PC714V5NSZXF [SHARP]
DIP 6 pin General Purpose Photocoupler; DIP 6针通用光电耦合器
| 型号： | PC714V5NSZXF |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | DIP 6 pin General Purpose Photocoupler |
| 文件： | 总13页 (文件大小：211K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PC714VxNSZXF Series
DIP 6 pin General Purpose
Photocoupler
PC714VxNSZXF
Series
■ Description
■ Agency approvals/Compliance
PC714VxNSZXF Series contains an IRED optically
1. Recognized by UL1577 (Double protection isolation),
coupled to a phototransistor.
file No. E64380 (as model No. PC714V)
It is packaged in a 6 pin DIP.
2. Approved by VDE, DIN EN60747-5-2(∗) (as an
option), file No. 40008189 (as model No. PC714V)
3. Package resin : UL flammability grade (94V-0)
Input-output isolation voltage(rms) is 5.0kV.
Collector-emitter voltage is 80V and CTR is 50% to
600% at input current of 5mA.
(∗)DIN EN60747-5-2 : successor standard of DIN VDE0884
■ Features
■ Applications
1. 6 pin DIP package
1. Home appliances
2. Double transfer mold package (Ideal for Flow
Soldering)
2. Programmable controllers
3. Personal computer peripherals
3. High collector-emitter voltage (VCEO:80V)
4. High isolation voltage between input and output
(Viso(rms) : 5.0kV)
5. Lead-free and RoHS directive compliant
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A04102EN
1
Date Jun. 30. 2005
© SHARP Corporation
PC714VxNSZXF Series
■ Internal Connection Diagram
1
2
3
4
5
6
Anode
Cathode
NC
1
6
5
4
2
3
Emitter
Collector
NC
(Unit : mm)
■ Outline Dimensions
1. Through-Hole [ex. PC714VxNSZXF]
2. Through-Hole (VDE option) [ex. PC714VxYSZXF]
1.2±0.3
1.2±0.3
0.6±0.2
0.6±0.2
VDE
Factory
identification mark
Identification mark
6
5
4
SHARP
mark
"S"
6
5
4
SHARP
mark
"S"
Factory
identification mark
P C 7 1 4 V
P C 7 1 4 V
Anode
mark
Anode
mark
4
Date code
Date code
1
2
3
1
2
3
7.12±0.3
7.12±0.5
7.62±0.3
7.62±0.3
Rank mark
Rank mark
Epoxy resin
Epoxy resin
0.5±0.1
0.5±0.1
2.54±0.25
2.54±0.25
θ
θ
θ
θ
θ : 0 to 13˚
θ : 0 to 13˚
Product mass : approx. 0.36g
Product mass : approx. 0.36g
Plating material : SnCu (Cu : TYP. 2%)
Sheet No.: D2-A04102EN
2
PC714VxNSZXF Series
Date code (2 digit)
1st digit
2nd digit
Year of production
Month of production
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
Mark
P
Month
Mark
1
Mark
A
B
January
February
March
R
2
S
3
C
T
April
4
D
E
U
May
5
F
V
June
6
H
J
W
X
July
7
August
September
October
November
December
8
K
L
A
9
B
O
N
D
M
N
C
·
·
·
·
·
·
repeats in a 20 year cycle
Factory identification mark
Factory identification Mark
Country of origin
no mark
Japan
Indonesia
China
* This factory marking is for identification purpose only.
Please Contact the local SHARP sales reprsentative to see the actual status of
the production.
Rank mark
Refer to the Model Line-up
Sheet No.: D2-A04102EN
3
PC714VxNSZXF Series
■ Absolute Maximum Ratings
(Ta=25˚C)
Unit
mA
A
Parameter
Symbol
IF
Rating
Forward current
50
*1 Peak forward current
Reverse voltage
IFM
1
VR
6
V
Power dissipation
P
70
mW
V
Collector-emitter voltage
Emitter-collector voltage
Collector current
VCEO
VECO
IC
80
6
V
50
150
mA
mW
mW
˚C
Collector power dissipation
Total power dissipation
Operating temperature
Storage temperature
*2 Isolation voltage
*3 Soldering temperature
PC
Ptot
170
Topr
Tstg
Viso (rms)
Tsol
−25 to +100
−40 to +125
5
˚C
kV
260
˚C
*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1minute, f=60Hz
*3 For 10s
■ Electro-optical Characteristics
(Ta=25˚C)
Parameter
Symbol
VF
Conditions
MIN.
TYP.
MAX.
1.4
3.0
10
Unit
V
Forward voltage
IF=20mA
IFM=0.5A
−
1.2
Peak forward voltage
Reverse current
VFM
IR
−
−
−
V
Input
VR=4V
−
µA
pF
nA
V
Terminal capacitance
Collector dark current
Ct
V=0, f=1kHz
−
30
−
250
100
−
ICEO
VCE=50V, IF=0
−
Output Collector-emitter breakdown voltage BVCEO
IC=0.1mA, IF=0
80
−
Emitter-collector breakdown voltage
BVECO
IC
IE=10µA, IF=0
6
−
−
V
Current transfer ratio
IF=5mA, VCE=5V
IF=20mA, IC=1mA
DC500V, 40 to 60%RH
V=0, f=1MHz
2.5
−
30.0
0.2
−
mA
V
Collector-emitter saturation voltage VCE (sat)
−
0.1
1×1011
0.6
80
4
Isolation resistance
Floating capacitance
Cut-off frequency
RISO
Cf
fC
5×1010
Ω
Transfer
charac-
teristics
−
−
−
−
1.0
−
pF
kHz
µs
µs
VCE=5V, IC=2mA, RL=100Ω −3dB
Rise time
tr
18
Response time
VCE=2V, IC=2mA, RL=100Ω
Fall time
tf
3
18
Sheet No.: D2-A04102EN
4
PC714VxNSZXF Series
■ Model Line-up
Lead Form
Through-Hole
Sleeve
IC [mA]
(IF=5mA, VCE=5V, Ta=25˚C)
Package
Rank mark
50pcs/sleeve
DIN EN60747-5-2
−−−−−−
Approved
PC714V0NSZXF PC714V0YSZXF with or without
2.5 to 30.0
4.0 to 8.0
PC714V1NSZXF PC714V1YSZXF
PC714V2NSZXF PC714V2YSZXF
PC714V3NSZXF PC714V3YSZXF
PC714V5NSZXF PC714V5YSZXF
PC714V6NSZXF PC714V6YSZXF
PC714V8NSZXF PC714V8YSZXF
A
B
6.5 to 13.0
10.0 to 20.0
4.0 to 13.0
6.5 to 20.0
4.0 to 20.0
Model No.
C
A or B
B or C
A, B or C
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: D2-A04102EN
5
PC714VxNSZXF Series
Fig.1 Forward Current vs. Ambient
Fig.2 Diode Power Dissipation vs. Ambient
Temperature
Temperature
60
100
50
40
30
20
80
70
60
40
20
0
10
0
0
75
Ambient temperature Ta (˚C)
100
-25
25
50 55
125
−25
0
25
50 55 75
100
125
Ambient temperature Ta (˚C)
Fig.3 Collector Power Dissipation vs.
Fig.4 Total Power Dissipation vs. Ambient
Ambient Temperature
200
Temperature
250
200
150
170
150
100
50
0
100
50
0
−25
0
25
50
75
100
125
−25
0
25
50
75
100
125
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.6 Forward Current vs. Forward Voltage
Fig.5 Peak Forward Current vs. Duty Ratio
10
Ta=75˚C
Pulse width≤100µs
Ta=25˚C
50˚C
25˚C
100
0˚C
1
−25˚C
10
0.1
1
10−3
10−2
Duty ratio
10−1
1
0.01
0
0.5
1
1.5
2
2.5
3
3.5
Forward voltage VF (V)
Sheet No.: D2-A04102EN
6
PC714VxNSZXF Series
Fig.8 Collector Current vs. Collector-
Fig.7 Current Transfer Ratio vs. Forward
Current
emitter Voltage
30
200
IF=30mA
VCE=5V
Ta=25˚C
Ta=25˚C
C (MAX.)
180
25
160
140
120
100
80
P
20mA
20
15
10mA
10
60
5mA
40
5
20
0
0
0
1
2
3
4
5
6
7
8
9
1
10
Collector-emitter voltage VCE (V)
Forward current IF (mA)
Fig.9 Relative Current Transfer Ratio vs.
Fig.10 Collector - emitter Saturation Voltage
vs. Ambient Temperature
Ambient Temperature
150
0.14
IF=20mA
IC=1mA
0.12
IF=5mA
VCE=5V
100
0.1
0.08
0.06
50
0
0.04
0.02
−25
0
20
40
60
80
100
−25
0
25
50
75
100
Ambient temperature Ta (˚C)
Ambient temperature Ta(˚C)
Fig.11 Collector Dark Current vs. Ambient
Fig.12 Response Time vs. Load Resistance
Temperature
10−5
VCE=2V Ta=25˚C
VCE=50V
IC=2mA
10−6
100
10−7
10−8
tr
tf
10
td
10−9
10−10
10−11
ts
1
0.1
0.1
1
10
−25
0
25
50
75
100
Load resistance RL (kΩ)
Ambient temperature Ta (˚C)
Sheet No.: D2-A04102EN
7
PC714VxNSZXF Series
Fig.14 Frequency Response
Fig.13 Test Circuit for Response Time
VCE=5V
IC=2mA
Ta=25˚C
Input
VCC
0
−10
−20
Output
Input
RD
RL
10%
90%
Output
VCE
100Ω
RL=10kΩ
1kΩ
td
ts
tr
tf
Please refer to the conditions in Fig.12
1
10
Frequency f (kHz)
100
Fig.15 Test Circuit for Frequency Response
VCC
RL
RD
Output
VCE
Please refer to the conditions in Fig.14
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D2-A04102EN
8
PC714VxNSZXF Series
■ Design Considerations
● Design guide
While operating at IF<1.0mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
✩
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A04102EN
9
PC714VxNSZXF Series
■ Manufacturing Guidelines
● Soldering Method
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A04102EN
10
PC714VxNSZXF Series
● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
Sheet No.: D2-A04102EN
11
PC714VxNSZXF Series
■ Package specification
● Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50 pcs. of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabbed stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0
6.7
(Unit : mm)
Sheet No.: D2-A04102EN
12
PC714VxNSZXF Series
■ Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems
related to any intellectual property right of a third party
resulting from the use of SHARP's devices.
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials,
structure, and other contents described herein at any
time without notice in order to improve design or
reliability. Manufacturing locations are also subject to
change without notice.
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in
whole or in part, without the express written permission
of SHARP. Express written permission is also required
before any use of this publication may be made by a
third party.
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
· Contact and consult with a SHARP representative if
there are any questions about the contents of this
publication.
[E219]
Sheet No.: D2-A04102EN
13
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