PC411L0YIP0F [SHARP]
Logic IC Output Optocoupler, 1-Element, 3750V Isolation, 15MBps, ROHS COMPLIANT, PLASTIC, MINI-FLAT, 5 PIN;
| 型号： | PC411L0YIP0F |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | Logic IC Output Optocoupler, 1-Element, 3750V Isolation, 15MBps, ROHS COMPLIANT, PLASTIC, MINI-FLAT, 5 PIN 输出元件 光电 |
| 文件： | 总13页 (文件大小：193K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PC411L0NIP0F Series
High Speed 15Mb/s, High CMR
Mini-flat Package OPIC
Photocoupler
∗
PC411L0NIP0F
Series
■ Description
■ Agency approvals/Compliance
PC411L0NIP0F Series contains a LED optically cou-
1. Recognized by UL1577 (Double protection isolation),
pled to an OPIC.
file No. E64380 (as model No. PC411L)
It is packaged in a 5 pin mini-flat.
Input-output isolation voltage(rms) is 3.75 kV.
High speed response (TYP. 15 Mb/s) and CMR is
MIN. 15 kV/µs.
2. Approved by VDE, DIN EN60747-5-2(∗) (as an op-
tion), file No. 40009162 (as model No. PC411L)
3. Package resin : UL flammability grade (94V-0)
(∗)DIN EN60747-5-2 : successor standard of DIN VDE0884
■ Features
1. 5 pin Mini-flat package
2. Double transfer mold package
(Ideal for Flow Soldering)
■ Applications
1. Programmable controller
2. Inverter
3. High noise immunity due to high instantaneous com-
mon mode rejection voltage (CMH : MIN. 15 kV/µs,
CML : MIN. −15 kV/µs)
4. High speed response
(tPHL : TYP. 27 ns, tPLH : TYP. 35 ns)
5. Isolation voltage between input and output (Viso(rms)
3.75 kV)
:
6. Lead-free and RoHS directive compliant
∗
"OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing
circuit integrated onto a single chip.
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A04902EN
1
Date Jun. 30. 2005
© SHARP Corporation
PC411L0NIP0F Series
■ Internal Connection Diagram
6
5
4
1
3
4
5
6
Anode
Cathode
GND
VO
Amp.
VCC
1
3
■ Truth table
Input
H
LED
ON
output
L
L : Logic (0)
H : Logic (1)
L
OFF
H
■ Outline Dimensions
(Unit : mm)
1. Mini-flat Package [ex. PC411L0NIP0F]
2. Mini-flat Package (VDE option)
[ex. PC411L0YIP0F]
3.6±0.3
3.6±0.3
1.27±0.25
1.27±0.25
1.27±0.25
1.27±0.25
6
5
4
6
5
4
SHARP
mark
"S"
SHARP
mark
"S"
PC411L
PC411L
Anode
mark
Anode
mark
4
VDE Identification mark
Date code
0.4±0.1
Factory identification mark
Date code
0.4±0.1
Factory identification mark
1
3
1
3
5.3±0.3
45˚
5.3±0.3
45˚
Epoxy resin
Epoxy resin
+0.4
−0.2
+0.4
0.5
0.5
−0.2
+0.2
+0.2
7.0
7.0
−0.7
−0.7
Product mass : approx. 0.1g
Product mass : approx. 0.1g
Plating material : SnCu (Cu : TYP. 2%)
Sheet No.: D2-A04901EN
2
PC411L0NIP0F Series
Date code (2 digit)
1st digit
2nd digit
Year of production
Month of production
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
Mark
P
Month
Mark
1
Mark
A
B
January
February
March
R
2
S
3
C
T
April
4
D
E
U
May
5
F
V
June
6
H
J
W
X
July
7
August
September
October
November
December
8
K
L
A
9
B
O
N
D
M
N
C
·
·
·
·
·
·
repeats in a 20 year cycle
Factory identification mark
Factory identification Mark
Country of origin
no mark
Japan
Indonesia
China
* This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see the actual status of the
production.
Rank mark
There is no rank mark indicator.
Sheet No.: D2-A04902EN
3
PC411L0NIP0F Series
■ Absolute Maximum Ratings
(Ta=25˚C)
Parameter
Symbol
IF
Rating
20
Unit
mA
V
*1 Forward current
Reverse voltage
Supply voltage
Input
VR
5
VCC
VO
0 to +6.0
−0.5 to +5.5
2
V
Output Output voltage
Output current
V
IO
mA
˚C
Operating temperature
Storage temperature
*2 Isolation voltage
Topr
Tstg
−40 to +85
−55 to +125
3.75
˚C
Viso (rms)
Tsol
kV
˚C
*3 Soldering temperature
260
*1 When ambient temperature goes above 70˚C, the power dissipation goes down at
0.6mA/˚C. (Fig.3)
*2 40 to 60 %RH, AC for 1minute
*3 For 10s
■
Electro-optical Characteristics*4
(Unless otherwise specified Ta=−40 to 85˚C, VCC=4.5 to 5.5V, TYP. at Ta=25˚C, VCC=5V)
Parameter
Symbol
VF
Conditions
Ta=25˚C, IF=12mA
Ta=25˚C, VR=5V
Ta=25˚C, V=0, f=1MHz
IF=0, IO=−20µA
MIN.
TYP. MAX.
Unit
V
Forward voltage
1.4
1.6
−
1.95
10
Reverse current
IR
−
µA
pF
Terminal capacitance
Ct
−
60
150
−
High level output voltage
Low level output voltage
Low level supply current
High level supply current
"High→Low" input threshold current
Isolation resistance
VOH
VOL
ICCL
ICCH
4
5
V
−
1.5
2.1
2.6
3.5
1011
0.6
100
14.0
11.0
6.0
−
mV
mA
mA
mA
Ω
IF=12mA, IO=20µA
IF=12mA
−
IF=0
−
IFHL
RISO
Cf
VO=2.5V
−
5×1010
−
Ta=25˚C, DC500V, 40 to 60%RH
Ta=25˚C, V=0V, f=1MHz
1.0
pF
Floating capacitance
"High→Low" propagation delay time
tPHL
tPLH
∆tW
TPSK
tr
20
13
0
27
35
8
60
60
30
40
−
"Low→High" propagation delay time
IF=12mA, CL=15pF
CMOS Logic level
tr=tf<1ns, Pulse width 100ns
Duty=50%
*5 Distortion of pulse width
Propagation delay skew
Rise time
ns
−
−
−
4
tf
−
Fall time
3
−
Instantaneous common mode rejection
voltage
Ta=25˚C, IF=0,
VCM=1.0kV(P-P)
CMH
CML
15
20
−
−
(High level output)
kV/µs
Instantaneous common mode rejection
voltage
(Low level output)
Ta=25˚C, IF=12mA,
VCM=1.0kV(P-P)
−15
−20
*4 It shall connect a by-pass capacitor of 0.01 µF or more between VCC (pin 6 ) and GND (pin 4 ) near the device.
when it measures the transfer characteristics and the output side characteristics.
*5 Distortion of pulse width ∆tw= | tPHL−tPLH
|
Sheet No.: D2-A04902EN
4
PC411L0NIP0F Series
■ Model Line-up
Taping
Package
3 000 pcs/reel
DIN EN60747-5-2
−−−−−−
Approved
Model No.
PC411L0NIP0F PC411L0YIP0F
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: D2-A04902EN
5
PC411L0NIP0F Series
Fig.1 Test Circuit for Propagation Delay Time and Rise Time, Fall Time
6
1
IF
0.1µF
tr=tf<1ns
V
CC=5V
Pulse width : 100ns
Duty 50%
Amp.
5
4
VO
CL
3
❈CL : Includes the probe and
wiring capacitance.
tPHL
tPLH
IF
50%
INPUT
IF
O
VOH
90%
OUTPUT
VO
2.5V CMOS
VOL
10%
tf
tr
Fig.2 Test Circuit for Instantaneous Common Mode Rejection Voltage
6
1
IF
SW
0.1µF
V
CC=5V
Amp.
B
A
5
4
VO
CL
3
+
−
VCM
❈CL : Includes the probe and wiring capacitance.
1kV
VCM
GND
VOH
CMH VO
SW at A, IF=OFF
∆VOH
∆VOL
VOL
CML VO
SW at B, IF=ON
GND
Sheet No.: D2-A04902EN
6
PC411L0NIP0F Series
Fig.4 Forward Current vs. Forward
Fig.3 Forward Current vs. Ambient
Temperature
Voltage
100
20
15
10
5
0˚C
10
1
Ta=85˚C
50˚C
−20˚C
−40˚C
25˚C
70
85
0
−40 −25
0.1
1
0
25
50
75
100
1.2
1.4
1.6
1.8
2
2.2
100
30
125
100
100
Forward voltage VF (V)
Ambient temperature Ta (°C)
Fig.5 Input Threshold Current vs.
Fig.6 High Level Supply Current vs.
Ambient Temperature
Ambient Temperature
6
6
VCC=5V
VCC=5V
5
4
3
2
5
4
3
2
1
0
1
0
−50
−25
0
25
50
75
−50
−25
0
25
50
75
Ambient temperature Ta (°C)
Ambient temperature Ta (°C)
Fig.7 Low Level Supply Current vs.
Ambient Temperature
Fig.8 Propagation Delay Time vs.
Input Current
6
50
VCC=5V, CL=15pF
Ta=25˚C
VCC=5V
IF=12mA
40
30
20
10
0
5
4
3
2
tPLH
tPHL
1
0
−10
−20
TW
−50
−25
0
25
50
75
0
5
10
15
20
25
Ambient temperature Ta (°C)
Input current (mA)
Sheet No.: D2-A04902EN
7
PC411L0NIP0F Series
Fig.10 Low Level Output Voltage vs.
Fig.9 High-Level Output Voltage vs.
Ambient Temperature
Ambient Temperature
3
6
IF=12mA
IO=20µA
VCC=5V
IF=0
IO=−20µA
VCC=5V
5.5
2.5
2
1.5
1
5
4.5
4
0.5
0
−50
−25
0
25
50
75
100
−50
−25
0
25
50
75
100
Ambient temperature Ta (°C)
Ambient temperature Ta (°C)
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D2-A04902EN
8
PC411L0NIP0F Series
■ Design Considerations
● Recommended operating conditions
Parameter
Forward current
Supply voltage
Symbol
IF
MIN.
10
TYP.
MAX.
16
Unit
mA
V
−
5
−
VCC
Topr
4.5
5.5
Operating temperature
−40
70
°C
● Notes about static electricity
Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute de-
sign.
When handling these devices, general countermeasure against static electricity should be taken to avoid
breakdown of devices or degradation of characteristics.
● Design guide
In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of
0.01µF or more between VCC and GND near the device.
In case that some sudden big noise caused by voltage variation is provided between primary and secondary
terminals of photocoupler some current caused by it is floating capacitance may be generated and result in
false operation since current may go through LED or current may change.
If the photocoupler may be used under the circumstances where noise will be generated we recommend to
use the bypass capacitors at the both ends of LED.
The detector which is used in this device, has parasitic diode between each pins and GND.
There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin
becomes below GND level even for instant.
Therefore it shall be recommended to design the circuit that electric potential of any pin does not become
below GND level.
This product is not designed against irradiation and incorporates non-coherent LED.
● Degradation
In general, the emission of the LED used in photocouplers will degrade over time.
In the case of long term operation, please take the general LED degradation (50% degradation over 5 years)
into the design consideration.
Please decide the input current which become 2 times of MAX. IFHL
.
● Recommended Foot Print (reference)
6.3
1.5
(Unit : mm)
✩
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A04902EN
9
PC411L0NIP0F Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
( package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
100
150 to 180˚C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 260˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A04902EN
10
PC411L0NIP0F Series
● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-
tual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated di-
phenyl ethers (PBDE).
Sheet No.: D2-A04902EN
11
PC411L0NIP0F Series
■ Package specification
● Tape and Reel package
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
E
D
G
J
I
M A X .
K
5 ˚
Dimensions List
(Unit : mm)
A
B
C
D
E
F
G
+0.1
12.0±0.3
5.5±0.1
1.75±0.1
8.0±0.1
2.0±0.1
4.0±0.1
φ1.5
−0
H
I
J
K
7.4±0.1
0.3±0.05
3.1±0.1
4.0±0.1
Reel structure and Dimensions
e
d
g
Dimensions List
(Unit : mm)
a
b
c
d
370
e
13.5±1.5
80±1.0
g
13±0.5
f
f
21±1.0
2.0±0.5
2.0±0.5
a
b
Direction of product insertion
Pull-out direction
[Packing : 3 000pcs/reel]
Sheet No.: D2-A04902EN
12
PC411L0NIP0F Series
■ Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems
related to any intellectual property right of a third party
resulting from the use of SHARP's devices.
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials,
structure, and other contents described herein at any
time without notice in order to improve design or
reliability. Manufacturing locations are also subject to
change without notice.
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in
whole or in part, without the express written permission
of SHARP. Express written permission is also required
before any use of this publication may be made by a
third party.
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
· Contact and consult with a SHARP representative if
there are any questions about the contents of this
publication.
[E229]
Sheet No.: D2-A04902EN
13
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