M20E3ISLBL [SILICOM]

Compression LBG U.2 Server Module;
M20E3ISLBL
型号: M20E3ISLBL
厂家: Silicom    Silicom
描述:

Compression LBG U.2 Server Module

文件: 总4页 (文件大小:491K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
M20E3ISLB Crypto Compression Module  
Crypto / Compression LBG U.2 Server Module / LBG-xLBG  
Product Description  
Silicom’s LBG-x NS Crypto / Compression U.2 server Modules are 3rd  
generation of Silicom adapters which are based Intel 3rd generation  
chipset to integrate Intel® QuickAssit Technology.  
Silicom’s LBG-x NS Crypto / Compression U.2 server Modules are  
optimized to Intel Architecture (IA) provide Data Centers and Cloud  
applications benefit greatly from the high performance security and  
compression capabilities, enabling more efficient network and storage  
architectures.  
Servers with Intel® QuickAssit Technology create a new compute paradigm in cloud services. Virtualized machines with virtualized  
acceleration services allow for network function virtualization as standard practice.  
Network elements share the same common standard hardware implementation. True software define network elements run on  
standard server  
Silicom’s LBG-x NS Crypto / Compression U.2 server Modules Optimized to IA (Intel Architecture). Simplest and highly mature  
architecture leading to highest reliability.  
Silicom’s LBG-x NS Crypto / Compression U.2 server Modules uses Intel solution and drivers: Seamless integration with the  
customer’s OS and application.  
The Silicom U.2 Server Modules are targeted for systems that support 2.5” PCI Express  
Enterprise SSD Form Factor.  
Silicom U.2 Server Modules are based on PCI Express U.2 specifications.  
Silicom U.2 Server Modules solution designed for the enterprise market of Servers,  
Network appliances and storage systems.  
Silicom U.2 Server Modules supports hot plug and removal, both with and without prior  
system notification (surprise removal).  
1Page  
Silicom Ltd. Connectivity Solutions  
Key Features  
Host Interface  
Host interface support PCI EXPRESS U.2 MODULE SPECIFICATION, REV. 0.5  
Host Interface Support PCI Express 3.0 (8Gb/s) and 2.1 (5Gb/s)  
PCI Express Card Electromechanical Specification, revision 2.0.  
2.5″ modules width same as 2.5” drive (SFF-8223, 2007) specification  
PCI Express X4 lanes.  
25W connector limit, with 12V only delivery.  
Supports Hot swap  
Supports PCI Express power management features  
Intel® QuickAssit Technology for Crypto and Compression  
o
Bulk: AES, 3DES, (A) RC4  
o
o
o
o
o
Hash: MD5, SHA-1/2 SHA-3 HMAC  
Wireless: KASUMI , ZUC, SNOW 3G  
Public Key DH, RSA, DSA, EDSA, ECDH  
Compression/Decompression-Feflate  
RDMA (iWARP) support per link  
System Acceleration Throughput  
LBG-L / LBG-T  
LBG-M  
LBG-E  
SSL/IPSec  
27Gbps (PCIe BW)  
27Gbps (PCIe BW)  
27Gbps (PCIe BW)  
550K Ops/sec  
27Gbps (PCIe BW)  
27Gbps (PCIe BW)  
27Gbps (PCIe BW)  
550K Ops/sec  
40 Ops/Sec  
20Gbps  
Compression Deflate  
Decompression Deflate  
RSA Decrypt 1k-bit  
RSA Decrypt 2k-bit  
20Gbps  
27Gbps (PCIe BW)  
550K Ops/sec  
20 Ops/Sec  
100 Ops/Sec  
TLS Handshakes  
ECDH_RSA2K:  
440K Ops/sec  
51K Ops/sec  
TLS Handshakes  
EDHE+ECDSA  
SSL/IPSec + Compression +  
PKE  
Total 120 Gbps +  
100K Ops/sec  
2Page  
Silicom Ltd. Connectivity Solutions  
Technical Specifications  
General Technical Specifications  
PCI-Express Base Specification Revision 3.1a (8GT/s)  
Enterprise SSD Form Factor Revision 1.0A  
Interface Standard:  
PCI Express U.2 Module Specification Revision 0.9  
Board Size:  
100.2mm X 69.85mm (3.945”X 2.750”)  
PCI Express Card Type:  
PCI Express Voltage  
PCI Connector:  
X4 Lane  
+12V ± 15%  
Multifunction 12 Gb/s 6X Unshielded Connector (SFF-8639)  
LBG-T B0  
LBG-L B0  
LBG-M B0  
LBG-E B0  
Controllers:  
Operating Humidity:  
0%90%, non-condensing  
0°C 45°C (32°F 113°F)  
Air flow requirement for this adapter is 200 LFM  
Operating Temperature:  
Cooling  
Fanless Heatsink / TBD LFM  
Storage:  
Regulation:  
-40°C65°C (-40°F149°F)  
Card shall meet CE, FCC Class B, ROHS requirements.  
Operating Systems Support:  
Operating system support:  
Linux  
3Page  
Silicom Ltd. Connectivity Solutions  
Order Information  
P/N  
Description  
Notes  
X4 G3, Based on Intel LBG-T, U.2 Module,  
RoHS compliant  
M20E3iSLBT  
Crypto / Compression LBG U.2 Server Module  
X4 G3, Based on Intel LBG-L, U.2 Module,  
RoHS compliant  
M20E3iSLBL  
M20E3iSLBM  
M20E3iSLBE  
Crypto / Compression LBG U.2 Server Module  
Crypto / Compression LBG U.2 Server Module  
Crypto / Compression LBG U.2 Server Module  
X4 G3, , Based on Intel LBG-M, U.2 Module,  
RoHS compliant  
X4 G3, , Based on Intel LBG-E, U.2 Module,  
RoHS compliant  
1V2  
4Page  
Silicom Ltd. Connectivity Solutions  

相关型号:

M20E3ISLBM

Compression LBG U.2 Server Module
SILICOM

M20E3ISLBT

Compression LBG U.2 Server Module
SILICOM

M20G100*2-F

Multilayer Ceramic Capacitors COG (NPO). X7R & Z5U Capacitors
CDE

M20G1002

Multilayer Ceramic Capacitors
ETC

M20G1002-F

Multilayer Ceramic Capacitors COG (NPO). X7R & Z5U Capacitors
CDE

M20G100J2-FTA

Ceramic Capacitor, Multilayer, Ceramic, 200V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.00001uF, Through Hole Mount, RADIAL LEADED, ROHS COMPLIANT
CDE

M20G100J2-FTR

Ceramic Capacitor, Multilayer, Ceramic, 200V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.00001uF, Through Hole Mount, RADIAL LEADED, ROHS COMPLIANT
CDE

M20G100K2-FTA

Ceramic Capacitor, Multilayer, Ceramic, 200V, 10% +Tol, 10% -Tol, C0G, 30ppm/Cel TC, 0.00001uF, Through Hole Mount, RADIAL LEADED, ROHS COMPLIANT
CDE

M20G100K2-FTR

Ceramic Capacitor, Multilayer, Ceramic, 200V, 10% +Tol, 10% -Tol, C0G, 30ppm/Cel TC, 0.00001uF, Through Hole Mount, RADIAL LEADED, ROHS COMPLIANT
CDE

M20G1012

Multilayer Ceramic Capacitors
ETC

M20G1012-F

Multilayer Ceramic Capacitors COG (NPO). X7R & Z5U Capacitors
CDE

M20G101F2-FTA

Ceramic Capacitor, Multilayer, Ceramic, 200V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.0001uF, Through Hole Mount, RADIAL LEADED, ROHS COMPLIANT
CDE