PC715V0NSZXF [SHARP]
Darlington Output Optocoupler, 1-Element, 5000V Isolation, ROHS COMPLIANT, PLASTIC, DIP-6;
| 型号： | PC715V0NSZXF |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | Darlington Output Optocoupler, 1-Element, 5000V Isolation, ROHS COMPLIANT, PLASTIC, DIP-6 输出元件 光电 |
| 文件： | 总13页 (文件大小：332K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PC715V0NSZXF Series
DIP 6 pin Darlington Phototransistor
Output Photocoupler
PC715V0NSZXF
Series
■ Description
■ Agency approvals/Compliance
PC715V0NSZXF Series contains an IRED optically
1. Recognized by UL1577 (Double protection isolation),
coupled to a phototransistor.
file No. E64380 (as model No. PC715V)
It is packaged in a 6 pin DIP.
Input-output isolation voltage(rms) is 5.0kV.
CTR is MIN. 600% at input current of 1mA.
2. Approved by VDE, DIN EN60747-5-2(∗) (as an
option), file No. 40008565 (as model No. PC715V)
3. Package resin : UL flammability grade (94V-0)
(∗)DIN EN60747-5-2 : successor standard of DIN VDE0884
■ Features
1. 6 pin DIP package
2. Double transfer mold package (Ideal for Flow
Soldering)
■ Applications
1. Home appliances
2. Programmable controllers
3. Personal computer peripherals
3. Darlington phototransistor output (CTR : MIN. 600%
at IF=1mA, VCE=2V)
4. High isolation voltage between input and output
(Viso(rms) : 5.0kV)
5. RoHS directive compliant
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A04402FEN
1
Date Jun. 30. 2005
© SHARP Corporation
PC715V0NSZXF Series
■ Internal Connection Diagram
1
2
3
4
5
6
Anode
Cathode
NC
1
2
3
6
5
4
Emitter
Collector
NC
■ Outline Dimensions
(Unit : mm)
1. Through-Hole [ex. PC715V0NSZXF]
2. Through-Hole (VDE option) [ex. PC715V0YSZXF]
1.2±0.3
1.2±0.3
0.6±0.2
0.6±0.2
VDE
Identification mark
Factory
identification mark
6
5
4
SHARP
mark
"S"
6
5
4
SHARP
mark
"S"
Factory
identification mark
P C 7 1 5 V
P C 7 1 5 V
Anode
mark
Anode
mark
4
Date code
Date code
1
2
3
1
2
3
7.12±0.5
7.12±0.3
7.62±0.3
7.62±0.3
Epoxy resin
Epoxy resin
0.5±0.1
0.5±0.1
2.54±0.25
2.54±0.25
θ
θ
θ
θ
θ : 0 to 13˚
θ : 0 to 13˚
Product mass : approx. 0.36g
Product mass : approx. 0.36g
Plating material : SnCu (Cu : TYP. 2%)
Sheet No.: D2-A04402FEN
2
PC715V0NSZXF Series
Date code (2 digit)
1st digit
2nd digit
Year of production
Month of production
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
Mark
P
Month
Mark
1
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
Mark
A
B
January
February
March
R
2
S
3
C
T
April
4
D
E
U
May
5
V
June
6
F
July
H
J
W
X
7
August
September
October
November
December
8
K
L
A
9
B
O
N
D
M
N
C
·
·
·
·
·
·
repeats in a 20 year cycle
Factory identification mark
Factory identification Mark
Country of origin
no mark
Japan
Indonesia
China
* This factory marking is for identification purpose only.
Please Contact the local SHARP sales reprsentative to see the actual status of
the production.
Rank mark
There is no rank mark indicator.
Sheet No.: D2-A04402FEN
3
PC715V0NSZXF Series
■ Absolute Maximum Ratings
(Ta=25˚C)
Unit
mA
A
Parameter
Symbol
IF
Rating
Forward current
50
*1 Peak forward current
Reverse voltage
IFM
1
VR
6
V
Power dissipation
P
70
mW
V
Collector-emitter voltage
Emitter-collector voltage
Collector current
VCEO
VECO
IC
35
6
V
80
150
mA
mW
mW
˚C
Collector power dissipation
Total power dissipation
Operating temperature
Storage temperature
*2 Isolation voltage
*3 Soldering temperature
PC
Ptot
170
Topr
Tstg
Viso (rms)
Tsol
−25 to +100
−40 to +125
5
˚C
kV
260
˚C
*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1minute, f=60Hz
*3 For 10s
■ Electro-optical Characteristics
(Ta=25˚C)
Parameter
Symbol
VF
Conditions
MIN.
TYP.
1.2
−
MAX.
1.4
3.0
10
Unit
V
Forward voltage
IF=10mA
IFM=0.5V
−
Peak forward voltage
Reverse current
VFM
IR
−
V
Input
VR=4V
−
−
µA
pF
nA
V
Terminal capacitance
Collector dark current
Ct
V=0, f=1kHz
−
30
−
250
1 000
−
ICEO
VCE=10V, IF=0
−
Output Collector-emitter breakdown voltage BVCEO
IC=0.1mA, IF=0
35
−
Emitter-collector breakdown voltage
BVECO
IC
IE=10µA, IF=0
6
−
−
V
Current transfer ratio
IF=1mA, VCE=2V
IF=20mA, IC=5mA
DC500V, 40 to 60%RH
V=0, f=1MHz
6.0
16.0
−
1×1011
0.6
6
75.0
1.0
−
mA
V
Collector-emitter saturation voltage VCE (sat)
−
Isolation resistance
Floating capacitance
Cut-off frequency
RISO
Cf
fC
5×1010
Ω
Transfer
charac-
teristics
−
−
−
−
1.0
−
pF
kHz
µs
µs
VCE=2V, IC=2mA, RL=100Ω −3dB
Rise time
tr
60
53
250
250
Response time
VCE=2V, IC=10mA, RL=100Ω
Fall time
tf
Sheet No.: D2-A04402FEN
4
PC715V0NSZXF Series
■ Model Line-up
Lead Form
Through-Hole
Sleeve
Package
50pcs/sleeve
DIN EN60747-5-2
−−−−−−
Approved
Model No.
PC715V0NSZXF PC715V0YSZXF
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: D2-A04402FEN
5
PC715V0NSZXF Series
Fig.1 Forward Current vs. Ambient
Fig.2 Diode Power Dissipation vs. Ambient
Temperature
Temperature
60
100
50
40
30
20
80
70
60
40
20
0
10
0
−25
0
25
5055
75
100
125
−25
0
25
50 55 75
100
125
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.3 Collector Power Dissipation vs.
Fig.4 Total Power Dissipation vs. Ambient
Ambient Temperature
Temperature
250
200
200
150
170
150
100
50
0
100
50
0
−25
0
25
50
75
100
125
−25
0
25
50
75
100
125
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.5 Peak Forward Current vs. Duty Ratio
Fig.6 Forward Current vs. Forward Voltage
10
Ta=75˚C
Pulse width≤100µs
Ta=25˚C
50˚C
25˚C
0˚C
100
1
−25˚C
10
0.1
1
0.01
10−3
10−2
Duty ratio
10−1
1
0
0.5
1
1.5
2
2.5
3
3.5
Forward voltage VF (V)
Sheet No.: D2-A04402FEN
6
PC715V0NSZXF Series
Fig.8 Collector Current vs. Collector-
Fig.7 Current Transfer Ratio vs. Forward
emitter Voltage
Current
16
2 000
Ta=25˚C
IF=1mA
VCE=2V
Ta=25˚C
1 800
0.9mA
0.8mA
14
12
10
8
PC(MAX.)
1 600
1 400
1 200
1 000
800
0.7mA
0.6mA
0.5mA
0.4mA
6
600
4
400
0.3mA
0.2mA
2
0
200
0
0.1mA
0
1
2
3
4
5
6
7
8
9
10 11 12 13
0.1
1
10
Collector-emitter voltage VCE (V)
Forward current IF (mA)
Fig.9 Collector Current vs. Collector-
Fig.10 Relative Current Transfer Ratio vs.
emitter Voltage
100
Ambient Temperature
150
Ta=25˚C
90
80
70
60
50
40
30
20
IF=1mA
VCE=2V
100
IF=10mA
PC (MAX.)
5mA
2mA
50
0
1mA
10
0
0
1
2
3
4
5
−25
0
25
50
75
100
Collector-emitter voltage VCE (V)
Ambient temperature Ta (˚C)
Fig.11 Collector - emitter Saturation Voltage
vs. Ambient Temperature
Fig.12 Collector Dark Current vs. Ambient
Temperature
1
10−5
VCE=10V
IF=20mA
IC=5mA
10−6
10−7
10−8
10−9
0.8
0.6
0.4
0.2
0
10−10
10−11
−25
0
25
50
75
100
0
25
Ambient temperature Ta (˚C)
−25
50
75
100
Ambient temperature Ta (˚C)
Sheet No.: D2-A04402FEN
7
PC715V0NSZXF Series
Fig.13 Response Time vs. Load Resistance
Fig.14 Test Circuit for Response Time
VCE=2V
IC=10mA
Ta=25˚C
VCC
Input
1 000
Output
RL
RD
Input
Output
VCE
10%
90%
tr
tf
tr
100
td
tr
ts
td
10
Please refer to the conditions in Fig.13
ts
1
0.01
0.1
1
10
Load resistance RL (kΩ)
Fig.15 Frequency Response
Fig.16 Test Circuit for Frequency Response
10
VCC
VCE=2V
IC=2mA
Ta=25˚C
RL
0
Output
VCE
RD
1kΩ
100Ω
RL=10kΩ
−10
−20
Please refer to the conditions in Fig.15
1
0.01
0.1
10
100
Frequency f (kHz)
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D2-A04402FEN
8
PC715V0NSZXF Series
■ Design Considerations
● Design guide
While operating at IF<1.0mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
✩
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A04402FEN
9
PC715V0NSZXF Series
■ Manufacturing Guidelines
● Soldering Method
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A04402FEN
10
PC715V0NSZXF Series
● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
Sheet No.: D2-A04402FEN
11
PC715V0NSZXF Series
■ Package specification
● Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50 pcs. of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0
6.7
(Unit : mm)
Sheet No.: D2-A04402FEN
12
PC715V0NSZXF Series
■ Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems rela-
ted to any intellectual property right of a third party re-
sulting from the use of SHARP's devices.
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high lev-
el of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the spec-
ifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufac-
turing locations are also subject to change without no-
tice.
· If the SHARP devices listed in this publication fall with-
in the scope of strategic products described in the For-
eign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP de-
vices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means, elec-
tronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
[E220]
Sheet No.: D2-A04402FEN
13
相关型号：
PC715V0YSZXF
Darlington Output Optocoupler, 1-Element, 5000V Isolation, ROHS COMPLIANT, PLASTIC, DIP-6
SHARP
©2020 ICPDF网 联系我们和版权申明