PC814X1YJ00F [SHARP]
DIP 4pin AC Input Photocoupler; DIP 4PIN AC输入光耦合器
| 型号： | PC814X1YJ00F |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | DIP 4pin AC Input Photocoupler |
| 文件： | 总14页 (文件大小：272K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PC814XJ0000F Series
DIP 4pin
AC Input Photocoupler
PC814XJ0000F
Series
∗4-channel package type is also available.
(model No. PC844XJ0000F Series)
■ Description
PC814XJ0000F Series contains an IRED optically
coupled to a phototransistor.
■ Agency approvals/Compliance
1. Recognized by UL1577, file No. E64380 (as model
No. PC814)
It is packaged in a 4pin DIP, available in SMT gullw-
ing lead-form option.
Input-output isolation voltage(rms) is 5.0kV.
Collector-emitter voltage is 80V and CTR is 20% to
300% at input current of ±1mA.
2. Approved by VDE (DIN EN60747-5-2(∗)) (as an op-
tion), file No. 40008087 (as model No. PC814)
3. Package resin : UL flammability grade (94V-0)
(∗)DIN EN60747-5-2 : successor standard of DIN VDE0884
■ Features
■ Applications
1. 4pin DIP package
1. Programmable controllers
2. Double transfer mold package (Ideal for Flow Solder-
ing)
2. Telephone sets, telephone exchangers
3. System appliances
3. AC input type
4. Signal transmission between circuits of different po-
tentials and impedances
4. High collector-emitter voltage (VCEO : 80V)
5. Current transfer ratio (CTR : MIN. 20% at IF=±1mA,
VCE=5V)
6. High isolation voltage between input and output
(Viso(rms) : 5.0 kV)
7. Lead-free and RoHS directive compliant
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A03503EN
1
Date Sep. 1. 2006
© SHARP Corporation
PC814XJ0000F Series
■ Internal Connection Diagram
1
2
3
4
Anode/Cathode
Cathode/Anode
Emitter
1
2
4
3
Collector
(Unit : mm)
■ Outline Dimensions
1. Through-Hole [ex. PC814XJ0000F]
2. Through-Hole (VDE option) [ex. PC814XNYJ00F]
Rank mark
Rank mark
Primary side mark
Primary side mark
Factory identification mark
Factory identification mark
Date code
Date code
1
2
4
3
1
2
4
3
P C 8 1 4
4
P C 8 1 4
6.5±0.5
SHARP mark "S"
6.5±0.5
VDE
Indenfication mark
7.62±0.30
4.58±0.50
7.62±0.30
4.58±0.50
Epoxy resin
Epoxy resin
0.26±0.10
0.5±0.1
0.26±0.10
0.5±0.1
θ
θ
θ
θ
θ : 0 to 13˚
θ : 0 to 13˚
Product mass : approx. 0.23g
Product mass : approx. 0.23g
3. SMT Gullwing Lead-Form [ex. PC814XPJ000F]
Primary side
mark
Rank mark
Factory identification mark
Date code
4
1
2
3
P C 8 1 4
6.5±0.5
4.58±0.50
7.62±0.30
Epoxy resin
2.54±0.25
+0.4
+0.4
1.0
1.0
−0.0
−0.0
+0.0
10.0
−0.5
Product mass : approx. 0.22g
Plating material : SnCu (Cu : TYP. 2%)
Sheet No.: D2-A03503EN
2
PC814XJ0000F Series
Date code (2 digit)
1st digit
2nd digit
Year of production
Month of production
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
Mark
P
Month
Mark
1
Mark
A
B
January
February
March
R
2
S
3
C
T
April
4
D
E
U
May
5
F
V
June
6
H
J
W
X
July
7
August
September
October
November
December
8
K
L
A
9
B
O
N
D
M
N
C
·
·
·
·
·
·
repeats in a 20 year cycle
Factory identification mark
Factory identification Mark
Country of origin
no mark
Japan
Indonesia
Philippines
China
* This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see
the actual status of the production.
Rank mark
Refer to the Model Line-up table
Sheet No.: D2-A03503EN
3
PC814XJ0000F Series
■ Absolute Maximum Ratings
(Ta=25˚C)
Unit
mA
A
Parameter
Symbol
IF
Rating
Forward current
±50
*1 Peak forward current
IFM
±1
Power dissipation
P
70
mW
V
Collector-emitter voltage
Emitter-collector voltage
Collector current
VCEO
VECO
IC
80
6
50
V
mA
mW
mW
kV
Collector power dissipation
Total power dissipation
*2 Isolation voltage
Operating temperature
Storage temperature
*3 Soldering temperature
PC
150
Ptot
200
Viso (rms)
Topr
Tstg
5.0
−30 to +100
−55 to +125
260
˚C
˚C
Tsol
˚C
*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1 minute, f=60Hz
*3 For 10s
■ Electro-optical Characteristics
(Ta=25˚C)
Parameter
Symbol
VF
Conditions
MIN.
TYP.
MAX.
1.4
3.0
250
100
−
Unit
V
Forward voltage
IF=±20mA
IFM=±0.5A
−
1.2
Input Peak forward voltage
Terminal capacitance
Collector dark current
Output Collector-emitter breakdown voltage
Emitter-collector breakdown voltage
Collector current
VFM
Ct
−
−
30
−
V
V=0, f=1kHz
−
pF
nA
V
ICEO
VCE=50V, IF=0
−
80
6
BVCEO
BVECO
IC
IC=0.1mA, IF=0
−
IE=10µA, IF=0
−
−
V
IF=±1mA, VCE=5V
IF=±20mA, IC=1mA
DC500V, 40 to 60%RH
V=0, f=1MHz
0.2
−
3.0
0.2
−
mA
V
Collector-emitter saturation voltage VCE (sat)
−
0.1
1×1011
0.6
80
4
Isolation resistance
Floating capacitance
Cutt-off frequency
RISO
Cf
fC
5×1010
−
Ω
Transfer
charac-
teristics
1.0
−
pF
kHz
µs
µs
VCE=5V, IC=2mA, RL=100Ω, −3dB
15
−
Rise time
tr
18
Response time
VCE=2V, IC=2mA, RL=100Ω
Fall time
tf
−
3
18
Sheet No.: D2-A03503EN
4
PC814XJ0000F Series
■ Model Line-up
Lead Form
Through-Hole
Sleeve
SMT Gullwing
Taping
IC [mA]
(IF=±1mA, VCE=5V, Ta=25˚C)
Package
Rank mark
100pcs/sleeve
2 000pcs/reel
DIN EN60747-5-2
−−−−−−
Approved
−−−−−−
PC814XJ0000F PC814XNYJ00F PC814XPJ000F
PC814X1J000F PC814X1YJ00F PC814XP1J00F
with or without
A
0.2 to 3.0
0.5 to 1.5
Model No.
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: D2-A03503EN
5
PC814XJ0000F Series
Fig.2 Diode Power Dissipation vs.
Fig.1 Forward Current vs. Ambient
Temperature
Ambient Temperature
100
50
40
30
20
80
70
60
40
20
0
10
0
−30
0
25
50 55 75
100
125
−30
0
25
50 55 75
100
125
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.3 Collector Power Dissipation vs.
Fig.4 Total Power Dissipation vs. Ambient
Ambient Temperature
250
Temperature
250
200
150
100
200
150
100
50
0
50
0
−30
0
25
50
75
100
125
−30
0
25
50
75
100
125
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.5 Peak Forward Current vs. Duty Ratio
Fig.6 Forward Current vs. Forward Voltage
10 000
Pulse width≤100µs
Ta=25˚C
−25˚C
0˚C
Ta=75˚C
50˚C
100
25˚C
1 000
100
10
1
10
10−3
10−2
Duty ratio
10−1
1
0
0.5
1.0
1.5
2.0
2.5
3.0
Forward voltage VF (V)
Sheet No.: D2-A03503EN
6
PC814XJ0000F Series
Fig.7 Current Transfer Ratio vs. Forward
Current
Fig.8 Collector Current vs. Collector-emitter
Voltage
140
Ta=25˚C
VCE=5V
30mA
=
IF
30
Ta=25˚C
120
PC (MAX.)
100
80
20mA
20
60
10mA
5mA
10
0
40
20
0
1mA
4
0.1
1
10
0
2
6
8
10
Forward current IF (mA)
Collector-emitter voltage VCE (V)
Fig.9 Relative Current Transfer Ratio vs.
Ambient Temperature
Fig.10 Collector - emitter Saturation Voltage
vs. Ambient Temperature
0.1
150
IF=1mA
VCE=5V
IF=20mA
0.09
IC=1mA
0.08
0.07
0.06
0.05
0.04
0.03
0.02
100
50
0
0.01
0
−30
0
25
50
75
100
−30
0
20
40
60
80
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.11 Collector Dark Current vs. Ambient
Temperature
Fig.12 Collector-emitter Saturation Voltage
vs. Forward Current
10−5
Ta=25˚C
VCE=50V
6
IC=0.5mA
10−6
10−7
10−8
10−9
5
4
3
2
1mA
3mA
5mA
7mA
10−10
10−11
1
0
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15
−30
0
20
40
60
80
100
Forward current IF (mA)
Ambient temperature Ta (˚C)
Sheet No.: D2-A03503EN
7
PC814XJ0000F Series
Fig.13 Response Time vs. Load Resistance
Fig.14 Test Circuit for Response Time
VCE=2V
IC=2mA
Ta=25˚C
Input
VCC
100
Output
tr
RL
Input
Output
VCE
10%
90%
tf
RD
tf
10
td
ts
tr
td
ts
Please refer to the conditions in Fig.13.
1
0.1
0.01
0.1
1
10
Load resistance RL (kΩ)
Fig.15 Frequency Response
Fig.16 Test Circuit for Frequency Response
VCC
VCE=5V
IC=2mA
Ta=25˚C
RL
RD
0
Output
VCE
−5
Please refer to the conditions in Fig.15.
RL=10kΩ
1kΩ
100Ω
−10
−15
−20
1
10
Frequency f (kHz)
100
1 000
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D2-A03503EN
8
PC814XJ0000F Series
■ Design Considerations
● Design guide
While operating at IF<1.0mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5years)
into the design consideration.
● Recommended Foot Print (reference)
8.2
2.2
(Unit : mm)
✩
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A03503EN
9
PC814XJ0000F Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
( package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
100
150 to 180˚C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A03503EN
10
PC814XJ0000F Series
● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-
tual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBB and PBDE are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive.
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated di-
phenyl ethers (PBDE).
Sheet No.: D2-A03503EN
11
PC814XJ0000F Series
■ Package specification
● Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its primary side mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0
6.7
(Unit : mm)
Sheet No.: D2-A03503EN
12
PC814XJ0000F Series
● Tape and Reel package
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
D
J
G
E
I
K
Dimensions List
(Unit : mm)
A
B
C
D
E
F
G
+0.1
16.0±0.3
7.5±0.1
1.75±0.10
8.0±0.1
2.0±0.1
4.0±0.1
φ1.5
−0.0
H
I
J
K
10.4±0.1 0.40±0.05
4.2±0.1
5.1±0.1
Reel structure and Dimensions
e
d
g
Dimensions List
(Unit : mm)
a
b
c
d
φ330
17.5±1.5 φ100.0±1.0 φ13.0±0.5
f
e
f
g
b
φ23.0±1.0
2.0±0.5
2.0±0.5
a
Direction of product insertion
Pull-out direction
[Packing : 2 000pcs/reel]
Sheet No.: D2-A03503EN
13
PC814XJ0000F Series
■ Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems rela-
ted to any intellectual property right of a third party re-
sulting from the use of SHARP's devices.
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high lev-
el of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the spec-
ifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufac-
turing locations are also subject to change without no-
tice.
· If the SHARP devices listed in this publication fall with-
in the scope of strategic products described in the For-
eign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP de-
vices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means, elec-
tronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
Sheet No.: D2-A03503EN
[E188]
14
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