5±0.1
1.75±0.1
12.0±0.1
2.0±0.1
4.0±0.1
φ1.5
−0
H
I
J
K
10.4±0.1
0.4±0.05
4.2±0.1
7.8±0.1
Reel structure and Dimensions
e
d
g
Dimensions List
(Unit : mm)
a
b
c
d
330
e
23±1.0
17.5±1.5
100±1.0
13±0.5
f
f
g
b
2.0±0.5
2.0±0.5
a
Direction of product insertion
Pull-out direction
[Packing : 1 000pcs/reel]
Sheet No.: D2-A07601EN
15
PC3SD21NTZ Series
2. Wide SMT Gullwing
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
D
J
G
C
I
E
K
Dimensions List
(Unit : mm)
A
B
C
D
E
F
G
+0.1
24.0±0.3
11.5±0.1
1.75±0.1
12.0±0.1
2.0±0.1
4.0±0.1
φ1.5
−0
H
I
J
K
12.2±0.1
0.4±0.05
4.15±0.1
7.6±0.1
Reel structure and Dimensions
e
d
g
Dimensions List
(Unit : mm)
a
b
c
d
330
e
23±1.0
25.5±1.5
100±1.0
13±0.5
f
g
f
b
2.0±0.5
2.0±0.5
a
Direction of product insertion
Pull-out direction
[Packing : 1 000pcs/reel]
Sheet No.: D2-A07601EN
16
PC3SD21NTZ Series
■ Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems rela-
ted to any intellectual property right of a third party re-
sulting from the use of SHARP's devices.
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high lev-
el of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the spec-
ifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufac-
turing locations are also subject to change without no-
tice.
· If the SHARP devices listed in this publication fall with-
in the scope of strategic products described in the For-
eign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP de-
vices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means, elec-
tronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
Sheet No.: D2-A07601EN
17
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