PC4SF11YXZBF [SHARP]
Triac Output Optocoupler, 1-Element, 5000V Isolation, LEAD FREE, PLASTIC, SMT, DIP-6/5;
| 型号： | PC4SF11YXZBF |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | Triac Output Optocoupler, 1-Element, 5000V Isolation, LEAD FREE, PLASTIC, SMT, DIP-6/5 |
| 文件： | 总15页 (文件大小：899K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PC4SF11YVZ Series
VDRM : 800V, Reinforced insulation type
Non-zero cross type
DIP 6pin
PC4SF11YVZ
Series
Phototriac Coupler for triggering
∗Zero cross type is also available.
(PC4SF21YVZ Series)
■ Description
■ Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. 4SF11)
2. Approved by CSA, file No. CA95323 (as model No.
4SF11)
3. Approved by BSI : BS-EN60065, file No. 6690/BS-
EN60950, file No. 7421, (as model No. 4SF11)
4. Approved by SEMKO, EN60065/EN60950, file No.
0033029 (as model No. 4SF11)
PC4SF11YVZ Series reinforced insulation type
Phototriac Coupler include an infrared emitting diode
(IRED) optically coupled to an output Phototriac.
These devices feature full wave control and are
ideal isolated drivers for medium to high current Triacs.
DIP package provides 5.0kV isolation from input to
output with superior commutative noise immunity.
5. Approved by DEMKO, EN60065/EN60950, file No.
310107 (as model No. 4SF11)
■ Features
1. High repetitive peak off-state voltage (VDRM : 800V)
2. Non-zero crossing functionality
3. IFT ranks available (see Model Line-up section in this
datasheet)
4. 6 pin DIP package
5. Reinforced insulation type (MIN. 0.4mm internal
separation)
6. Approved by FIMKO, EN60065/EN60950, file No.
15795 (as model No. 4SF11)
(∗)
7. Approved by VDE (DIN EN 60747-5-2), file No.
40008189 (as model No. 4SF11)
8. Package resin : UL flammability grade (94V-0)
(∗) DIN EN60747-5-2 : successor standard of DIN VDE0884
Up to Date code "RD" (December 2003), approval of DIN
VDE0884.
From Date code "S1" (January 2004), approval of DIN
EN60747-5-2.
6. Double transfer mold construction (Ideal for Flow
Soldering)
7. High isolation voltage between input and output
(Viso(rms) : 5.0kV)
■ Applications
1. Triggering for Triacs used to switch on and off
devices which require AC Loads.
For example heaters, fans, motors, solenoids, and
valves.
2. Triggering for Triacs used for implementing phase
control in applications such as lighting control and
temperature control (HVAC).
3. AC line control in power supply applications.
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A08201FEN
1
Date Mar. 31. 2004
© SHARP Corporation
PC4SF11YVZ Series
■ Internal Connection Diagram
1
2
3
4
5
6
Anode
Cathode
NC
Anode/Cathode
No external connection
Cathode/Anode
1
6
2
5
3
4
(Unit : mm)
■ Outline Dimensions
1. Through-Hole [ex. PC4SF11YTZ]
2. Wide Through-Hole Lead-Form [ex. PC4SF11YVZ]
1.2±0.3
1.2±0.3
0.6±0.2
0.6±0.2
Model No.
Rank mark
6
4
5
Model No.
SHARP
mark
"S"
SHARP
mark
"S"
6
5
4
Rank mark
4 S F 1 1
4 S F 1 1
Anode
mark
4
Anode
mark
4
Date code (2 digit)
Date code (2 digit)
1
2
3
1
3
VDE
identification mark
Factory identification mark
2
VDE
Factory identification mark
7.62±0.3
7.12±0.5
7.62±0.3
identification mark
7.12±0.5
Epoxy resin
Epoxy resin
10.16±0.5
0.5±0.1
2.54±0.25
0.26±0.1
θ
θ
2.54±0.25
0.5±0.1
θ : 0 to 13˚
Product mass : approx. 0.35g
Product mass : approx. 0.35g
3. SMT Gullwing Lead-Form [ex. PC4SF11YXP]
4. Wide SMT Gullwing Lead-Form [ex. PC4SF11YWP]
0.6±0.2
1.2±0.3
1.2±0.3
0.6±0.2
Model No.
Rank mark
6
5
4
6
5
4
Model No.
Rank mark
SHARP
mark
"S"
SHARP
mark
"S"
4 S F 1 1
4 S F 1 1
Anode
mark
4
Anode
mark
4
Date code (2 digit)
Date code (2 digit)
1
2
3
1
2
3
Factory identification mark
7.62±0.3
VDE
identification mark
Factory identification mark
7.62±0.3
VDE
identification mark
7.12±0.5
7.12±0.5
Epoxy resin
10.16±0.5
12.0MAX.
2.54±0.25
2.54±0.25
Epoxy resin
+0.4
+0.4
0.75±0.25
0.75±0.25
1.0
1.0
−0
−0
+0
10.0
−0.5
Product mass : approx. 0.33g
Product mass : approx. 0.34g
5
∗Pin is not allowed external connection
Sheet No.: D2-A08201FEN
2
PC4SF11YVZ Series
Date code (2 digit)
1st digit
2nd digit
Year of production
Month of production
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
Mark
P
Month
Mark
1
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
Mark
A
B
January
February
March
R
2
S
3
C
T
April
4
D
E
U
May
5
V
June
6
F
July
H
J
W
X
7
August
September
October
November
December
8
K
L
A
9
B
O
N
D
M
N
C
·
·
·
·
·
·
repeats in a 20 year cycle
Factory identification mark
Factory identification Mark
Country of origin
no mark
Japan
Indonesia
Philippines
China
* This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see the actural status of the
production.
Rank mark
Refer to the Model Line-up table
Sheet No.: D2-A08201FEN
3
PC4SF11YVZ Series
■ Absolute Maximum Ratings
(Ta=25˚C)
Parameter
Symbol
IF
VR
Rating
50
Unit
mA
V
Forward current
Input
6
Reverse voltage
IT(rms)
Isurge
0.1
A
RMS ON-state current
Peak one cycle surge current
Repetitive peak OFF-state voltage
*3
Output
1.2
800
A
VDRM
Viso(rms)
Topr
V
*1 Isolation voltage
5.0
kV
˚C
˚C
˚C
−30 to +100
−55 to +125
270 *4
Operating temperature
Storage temperature
*2 Soldering temperature
Tstg
Soldering area
Tsol
*1 40 to 60%RH, AC for 1minute, f=60Hz
*2 For 10s
*3 f=50Hz sine wave
*4 Lead solder plating models: 260˚C
■ Electro-optical Characteristics
(Ta=25˚C)
Parameter
Symbol
VF
Conditions
MIN. TYP. MAX. Unit
−
−
1.2
−
1.4
10
3
V
µA
µA
V
IF=20mA
VR=3V
Forward voltage
Input
IR
Reverse current
IDRM
VT
VD=VDRM
IT=0.1A
VD=6V
−
−
Repentitive peak OFF-state current
−
−
2.5
3.5
−
ON-state voltage
Output
IH
0.1
50
−
−
mA
V/µs
Holding current
−
dV/dt
VD=1/√2 ·VDRM
Critical rate of rise of OFF-state voltage
Rank A
−
−
10
7
IFT
VD=6V, RL=100Ω
Minimum trigger current
mA
Transfer
charac-
teristics
−
−
Rank B
5
×
1010 1011
−
Ω
RISO
ton
DC500V,40 to 60%RH
Isolation resistance
Turn-on time
VD=6V, RL=100Ω, IF=20mA
−
−
100
µs
Sheet No.: D2-A08201FEN
4
PC4SF11YVZ Series
Model Line-up
Lead Form
Through-Hole
SMT Gullwing
Sleeve
Wide Through-Hole
Approved
I [mA]
FT
Shipping Package
50pcs/sleeve
(VD=6V,
Rank mark
RL=100Ω )
DIN
Approved
Approved
EN60747-5-2
MAX.10
MAX.7
PC4SF11YTZAF
PC4SF11YTZBF
PC4SF11YXZAF
PC4SF11YXZBF
PC4SF11YVZAF
PC4SF11YVZBF
A
B
Model No.
Lead Form
Wide SMT Gullwing
Sleeve
SMT Gullwing
Wide SMT Gullwing
Taping
1 000pcs/reel
I [mA]
FT
Shipping Package
50pcs/sleeve
(VD=6V,
Rank mark
RL=100Ω )
DIN
Approved
Approved
Approved
EN60747-5-2
MAX.10
MAX.7
PC4SF11YWZAF
PC4SF11YWZBF
PC4SF11YXPAF
PC4SF11YXPBF
PC4SF11YWPAF
PC4SF11YWPBF
A
B
Model No.
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: D2-A08201FEN
5
PC4SF11YVZ Series
Fig.2 RMS ON-state Current vs.
Fig.1 Forward Current vs. Ambient
Temperature
Ambient Temperature
175
70
150
125
100
75
60
50
40
30
20
50
25
0
10
0
−30
0
50
100
−30
0
50
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.3 Forward Current vs. Forward Voltage
Fig.4 Minimum Trigger Current vs.
Ambient Temperature
10
VD=6V
RL=100Ω
9
8
7
6
5
4
3
2
100
Ta=75˚C
50
50˚C
25˚C
0˚C
10
5
−25˚C
1
0
1
0.9
1
1.1
1.2
1.3
1.4
1.5
−40 −20
0
20
40
60
80
100
Forward voltage VF (V)
Ambient temperature T (˚C)
Fig.5 Relative Repetitive Peak OFF-state
Fig.6 ON-state Voltage vs.
Voltage vs. Ambient Temperature
Ambient Temperature
2
1.3
IT=100mA
1.9
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.2
1.1
1
0.9
0.8
0.7
1.1
1
−40 −20
−40 −20
0
20
40
60
80
100
0
20
40
60
80
100
Ambient Temperature Ta (˚C)
Ambient temperature Ta (˚C)
Sheet No.: D2-A08201FEN
6
PC4SF11YVZ Series
Fig.7 Holding Current vs.
Fig.8 Repetitive Peak OFF-state Current vs.
Ambient Temperature
Ambient Temperature
10−5
10
VD=800V
VD=6V
10−6
10−7
1
10−8
10−9
0.1
−40 −20
0
20
40
60
80
100
−40 −20
0
20
40
60
80 100 120
Ambient temperature Ta (˚C)
Ambient Temperature Ta (˚C)
Fig.9 Turn-on Time vs. Forward Current
1 000
VD=6V
RL=100Ω
100
10
1
10
100
Forward current IF (mA)
Remarks : Please be aware that all data in the graph are just for reference.
Sheet No.: D2-A08201FEN
7
PC4SF11YVZ Series
■ Design Considerations
● Design guide
In order for the Phototriac to turn off, the triggering current (IF) must be 0.1mA or less.
Please refrain from using these devices in a direct drive configuration.
These Phototriac Coupler are intended to be used as triggering device for main Triacs.
Please ensure that the output rating of these devices will be sufficient for triggering the main output Triac of
your choice. Failure to do may result in malfunctions.
In phase control applications or where the Phototriac Coupler is being by a pulse signal, please ensure that
the pulse width is a minimum of 1ms.
For designs that will experience excessive noise or sudden changes in load voltage, please include an
appropriate snubber circuit as shown in the below circuit.
Please keep in mind that Sharp Phototriac Couplers incorporate superor dV/dt ratings which can often
eliminate the need for a snubber circuit.
● Degradation
In general, the emission of the IRED used in Phototriac Couplers will degrade over time.
In the case where long term operation and / or constant extreme temperature fluctuations will be applied to
the devices, please allow for a worst case scenario of 50% degradation over 5years.
Therefore in order to maintain proper operation, a design implementing these Phototriac Couplers should
provide at least twice the minimum required triggering current from initial operation.
● Recommended Foot Print (reference)
SMT Gullwing Lead-form
Wide SMT Gullwing Lead-form
10.2
8.2
2.2
2.2
(Unit : mm)
Sheet No.: D2-A08201FEN
8
PC4SF11YVZ Series
● Standard Circuit (Medium/High Power Triac Drive Circuit)
PC4SF11YVZ
1
6
5
4
Load
AC Line
Triac
2
3
Note) Please add the snubber circuit according to a condition.
Any snubber or varistor used for the above mentioned scenarios should be located
as close to the main output triac as possible.
✩
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A08201FEN
9
PC4SF11YVZ Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
( package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
100
150 to 180˚C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A08201FEN
10
PC4SF11YVZ Series
● Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less.
Ultrasonic cleaning :
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
Sheet No.: D2-A08201FEN
11
PC4SF11YVZ Series
■ Package specification
● Sleeve package
1. Through-Hole or SMT Gullwing
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0
6.7
(Unit : mm)
2. Wide Through-Hole or Wide SMT Gullwing
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
15.0
6.35
(Unit : mm)
Sheet No.: D2-A08201FEN
12
PC4SF11YVZ Series
● Tape and Reel package
1. SMT Gullwing
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
J
F
D
G
I
E
K
Dimensions List
(Unit:mm)
A
B
C
D
E
F
G
+0.1
16.0±0.3
7.5±0.1
1.75±0.1
12.0±0.1
2.0±0.1
4.0±0.1
φ1.5
−0
H
I
J
K
10.4±0.1
0.4±0.05
4.2±0.1
7.8±0.1
Reel structure and Dimensions
e
d
g
Dimensions List
(Unit : mm)
a
b
c
d
330
e
23±1.0
17.5±1.5
100±1.0
13±0.5
f
f
g
b
2.0±0.5
2.0±0.5
a
Direction of product insertion
Pull-out direction
[Packing : 1 000pcs/reel]
Sheet No.: D2-A08201FEN
13
PC4SF11YVZ Series
2. Wide SMT Gullwing
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
D
J
G
C
I
E
K
Dimensions List
(Unit : mm)
A
B
C
D
E
F
G
+0.1
24.0±0.3
11.5±0.1
1.75±0.1
12.0±0.1
2.0±0.1
4.0±0.1
φ1.5
−0
H
I
J
K
12.2±0.1
0.4±0.05
4.15±0.1
7.6±0.1
Reel structure and Dimensions
e
d
g
Dimensions List
(Unit : mm)
a
b
c
d
330
e
23±1.0
25.5±1.5
100±1.0
13±0.5
f
g
f
b
2.0±0.5
2.0±0.5
a
Direction of product insertion
Pull-out direction
[Packing : 1 000pcs/reel]
Sheet No.: D2-A08201FEN
14
PC4SF11YVZ Series
■ Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems rela-
ted to any intellectual property right of a third party re-
sulting from the use of SHARP's devices.
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high lev-
el of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the spec-
ifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufac-
turing locations are also subject to change without no-
tice.
· If the SHARP devices listed in this publication fall with-
in the scope of strategic products described in the For-
eign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP de-
vices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means, elec-
tronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
Sheet No.: D2-A08201FEN
15
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