PC929P [SHARP]
Logic IC Output Optocoupler, 1-Element, 4000V Isolation, PLASTIC, SMD, MINI-FLAT, 14 PIN;
| 型号： | PC929P |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | Logic IC Output Optocoupler, 1-Element, 4000V Isolation, PLASTIC, SMD, MINI-FLAT, 14 PIN 输出元件 光电 |
| 文件： | 总22页 (文件大小：430K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PC929 Series
High Speed, Built-in Short
PC929 Series
Protection Circuit, Gate Drive
∗
SMD 14 pin OPIC Photocoulper
■ Description
PC929 Series contains an IRED optically coupled to
an OPIC chip.
■ Agency approvals/Compliance
1. Recognized by UL1577, file No. E64380 (as model
No. PC929)
It is packaged in a Mini-flat, Half pitch type (14 pin).
Input-output isolation voltage(rms) is 4.0kV. High
speed responce (tPLH, tPHL : MAX. 0.5 µs).
2. Approved by VDE (VDE0884) (as an option) file No.
94626 (as model No. PC929)
3. Package resin : UL flammability grade (94V-0)
■ Features
■ Applications
1. 14 pin Half pitch type (Lead pitch : 1.27 mm)
1. Inverter
2. Double transfer mold package
(Ideal for Flow Soldering)
3. Built-in IGBT shortcircuit protector circuit
4. Built-in direct drive circuit for IGBT drive
(Peak output current : IO1P, IO2P : MAX. 0.4 A)
5. High speed responce (tPLH, tPHL : MAX. 0.5 µs)
6. High isolation voltage (Viso(rms) : 4.0 kV)
∗
"OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing
circuit integrated onto a single chip.
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A06302EN
1
Date Mar. 26. 2004
© SHARP Corporation
PC929 Series
■ Internal Connection Diagram
14
13 12 11 10
9
8
1
2
3
4
5
6
7
8
9
Cathode
Cathode
Anode
NC∗
FS
C
GND
O2
O1
IGBT protection
circuit
10
11
12
13
14
Interface
Amp.
NC∗
NC∗
VCC
GND
NC∗
∗ No. to pin shall be shorted in the device.
4
7
1
2
3
4
5
6
7
Voltage regulator
■ Truth table
Input
C input-output O2 output FS output
Low level
High level
Low level
High level
High level High level
ON
Low level Low level At operating protection function
Low level High level
OFF
Low level High level
■ Outline Dimensions
(Unit : mm)
2. SMT Gullwing Lead-Form (VDE0884 option)
1. SMT Gullwing Lead-Form [ex. PC929P]
[ex. PC929PY]
1.27±0.25
1.27±0.25
14
8
14
8
SHARP
mark "S"
PC929
PC929
4
V
DE
Date code
Date code
1
7
1
7
Primary side mark
Primary side mark
9.22±0.5
VDE0884 Identification mark
7.62±0.3
9.22±0.5
7.62±0.3
Epoxy resin
Epoxy resin
0.6±0.1
0.6±0.1
+0.4
+0.4
+0.4
+0.4
1.0
1.0
−0
1.0
1.0
−0
−0
−0
+0
+0
10.0
10.0
−0.5
−0.5
Product mass : approx. 0.47g
Sheet No.: D2-A06302EN
2
PC929 Series
Date code (2 digit)
1st digit
2nd digit
Year of production
Month of production
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
Mark
P
Month
Mark
1
Mark
A
B
January
February
March
R
2
S
3
C
T
April
4
D
E
U
May
5
F
V
June
6
H
J
W
X
July
7
August
September
October
November
December
8
K
L
A
9
B
O
N
D
M
N
C
·
·
·
·
·
·
repeats in a 20 year cycle
Country of origin
Japan
Sheet No.: D2-A06302EN
3
PC929 Series
■ Absolute Maximum Ratings
(unless otherwise specified Ta=Topr
)
Parameter
*1Forward current
*2Reverse voltage
Symbol
IF
Rating
Unit
mA
V
20
VR
6
35
Supply voltage
VCC
IO1
V
O1 output current
0.1
A
*3O1 peak output current
IO1P
IO2
0.4
A
O2 output current
0.1
A
*3O2 peak output current
O1 output voltage
IO2P
VO1
PO
0.4
A
35
V
*4Power dissipation
Overcurrent detection voltage
Overcurrent detection current
Error signal output voltage
Error signal output current
*5Total power dissipation
*6Isolation voltage
Operating temperature
Storage temperature
*7Soldering temperature
500
mW
V
VC
VCC
IC
30
mA
V
VFS
IFS
VCC
20
mA
mW
kV
˚C
˚C
˚C
Ptot
550
Viso (rms)
Topr
Tstg
Tsol
4.0
−25 to +80
−55 to +125
260
*1 The derating factors of a absolute maximum ratings due to ambient temperature
are shown in Fig.15
*2 Ta =25˚C
*3 Pulse width≤0.15µs, Duty ratio : 0.01
*4.5 The derating factors of a absolute maximum ratings due to ambient temperature
are shown in Fig.16
*6 AC for 1minute, 40 to 60 %RH, Ta =25˚C, f=60Hz
*7 For 10s
■ Electro-optical Characteristics
(unless otherwise specified Ta=Topr
)
Parameter
Symbol
VF1
VF2
IR
Conditions *8
Ta=25˚C, IF=10mA
Ta=25˚C, IF=0.2mA
Ta=25˚C, VR=5V
MIN.
−
TYP.
1.6
1.5
−
MAX.
1.75
−
Unit
V
Forward voltage
1.2
−
V
Reverse current
10
µA
pF
V
Terminal capacitance
Ct
Ta=25˚C, V=0, f=1kHz
Ta=−10 to +60˚C
−
30
−
250
30
15
Supply voltage
VCC
−
15
−
24
V
VO1L
−
O1 Low level output voltage
O2 High level output voltage
O2 Low level output voltage
O1 leak current
V
=12V, V =−12V, I =0.1A, I =5mA*9
0.2
22
1.2
−
0.4
−
V
CC1
CC2
O1
F
VO2H
VO2L
IO1L
VCC=VO1=24V, IO2=−0.1A, IF=5mA *9
20
−
V
VCC=24V, IO2=0.1A, IF=0
*9
2.0
500
17
V
Ta=25˚C, VCC=VO1=35V, IF=0 *9
Ta=25˚C, VCC=VO1=24V, IF=5mA*9
−
µA
mA
mA
mA
mA
−
10
−
High level supply current
Low level supply current
ICCH
ICCL
VCC=VO1=24V, IF=5mA
Ta=25˚C, VCC=VO1=24V, IF=0 *9
VCC=VO1=24V, IF=0
*9
−
19
−
11
−
18
*9
−
20
*8 It shall connect a by-pass capacitor of 0.01 µF or more between VCC (pin 13 ) and GND (pin, 10 , 14) near the device, when it measures the transfer characteristics and the
output side characteristics.
*9 FS=OPEN, VC=0
Sheet No.: D2-A06302EN
4
PC929 Series
(unless otherwise specified Ta=Topr
)
*10
Parameter
High input threshold current
Symbol
IFLH
Conditions
MIN.
0.3
TYP.
1.5
−
1011
0.3
0.3
0.2
0.2
MAX.
3.0
5.0
−
Unit
mA
mA
Ω
Ta=25˚C,VCC=VO1=24V, FS=OPEN, VC=0
*11
"
Low
→
"
VCC=VO1=24V, FS=OPEN, VC=0
0.2
Isolation resistance
RISO
tPLH
tPHL
tr
Ta=25˚C, DC=500V, 40 to 60%RH 5×1010
"Low→High" propagation delay time
"High→Low" propagation delay time
Rise time
Ta=25˚C,
−
−
−
−
0.5
0.5
0.5
0.5
µs
VCC=VO1=24V, IF=5mA,
RG=47Ω, CG=3 000pF
FS=OPEN, VC=0
µs
µs
Fall time
tf
µs
Ta=25˚C, VCM=600V(p-p)
IF=5mA, VCC=VO1=24V,
∆VO2H=2.0V, FS=OPEN, VC=0
Ta=25˚C, VCM=600V(p-p)
IF=0, VCC=VO1=24V,
∆VO2L=2.0V, FS=OPEN, VC=0
Ta=25˚C
Instantaneous common mode
rejection voltage
(High level output)
CMH
CML
−1.5
−
−
−
−
kV/µs
kV/µs
Instantaneous common mode
rejection voltage
(Low level output)
1.5
*12
Overcurrent detection voltage
VCTH
VCHIS
tPCOHL
tPCOtf
VOE
V
CC−6.5 VCC−6 VCC−5.5
V
V
VCC=VO1=24V
IF=5mA, RG=47Ω
CG=3 000pF, FS=OPEN
Overcurrent detection
voltage hysteresis width
1
−
2
−
2
4
5
−
3
10
−
O2 "High→Low" propagation delay
time at overcurrent protection
Ta=25˚C
VCC=VO1=24V
IF=5mA,
µs
µs
V
O2 Fall time at overcurrent protection
RG=47Ω, CG=3 000pF,
RC=1kΩ, CP=3 000pF
FS=OPEN
O2 "High→Low" output voltage
at overcurrent protection
2
Ta=25˚C, IF=5mA
VCC=VO1=24V
IFS=10mA, RG=47Ω
CG=3 000pF, C=OPEN
Low level error signal voltage
High level error signal voltage
VFSL
−
−
0.2
0.4
V
Ta=25˚C
VCC=VO1=24V, IF=5mA
VFS=24V, RG=47Ω
CG=3 000pF, VC=0
IFSH
−
100
µA
Error signal "High→Low"
propagation delay time
Ta=25˚C, VCC=VO1=24V
IF=5mA, RFS=1.8kΩ
RG=47Ω, RC=1kΩ
tPCFHL
−
1
5
µs
µs
Error signal output pulse width
∆tFS
20
35
−
CG=3 000pF, CP=1 000pF
*10 It shall connect a by-pass capacitor of 0.01 µF or more between VCC (pin 13 ) and GND (pin 10 , 14) near the device, when it measures the device, when it measures the
overcurrent characteristics, Protection output characteristics, and Error signal output characteristics.
*11 IFLH represents forward current when output goes from "Low" to "High"
*12 VCTH is the of C(pin 9 ) voltage when output becomes from "High" to "Low"
Sheet No.: D2-A06302EN
5
PC929 Series
■ Model Line-up
Lead Form
SMT Gullwing
Sleeve
50pcs/sleeve
−−−−−− Approved
PC929 PC929Y
Taping
Package
1 000pcs/reel
VDE0884
Model No.
−−−−−−
PC929P
Approved
PC929PY
Please contact a local SHARP sales representative to inquire about production status and Lead-Free options.
Sheet No.: D2-A06302EN
6
PC929 Series
Fig.1 Test Circuit for O1 Low Level Output
Voltage
Fig.2 Test Circuit for O2 High Level Output
Voltage
13
13
VCC1
3
3
1
12
12
11
IO2
V
VCC
IO1
VO1L
11
PC929
PC929
VCC2
V
IF
IF
V02H
14 10
14 10
1
2
2
9
8
9
8
Fig.3 Test Circuit for O2 Low Level Output
Voltage
Fig.4 Test Circuit for O1 Leak Current
13
13
A
IO1L
3
1
3
1
12
11
12
11
VCC
VCC
PC929
PC929
V
VO2L
IF
IF
IO2
14 10
14 10
2
2
9
8
9
8
Fig.5 Test Circuit for "Low→High" Input
Fig.6 Test Circuit for High Level / Low Level
Supply Current
Threshold Current
13
13
12
11
A
ICC
3
1
3
1
12
11
VCC
VCC
PC929
PC929
V
VO2
IF
IF
14 10
14 10
variable
2
2
9
8
9
8
Sheet No.: D2-A06302EN
7
PC929 Series
Fig.8 Test Circuit for Response Time
Fig.7 Test Circuit for Instantaneous Common
Mode Rejection Voltage
13
13
12
11
3
3
1
12
11
SW
VCC
VCC
CG
RG
VOUT
A
B
tr=tf=0.01µs
Pulse width 5µs
Duty ratio 50%
PC929
PC929
VIN
V
V
VO2
14 10
14 10
1
2
2
9
8
9
8
−
+
VCM
50%
VCM
(peak)
VIN waveform
VCM waveform
tPHL
tPLH
GND
VO2H
90%
50%
10%
CMH, VO2 waveform
SW at A, IF=5mA
VOUT waveform
tf
tr
∆VO2H
∆VO2L
CML, VO2 waveform
SW at B, IF=0mA
VO2L
GND
Fig.9 Test Circuit for Overcurrent Detection Voltage,
Overcurrent Detection Voltage Hysteresis
Fig.10 Test Circuit for O2 Output Voltage at
Overcurrent Protection
13
13
3
3
12
11
12
11
VCC
CG
VCC
CG
RG
RG
PC929
PC929
V
V
VO2
VO2
CP
IF
IF
14 10
14 10
RC
V
VCTH
VC
1
2
1
2
9
8
9
8
Sheet No.: D2-A06302EN
8
PC929 Series
Fig.12 Test Circuit for High Level Error
Fig.11 Test Circuit for O1 Low Level
Error Signal Voltage
Signal Current
13
13
3
3
12
11
12
VCC
CG
VCC
CG
RG
RG
11
PC929
PC929
IF
IF
14 10
14 10
V
1
2
1
2
9
8
9
8
VFSL
IFS
VFS
IFSH
A
Fig.13 Test Circuit for O "High→Low" Propagation
Fig.14 Error Signal "High→Low" propagation Delay
2
Delay Time at Overcurrent Protection, O Fall
Time, Error Signal Output Pulse Width
2
Time at Overcurrent Protection
13
13
RC
3
1
3
1
12
11
12
11
VCC
CG
VCC
CG
RG
VOUT
CP
RG
tr=tf=0.01µs
Pulse width 25µs
Duty ratio 25%
tr=tf=0.01µs
Pulse width 25µs
Duty ratio 25%
PC929
PC929
VIN
VIN
V
14 10
14 10
RC
VOUT
2
2
V
9
8
9
8
RFS
IF
tpCOTF
(Input current)
90%
50%
10%
VO2
(O2 output voltage)
tpCOHL
90%
10%
Error detection threshold voltage (VCTH
)
C
(Detecting terminal)
tpCFHL
∆tFS
FS
(Error signal output)
50%
50%
Sheet No.: D2-A06302EN
9
PC929 Series
Fig.16 Power Dissipation vs. Ambient
Fig.15 Forward Current vs. Ambient
Temperature
Temperature
60
600
550
500
50
40
30
20
Ptot
PO
400
300
200
10
0
100
0
−25
0
25
50
75 80 100
125
−25
0
25
50
75 80 100
125
Ambient temperature Ta (°C)
Ambient temperature Ta (˚C)
Fig.17 Forward Current vs. Forward
Fig.18 "Low→High" Relative Input Threshold
Voltage
100
Current vs. Supply Voltage
1.6
Ta=25°C
1.4
1.2
1.0
10
Ta=0˚C
Value of VCC=24V assumes 1.
1
25˚C
50˚C
70˚C
0.1
0.8
0.6
0.01
15
18
21
24
27
30
1.0
1.2
1.4
1.6
1.8
2.0
2.2
Supply voltage VCC (V)
Forward voltage VF (V)
Fig.19 "Low→High" Relative Input Threshold
Fig.20 O1 Low Level Output Voltage vs.
O1 Output Current
Current vs. Ambient Temperature
1.6
1
Ta=25°C
VCC=24V
VCC1=12V
VCC2=−12V
IF=5mA
1.4
1.2
1.0
0.1
0.8
IFLH = 1 at Ta=25°C
0.6
0.4
0.01
0.2
0.0
0.001
−25
0
25
50
75
100
0.01
0.1
1
Ambient temperature Ta (°C)
O1 output current IO1 (A)
Sheet No.: D2-A06302EN
10
PC929 Series
Fig.22 O1 Leak Current vs. Ambient
Fig.21 O1 Low Level Output Voltage vs.
Ambient Temperature
Temperature
10−6
0.20
VCC=VO1=35V
IF=0mA
VCC1=12V
VCC2=−12V
IF=5mA
10−7
10−8
0.15
0.10
IO1=0.1A
10−9
0.05
0.00
10−10
−25
0
25
50
75
100
−25
0
25
50
75
100
Ambient temperature Ta (°C)
Ambient temperature Ta (°C)
Fig.23 O2 High Level Output Voltage vs.
Supply Voltage
Fig.24 O2 High Level Output Voltage vs.
Ambient Temperature
35
24
Ta=25°C
IF=5mA
VCC=24V
IF=5mA
IO2=−0.1A
30
23
IO2=0A
25
20
15
22
IO2=−0.1A
21
20
19
10
5
15
18
21
24
27
30
−25
0
25
50
75
100
Ambient temperature Ta (°C)
Supply voltage VCC (V)
Fig.25 O2 Low Level Output Voltage vs.
O2 Output Current
Fig.26 O2 Low Level Output Voltage vs.
Ambient Temperature
1.3
10
VCC=24V
Ta=25°C
VCC=24V
IF=5mA
1.2
1
1.1
IO2=−0.1A
1
0.1
0.9
0.8
0.01
0.01
0.1
1
−25
0
25
50
75
100
O2 output current IO2 (A)
Ambient temperature Ta (°C)
Sheet No.: D2-A06302EN
11
PC929 Series
Fig.28 Low Level Supply Current vs.
Fig.27 High Level Supply Current vs. Supply
Voltage
Supply Voltage
16
18
IF=5mA
IF=0mA
Ta=−25˚C
Ta=−25˚C
14
16
14
12
10
12
Ta=25˚C
Ta=25˚C
Ta=80˚C
10
Ta=80˚C
8
6
4
8
6
15
18
21
24
27
30
15
18
21
24
27
30
Supply voltage VCC (V)
Supply voltage VCC (V)
Fig.29 Propagation Delay Time vs. Forward
Fig.30 Propagation Delay Time vs.
Ambient Temperature
Current
1.0
0.5
VCC=24V
RG=47Ω
tPLH
Ta=25°C
IF=5mA
RG=47Ω
0.9
0.8
CG=3 000pF
IF=5mA
0.4
0.3
0.2
CG=3 000pF
0.7
0.6
0.5
0.4
0.3
0.2
tPLH
tPHL
0.1
0
0.1
0
tPHL
0
5
10
15
20
25
−25
0
25
50
75
100
Forward current IF (mA)
Ambient temperature Ta (°C)
Fig.31 Overcurrent Detecting Voltage vs.
Fig.32 O2 Output Fall Time at Protection from Overcurrent/O2 "High-Low"
Ambient Temperature
Propagation Delay Time at Protection from Overcurrent vs. Ambient Temperature
30
10
VCC=24V
VCC=24V
RG=47Ω
CG=3 000pF
IF=5mA
RG=47Ω
tPCOtf
25
8
6
4
CG=3 000pF
RC=1kΩ
CP=1 000pF
IF=5mA
20
15
10
tPCOHL
2
0
5
0
−25
0
25
50
75
100
−25
0
25
50
75
100
Ambient temperature Ta (°C)
Ambient temperature Ta (°C)
Sheet No.: D2-A06302EN
12
PC929 Series
Fig.33 Error Signal "High-Low" Propagation
Delay Time vs. Ambient Temperature
Fig.34 O2 Output Voltage at Protection from
Overcurrent vs. Ambient Temperature
1.5
2.0
VCC=24V
IF=5mA
RG=47Ω
CG=3 000pF
RC=1kΩ
VCC=24V
IF=5mA
RFS=1.8kΩ
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
RG=47Ω
1.2
0.9
0.6
CG=3 000pF
RC=1kΩ
CP=1 000pF
CP=1 000pF
0.3
0
0.2
0.0
−25
0
25
50
75
100
−25
0
25
50
75
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (°C)
Fig.36 High Level Error Signal Current vs.
Fig.35 Low Level Error Signal Voltage vs.
Ambient Temperature
Ambient Temperature
10−6
0.5
VCC=24V
IF=5mA
VCC=24V
IF=5mA
RG=47Ω
CG=3 000pF
VC=0
IFS=10mA
RG=47Ω
0.4
CG=3 000pF
10−7
C=OPEN
0.3
0.2
10−8
0.1
0
10−9
−25
−25
0
25
50
75
100
0
25
50
75
100
Ambient temperature Ta (°C)
Ambient temperature Ta (˚C)
Fig.37 Error signal output pulse width vs.
Ambient Temperature
Fig.38 Overcurrent Detecting Voltage vs.
Supply Voltage
50
25
VCC=24V
IF=5mA
RFS=1.8kΩ
Ta=25˚C
IF=5mA
VCC=24V
RG=47Ω
Added resistance=0Ω
RG=47Ω
40
30
20
20
15
10
CG=3 000pF
RC=1kΩ
CG=3 000pF
RC=1kΩ
FS=OPEN
CP=1 000pF
CP=1 000pF
0.5kΩ
1kΩ
10
0
5
0
1.5kΩ
−25
0
25
50
75
100
15
18
21
24
27
30
Ambient temperature Ta (°C)
Supply voltage VCC (V)
Sheet No.: D2-A06302EN
13
PC929 Series
Fig.39 Overcurrent Detecting Voltage - Supply Voltage Characteristics Test Circuit
VCC
Anode
O1
IF
VCC
Cathode
RG
O2
C
RC
VO2
V
CP
CG
VC
V
FS
GND
Fig.40 Example of The Application Circuit (IGBT Drive for Inverter)
Anode
VCC
(+)
R1
V
CC1=12V
+
+
O1
O2
Cathode
Cathode
RG
CB
RC
Cp
R2
D2
D1
R3
C
FS
TTL, microcomputer,
etc.
V
CC2=12V
GND
(−)
RFS
To microcomputer
PC817X etc.
CFS
• In order to stabilize the power supply line, we recommend to locate a bypass capacitor CB (0.01µF or more)
between VCC and GND near photocoupler.
• In order to stabilize the detecting voltage of pin-C, we recommend to locate a capacitor CP (approximately
1 000pF) between pin-C and GND, and a resistor RC (approximately 1.0kΩ) between VCC and pin-C.
However, the rise time of the detection voltage at Pin-C varies along with the time constants of CP and RC.
So, please make sure the device works properly in actual conditions.
• For the diode D, which is located between pin-C and collector of IGBT, we recommend to use a diode that
has the withstand voltage characteristic equivalent to IGBT and also has little leak current.
• In order to prevent the failure mode or breakdown of pin-C from VCE variation of IGBT, we recommend to
locate a resistor R2 (approximately 10kΩ) and a diode D1 at near pin-C, and a resistor R3 (approximately
50kΩ) and a diode D2 at between pin-C and GND.
This application circuit shows the general example of a circuit, and is not a design guarantee
for right operation.
Sheet No.: D2-A06302EN
14
PC929 Series
Fig.41 Operations of Shortcircuit Protector Circuit
VCC
PC929
VCC
13
Anode
3
O1
O2
12
11
Cathode
Constant voltage circuit
Amp.
1
2
Tr. 1
Cathode
RG
IGBT
Tr. 2
VC
RC
TTL, microcomputer, etc.
Typ. 150kΩ
C
9
8
IGBT protector
circuit
FS
CP
GND
14 10
VEE
Feedback to primary side
1. Detection of increase in VCE(sat) of IGBT due to overcurrent by means of C terminal (pin
2. Reduction of the IGBT gate voltage, and suppression of the collector current
)
9
3. Simultaneous output of signals to indicate the shortcircuit condition (FS signal) from FS (pin
the microcomputer
) terminal to
8
4. Judgement and processing by the microcomputer
In the case of instantaneous shortcircuit, run continues.
At fault, input to the photocoupler is cut off, and IGBT is
turned OFF.
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D2-A06302EN
15
PC929 Series
■ Design Considerations
● Notes about static electricity
Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute de-
sign.
When handling these devices, general countermeasure against static electricity should be taken to avoid
breakdown of devices or degradation of characteristics.
● Design guide
In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of
0.01µF or more between VCC and GND near the device.
We recommed to use approximately 1 000pF of capacitor between C-pin and GND in order to prevent miss
opration by noise.
In the case that capacitor is used approximately 1kΩ of resistance shall be recommended to use between
VCC and C-pin However, the rise time of C-pin shall be changed by time constant of added CR, so that
please use this device after confirmation.
In case that some sudden big noise caused by voltage variation is provided between primary and secondary
terminals of photocoupler some current caused by it is floating capacitance may be generated and result in
false operation since current may go through LED or current may change.
If the photocoupler may be used under the circumstances where noise will be generated we recommend to
use the bypass capacitors at the both ends of LED.
The detector which is used in this device, has parasitic diode between each pins and GND.
There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin
becomes below GND level even for instant.
Therefore it shall be recommended to design the circuit that electric potential of any pin does not become
below GND level.
This product is not designed against irradiation and incorporates non-coherent LED.
Sheet No.: D2-A06302EN
16
PC929 Series
● Degradation
In general, the emission of the LED used in photocouplers will degrade over time.
In the case of long term operation, please take the general LED degradation (50% degradation over 5years)
into the design consideration.
Please decide the input current which become 2times of MAX. IFLH
.
● Recommended Foot Print (reference)
9.0
1.8
(Unit : mm)
✩
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A06302EN
17
PC929 Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
( package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
100
150 to 180˚C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 260˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A06302EN
18
PC929 Series
● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-
tual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
Sheet No.: D2-A06302EN
19
PC929 Series
■ Package specification
● Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50 pcs. of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its primary side mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0
6.7
(Unit : mm)
Sheet No.: D2-A06302EN
20
PC929 Series
● Tape and Reel package
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
J
D
E
G
I
K
Dimensions List
(Unit : mm)
A
B
C
D
E
F
G
+0.1
16.0±0.3
7.5±0.1
1.75±0.1
12.0±0.1
2.0±0.1
4.0±0.1
φ1.5
−0
H
I
J
K
10.4±0.1
0.4±0.05
4.2±0.1
9.7±0.1
Reel structure and Dimensions
e
d
g
Dimensions List
(Unit : mm)
a
b
c
d
330
e
23±1.0
17.5±1.5
100±1.0
13±0.5
f
f
g
b
2.0±0.5
2.0±0.5
a
Direction of product insertion
Pull-out direction
[Packing : 1 000pcs/reel]
Sheet No.: D2-A06302EN
21
PC929 Series
■ Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems rela-
ted to any intellectual property right of a third party re-
sulting from the use of SHARP's devices.
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high lev-
el of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the spec-
ifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufac-
turing locations are also subject to change without no-
tice.
· If the SHARP devices listed in this publication fall with-
in the scope of strategic products described in the For-
eign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP de-
vices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means, elec-
tronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
Sheet No.: D2-A06302EN
22
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