PC4H520NIP0F [SHARP]
Darlington Output Optocoupler, 1-Element, 2500V Isolation, ROHS COMPLIANT, PLASTIC, MINI-FLAT-4;
| 型号： | PC4H520NIP0F |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | Darlington Output Optocoupler, 1-Element, 2500V Isolation, ROHS COMPLIANT, PLASTIC, MINI-FLAT-4 输出元件 光电 |
| 文件： | 总12页 (文件大小：175K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PC4H520NIP0F
Mini-flat Half-pitch Package
PC4H520NIP0F
Darlington Phototransistor Output
High Collector-emitter Voltage
Photocoupler
■ Description
■ Agency approvals/Compliance
PC4H520NIP0F contains a IRED optically coupled
1. Recognized by UL1577 (Double protection isolation),
to a phototransistor.
file No. E64380 (as model No. PC4H52)
It is packaged in a 4-pin Mini-flat, Half pitch type.
Input-output isolation voltage(rms) is 2.5kV.
Collector-emitter voltage is 350V and CTR is MIN.
1000% at input current of 1mA.
2. Package resin : UL flammability grade (94V-0)
■ Applications
1. Modems
■ Features
1. 4-pin Mini-flat Half pitch package (Lead pitch :
1.27mm)
2. Double transfer mold package (Ideal for Flow
Soldering)
3. High collector-emitter voltage (VCEO : 350V)
4. Darlington phototransistor output (CTR : MIN.1000%
at IF=lmA,VCE=2V)
5. Isolation voltage between input and output (Viso(rms)
2.5kV)
:
6. Lead-free and RoHS directive compliant
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A02802EN
1
Date Jun. 30. 2005
© SHARP Corporation
PC4H520NIP0F
■ Internal Connection Diagram
1
3
4
5
Anode
1
2
4
3
Cathode
Emitter
Collector
(Unit : mm)
■ Outline Dimensions
SHARP mark "S"
Primary side mark
Date code
1
2
4
3
4 H 5 2
4.4±0.2
5.3±0.3
(1.7)
Epoxy resin
+0.4
0.5
−0.2
+0.2
7.0
−0.7
*( ) : Reference Dimensions
Product mass : approx. 0.05g
Plating material : SnCu (Cu : TYP. 2%)
Sheet No.: D2-A02802EN
2
PC4H520NIP0F
Date code (2 digit)
1st digit
2nd digit
Year of production
Month of production
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
Mark
P
Month
Mark
1
Mark
A
B
January
February
March
R
2
S
3
C
T
April
4
D
E
U
May
5
F
V
June
6
H
J
W
X
July
7
August
September
October
November
December
8
K
L
A
9
B
O
N
D
M
N
C
·
·
·
·
·
·
repeats in a 20 year cycle
Country of origin
Japan
Rank mark
There is no rank mark indicator.
Sheet No.: D2-A02802EN
3
PC4H520NIP0F
■ Absolute Maximum Ratings
(Ta=25˚C)
Unit
mA
A
Parameter
Symbol
IF
Rating
Forward current
50
*2 Peak forward current
IFM
1
Reverse voltage
VR
6
70
V
*1 Power dissipation
Collector-emitter voltage
Emitter-collector voltage
Collector current
P
mW
V
VCEO
VECO
IC
350
0.1
V
120
mA
mW
mW
˚C
*1
Collector power dissipation
PC
180
*1 Total power dissipation
Operating temperature
Storage temperature
*3 Isolation voltage
*4 Soldering temperature
Ptot
210
Topr
Tstg
Viso (rms)
Tsol
−40 to +100
−55 to +125
2.5
˚C
kV
260
˚C
*1 Mounted glass epoxy PCB (Size : 20mm×20mm×1.6mm)
*2 Pulse width≤100µs, Duty ratio : 0.001
*3 40 to 60%RH, AC for 1 minute, f=60Hz
*4 For 10s
■ Electro-optical Characteristics
(Ta=25˚C)
Parameter
Forward voltage
Symbol
VF
Conditions
MIN.
TYP.
1.2
−
MAX.
1.4
10
Unit
V
IF=10mA
VR=4V
−
Input Reverse current
Terminal capacitance
IR
−
µA
pF
µA
V
Ct
V=0, f=1kHz
−
30
250
200
−
Collector dark current
Output
ICEO
VCE=200V, IF=0
−
−
Collector-emitter breakdown voltage BVCEO
IC=0.1mA, IF=0
350
−
Current transfer ratio
IC
IF=1mA, VCE=2V
IF=20mA, IC=100mA
DC500V, 40 to 60%RH
V=0, f=1MHz
10
40
120
1.4
−
mA
V
Collector-emitter saturation voltage VCE (sat)
−
−
Isolation resistance
Floating capacitance
Cut-off frequency
RISO
Cf
fC
5×1010
1×1011
0.6
7
Ω
Transfer
charac-
teristics
−
1
−
−
1.0
−
pF
kHz
µs
VCE=2V, IC=20mA, RL=100Ω −3dB
Rise time
tr
100
20
300
100
Response time
VCE=2V, IC=20mA, RL=100Ω
Fall time
tf
µs
Sheet No.: D2-A02802EN
4
PC4H520NIP0F
Fig.1 Forward Current vs. Ambient
Temperature
Fig.2 Diode Power Dissipation vs. Ambient
Temperature
100
50
40
30
20
80
70
60
40
20
0
10
0
−40 −25
0
25
5055 75
100
125
−40 −25
0
25
5055 75
100
125
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.3 Collector Power Dissipation vs.
Fig.4 Total Power Dissipation vs. Ambient
Ambient Temperature
250
Temperature
250
210
200
200
180
150
150
100
100
50
0
50
0
−40 −25
0
25
50
75
100
125
−40 −25
0
25
50
75
100
125
Ambient temperature T (˚C)
Ambient temperature T (˚C)
a
a
Fig.5 Peak Forward Current vs. Duty Ratio
Fig.6 Forward Current vs. Forward Voltage
100
Pulse width≤100µs
Ta=25˚C
1 000
Ta=25˚C
10
Ta=0˚C
Ta=100˚C
Ta=−25˚C
Ta=75˚C
Ta=50˚C
100
1
10
0.1
10−3
10−2
Duty ratio
10−1
1
0
0.5
1
1.5
2
Forward voltage VF (V)
Sheet No.: D2-A02802EN
5
PC4H520NIP0F
Fig.7 Current Transfer Ratio vs. Forward
Fig.8 Collector Current vs. Collector-emitter
Current
10 000
Voltage
150
Ta=25˚C
VCE=2V
Ta=25˚C
PC (MAX)
9 000
8 000
7 000
6 000
5 000
4 000
3 000
2 000
IF=2.5mA
IF=2mA
100
IF=1.5mA
IF=1mA
IF=0.5mA
50
1 000
0
0
0
1
2
3
4
5
0.1
1
10
Forward current IF (mA)
Collector-emitter voltage VCE (V)
Fig.9 Collector Current vs. Forward Current
Fig.10 Relative Current Transfer Ratio vs.
Ambient Temperature
100
150
VCE=2V
IF=1mA
Ta=25˚C
VCE=2V
10
100
1
50
0
0.1
0.01
0.1
1
10
−40 −20
0
20
40
60
80
100
Ambient temperature Ta (˚C)
Forward current IF (mA)
Fig.11 Collector Dark Current vs. Ambient
Temperature
Fig.12 Collector Sayuration Voltage vs.
Ambient Temperature
10−5
2.5
VCE=200V
IF=20mA
IC=100mA
10−6
10−7
10−8
10−9
2
1.5
1
10−10
10−11
0.5
0
−40 −20
0
20
40
60
80
100
−50
−25
0
25
50
75
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Sheet No.: D2-A02802EN
6
PC4H520NIP0F
Fig.14 Test Circuit for Response Time
Fig.13 Response Time vs. Load Resistance
1 000
VCC
VCE=2V
IC=20mA
Ta=25˚C
Input
RL
Input
RD
Output
Output
tr
10%
90%
100
tf
VCE
td
ts
td
tr
tf
ts
10
Please refer to the conditions in Fig.13
1
0.01
0.1
1
10
Load resistance RL (kΩ)
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D2-A02802EN
7
PC4H520NIP0F
■ Design Considerations
● Design guide
While operating at IF<1.0mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
● Recommended Foot Print (reference)
6.3
1.5
(Unit : mm)
✩
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A02802EN
8
PC4H520NIP0F
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
( package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
100
150 to 180˚C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 260˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A02802EN
9
PC4H520NIP0F
● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
Sheet No.: D2-A02802EN
10
PC4H520NIP0F
■ Package specification
● Tape and Reel package
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
G
D
J
E
I
M A X .
5 ˚
L
K
Dimensions List
(Unit : mm)
A
B
C
D
E
F
G
+0.1
12.0±0.3
5.5±0.1
1.75±0.1
8.0±0.1
2.0±0.1
4.0±0.1
φ1.5
−0
H
I
J
K
L
+0.1
7.5±0.1
0.3±0.05
2.3±0.1
3.1±0.1
φ1.6
−0
Reel structure and Dimensions
e
d
g
Dimensions List
(Unit : mm)
a
b
c
d
330
e
13.5±1.5
100±1.0
13±0.5
f
g
f
23±1.0
2.0±0.5
2.0±0.5
a
b
Direction of product insertion
Pull-out direction
[Packing : 3 000pcs/reel]
Sheet No.: D2-A02802EN
11
PC4H520NIP0F
■ Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems
related to any intellectual property right of a third party
resulting from the use of SHARP's devices.
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials,
structure, and other contents described herein at any
time without notice in order to improve design or
reliability. Manufacturing locations are also subject to
change without notice.
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in
whole or in part, without the express written permission
of SHARP. Express written permission is also required
before any use of this publication may be made by a
third party.
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
· Contact and consult with a SHARP representative if
there are any questions about the contents of this
publication.
[E208]
Sheet No.: D2-A02802EN
12
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