PC81713NSZ1B [SHARP]
Transistor Output Optocoupler,;
| 型号： | PC81713NSZ1B |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | Transistor Output Optocoupler, 输出元件 光电 |
| 文件： | 总14页 (文件大小：1420K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PC8171xNSZ1B Series
DIP 4pin High CMR,
Low Input Current
Photocoupler
PC8171xNSZ1B
Series
Description
Agencyapprovals/Compliance
PC8171xNSZ1B Series contains an IRED optically
coupled to a phototransistor.
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC8171)
It is packaged in a 4-pin DIP.
Input-output isolation voltage(rms) is 5kV.
Collector-emitter voltage is 80V.
2. Package resin : UL flammability grade (94V-0)
CTR is 100% to 600% (at IF=0.5mA,VCE=5V,Ta=25℃)
Features
Applications
1. 4-pin DIPpackage
Programmablecontrollers
1. Facsimiles
2. Double transfer mold package
(Ideal for Flow Soldering)
3. Low input current type(IF=0.5mA)
2. Telephones
4. High noise immunity due to high common mode
rejection voltage (CMR : MIN.10kV/μs)
5. High collector-emitter voltage(VCEO : 80V)
6. High isolation voltage between input and output
(Viso(rms) : 5kV)
7. RoHS directivecompliant
Notice The contentof data sheet is subject to change without prior notice.
In the absence of confirmationby device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specificationsheets before using any SHARP device.
Sheet No.: OP18004EN
DATE Jan.15.2018
© SHARP Corporation
1
PC8171xNSZ1B Series
Internal Connection Diagram
1 Anode
2 Cathode
3 Emitter
4
3
1
2
4 Collector
Outline
(Unit : mm)
１． Through-Hole
２．SMT GullwingLead-Form
[ex. PC8171xNSZ1B]
[ex . PC8171xNIP1B]
8 1 7 1
8 1 7 1
Product mass : approx.0.23g
Product mass : approx.0.22g
Sheet No.: OP18004EN
2
PC8171xNSZ1B Series
Date code indication (Ex.)
3-digit number shall be marked the age indication of 1-digit number, and week code of 2-digit number.
Week code “01” indicate the week including the first Thursday of January. And later, Monday is the starting
point.
Year Week
Date code
652
701
702
703
・
MON
12/26
1/2
1/9
1/16
・
TUE
12/27
1/3
1/10
1/17
・
WED
12/28
1/4
1/11
1/18
・
THU
12/29
1/5
1/12
1/19
・
FRI
12/30
1/6
1/13
1/20
・
SAT
12/31
1/7
1/14
1/21
・
SUN
1/1
1/8
1/15
1/22
・
・
・
・
・
・
・
・
・
・
・
・
・
・
・
・
・
752
751
752
801
12/11
12/18
12/25
1/1
12/12
12/19
12/26
1/2
12/13
12/20
12/27
1/3
12/14
12/21
12/28
1/4
12/15
12/22
12/29
1/5
12/16
12/23
12/30
1/6
12/17
12/24
12/31
1/7
Factory identification mark and Plating material
Factory identification Mark
Country of origin
Plating material
SnBi (Bi : 1 4%)
K
Japan
～
Rankmark
Refer to the Model Line-uptable.
Sheet No.: OP18004EN
3
PC8171xNSZ1B Series
Absolute maximum ratings
(Ta=25°C)
Parameter
Symbol
IF
Rating
10
Unit
mA
mA
V
Forward current
*1 Peak forward current
IFM
200
6
Input
Reverse voltage
VR
Power dissipation
P
15
mW
V
Collector-emitter voltage
Emitter-collector voltage
VCEO
VECO
IC
80
6
V
Output
Collector current
50
mA
mW
Collector power dissipation
PC
150
Total power dissipation
*2 Isolation voltage
170
5
mW
kV
Ptot
Viso(rms)
Topr
Operating temperature
Storage temperature
*2 Soldering temperature
30 to 100
̊C
C̊
Tstg
55 to 125
270
C
Tsol
*1 Pulse width≦100μs, Duty ratio: 0.001
*2 AC for 1 min, 40 to 60%RH
*3 For 10 s
Electro-optical Characteristics
(Ta=25°C)
Parameter
Symbol
VF
Condition
MIN.
TYP.
1.2
MAX.
1.4
Unit
V
Forward voltage
I 5mA
F
Reverse current
Input
IR
VR 4V
10
A
Terminal capacitance
Dark current
Ct
V 0, f 1kHz
30
250
100
pF
nA
V
80
VCE 50V,I
F
0
ICEO
Collector-emitter breakdown voltage
Output
IC 0.1mA, I
0
F
BVCEO
BVECO
IC
3.0
Emitter-collector breakdown voltage
Collector current
I
E
10 A, I
0
6
V
F
I
5mA, V 5V
0.5
mA
V
F
CE
Collector-emitter saturation voltage
I
0mA, I 1mA
F C
0.2
VCE(sat)
RISO
Isolation resistance
Transfer
DC500V, 40 to 60%RH
V 0, f 1MHz
5×1010 1×1011
Ω
charac
Floating capacitance
Responsetime
Cf
tr
tf
0.6
4
3
1.0
18
18
pF
Risetime
Fall time
s
s
VCE2V, IC2mA, RL100Ω
teristics
Ta=25℃,RL=470Ω
Common mode rejection ratio
CMR
VCM 5kV(peak),
IF=0,Vcc=9V,Vnp=100mV
kV/μs
Sheet No.: OP18004EN
4
PC8171xNSZ1B Series
ModelLine-up
IC[mA]
(IF=0.5mA,
VCE=5V,
Lead Form
Package
Through-Hole
Sleeve
Rank mark
100pcs/sleeve
Ta=25˚C)
PC81710NSZ1B
PC81711NSZ1B
PC81712NSZ1B
PC81713NSZ1B
PC81716NSZ1B
0.5～3.0
0.6～1.5
0.8～2.0
1.0～2.5
0.8～2.5
with or “_”
A
B
Model No.
C
B or C
IC[mA]
(IF=0.5mA,
VCE=5V,
Lead Form
Package
SMT Gullwing
Taping
Rank mark
2,000pcs/reel
Ta=25˚C)
PC81710NIP1B
PC81711NIP1B
PC81712NIP1B
PC81713NIP1B
PC81716NIP1B
0.5～3.0
0.6～1.5
0.8～2.0
1.0～2.5
0.8～2.5
with or “_”
A
B
Model No.
C
B or C
Please contact a local SHARP sales representative to inquire about productionstatus.
Sheet No.: OP18004EN
5
PC8171xNSZ1B Series
Fig.2 Diode Power Dissipationvs.
Fig.1 Forward Current vs.Ambient
Temperature
Ambient Temperature
Fig.3 Collector Power Dissipation vs.
Ambient Temperature
Fig.4 Total Power Dissipation vs. Ambient
Temperature
Fig.6 Forward Current vs. Forward Voltage
Fig.5 Peak Forward Current vs. Duty Ratio
Sheet No.: OP18004EN
6
PC8171xNSZ1B Series
Fig.8 Collector Current vs.
Fig.7 Current Transfer Ratio vs.
Forward Current
Collector-emitterVoltage
Fig.9 Relative Current Transfer Ratio vs.
Ambient Temperature
Fig.10 Collector - emitter Saturation Voltage
vs. AmbientTemperature
Fig.11 Collector Dark Current vs.
Ambient Temperature
Fig.12 Collector-emitter Saturation Voltage vs.
Forward Current
Sheet No.: OP18004EN
7
PC8171xNSZ1B Series
Fig.13 Response Timevs.
Load Resistance
Fig.14 Test Circuit for Response Time
Fig.15 Frequency Response
Fig.16 Test Circuit for Frequency Response
Fig.17 Test Circuit for Common Mode Rejection Voltage
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: OP18004EN
8
PC8171xNSZ1B Series
Design Considerations
● Designguide
While operating at IF<0.5mA, CTR variation may increase.
Please make design considering this fact.
In case that some sudden big noise caused by voltage variation is provided between primary and secondary
terminals of photocoupler some current caused by it is floating capacitance may be generated and result in
false operation since current may go through IRED or current may change.
If the photocoupler may be used under the circumstances where noise will be generated we recommend to
use the bypass capacitors at the both ends of IRED.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the designconsideration.
● Recommended foot print (reference)
SMT Gullwinglead-form
8.2
2.2
(Unit : mm)
Sheet No.: OP18004EN
9
PC8171xNSZ1B Series
Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more thantwice.
(˚C)
300
Terminal : 260˚C peak
(package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
100
150 to 180˚C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the be-
low listedguidelines.
Flow soldering should be completed below 270℃ and within 10s.
Preheating is within the bounds of 100 to 150℃ and 30 to 80s.
Please don't solder more thantwice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400℃.
Please don't solder more thantwice.
Other notice
Please test the soldering method in actual condition and make sure the soldering works fine, since the im-
pact on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: OP18004EN
10
PC8171xNSZ1B Series
● Cleaninginstructions
Solvent cleaning:
Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of thedevice.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-
tual using conditions since some materials may erode the packagingresin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane(Methylchloroform)
Specific brominated flame retardants such as the PBB and PBDE are not used in this product at all.
(1) The RoHS directive(2011/65/EU)
This product complies with the RoHS directive(2011/65/EU)
Object substances: mercury, lead, cadmium, hexavalent chromium, polybrominated biphenyls
（PBB）and polybrominated diphenyl ethers（PBDE）
(2) Content of six substances specified in Management Methods for Control of Pollution Caused
by Electronic Information Products Regulation (Chinese : 电子信息产品污染控制管理办法).
Marking Styles for the Names and Contents of the Hazardous Substances
Hazardous Substances
Polybrominated
biphenyls
Polybrominated
diphenyl ethers
Hexavalent
chromium
(Cr6+)
Category
Lead
Mercury
Cadmium
(Cd)
(Pb)
(Hg)
(PBB)
○
(PBDE)
○
Photocoupler
○
○
○
○
This table is prepared in accordance with the provisions of SJ/T 11364.
○：Indicates that said hazardous substance contained in all of the homogeneous materials
for this part is below the limit requirement of GB/T 26572.
Sheet No.: OP18004EN
11
PC8171xNSZ1B Series
Packagespecification
● Sleevepackage
Through-Hole
Packagematerials
Sleeve : HIPS/PS or PC (with anti-staticmaterial)
Stopper : EPM
Packagemethod
MAX. 100pcs. of products shall be packaged in a sleeve and both of sleeve edges shall be fixed by stoppers.
MAX. 25 sleeves (Product : 2,500pcs.) above shall be packaged in inner case and sealed by tape .
Max 2 bags(product : 5,000pcs) above shall be packaged in packing case , and put a cushioning material inside.
8.8 ± 0.2
Sleeve outlinedimensions
6.5 ± 0.2
14.2 ± 0.2
500 ± 2
(Unit : mm)
Sheet No.: OP18004EN
12
PC8171xNSZ1B Series
● Tapeand Reelpackage
SMT Gullwing
Packagematerials
Carrier tape : PS
Cover tape : PET (three layersystem)
Reel : PS
Carrier tape structure andDimensions
Dimensions List (Unit : mm)
A
16.00.3
B
7.50.1
I
C
1.750.10
J
D
8.00.1
E
2.00.1
F
G
0.1
4.00.1
1.5
0.0
H
K
10.30.1
0.400.05
4.00.1
5.30.1
Reel structure and Dimensions
Dimensions List
(Unit : mm)
a
330
e
b
17.51.5
f
c
d
1001 13.00.5
g
2.00.5
2.00.5
21.01
Direction of productinsertion
[Packing : 2,000pcs/reel]
Sheet No.: OP18004EN
13
PC8171xNSZ1B Series
Important Notices
·The circuit application examples in this publication
are provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related
to any intellectual property right of a third party resulting
from the use of SHARP'sdevices.
with equipment that requires higher reliability suchas:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles,etc.)
--- Trafficsignals
--- Gas leakage sensor breakers
--- Alarmequipment
--- Various safety devices,etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
·Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials, structure,
and other contents described herein at any time
without notice in order to improve design or reliability.
Manufacturing locations are also subject to change
withoutnotice.
--- Spaceapplications
--- Telecommunication equipment [trunk lines]
--- Nuclear power controlequipment
--- Medical and other life support equipment (e.g.,
scuba).
·If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
·Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i)The devices in this publication are designed for use in
general electronic equipment designs such as:
--- Personalcomputers
·This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
--- Office automationequipment
--- Telecommunication equipment [terminal]
--- Testand measurement equipment
--- Industrialcontrol
--- Audio visualequipment
--- Consumerelectronics
(ii)Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
·Contact and consult with a SHARP representative if
there are any questions about the contents of this
publication.
Sheet No.: OP18004EN
[E178]
14
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