PQ1CZ21H2Z [SHARP]
Low Dissipation Current at OFF-state Chopper Regulator; 低功耗关断电流状态斩波稳压器
| 型号： | PQ1CZ21H2Z |
| 厂家： | 
SHARP ELECTRIONIC COMPONENTS |
| 描述： | Low Dissipation Current at OFF-state Chopper Regulator |
| 文件： | 总8页 (文件大小：85K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PQ1CZ21H2Z
Low Dissipation Current at
OFF-state Chopper Regulator
PQ1CZ21H2Z
ꢀ Outline Dimensions
ꢀ Features
(Unit : mm)
1. Maximum switching current:1.5A
2. Low dissipation current at OFF-state (Iqs=Max. 1µA)
3. Built-in oscillation circuit
6.6MAX.
5.2±0.5
2.3±0.5
(0.5)
(Oscillation frequency:TYP.100kHz)
4. Built-in overheat/overcurrent protection function
5. Variable output voltage
3
Epoxy resin
1CZ21H
(Output variable range:Vref to 35V/−Vref to −30V)
[Possible to select step-down output/inversing output
according to external connection circuit]
PQ1CZ21H2ZZ:sleeve-packaged product
PQ1CZ21H2ZP:tape-packaged product
(0 to 0.25)
+0.2
0.5
−0.1
(0.5)
4−(1.27)
ꢀ Applications
1. Facsimiles
1
2
3
4
5
VIN
VOUT
2. Printers
3. Switching power supplies
GND (Common to heat sink)
OADJ
ON/OFF control
1
2
3
4
5
ꢀ Absolute Maximum Ratings
(Ta=25°C)
( ) : Typical dimensions
Parameter
*1 Input voltage
Symbol
Rating
Unit
V
VIN
40
V
Output adjustment terminal voltage
Dropout voltage
*2 Output-COM voltage
*3 ON/OFF control voltage
Switching current
VADJ
VI-O
VOUT
VC
7
V
41
V
−1
V
−0.3 to +40
A
1.5
8
ISW
*4 Power dissipation
PD
W
*5 Junction temperature
Operating temperature
Storage temperature
*6Soldering temperature
Tj
˚C
˚C
˚C
˚C
150
−40 to +85
−40 to +150
260
Topr
Tstg
Tsol
*1 Voltage between V terminal and COM terminal
IN
*2 Voltage between V
terminal and COM terminal
OUT
*3 Voltage between ON/OFF control and COM terminal
*4 P :With infinite heat sink
D
*5 Overheat protection may operate at the condition T :125˚C to 150˚C
j
*6 For 10s
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/
PQ1CZ21H2Z
(Unless otherwise specified, condition shall be VIN=12V, IO=0.2A, VO=5V, ON-OFF terminal=2.7V, Ta=25˚C)
ꢀ Electrical Characteristics
Parameter
Symbol
Conditions
ISW=1A
MIN. TYP. MAX. Unit
Output saturation voltage
Reference voltage
VSAT
Vref
−
1.235
0.9
1.5
1.285
−
V
V
1.26
−
Reference voltage temperature fluctuation
Load regulation
∆Vref
|RegL|
|RegI|
η
Tj=0 to 125˚C
IO=0.2 to 1A
VIN=8 to 35V
IO=1A
−
−
±0.5
0.1
0.5
82
100
±3
2
%
1.5
2.5
−
%
Line regulation
−
%
Efficiency
−
%
Oscillation frequency
fO
−
120
−
80
−
kHz
Tj=0 to 125˚C
No L, C, D
Oscillation frequency temperature fluctuation
Overcurrent detecting level
ON threshold voltage
∆fO
%
A
IL
1.55
0.8
−
2.6
2
4
5
terminal=0V, terminal
VTH(ON)
IC (ON)
IC (OFF)
ISD
1.5
−
V
5
terminal=2.7V
terminal=0.4V
Output ON control current
Output OFF control current
Stand-by current
200
2
µA
µA
µA
mA
5
−
−
5
VIN=40V, terminal=0V
−
−
1
4
VIN=40V, terminal=3V
Output OFF-state consumption current
IQS
−
8
12
Fig.1 Standard Test Circuit
4
L
IO
210µH
1
2
VO
PQ1CZ21H2Z
ISD
Iqs
A
R2
5
+
+
Load
3
VIN
CO
A
IC (ON)
IC (OFF)
D
CIN
470µF
100µF
R1
1kΩ
ON/OFF control logic
L : HK-14D100-2110 (made by Toho Co.)
D :ERC80-004 (made by Fuji electronics Co.)
5 pin
LOW
HIGH
OPEN
Output
OFF
ON
OFF
Fig.2 Power Dissipation vs. Ambient
Fig.3 Overcurrent Protection Characteristics
Temperature
10
(Typical value)
7
Ta=25°C
6
5
4
3
2
VIN=12V
VO=5V
PD : With infinite heat sink
8
5
1
0
0
−40
−20
0
20
Ambient temperature Ta (°C)
Note) Oblique line prtion:Overheat protection may operate in this area
40
60
80 85
0
0.5
1
1.5
2
2.5
3
3.5
4
Output current IO (A)
PQ1CZ21H2Z
Fig.5 Switching Current vs. Output
Fig.4 Efficiency vs. Input Current
Saturation Voltage
1.2
100
VO=12V, IO=1A
VO=12V, IO=0.2A
Tj=25°C
Tj=25°C
1
0.8
0.6
0.4
90
80
70
VO=5V, IO=1A
VO=5V, IO=0.2A
60
50
0.2
0
0
0.5
1
1.5
2
0
10
20
Input voltage VIN (V)
30
40
Switching current ISW (A)
Fig.6 Reference Voltage Fluctuation vs.
Fig.7 Load Regulation vs. Output Current
Junction Temperature
2
1
VIN=12V
VO=5V
Tj=25˚C
VIN=12V
VO=5V
1
0
0.5
0
−1
−2
−0.5
−50 −25
0
25
50
75
100 125
0
0.2
0.4
0.6
0.8
1
1.2
Junction temperature Tj (°C)
Output current IO (A)
Fig.8 Line Regulation vs. Input Voltage
Fig.9 Oscillation Frequency Fluctuation
vs. Junction Temperature
1
2
VIN=12V
VO=5V
0
0.5
−2
−4
−6
0
Tj=25°C
VO=5V
IO=0.2A
−8
−0.5
−10
−50 −25
0
5
10
15
20
25
30
35
40
0
25
50
75
100 125
Input voltage VIN (V)
Junction temperature Tj (°C)
PQ1CZ21H2Z
Fig.10 Overcurrent Detection Level Fluctuation
Fig.11 ON Threshold Voltage vs. Junction
vs. Junction Temperature
Temperature
6
2
VIN=12V
4
2
1.5
0
1
−2
−4
0.5
0
−6
−8
−50 −25
0
25
50
75
100 125
−50 −25
0
25
50
75 100 125 150
Junction temperature Tj (°C)
Junction temperature Tj (°C)
Fig.12 Operating Consumption Current vs.
Input Voltage
10
Tj=25°C
VO=5V
9
IO=1A
8
IO=0.2A
7
No load
6
5
0
10
20
30
40
Input voltage VIN (V)
Fig.13 Power Dissipation vs. Ambient
Temperature (Typical Value)
3
Cu area 740mm2
2
PWB
Cu area 180mm2
Cu area 100mm2
PWB
Cu
Cu area 70mm2
1
Cu area 36mm2
Material : Glass-cloth epoxy resin
Size : 50×50×1.6mm
Cu thickness : 35µm
0
−40
−20
0
20
40
60
8085
Ambient temperature Ta (°C)
PQ1CZ21H2Z
Fig.14 Block Diagram
1
2
Voltage regulator
PWM COMP.
_
+
ON/
OFF
5
F/F
Q
S
ERROR AMP.
R
OSC.
Overcurrent
detection circuit
_
4
1
VIN
VOUT
+
2
3
GND (Common to heat sink)
Oadj
ON/OFF control
Vref
4
5
Overheat
detection circuit
3
Fig.15 Step Down Type Circuit Diagram (5V output)
4
L
210µH
1
2
VO 5V
PQ1CZ21H2Z
5
R2
3kΩ
+
+
Load
3
VIN
D
CIN
CO
8 to 35V
100µF
470µF
R1
1kΩ
ON/OFF control signal
Fig.16 Polarity Inversion Type Circuit Diagram (-5V output)
4
L
130µH
1
2
5
PQ1CZ21H2Z
R2
3kΩ
+
+
Load
3
VIN
D
CO
CIN
5 to 30V
100µF
2200µF
R1
1kΩ
VO −5V
ON/OFF control signal
PQ1CZ21H2Z
ꢀꢀPrecautions for Use
1. External connection
(1) Wiring condition is very important. Noise associated with wiring inductance may cause problems.
For minimizing inductance, it is recommended to design the thick and short pattern (between large current diodos, input/output
capacitors, and terminal 1,2.) Single-point grounding (as indicated) should be used for best results.
(2) High switching speed and low forward voltage type schottky barrier diode should be recommended for the catch-diode D
because it affects the efficiency. Please select the diode which the current rating is at least 1.2 times greater than maximum
swiching current.
(3) The output ripple voltage is highly influenced by ESR(Equivalent Series Resistor)of output capacitor, and can be minimized by
selecting Low ESR capacitor.
(4) An inductor should not be operated beyond its maximum rated current so that it may not saturate.
1
2
, there is the case that the device is broken. Especially, in case
(5) When voltage that is higher than VIN , is applied to VOUT
1
VIN is shorted to GND in normal condition, there is the case that the device is broken since the charged electric charge in
output capacitor (CO) flows into input side. In such case a schottly barrier diode or a silicon diode shall be recommended to
connect as the following circuit.
4
L
VO
1
2
5
PQ1CZ21H2Z
R2
VIN
+
+
3
Load
D
CO
CIN
R1
C-MOS or TTL
1
2
PQ1CZ21H2Z
PQ1CZ21H2Z
ꢀꢀThermal Protection Design
Internal power dissipation(P)of device is generally obtained by the following equation.
P=ISW(Average.) × VSAT×D' + VIN(voltage between VIN to COM terminal)× IQ'(consumption current)
Step down type
––––––––––––––
Ton
VO+VF
VIN–VSAT+VF
–––––––– –––––––––––––
D'(Duty)=
=
T(period)
ISW(Average)= IO(Output current.)
Polarity inversion type
––––––––––––––––––––
Ton
|VO|+VF
VIN+|VO|–VSAT+VF
–––––––– ––––––––––––––––––––
D'(Duty)=
=
T(period)
1
––––––––
ISW(Average)=
× IO(Output current.)
1–D'
VF : Forward voltage of the diode
When ambient temperature Ta and power dissipation PD(MAX)during operation are determined, use Cu plate which allows the
element to operate within the safety operation area specified by the derating curve. Insufficient radiation gives an unfavorable
influence to the normal operation and reliability of the device.
ꢀꢀON/OFF Control Terminal
5
1. In the following circuit,when ON/OFF control terminal becomes low by switching transistor Tr on, output voltage may be turned
OFF and the device becomes stand-by mode. Dissipation current at stand-by mode becomes Max.1µA.
5
2. ON/OFF control terminal
is compatible with LS-TTL. It enables to be directly drive by TTL or C-MOS standard logic
(RCA4000 series). If ON/OFF control terminal is not used, it is recommended to directly connect applicable terminals with input
terminal.
4
IO
L
VO
1
2
PQ1CZ21H2Z
5
R2
+
+
Load
3
VIN
D
CO
CIN
R1
C-MOS or TTL
Application Circuits
NOTICE
●The circuit application examples in this publication are provided to explain representative applications of
SHARP devices and are not intended to guarantee any circuit design or license any intellectual property
rights. SHARP takes no responsibility for any problems related to any intellectual property right of a
third party resulting from the use of SHARP's devices.
●Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials,
structure, and other contents described herein at any time without notice in order to improve design or
reliability. Manufacturing locations are also subject to change without notice.
●Observe the following points when using any devices in this publication. SHARP takes no responsibility
for damage caused by improper use of the devices which does not meet the conditions and absolute
maximum ratings to be used specified in the relevant specification sheet nor meet the following
conditions:
(i) The devices in this publication are designed for use in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and
safety when SHARP devices are used for or in connection with equipment that requires higher
reliability such as:
--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g., scuba).
●Contact a SHARP representative in advance when intending to use SHARP devices for any "specific"
applications other than those recommended by SHARP or when it is unclear which category mentioned
above controls the intended use.
●If the SHARP devices listed in this publication fall within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export
such SHARP devices.
●This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in whole or in part, without the express written
permission of SHARP. Express written permission is also required before any use of this publication
may be made by a third party.
●Contact and consult with a SHARP representative if there are any questions about the contents of this
publication.
115
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