PC853XI [SHARP]
Darlington Output Optocoupler, 1-Element, 5000V Isolation, PLASTIC, SMT, DIP-4;
| 型号： | PC853XI |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | Darlington Output Optocoupler, 1-Element, 5000V Isolation, PLASTIC, SMT, DIP-4 输出元件 光电 |
| 文件： | 总15页 (文件大小：253K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PC852X Series/PC853X Series
DIP 4pin Darlington Phototransistor Ouput,
High Collector-emitter Voltage
Photocoupler
PC852X Series
PC853X Series
■ Description
■ Agency approvals/Compliance
1. Recognized by UL1577, file No. E64380 (as model
No. PC852/PC853)
PC852X Series/PC853X Series contains an IRED
optically coupled to a phototransistor.
It is packaged in a 4-pin DIP, available in SMT gullw-
ing lead-form option.
2. Package resin : UL flammability grade (94V-0)
Input-output isolation voltage(rms) is 5.0kV.
Collector-emitter voltage is 350V and CTR is MIN.
1 000% at input current of 1mA.
■ Applications
1. Telephone line interface/isolation
2. Interface to power supply circuit
3. Controller for SSRs, DC motors
■ Features
1. 4pin DIP package
2. Double transfer mold package (Ideal for Flow Solder-
ing)
3. High collector-emitter voltage (VCEO : 350V)
4. Durlington phototransistor output (CTR : MIN. 1 000%
at IF=1mA, VCE=2V)
5. Large collector power disspation : PC853X
(PC : 300mW)
6. High isolation voltage between input and output
(Viso(rms) : 5kV)
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A04003EN
1
Date Mar. 26. 2004
© SHARP Corporation
PC852X Series/PC853X Series
■ Internal Connection Diagram
1
3
4
5
Anode
1
2
4
3
Cathode
Emitter
Collector
(Unit : mm)
■ Outline Dimensions
● PC852X Series
1. Through-Hole [ex. PC852X]
2. Through-Hole (VDE 0884 option) [ex. PC852XY]
Anode mark
Anode mark
Factory identification mark
Factory identification mark
Date code
Date code
4
4
3
1
2
1
2
P C 8 5 2
P C 8 5 2
3
4
6.5±0.5
6.5±0.5
SHARP mark "S"
VDE 0884 identification mark
4.58±0.5
7.62±0.3
4.58±0.5
7.62±0.3
Epoxy resin
Epoxy resin
0.26±0.1
0.5±0.1
0.26±0.1
0.5±0.1
θ
θ
θ
θ
θ : 0 to 13˚
θ : 0 to 13˚
3. SMT Gullwing Lead-Form [ex. PC852XI]
4. SMT Gullwing Lead-Form (VDE 0884 option)
[ex. PC852XPY]
Anode mark
Factory identification mark
Anode mark
Factory identification mark
Date code
Date code
4
1
2
4
1
2
3
PC852
3
P C 8 5 2
4
6.5±0.5
6.5±0.5
SHARP mark "S"
4.58±0.5
7.62±0.3
VDE 0884 identification mark
4.58±0.5
7.62±0.3
Epoxy resin
+0.4
+0.4
1.0
1.0
−0
−0
+0
2.54±0.25
Epoxy resin
+0.4
10.0
+0.4
−0.5
1.0
1.0
−0
−0
+0
10.0
2.54±0.25
−0.5
Sheet No.: D2-A04003EN
2
PC852X Series/PC853X Series
(Unit : mm)
● PC853X Series
1. Through-Hole [ex. PC853X]
2. SMT Gullwing Lead-Form [ex. PC853XI]
Anode mark
Factory identification mark
Anode mark
Factory identification mark
Date code
Date code
4
1
2
4
3
1
2
P C 8 5 3
3
PC853
6.5±0.5
6.5±0.5
7.62±0.3
4.58±0.5
4.58±0.5
7.62±0.3
Epoxy resin
Epoxy resin
+0.4
+0.4
1.0
1.0
−0
−0
+0
2.54±0.25
10.0
0.26±0.1
0.5±0.1
−0.5
θ
θ
θ : 0 to 13˚
Product mass : approx. 0.21g
Sheet No.: D2-A04003EN
3
PC852X Series/PC853X Series
Date code (2 digit)
1st digit
2nd digit
Year of production
Month of production
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
Mark
P
Month
Mark
1
Mark
A
B
January
February
March
R
2
S
3
C
T
April
4
D
E
U
May
5
F
V
June
6
H
J
W
X
July
7
August
September
October
November
December
8
K
L
A
9
B
O
N
D
M
N
C
·
·
·
·
·
·
repeats in a 20 year cycle
Factory identification mark
Factory identification Mark
Country of origin
no mark
Japan
Indonesia
Philippines
China
* This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see the actural status of the
production.
Sheet No.: D2-A04003EN
4
PC852X Series/PC853X Series
■ Absolute Maximum Ratings
(Ta=25˚C)
Rating
Parameter
Symbol
Unit
PC852X PC853X
Forward current
*1 Peak forward current
Reverse voltage
IF
IFM
50
1
mA
A
VR
6
V
Power dissipation
P
70
350
0.1
150
mW
V
Collector-emitter voltage
Emitter-collector voltage
Collector current
VCEO
VECO
IC
V
mA
mW
mW
kV
˚C
Collector power dissipation
Total power dissipation
*2 Isolation voltage
PC
150
200
300
320
Ptot
Viso (rms)
Topr
Tstg
Tsol
5.0
Operating temperature
Storage temperature
*3 Soldering temperature
−30 to +100
−55 to +125
260
˚C
˚C
*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1 minute, f=60Hz
*3 For 10s
■ Electro-optical Characteristics
(Ta=25˚C)
Parameter
Forward voltage
Symbol
VF
Conditions
MIN.
TYP.
1.2
−
MAX.
1.4
10
Unit
V
IF=10mA
VR=4V
−
Input Reverse voltage
Terminal capacitance
IR
−
µA
pF
nA
V
Ct
V=0, f=1kHz
−
30
250
200
−
Collector dark current
Output
ICEO
VCE=200V, IF=0
−
−
Collector-emitter breakdown voltage BVCEO
IC=0.1mA, IF=0
350
−
Collector current
IC
IF=1mA, VCE=2V
IF=20mA, IC=100mA
DC500V, 40 to 60%RH
V=0, f=1MHz
10
40
150
1.2
−
mA
V
Collector-emitter saturation voltage VCE (sat)
−
−
Isolation resistance
Floating capacitance
Cut-off frequency
RISO
Cf
fC
5×1010
1×1011
0.6
7
Ω
Transfer
charac-
teristics
−
1
−
−
1.0
−
pF
kHz
µs
VCE=2V, IC=20mA, RL=100Ω, −3dB
Rise time
tr
100
20
300
100
Response time
VCE=2V, IC=20mA, RL=100Ω
Fall time
tf
µs
Sheet No.: D2-A04003EN
5
PC852X Series/PC853X Series
■ Model Line-up
● PC852X Series
Lead Form
Through-Hole
SMT Gullwing
Taping
2 000pcs/reel
Approved
Sleeve
Package
100pcs/sleeve
Approved
VDE0884
Model No.
PC852X
PC852XY PC852XI PC852XP PC852XPY
● PC853X Series
Lead Form Through-Hole
SMT Gullwing
Sleeve
100pcs/sleeve
Taping
Package
2 000pcs/reel
VDE0884
Model No.
PC853X
PC853XI PC853XP
Please contact a local SHARP sales representative to inquire about production status and Lead-Free options.
Sheet No.: D2-A04003EN
6
PC852X Series/PC853X Series
Fig.2 Diode Power Dissipation vs.
Fig.1 Forward Current vs. Ambient
Temperature
Ambient Temperature
60
100
50
40
30
20
10
0
80
70
60
40
20
0
−30
0
25
50 55 75
100
125
−30
0
25
50
75
100
125
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.3-a Collector Power Dissipation vs.
Fig.3-b Collector Power Dissipation vs.
Ambient Temperature
200
Ambient Temperature
350
(PC852X)
(PC853X)
300
250
200
150
100
150
100
50
0
50
0
−30
0
25
50
75
100
125
−30
0
25
50
75
100
125
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.4 Total Power Dissipation vs. Ambient
Temperature
Fig.5 Peak Forward Current vs. Duty Ratio
10 000
Pulse width≤100µs
5 000
Ta=25˚C
400
2 000
1 000
PC853X
320
300
500
200
100
200
100
0
50
PC852X
20
10
5
5
10−3
2
5
10−2
Duty ratio
2
5
10−1
2
5
1
−30
0
25
50
75
100
Ambient Temperature Ta (˚C)
Sheet No.: D2-A04003EN
7
PC852X Series/PC853X Series
Fig.6 Forward Current vs. Forward Voltage
Fig.7-a Current Transfer Ratio vs. Forward
Current
(PC852X)
5 000
500
VCE=2V
Ta=25˚C
Ta=75˚C
200
50˚C
25˚C
4 000
3 000
2 000
100
0˚C
−25˚C
50
20
10
5
1 000
0
2
1
0.1
0.2
0.5
1
2
5
10
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Forward current IF (mA)
Forward voltage VF (V)
Fig.7-b Current Transfer Ratio vs. Forward
Fig.8-a Collector Current vs. Collector-
Current
(PC853X)
5 000
emitter Voltage
(PC852X)
200
Ta=25˚C
VCE=2V
Ta=25˚C
4 000
3 000
2 000
IF =10mA
5mA
3mA
2.5mA
100
2mA
1.5mA
PC (MAX.)
1mA
1 000
0
0.5mA
0
0.1
0.2
0.5
1
2
5
10
0
1
2
3
4
5
Forward current IF (mA)
Collector-emitter voltage VCE (V)
Fig.8-b Collector Current vs. Collector-
Fig.9 Relative Current Transfer Ratio vs.
Ambient Temperature
emitter Voltage
200
(PC853X)
150
IF=1mA
VCE=2V
Ta=25˚C
IF=10mA
5mA
3mA
100
2.5mA
2mA
100
PC (MAX.)
1.5mA
50
0
1mA
0.5mA
0
−30
0
20
40
60
80
100
0
1
2
3
4
5
Collector-emitter voltage VCE (V)
Ambient Temperature Ta (˚C)
Sheet No.: D2-A04003EN
8
PC852X Series/PC853X Series
Fig.10 Collector - emitter Saturation Voltage
Fig.11 Collector Dark Current vs. Ambient
Temperature
vs. Ambient Temperature
10−5
1.2
VCE=200V
10−6
10−7
10−8
10−9
1.0
0.8
0.6
0.4
10−10
10−11
0.2
IF=20mA
IC=100mA
0
0
20
−30
0
20
40
60
80
100
−30
40
60
80
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.12 Response Time vs. Load Resistance
Fig.13 Test Circuit for Response Time
1 000
VCE=2V
IC=20mA
Ta=25˚C
500
tr
tf
Input
VCC
RL
Output
200
100
Input
10%
90%
RD
Output
VCE
50
td
ts
tr
tf
td
ts
20
10
Please refer to the conditions in Fig.12.
5
2
1
0.01
0.1
1
10
Load resistance RL (kΩ)
Fig.14 Frequency Response
Fig.15 Collector-emitter Saturation Voltage
vs. Forward Current
5
Ta=25˚C
IC=5mA
10mA
VCE=2V
IC=20mA
Ta=25˚C
0
4
3
2
30mA
−5
50mA
70mA
RL=1kΩ
100Ω 10Ω
−10
−15
−20
−25
100mA
1
0
0
1
2
3
4
5
0.1
1
10
100
1 000
Forward current IF (mA)
Frequency f (kHz)
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
9
Sheet No.: D2-A04003EN
PC852X Series/PC853X Series
■ Design Considerations
● Design guide
While operating at IF<1.0mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5years)
into the design consideration.
● Recommended Foot Print (reference)
8.2
2.2
(Unit : mm)
✩
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A04003EN
10
PC852X Series/PC853X Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
( package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
100
150 to 180˚C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A04003EN
11
PC852X Series/PC853X Series
● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-
tual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances:CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
Sheet No.: D2-A04003EN
12
PC852X Series/PC853X Series
■ Package specification
● Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0
6.7
(Unit : mm)
Sheet No.: D2-A04003EN
13
PC852X Series/PC853X Series
● Tape and Reel package
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
D
J
G
E
I
K
Dimensions List
(Unit : mm)
A
B
C
D
E
F
G
+0.1
16.0±0.3
7.5±0.1
1.75±0.1
8.0±0.1
2.0±0.1
4.0±0.1
φ1.5
−0
H
I
J
K
10.4±0.1
0.4±0.05
4.2±0.1
5.1±0.1
Reel structure and Dimensions
e
d
g
Dimensions List
(Unit : mm)
a
b
c
d
330
e
17.5±1.5
100±1.0
13±0.5
f
f
g
b
23±1.0
2.0±0.5
2.0±0.5
a
Direction of product insertion
Pull-out direction
[Packing : 2 000pcs/reel]
Sheet No.: D2-A04003EN
14
PC852X Series/PC853X Series
■ Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems rela-
ted to any intellectual property right of a third party re-
sulting from the use of SHARP's devices.
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high lev-
el of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the spec-
ifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufac-
turing locations are also subject to change without no-
tice.
· If the SHARP devices listed in this publication fall with-
in the scope of strategic products described in the For-
eign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP de-
vices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means, elec-
tronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
Sheet No.: D2-A04003EN
15
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