532MB000108DG [SILICON]

Oscillator;
532MB000108DG
型号: 532MB000108DG
厂家: SILICON    SILICON
描述:

Oscillator

文件: 总12页 (文件大小:113K)
中文:  中文翻译
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Si532  
REVISION D  
DUAL FREQUENCY CRYSTAL OSCILLATOR (XO)  
(10 MHZ TO 1.4 GHZ)  
Features  
Available with any-frequency output  
frequencies from 10 MHz to 945 MHz  
and select frequencies to 1.4 GHz  
Two selectable output frequencies  
Internal fixed crystal frequency  
ensures high reliability and low  
aging  
Available CMOS, LVPECL,  
LVDS, and CML outputs  
3.3, 2.5, and 1.8 V supply options  
Industry-standard 5 x 7 mm  
package and pinout  
®
3rd generation DSPLL with superior  
jitter performance  
3x better frequency stability than  
SAW-based oscillators  
Pb-free/RoHS-compliant  
Ordering Information:  
Applications  
See page 7.  
SONET/SDH  
Networking  
SD/HD video  
Test and measurement  
Clock and data recovery  
FPGA/ASIC clock generation  
Pin Assignments:  
See page 6.  
Description  
(Top View)  
The Si532 dual frequency XO utilizes Silicon Laboratories’ advanced  
®
DSPLL circuitry to provide a low jitter clock at high frequencies. The Si532 is  
VDD  
1
2
3
6
5
4
FS  
OE  
available with any-frequency output frequency from 10 to 945 MHz and select  
frequencies to 1400 MHz. Unlike a traditional XO where a different crystal is  
required for each output frequency, the Si532 uses one fixed crystal  
frequency to provide a wide range of output frequencies. This IC based  
approach allows the crystal resonator to provide exceptional frequency  
stability and reliability. In addition, DSPLL clock synthesis provides superior  
supply noise rejection, simplifying the task of generating low jitter clocks in  
noisy environments typically found in communication systems. The Si532 IC  
based XO is factory configurable for a wide variety of user specifications  
including frequency, supply voltage, output format, and temperature stability.  
Specific configurations are factory programmed at time of shipment, thereby  
eliminating long lead times associated with custom oscillators.  
CLK–  
CLK+  
GND  
(LVDS/LVPECL/CML)  
VDD  
1
2
3
6
5
4
FS  
OE  
NC  
Functional Block Diagram  
GND  
CLK  
VDD  
CLK– CLK+  
(CMOS)  
Any-frequency  
10–1400 MHz  
DSPLL®  
Fixed  
Frequency  
XO  
Clock  
Synthesis  
FS  
OE  
GND  
Rev. 1.2 5/11  
Copyright © 2011 by Silicon Laboratories  
Si532  
Si532  
1. Electrical Specifications  
Table 1. Recommended Operating Conditions  
Parameter  
Symbol  
Test Condition  
3.3 V option  
2.5 V option  
1.8 V option  
Min  
2.97  
2.25  
1.71  
Typ  
3.3  
2.5  
1.8  
Max  
3.63  
2.75  
1.89  
Units  
1
V
V
V
V
Supply Voltage  
DD  
Supply Current  
I
Output enabled  
LVPECL  
CML  
DD  
121  
108  
98  
111  
99  
90  
81  
mA  
LVDS  
CMOS  
88  
Tristate mode  
0.75 x V  
60  
75  
mA  
V
Output Enable (OE)  
V
IH  
DD  
and Frequency Select (FS)2  
V
0.5  
85  
V
IL  
Operating Temperature Range  
T
–40  
ºC  
A
Notes:  
1. Selectable parameter specified by part number. See Section 3. "Ordering Information" on page 7 for further details.  
2. OE and FS pins include a 17 kpullup resistor to VDD. Pulling OE to ground causes outputs to tristate.  
Table 2. CLK± Output Frequency Characteristics  
Parameter  
Symbol  
Test Condition  
LVPECL/LVDS/CML  
CMOS  
Min  
10  
Typ  
Max Units  
Nominal Frequency1,2  
O
f
945  
160  
MHz  
MHz  
10  
Initial Accuracy  
Measured at +25 °C at time of  
shipping  
fi  
±1.5  
ppm  
ppm  
Temperature Stability1,3  
–7  
–20  
–50  
+7  
+20  
+50  
Aging  
Frequency drift over first year  
Frequency drift over 20 year life  
Temp stability = ±7 ppm  
±3  
ppm  
ppm  
ppm  
ppm  
ppm  
fa  
±10  
Total Stability  
±20  
Temp stability = ±20 ppm  
Temp stability = ±50 ppm  
±31.5  
±61.5  
Notes:  
1. See Section 3. "Ordering Information" on page 7 for further details.  
2. Specified at time of order by part number. Also available in frequencies from 970 to 1134 MHz and 1213 to 1417 MHz.  
3. Selectable parameter specified by part number.  
4. Time from powerup or tristate mode to fO.  
2
Rev. 1.2  
Si532  
Table 2. CLK± Output Frequency Characteristics (Continued)  
Parameter  
Powerup Time4  
Symbol  
tOSC  
Test Condition  
Min  
Typ  
Max Units  
10  
10  
ms  
ms  
Settling Time After FS Change  
tFRQ  
Notes:  
1. See Section 3. "Ordering Information" on page 7 for further details.  
2. Specified at time of order by part number. Also available in frequencies from 970 to 1134 MHz and 1213 to 1417 MHz.  
3. Selectable parameter specified by part number.  
4. Time from powerup or tristate mode to fO.  
Table 3. CLK± Output Levels and Symmetry  
Parameter  
Symbol  
Test Condition  
mid-level  
Min  
VDD – 1.42  
1.1  
Typ  
Max  
VDD – 1.25  
1.9  
Units  
V
LVPECL Output Option1  
V
O
VOD  
VSE  
swing (diff)  
VPP  
VPP  
swing (single-ended)  
mid-level  
0.55  
0.95  
LVDS Output Option2  
CML Output Option2  
V
1.125  
1.20  
1.275  
V
O
swing (diff)  
VOD  
VO  
0.5  
0.7  
0.9  
VPP  
V
2.5/3.3 V option mid-level  
1.8 V option mid-level  
V
V
– 1.30  
DD  
– 0.36  
V
DD  
2.5/3.3 V option swing (diff)  
1.8 V option swing (diff)  
1.10  
0.35  
0.8 x VDD  
1.50  
1.90  
0.50  
VDD  
0.4  
350  
VPP  
VPP  
V
VOD  
0.425  
CMOS Output Option3  
Rise/Fall time (20/80%)  
Symmetry (duty cycle)  
VOH  
VOL  
I
= 32 mA  
OH  
IOL = 32 mA  
tR, F  
t
LVPECL/LVDS/CML  
ps  
ns  
CMOS with C = 15 pF  
1
L
SYM  
LVPECL:  
VDD – 1.3 V  
(diff)  
LVDS:  
CMOS:  
45  
55  
%
1.25 V (diff)  
VDD/2  
Notes:  
1. 50 to VDD – 2.0 V.  
2. Rterm = 100 (differential).  
3. CL = 15 pF  
Rev. 1.2  
3
Si532  
Table 4. CLK± Output Phase Jitter  
Parameter  
Symbol  
Test Condition  
Min  
Typ  
0.25  
0.26  
0.36  
0.34  
0.62  
0.61  
Max  
0.40  
0.37  
0.50  
0.42  
Units  
ps  
Phase Jitter (RMS)1  
for FOUT > 500 MHz  
J  
J  
J  
12 kHz to 20 MHz (OC-48)  
50 kHz to 80 MHz (OC-192)  
12 kHz to 20 MHz (OC-48)  
ps  
Phase Jitter (RMS)1  
for FOUT of 125 to 500 MHz  
ps  
2
50 kHz to 80 MHz (OC-192)  
ps  
2
Phase Jitter (RMS)  
for FOUT of 10 to 160 MHz  
CMOS Output Only  
12 kHz to 20 MHz (OC-48)  
ps  
2
50 kHz to 20 MHz  
ps  
Notes:  
1. Refer to AN256 for further information.  
2. Max offset frequencies: 80 MHz for FOUT > 250 MHz, 20 MHz for 50 MHz < FOUT <250 MHz,  
2 MHz for 10 MHz < FOUT <50 MHz.  
Table 5. CLK± Output Period Jitter  
Parameter  
Period Jitter*  
Symbol  
Test Condition  
RMS  
Min  
Typ  
2
Max  
Units  
ps  
J
PER  
Peak-to-Peak  
14  
ps  
*Note: Any output mode, including CMOS, LVPECL, LVDS, CML. N = 1000 cycles. Refer to AN279 for further information.  
Table 6. CLK± Output Phase Noise (Typical)  
Offset Frequency (f)  
120.00 MHz  
LVDS  
156.25 MHz  
LVPECL  
622.08 MHz  
LVPECL  
Units  
100 Hz  
1 kHz  
10 kHz  
100 kHz  
1 MHz  
–112  
–122  
–132  
–137  
–144  
–150  
n/a  
–105  
–122  
–128  
–135  
–144  
–147  
n/a  
–97  
–107  
–116  
–121  
–134  
–146  
–148  
dBc/Hz  
10 MHz  
100 MHz  
4
Rev. 1.2  
Si532  
Table 7. Absolute Maximum Ratings1  
Parameter  
Maximum Operating Temperature  
Supply Voltage, 1.8 V Option  
Symbol  
Rating  
85  
Units  
T
ºC  
AMAX  
V
V
–0.5 to +1.9  
–0.5 to +3.8  
V
DD  
DD  
Supply Voltage, 2.5/3.3 V Option  
Input Voltage (any input pin)  
V
V
–0.5 to V + 0.3  
V
ºC  
I
DD  
Storage Temperature  
T
–55 to +125  
2500  
S
ESD Sensitivity (HBM, per JESD22-A114)  
Soldering Temperature (Pb-free profile)2  
Soldering Temperature Time @ TPEAK (Pb-free profile)2  
Notes:  
ESD  
V
T
260  
ºC  
PEAK  
t
20–40  
seconds  
P
1. Stresses beyond those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional  
operation or specification compliance is not implied at these conditions.  
2. The device is compliant with JEDEC J-STD-020C. Refer to Si5xx Packaging FAQ available for download at  
www.silabs.com/VCXO for further information, including soldering profiles.  
Table 8. Environmental Compliance  
The Si532 meets the following qualification test requirements.  
Parameter  
Conditions/Test Method  
MIL-STD-883, Method 2002  
MIL-STD-883, Method 2007  
MIL-STD-883, Method 2003  
MIL-STD-883, Method 1014  
MIL-STD-883, Method 2036  
J-STD_020, MSL1  
Mechanical Shock  
Mechanical Vibration  
Solderability  
Gross & Fine Leak  
Resistance to Solder Heat  
Moisture Sensitivity Level  
Contact Pads  
Gold over Nickel  
Rev. 1.2  
5
Si532  
2. Pin Descriptions  
(Top View)  
VDD  
VDD  
1
2
3
6
5
4
1
6
5
4
FS  
OE  
FS  
OE  
2
3
NC  
CLK–  
CLK+  
GND  
GND  
CLK  
LVDS/LVPECL/CML  
CMOS  
Table 9. Pin Descriptions  
Pin  
Symbol  
LVDS/LVPECL/CML Function  
CMOS Function  
Frequency Select  
Frequency Select  
1
FS*  
0 = First frequency selected  
1 = Second frequency selected  
0 = First frequency selected  
1 = Second frequency selected  
Output enable  
Output enable  
2
OE*  
0 = clock output disabled (outputs tristated) 0 = clock output disabled (outputs tristated)  
1 = clock output enabled  
Electrical and Case Ground  
Oscillator Output  
1 = clock output enabled  
Electrical and Case Ground  
Oscillator Output  
3
4
5
6
GND  
CLK+  
CLK–  
Complementary Output  
Power Supply Voltage  
No connection  
V
Power Supply Voltage  
DD  
*Note: FS and OE include a 17 kpullup resistor to VDD. See Section 3. “Ordering Information” for details on frequency value  
ordering.  
6
Rev. 1.2  
Si532  
3. Ordering Information  
The Si532 XO supports a variety of options including frequency, temperature stability, output format, and V  
.
DD  
Specific device configurations are programmed into the Si532 at time of shipment. Configurations can be specified  
using the Part Number Configuration chart below. Silicon Laboratories provides a web browser-based part number  
configuration utility to simplify this process. Refer to www.silabs.com/VCXOPartNumber to access this tool and for  
further ordering instructions. The Si532 is supplied in an industry-standard, RoHS-compliant, 6-pad, 5 x 7 mm  
package.  
X
X
D
G
R
532  
XXXXXX  
R = Tape & Reel  
Blank = Trays  
532 Dual XO  
Product Family  
Operating Temp Range (°C)  
–40 to +85 °C  
1st Option Code  
VDD Output Format Output Enable Polarity  
G
A
B
C
D
E
F
G
H
J
K
M
N
P
Q
R
S
T
3.3 LVPECL  
3.3 LVDS  
3.3 CMOS  
3.3 CML  
2.5 LVPECL  
2.5 LVDS  
2.5 CMOS  
2.5 CML  
1.8 CMOS  
1.8 CML  
3.3 LVPECL  
3.3 LVDS  
3.3 CMOS  
3.3 CML  
2.5 LVPECL  
2.5 LVDS  
2.5 CMOS  
2.5 CML  
1.8 CMOS  
1.8 CML  
High  
High  
High  
High  
High  
High  
High  
High  
High  
High  
Low  
Low  
Low  
Low  
Low  
Low  
Low  
Low  
Low  
Low  
Device Revision Letter  
6-digit Frequency Designator Code  
Two unique frequencies can be specified within the following bands of  
frequencies: 10 to 945 MHz, 970 to 1134 MHz, and 1213 to 1417 MHz. A  
six digit code will be assigned for the specified combination of frequencies.  
Codes > 000100 refer to dual XOs programmed with the lower frequency  
value selected when FS = 0, and the higher value when FS = 1. Six digit  
codes < 000100 refer to dual XOs programmed with the higher frequency  
value selected when FS = 0, and the lower value when FS = 1.  
2nd Option Code  
Code Temperature Stability (ppm, max, ±) Total Stablility (ppm, max, ±)  
U
V
W
A
B
C
50  
20  
7
61.5  
31.5  
20  
Note:  
CMOS available to 160 MHz.  
Example Part Number: 532AB000108DGR is a 5 x 7 mm Dual XO in a 6 pad package. Since the six digit code (000108) is > 000100,  
f0 is 644.53125 MHz (lower frequency) and f1 is 693.48299 (higher frequency), with a 3.3 V supply, LVPECL output, and Output  
Enable active high polarity. Temperature stability is specified as ±20 ppm. The part is specified for a –40 to +85 C° ambient  
temperature range operation and is shipped in tape and reel format.  
Figure 1. Part Number Convention  
Rev. 1.2  
7
Si532  
4. Outline Diagram and Suggested Pad Layout  
Figure 2 illustrates the package details for the Si532. Table 10 lists the values for the dimensions shown in the  
illustration.  
Figure 2. Si532 Outline Diagram  
Table 10. Package Diagram Dimensions (mm)  
Dimension  
Min  
1.50  
1.30  
0.50  
Nom  
1.65  
Max  
1.80  
1.50  
0.70  
A
b
1.40  
c
0.60  
D
5.00 BSC  
4.40  
D1  
e
4.30  
4.50  
2.54 BSC  
7.00 BSC  
6.20  
E
E1  
H
6.10  
0.55  
1.17  
1.80  
6.30  
0.75  
1.37  
2.60  
0.65  
L
1.27  
p
R
0.70 REF  
0.15  
aaa  
bbb  
ccc  
ddd  
eee  
0.15  
0.10  
0.10  
0.05  
8
Rev. 1.2  
Si532  
5. Si532 Mark Specification  
Figure 3 illustrates the mark specification for the Si532. Table 11 lists the line information.  
Figure 3. Mark Specification  
Table 11. Si53x Top Mark Description  
Line  
Position  
Description  
1
1–10  
“SiLabs 532”  
2
3
1–10  
Si532: Option1 + Option2 + ConfigNum(6) + Temp  
Trace Code  
Position 1  
Pin 1 orientation mark (dot)  
Product Revision (D)  
Position 2  
Position 3–6  
Position 7  
Tiny Trace Code (4 alphanumeric characters per assembly release instructions)  
Year (least significant year digit), to be assigned by assembly site (ex: 2007 = 7)  
Calendar Work Week number (1–53), to be assigned by assembly site  
“+” to indicate Pb-Free and RoHS-compliant  
Position 8–9  
Position 10  
Rev. 1.2  
9
Si532  
6. 6-Pin PCB Land Pattern  
Figure 4 illustrates the 6-pin PCB land pattern for the Si532. Table 12 lists the values for the dimensions shown in  
the illustration.  
Figure 4. Si532 PCB Land Pattern  
Table 12. PCB Land Pattern Dimensions (mm)  
Dimension  
Min  
Max  
D2  
e
5.08 REF  
2.54 BSC  
4.15 REF  
E2  
GD  
GE  
VD  
VE  
X
0.84  
2.00  
8.20 REF  
7.30 REF  
1.70 TYP  
2.15 REF  
Y
ZD  
ZE  
6.78  
6.30  
Notes:  
1. Dimensioning and tolerancing per the ANSI Y14.5M-1994 specification.  
2. Land pattern design based on IPC-7351 guidelines.  
3. All dimensions shown are at maximum material condition (MMC).  
4. Controlling dimension is in millimeters (mm).  
10  
Rev. 1.2  
Si532  
DOCUMENT CHANGE LIST  
Revision 1.0 to Revision 1.1  
Updated Table 1, “Recommended Operating  
Conditions,” on page 2.  
Device maintains stable operation over –40 to +85 ºC  
operating temperature range.  
Supply current specifications updated for revision D.  
Updated Table 2, “CLK± Output Frequency  
Characteristics,” on page 2.  
Added specification for ±20 ppm lifetime stability  
(±7 ppm temperature stability) XO.  
Updated Table 3, “CLK± Output Levels and  
Symmetry,” on page 3.  
Updated LVDS differential peak-peak swing  
specifications.  
Updated Table 4, “CLK± Output Phase Jitter,” on  
page 4.  
Updated Table 5, “CLK± Output Period Jitter,” on  
page 4.  
Revised period jitter specifications.  
1
Updated Table 7, “Absolute Maximum Ratings ,” on  
page 5 to reflect the soldering temperature time at  
260 ºC is 20–40 sec per JEDEC J-STD-020C.  
Updated 3. "Ordering Information" on page 7.  
Changed ordering instructions to revision D.  
Added 5. "Si532 Mark Specification" on page 9.  
Revision 1.1 to Revision 1.2  
Updated 2.5 V/3.3 V and 1.8 V CML output level  
specifications for Table 3 on page 3.  
Added footnotes clarifying max offset frequency test  
conditions for Table 4 on page 4.  
Removed the words "Differential Modes:  
LVPECL/LVDS/CML" in the footnote referring to  
AN256 in Table 4 on page 4.  
Added CMOS phase jitter specs to Table 4 on  
page 4.  
Updated Table 8 on page 5 to include the "Moisture  
Sensitivity Level" and "Contact Pads" rows.  
Revised Figure 2 on page 8 to reflect current  
package outline diagram.  
Updated Figure 3 and Table 11 on page 9 to reflect  
specific marking information. Previously, Figure 3  
was generic.  
Rev. 1.2  
11  
Si532  
CONTACT INFORMATION  
Silicon Laboratories Inc.  
400 West Cesar Chavez  
Austin, TX 78701  
Tel: 1+(512) 416-8500  
Fax: 1+(512) 416-9669  
Toll Free: 1+(877) 444-3032  
Please visit the Silicon Labs Technical Support web page:  
https://www.silabs.com/support/pages/contacttechnicalsupport.aspx  
and register to submit a technical support request.  
The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice.  
Silicon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from  
the use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the functioning of undescribed features  
or parameters. Silicon Laboratories reserves the right to make changes without further notice. Silicon Laboratories makes no warranty, rep-  
resentation or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Laboratories assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation conse-  
quential or incidental damages. Silicon Laboratories products are not designed, intended, or authorized for use in applications intended to  
support or sustain life, or for any other application in which the failure of the Silicon Laboratories product could create a situation where per-  
sonal injury or death may occur. Should Buyer purchase or use Silicon Laboratories products for any such unintended or unauthorized ap-  
plication, Buyer shall indemnify and hold Silicon Laboratories harmless against all claims and damages.  
Silicon Laboratories and Silicon Labs are trademarks of Silicon Laboratories Inc.  
Other products or brandnames mentioned herein are trademarks or registered trademarks of their respective holders.  
12  
Rev. 1.2  

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