PC815XYJ000F [SHARP]
Transistor Output Optocoupler, 1-Element, 5000V Isolation,;
| 型号： | PC815XYJ000F |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | Transistor Output Optocoupler, 1-Element, 5000V Isolation, 输出元件 光电 |
| 文件： | 总14页 (文件大小：238K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PC815XJ0000F Series
DIP 4pin
PC815XJ0000F
Darlington Phototransistor Output,
Photocoupler
Series
∗4-channel package type is also available.
(model No.
)
PC845XJ0000F Series
Description
Agency approvals/Compliance
■
■
PC815XJ0000F Series contains an IRED optically
1. Recognized by UL1577 (Double protection isolation),
coupled to a phototransistor.
file No. E64380 (as model No. PC815)
It is packaged in a 4 pin DIP.
2. Approved by VDE, DIN EN60747-5-2(∗) (as an
option), file No. 40008087 (as model No. PC815)
3. Package resin : UL flammability grade (94V-0))
Input-output isolation voltage(rms) is 5.0 kV.
CTR is MIN. 600% at input current of 1.0 mA.
(∗) DIN EN60747-5-2 : successor standard of DIN VDE0884.
Features
■
1. 4 pin DIP package
Applications
■
2. Double transfer mold package
(Ideal for Flow Soldering)
1. Home appliances
2. Programmable controller
3. Darlington phototransisitor output (CTR : MIN. 600%
3. Signal transmission between circuits of different
potentials and impedances
at I 1.0 mA, V 2 V
=
=
F
CE
4. High isolation voltage between input and output
(Viso(rms) : 5.0 kV)
5. Lead-free and RoHS directive compliant
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A08401EN
Date Sep. 1. 2006
© SHARP Corporation
1
PC815XJ0000F Series
Internal Connection Diagram
■
■
1
Anode
1
4
2
3
4
Cathode
Emitter
Collector
2
3
(Unit : mm)
Outline Dimensions
1. Through-Hole [ex. PC815XJ0000F]
2. Through-Hole (VDE option) [ex. PC815XYJ000F]
Rank mark
Anode mark
Rank mark
Anode mark
Factory identification mark
Factory identification mark
Date code
Date code
1
2
4
3
1
2
4
3
PC815
PC815
4
SHARP mark "S"
6.5±0.3
6.5±0.3
VDE
Indenfication mark
7.62±0.30
4.58±0.30
7.62±0.30
4.58±0.30
Epoxy resin
Epoxy resin
0.26±0.10
0.26±0.10
0.5±0.1
0.5±0.1
θ
θ
θ
θ
θ : 0 to 13˚
θ : 0 to 13˚
Product mass : approx. 0.23g
Product mass : approx. 0.23g
3. SMT Gullwing Lead-Form
4. SMT Gullwing Lead-Form (VDE option)
[ex. PC815XPJ000F]
[ex. PC815XPYJ00F]
Rank mark
Anode mark
Rank mark
Anode mark
Factory identification mark
Factory identification mark
Date code
Date code
4
4
1
2
1
2
3
3
P C 8 1 5
P C 8 1 5
4
SHARP mark "S"
6.5±0.3
6.5±0.3
VDE
Indenfication mark
4.58±0.30
7.62±0.30
7.62±0.30
4.58±0.30
2.54±0.25
+0.4
−0.0
+0.4
−0.0
Epoxy resin
1.0
1.0
2.54±0.25
+0.4
−0.0
+0.4
−0.0
+0.0
−0.5
Epoxy resin
1.0
1.0
10.0
+0.0
−0.5
10.0
Product mass : approx. 0.22g
Product mass : approx. 0.22g
Plating material : SnCu (Cu : TYP. 2%)
Sheet No.: D2-A08401EN
2
PC815XJ0000F Series
Date code (2 digit)
1st digit
2nd digit
Year of production
Month of production
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
Mark
A
B
A.D.
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
:
Mark
P
Month
Mark
1
January
February
March
R
2
C
S
3
D
E
T
April
4
U
V
W
X
A
B
May
5
F
June
6
H
J
July
7
August
September
October
November
December
8
K
L
9
O
N
D
M
N
C
:
repeats in a 20 year cycle
Factory identification mark
Factory identification Mark
Country of origin
no mark
Japan
Indonesia
China
* This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see the actural status of the
production.
Rank mark
With or without.
Sheet No.: D2-A08401EN
3
PC815XJ0000F Series
Absolute Maximum Ratings
■
(T 25˚C)
=
a
Parameter
Symbol
Rating
50
Unit
mA
A
Forward current
*1 Peak forward current
IF
IFM
VR
1
Input
Reverse voltage
6
V
Power dissipation
P
70
mW
V
Collector-emitter voltage
Emitter-collector voltage
Collector current
VCEO
VECO
IC
35
6
V
Output
80
mA
mW
mW
˚C
Collector power dissipation
PC
150
200
Total power dissipation
Ptot
Topr
Tstg
Operating temperature
Storage temperature
*2 Isolation voltage
30 to 100
+
−
−
55 to 125
˚C
+
V
5
kV
˚C
iso(rms)
*3 Soldering temperature
Tsol
270
*1 Pulse width≤100ms, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1minute, f=60Hz
*3 For 10s
Electro-optical Characteristics
■
(T 25˚C)
=
a
Parameter
Forward voltage
Symbol
VF
Condition
20mA
MIN.
−
TYP. MAX.
Unit
V
I
1.2
−
1.4
3.0
10
=
F
Peak forward voltage
VFM
IR
IFM 0.5V
V
=
−
Input
Reverse current
VR 4V
A
μ
=
−
−
Terminal capacitance
Collector dark current
Ct
V 0, f 1kHz
30
−
250
1 000
−
pF
nA
V
=
=
−
ICEO
BVCEO
BVECO
IC
VCE 10V, I 0
= =
F
−
35
6
Output Collector-emitter breakdown voltage
Emitter-collector breakdown voltage
Current transfer ratio
IC 0.1mA, I
=
0
=
F
−
I
10 A, I
μ
0
=
F
V
=
E
−
16.0
0.8
−
I
1mA, V 2V
6.0
−
75.0
1.0
−
1.0
−
mA
V
=
=
CE
F
Collector-emitter saturation voltage
VCE(sat)
RISO
Cf
I 20mA, I 5mA
= =
F C
5 1010 1 1011
Transfer
Isolation resistance
DC500V, 40 to 60%RH
V 0, f 1MHz
×
×
Ω
pF
kHz
charac- Floating capacitance
0.6
=
=
−
1
−
−
Cut-off frequency
fC
VCE 2V, I 2mA, R 100 , 3dB
Ω −
6
=
=
C
=
L
teristics
Rise time
Response time
tr
60
53
300
250
s
μ
μ
VCE 2V, I 10mA, R 100
=
=
=
L
Ω
C
Fall time
tf
s
Sheet No.: D2-A08401EN
4
PC815XJ0000F Series
Model Line-up
■
Lead Form
Through-Hole
Sleeve
SMT Gullwing Form
Taping
Package
100pcs/sleeve
2 000pcs/reel
DIN EN60747-5-2
Model No.
Approved
Approved
PC815XJ0000F PC815XYJ000F PC815XPJ000F PC815XPYJ00F
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: D2-A08401EN
5
PC815XJ0000F Series
Fig.1 Forward Current vs.
Ambient Temperature
Fig.2 Diode Power Dissipation vs.
Ambient Temperature
50
40
30
20
100
80
70
60
40
10
0
20
0
ꢀ30
0
25
50 55 75
100
125
ꢀ30
0
25
50 55 75
100
125
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.3 Collector Power Dissipation vs.
Fig.4 Total Power Dissipation vs.
Ambient Temperature
Ambient Temperature
250
250
200
150
100
200
150
100
50
0
50
0
ꢀ30
0
25
50
75
100
125
ꢀ30
0
25
50
75
100
125
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.5 Peak Forward Current vs. Duty Ratio
Fig.6 Current Transfer Ratio vs.
Forward Current
10 000
2 000
Pulse width 100Ms
Taꢀ25˚C
VCEꢀ2V
Taꢀ25˚C
1 800
1 600
1 400
1 200
1 000
800
1 000
100
10
600
400
200
0
10ꢀ3
10ꢀ2
Duty ratio
10ꢀ1
1
0.1
1
10
Forward current IF (mA)
Sheet No.: D2-A08401EN
6
PC815XJ0000F Series
Fig.7 Forward Current vs. Forward Voltage
Fig.8 Collector Current vs.
Collector-emitter Voltage
100
Taꢀ75˚C
Taꢀ25˚C
90
80
50˚C
25˚C
100
0˚C
IFꢀ10mA
70
ꢀ25˚C
P
C (MAX.)
60
50
40
30
20
5mA
10
2mA
1mA
10
0
1
0
0.5
1
1.5
2
2.5
3
3.5
0
1
2
3
4
5
Forward voltage VF (V)
Collector-emitter voltage VCE (V)
Fig.9 Relative Current Transfer Ratio vs.
Ambient Temperature
Fig.10 Collector - emitter Saturation Voltage
vs. Ambient Temperature
150
1.3
IFꢀ1mA
VCEꢀ2V
IFꢀ20mA
1.2
ICꢀ5mA
1.1
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
100
50
0
0.1
0
ꢀ30
0
ꢆ0
ꢅ0
ꢄ0
ꢃ0
ꢁꢂ0
ꢀ30
0
ꢆ0
ꢅ0
ꢄ0
ꢃ0
ꢁꢂ0
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.11 Collector Dark Current vs.
Fig.12 Collector-emitter Saturation Voltage
Ambient Temperature
vs. Forward Current
8
10ꢀ5
VCEꢀ10V
Taꢀ25˚C
ICꢀ0.5mA
7
10ꢀ6
10ꢀ7
10ꢀ8
10ꢀ9
1mA
6
3mA
5mA
5
4
7mA
3
50mA
2
10ꢀ10
10ꢀ11
30mA
1
0
0
0.5
1
1.5
2
2.5
3
3.5
4
ꢀ30
0
20
40
60
80
100
Forward current IF (mA)
Ambient temperature Ta (˚C)
Sheet No.: D2-A08401EN
7
PC815XJ0000F Series
Fig.11 Response Time vs. Load Resistance
Fig.12 Test Circuit for Response Time
VCEꢀ2V
VCC
RL
ICꢀ10mA
Input
tr
Taꢀ25˚C
Output
RD
Input
Output
100
10%
90%
tr
tf
VCE
td
tr
ts
td
10
Please refer to the conditions in Fig.13
ts
1
0.1
1
Load resistance RL (k7)
Fig.13 Frequency Response
Fig.14 Test Circuit for Frequency Response
VCC
VCEꢀ2V
ICꢀ2mA
Taꢀ25˚C
RL
0
Output
VCE
RD
1k7
1007
RLꢀ10k7
ꢀ10
ꢀ20
Please refer to the conditions in Fig.15
1
0.01
0.1
10
100
Frequency f (kHz)
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D2-A08401EN
8
PC815XJ0000F Series
Design Considerations
■
●
Design guide
While operating at IF<1.0mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
●
●
Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
Recommended foot print (reference)
SMT Gullwing Lead-form
8.2
2.2
(Unit : mm)
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
✩
Sheet No.: D2-A08401EN
9
PC815XJ0000F Series
Manufacturing Guidelines
■
●
Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
( package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
100
150 to 180˚C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the
below listed guidelines.
Flow soldering should be completed below 270 ̊C and within 10s.
Preheating is within the bounds of 100 to 150 ̊C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400 ̊C.
Please don't solder more than twice.
Other notice
Please test the soldering method in actual condition and make sure the soldering works fine, since
the impact on the junction between the device and PCB varies depending on the tooling and soldering
conditions.
Sheet No.: D2-A08401EN
10
PC815XJ0000F Series
●
Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.
Ultrasonic cleaning :
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
●
Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBB and PBDE are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
Sheet No.: D2-A08401EN
11
PC815XJ0000F Series
Package specification
■
●
Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 100 pcs. of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless
stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0
6.7
(Unit : mm)
Sheet No.: D2-A08401EN
12
PC815XJ0000F Series
●
Tape and Reel package
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
D
J
G
E
I
K
Dimensions List
(Unit : mm)
A
B
C
D
E
F
G
+0.1
16.0±0.3
7.5±0.1
1.75±0.10
8.0±0.1
2.0±0.1
4.0±0.1
φ1.5
−0.0
H
I
J
K
10.4±0.1 0.40±0.05
4.2±0.1
5.1±0.1
Reel structure and Dimensions
e
d
g
Dimensions List
(Unit : mm)
a
b
c
d
φ330
17.5±1.5 φ100.0±1.0 φ13.0±0.5
f
e
f
g
b
φ23.0±1.0
2.0±0.5
2.0±0.5
a
Direction of product insertion
Pull-out direction
[Packing : 2 000pcs/reel]
Sheet No.: D2-A08401EN
13
PC815XJ0000F Series
Important Notices
■
· The circuit application examples in this publication
are provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related
to any intellectual property right of a third party resulting
from the use of SHARP's devices.
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials, structure,
and other contents described herein at any time
without notice in order to improve design or reliability.
Manufacturing locations are also subject to change
without notice.
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
· Contact and consult with a SHARP representative
if there are any questions about the contents of this
publication.
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
Sheet No.: D2-A08401EN
[E241]
14
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