SX-PCEAC2-HMC [SILEX]
2x2 Dual Band 802.11ac WLAN Plus BT Combo Module;
| 型号： | SX-PCEAC2-HMC |
| 厂家： | 
Silex Technology |
| 描述： | 2x2 Dual Band 802.11ac WLAN Plus BT Combo Module 局域网 WLAN 无线局域网 |
| 文件： | 总1页 (文件大小：756K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SX-PCEAC2
2x2 Dual Band 802.11ac WLAN Plus BT
Combo Module
Form Factors includes M.2 LGA, M.2 PCIe and Half Mini Card Options
The SX-PCEAC2 is a dual-band 802.11 a/b/g/n/ac module with
bluetooth support which is designed for devices that require wireless
connectivity in a small form factor combined with high performance
with throughouts reaching upto 867Mbps.
/M2
The SX-PCEAC2 is powered by Qualcomm Atheros radio chip, the
QCA6174-5 which features 2x2 wave 2 MU-MIMO technology. There are
a few form factors available . The surface mount option, the M.2 LGA
type 1216, oꢀers the lowest footprint. Where as the M.2 card form factor
is suitable who are looking to migrate from their legacy PCIe radios to
an 802.11ac solution. The half mini card option also allows ꢁexibility to
customers to evaluate the radio using any platform that has a full PCIe
slot.
Speciꢂcations:
Key Features:
Product Name
Chipset
SX-PCEAC2-SMT / SX-PCEAC2-HMC / SX-PCEAC2-M2
QCA6174-5
Dual-Band 802.11ac Wave2 with MU-MIMO
•
SX-PCEAC2 is a 802.11ac WLAN plus Bluetooth combo solution that
supports 2x2 MU-MIMO with two spatial streams for designed to
deliver superior WLAN and BT performance.
Host Interface
WLAN: PCIe BT: USB
Radio Speciꢂcations
Bluetooth Speciꢂcations
Security
802.11a/b/g/n/ac (2x2)
Multiple Form Factors for Diverse Needs
SX-PCEAC2 s available in surface mount (M.2 LGA Type), M.2 1630 PCI
Express Card and half mini PCIe form factors.
•
•
Bluetooth v5.0 (BR/EDR/LE）
WPA/WPA2
802.11x (LEAP, PEAP, TLS, TTLS, FAST)
Enterprise Security Support
Operating Voltage
3.3V +/-5%
The SX-PCEAC2 supports WPA and WPA2 including 802.1x Extensible
Authentication Protocol (EAP) types. It provides robust security for
enterprise demands.
[2.4GHz] Tx: 970mA ; Rx: 150mA
[5GHz] Tx: 940mA; Rx 210mA
Idle: 10mA ; Radio Oꢀ: 3mA
Current Consumption
(Peak Value)
Support from Design to Manufacture
•
•
-20°C to +70 °C
Operating Temperature
Dimensions
As Qualcomm’s Authorized Deisgn Center, we have direct access to
their design information that enables us to provide premium
hardware and software support from design through deployment.
SX-PCEAC2-SMT: 12.0 x 16.0 x 1.5 (mm)
SX-PCEAC2-HMC: 30.0 x 26.8 x 3.4 (mm)
SX-PCEAC2-M2: 16.5x30.0x2.34 (mm)
Modular Certiꢀcations
Modular certiꢂcations and approvals available for FCC (USA), IC
(Canada), ETSI (Europe), MIC (Japan).
Linux, ath10k, Windows
FCC / IC / CE / MIC
Driver Options
Modular Certiꢂcations
silex technology is a registered trademark of silex technology, Inc. Other product or brand names may be registered trademarks or trademarks of their respective owners.
Technical information and speciꢂcations are subject to change without notice. © 2020 silex technology, Inc. All rights reserved.
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REV B. 20200120
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