PC713V1NIZXFA [SHARP]
Transistor Output Optocoupler, 1-Element, 5000V Isolation,;
| 型号： | PC713V1NIZXFA |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | Transistor Output Optocoupler, 1-Element, 5000V Isolation, |
| 文件： | 总14页 (文件大小：232K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PC713VxNSZXF Series
DIP 6 pin Includes Base Terminal
Connection Photocoupler
PC713VxNSZXF
Series
■ Description
■ Agency approvals/Compliance
PC713VxNSZXF Series contains an IRED optically
1. Recognized by UL1577 (Double protection isolation),
coupled to a phototransistor.
It is packaged in a 6 pin DIP, available in SMT
gullwing lead-form option.
Input-output isolation voltage(rms) is 5.0kV.
Collector-emitter voltage is 80V and CTR is 50% to
600% at input current of 5mA.
file No. E64380 (as model No. PC713V)
2. Approved by VDE, DIN EN60747-5-2(∗) (as an
option), file No. 40008189 (as model No. PC713V)
3. Package resin : UL flammability grade (94V-0)
(∗)DIN EN60747-5-2 : successor standard of DIN VDE0884
■ Features
■ Applications
1. 6 pin DIP package
1. Home appliances
2. Double transfer mold package (Ideal for Flow
Soldering)
2. Programmable controllers
3. Personal computer peripherals
3. With base terminal
4. High collector-emitter voltage (VCEO:80V)
5. High isolation voltage between input and output
(Viso(rms) : 5.0kV)
6. Lead-free and RoHS directive compliant
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A04302EN
1
Date Jun. 30. 2005
© SHARP Corporation
PC713VxNSZXF Series
■ Internal Connection Diagram
1
2
3
4
5
6
Anode
Cathode
NC
1
6
5
4
2
3
Emitter
Collector
Base
(Unit : mm)
■ Outline Dimensions
1. Through-Hole [ex. PC713VxNSZXF]
2. Through-Hole (VDE option) [ex. PC713VxYSZXF]
1.2±0.3
1.2±0.3
0.6±0.2
0.6±0.2
VDE
Identification mark
Factory
identification mark
6
5
4
SHARP
mark
"S"
6
5
4
SHARP
mark
"S"
Factory
identification mark
P C 7 1 3 V
P C 7 1 3 V
Anode
mark
4
Anode
mark
Date code
Date code
1
2
3
1
2
3
7.12±0.3
7.12±0.5
7.62±0.3
7.62±0.3
Rank mark
Rank mark
Epoxy resin
Epoxy resin
0.5±0.1
0.5±0.1
2.54±0.25
2.54±0.25
θ
θ
θ
θ
θ : 0 to 13˚
θ : 0 to 13˚
Product mass : approx. 0.36g
Product mass : approx. 0.36g
3. SMT Gullwing Lead-Form [ex. PC713VxNIPXF]
4. SMT Gullwing Lead-Form (VDE option)
[ex. PC713VxYIPXF]
1.2±0.3
1.2±0.3
0.6±0.2
0.6±0.2
VDE
6
5
4
Factory
identification mark
6
5
4
Identification mark
SHARP
mark
"S"
SHARP
mark
"S"
Factory
P C 7 1 3 V
identification mark
P C 7 1 3 V
Anode
mark
4
Anode
mark
Date code
Date code
Rank mark
1
2
3
1
2
3
Rank mark
7.12±0.5
7.12±0.5
7.62±0.3
7.62±0.3
2.54±0.25
Epoxy resin
2.54±0.25
Epoxy resin
+0.4
+0.4
+0.4
+0.4
1.0
1.0
−0
−0
1.0
1.0
−0
−0
+0
+0
10.0
−0.5
10.0
−0.5
Product mass : approx. 0.35g
Product mass : approx. 0.35g
Plating material : SnCu (Cu : TYP. 2%)
Sheet No.: D2-A04302EN
2
PC713VxNSZXF Series
Date code (2 digit)
1st digit
2nd digit
Year of production
Month of production
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
Mark
P
Month
Mark
1
Mark
A
B
January
February
March
R
2
S
3
C
T
April
4
D
E
U
May
5
F
V
June
6
H
J
W
X
July
7
August
September
October
November
December
8
K
L
A
9
B
O
N
D
M
N
C
·
·
·
·
·
·
repeats in a 20 year cycle
Factory identification mark
Factory identification Mark
Country of origin
no mark
Japan
Indonesia
China
* This factory marking is for identification purpose only.
Please Contact the local SHARP sales reprsentative to see the actual status of
the production.
Rank mark
Refer to the Model Line-up
Sheet No.: D2-A04302EN
3
PC713VxNSZXF Series
■ Absolute Maximum Ratings
(Ta=25˚C)
Unit
mA
A
Parameter
Symbol
IF
Rating
Forward current
50
*1 Peak forward current
Reverse voltage
IFM
1
VR
6
V
Power dissipation
P
70
mW
V
Collector-emitter voltage
Emitter-collector voltage
Collector-base voltage
Emitter-base voltage
Collector current
VCEO
VECO
VCBO
VEBO
IC
80
6
V
80
V
6
V
50
150
mA
mW
mW
˚C
Collector power dissipation
Total power dissipation
Operating temperature
Storage temperature
*2 Isolation voltage
*3 Soldering temperature
PC
Ptot
170
Topr
Tstg
−25 to +100
−40 to +125
5
˚C
Viso (rms)
Tsol
kV
˚C
260
*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1minute, f=60Hz
*3 For 10s
■ Electro-optical Characteristics
(Ta=25˚C)
Parameter
Symbol
VF
Conditions
MIN.
TYP.
MAX.
1.4
3.0
10
250
100
−
Unit
V
Forward voltage
IF=20mA
IFM=0.5A
−
1.2
Peak forward voltage
Reverse current
VFM
IR
−
−
−
V
Input
VR=4V
−
µA
pF
nA
V
Terminal capacitance
Collector dark current
Ct
V=0, f=1kHz
−
30
−
ICEO
VCE=50V, IF=0
−
Collector-emitter breakdown voltage BVCEO
IC=0.1mA, IF=0
IE=10µA, IF=0
80
−
Output
Emitter-base breakdown voltage
Collector-base breakdown voltage
Current transfer ratio
BVEBO
BVCBO
IC
6
−
−
V
IC=0.1mA, IF=0
IF=5mA, VCE=5V
IF=20mA, IC=1mA
DC500V, 40 to 60%RH
V=0, f=1MHz
80
−
−
V
2.5
−
30
0.2
−
mA
V
Collector-emitter saturation voltage VCE (sat)
−
0.1
1×1011
0.6
80
4
Isolation resistance
Floating capacitance
Cut-off frequency
RISO
Cf
fC
5×1010
Ω
Transfer
charac-
teristics
−
−
−
−
1.0
−
pF
kHz
µs
µs
VCE=5V, IC=2mA, RL=100Ω −3dB
Rise time
tr
18
18
Response time
VCE=2V, IC=2mA, RL=100Ω
Fall time
tf
3
Sheet No.: D2-A04302EN
4
PC713VxNSZXF Series
■ Model Line-up
Lead Form
Through-Hole
SMT Gullwing
IC [mA]
Sleeve
50pcs / sleeve
Approved −−−−−−
Taping
1 000pcs / reel
−−−−−− Approved
(IF=5mA,
VCE=5V,
Ta=25˚C)
Package
Rank mark
DIN EN60747-5-2
Model No.
−−−−−−
Approved
2.5 to 30.0
4.0 to 8.0
PC713V0NSZXF PC713V0YSZXF PC713V0NIZXF PC713V0YIZXF PC713V0NIPXF PC713V0YIPXF with or without
PC713V1NSZXF PC713V1YSZXF PC713V1NIZXF PC713V1YIZXF PC713V1NIPXF PC713V1YIPXF
PC713V2NSZXF PC713V2YSZXF PC713V2NIZXF PC713V2YIZXF PC713V2NIPXF PC713V2YIPXF
PC713V3NSZXF PC713V3YSZXF PC713V3NIZXF PC713V3YIZXF PC713V3NIPXF PC713V3YIPXF
PC713V5NSZXF PC713V5YSZXF PC713V5NIZXF PC713V5YIZXF PC713V5NIPXF PC713V5YIPXF
PC713V6NSZXF PC713V6YSZXF PC713V6NIZXF PC713V6YIZXF PC713V6NIPXF PC713V6YIPXF
PC713V8NSZXF PC713V8YSZXF PC713V8NIZXF PC713V8YIZXF PC713V8NIPXF PC713V8YIPXF
A
B
6.5 to 13.0
10.0 to 20.0
4.0 to 13.0
6.5 to 20.0
4.0 to 20.0
C
A or B
B or C
A, B or C
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: D2-A04302EN
5
PC713VxNSZXF Series
Fig.1 Forward Current vs. Ambient
Fig.2 Diode Power Dissipation vs. Ambient
Temperature
Temperature
60
100
50
40
30
20
80
70
60
40
20
0
10
0
0
75
Ambient temperature Ta (˚C)
100
-25
25
50 55
125
−25
0
25
50 55 75
100
125
Ambient temperature Ta (˚C)
Fig.3 Collector Power Dissipation vs.
Fig.4 Total Power Dissipation vs. Ambient
Ambient Temperature
200
Temperature
250
200
150
170
150
100
50
0
100
50
0
−25
0
25
50
75
100
125
−25
0
25
50
75
100
125
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.5 Peak Forward Current vs. Duty Ratio
Fig.6 Forward Current vs. Forward Voltage
10
Ta=75˚C
Pulse width≤100µs
Ta=25˚C
50˚C
25˚C
100
0˚C
1
−25˚C
10
0.1
1
0.01
10−3
10−2
Duty ratio
10−1
1
0
0.5
1
1.5
2
2.5
3
3.5
Forward voltage VF (V)
Sheet No.: D2-A04302EN
6
PC713VxNSZXF Series
Fig.8 Collector Current vs. Collector-
Fig.7 Current Transfer Ratio vs. Forward
Current
emitter Voltage
30
200
RBE=∞
Ta=25˚C
IF=30mA
VCE=5V
Ta=25˚C
180
25
160
140
PC (MAX.)
20mA
20
120
RBE=∞
15
100
80
60
40
500kΩ
10mA
10
100kΩ
5mA
5
20
0
0
0
1
2
3
4
5
6
7
8
9
1
10
Forward current IF (mA)
Collector-emitter voltage VCE (V)
Fig.9 Relative Current Transfer Ratio vs.
Fig.10 Collector - emitter Saturation Voltage
Ambient Temperature
150
vs. Ambient Temperature
0.14
IF=20mA
IF=5mA
VCE=5V
RBE=∞
IC=1mA
RBE=∞
0.12
0.1
100
0.08
0.06
50
0
0.04
0.02
−25
0
20
40
60
80
100
−25
0
25
50
75
100
Ambient temperature Ta (˚C)
Ambient temperature Ta(˚C)
Fig.11 Collector Dark Current vs. Ambient
Fig.12 Collector-base Dark Current vs.
Ambient Temperature
Temperature
10−5
10−8
VCE=50V
VCB=50V
RBE=∞
RBE=∞
10−6
10−7
10−8
10−9
10−10
10−11
10−9
10−10
10−11
−25
0
25
50
75
100
0
25
50
75
100
125
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Sheet No.: D2-A04302EN
7
PC713VxNSZXF Series
Fig.13 Response Time vs. Load Resistance
Fig.14 Test Circuit for Response Time
VCE=2V RBE=∞
IC=2mA Ta=25˚C
Input
VCC
100
Output
Input
RD
RL
10%
90%
Output
VCE
tr
tf
10
td
ts
tr
tf
td
ts
1
Please refer to the conditions in Fig.13
0.1
0.1
1
10
Load resistance RL (kΩ)
Fig.15 Frequency Response
Fig.16 Test Circuit for Frequency Response
VCC
VCE=5V
IC=2mA
RBE=∞
0
RL
RD
Ta=25˚C
Output
VCE
100Ω
RL=10kΩ
1kΩ
−10
Please refer to the conditions in Fig.15
−20
1
10
100
Frequency f (kHz)
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D2-A04302EN
8
PC713VxNSZXF Series
■ Design Considerations
● Design guide
While operating at IF<1.0mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
● Recommended Foot Print (reference)
8.2
2.2
(Unit : mm)
✩
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A04302EN
9
PC713VxNSZXF Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
( package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
100
150 to 180˚C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A04302EN
10
PC713VxNSZXF Series
● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
Sheet No.: D2-A04302EN
11
PC713VxNSZXF Series
■ Package specification
● Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50 pcs. of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0
6.7
(Unit : mm)
Sheet No.: D2-A04302EN
12
PC713VxNSZXF Series
● Tape and Reel package
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
J
F
D
G
I
E
K
Dimensions List
(Unit:mm)
A
B
C
D
E
F
G
+0.1
16.0±0.3
7.5±0.1
1.75±0.1
12.0±0.1
2.0±0.1
4.0±0.1
φ1.5
−0
H
I
J
K
10.4±0.1
0.4±0.05
4.2±0.1
7.8±0.1
Reel structure and Dimensions
e
d
g
Dimensions List
(Unit : mm)
a
b
c
d
330
e
23±1.0
17.5±1.5
100±1.0
13±0.5
f
f
g
b
2.0±0.5
2.0±0.5
a
Direction of product insertion
Pull-out direction
[Packing : 1 000pcs/reel]
Sheet No.: D2-A04302EN
13
PC713VxNSZXF Series
■ Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems
related to any intellectual property right of a third party
resulting from the use of SHARP's devices.
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials,
structure, and other contents described herein at any
time without notice in order to improve design or
reliability. Manufacturing locations are also subject to
change without notice.
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in
whole or in part, without the express written permission
of SHARP. Express written permission is also required
before any use of this publication may be made by a
third party.
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
· Contact and consult with a SHARP representative if
there are any questions about the contents of this
publication.
[E218]
Sheet No.: D2-A04302EN
14
相关型号：
PC713V1YIZXF
Transistor Output Optocoupler, 1-Element, 5000V Isolation, ROHS COMPLIANT, PLASTIC, SMT, DIP-6
SHARP
PC713V2NIPXF
Transistor Output Optocoupler, 1-Element, 5000V Isolation, ROHS COMPLIANT, PLASTIC, SMT, DIP-6
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