PR3BMF51NSLF [SHARP]

Trigger Output SSR,;


型号：	PR3BMF51NSLF
厂家：	SHARP ELECTRIONIC COMPONENTS
描述：	Trigger Output SSR, 输出元件光电
文件：	总12页 (文件大小：634K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

PR3BMF51NSLF

I_T(rms)≦1.2A, Non-Zero Cross type

DIP 8pin

Triac output SSR

■Description

■Agency approvals/Compliance

PR3BMF51NSLF Solid State Relay (SSR) is an

integration of an infrared emitting diode (IRED),

a Phototriac Detector and a main output Triac. This

device is ideally suited for controlling high voltage

AC loads with solid state reliability while providing

4kV isolation (V_iso(rms)) from input to output.

1. Approved by UL file No.E94758

(as model No.R3BMF5)

2. Approved by CSA file No.LR63705

(as model No.R3BMF5)

3. Optionary approved by VDE

(DIN EN 60747-5-5), file No.40008898

(as model No.R3BMF5)

4. Package resin : UL flammability grade (94V-0)

■Features

■Applications

1. Output current, I_T(rms)≤1.2A

2. Non-zero crossing functionary

3. 8 pin DIP package

4. High repetitive peak off-state voltage

(V_DRM: 600V)

5. Superior noise immunity (dV/dt : MIN. 100V/μs)

6. Response time, t_on: MAX. 100μs

7. High isolation voltage between input and output

(V_iso(rms) : 4kV)

1. Isolated interface between high voltage AC devices

and lower voltage DC control circuitry.

2. Switching motors, fans, heaters, solenoids, and

valves.

3. Phase or power control in applications such as

lighting and temperature control equipment.

8. RoHS directive compliant

Notice The content of data sheet is subject to change without prior notice.

In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP

devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.

Sheet No.: OP14009EN

PR3BMF51NSLF

■Pin-Number and internal connection diagram

⑧

①

① : Cathode

② : Anode

⑤ : Gate

⑥ : T₁

②

③

③ : Cathode

④ : Cathode

⑧ : T₂

⑥

⑤

④

■Outline

Burr

Max. 0.2

Brand name "S"

Anode mark

Factory identification

mark *2

Date Code *1

Business dealing

name identification

mark *3

6.5

0.5

Rank mark

9.66^±0.50

7.62^±0.30

Epoxy resin

0.26^±0.10

0.5^±0.1

θ:0～13

Marking is laser marking

*1) 2-digit number shall be marked according to OLD DIN standard.

*2) Factory identification mark applies to the below.

Without : SUN-S Corporation (Japan)

: SUN-S Electronic Technology (KUNSHAN) Co. Ltd (China)

*3) Business dealing name identification mark : －

Product mass : Approx. 0.56g

UNIT : 1/1 mm

Pin material : Copper Alloy

R3BMF5 Outline Dimensions

(Business dealing name : PR3BMF51NSLF)

Pin finish : SnCu plating (Cu : TYP. 2%)

Name

Sheet No.: OP14009EN

PR3BMF51NSLF

■Absolute maximum ratings

Ta=25°C

Unit

Parameter

Symbol

I_F

Rating

Forward current

Input

Reverse voltage

V_R

1.2

RMS on-state current

I_T(rms)

Isurge

V_DRM

Viso(rms)

Topr

Output Peak one cycle surge current *2

Repetitive peak off-state voltage

600

Isolation voltage

4.0

°C

Operating temperature

Storage temperature

Soldering temperature

-30 to +85

-40 to +125

270

Tstg

°C

Tsol

°C

*1 The derating factors of absolute maximum rating due to ambient temperature are shown in Fig.1, 2.

*2 50Hz sine wave

*3 AC for 1min, 40 to 60%RH, f=60Hz

*4 For 10s

■Electrical Characteristics

Ta=25°C

Conditions

I_F=20mA

Parameter

Symbol MIN. TYP. MAX. Unit

Forward voltage

V_F

I_R

1.2

1.4

100

2.5

μA

Input

Reverse current

V_R=3V

Repetitive peak off-state current

On-state voltage

I_DRM

V_T

V_D=V_DRM

I_T=1.2A

V_D=6V

Output

Holding current

I_H

Critical rate of rise of off-state voltage

Minimum trigger current

Isolation resistance

dv/dt

I_FT

100

5×10¹⁰10¹¹

V/μs V_D=(1/√2)· V_DRM

V_D=6V, R_L=100Ω

Transfer

charac-

teristics

R_ISO

DC500V 40 to 60%RH

V_D=6V, R_L=100Ω,

I_F=20mA

Turn on time

t_ON

100

μs

Sheet No.: OP14009EN

PR3BMF51NSLF

Fig.1 Forward current vs. ambient temperature(*1)

-30 -20 -10

10 20 30 40 50 60 70 80 90 100

Ambient temperature Ta (°C)

Fig.2 RMS on-state current vs. ambient temperature(*1)

1.4

1.2

1.0

0.8

0.6

0.4

0.2

-30 -20 -10

10 20 30 40 50 60 70 80 90 100

Ambient temperature Ta (°C)

*1 Mounting conditions

No heat sink

Paper phenol board : 100mm×100mm×1.6mm

All pins should be installed in the print board with soldering.

Whole solder landing dimensions : 140mm²

Sheet No.: OP14009EN

PR3BMF51NSLF

■Supplement

●Isolation voltage shall be measured in the following method.

(1) Short between anode and cathode on the primary side and between anode, cathode and gate on the secondary side.

(2) The dielectric withstanding tester with zero-cross circuit shall be used.

(3) The wave form of applied voltage shall be a sine wave.

(It is recommended that the isolation voltage be measured in insulation oil.)

●This Model is approved by UL and CSA.

Approved Model No. : R3BMF5

1. UL file No. : E94758

2. CSA file No. : LR63705

CSA approved mark "

" and rating shall be indicated on minimum unit package.

●This product is not designed against irradiation.

This product is assembled with electrical input and output.

This product incorporates non-coherent light emitting diode.

●ODS materials

This product shall not contain the following materials.

Also, the following materials shall not be used in the production process for this product.

Materials for ODS : CFC_S, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methyl chloroform)

●Brominated flame retardants

Specified brominated flame retardants (PBB and PBDE) are not used in this device at all.

●Compliance with each regulation

1) The RoHS directive (2002/95/EC)

This product complies with the RoHS directive (2002/95/EC).

Object substances: mercury, lead (except for lead in high melting temperature type solders^*1and glass of

electronic components), cadmium, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated

diphenyl ethers (PBDE)

*1 : i.e. tin-lead solder alloys containing more than 85% lead

2) Content of six substances specified in Management Methods for Control of Pollution Caused by Electronic

Information Products Regulation (Chinese : 电子信息产品污染控制管理办法).

Toxic and hazardous substances

Hexavalent

chromium

(Cr⁶⁺)

Polybrominated Polybrominated

Category

Lead

(Pb)

Mercury

(Hg)

Cadmium

(Cd)

biphenyls

(PBB)

✓

diphenyl ethers

(PBDE)

✓

Solid State Relay

＊

✓

✓ : indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is

below the concentration limit requirement as described in SJ/T 11363-2006 standard.

＊ : indicates that the content of the toxic and hazardous substance in at least one homogeneous material of the part

exceeds the concentration limit requirement as described in SJ/T 11363-2006 standard.

Lead in high melting temperature type solders (i.e. tin-lead solder alloys containing more than 85% lead) and glass of

electronic components (designated by “＊” in the above table) are exempt from the RoHS directive (2002/95/EC),

because there is no effective way to eliminate or substitute them by present scientific technology.

Sheet No.: OP14009EN

PR3BMF51NSLF

■Notes

●Circuit designing

(1) Trigger current

The LED used in the Solid state relay generally decreases the light emission power by operation.

In case of long operation time, please decide I_Fvalue so that I_Fis twice or more of the Maximum value

of the Minimum triggering current at circuit design with considering the decreases of the light emission power

of the LED. (50%/5years)

(2) Snubber circuit

This device doesn’t have built-in snubber circuit.

To avoid the false operation and protect SSR, please locate the appropriate snubber circuit between output pins

base by the load. (Recommendable values : Rs=47Ω, Cs=0.022μF)

Particularly, in case the device is used for the load such as solenoid valves and motors, false operation may

happen in off-state due to rapid change of voltage at output pins caused by the phase difference of load current.

So please be sure to locate the snubber circuit (Rs=47Ω, Cs=0.022μF) and make sure the device works properly

in actual conditions.

In addition, the values of snubber circuit may have to be changed if necessary after tested in actual conditions.

(3) Off-state input current

Input current (I_F) at off-state shall be set 0.1mA or less.

(4) Pulse drive

In case that pulse drive is carried out, the pulse width of input signal should be 1ms or more.

(5) If the voltage exceeding the repetitive peak off-state voltage (V_DRM) in the absolute maximum ratings is applied

to the phototriac, it may cause not only faulty operation but breakdown.

Make sure that the surge voltage exceeding V_DRMshall not be applied by using the varistor, CR.

●Cleaning

(1) Solvent cleaning : Solvent temperature 45°C or less Immersion for 3 min or less

(2) Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size, ultrasonic power

output, cleaning time, PCB size or device mounting condition etc.

Please test it in actual using condition and confirm that any defect doesn't occur

before starting the ultrasonic cleaning.

(3) Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol

In case the other solvent is used, there are cases that the packaging resin is eroded.

Please use the other solvent after thorough confirmation is performed in actual using condition.

●Using method

As to this product, all pin shall be used by soldering on the print wiring board. (Socket and others shall not be used.)

●Precautions for Soldering

(1) In case of flow soldering (Avoid immersing the resin part in the solder.)

It is recommended that flow soldering be carried out at 270°C or less and within 10s

(Pre-heating:100 to 150°C, 30 to 80s) : Within 2 times

(2) In case of hand soldering

It is recommended that hand soldering be carried out at 400°C or less and within 3s: Within 2 times

(3) Other precautions

Depending on equipment and soldering conditions (temperature, Using solder etc.),

the effect to junction between PCB and lead pins of the device is different.

Please confirm that there is no problem on the actual use conditions

Sheet No.: OP14009EN

PR3BMF51NSLF

■Package specification

●Package materials

No.

Name

Materials

Purposes

Products packaged

HIPS or ABS with preventing

static electricity

Sleeve

①

Stopper

Styrene-Elastomer

Corrugated cardboard

Paper

Products fixed

②

③

④

Packing case

Kraft tape

Sleeve packaged

Lid of packaged case fixed

Model No. (Business dealing name), Lot No.

Quantity, Country of origin, Company name

and Inspection date specified

Label

Paper

⑤

●Package method

(1) MAX. 50pcs. of products shall be packaged in a sleeve ① and both of sleeve edges shall be fixed by stoppers ②.

(2) MAX. 20 sleeves (Product : 1000pcs) above shall be packaged in a packing case ③.

(3) The label ⑤ shall be put on the side of the packing case.

(4) Case shall be closed with the lid and enclosed with kraft tape ④.

●Sleeve outline dimensions

8-R0.5

6.7

(Unit : mm)

520

±2

Note 1) Thickness : 0.5±0.2mm

2) Process with applying antistatic treatment.

3) Unless otherwise specified tolerances shall be ±0.5mm.

(However except for deformation due to the rubber stopper in sleeve.)

Sheet No.: OP14009EN

PR3BMF51NSLF

●Packaging case outline dimensions

Sleeve ①

Product

Anode mark or

stepping side

Stopper ②

(Without pulled portion)

Anode mark shall be arranged

at stopper side without pulled portion.

Stopper ②

(With pulled portion)

20 sleeves *Maximum

(5 lines×4 stairs)

It is disapproved to mix

different model or different

rank model in one case.

Packing case ③

Kraft tape ④

Label ⑤

(56mm)

(544mm)

(70mm)

Regular packing mass : Approx.970g

) : Reference dimensions

(

Sheet No.: OP14009EN

PR3BMF51NSLF

(Attachment-1-1)

●This specification shall be applied to Solid State Relay (SSR), Model No. R3BMF5 series as an option.

●Applicable Models (Business dealing name)

PR3BMF51YSLF

●The relevant models are the models Approved by VDE according to DIN EN 60747-5-5

VDE approved No. : 40008898

Approved Model No. : R3BMF5

・Operating isolation voltage

・Transient voltage

・Pollution :

V_{IORM (Peak)}

7100V

890V

(Peak)

・Clearances distance (Between input and output) : 6.4mm (MIN.)

・Creepage distance (Between input and output) : 6.4mm (MIN.)

・Isolation thickness between input and output

・Tracking-proof : CTI 175

0.15mm (MIN.)

・Safety limit values

Current (Isi) : 200mA (Diode side)

Power (Psi) : 3600mW (Triac side)

Temperature (Tsi) : 150°C

In order to keep safety electric isolation of photocoupler, please set the protective circuit to keep within safety

limit values when the actual application equipment troubled.

Ｖ

ＤＥ

・Indication of VDE approval "

" is printed on minimum unit package.

●Outline

Refer to the attachment-1-2.

●Isolation specification according to EN 60747-5-5

Parameter

Symbol

Condition

Rating

Unit

Remark

Class of environmental test

30/100/21

Pollution

Maximum operating isolation voltage

Partial discharge test voltage (Between input and output)

V_IORM(PEAK)

890

Refer to

the Diagram 1, 2

(Attachement-1-3)

t_m=10s,

qc<5pC

t_st1=1s,

qc<5pC

Diagram 1

Diagram 2

1340

V_m(PEAK)

1670

7100

Maximum over-voltage

Safety maximum ratings

V_ini,a(PEAK)t_ini=60s

I_F=0,

P_C=0

Refer to

the Fig. 3, 4

1) Case temperature

Tsi

150

°C

(Attachement-1-3)

2) Input current

Isi

P_C=0

200

3) Electric power (Output or Total power dissipation)

Psi

3600

T_amb=Tsi

MIN. 10⁹

Isolation resistance

(Test voltage between input and output ; DC500V)

T_amb=Topr

(MAX)

R_ISO

MIN. 10¹¹

MIN. 10¹²

T_amb=25°C

●Precautions in performing isolation test

1) Partial discharge test methods shall be the ones according to the specifications of EN 60747-5-5.

2) Please don't carry out isolation test (Viso) over V_ini,a

This product deteriorates isolation characteristics by partial discharge due to applying high voltage (ex. V_ini,a).

And there is possibility that partial discharge occurs in operating isolation voltage (V_IORM).

Sheet No.: OP14009EN

PR3BMF51NSLF

(Attachment-1-2)

●Pin-Number and internal connection diagram

⑧

①

① : Cathode

② : Anode

⑤ : Gate

⑥ : T₁

②

③

③ : Cathode

④ : Cathode

⑧ : T₂

⑥

⑤

④

●Outline

Burr

Max. 0.2

Brand name "S"

①

②

③

⑧

⑥

⑤

Anode mark

Factory identification

mark *2

Date code *1

④

“L” identification

mark

VDE

identification mark

6.5^±0.5

7.62^±0.30

Rank mark

9.66^±0.50

Epoxy resin

0.26^±0.10

0.5^±0.1

θ:0～13

Marking is laser marking

*1) 2-digit number shall be marked according to OLD DIN standard.

*2) Factory identification mark applies to the below.

Without : SUN-S Corporation (Japan)

: SUN-S Electronic Technology (KUNSHAN) Co. Ltd (China)

Product mass : Approx. 0.56g

UNIT : 1/1 mm

*3) Pin material : Copper Alloy

Pin finish : SnCu plating (Cu : TYP. 2%)

Name

R3BMF5 Outline Dimensions

(Business dealing name : PR3BMF51YSLF)

Sheet No.: OP14009EN

PR3BMF51NSLF

(Attachment-1-3)

Method of Diagram 1: Breakdown test (Apply to type test and sampling test)

Method of Diagram 2: Non breakdown test (Apply to all device test)

(Fig.3) Safety maximum power dissipation

vs. ambient temperature

(Fig.4) Safety maximum forward current

vs. ambient temperature

(When failed)

4000

250

200

150

100

3600

3000

2000

1000

25 50

100 125 150

Ambient temperature Ta (°C)

Sheet No.: OP14009EN

PR3BMF51NSLF

■Important Notices

· The circuit application examples in this publication are

provided to explain representative applications of SHARP

devices and are not intended to guarantee any circuit design or

license any intellectual property rights. SHARP takes no

responsibility for any problems related to any intellectual

property right of a third party resulting from the use of SHARP's

devices.

with equipment that requires higher reliability such as:

--- Transportation control and safety equipment (i.e.,

aircraft, trains, automobiles, etc.)

--- Traffic signals

--- Gas leakage sensor breakers

--- Alarm equipment

--- Various safety devices, etc.

· Contact SHARP in order to obtain the latest device specification

sheets before using any SHARP device. SHARP reserves the

right to make changes in the specifications, characteristics, data,

materials, structure, and other contents described herein at any

time without notice in order to improve design or reliability.

Manufacturing locations are also subject to change without

notice.

(iii) SHARP devices shall not be used for or in connection with

equipment that requires an extremely high level of reliability and

safety such as:

--- Space applications

--- Telecommunication equipment [trunk lines]

--- Nuclear power control equipment

--- Medical and other life support equipment (e.g.,

scuba).

· Observe the following points when using any devices in this

publication. SHARP takes no responsibility for damage caused

by improper use of the devices which does not meet the

conditions and absolute maximum ratings to be used specified in

the relevant specification sheet nor meet the following

conditions:

· If the SHARP devices listed in this publication fall within the

scope of strategic products described in the Foreign Exchange

and Foreign Trade Law of Japan, it is necessary to obtain

approval to export such SHARP devices.

(i) The devices in this publication are designed for use in general

electronic equipment designs such as:

· This publication is the proprietary product of SHARP and is

no part of this publication may be reproduced or transmitted in

any form or by any means, electronic or mechanical, for any

purpose, in whole or in part, without the express written

permission of SHARP. Express written permission is also

required before any use of this publication may be made by a

third party.

--- Personal computers

--- Office automation equipment

--- Telecommunication equipment [terminal]

--- Test and measurement equipment

--- Industrial control

--- Audio visual equipment

--- Consumer electronics

(ii) Measures such as fail-safe function and redundant design

should be taken to ensure reliability and safety when SHARP

devices are used for or in connection

· Contact and consult with a SHARP representative if there are

any questions about the contents of this publication.

Sheet No.: OP14009EN

PR3BMF51NSLF [SHARP]

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