530AA010M000DG [SILICON]
LVPECL Output Clock Oscillator, 10MHz Nom, ROHS COMPLIANT PACKAGE-6;型号: | 530AA010M000DG |
厂家: | SILICON |
描述: | LVPECL Output Clock Oscillator, 10MHz Nom, ROHS COMPLIANT PACKAGE-6 |
文件: | 总12页 (文件大小:126K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Si530/531
REVISION D
CRYSTAL OSCILLATOR (XO) (10 MHZ TO 1.4 GHZ)
Features
Si5602
Available with any-rate output
Internal fixed crystal frequency
ensures high reliability and low
aging
Available CMOS, LVPECL,
LVDS, and CML outputs
3.3, 2.5, and 1.8 V supply options
Industry-standard 5 x 7 mm
package and pinout
frequencies from 10 MHz to 945 MHz
and select frequencies to 1.4 GHz
®
3rd generation DSPLL with superior
jitter performance
3x better frequency stability than
SAW-based oscillators
Pb-free/RoHS-compliant
Ordering Information:
Applications
See page 7.
SONET/SDH
Networking
SD/HD video
Test and measurement
Clock and data recovery
FPGA/ASIC clock generation
Pin Assignments:
See page 6.
Description
(Top View)
®
The Si530/531 XO utilizes Silicon Laboratories’ advanced DSPLL circuitry
to provide a low jitter clock at high frequencies. The Si530/531 is available
with any-rate output frequency from 10 to 945 MHz and select frequencies to
1400 MHz. Unlike a traditional XO, where a different crystal is required for
each output frequency, the Si530/531 uses one fixed crystal to provide a
wide range of output frequencies. This IC based approach allows the crystal
resonator to provide exceptional frequency stability and reliability. In addition,
DSPLL clock synthesis provides superior supply noise rejection, simplifying
the task of generating low jitter clocks in noisy environments typically found in
communication systems. The Si530/531 IC based XO is factory configurable
for a wide variety of user specifications including frequency, supply voltage,
output format, and temperature stability. Specific configurations are factory
programmed at time of shipment, thereby eliminating long lead times
associated with custom oscillators.
VDD
1
2
3
6
5
4
NC
OE
CLK–
CLK+
GND
Si530 (LVDS/LVPECL/CML)
VDD
1
2
3
6
5
4
OE
NC
NC
Functional Block Diagram
GND
CLK
VDD
CLK– CLK+
Si530 (CMOS)
VDD
1
2
3
6
5
4
OE
NC
Any-rate
10–1400 MHz
DSPLL®
Clock
Synthesis
Fixed
Frequency
XO
CLK–
CLK+
GND
Si531 (LVDS/LVPECL/CML)
OE
GND
Rev. 1.4 5/13
Copyright © 2013 by Silicon Laboratories
Si530/531
Si530/531
1. Electrical Specifications
Table 1. Recommended Operating Conditions
Parameter
Symbol
Test Condition
3.3 V option
2.5 V option
1.8 V option
Min
2.97
2.25
1.71
Typ
3.3
2.5
1.8
Max
3.63
2.75
1.89
Unit
V
1
V
Supply Voltage
DD
V
V
Supply Current
I
Output enabled
LVPECL
CML
DD
—
—
—
—
121
108
98
111
99
90
81
mA
LVDS
CMOS
88
Tristate mode
—
0.75 x V
—
60
—
—
—
75
—
mA
V
Output Enable (OE)2
V
IH
DD
V
0.5
85
V
IL
Operating Temperature Range
T
–40
ºC
A
Notes:
1. Selectable parameter specified by part number. See Section 3. "Ordering Information" on page 7 for further details.
2. OE pin includes a 17 k pullup resistor to VDD
.
Table 2. CLK± Output Frequency Characteristics
Parameter
Symbol
Test Condition
LVPECL/LVDS/CML
CMOS
Min
10
Typ
—
Max
945
160
Unit
MHz
MHz
Nominal Frequency1,2
O
f
10
—
Initial Accuracy
Measured at +25 °C at time of
shipping
fi
—
±1.5
—
ppm
ppm
Temperature Stability1,3
–7
–20
–50
—
—
—
+7
+20
+50
Aging
Frequency drift over first year
—
—
—
—
±3
ppm
ppm
fa
Frequency drift over 20 year
life
±10
Notes:
1. See Section 3. "Ordering Information" on page 7 for further details.
2. Specified at time of order by part number. Also available in frequencies from 970 to 1134 MHz and 1213 to 1417 MHz.
3. Selectable parameter specified by part number.
4. Time from powerup or tristate mode to fO.
2
Rev. 1.4
Si530/531
Table 2. CLK± Output Frequency Characteristics (Continued)
Parameter
Total Stability
Symbol
Test Condition
Min
—
Typ
—
Max
±20
Unit
ppm
ppm
ppm
ms
Temp stability = ±7 ppm
Temp stability = ±20 ppm
Temp stability = ±50 ppm
—
—
±31.5
±61.5
10
—
—
Powerup Time4
tOSC
—
—
Notes:
1. See Section 3. "Ordering Information" on page 7 for further details.
2. Specified at time of order by part number. Also available in frequencies from 970 to 1134 MHz and 1213 to 1417 MHz.
3. Selectable parameter specified by part number.
4. Time from powerup or tristate mode to fO.
Table 3. CLK± Output Levels and Symmetry
Parameter
Symbol
Test Condition
mid-level
Min
VDD – 1.42
1.1
Typ
—
Max
VDD – 1.25
1.9
Unit
V
LVPECL Output Option1
V
O
VOD
VSE
swing (diff)
—
VPP
VPP
swing (single-ended)
mid-level
0.55
—
0.95
LVDS Output Option2
CML Output Option2
V
1.125
1.20
1.275
V
O
swing (diff)
VOD
VO
0.5
—
0.7
0.9
—
VPP
V
2.5/3.3 V option mid-level
1.8 V option mid-level
V
V
– 1.30
DD
—
– 0.36
—
V
DD
2.5/3.3 V option swing (diff)
1.8 V option swing (diff)
1.10
0.35
0.8 x VDD
—
1.50
1.90
0.50
VDD
0.4
350
—
VPP
VPP
V
VOD
0.425
—
CMOS Output Option3
Rise/Fall time (20/80%)
Symmetry (duty cycle)
VOH
VOL
I
= 32 mA
OH
IOL = 32 mA
—
V
tR, tF
LVPECL/LVDS/CML
—
—
ps
ns
CMOS with C = 15 pF
—
1
L
LVPECL:
VDD – 1.3 V
SYM
(diff)
LVDS:
CMOS:
45
—
55
%
1.25 V (diff)
VDD/2
Notes:
1. 50 to VDD – 2.0 V.
2. Rterm = 100 (differential).
3. CL = 15 pF
Rev. 1.4
3
Si530/531
Table 4. CLK± Output Phase Jitter
Parameter
Symbol
Test Condition
Min
—
Typ
0.25
0.26
0.36
0.34
0.62
0.61
Max
0.40
0.37
0.50
0.42
—
Unit
ps
Phase Jitter (RMS)1
for FOUT > 500 MHz
J
J
J
12 kHz to 20 MHz (OC-48)
50 kHz to 80 MHz (OC-192)
12 kHz to 20 MHz (OC-48)
—
ps
Phase Jitter (RMS)1
for FOUT of 125 to 500 MHz
—
ps
2
50 kHz to 80 MHz (OC-192)
—
ps
2
Phase Jitter (RMS)
for FOUT of 10 to 160 MHz
CMOS Output Only
12 kHz to 20 MHz (OC-48)
—
ps
2
50 kHz to 20 MHz
—
—
ps
Notes:
1. Refer to AN256 for further information.
2. Max offset frequencies: 80 MHz for FOUT > 250 MHz, 20 MHz for 50 MHz < FOUT <250 MHz,
2 MHz for 10 MHz < FOUT <50 MHz.
Table 5. CLK± Output Period Jitter
Parameter
Period Jitter*
Symbol
Test Condition
RMS
Min
—
Typ
2
Max
—
Unit
ps
J
PER
Peak-to-Peak
—
14
—
ps
*Note: Any output mode, including CMOS, LVPECL, LVDS, CML. N = 1000 cycles. Refer to AN279 for further information.
Table 6. CLK± Output Phase Noise (Typical)
Offset Frequency (f)
120.00 MHz
LVDS
156.25 MHz
LVPECL
622.08 MHz
LVPECL
Unit
100 Hz
1 kHz
10 kHz
100 kHz
1 MHz
–112
–122
–132
–137
–144
–150
n/a
–105
–122
–128
–135
–144
–147
n/a
–97
–107
–116
–121
–134
–146
–148
dBc/Hz
10 MHz
100 MHz
4
Rev. 1.4
Si530/531
Table 7. Environmental Compliance
The Si530/531 meets the following qualification test requirements.
Parameter
Mechanical Shock
Conditions/Test Method
MIL-STD-883, Method 2002
MIL-STD-883, Method 2007
MIL-STD-883, Method 2003
MIL-STD-883, Method 1014
MIL-STD-883, Method 2036
J-STD-020, MSL1
Mechanical Vibration
Solderability
Gross & Fine Leak
Resistance to Solder Heat
Moisture Sensitivity Level
Contact Pads
Gold over Nickel
Table 8. Thermal Characteristics
(Typical values TA = 25 ºC, VDD = 3.3 V)
Parameter
Symbol
Test Condition
Still Air
Min
—
Typ
84.6
38.8
—
Max
—
Unit
°C/W
°C/W
°C
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Case
Ambient Temperature
JA
Still Air
—
—
JC
T
–40
—
85
A
Junction Temperature
T
—
125
°C
J
Table 9. Absolute Maximum Ratings1
Parameter
Maximum Operating Temperature
Supply Voltage, 1.8 V Option
Symbol
Rating
85
Unit
T
ºC
V
AMAX
V
V
–0.5 to +1.9
–0.5 to +3.8
DD
DD
Supply Voltage, 2.5/3.3 V Option
Input Voltage (any input pin)
V
V
–0.5 to V + 0.3
V
I
DD
Storage Temperature
T
–55 to +125
2500
ºC
V
S
ESD Sensitivity (HBM, per JESD22-A114)
Soldering Temperature (Pb-free profile)2
ESD
T
260
ºC
PEAK
Soldering Temperature Time @ TPEAK (Pb-free profile)2
t
20–40
seconds
P
Notes:
1. Stresses beyond those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional
operation or specification compliance is not implied at these conditions. Exposure to maximum rating conditions for
extended periods may affect device reliability.
2. The device is compliant with JEDEC J-STD-020C. Refer to Si5xx Packaging FAQ available for download at
www.silabs.com/VCXO for further information, including soldering profiles.
Rev. 1.4
5
Si530/531
2. Pin Descriptions
(Top View)
VDD
VDD
VDD
1
2
3
6
5
4
1
2
3
6
5
4
1
2
3
6
5
4
OE
NC
NC
OE
OE
NC
NC
CLK–
CLK+
CLK–
CLK+
GND
GND
GND
CLK
Si531
Si530
Si530
LVDS/LVPECL/CML
LVDS/LVPECL/CML
CMOS
Table 10. Pinout for Si530 Series
LVDS/LVPECL/CML Function
Pin
Symbol
OE (CMOS only)*
OE
CMOS Function
Output enable
1
No connection
0 = clock output disabled (outputs tristated)
1 = clock output enabled
Output enable
2
(LVPECL,LVDS, 0 = clock output disabled (outputs tristated)
No connection
CML)*
1 = clock output enabled
Electrical and Case Ground
Oscillator Output
3
4
5
6
GND
Electrical and Case Ground
Oscillator Output
CLK+
CLK–
Complementary Output
Power Supply Voltage
No connection
V
Power Supply Voltage
DD
*Note: OE includes a 17 k pullup resistor to VDD
.
Table 11. Pinout for Si531 Series
Pin
Symbol
LVDS/LVPECL/CML Function
Output enable
1
OE (LVPECL, LVDS, CML)* 0 = clock output disabled (outputs tristated)
1 = clock output enabled
2
3
4
5
6
No connection
GND
No connection
Electrical and Case Ground
Oscillator Output
CLK+
CLK–
Complementary output
Power Supply Voltage
V
DD
*Note: OE includes a 17 k pullup resistor to VDD
.
6
Rev. 1.4
Si530/531
3. Ordering Information
The Si530/531 XO supports a variety of options including frequency, temperature stability, output format, and V
.
DD
Specific device configurations are programmed into the Si530/531 at time of shipment. Configurations can be
specified using the Part Number Configuration chart below. Silicon Laboratories provides a web browser-based
part number configuration utility to simplify this process. Refer to www.silabs.com/VCXOPartNumber to access this
tool and for further ordering instructions. The Si530 and Si531 XO series are supplied in an industry-standard,
RoHS compliant, 6-pad, 5 x 7 mm package. The Si531 Series supports an alternate OE pinout (pin #1) for the
LVPECL, LVDS, and CML output formats. See Tables 10 and 11 for the pinout differences between the Si530 and
Si531 series.
X
53x
XXXMXXX
G
R
X
D
Tape & Reel Packaging
Blank = Trays
530 or 531 XO
Product Family
Operating Temp Range (°C)
-40 to +85°C
G
1st Option Code
VDD Output Format Output Enable Polarity
Part Revision Letter
Frequency (e.g., 622M080 is 622.080 MHz)
A
B
C
D
E
F
G
H
J
K
M
N
P
Q
R
S
T
3.3 LVPECL
3.3 LVDS
3.3 CMOS
3.3 CML
High
High
High
High
High
High
High
High
High
High
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Available frequency range is 10 to 945 MHz, 970 to 1134 MHz, and
1213 to 1417 MHz. The position of “M” shifts to denote higher or lower
frequencies. If the frequency of interest requires greater than 6 digit
resolution, a six digit code will be assigned for the specific frequency.
2.5 LVPECL
2.5 LVDS
2.5 CMOS
2.5 CML
2nd Option Code
1.8 CMOS
1.8 CML
Code Temperature Stability (ppm, max, ±) Total Stablility (ppm, max, ±)
A
B
C
50
20
7
61.5
31.5
20
3.3 LVPECL
3.3 LVDS
3.3 CMOS
3.3 CML
2.5 LVPECL
2.5 LVDS
2.5 CMOS
2.5 CML
U
V
W
1.8 CMOS
1.8 CML
Note:
CMOS available to 160 MHz.
Example P/N: 530AB622M080DGR is a 5 x 7 XO in a 6 pad package. The frequency is 622.080 MHz, with a 3.3 V supply, LVPECL output,
and Output Enable active high polarity. Temperature stability is specifed as ±20 ppm. The part is specified for –40 to +85 °C ambient
temperature range operation and is shipped in tape and reel format.
Figure 1. Part Number Convention
Rev. 1.4
7
Si530/531
4. Outline Diagram and Suggested Pad Layout
Figure 2 illustrates the package details for the Si530/531. Table 12 lists the values for the dimensions shown in the
illustration.
Figure 2. Si530/531 Outline Diagram
Table 12. Package Diagram Dimensions (mm)
Dimension
Min
1.50
1.30
0.50
Nom
1.65
1.40
Max
1.80
1.50
0.70
A
b
c
0.60
D
D1
e
E
E1
H
L
L1
p
5.00 BSC
4.40
2.54 BSC
7.00 BSC
6.20
4.30
4.50
6.10
0.55
1.17
0.05
1.80
6.30
0.75
1.37
0.15
2.60
0.65
1.27
0.10
—
R
0.70 REF
0.15
aaa
bbb
ccc
ddd
eee
0.15
0.10
0.10
0.05
Notes:
1. All dimensions shown are in millimeters (mm) unless
otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
8
Rev. 1.4
Si530/531
5. Si530/Si531 Mark Specification
Figure 3 illustrates the mark specification for the Si530/Si531. Table 13 lists the line information.
Figure 3. Mark Specification
Table 13. Si53x Top Mark Description
Line
Position
Description
1
1–10
“SiLabs"+ Part Family Number, 53x (First 3 characters in part number where x = 0
indicates a 530 device and x = 1 indicates a 531 device).
2
3
1–10
Si530, Si531: Option1 + Option2 + Freq(7) + Temp
Si532, Si533, Si534, Si530/Si531 w/ 8-digit resolution:
Option1 + Option2 + ConfigNum(6) + Temp
Trace Code
Position 1
Pin 1 orientation mark (dot)
Product Revision (D)
Position 2
Tiny Trace Code (4 alphanumeric characters per assembly release instructions)
Year (least significant year digit), to be assigned by assembly site (ex: 2007 = 7)
Calendar Work Week number (1–53), to be assigned by assembly site
“+” to indicate Pb-Free and RoHS-compliant
Position 3–6
Position 7
Position 8–9
Position 10
Rev. 1.4
9
Si530/531
6. 6-Pin PCB Land Pattern
Figure 4 illustrates the 6-pin PCB land pattern for the Si530/531. Table 14 lists the values for the dimensions shown
in the illustration.
Figure 4. Si530/531 PCB Land Pattern
Table 14. PCB Land Pattern Dimensions (mm)
Dimension
(mm)
4.20
2.54
1.55
1.95
C1
E
X1
Y1
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material
Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm.
Solder Mask Design
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between
the solder mask and the metal pad is to be 60 µm minimum, all the way around
the pad.
Stencil Design
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls
should be used to assure good solder paste release.
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1.
Card Assembly
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020
specification for Small Body Components.
10
Rev. 1.4
Si530/531
Revision 1.1 to Revision 1.2
DOCUMENT CHANGE LIST
Revision 0.4 to Revision 0.5
Updated 2.5 V/3.3 V and 1.8 V CML output level
specifications for Table 3 on page 3.
Updated Table 1, “Recommended Operating
Added footnotes clarifying max offset frequency test
Conditions,” on page 2.
conditions for Table 4 on page 4.
Added maximum supply current specifications.
Specified relationship between temperature at startup
and operation temperature.
Added CMOS phase jitter specs to Table 4 on
page 4.
Removed the words "Differential Modes:
LVPECL/LVDS/CML" in the footnote referring to
AN256 in Table 4 on page 4.
Updated Table 4, “CLK± Output Phase Jitter,” on
page 4 to include maximum rms jitter generation
specifications and updated typical rms jitter
specifications.
Separated 1.8 V, 2.5 V/3.3 V supply voltage
specifications in Table 9 on page 5.
Added Table 6, “CLK± Output Phase Noise
Updated and clarified Table 9 on page 5 to include
the "Moisture Sensitivity Level" and "Contact Pads"
rows.
(Typical),” on page 4.
Added Output Enable active polarity as an option in
Figure 1, “Part Number Convention,” on page 7.
Updated Figure 3 on page 9 and Table 13 on page 9
to reflect specific marking information. Previously,
Figure 3 was generic.
Revision 0.5 to Revision 1.0
Updated Note 3 in Table 1, “Recommended
Operating Conditions,” on page 2.
Revision 1.2 to Revision 1.3
Updated Figure 1, “Part Number Convention,” on
Added Table 8, “Thermal Characteristics,” on
page 7.
page 5.
Revision 1.0 to Revision 1.1
Revision 1.3 to Revision 1.4
Updated Table 1, “Recommended Operating
Revised Figure 2 and Table 12 on page 8 to reflect
Conditions,” on page 2.
Device maintains stable operation over –40 to +85 ºC
operating temperature range.
current package outline diagram.
Revised Figure 4 and Table 14 on page 10 to reflect
the recommended PCB land pattern.
Supply current specifications updated for revision D.
Updated Table 2, “CLK± Output Frequency
Characteristics,” on page 2.
Added specification for ±20 ppm lifetime stability
(±7 ppm temperature stability) XO.
Updated Table 3, “CLK± Output Levels and
Symmetry,” on page 3.
Updated LVDS differential peak-peak swing
specifications.
Updated Table 4, “CLK± Output Phase Jitter,” on
page 4.
Updated Table 5, “CLK± Output Period Jitter,” on
page 4.
Revised period jitter specifications.
1
Updated Table 9, “Absolute Maximum Ratings ,” on
page 5 to reflect the soldering temperature time at
260 ºC is 20–40 sec per JEDEC J-STD-020C.
Updated 3. "Ordering Information" on page 7.
Changed ordering instructions to revision D.
Added 5. "Si530/Si531 Mark Specification" on page
9.
11
Rev. 1.4
Si530/531
CONTACT INFORMATION
Silicon Laboratories Inc.
400 West Cesar Chavez
Austin, TX 78701
Tel: 1+(512) 416-8500
Fax: 1+(512) 416-9669
Toll Free: 1+(877) 444-3032
Please visit the Silicon Labs Technical Support web page:
https://www.silabs.com/support/pages/contacttechnicalsupport.aspx
and register to submit a technical support request.
Patent Notice
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intensive mixed-signal solutions. Silicon Labs' extensive patent portfolio is a testament to our unique approach and world-class engineering team.
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12
Rev. 1.4
相关型号:
530AA1000M00DG
LVPECL Output Clock Oscillator, 970MHz Min, 1134MHz Max, 1000MHz Nom, ROHS COMPLIANT, SMD, 6 PIN
SILICON
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