S-5732NNH1I-Y3B2U [SII]

HIGH-WITHSTAND VOLTAGE HIGH-SPEED;
S-5732NNH1I-Y3B2U
型号: S-5732NNH1I-Y3B2U
厂家: SEIKO INSTRUMENTS INC    SEIKO INSTRUMENTS INC
描述:

HIGH-WITHSTAND VOLTAGE HIGH-SPEED

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S-5732 I Series  
HIGH-WITHSTAND VOLTAGE HIGH-SPEED  
UNIPOLAR DETECTION TYPE HALL IC  
www.sii-ic.com  
© SII Semiconductor Corporation, 2016  
Rev.2.1_00  
This IC, developed by CMOS technology, is a unipolar detection type Hall IC with high-withstand voltage, high-speed  
detection and high-accuracy magnetic characteristics.  
The output voltage changes when this IC detects the intensity level of magnetic flux density. Using this IC with a magnet  
makes it possible to detect the open / close and rotation status in various devices.  
This IC includes an output current limit circuit.  
This IC is available in various systems by using the insertion TO-92S package.  
Due to its high-accuracy magnetic characteristics, this IC can make operation's dispersion in the system combined with  
magnet smaller.  
SII Semiconductor Corporation offers a "magnetism simulation service" that provides the ideal combination of magnets and  
our Hall ICs for customer systems. Our magnetism simulation service will reduce prototype production, development period  
and development costs. In addition, it will contribute to optimization of parts to realize high cost performance.  
For more information regarding our magnetism simulation service, contact our sales office.  
Features  
Pole detection*1:  
Detection of S pole, detection of N pole  
Active "L", active "H"  
Nch open-drain output  
Nch driver + built-in pull-up resistor  
BOP = 3.0 mT typ.  
Detection logic for magnetism*1:  
Output form*1:  
Magnetic sensitivity*1:  
BOP = 6.0 mT typ.  
Chopping frequency:  
fC = 250 kHz typ.  
Output delay time:  
tD = 16.0 μs typ.  
Power supply voltage range:  
Built-in regulator  
VDD = 3.5 V to 26.0 V  
Built-in output current limit circuit  
Operation temperature range:  
Lead-free (Sn 100%), halogen-free  
Ta = 40°C to +85°C  
*1. The option can be selected.  
Applications  
Home appliance  
DC brushless motor  
Housing equipment  
Industrial equipment  
Packages  
TO-92S (Straight)  
TO-92S (Forming)  
1
HIGH-WITHSTAND VOLTAGE HIGH-SPEED UNIPOLAR DETECTION TYPE HALL IC  
Rev.2.1_00  
S-5732 I Series  
Block Diagrams  
1. Nch open-drain output product  
VDD  
OUT  
Regulator  
*1  
Chopping  
stabilized  
amplifier  
Output current limit circuit  
VSS  
*1. Parasitic diode  
Figure 1  
2. Nch driver + built-in pull-up resistor product  
VDD  
OUT  
Regulator  
*1  
Chopping  
stabilized  
amplifier  
Output current limit circuit  
VSS  
*1. Parasitic diode  
Figure 2  
2
HIGH-WITHSTAND VOLTAGE HIGH-SPEED UNIPOLAR DETECTION TYPE HALL IC  
Rev.2.1_00  
S-5732 I Series  
Product Name Structure  
1. Product name  
S-5732  
x
x
x
x
I
-
Y3  
x
x
U
Environmental code  
U: Lead-free (Sn 100%), halogen-free  
Pin shape  
2: Straight  
3: Forming  
Packing specifications  
B: Bulk (500 pcs / bag)  
Z: Tape and ammo (2000 pcs / case)  
Package abbreviation  
Y3: TO-92S  
Operation temperature  
I:  
Ta = 40°C to +85°C  
Magnetic sensitivity  
1:  
2:  
B
B
OP = 3.0 mT typ.  
OP = 6.0 mT typ.  
Detection logic for magnetism  
L: Active "L"  
H: Active "H"  
Pole detection  
S: Detection of S pole  
N: Detection of N pole  
Output form  
N: Nch open-drain output  
R: Nch driver + built-in pull-up resistor  
2. Packages  
Table 1 Package Drawing Codes  
Package Name  
Bulk  
Dimension  
Tape  
Ammo Packing  
TO-92S (Straight)  
YB003-A-P-SD  
Tape and ammo  
Bulk  
YC003-A-C-SD  
YC003-A-Z-SD  
TO-92S (Forming)  
YB003-B-P-SD  
Tape and ammo  
YC003-B-C-SD  
YC003-B-Z-SD  
3
HIGH-WITHSTAND VOLTAGE HIGH-SPEED UNIPOLAR DETECTION TYPE HALL IC  
Rev.2.1_00  
S-5732 I Series  
3. Product name list  
3. 1 TO-92S (Straight)  
Table 2  
Detection Logic  
for Magnetism  
Magnetic  
Sensitivity (BOP  
Product Name*1  
Output Form  
Pole Detection  
)
S-5732NSL1I-Y3n2U  
S-5732NSL2I-Y3n2U  
S-5732RSL1I-Y3n2U  
S-5732RSL2I-Y3n2U  
Nch open-drain output  
Nch open-drain output  
S pole  
S pole  
Active "L"  
Active "L"  
Active "L"  
Active "L"  
3.0 mT typ.  
6.0 mT typ.  
3.0 mT typ.  
6.0 mT typ.  
Nch driver + built-in pull-up resistor S pole  
Nch driver + built-in pull-up resistor S pole  
*1. "n" changes according to the packing specification as follows.  
B: Bulk, Z: Tape and ammo  
Remark Please contact our sales office for products other than the above.  
3. 2 TO-92S (Forming)  
Table 3  
Detection Logic  
for Magnetism  
Magnetic  
Sensitivity (BOP  
Product Name*1  
Output Form  
Pole Detection  
S pole  
)
S-5732NSL1I-Y3n3U  
Nch open-drain output  
Active "L"  
3.0 mT typ.  
*1. "n" changes according to the packing specification as follows.  
B: Bulk, Z: Tape and ammo  
Remark Please contact our sales office for products other than the above.  
Pin Configuration  
1. TO-92S  
Table 4  
Pin No.  
Symbol  
VDD  
Description  
1
2
3
Power supply pin  
GND pin  
VSS  
OUT  
Output pin  
Bottom view  
3
1
2
Figure 3  
4
HIGH-WITHSTAND VOLTAGE HIGH-SPEED UNIPOLAR DETECTION TYPE HALL IC  
Rev.2.1_00  
S-5732 I Series  
Absolute Maximum Ratings  
Table 5  
(Ta = +25°C unless otherwise specified)  
Item  
Power supply voltage  
Output current  
Symbol  
VDD  
Absolute Maximum Rating  
VSS 0.3 to VSS + 28.0  
20  
Unit  
V
IOUT  
mA  
V
Nch open-drain output product  
Nch driver + built-in pull-up resistor product  
VSS 0.3 to VSS + 28.0  
VSS 0.3 to VDD + 0.3  
40 to +85  
Output voltage  
VOUT  
V
Operation ambient temperature  
Topr  
Tstg  
°C  
°C  
Storage temperature  
40 to +125  
Caution The absolute maximum ratings are rated values exceeding which the product could suffer physical  
damage. These values must therefore not be exceeded under any conditions.  
Thermal Resistance Value  
Table 6  
Item  
Symbol  
θja  
Condition  
Min.  
Typ.  
153*1  
Max.  
Unit  
Junction-to-ambient thermal resistance  
*1. When not mounted on board  
TO-92S  
°C/W  
Remark Refer to "Thermal Characteristics" for details of power dissipation.  
5
HIGH-WITHSTAND VOLTAGE HIGH-SPEED UNIPOLAR DETECTION TYPE HALL IC  
Rev.2.1_00  
S-5732 I Series  
Electrical Characteristics  
Table 7  
(Ta = +25°C, VDD = 12.0 V, VSS = 0 V unless otherwise specified)  
Test  
Circuit  
Item  
Symbol  
VDD  
Condition  
Min.  
3.5  
Typ. Max. Unit  
Power supply voltage  
12.0 26.0  
V
Nch open-drain output product  
3.0  
3.0  
4.0  
4.0  
0.4  
0.5  
20  
mA  
1
1
2
2
2
3
Average value  
Current consumption  
Output voltage  
IDD  
Nch driver + built-in pull-up resistor product  
Average value, VOUT = "H"  
mA  
V
Nch open-drain output product  
Output transistor Nch, VOUT = "L", IOUT = 10 mA  
Nch driver + built-in pull-up resistor product  
Output transistor Nch, VOUT = "L", IOUT = 10 mA  
Nch driver + built-in pull-up resistor product  
VOUT  
V
Output drop voltage  
Leakage current  
VD  
mV  
V
OUT = "H", VD = VDD VOUT  
Nch open-drain output product  
Output transistor Nch, VOUT = "H" = 26.0 V  
VOUT = 12.0 V  
ILEAK  
10  
μA  
Output limit current  
Output delay time  
Chopping frequency  
Start up time  
IOM  
tD  
fC  
22  
70  
mA  
μs  
kHz  
3
4
16.0  
250  
30  
tPON  
μs  
Nch open-drain output product  
C = 20 pF, R = 820 Ω  
Nch driver + built-in pull-up resistor product  
C = 20 pF  
2.0  
μs  
μs  
5
5
Output start up time  
tR  
6.0  
Output fall time  
Pull-up resistor  
tF  
RL  
C = 20 pF, R = 820 Ω  
Nch driver + built-in pull-up resistor product  
7
10  
2.0  
13  
μs  
kΩ  
5
S pole  
BOPS  
BRPS  
Magnetic flux density  
applied to this IC (B)  
0
tD  
tD  
tF  
tR  
90%  
)
Output voltage (VOUT  
(Product with active "L")  
10%  
tD  
tD  
tR  
tF  
90%  
)
Output voltage (VOUT  
(Product with active "H")  
10%  
Figure 4 Operation Timing  
6
HIGH-WITHSTAND VOLTAGE HIGH-SPEED UNIPOLAR DETECTION TYPE HALL IC  
Rev.2.1_00  
S-5732 I Series  
Magnetic Characteristics  
1. Product with S pole detection  
1. 1 Product with BOP = 3.0 mT typ.  
Table 8  
(Ta = +25°C, VDD = 12.0 V, VSS = 0 V unless otherwise specified)  
Item  
Symbol  
BOPS  
Condition  
Min.  
1.2  
0.8  
Typ.  
3.0  
2.0  
1.0  
Max.  
4.8  
3.6  
Unit  
mT  
mT  
mT  
Test Circuit  
Operation point*1  
S pole  
S pole  
S pole  
4
4
4
Release point*2  
Hysteresis width*3  
BRPS  
BHYSS  
BHYSS = BOPS BRPS  
1. 2 Product with BOP = 6.0 mT typ.  
Table 9  
(Ta = +25°C, VDD = 12.0 V, VSS = 0 V unless otherwise specified)  
Item  
Symbol  
BOPS  
Condition  
Min.  
3.0  
2.5  
Typ.  
6.0  
4.5  
1.5  
Max.  
9.0  
7.5  
Unit  
mT  
mT  
mT  
Test Circuit  
Operation point*1  
S pole  
S pole  
S pole  
4
4
4
Release point*2  
Hysteresis width*3  
BRPS  
BHYSS  
BHYSS = BOPS BRPS  
*1. BOPN, BOPS: Operation points  
BOPN and BOPS are the values of magnetic flux density when the output voltage (VOUT) changes after the magnetic flux  
density applied to this IC by the magnet (N pole or S pole) is increased (by moving the magnet closer).  
Even when the magnetic flux density exceeds BOPN or BOPS, VOUT retains the status.  
*2. BRPN, BRPS: Release points  
BRPN and BRPS are the values of magnetic flux density when the output voltage (VOUT) changes after the magnetic flux  
density applied to this IC by the magnet (N pole or S pole) is decreased (the magnet is moved further away).  
Even when the magnetic flux density falls below BRPN or BRPS, VOUT retains the status.  
*3. BHYSN, BHYSS: Hysteresis widths  
BHYSN and BHYSS are the difference between BOPN and BRPN, and BOPS and BRPS, respectively.  
Remark The unit of magnetic density mT can be converted by using the formula 1 mT = 10 Gauss.  
7
HIGH-WITHSTAND VOLTAGE HIGH-SPEED UNIPOLAR DETECTION TYPE HALL IC  
Rev.2.1_00  
S-5732 I Series  
Test Circuits  
A
R*1  
820 Ω  
VDD  
S-5732  
I Series  
VSS  
OUT  
*1. Resistor (R) is unnecessary for Nch driver + built-in pull-up resistor product.  
Figure 5 Test Circuit 1  
VDD  
S-5732  
I Series  
VSS  
A
OUT  
V
Figure 6 Test Circuit 2  
VDD  
S-5732  
I Series  
A
OUT  
VSS  
V
Figure 7 Test Circuit 3  
R*1  
820 Ω  
VDD  
S-5732  
I Series  
OUT  
VSS  
V
*1. Resistor (R) is unnecessary for Nch driver + built-in pull-up resistor product.  
Figure 8 Test Circuit 4  
8
HIGH-WITHSTAND VOLTAGE HIGH-SPEED UNIPOLAR DETECTION TYPE HALL IC  
Rev.2.1_00  
S-5732 I Series  
R*1  
820 Ω  
VDD  
S-5732  
OUT  
I Series  
VSS  
C
20 pF  
V
*1. Resistor (R) is unnecessary for Nch driver + built-in pull-up resistor product.  
Figure 9 Test Circuit 5  
Standard Circuit  
R*1  
820 Ω  
VDD  
S-5732  
I Series  
VSS  
OUT  
CIN  
0.1  
μ
F
*1. Resistor (R) is unnecessary for Nch driver + built-in pull-up resistor product.  
Figure 10  
Caution The above connection diagram and constant will not guarantee successful operation. Perform  
thorough evaluation using the actual application to set the constant.  
9
HIGH-WITHSTAND VOLTAGE HIGH-SPEED UNIPOLAR DETECTION TYPE HALL IC  
Rev.2.1_00  
S-5732 I Series  
Operation  
1. Direction of applied magnetic flux  
This IC detects the magnetic flux density which is vertical to the marking surface.  
Figure 11 shows the direction in which magnetic flux is being applied.  
N
S
Marking surface  
Figure 11  
2. Position of Hall sensor  
Figure 12 shows the position of Hall sensor.  
The center of this Hall sensor is located in the area indicated by a circle, which is in the center of a package as  
described below.  
The center of Hall sensor;  
in this φ 0.3 mm  
Figure 12  
10  
HIGH-WITHSTAND VOLTAGE HIGH-SPEED UNIPOLAR DETECTION TYPE HALL IC  
Rev.2.1_00  
S-5732 I Series  
3. Basic operation  
This IC changes the output voltage (VOUT) according to the level of the magnetic flux density (N pole or S pole) applied  
by a magnet.  
The following explains the operation when the magnetism detection logic is active "L".  
3. 1 Product with S pole detection  
When the magnetic flux density of the S pole perpendicular to the marking surface exceeds the operation point  
(BOPS) after the S pole of a magnet is moved closer to the marking surface of this IC, VOUT changes from "H" to "L".  
When the S pole of a magnet is moved further away from the marking surface of this IC and the magnetic flux  
density is lower than the release point (BRPS), VOUT changes from "L" to "H".  
Figure 13 shows the relationship between the magnetic flux density and VOUT  
.
VOUT  
BHYSS  
H
L
S pole  
N pole  
0
BRPS  
BOPS  
Magnetic flux density (B)  
Figure 13  
3. 2 Product with N pole detection  
When the magnetic flux density of the N pole perpendicular to the marking surface exceeds the operation point  
(BOPN) after the N pole of a magnet is moved closer to the marking surface of this IC, VOUT changes from "H" to "L".  
When the N pole of a magnet is moved further away from the marking surface of this IC and the magnetic flux  
density of the N pole is lower than the release point (BRPN), VOUT changes from "L" to "H".  
Figure 14 shows the relationship between the magnetic flux density and VOUT  
.
VOUT  
BHYSN  
H
L
S pole  
N pole  
BOPN BRPN  
0
Magnetic flux density (B)  
Figure 14  
11  
HIGH-WITHSTAND VOLTAGE HIGH-SPEED UNIPOLAR DETECTION TYPE HALL IC  
Rev.2.1_00  
S-5732 I Series  
4. Timing chart  
Figure 15 shows the operation timing at power-on.  
The initial output voltage at rising of power supply voltage (VDD) is either "H" or "L".  
In case of B > BOPS (operation point) or B < BRPS (release point) at the time when the start up time (tPON) is passed after  
rising of VDD, this IC outputs VOUT according to the applied magnetic flux density.  
In case of BRPS < B < BOPS at the time when tPON is passed after rising of VDD, this IC maintains the initial output  
voltage.  
Product with S pole detection and active "L"  
Product with S pole detection and active "H"  
Power supply voltage  
Power supply voltage  
(VDD  
)
(VDD  
)
tPON  
tPON  
Output voltage (VOUT  
)
)
Output voltage (VOUT  
)
)
"H" / "L"  
"L"  
"H" / "L"  
"H"  
(B > BOPS  
(B > BOPS  
Output voltage (VOUT  
)
)
Output voltage (VOUT  
)
)
"H" / "L"  
"H" / "L"  
"L"  
"H" / "L"  
"H" / "L"  
"H"  
(B < BRPS  
(B < BRPS  
Output voltage (VOUT  
)
)
Output voltage (VOUT  
)
)
Latching  
Latching  
(BRPS < B < BOPS  
(BRPS < B < BOPS  
Figure 15  
12  
HIGH-WITHSTAND VOLTAGE HIGH-SPEED UNIPOLAR DETECTION TYPE HALL IC  
Rev.2.1_00  
S-5732 I Series  
Precautions  
If the impedance of the power supply is high, the IC may malfunction due to a supply voltage drop caused by feed-  
through current. Take care with the pattern wiring to ensure that the impedance of the power supply is low.  
Note that the IC may malfunction if the power supply voltage rapidly changes. When the IC is used under the  
environment where the power supply voltage rapidly changes, it is recommended to judge the output voltage of the IC  
by reading it multiple times.  
Note that the output voltage may rarely change if the magnetic flux density between the operation point and the release  
point is applied to this IC continuously for a long time.  
Do not apply an electrostatic discharge to this IC that exceeds the performance ratings of the built-in electrostatic  
protection circuit.  
Although this IC has a built-in output current limit circuit, it may suffer physical damage such as product deterioration  
under the environment where the absolute maximum ratings are exceeded.  
The application conditions for the power supply voltage, the pull-up voltage, and the pull-up resistor should not exceed  
the power dissipation.  
Large stress on this IC may affect on the magnetic characteristics. Avoid large stress which is caused by the handling  
during or after mounting the IC on a board.  
SII Semiconductor Corporation claims no responsibility for any disputes arising out of or in connection with any  
infringement by products including this IC of patents owned by a third party.  
13  
HIGH-WITHSTAND VOLTAGE HIGH-SPEED UNIPOLAR DETECTION TYPE HALL IC  
Rev.2.1_00  
S-5732 I Series  
Thermal Characteristics  
1. TO-92S  
Tj = +125°C max.  
1.0  
0.8  
0.6  
0.4  
0.2  
0
0.65 W  
0
50  
100  
150  
Ambient temperature (Ta) [C]  
Figure 16 Power Dissipation of Package (When not mounted on board)  
14  
1.62max.  
4.1max.  
Marked side  
0.55max.  
0.65max.  
0.51max.  
0.48max.  
1.27  
No. YB003-A-P-SD-1.0  
TITLE  
TO92S-C-PKG Dimensions  
YB003-A-P-SD-1.0  
No.  
ANGLE  
UNIT  
mm  
SII Semiconductor Corporation  
12.7±0.3  
1.0max.  
1.0max.  
Marked side  
Marked side  
Marked side  
Marked side  
#
#
1.0max.  
3 pin  
1 pin  
1.45max.  
ø4.0±0.2  
6.35±0.3  
12.7±0.2  
Marked side  
Marked side  
Marked side  
Feed direction  
No. YC003-A-C-SD-1.1  
TITLE  
TO92S-E-Radial Tape  
YC003-A-C-SD-1.1  
No.  
ANGLE  
mm  
UNIT  
SII Semiconductor Corporation  
Spacer(Sponge)  
15  
310  
35  
Side spacer placed in front side  
157  
320  
Space more than 4 strokes  
162  
333  
43  
No. YC003-A-Z-SD-1.0  
TITLE  
TO92S-E-Ammo Packing  
YC003-A-Z-SD-1.0  
No.  
ANGLE  
QTY.  
2,000  
mm  
UNIT  
SII Semiconductor Corporation  
1.62max.  
4.1max.  
Marked side  
0.55max.  
0.65max.  
0.48max.  
0.51max.  
2.5±0.3  
1.27  
No. YB003-B-P-SD-1.0  
TITLE  
TO92S-D-PKG Dimensions  
YB003-B-P-SD-1.0  
No.  
ANGLE  
UNIT  
mm  
SII Semiconductor Corporation  
12.7±0.3  
1.0max.  
1.0max.  
Marked side  
Marked side  
Marked side  
Marked side  
#
#
1.0max.  
1 pin  
3 pin  
1.45max.  
ø4.0±0.2  
6.35±0.3  
12.7±0.2  
Marked side  
Marked side  
Marked side  
Feed direction  
No. YC003-B-C-SD-1.1  
TITLE  
TO92S-F-Radial Tape  
YC003-B-C-SD-1.1  
No.  
ANGLE  
mm  
UNIT  
SII Semiconductor Corporation  
Spacer(Sponge)  
15  
310  
35  
Side spacer placed in front side  
157  
320  
Space more than 4 strokes  
162  
333  
43  
No. YC003-B-Z-SD-1.0  
TITLE  
TO92S-F-Ammo Packing  
YC003-B-Z-SD-1.0  
No.  
ANGLE  
QTY.  
2,000  
mm  
UNIT  
SII Semiconductor Corporation  
Disclaimers (Handling Precautions)  
1. All the information described herein (product data, specifications, figures, tables, programs, algorithms and  
application circuit examples, etc.) is current as of publishing date of this document and is subject to change without  
notice.  
2. The circuit examples and the usages described herein are for reference only, and do not guarantee the success of  
any specific mass-production design.  
SII Semiconductor Corporation is not responsible for damages caused by the reasons other than the products or  
infringement of third-party intellectual property rights and any other rights due to the use of the information described  
herein.  
3. SII Semiconductor Corporation is not responsible for damages caused by the incorrect information described herein.  
4. Take care to use the products described herein within their specified ranges. Pay special attention to the absolute  
maximum ratings, operation voltage range and electrical characteristics, etc.  
SII Semiconductor Corporation is not responsible for damages caused by failures and/or accidents, etc. that occur  
due to the use of products outside their specified ranges.  
5. When using the products described herein, confirm their applications, and the laws and regulations of the region or  
country where they are used and verify suitability, safety and other factors for the intended use.  
6. When exporting the products described herein, comply with the Foreign Exchange and Foreign Trade Act and all  
other export-related laws, and follow the required procedures.  
7. The products described herein must not be used or provided (exported) for the purposes of the development of  
weapons of mass destruction or military use. SII Semiconductor Corporation is not responsible for any provision  
(export) to those whose purpose is to develop, manufacture, use or store nuclear, biological or chemical weapons,  
missiles, or other military use.  
8. The products described herein are not designed to be used as part of any device or equipment that may affect the  
human body, human life, or assets (such as medical equipment, disaster prevention systems, security systems,  
combustion control systems, infrastructure control systems, vehicle equipment, traffic systems, in-vehicle equipment,  
aviation equipment, aerospace equipment, and nuclear-related equipment), excluding when specified for in-vehicle  
use or other uses. Do not use those products without the prior written permission of SII Semiconductor Corporation.  
Especially, the products described herein cannot be used for life support devices, devices implanted in the human  
body and devices that directly affect human life, etc.  
Prior consultation with our sales office is required when considering the above uses.  
SII Semiconductor Corporation is not responsible for damages caused by unauthorized or unspecified use of our  
products.  
9. Semiconductor products may fail or malfunction with some probability.  
The user of these products should therefore take responsibility to give thorough consideration to safety design  
including redundancy, fire spread prevention measures, and malfunction prevention to prevent accidents causing  
injury or death, fires and social damage, etc. that may ensue from the products' failure or malfunction.  
The entire system must be sufficiently evaluated and applied on customer's own responsibility.  
10. The products described herein are not designed to be radiation-proof. The necessary radiation measures should be  
taken in the product design by the customer depending on the intended use.  
11. The products described herein do not affect human health under normal use. However, they contain chemical  
substances and heavy metals and should therefore not be put in the mouth. The fracture surfaces of wafers and chips  
may be sharp. Take care when handling these with the bare hands to prevent injuries, etc.  
12. When disposing of the products described herein, comply with the laws and ordinances of the country or region where  
they are used.  
13. The information described herein contains copyright information and know-how of SII Semiconductor Corporation.  
The information described herein does not convey any license under any intellectual property rights or any other  
rights belonging to SII Semiconductor Corporation or a third party. Reproduction or copying of the information  
described herein for the purpose of disclosing it to a third-party without the express permission of SII Semiconductor  
Corporation is strictly prohibited.  
14. For more details on the information described herein, contact our sales office.  
1.0-2016.01  
www.sii-ic.com  

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