PC957L0YIP0F [SHARP]

Logic IC Output Optocoupler, 1-Element, 5000V Isolation, 1MBps, ROHS COMPLIANT, PLASTIC, SMT, DIP-8;
PC957L0YIP0F
型号: PC957L0YIP0F
厂家: SHARP ELECTRIONIC COMPONENTS    SHARP ELECTRIONIC COMPONENTS
描述:

Logic IC Output Optocoupler, 1-Element, 5000V Isolation, 1MBps, ROHS COMPLIANT, PLASTIC, SMT, DIP-8

输出元件 光电
文件: 总13页 (文件大小:232K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PC957L0NSZ0F Series  
High Speed 1Mb/s, High CMR  
DIP 8 pin OPIC  
Photocoupler  
PC957L0NSZ0F  
Series  
Description  
Agency approvals/Compliance  
PC957L0NSZ0F Series contains a LED optically  
1. Recognized by UL1577 (Double protection isolation),  
coupled to an OPIC chip.  
It is packaged in a 8 pin DIP, available in SMT  
gullwing lead-form option.  
Input-output isolation voltage(rms) is 5.0 kV, High  
speed response (TYP. 1Mb/s) and CMR is MIN.  
15 kV/µs.  
file No. E64380 (as model No. PC957L)  
2. Approved by VDE, DIN EN60747-5-2() (as an  
option), file No. 40008898 (as model No. PC957L)  
3. Package resin : UL flammability grade (94V-0)  
()DIN EN60747-5-2 : successor standard of DIN VDE0884  
Features  
1. 8 pin DIP package  
2. Double transfer mold package  
(Ideal for Flow Soldering)  
Applications  
1. Programmable controllers  
2. Inverter  
3. High speed response  
(tPHL : TYP. 0.2 µs, tPLH : TYP. 0.4 µs)  
4. High noise immunity due to high instantaneous  
common mode rejection voltage (CMH : MIN. 15  
kV/µs, CML : MIN. 15 kV/µs)  
5. High isolation voltage between input and output  
(Viso(rms) : 5.0 kV)  
6. Lead-free and RoHS directive compliant  
"OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing  
circuit integrated onto a single chip.  
Notice The content of data sheet is subject to change without prior notice.  
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP  
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.  
Sheet No.: D2-A06402EN  
1
Date Jun. 30. 2005  
© SHARP Corporation  
PC957L0NSZ0F Series  
Internal Connection Diagram  
8
7
6
5
1
2
3
4
5
6
7
NC  
GND  
VO (Open collector)  
NC  
Anode  
Cathode  
NC  
8 VCC  
1
2
3
4
Outline Dimensions  
(Unit : mm)  
1. Through-Hole [ex. PC957L0NSZ0F]  
2. Through-Hole (VDE option) [ex. PC957L0YSZ0F]  
1.2±0.3  
1.2±0.3  
0.85±0.2  
0.85±0.2  
SHARP  
SHARP  
mark  
"S"  
mark  
8
7
6
5
8
7
6
5
"S"  
P C 9 5 7 L  
P C 9 5 7 L  
4
VDE Identification mark  
Date code  
1
2
3
4
1
2
3
4
9.66±0.5  
9.66±0.5  
Date code  
Primary side  
mark  
Primary side  
mark  
7.62±0.3  
7.62±0.3  
Epoxy resin  
0.26±0.1  
Epoxy resin  
0.26±0.1  
2.54±0.25  
2.54±0.25  
0.5±0.1  
0.5±0.1  
θ
θ
θ
θ
θ:0 to 13˚  
θ:0 to 13˚  
Product mass : approx. 0.55g  
Product mass : approx. 0.55g  
3. SMT Gullwing Lead-Form [ex. PC957L0NIP0F]  
4. SMT Gullwing Lead-Form (VDE option)  
[ex. PC957L0YIP0F]  
1.2±0.3  
1.2±0.3  
0.85±0.2  
0.85±0.2  
SHARP  
mark  
"S"  
SHARP  
mark  
"S"  
8
7
6
5
8
7
6
5
P C 9 5 7 L  
P C 9 5 7 L  
4
VDE Identification mark  
Date code  
1
2
3
4
1
2
3
4
9.66±0.5  
9.66±0.5  
Date code  
Primary side  
mark  
Primary side  
mark  
7.62±0.3  
7.62±0.3  
Epoxy resin  
Epoxy resin  
+0.4  
+0.4  
+0.4  
+0.4  
2.54±0.25  
0  
0  
2.54±0.25  
0  
0  
1.0  
1.0  
1.0  
1.0  
+0  
+0  
10.0  
10.0  
0.5  
0.5  
Product mass : approx. 0.51g  
Product mass : approx. 0.51g  
Plating material : SnCu (Cu : TYP. 2%)  
Sheet No.: D2-A06402EN  
2
PC957L0NSZ0F Series  
Date code (2 digit)  
1st digit  
2nd digit  
Year of production  
Month of production  
A.D.  
1990  
1991  
1992  
1993  
1994  
1995  
1996  
1997  
1998  
1999  
2000  
2001  
A.D  
2002  
2003  
2004  
2005  
2006  
2007  
2008  
2009  
2010  
2011  
2012  
Mark  
P
Month  
Mark  
1
Mark  
A
B
January  
February  
March  
R
2
S
3
C
T
April  
4
D
E
U
May  
5
F
V
June  
6
H
J
W
X
July  
7
August  
September  
October  
November  
December  
8
K
L
A
9
B
O
N
D
M
N
C
·
·
·
·
·
·
repeats in a 20 year cycle  
Country of origin  
Japan  
Rank mark  
There is no rank mark indicator.  
Sheet No.: D2-A06402EN  
3
PC957L0NSZ0F Series  
Absolute Maximum Ratings  
(Ta=25˚C)  
Unit  
Parameter  
Symbol  
IF  
Rating  
*1 Forward current  
Reverse voltage  
*2 Power dissipation  
Supply voltage  
Output voltage  
Output current  
*3 Power dissipation  
25  
mA  
Input  
VR  
5
45  
V
mW  
P
VCC  
VO  
0.5 to +30  
0.5 to +20  
8
V
V
mA  
Output  
IO  
PO  
100  
mW  
˚C  
Operating temperature  
Storage temperature  
*4 Isolation voltage  
Topr  
Tstg  
Viso (rms)  
55 to +85  
55 to +125  
5.0  
˚C  
kV  
*5 Soldering temperature  
˚C  
270  
Tsol  
*1 When ambient temperature goes above 70˚C, the power dissipation goes down at  
0.8mA/˚C. (Fig.3)  
*2 When ambient temperature goes above 70˚C, the power dissipation goes down at  
1.5mW/˚C. (Fig.4)  
*3 When ambient temperature goes above 70˚C, the power dissipation goes down at  
1.8mW/˚C. (Fig.4)  
*4 40 to 60%RH, AC for 1minute, f=60Hz  
*5 For 10s  
Electro-optical Characteristics*6  
(Unless otherwise specified Ta=0 to 70˚C)  
Parameter  
Symbol  
VF  
Conditions  
MIN.  
TYP. MAX.  
Unit  
V
Forward voltage  
Ta=25˚C, IF=16mA  
1.7  
1.95  
10  
150  
500  
1
Input  
Reverse current  
IR  
Ta=25˚C, VR=5V  
µA  
pF  
nA  
µA  
µA  
V
Terminal capacitance  
High level output current (1)  
High level output current (2)  
High level output current (3)  
Ct  
Ta=25˚C, V=0, f=1MHz  
60  
3
IOH (1)  
IOH (2)  
IOH (3)  
VOL  
Ta=25˚C, IF=0, VCC=VO=5.5V  
Ta=25˚C, IF=0, VCC=VO=15V  
IF=0, VCC=VO=15V  
0.01  
50  
0.4  
Output Low level output voltage  
Low level supply current  
High level supply current (1)  
High level supply current (2)  
Current transfer ratio (1)  
Current transfer ratio (2)  
Isolation resistance  
IF=16mA, VCC=4.5V, IO=2.4mA  
IF=16mA, VCC=15V, VO=OPEN  
Ta=25˚C, IF=0, VCC=15V, VO=OPEN  
IF=0, VCC=15V, VO=OPEN  
Ta=25˚C, IF=16mA, VCC=4.5V, VO=0.4V  
IF=16mA, VCC=4.5V, VO=0.4V  
Ta=25˚C, DC500V, 40 to 60%RH  
Ta=25˚C, V=0, f=1MHz  
0.1  
120  
0.02  
ICCL  
µA  
µA  
µA  
%
I
CCH (1)  
1
ICCH (2)  
CTR (1)  
CTR (2)  
RISO  
19  
2
50  
%
15  
5×1010  
1011  
0.6  
0.2  
0.4  
1
Floating capacitance  
Cf  
pF  
µs  
Transfer  
charac-  
teristics  
"HighLow" propagation delay time  
tpHL  
0.8  
0.8  
Ta=25˚C, IF=16mA  
VCC=5V, RL=1.9Ω  
"LowHigh" propagation delay time  
tpLH  
µs  
Instantaneous common mode  
rejection voltage  
Ta=25˚C, IF=0, VCC=5V  
VCM=1.0kV(p-p), RL=1.9kΩ  
15  
30  
kV/µs  
kV/µs  
CMH  
CML  
(High level output)  
Instantaneous common mode  
rejection voltage  
(Low level output)  
Ta=25˚C, IF=16mA, VCC=5V  
VCM=1.0kV(p-p), RL=1.9kΩ  
15  
30  
*6 It shall connect a by-pass capacitor of 0.01µF or more between VCC (pin 8 ) and GND (pin 5 ) near the device, when it measures transfer characteristics and the output side  
characteristics.  
Sheet No.: D2-A06402EN  
4
PC957L0NSZ0F Series  
Model Line-up  
Lead Form  
Through-Hole  
Sleeve  
SMT Gullwing  
Taping  
Package  
50pcs/sleeve  
1 000pcs/reel  
DIN EN60747-5-2  
−−−−−−  
Approved  
−−−−−−  
Approved  
Model No.  
PC957L0NSZ0F PC957L0YSZ0F PC957L0NIP0F PC957L0YIP0F  
Please contact a local SHARP sales representative to inquire about production status.  
Sheet No.: D2-A06402EN  
5
PC957L0NSZ0F Series  
Fig.1 Test Circuit for Propagation Delay Time  
Pulse input  
Pulse width  
IF  
0
10µs  
IF  
VO  
5V  
1
2
3
4
8
7
6
5
VCC  
VO  
Duty  
ratio1/10  
RL  
1.5V  
1.5V  
VOL  
0.01  
µF  
CL  
IF monitor  
tPLH  
tPHL  
100Ω  
*CL includes the probe  
and wiring capacitance.  
Fig.2 Test Circuit for Instantaneous Common Mode Rejection Voltage  
1.0kV  
VCM  
10%  
90%  
90%  
IF  
10%  
1
2
3
4
8
7
6
5
V
CC=5V  
0V  
RL  
VO  
GL SW  
B
CMH  
VO  
When the switch for  
LED sets to A.  
0.01µF  
5V  
A
2V  
IF=0  
CL  
CML  
VO  
VFF  
VCM  
0.8V  
When the switch for  
LED sets to B.  
VOL  
+
IF=16mA  
*CL includes the probe and wiring capacitance.  
Fig.3 Forward Current vs. Ambient  
Temperature  
Fig.4 Power Dissipation vs. Ambient  
Temperature  
PO  
100  
25  
20  
15  
10  
5
80  
60  
P
45  
40  
20  
70  
85  
70  
85  
0
55  
0
55  
0
25  
50  
75  
100  
125  
0
25  
50  
75  
100  
125  
Ambient temperature Ta (˚C)  
Ambient temperature Ta (˚C)  
Sheet No.: D2-A06402EN  
6
PC957L0NSZ0F Series  
Fig.5 Forward Current vs. Forward Voltage  
Fig.6 Relative Current Transfer Ratio vs.  
Forward Current  
100  
200  
VCC=4.5V  
VO=0.4V  
Ta=25˚C  
150  
10  
Ta=25˚C  
Ta=0˚C  
100  
50  
Ta=50˚C  
Ta=25˚C  
1
Ta=70˚C  
Ta=55˚C  
CTR=100% at IF=16mA  
0.1  
1.0  
0
0.1  
1.2  
1.4  
1.6  
1.8  
2.0  
1
10  
100  
Forward voltage VF (V)  
Forward current IF (mA)  
Fig.7 Output Current vs. Output Voltage  
Fig.8 Relative Current Transfer Ratio vs.  
Ambient Temperature  
18  
150  
IF=16mA  
Ta=25˚C  
VCC=5V  
Dotted line shows  
pulse characteristics  
140  
130  
120  
110  
100  
90  
16  
14  
12  
10  
8
VCC=4.5V  
VO=0.4V  
IF=25mA  
IF=20mA  
IF=15mA  
IF=10mA  
6
80  
4
70  
60  
IF=5mA  
2
0
CTR=100% at Ta=25˚C  
50  
0
2
4
6
8
10 12 14 16 18 20  
55 40 20  
0
20  
40  
60  
80 100  
Output voltage VO (V)  
Ambient temperature Ta (˚C)  
Fig.9 High Level Output Current vs.  
Ambient Temperature  
Fig.10 Propagation Delay Time vs. Ambient  
Temperature  
800  
1 000  
IF=0  
IF=16mA  
VCC=5V  
RL=1.9kΩ  
600  
100  
tPLH  
VCC=VO=5.5V  
400  
10  
VCC=VO=15V  
200  
1
VCC=VO=30V  
tPHL  
0
0.1  
25  
55 40 20  
0
20  
40  
60  
80 100  
0
25  
50  
75  
100  
Ambient temperature Ta (˚C)  
Ambient temperature Ta (˚C)  
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.  
7
Sheet No.: D2-A06402EN  
PC957L0NSZ0F Series  
Design Considerations  
Recommended operating conditions  
MAX.  
16  
Unit  
mA  
V
Symbol  
Parameter  
MIN.  
TYP.  
IF  
Input current  
7
0
5
VCC  
N
Supply voltage  
Fan out (TTL load)  
Operating temperature  
5
Topr  
+70  
˚C  
Notes about static electricity  
Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute  
design.  
When handling these devices, general countermeasure against static electricity should be taken to avoid  
breakdown of devices or degradation of characteristics.  
Design guide  
In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of  
0.01µF or more between VCC and GND near the device.  
In case that some sudden big noise caused by voltage variation is provided between primary and secondary  
terminals of photocoupler some current caused by it is floating capacitance may be generated and result in  
false operation since current may go through LED or current may change.  
If the photocoupler may be used under the circumstances where noise will be generated we recommend to  
use the bypass capacitors at the both ends of LED.  
The detector which is used in this device, has parasitic diode between each pins and GND.  
There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin  
becomes below GND level even for instant.  
Therefore it shall be recommended to design the circuit that electric potential of any pin does not become  
below GND level.  
This product is not designed against irradiation and incorporates non-coherent LED.  
Degradation  
In general, the emission of the LED used in photocouplers will degrade over time.  
In the case of long term operation, please take the general LED degradation (50% degradation over 5 years)  
into the design consideration.  
Recommended Foot Print (reference)  
8.2  
2.2  
(Unit : mm)  
For additional design assistance, please review our corresponding Optoelectronic Application Notes.  
Sheet No.: D2-A06402EN  
8
PC957L0NSZ0F Series  
Manufacturing Guidelines  
Soldering Method  
Reflow Soldering:  
Reflow soldering should follow the temperature profile shown below.  
Soldering should not exceed the curve of temperature profile and time.  
Please don't solder more than twice.  
(˚C)  
300  
Terminal : 260˚C peak  
( package surface : 250˚C peak)  
200  
Reflow  
220˚C or more, 60s or less  
Preheat  
100  
150 to 180˚C, 120s or less  
0
0
1
2
3
4
(min)  
Flow Soldering :  
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below  
listed guidelines.  
Flow soldering should be completed below 270˚C and within 10s.  
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.  
Please don't solder more than twice.  
Hand soldering  
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.  
Please don't solder more than twice.  
Other notices  
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact  
on the junction between the device and PCB varies depending on the tooling and soldering conditions.  
Sheet No.: D2-A06402EN  
9
PC957L0NSZ0F Series  
Cleaning instructions  
Solvent cleaning:  
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less  
Ultrasonic cleaning:  
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,  
size of PCB and mounting method of the device.  
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of  
mass production.  
Recommended solvent materials:  
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol  
In case the other type of solvent materials are intended to be used, please make sure they work fine in  
actual using conditions since some materials may erode the packaging resin.  
Presence of ODC  
This product shall not contain the following materials.  
And they are not used in the production process for this product.  
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)  
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.  
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).  
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated  
diphenyl ethers (PBDE).  
Sheet No.: D2-A06402EN  
10  
PC957L0NSZ0F Series  
Package specification  
Sleeve package  
Package materials  
Sleeve : HIPS (with anti-static material)  
Stopper : Styrene-Elastomer  
Package method  
MAX. 50 pcs. of products shall be packaged in a sleeve.  
Both ends shall be closed by tabbed and tabless stoppers.  
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.  
MAX. 20 sleeves in one case.  
Sleeve outline dimensions  
12.0  
6.7  
(Unit : mm)  
Sheet No.: D2-A06402EN  
11  
PC957L0NSZ0F Series  
Tape and Reel package  
Package materials  
Carrier tape : A-PET (with anti-static material)  
Cover tape : PET (three layer system)  
Reel : PS  
Carrier tape structure and Dimensions  
F
J
D
E
G
I
K
Dimensions List  
(Unit : mm)  
A
B
C
D
E
F
G
+0.1  
16.0±0.3  
7.5±0.1  
1.75±0.1  
12.0±0.1  
2.0±0.1  
4.0±0.1  
φ1.5  
0  
H
I
J
K
10.4±0.1  
0.4±0.05  
4.2±0.1  
10.2±0.1  
Reel structure and Dimensions  
e
d
g
Dimensions List  
(Unit : mm)  
a
b
c
d
330  
e
23±1.0  
17.5±1.5  
100±1.0  
13±0.5  
f
f
g
b
2.0±0.5  
2.0±0.5  
a
Direction of product insertion  
Pull-out direction  
[Packing : 1 000pcs/reel]  
Sheet No.: D2-A06402EN  
12  
PC957L0NSZ0F Series  
Important Notices  
· The circuit application examples in this publication are  
provided to explain representative applications of  
SHARP devices and are not intended to guarantee any  
circuit design or license any intellectual property rights.  
SHARP takes no responsibility for any problems  
related to any intellectual property right of a third party  
resulting from the use of SHARP's devices.  
with equipment that requires higher reliability such as:  
--- Transportation control and safety equipment (i.e.,  
aircraft, trains, automobiles, etc.)  
--- Traffic signals  
--- Gas leakage sensor breakers  
--- Alarm equipment  
--- Various safety devices, etc.  
(iii) SHARP devices shall not be used for or in  
connection with equipment that requires an extremely  
high level of reliability and safety such as:  
--- Space applications  
--- Telecommunication equipment [trunk lines]  
--- Nuclear power control equipment  
--- Medical and other life support equipment (e.g.,  
scuba).  
· Contact SHARP in order to obtain the latest device  
specification sheets before using any SHARP device.  
SHARP reserves the right to make changes in the  
specifications, characteristics, data, materials,  
structure, and other contents described herein at any  
time without notice in order to improve design or  
reliability. Manufacturing locations are also subject to  
change without notice.  
· If the SHARP devices listed in this publication fall  
within the scope of strategic products described in the  
Foreign Exchange and Foreign Trade Law of Japan, it  
is necessary to obtain approval to export such SHARP  
devices.  
· Observe the following points when using any devices  
in this publication. SHARP takes no responsibility for  
damage caused by improper use of the devices which  
does not meet the conditions and absolute maximum  
ratings to be used specified in the relevant specification  
sheet nor meet the following conditions:  
(i) The devices in this publication are designed for use  
in general electronic equipment designs such as:  
--- Personal computers  
--- Office automation equipment  
--- Telecommunication equipment [terminal]  
--- Test and measurement equipment  
--- Industrial control  
--- Audio visual equipment  
· This publication is the proprietary product of SHARP  
and is copyrighted, with all rights reserved. Under the  
copyright laws, no part of this publication may be  
reproduced or transmitted in any form or by any  
means, electronic or mechanical, for any purpose, in  
whole or in part, without the express written permission  
of SHARP. Express written permission is also required  
before any use of this publication may be made by a  
third party.  
--- Consumer electronics  
(ii) Measures such as fail-safe function and redundant  
design should be taken to ensure reliability and safety  
when SHARP devices are used for or in connection  
· Contact and consult with a SHARP representative if  
there are any questions about the contents of this  
publication.  
[E237]  
Sheet No.: D2-A06402EN  
13  

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TDK