BGM13S32F512GN-V3R_技术文档

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BGM13S Blue Gecko Bluetooth SiP

Module Data Sheet

The BGM13S is Silicon Labs’ first SiP module solution for Bluetooth 5 connectivity. It

supports 2 Mbps, 1 Mbps and coded LE Bluetooth PHYs. Also, with 512 kB of flash and

KEY FEATURES

64 kB of RAM, the BGM13S is suited to meet Bluetooth Mesh networking memory re-

quirements effectively.

• Bluetooth 5 compliant

• Fit for Bluetooth Mesh

Based on the EFR32BG13 Blue Gecko SoC, the BGM13S delivers robust RF perform-

ance, low energy consumption, a wide selection of MCU peripherals, regulatory test cer-

tificates for various regions and countries, and a simplified development experience, all

in a 6.5 × 6.5 mm package. Together with the certified software stacks and powerful

tools also offered by Silicon Labs, the BGM13S minimizes the area requirements, engi-

neering efforts and development costs associated with adding Bluetooth 5.0 or Bluetooth

Mesh connectivity to any product, accelerating its time-to-market.

• Antenna or RF Pin variants

• Up to +19 dBm TX power

• -94.1 dBm RX sensitivity at 1 Mbps

• 32-bit ARM® Cortex®-M4 core at 38.4

MHz

• 512/64 kB of flash/RAM memory

• Precision Low Frequency Oscillator meets

Bluetooth Low Energy Sleep Clock

accuracy requirements

The BGM13S is intended for a broad range of applications, including:

• Wearables

• Autonomous Hardware Crypto

Accelerators

• IoT end-node devices and gateways

• Health, sports, and wellness

• Industrial, home, and building automation

• Beacons

• Integrated DC-DC converter

• 32 GPIO pins

• 6.5 mm × 6.5 mm × 1.4 mm

• Smart phone, tablet, and PC accessories

Core / Memory

Crystal

Clock Management

Energy Management

Other

H-F Crystal

Oscillator

H-F

RC Oscillator

Voltage

38.4 MHz

CRYPTO

CRC

Voltage Monitor

Regulator

ARM Cortex^TMM4 processor

with DSP extensions, FPU and MPU

Flash Program

Memory

Precision L-F RC

Oscillator

Auxiliary H-F RC

Oscillator

DC-DC

Power-On Reset

Converter

L-F Crystal

Oscillator

L-F

True Random

Number Generator

RC Oscillator

Brown-Out

Detector

LDMA

Controller

Ultra L-F RC

Oscillator

ETM

Debug Interface

RAM Memory

SMU

32-bit bus

Peripheral Reflex System

Antenna

Radio Transceiver

Serial

I/O Ports

Timers and Triggers

Analog I/F

Interfaces

DEMOD

IFADC

AGC

ADC

External

Interrupts

USART

Timer/Counter

Protocol Timer

Chip Antenna

Matching

Analog

Comparator

PGA

I

Low Energy

UART^TM

General

Purpose I/O

Low Energy

Timer

Low Energy

Sensor Interface

LNA

IDAC

RF Frontend

PA

Capacitive

Touch

I²C

Pin Reset

Pulse Counter

Watchdog Timer

Cryotimer

Frequency

Synthesizer

Q

VDAC

MOD

Real Time

Counter and

Calendar

Pin Wakeup

Op-Amp

Lowest power mode with peripheral operational:

EM0—Active EM1—Sleep

EM2—Deep Sleep

EM3—Stop

EM4—Hibernate

EM4—Shutoff

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Feature List

1. Feature List

• Supported Protocols

• Bluetooth 5

• Support for Internet Security

• General Purpose CRC

• Bluetooth Mesh

• True Random Number Generator (TRNG)

• Wireless System-on-Chip

• 2.4 GHz radio

• 2 × Hardware Cryptographic Accelerators (CRYPTO) for

AES 128/256, SHA-1, SHA-2 (SHA-224 and SHA-256) and

ECC

• TX power up to +19 dBm

• Wide Selection of MCU Peripherals

• 12-bit 1 Msps SAR Analog to Digital Converter (ADC)

• 2 × Analog Comparator (ACMP)

High Performance 32-bit 38.4 MHz ARM Cortex^®-M4 with

DSP instruction and floating-point unit for efficient signal

processing

•

• 2 × Digital to Analog Converter (VDAC)

• 3 × Operational Amplifier (Opamp)

• 512 kB flash program memory

• 64 kB RAM data memory

• Digital to Analog Current Converter (IDAC)

• Low-Energy Sensor Interface (LESENSE)

• Multi-channel Capacitive Sense Interface (CSEN)

• Embedded Trace Macrocell (ETM) for advanced debugging

• Integrated DC-DC converter

• High Receiver Performance

• 32 pins connected to analog channels (APORT) shared be-

tween analog peripherals

• -102.1 dBm sensitivity at 125 kbit/s GFSK

• -97.9 dBm sensitivity at 500 kbit/s GFSK

• -94.1 dBm sensitivity at 1 Mbit/s GFSK

• -90.2 dBm sensitivity at 2 Mbit/s GFSK

• Low Energy Consumption

• 32 General Purpose I/O pins with output state retention and

asynchronous interrupts

• 8 Channel DMA Controller

• 12 Channel Peripheral Reflex System (PRS)

• 2 ×16-bit Timer/Counter

• 9.7 mA RX current at 1 Mbps, GFSK

• 8.9 mA TX current at 0 dBm output power

• 87 μA/MHz in Active Mode (EM0)

• 3 or 4 Compare/Capture/PWM channels

• 1 × 32-bit Timer/Counter

• 1.4 μA EM2 DeepSleep current (full RAM retention and

RTCC running from LFXO)

• 3 Compare/Capture/PWM channels

• Precision Low Frequency RC Oscillator (PLFRCO)

• 32-bit Real Time Counter and Calendar

• 16-bit Low Energy Timer for waveform generation

• 1.14 μA EM3 Stop current (State/RAM retention)

• Wake on Radio with signal strength detection, preamble

pattern detection, frame detection and timeout

• 32-bit Ultra Low Energy Timer/Counter for periodic wake-up

from any Energy Mode

• Regulatory Certifications

• FCC

• 16-bit Pulse Counter with asynchronous operation

• 2 × Watchdog Timer

• CE

• IC / ISEDC

• 3 × Universal Synchronous/Asynchronous Receiver/Trans-

mitter (UART/SPI/SmartCard (ISO 7816)/IrDA/I²S)

• MIC / Telec

• Wide Operating Range

• 1.8 V to 3.8 V single power supply

• -40 °C to +85 °C

• Dimensions

Low Energy UART (LEUART^™)

2 × I²C interface with SMBus support and address recogni-

tion in EM3 Stop

•

• 6.5 mm × 6.5 mm × 1.4 mm

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Ordering Information

2. Ordering Information

Table 2.1. Ordering Information

Flash

(kB)

RAM

(kB)

Ordering Code

Protocol Stack

Max TX Power

19 dBm

8 dBm

Antenna

GPIO

32

Packaging

Cut Tape

Reel

BGM13S32F512GA-V3

BGM13S32F512GA-V3R

BGM13S32F512GN-V3

BGM13S32F512GN-V3R

BGM13S22F512GA-V3

BGM13S22F512GA-V3R

BGM13S22F512GN-V3

BGM13S22F512GN-V3R

Bluetooth LE

Built-in

RF pin

Built-in

RF pin

512

64

32

Cut Tape

Reel

32

Cut Tape

Reel

8 dBm

32

8 dBm

32

Cut Tape

Reel

8 dBm

32

Radio board development hardware is also available:

• SLWRB4305A for BGM13S32 Blue Gecko Module Radio Board

• SLWRB4305C for BGM13S22 Blue Gecko Module Radio Board

End-product manufacturers must verify that the module is configured to meet regulatory limits for each region in accordance with the

formal certification test reports.

Devices ship with the Gecko UART DFU bootloader 1.4.1 + NCP application from Bluetooth SDK 2.8.1.0. The firmware settings con-

form to the diagram shown in .

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Table of Contents

1. Feature List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

2. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

3. System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3.2 Radio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3.2.1 Antenna Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3.2.2 RFSENSE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.2.3 Packet and State Trace . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.2.4 Random Number Generator . . . . . . . . . . . . . . . . . . . . . . . . 8

3.3 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.3.1 Energy Management Unit (EMU) . . . . . . . . . . . . . . . . . . . . . .10

3.3.2 DC-DC Converter . . . . . . . . . . . . . . . . . . . . . . . . . . .10

3.3.3 Power Domains . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

3.4 General Purpose Input/Output (GPIO) . . . . . . . . . . . . . . . . . . . . . .10

3.5 Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

3.5.1 Clock Management Unit (CMU) . . . . . . . . . . . . . . . . . . . . . . .10

3.5.2 Internal Oscillators and Crystal . . . . . . . . . . . . . . . . . . . . . . .11

3.6 Counters/Timers and PWM . . . . . . . . . . . . . . . . . . . . . . . . . .11

3.6.1 Timer/Counter (TIMER) . . . . . . . . . . . . . . . . . . . . . . . . .11

3.6.2 Wide Timer/Counter (WTIMER) . . . . . . . . . . . . . . . . . . . . . . .11

3.6.3 Real Time Counter and Calendar (RTCC) . . . . . . . . . . . . . . . . . . .11

3.6.4 Low Energy Timer (LETIMER) . . . . . . . . . . . . . . . . . . . . . . .11

3.6.5 Ultra Low Power Wake-up Timer (CRYOTIMER) . . . . . . . . . . . . . . . . .11

3.6.6 Pulse Counter (PCNT) . . . . . . . . . . . . . . . . . . . . . . . . . .12

3.6.7 Watchdog Timer (WDOG). . . . . . . . . . . . . . . . . . . . . . . . .12

3.7 Communications and Other Digital Peripherals . . . . . . . . . . . . . . . . . . .12

3.7.1 Universal Synchronous/Asynchronous Receiver/Transmitter (USART) . . . . . . . . . .12

3.7.2 Low Energy Universal Asynchronous Receiver/Transmitter (LEUART) . . . . . . . . . .12

2

3.7.3 Inter-Integrated Circuit Interface (I C) . . . . . . . . . . . . . . . . . . . . .12

3.7.4 Peripheral Reflex System (PRS) . . . . . . . . . . . . . . . . . . . . . .12

3.7.5 Low Energy Sensor Interface (LESENSE) . . . . . . . . . . . . . . . . . . .12

3.8 Security Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

3.8.1 General Purpose Cyclic Redundancy Check (GPCRC) . . . . . . . . . . . . . . .12

3.8.2 Crypto Accelerator (CRYPTO) . . . . . . . . . . . . . . . . . . . . . . .13

3.8.3 True Random Number Generator (TRNG) . . . . . . . . . . . . . . . . . . .13

3.8.4 Security Management Unit (SMU) . . . . . . . . . . . . . . . . . . . . . .13

3.9 Analog. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

3.9.1 Analog Port (APORT) . . . . . . . . . . . . . . . . . . . . . . . . . .13

3.9.2 Analog Comparator (ACMP) . . . . . . . . . . . . . . . . . . . . . . . .13

3.9.3 Analog to Digital Converter (ADC) . . . . . . . . . . . . . . . . . . . . . .13

3.9.4 Capacitive Sense (CSEN). . . . . . . . . . . . . . . . . . . . . . . . .13

3.9.5 Digital to Analog Current Converter (IDAC) . . . . . . . . . . . . . . . . . . .14

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3.9.6 Digital to Analog Converter (VDAC) . . . . . . . . . . . . . . . . . . . . .14

3.9.7 Operational Amplifiers . . . . . . . . . . . . . . . . . . . . . . . . . .14

3.10 Reset Management Unit (RMU) . . . . . . . . . . . . . . . . . . . . . . . .14

3.11 Core and Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

3.11.1 Processor Core . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

3.11.2 Memory System Controller (MSC) . . . . . . . . . . . . . . . . . . . . .14

3.11.3 Linked Direct Memory Access Controller (LDMA) . . . . . . . . . . . . . . . .14

3.12 Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

3.13 Configuration Summary . . . . . . . . . . . . . . . . . . . . . . . . . .16

4. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 17

4.1 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .17

4.1.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . .18

4.1.2 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . .19

4.1.3 DC-DC Converter . . . . . . . . . . . . . . . . . . . . . . . . . . .20

4.1.4 Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . .22

4.1.5 Wake Up Times . . . . . . . . . . . . . . . . . . . . . . . . . . . .28

4.1.6 Brown Out Detector (BOD) . . . . . . . . . . . . . . . . . . . . . . . .28

4.1.7 Frequency Synthesizer. . . . . . . . . . . . . . . . . . . . . . . . . .29

4.1.8 2.4 GHz RF Transceiver Characteristics . . . . . . . . . . . . . . . . . . . .30

4.1.9 Oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39

4.1.10 Flash Memory Characteristics . . . . . . . . . . . . . . . . . . . . . . .42

4.1.11 General-Purpose I/O (GPIO) . . . . . . . . . . . . . . . . . . . . . . .43

4.1.12 Voltage Monitor (VMON). . . . . . . . . . . . . . . . . . . . . . . . .45

4.1.13 Analog to Digital Converter (ADC) . . . . . . . . . . . . . . . . . . . . .46

4.1.14 Analog Comparator (ACMP) . . . . . . . . . . . . . . . . . . . . . . .48

4.1.15 Digital to Analog Converter (VDAC) . . . . . . . . . . . . . . . . . . . . .51

4.1.16 Current Digital to Analog Converter (IDAC) . . . . . . . . . . . . . . . . . .54

4.1.17 Capacitive Sense (CSEN) . . . . . . . . . . . . . . . . . . . . . . . .56

4.1.18 Operational Amplifier (OPAMP) . . . . . . . . . . . . . . . . . . . . . .58

4.1.19 Pulse Counter (PCNT) . . . . . . . . . . . . . . . . . . . . . . . . .61

4.1.20 Analog Port (APORT) . . . . . . . . . . . . . . . . . . . . . . . . . .61

4.1.21 I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62

4.1.22 USART SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65

5. Typical Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . . 67

5.1 Typical BGM13S Connections . . . . . . . . . . . . . . . . . . . . . . . . .67

6. Layout Guidelines

. . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

6.1 Layout Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69

6.2 Effect of PCB Width . . . . . . . . . . . . . . . . . . . . . . . . . . . .70

6.3 Effect of Plastic and Metal Materials . . . . . . . . . . . . . . . . . . . . . . .70

6.4 Effects of Human Body . . . . . . . . . . . . . . . . . . . . . . . . . . .71

6.5 2D Radiation Pattern Plots . . . . . . . . . . . . . . . . . . . . . . . . . .71

7. Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73

7.1 BGM13S Device Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . .73

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7.2 GPIO Functionality Table . . . . . . . . . . . . . . . . . . . . . . . . . .75

7.3 Alternate Functionality Overview . . . . . . . . . . . . . . . . . . . . . . . 103

7.4 Analog Port (APORT) Client Maps

8. Package Specifications . . . . . . . . . . . . . . . . . . . . . . . . . 1.24

8.1 BGM13S Package Dimensions . . . . . . . . . . . . . . . . . . . . . . 1. 24

8.2 BGM13S Recommeded PCB Land Pattern . . . . . . . . . . . . . . . . . . .127

. . . . . . . . . . . . . . . . . . . . . .115

8.3 BGM13S Package Marking

. . . . . . . . . . . . . . . . . . . . . . . 1.31

9. Tape and Reel Specifications

. . . . . . . . . . . . . . . . . . . . . . . .132

9.1 Tape and Reel Packaging . . . . . . . . . . . . . . . . . . . . . . . . .132

9.2 Reel and Tape Specifications . . . . . . . . . . . . . . . . . . . . . . . . 132

9.3 Orientation and Tape Feed . . . . . . . . . . . . . . . . . . . . . . . . . 133

9.4 Tape and Reel Box Dimensions . . . . . . . . . . . . . . . . . . . . . . .134

9.5 Moisture Sensitivity Level

. . . . . . . . . . . . . . . . . . . . . . . . .134

10. Soldering Recommendations . . . . . . . . . . . . . . . . . . . . . . . . 135

10.1 Soldering Recommendations. . . . . . . . . . . . . . . . . . . . . . . . 135

11. Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136

11.1 Qualified Antenna Types . . . . . . . . . . . . . . . . . . . . . . . . .136

11.2 Bluetooth

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .136

11.3 CE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.36

11.4 FCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137

11.5 ISED Canada . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138

11.6 Japan

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1. 40

11.7 KC South Korea . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140

12. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

System Overview

3. System Overview

3.1 Introduction

The BGM13S product family combines an energy-friendly MCU with a highly integrated radio transceiver and a high performance, ultra

robust antenna. The devices are well suited for any battery operated application, as well as other system where ultra-small size, reliable

high performance RF, low-power consumption and easy application development are key requirements. This section gives a short intro-

duction to the full radio and MCU system.

A detailed block diagram of the BGM13S module is shown in the figure below.

Antenna

Radio Transciever

Port I/O Configuration

Digital Peripherals

IOVDD

DEMOD

IFADC

AGC

Chip

Antenna

RF Frontend

LETIMER

PGA

I

Port A

Drivers

LNA

PAn

TIMER

CRYOTIMER

PCNT

Matching

PA

Frequency

Synthesizer

Q

Port B

Drivers

PBn

PCn

PDn

PFn

MOD

RTC / RTCC

USART

Port

Mapper

Reset

Management

Unit

Port C

Drivers

ARM Cortex-M4 Core

RESETn

LEUART

I2C

Serial Wire

and ETM

Debug /

512 KB ISP Flash

Program Memory

Debug Signals

(shared w/GPIO)

Brown Out /

Power-On

Reset

Port D

Drivers

CRYPTO

CRC

64 KB RAM

Memory Protection Unit

Floating Point Unit

DMA Controller

Programming

A

H

B

A

P

B

Port F

Drivers

LESENSE

Energy Management

IOVDD

1V8

Analog Peripherals

PAVDD / RFVDD / DVDD

bypass

Voltage

Monitor

IDAC

Watchdog

Timer

-

VDAC

+

DC-DC

Converter

VBATT

Voltage

Regulator

Op-Amp

VDD

Internal

Reference

Clock Management

VREGVDD / AVDD

ULFRCO

LFXO

LFXTAL_P

LFXTAL_N

12-bit ADC

Temp

Sense

AUXHFRCO

LFRCO

Internal Crystal

38.4 MHz Crystal

Capacitive

Touch

HFRCO

HFXO

+

-

PLFRCO

Analog Comparator

Figure 3.1. BGM13S Block Diagram

3.2 Radio

The BGM13S features a radio transceiver supporting Bluetooth^®low energy protocol. It features a memory buffer and a low-voltage

circuit that can withstand extremely high data rates.

3.2.1 Antenna Interface

The BGM13S has two antenna solution variants. One of them is a high-performance integrated chip antenna (BGM13SxxFxxxxA) and

the other is a 50 Ohm matched RF pin to attach an external antenna to the module (BGM13SxxFxxxxN).

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

System Overview

Table 3.1. Antenna Efficiency and Peak Gain

Parameter

Efficiency

Peak gain

With optimal layout Note

-1 to -2 dB

1 dBi

Antenna efficiency, gain and radiation pattern are highly depend-

ent on the application PCB layout and mechanical design. Refer

to for PCB layout and antenna integration guidelines for optimal

performance.

3.2.2 RFSENSE

The RFSENSE block generates a system wakeup interrupt upon detection of wideband RF energy at the antenna interface, providing

true RF wakeup capabilities from low energy modes including EM2, EM3 and EM4.

RFSENSE triggers on a relatively strong RF signal and is available in the lowest energy modes, allowing exceptionally low energy con-

sumption. RFSENSE does not demodulate or otherwise qualify the received signal, but software may respond to the wakeup event by

enabling normal RF reception.

Various strategies for optimizing power consumption and system response time in presence of false alarms may be employed using

available timer peripherals.

3.2.3 Packet and State Trace

The BGM13S Frame Controller has a packet and state trace unit that provides valuable information during the development phase. It

features:

• Non-intrusive trace of transmit data, receive data and state information

• Data observability on a single-pin UART data output, or on a two-pin SPI data output

• Configurable data output bitrate / baudrate

• Multiplexed transmitted data, received data and state / meta information in a single serial data stream

3.2.4 Random Number Generator

The Frame Controller (FRC) implements a random number generator that uses entropy gathered from noise in the RF receive chain.

The data is suitable for use in cryptographic applications.

Output from the random number generator can be used either directly or as a seed or entropy source for software-based random num-

ber generator algorithms such as Fortuna.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

System Overview

3.3 Power

The BGM13S has an Energy Management Unit (EMU) and efficient integrated regulators to generate internal supply voltages. Only a

single external supply voltage is required, from which all internal voltages are created. An integrated DC-DC buck regulator is utilized to

further reduce the current consumption. Figure 3.2 Power Supply Configuration for BGM13S22xxx Devices on page 9 and Figure

3.3 Power Supply Configuration for BGM13S32xxx Devices on page 9 show how the external and internal supplies of the module

are connected for different part numbers.

BGM13S22 Module

EFR32BG13 SoC

IOVDD

I/O Interfaces

RF

220nF

RFVDD

PAVDD

DVDD

RF PA

1V8

Digital

10nF

4.7µF

VREGSW

DC-DC

DECOUPLE

4.7µH

2.2µF

VREGVDD

VBATT

4.9µF

AVDD

Analog

Figure 3.2. Power Supply Configuration for BGM13S22xxx Devices

BGM13S32 Module

EFR32BG13 SoC

IOVDD

1V8

I/O Interfaces

RF

220nF

RFVDD

DVDD

Digital

10nF

4.7µF

VREGSW

DC-DC

DECOUPLE

4.7µH

2.2µF

VREGVDD

VBATT

4.9µF

AVDD

Analog

RF PA

PAVDD

Figure 3.3. Power Supply Configuration for BGM13S32xxx Devices

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System Overview

3.3.1 Energy Management Unit (EMU)

The Energy Management Unit manages transitions of energy modes in the device. Each energy mode defines which peripherals and

features are available and the amount of current the device consumes. The EMU can also be used to turn off the power to unused RAM

blocks, and it contains control registers for the dc-dc regulator and the Voltage Monitor (VMON). The VMON is used to monitor multiple

supply voltages. It has multiple channels which can be programmed individually by the user to determine if a sensed supply has fallen

below a chosen threshold.

3.3.2 DC-DC Converter

The DC-DC buck converter covers a wide range of load currents and provides up to 90% efficiency in energy modes EM0, EM1, EM2

and EM3. Patented RF noise mitigation allows operation of the DC-DC converter without degrading sensitivity of radio components.

Protection features include programmable current limiting, short-circuit protection, and dead-time protection. The DC-DC converter may

also enter bypass mode when the input voltage is too low for efficient operation. In bypass mode, the DC-DC input supply is internally

connected directly to its output through a low resistance switch. Bypass mode also supports in-rush current limiting to prevent input

supply voltage droops due to excessive output current transients.

3.3.3 Power Domains

The BGM13S has two peripheral power domains for operation in EM2 and EM3. If all of the peripherals in a peripheral power domain

are configured as unused, the power domain for that group will be powered off in the low-power mode, reducing the overall current

consumption of the device.

Table 3.2. Peripheral Power Subdomains

Peripheral Power Domain 1

Peripheral Power Domain 2

ACMP0

PCNT0

ADC0

ACMP1

CSEN

VDAC0

LEUART0

I2C0

LETIMER0

LESENSE

APORT

-

I2C1

IDAC

3.4 General Purpose Input/Output (GPIO)

BGM13S has up to 32 General Purpose Input/Output pins. Each GPIO pin can be individually configured as either an output or input.

More advanced configurations including open-drain, open-source, and glitch-filtering can be configured for each individual GPIO pin.

The GPIO pins can be overridden by peripheral connections, like SPI communication. Each peripheral connection can be routed to sev-

eral GPIO pins on the device. The input value of a GPIO pin can be routed through the Peripheral Reflex System to other peripherals.

The GPIO subsystem supports asynchronous external pin interrupts.

3.5 Clocking

3.5.1 Clock Management Unit (CMU)

The Clock Management Unit controls oscillators and clocks in the BGM13S. Individual enabling and disabling of clocks to all peripher-

als is performed by the CMU. The CMU also controls enabling and configuration of the oscillators. A high degree of flexibility allows

software to optimize energy consumption in any specific application by minimizing power dissipation in unused peripherals and oscilla-

tors.

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System Overview

3.5.2 Internal Oscillators and Crystal

The BGM13S fully integrates two crystal oscillators, four RC oscillators, and a 38.4 MHz crystal.

• The high-frequency crystal oscillator (HFXO) and integrated 38.4 MHz crystal provide a precise timing reference for the MCU and

radio.

• The low-frequency crystal oscillator (LFXO) provides an accurate timing reference for low energy modes and the real-time-clock cir-

cuits.

• An integrated high frequency RC oscillator (HFRCO) is available for the MCU system, when crystal accuracy is not required. The

HFRCO employs fast startup at minimal energy consumption combined with a wide frequency range.

• An integrated auxilliary high frequency RC oscillator (AUXHFRCO) is available for timing the general-purpose ADC and the Serial

Wire Viewer port with a wide frequency range.

• An integrated low frequency 32.768 kHz RC oscillator (LFRCO) for low power operation where high accuracy is not required.

• An integrated low frequency precision 32.768 kHz RC oscillator (PLFRCO) can be used as a timing reference in low energy modes,

with 500 ppm accuracy.

• An integrated ultra-low frequency 1 kHz RC oscillator (ULFRCO) is available to provide a timing reference at the lowest energy con-

sumption in low energy modes.

3.6 Counters/Timers and PWM

3.6.1 Timer/Counter (TIMER)

TIMER peripherals keep track of timing, count events, generate PWM outputs and trigger timed actions in other peripherals through the

PRS system. The core of each TIMER is a 16-bit counter with up to 4 compare/capture channels. Each channel is configurable in one

of three modes. In capture mode, the counter state is stored in a buffer at a selected input event. In compare mode, the channel output

reflects the comparison of the counter to a programmed threshold value. In PWM mode, the TIMER supports generation of pulse-width

modulation (PWM) outputs of arbitrary waveforms defined by the sequence of values written to the compare registers, with optional

dead-time insertion available in timer unit TIMER_0 only.

3.6.2 Wide Timer/Counter (WTIMER)

WTIMER peripherals function just as TIMER peripherals, but are 32 bits wide. They keep track of timing, count events, generate PWM

outputs and trigger timed actions in other peripherals through the PRS system. The core of each WTIMER is a 32-bit counter with up to

4 compare/capture channels. Each channel is configurable in one of three modes. In capture mode, the counter state is stored in a

buffer at a selected input event. In compare mode, the channel output reflects the comparison of the counter to a programmed thresh-

old value. In PWM mode, the WTIMER supports generation of pulse-width modulation (PWM) outputs of arbitrary waveforms defined by

the sequence of values written to the compare registers, with optional dead-time insertion available in timer unit WTIMER_0 only.

3.6.3 Real Time Counter and Calendar (RTCC)

The Real Time Counter and Calendar (RTCC) is a 32-bit counter providing timekeeping in all energy modes. The RTCC includes a

Binary Coded Decimal (BCD) calendar mode for easy time and date keeping. The RTCC can be clocked by any of the on-board oscilla-

tors with the exception of the AUXHFRCO, and it is capable of providing system wake-up at user defined instances. When receiving

frames, the RTCC value can be used for timestamping. The RTCC includes 128 bytes of general purpose data retention, allowing easy

and convenient data storage in all energy modes down to EM4H.

A secondary RTC is used by the RF protocol stack for event scheduling, leaving the primary RTCC block available exclusively for appli-

cation software.

3.6.4 Low Energy Timer (LETIMER)

The unique LETIMER is a 16-bit timer that is available in energy mode EM2 Deep Sleep in addition to EM1 Sleep and EM0 Active. This

allows it to be used for timing and output generation when most of the device is powered down, allowing simple tasks to be performed

while the power consumption of the system is kept at an absolute minimum. The LETIMER can be used to output a variety of wave-

forms with minimal software intervention. The LETIMER is connected to the Real Time Counter and Calendar (RTCC), and can be con-

figured to start counting on compare matches from the RTCC.

3.6.5 Ultra Low Power Wake-up Timer (CRYOTIMER)

The CRYOTIMER is a 32-bit counter that is capable of running in all energy modes. It can be clocked by either the 32.768 kHz crystal

oscillator (LFXO), the 32.768 kHz RC oscillator (LFRCO), or the 1 kHz RC oscillator (ULFRCO). It can provide periodic Wakeup events

and PRS signals which can be used to wake up peripherals from any energy mode. The CRYOTIMER provides a wide range of inter-

rupt periods, facilitating flexible ultra-low energy operation.

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System Overview

3.6.6 Pulse Counter (PCNT)

The Pulse Counter (PCNT) peripheral can be used for counting pulses on a single input or to decode quadrature encoded inputs. The

clock for PCNT is selectable from either an external source on pin PCTNn_S0IN or from an internal timing reference, selectable from

among any of the internal oscillators, except the AUXHFRCO. The peripheral may operate in energy mode EM0 Active, EM1 Sleep,

EM2 Deep Sleep, and EM3 Stop.

3.6.7 Watchdog Timer (WDOG)

The watchdog timer can act both as an independent watchdog or as a watchdog synchronous with the CPU clock. It has windowed

monitoring capabilities, and can generate a reset or different interrupts depending on the failure mode of the system. The watchdog can

also monitor autonomous systems driven by PRS.

3.7 Communications and Other Digital Peripherals

3.7.1 Universal Synchronous/Asynchronous Receiver/Transmitter (USART)

The Universal Synchronous/Asynchronous Receiver/Transmitter is a flexible serial I/O interface. It supports full duplex asynchronous

UART communication with hardware flow control as well as RS-485, SPI, MicroWire and 3-wire. It can also interface with devices sup-

porting:

• ISO7816 SmartCards

• IrDA

I²S

•

3.7.2 Low Energy Universal Asynchronous Receiver/Transmitter (LEUART)

The unique LEUART^TMprovides two-way UART communication on a strict power budget. Only a 32.768 kHz clock is needed to allow

UART communication up to 9600 baud. The LEUART includes all necessary hardware to make asynchronous serial communication

possible with a minimum of software intervention and energy consumption.

3.7.3 Inter-Integrated Circuit Interface (I²C)

The I²C interface enables communication between the MCU and a serial I²C bus. It is capable of acting as both a master and a slave

and supports multi-master buses. Standard-mode, fast-mode and fast-mode plus speeds are supported, allowing transmission rates

from 10 kbit/s up to 1 Mbit/s. Slave arbitration and timeouts are also available, allowing implementation of an SMBus-compliant system.

The interface provided to software by the I²C peripheral allows precise timing control of the transmission process and highly automated

transfers. Automatic recognition of slave addresses is provided in active and low energy modes.

3.7.4 Peripheral Reflex System (PRS)

The Peripheral Reflex System provides a communication network between different peripherals without software involvement. Peripher-

als producing Reflex signals are called producers. The PRS routes Reflex signals from producers to consumer peripherals, which in

turn perform actions in response. Edge triggers and other functionality such as simple logic operations (AND, OR, NOT) can be applied

by the PRS to the signals. The PRS allows peripheral to act autonomously without waking the MCU core, saving power.

3.7.5 Low Energy Sensor Interface (LESENSE)

The Low Energy Sensor Interface LESENSE^TMis a highly configurable sensor interface with support for up to 16 individually configura-

ble sensors. By controlling the analog comparators, ADC, and DAC, LESENSE is capable of supporting a wide range of sensors and

measurement schemes, and can for instance measure LC sensors, resistive sensors and capacitive sensors. LESENSE also includes a

programmable finite state machine which enables simple processing of measurement results without CPU intervention. LESENSE is

available in energy mode EM2, in addition to EM0 and EM1, making it ideal for sensor monitoring in applications with a strict energy

budget.

3.8 Security Features

3.8.1 General Purpose Cyclic Redundancy Check (GPCRC)

The GPCRC block implements a Cyclic Redundancy Check (CRC) function. It supports both 32-bit and 16-bit polynomials. The suppor-

ted 32-bit polynomial is 0x04C11DB7 (IEEE 802.3), while the 16-bit polynomial can be programmed to any value, depending on the

needs of the application.

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System Overview

3.8.2 Crypto Accelerator (CRYPTO)

The Crypto Accelerator is a fast and energy-efficient autonomous hardware encryption and decryption accelerator. EFR32 devices sup-

port AES encryption and decryption with 128- or 256-bit keys, ECC over both GF(P) and GF(2^m), SHA-1 and SHA-2 (SHA-224 and

SHA-256).

Supported block cipher modes of operation for AES include: ECB, CTR, CBC, PCBC, CFB, OFB, GCM, CBC-MAC, GMAC and CCM.

Supported ECC NIST recommended curves include P-192, P-224, P-256, K-163, K-233, B-163 and B-233.

The CRYPTO1 block is tightly linked to the Radio Buffer Controller (BUFC) enabling fast and efficient autonomous cipher operations on

data buffer content. It allows fast processing of GCM (AES), ECC and SHA with little CPU intervention.

CRYPTO also provides trigger signals for DMA read and write operations.

3.8.3 True Random Number Generator (TRNG)

The TRNG is a non-deterministic random number generator based on a full hardware solution. The TRNG is validated with NIST800-22

and AIS-31 test suites as well as being suitable for FIPS 140-2 certification (for the purposes of cryptographic key generation).

3.8.4 Security Management Unit (SMU)

The Security Management Unit (SMU) allows software to set up fine-grained security for peripheral access, which is not possible in the

Memory Protection Unit (MPU). Peripherals may be secured by hardware on an individual basis, such that only priveleged accesses to

the peripheral's register interface will be allowed. When an access fault occurs, the SMU reports the specific peripheral involved and

can optionally generate an interrupt.

3.9 Analog

3.9.1 Analog Port (APORT)

The Analog Port (APORT) is an analog interconnect matrix allowing access to many analog peripherals on a flexible selection of pins.

Each APORT bus consists of analog switches connected to a common wire. Since many clients can operate differentially, buses are

grouped by X/Y pairs.

3.9.2 Analog Comparator (ACMP)

The Analog Comparator is used to compare the voltage of two analog inputs, with a digital output indicating which input voltage is high-

er. Inputs are selected from among internal references and external pins. The tradeoff between response time and current consumption

is configurable by software. Two 6-bit reference dividers allow for a wide range of internally-programmable reference sources. The

ACMP can also be used to monitor the supply voltage. An interrupt can be generated when the supply falls below or rises above the

programmable threshold.

3.9.3 Analog to Digital Converter (ADC)

The ADC is a Successive Approximation Register (SAR) architecture, with a resolution of up to 12 bits at up to 1 Msps. The output

sample resolution is configurable and additional resolution is possible using integrated hardware for averaging over multiple samples.

The ADC includes integrated voltage references and an integrated temperature sensor. Inputs are selectable from a wide range of

sources, including pins configurable as either single-ended or differential.

3.9.4 Capacitive Sense (CSEN)

The CSEN peripheral is a dedicated Capacitive Sensing block for implementing touch-sensitive user interface elements such a

switches and sliders. The CSEN peripheral uses a charge ramping measurement technique, which provides robust sensing even in

adverse conditions including radiated noise and moisture. The peripheral can be configured to take measurements on a single port pin

or scan through multiple pins and store results to memory through DMA. Several channels can also be shorted together to measure the

combined capacitance or implement wake-on-touch from very low energy modes. Hardware includes a digital accumulator and an aver-

aging filter, as well as digital threshold comparators to reduce software overhead.

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3.9.5 Digital to Analog Current Converter (IDAC)

The IDAC can source or sink a configurable constant current. This current can be driven on an output pin or routed to the selected ADC

input pin for capacitive sensing. The full-scale current is programmable between 0.05 µA and 64 µA with several ranges consisting of

various step sizes.

3.9.6 Digital to Analog Converter (VDAC)

The Digital to Analog Converter (VDAC) can convert a digital value to an analog output voltage. The VDAC is a fully differential, 500

ksps, 12-bit converter. The opamps are used in conjunction with the VDAC, to provide output buffering. One opamp is used per single-

ended channel, or two opamps are used to provide differential outputs. The VDAC may be used for a number of different applications

such as sensor interfaces or sound output. The VDAC can generate high-resolution analog signals while the MCU is operating at low

frequencies and with low total power consumption. Using DMA and a timer, the VDAC can be used to generate waveforms without any

CPU intervention. The VDAC is available in all energy modes down to and including EM3.

3.9.7 Operational Amplifiers

The opamps are low power amplifiers with a high degree of flexibility targeting a wide variety of standard opamp application areas, and

are available down to EM3. With flexible built-in programming for gain and interconnection they can be configured to support multiple

common opamp functions. All pins are also available externally for filter configurations. Each opamp has a rail to rail input and a rail to

rail output. They can be used in conjunction with the VDAC peripheral or in stand-alone configurations. The opamps save energy, PCB

space, and cost as compared with standalone opamps because they are integrated on-chip.

3.10 Reset Management Unit (RMU)

The RMU is responsible for handling reset of the BGM13S. A wide range of reset sources are available, including several power supply

monitors, pin reset, software controlled reset, core lockup reset, and watchdog reset.

3.11 Core and Memory

3.11.1 Processor Core

The ARM Cortex-M processor includes a 32-bit RISC processor integrating the following features and tasks in the system:

• ARM Cortex-M4 RISC processor achieving 1.25 Dhrystone MIPS/MHz

• Memory Protection Unit (MPU) supporting up to 8 memory segments

• Up to 512 kB flash program memory

• Up to 64 kB RAM data memory

• Configuration and event handling of all peripherals

• 2-pin Serial-Wire debug interface

3.11.2 Memory System Controller (MSC)

The Memory System Controller (MSC) is the program memory unit of the microcontroller. The flash memory is readable and writable

from both the Cortex-M and DMA. The flash memory is divided into two blocks; the main block and the information block. Program code

is normally written to the main block, whereas the information block is available for special user data and flash lock bits. There is also a

read-only page in the information block containing system and device calibration data. Read and write operations are supported in en-

ergy modes EM0 Active and EM1 Sleep.

3.11.3 Linked Direct Memory Access Controller (LDMA)

The Linked Direct Memory Access (LDMA) controller allows the system to perform memory operations independently of software. This

reduces both energy consumption and software workload. The LDMA allows operations to be linked together and staged, enabling so-

phisticated operations to be implemented.

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3.12 Memory Map

The BGM13S memory map is shown in the figures below. RAM and flash sizes are for the largest memory configuration.

Figure 3.4. BGM13S Memory Map — Core Peripherals and Code Space

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Figure 3.5. BGM13S Memory Map — Peripherals

3.13 Configuration Summary

Many peripherals on the BGM13S are available in multiple instances. However, certain USART, TIMER and WTIMER instances imple-

ment only a subset of the full features for that peripheral type. The table below describes the specific features available on these periph-

eral instances. All remaining peripherals support full configuration.

Table 3.3. Configuration Summary

Peripheral

USART0

USART1

Configuration

Pin Connections

IrDA SmartCard

US0_TX, US0_RX, US0_CLK, US0_CS

US1_TX, US1_RX, US1_CLK, US1_CS

IrDA I²S SmartCard

IrDA SmartCard

with DTI

USART2

TIMER0

TIMER1

WTIMER0

US2_TX, US2_RX, US2_CLK, US2_CS

TIM0_CC[2:0], TIM0_CDTI[2:0]

TIM1_CC[3:0]

-

with DTI

WTIM0_CC[2:0], WTIM0_CDTI[2:0]

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Electrical Specifications

4. Electrical Specifications

4.1 Electrical Characteristics

All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:

• Typical values are based on T_AMB=25 °C and V_DD= 3.3 V, by production test and/or technology characterization.

• Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output pow-

er-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna.

• Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature,

unless stated otherwise.

The BGM13S module is powered primarily from the VBATT supply pin. GPIO are powered from the IOVDD supply pin. There are also

several internal supply rails mentioned in the electrical specifications, whose connections vary based on transmit power configuration.

Refer to 3.3 Power for the relationship between the module's external supply pins and the internal voltage supply rails.

Refer to Table 4.2 General Operating Conditions on page 19 for more details about operational supply and temperature limits.

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Electrical Specifications

4.1.1 Absolute Maximum Ratings

Stress levels beyond those listed below may cause permanent damage to the device. This is a stress rating only and functional opera-

tion of the devices at those or any other conditions beyond those indicated in the operation listings of this specification is not implied.

Exposure to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality

and reliability data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx.

Table 4.1. Absolute Maximum Ratings

Parameter

Symbol

T_STG

Test Condition

Min

-40

-0.3

—

Typ

—

Max

85

Unit

°C

Storage temperature range

Voltage on any supply pin

V_DDMAX

V_DDRAMPMAX

—

3.8

1

V

Voltage ramp rate on any

supply pin

—

V / µs

5V tolerant GPIO pins^{1 2 3}

Standard GPIO pins

DC voltage on any GPIO pin V_DIGPIN

-0.3

—

Min of 5.25

and IOVDD

+2

V

-0.3

—

IOVDD+0.3

V

Maximum RF level at input

P_RFMAX2G4

10

dBm

mA

Total current into supply pins I_VDDMAX

Source

Sink

—

200

Total current into VSS

ground lines

I_VSSMAX

—

Current per I/O pin

I_IOMAX

Sink

—

50

mA

°C

Source

Sink

Current for all I/O pins

I_IOALLMAX

—

200

105

Source

—

Junction temperature

T_J

-40

Note:

1. When a GPIO pin is routed to the analog block through the APORT, the maximum voltage = IOVDD.

2. Valid for IOVDD in valid operating range or when IOVDD is undriven (high-Z). If IOVDD is connected to a low-impedance source

below the valid operating range (e.g. IOVDD shorted to VSS), the pin voltage maximum is IOVDD + 0.3 V, to avoid exceeding the

maximum IO current specifications.

3. To operate above the IOVDD supply rail, over-voltage tolerance must be enabled according to the GPIO_Px_OVTDIS register.

Pins with over-voltage tolerance disabled have the same limits as Standard GPIO.

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Electrical Specifications

4.1.2 Operating Conditions

The following subsections define the operating conditions for the module.

4.1.2.1 General Operating Conditions

Table 4.2. General Operating Conditions

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Operating ambient tempera- T_A

ture range

-G temperature grade

-40

25

85

°C

VBATT operating supply

voltage¹

V_VBATT

DCDC in regulation

2.4

1.8

—

3.3

—

3.8

V

DCDC in bypass 50mA load

DCDC in bypass, T ≤ 85 °C

VBATT current

I_VBATT

200

mA

V

IOVDD operating supply volt- V_IOVDD

age

1.62

—

V_VBATT

HFCORECLK frequency

HFCLK frequency

Note:

f_CORE

VSCALE2, MODE = WS1

VSCALE0, MODE = WS2

VSCALE2

—

40

20

40

20

MHz

f_HFCLK

VSCALE0

1. The minimum voltage required in bypass mode is calculated using R_BYPfrom the DCDC specification table. Requirements for

other loads can be calculated as V_{VBATT_min}+I_LOAD* R_{BYP_max}

.

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Electrical Specifications

4.1.3 DC-DC Converter

Test conditions: V_DCDC_I=3.3 V, V_DCDC_O=1.8 V, I_DCDC_LOAD=50 mA, Heavy Drive configuration, F_DCDC_LN=7 MHz, un-

less otherwise indicated.

Table 4.3. DC-DC Converter

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Input voltage range

V_{DCDC_I}

Bypass mode, I_{DCDC_LOAD}= 50

mA

1.8

—

V_{VREGVDD_}

V

MAX

Low noise (LN) mode, 1.8 V out-

put, I_{DCDC_LOAD}= 100 mA, or

Low power (LP) mode, 1.8 V out-

put, I_{DCDC_LOAD}= 10 mA

2.4

—

V_{VREGVDD_}

V

MAX

Output voltage programma- V_{DCDC_O}

ble range¹

1.8

—

V_VREGVDD

V

Regulation DC accuracy

ACC_DC

Low Noise (LN) mode, 1.8 V tar-

get output

1.7

—

1.9

2.2

V

Regulation window²

WIN_REG

Low Power (LP) mode,

LPCMPBIASEMxx³= 0, 1.8 V tar-

get output, I_{DCDC_LOAD}≤ 75 µA

1.63

Low Power (LP) mode,

1.63

—

2.1

V

LPCMPBIASEMxx³= 3, 1.8 V tar-

get output, I_{DCDC_LOAD}≤ 10 mA

Steady-state output ripple

V_R

Radio disabled

—

3

—

mVpp

mV

CCM Mode (LNFORCECCM³=

1), Load changes between 0 mA

and 100 mA

Output voltage under/over-

shoot

V_OV

25

60

DCM Mode (LNFORCECCM³=

0), Load changes between 0 mA

and 10 mA

—

45

90

mV

Overshoot during LP to LN

CCM/DCM mode transitions com-

pared to DC level in LN mode

—

200

40

—

mV

Undershoot during BYP/LP to LN

CCM (LNFORCECCM³= 1) mode

transitions compared to DC level

in LN mode

Undershoot during BYP/LP to LN

—

100

—

mV

DCM (LNFORCECCM³= 0) mode

transitions compared to DC level

in LN mode

DC line regulation

DC load regulation

V_REG

Input changes between

V_{VREGVDD_MAX}and 2.4 V

—

0.1

—

%

I_REG

Load changes between 0 mA and

100 mA in CCM mode

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Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Max load current

I_{LOAD_MAX}

Low noise (LN) mode, Medium or

Heavy Drive⁴

—

80

mA

Low noise (LN) mode, Light

Drive⁴

—

50

75

10

mA

µA

Low power (LP) mode,

LPCMPBIASEMxx³= 0

Low power (LP) mode,

LPCMPBIASEMxx³= 3

mA

Note:

1. Due to internal dropout, the DC-DC output will never be able to reach its input voltage, V_VREGVDD

.

2. LP mode controller is a hysteretic controller that maintains the output voltage within the specified limits.

3. LPCMPBIASEMxx refers to either LPCMPBIASEM234H in the EMU_DCDCMISCCTRL register or LPCMPBIASEM01 in the

EMU_DCDCLOEM01CFG register, depending on the energy mode.

4. Drive levels are defined by configuration of the PFETCNT and NFETCNT registers. Light Drive: PFETCNT=NFETCNT=3; Medi-

um Drive: PFETCNT=NFETCNT=7; Heavy Drive: PFETCNT=NFETCNT=15.

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Electrical Specifications

4.1.4 Current Consumption

4.1.4.1 Current Consumption 3.3 V using DC-DC Converter

Unless otherwise indicated, typical conditions are: VBATT = 3.3 V. T = 25 °C. Minimum and maximum values in this table represent the

worst conditions across process variation at T = 25 °C.

Table 4.4. Current Consumption 3.3 V using DC-DC Converter

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Current consumption in EM0 I_{ACTIVE_DCM}

mode with all peripherals dis-

abled, DCDC in Low Noise

DCM mode¹

38.4 MHz crystal, CPU running

while loop from flash²

—

87

—

µA/MHz

38 MHz HFRCO, CPU running

Prime from flash

—

69

70

—

µA/MHz

38 MHz HFRCO, CPU running

while loop from flash

38 MHz HFRCO, CPU running

CoreMark from flash

82

26 MHz HFRCO, CPU running

while loop from flash

76

1 MHz HFRCO, CPU running

while loop from flash

615

97

Current consumption in EM0 I_{ACTIVE_CCM}

mode with all peripherals dis-

abled, DCDC in Low Noise

CCM mode³

38.4 MHz crystal, CPU running

while loop from flash²

38 MHz HFRCO, CPU running

Prime from flash

—

80

81

—

µA/MHz

38 MHz HFRCO, CPU running

while loop from flash

38 MHz HFRCO, CPU running

CoreMark from flash

92

26 MHz HFRCO, CPU running

while loop from flash

94

1 MHz HFRCO, CPU running

while loop from flash

1145

101

1124

Current consumption in EM0 I_{ACTIVE_CCM_VS}19 MHz HFRCO, CPU running

mode with all peripherals dis-

abled and voltage scaling

enabled, DCDC in Low

Noise CCM mode³

while loop from flash

1 MHz HFRCO, CPU running

while loop from flash

38.4 MHz crystal²

38 MHz HFRCO

26 MHz HFRCO

1 MHz HFRCO

19 MHz HFRCO

1 MHz HFRCO

Current consumption in EM1 I_{EM1_DCM}

mode with all peripherals dis-

abled, DCDC in Low Noise

—

56

—

µA/MHz

—

39

46

—

µA/MHz

DCM mode¹

588

50

Current consumption in EM1 I_{EM1_DCM_VS}

mode with all peripherals dis-

abled and voltage scaling

572

enabled, DCDC in Low

Noise DCM mode¹

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Current consumption in EM2 I_{EM2_VS}

mode, with voltage scaling

enabled, DCDC in LP mode⁴

Full 64 kB RAM retention and

RTCC running from LFXO

—

1.4

—

µA

Full 64 kB RAM retention and

RTCC running from LFRCO

—

1.5

2.0

1.9

1.3

—

µA

Full 64 kB RAM retention and

PRORTCC running from PLFRCO

1 bank RAM retention and

PRORTCC running from PLFRCO

1 bank RAM retention and RTCC

running from LFRCO⁵

Current consumption in EM3 I_{EM3_VS}

mode, with voltage scaling

enabled

Full 64 kB RAM retention and

CRYOTIMER running from ULFR-

CO

—

1.14

—

µA

Current consumption in

EM4H mode, with voltage

scaling enabled

I_{EM4H_VS}

128 byte RAM retention, RTCC

running from LFXO

—

0.75

0.44

—

µA

128 byte RAM retention, CRYO-

TIMER running from ULFRCO

128 byte RAM retention, no RTCC

No RAM retention, no RTCC

—

0.42

0.07

—

µA

Current consumption in

EM4S mode

I_EM4S

Note:

1. DCDC Low Noise DCM Mode = Light Drive (PFETCNT=NFETCNT=3), F=3.0 MHz (RCOBAND=0), ANASW=DVDD.

2. CMU_HFXOCTRL_LOWPOWER=0.

3. DCDC Low Noise CCM Mode = Light Drive (PFETCNT=NFETCNT=3), F=6.4 MHz (RCOBAND=4), ANASW=DVDD.

4. DCDC Low Power Mode = Medium Drive, LPOSCDIV=1, LPCMPBIASEM234H=0, LPCLIMILIMSEL=1, ANASW=DVDD.

5. CMU_LFRCOCTRL_ENVREF = 1, CMU_LFRCOCTRL_VREFUPDATE = 1

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

4.1.4.2 Current Consumption 1.8 V (DC-DC Converter in Bypass Mode)

Unless otherwise indicated, typical conditions are: VBATT = 1.8 V. T = 25 °C. Minimum and maximum values in this table represent the

worst conditions across process variation at T = 25 °C.

Table 4.5. Current Consumption 1.8 V (DC-DC Converter in Bypass Mode)

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Current consumption in EM0 I_ACTIVE

mode with all peripherals dis-

abled

38.4 MHz crystal, CPU running

while loop from flash¹

—

128

—

µA/MHz

38 MHz HFRCO, CPU running

Prime from flash

—

97

98

—

µA/MHz

38 MHz HFRCO, CPU running

while loop from flash

38 MHz HFRCO, CPU running

CoreMark from flash

119

100

243

86

26 MHz HFRCO, CPU running

while loop from flash

1 MHz HFRCO, CPU running

while loop from flash

Current consumption in EM0 I_{ACTIVE_VS}

mode with all peripherals dis-

abled and voltage scaling

enabled

19 MHz HFRCO, CPU running

while loop from flash

1 MHz HFRCO, CPU running

while loop from flash

206

76

38.4 MHz crystal¹

38 MHz HFRCO

26 MHz HFRCO

1 MHz HFRCO

19 MHz HFRCO

1 MHz HFRCO

Current consumption in EM1 I_EM1

mode with all peripherals dis-

abled

—

47

48

—

µA/MHz

191

43

Current consumption in EM1 I_{EM1_VS}

mode with all peripherals dis-

abled and voltage scaling

enabled

163

Current consumption in EM2 I_{EM2_VS}

mode, with voltage scaling

enabled

Full 64 kB RAM retention and

RTCC running from LFXO

—

1.8

2.0

2.7

2.5

1.6

—

µA

Full 64 kB RAM retention and

RTCC running from LFRCO

Full 64 kB RAM retention and

PRORTCC running from PLFRCO

1 bank (16 kB) RAM retention and

PRORTCC running from PLFRCO

1 bank (16 kB) RAM retention and

RTCC running from LFRCO²

Current consumption in EM3 I_{EM3_VS}

mode, with voltage scaling

enabled

Full 64 kB RAM retention and

CRYOTIMER running from ULFR-

CO

—

1.43

—

µA

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Current consumption in

EM4H mode, with voltage

scaling enabled

I_{EM4H_VS}

128 byte RAM retention, RTCC

running from LFXO

—

0.83

—

µA

128 byte RAM retention, CRYO-

TIMER running from ULFRCO

—

0.37

—

µA

128 byte RAM retention, no RTCC

no RAM retention, no RTCC

—

0.36

0.05

—

µA

Current consumption in

EM4S mode

I_EM4S

Note:

1. CMU_HFXOCTRL_LOWPOWER=0.

2. CMU_LFRCOCTRL_ENVREF = 1, CMU_LFRCOCTRL_VREFUPDATE = 1

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

4.1.4.3 Current Consumption 3.3 V (DC-DC Converter in Bypass Mode)

Unless otherwise indicated, typical conditions are: VBATT = 3.3 V. T = 25 °C. Minimum and maximum values in this table represent the

worst conditions across process variation at T = 25 °C.

Table 4.6. Current Consumption 3.3 V (DC-DC Converter in Bypass Mode)

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Current consumption in EM0 I_ACTIVE

mode with all peripherals dis-

abled

38.4 MHz crystal, CPU running

while loop from flash¹

—

128

—

µA/MHz

38 MHz HFRCO, CPU running

Prime from flash

—

97

98

—

107

—

µA/MHz

38 MHz HFRCO, CPU running

while loop from flash

38 MHz HFRCO, CPU running

CoreMark from flash

119

100

246

86

26 MHz HFRCO, CPU running

while loop from flash

109

430

—

1 MHz HFRCO, CPU running

while loop from flash

Current consumption in EM0 I_{ACTIVE_VS}

mode with all peripherals dis-

abled and voltage scaling

enabled

19 MHz HFRCO, CPU running

while loop from flash

1 MHz HFRCO, CPU running

while loop from flash

209

76

—

38.4 MHz crystal¹

38 MHz HFRCO

26 MHz HFRCO

1 MHz HFRCO

19 MHz HFRCO

1 MHz HFRCO

Current consumption in EM1 I_EM1

mode with all peripherals dis-

abled

—

47

49

51

55

µA/MHz

195

43

374

—

Current consumption in EM1 I_{EM1_VS}

mode with all peripherals dis-

abled and voltage scaling

enabled

167

—

Current consumption in EM2 I_{EM2_VS}

mode, with voltage scaling

enabled

Full 64 kB RAM retention and

RTCC running from LFXO

—

1.9

2.2

2.6

2.8

1.9

—

µA

Full 64 kB RAM retention and

RTCC running from LFRCO

1 bank (16 kB) RAM retention and

PRORTCC running from PLFRCO

—

Full 64 kB RAM retention and

PRORTCC running from PLFRCO

—

1 bank (16 kB) RAM retention and

RTCC running from LFRCO²

3.3

Current consumption in EM3 I_{EM3_VS}

mode, with voltage scaling

enabled

Full 64 kB RAM retention and

CRYOTIMER running from ULFR-

CO

—

1.53

3.0

µA

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Current consumption in

EM4H mode, with voltage

scaling enabled

I_{EM4H_VS}

128 byte RAM retention, RTCC

running from LFXO

—

0.93

—

µA

128 byte RAM retention, CRYO-

TIMER running from ULFRCO

—

0.45

—

µA

128 byte RAM retention, no RTCC

No RAM retention, no RTCC

—

0.44

0.04

0.9

µA

Current consumption in

EM4S mode

I_EM4S

0.18

Note:

1. CMU_HFXOCTRL_LOWPOWER=0.

2. CMU_LFRCOCTRL_ENVREF = 1, CMU_LFRCOCTRL_VREFUPDATE = 1

4.1.4.4 Current Consumption Using Radio

Unless otherwise indicated, typical conditions are: VBATT = 3.3 V. T = 25 °C. DC-DC on. Minimum and maximum values in this table

represent the worst conditions across process variation at T = 25 °C.

Table 4.7. Current Consumption Using Radio

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Current consumption in re-

ceive mode, active packet

reception (MCU in EM1 @

38.4 MHz, peripheral clocks

disabled), T ≤ 85 °C

I_{RX_ACTIVE}

125 kbit/s, 2GFSK, F = 2.4 GHz,

Radio clock prescaled by 4

—

9.4

—

mA

500 kbit/s, 2GFSK, F = 2.4 GHz,

Radio clock prescaled by 4

—

9.4

9.7

—

mA

1 Mbit/s, 2GFSK, F = 2.4 GHz,

Radio clock prescaled by 4

2 Mbit/s, 2GFSK, F = 2.4 GHz,

Radio clock prescaled by 4

10.5

10.4

10.7

11.5

8.9

Current consumption in re-

ceive mode, listening for

packet (MCU in EM1 @ 38.4

MHz, peripheral clocks disa-

bled), T ≤ 85 °C

I_{RX_LISTEN}

125 kbit/s, 2GFSK, F = 2.4 GHz,

No radio clock prescaling

500 kbit/s, 2GFSK, F = 2.4 GHz,

No radio clock prescaling

1 Mbit/s, 2GFSK, F = 2.4 GHz, No

radio clock prescaling

2 Mbit/s, 2GFSK, F = 2.4 GHz, No

radio clock prescaling

Current consumption in

transmit mode (MCU in EM1

@ 38.4 MHz, peripheral

clocks disabled), T ≤ 85 °C

I_TX

F = 2.4 GHz, CW, 0 dBm output

power, Radio clock prescaled by 3

F = 2.4 GHz, CW, 0 dBm output

power, Radio clock prescaled by 1

9.7

F = 2.4 GHz, CW, 8 dBm output

power

27.4

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

4.1.5 Wake Up Times

Table 4.8. Wake Up Times

Test Condition

Parameter

Symbol

Min

Typ

Max

Unit

Wake up time from EM1

t_{EM1_WU}

—

3

—

AHB

Clocks

Wake up from EM2

Wake up from EM3

t_{EM2_WU}

Code execution from flash

Code execution from RAM

Code execution from flash

Code execution from RAM

Executing from flash

—

10.9

3.8

—

µs

t_{EM3_WU}

10.9

3.8

Wake up from EM4H¹

Wake up from EM4S¹

t_{EM4H_WU}

t_{EM4S_WU}

t_RESET

90

Executing from flash

—

300

—

µs

Time from release of reset

source to first instruction ex-

ecution

Soft Pin Reset released

Any other reset released

—

51

—

µs

358

Power mode scaling time

t_SCALE

VSCALE0 to VSCALE2, HFCLK =

19 MHz^{2 3}

—

31.8

4.3

—

µs

VSCALE2 to VSCALE0, HFCLK =

19 MHz⁴

Note:

1. Time from wake up request until first instruction is executed. Wakeup results in device reset.

2. Scaling up from VSCALE0 to VSCALE2 requires approximately 30.3 µs + 28 HFCLKs.

3. VSCALE0 to VSCALE2 voltage change transitions occur at a rate of 10 mV/µs for approximately 20 µs. During this transition,

peak currents will be dependent on the value of the DECOUPLE output capacitor, from 35 mA (with a 1 µF capacitor) to 70 mA

(with a 2.7 µF capacitor).

4. Scaling down from VSCALE2 to VSCALE0 requires approximately 2.8 µs + 29 HFCLKs.

4.1.6 Brown Out Detector (BOD)

Table 4.9. Brown Out Detector (BOD)

Parameter

Symbol

Test Condition

Min

—

Typ

—

Max

1.8

—

Unit

V

AVDD BOD threshold

V_AVDDBOD

AVDD rising

AVDD falling (EM0/EM1)

AVDD falling (EM2/EM3)

1.62

1.53

—

V

—

V

AVDD BOD hysteresis

AVDD BOD response time

EM4 BOD threshold

V_{AVDDBOD_HYST}

20

2.4

—

mV

µs

V

t_{AVDDBOD_DELAY}Supply drops at 0.1V/µs rate

—

V_EM4DBOD

AVDD rising

AVDD falling

—

1.7

—

1.45

—

V

EM4 BOD hysteresis

V_{EM4BOD_HYST}

25

300

—

mV

µs

EM4 BOD response time

t_{EM4BOD_DELAY}Supply drops at 0.1V/µs rate

—

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

4.1.7 Frequency Synthesizer

Table 4.10. Frequency Synthesizer

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

RF synthesizer frequency

range

f_RANGE

2400 - 2483.5 MHz

2400

—

2483.5

MHz

LO tuning frequency resolu- f_RES

tion with 38.4 MHz crystal

2400 - 2483.5 MHz

—

73

Hz

Frequency deviation resolu- df_RES

tion with 38.4 MHz crystal

Maximum frequency devia-

tion with 38.4 MHz crystal

df_MAX

1677

kHz

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

4.1.8 2.4 GHz RF Transceiver Characteristics

4.1.8.1 RF Transmitter General Characteristics for 2.4 GHz Band

Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center

frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.

Table 4.11. RF Transmitter General Characteristics for 2.4 GHz Band

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Maximum TX power¹

POUT_MAX

19 dBm-rated part numbers.

PAVDD connected directly to ex-

ternal 3.3V supply

—

18.9

—

dBm

8 dBm-rated part numbers

CW

—

7.8

-30

1

—

dBm

dB

Minimum active TX Power

Output power step size

POUT_MIN

POUT_STEP

-5 dBm< Output power < 0 dBm

—

0 dBm < output power <

POUT_MAX

0.5

dB

Output power variation vs

supply at POUT_MAX

POUT_{VAR_V}

1.8 V < V_VREGVDD< 3.3 V,

PAVDD connected directly to ex-

ternal supply, for output power >

10 dBm.

—

4.5

—

dB

1.8 V < V_VREGVDD< 3.3 V using

DC-DC converter

—

2.1

1.7

0.3

—

dB

Output power variation vs

temperature at POUT_MAX

POUT_{VAR_T}

From -40 to +85 °C, PAVDD con-

nected to DC-DC output

From -40 to +85 °C, PAVDD con-

nected to external supply

Output power variation vs RF POUT_{VAR_F}

frequency at POUT_MAX

Over RF tuning frequency range,

PAVDD connected to external

supply

RF tuning frequency range

F_RANGE

2400

—

2483.5

MHz

Note:

1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov-

ered in this datasheet can be found in the Max TX Power column of the Ordering Information Table.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

4.1.8.2 RF Receiver General Characteristics for 2.4 GHz Band

Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center

frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.

Table 4.12. RF Receiver General Characteristics for 2.4 GHz Band

Parameter

Symbol

F_RANGE

SPUR_RX

Test Condition

Min

2400

—

Typ

—

Max

2483.5

—

Unit

MHz

dBm

RF tuning frequency range

Receive mode maximum

spurious emission

30 MHz to 1 GHz

1 GHz to 12 GHz

-57

—

-47

—

Max spurious emissions dur- SPUR_{RX_FCC}

ing active receive mode, per

FCC Part 15.109(a)

216 MHz to 960 MHz, Conducted

Measurement

—

-55.2

—

Above 960 MHz, Conducted

Measurement

—

-47.2

-24

—

dBm

Level above which

RFSENSE will trigger¹

RFSENSE_TRIG

CW at 2.45 GHz

Level below which

RFSENSE will not trigger¹

RFSENSE_THRESCW at 2.45 GHz

—

-50

—

dBm

Note:

1. RFSENSE performance is only valid from 0 to 85 °C. RFSENSE should be disabled outside this temperature range.

4.1.8.3 RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 125 kbps Data Rate

Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center

frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.

Table 4.13. RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 125 kbps Data Rate

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Power spectral density limit

PSD_LIMIT

Per FCC part 15.247 at 10 dBm

—

8

dBm/

3kHz

Per FCC part 15.247 at 20 dBm¹

—

8

dBm/

3kHz

Spurious emissions out-of-

band, excluding harmonics

captured in SPUR_HARM,FCC

Emissions taken at

SPUR_{OOB_FCC}

Per FCC part 15.205/15.209,

Above 2.483 GHz or below 2.4

GHz; continuous transmission of

CW carrier, Restricted Bands^{2 3}

-47

—

dBm

.

POUT_MAX, PAVDD connec-

ted to external 3.3 V supply

Note:

1. Output power limited to 14 dBm to ensure compliance with FCC specifications.

2. For 2476 MHz, 1.2 dB of power backoff is used to achieve this value.

3. For 2478 MHz, 5.8 dB of power backoff is used to achieve this value.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

4.1.8.4 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 125 kbps Data Rate

Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center

frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.

Table 4.14. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 125 kbps Data Rate

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Signal is reference signal¹. Packet

length is 20 bytes.

Max usable receiver input

level, 0.1% BER

SAT

—

10

—

dBm

Signal is reference signal¹. Using

DC-DC converter.

Sensitivity, 0.1% BER

SENS

—

-102.1

-101.8

—

dBm

With non-ideal signals as speci-

fied in RF-PHY.TS.4.2.2, section

4.6.1.

N+1 adjacent channel selec- C/I₁₊

tivity, 0.1% BER, with allowa-

ble exceptions. Desired is

Interferer is reference signal at +1

MHz offset. Desired frequency

2402 MHz ≤ Fc ≤ 2480 MHz

—

-14.0

-13.6

—

dB

reference signal at -79 dBm

N-1 adjacent channel selec- C/I_1-

tivity, 0.1% BER, with allowa-

ble exceptions. Desired is

Interferer is reference signal at -1

MHz offset. Desired frequency

2402 MHz ≤ Fc ≤ 2480 MHz

reference signal at -79 dBm

Selectivity to image frequen- C/I_IM

cy, 0.1% BER. Desired is ref-

erence signal at -79 dBm

Interferer is reference signal at im-

age frequency with 1 MHz preci-

sion

—

-51.6

-55.5

—

dB

Selectivity to image frequen- C/I_IM+1

cy ± 1 MHz, 0.1% BER. De-

sired is reference signal at

-79 dBm

Interferer is reference signal at im-

age frequency ± 1 MHz with 1

MHz precision

Note:

1. Reference signal is defined 2GFSK at -79 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 125 kbps, desired data = PRBS9;

interferer data = PRBS15; frequency accuracy better than 1 ppm.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

4.1.8.5 RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 500 kbps Data Rate

Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center

frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.

Table 4.15. RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 500 kbps Data Rate

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Power spectral density limit

PSD_LIMIT

Per FCC part 15.247 at 10 dBm

—

-9.8

—

dBm/

3kHz

Per FCC part 15.247 at 20 dBm¹

—

8

dBm/

3kHz

Spurious emissions out-of-

band, excluding harmonics

captured in SPUR_HARM,FCC

Emissions taken at

SPUR_{OOB_FCC}

Per FCC part 15.205/15.209,

Above 2.483 GHz or below 2.4

GHz; continuous transmission of

CW carrier, Restricted Bands^{2 3}

-47

—

dBm

.

POUT_MAX, PAVDD connec-

ted to external 3.3 V supply

Note:

1. Output power limited to 14 dBm to ensure compliance with FCC specifications.

2. For 2476 MHz, 1.2 dB of power backoff is used to achieve this value.

3. For 2478 MHz, 5.8 dB of power backoff is used to achieve this value.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

4.1.8.6 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 500 kbps Data Rate

Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center

frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.

Table 4.16. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 500 kbps Data Rate

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Signal is reference signal¹. Packet

length is 20 bytes.

Max usable receiver input

level, 0.1% BER

SAT

—

10

—

dBm

Signal is reference signal¹. Using

DC-DC converter.

Sensitivity, 0.1% BER

SENS

—

-97.9

-97.0

—

dBm

With non-ideal signals as speci-

fied in RF-PHY.TS.4.2.2, section

4.6.1.

N+1 adjacent channel selec- C/I₁₊

tivity, 0.1% BER, with allowa-

ble exceptions. Desired is

Interferer is reference signal at +1

MHz offset. Desired frequency

2402 MHz ≤ Fc ≤ 2480 MHz

—

-9.2

-9.0

—

dB

reference signal at -72 dBm

N-1 adjacent channel selec- C/I_1-

tivity, 0.1% BER, with allowa-

ble exceptions. Desired is

Interferer is reference signal at -1

MHz offset. Desired frequency

2402 MHz ≤ Fc ≤ 2480 MHz

reference signal at -72 dBm

Alternate selectivity, 0.1%

BER, with allowable excep-

tions. Desired is reference

signal at -72 dBm

C/I₂

Interferer is reference signal at ± 2

MHz offset. Desired frequency

2402 MHz ≤ Fc ≤ 2480 MHz

-46.5

Selectivity to image frequen- C/I_IM

cy, 0.1% BER. Desired is ref-

erence signal at -72 dBm

Interferer is reference signal at im-

age frequency with 1 MHz preci-

sion

—

-46.5

-50.7

—

dB

Selectivity to image frequen- C/I_IM+1

cy ± 1 MHz, 0.1% BER. De-

sired is reference signal at

-72 dBm

Interferer is reference signal at im-

age frequency ± 1 MHz with 1

MHz precision

Note:

1. Reference signal is defined 2GFSK at -72 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 500 kbps, desired data = PRBS9;

interferer data = PRBS15; frequency accuracy better than 1 ppm.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

4.1.8.7 RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 1 Mbps Data Rate

Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center

frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.

Table 4.17. RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 1 Mbps Data Rate

Parameter

Symbol

Test Condition

Min

—

Typ

-39.7

-43.6

—

Max

—

Unit

dBm

In-band spurious emissions, SPUR_INB

with allowed exceptions¹

At ± 2 MHz, 10 dBm

At ± 3 MHz, 10 dBm

At ± 2 MHz, 20 dBm

At ± 3 MHz, 20 dBm

—

-20

-30

—

Spurious emissions out-of-

band, excluding harmonics

captured in SPUR_HARM,FCC

Emissions taken at

SPUR_{OOB_FCC}

Per FCC part 15.205/15.209,

Above 2.483 GHz or below 2.4

GHz; continuous transmission of

CW carrier, Restricted Bands^{2 3}

—

-47

.

POUT_MAX, PAVDD connec-

ted to external 3.3 V supply

Note:

1. Per Bluetooth Core_5.0, Vol.6 Part A, Section 3.2.2, exceptions are allowed in up to three bands of 1 MHz width, centered on a

frequency which is an integer multiple of 1 MHz. These exceptions shall have an absolute value of -20 dBm or less.

2. For 2476 MHz, 1.5 dB of power backoff is used to achieve this value.

3. For 2478 MHz, 4.2 dB of power backoff is used to achieve this value.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

4.1.8.8 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 1 Mbps Data Rate

Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center

frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.

Table 4.18. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 1 Mbps Data Rate

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Signal is reference signal¹. Packet

length is 20 bytes.

Max usable receiver input

level, 0.1% BER

SAT

—

10

—

dBm

Signal is reference signal¹. Using

DC-DC converter.

Sensitivity, 0.1% BER

SENS

—

-94.1

-93.8

—

dBm

With non-ideal signals as speci-

fied in RF-PHY.TS.4.2.2, section

4.6.1.

Signal to co-channel interfer- C/I_CC

er, 0.1% BER

Desired signal 3 dB above refer-

ence sensitivity.

—

9.0

—

dB

N+1 adjacent channel selec- C/I₁₊

tivity, 0.1% BER, with allowa-

ble exceptions. Desired is

Interferer is reference signal at +1

MHz offset. Desired frequency

2402 MHz ≤ Fc ≤ 2480 MHz

-3.3

reference signal at -67 dBm

N-1 adjacent channel selec- C/I_1-

tivity, 0.1% BER, with allowa-

ble exceptions. Desired is

Interferer is reference signal at -1

MHz offset. Desired frequency

2402 MHz ≤ Fc ≤ 2480 MHz

—

-1.6

-42.0

-46.4

—

dB

reference signal at -67 dBm

Alternate selectivity, 0.1%

BER, with allowable excep-

tions. Desired is reference

signal at -67 dBm

C/I₂

Interferer is reference signal at ± 2

MHz offset. Desired frequency

2402 MHz ≤ Fc ≤ 2480 MHz

Alternate selectivity, 0.1%

BER, with allowable excep-

tions. Desired is reference

signal at -67 dBm

C/I₃

Interferer is reference signal at ± 3

MHz offset. Desired frequency

2404 MHz ≤ Fc ≤ 2480 MHz

Selectivity to image frequen- C/I_IM

cy, 0.1% BER. Desired is ref-

erence signal at -67 dBm

Interferer is reference signal at im-

age frequency with 1 MHz preci-

sion

—

-42.0

-47.1

—

dB

Selectivity to image frequen- C/I_IM+1

cy ± 1 MHz, 0.1% BER. De-

sired is reference signal at

-67 dBm

Interferer is reference signal at im-

age frequency ± 1 MHz with 1

MHz precision

Intermodulation performance IM

Per Core_4.1, Vol 6, Part A, Sec-

tion 4.4 with n = 3

—

-18.4

—

dBm

Note:

1. Reference signal is defined 2GFSK at -67 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 1 Mbps, desired data = PRBS9;

interferer data = PRBS15; frequency accuracy better than 1 ppm.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

4.1.8.9 RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 2 Mbps Data Rate

Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center

frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.

Table 4.19. RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 2 Mbps Data Rate

Parameter

Symbol

Test Condition

Min

—

Typ

-38.2

-41.1

-30.1

-31.4

-47

Max

—

Unit

dBm

In-band spurious emissions, SPUR_INB

with allowed exceptions¹

At ± 4 MHz, 10 dBm

At ± 6 MHz, 10 dBm

At ± 4 MHz, 20 dBm

At ± 6 MHz, 20 dBm

—

Spurious emissions out-of-

band, excluding harmonics

captured in SPUR_HARM,FCC

Emissions taken at

SPUR_{OOB_FCC}

Per FCC part 15.205/15.209,

Above 2.483 GHz or below 2.4

GHz; continuous transmission of

CW carrier, Restricted Bands^{2 3 4}

5

—

.

POUT_MAX, PAVDD connec-

ted to external 3.3 V supply

Note:

1. Per Bluetooth Core_5.0, Vol.6 Part A, Section 3.2.2, exceptions are allowed in up to three bands of 1 MHz width, centered on a

frequency which is an integer multiple of 1 MHz. These exceptions shall have an absolute value of -20 dBm or less.

2. For 2472 MHz, 1.3 dB of power backoff is used to achieve this value.

3. For 2474 MHz, 3.8 dB of power backoff is used to achieve this value.

4. For 2476 MHz, 7 dB of power backoff is used to achieve this value.

5. For 2478 MHz, 11.2 dB of power backoff is used to achieve this value.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

4.1.8.10 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 2 Mbps Data Rate

Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center

frequency 2.45 GHz. Conducted measurement from the antenna feedpoint.

Table 4.20. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 2 Mbps Data Rate

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Signal is reference signal¹. Packet

length is 20 bytes.

Max usable receiver input

level, 0.1% BER

SAT

—

10

—

dBm

Signal is reference signal¹. Using

DC-DC converter.

Sensitivity, 0.1% BER

SENS

—

-90.2

-89.9

—

dBm

With non-ideal signals as speci-

fied in RF-PHY.TS.4.2.2, section

4.6.1.

Signal to co-channel interfer- C/I_CC

er, 0.1% BER

Desired signal 3 dB above refer-

ence sensitivity.

—

8.6

—

dB

N+1 adjacent channel selec- C/I₁₊

tivity, 0.1% BER, with allowa-

ble exceptions. Desired is

Interferer is reference signal at +2

MHz offset. Desired frequency

2402 MHz ≤ Fc ≤ 2480 MHz

-7.6

reference signal at -67 dBm

N-1 adjacent channel selec- C/I_1-

tivity, 0.1% BER, with allowa-

ble exceptions. Desired is

Interferer is reference signal at -2

MHz offset. Desired frequency

2402 MHz ≤ Fc ≤ 2480 MHz

—

-11.4

-40.3

-45.1

—

dB

reference signal at -67 dBm

Alternate selectivity, 0.1%

BER, with allowable excep-

tions. Desired is reference

signal at -67 dBm

C/I₂

Interferer is reference signal at ± 4

MHz offset. Desired frequency

2402 MHz ≤ Fc ≤ 2480 MHz

Alternate selectivity, 0.1%

BER, with allowable excep-

tions. Desired is reference

signal at -67 dBm

C/I₃

Interferer is reference signal at ± 6

MHz offset. Desired frequency

2404 MHz ≤ Fc ≤ 2480 MHz

Selectivity to image frequen- C/I_IM

cy, 0.1% BER. Desired is ref-

erence signal at -67 dBm

Interferer is reference signal at im-

age frequency with 1 MHz preci-

sion

—

-7.6

—

dB

Selectivity to image frequen- C/I_IM+1

cy ± 2 MHz, 0.1% BER. De-

sired is reference signal at

-67 dBm

Interferer is reference signal at im-

age frequency ± 2 MHz with 2

MHz precision

-40.30

Intermodulation performance IM

Per Core_4.1, Vol 6, Part A, Sec-

tion 4.4 with n = 3

—

-18.4

—

dBm

Note:

1. Reference signal is defined 2GFSK at -67 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 2 Mbps, desired data = PRBS9;

interferer data = PRBS15; frequency accuracy better than 1 ppm.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

4.1.9 Oscillators

4.1.9.1 Low-Frequency Crystal Oscillator (LFXO)

Table 4.21. Low-Frequency Crystal Oscillator (LFXO)

Parameter

Symbol

Test Condition

Min

—

Typ

32.768

—

Max

—

Unit

kHz

kΩ

Crystal frequency

f_LFXO

Supported crystal equivalent ESR_LFXO

series resistance (ESR)

—

70

Supported range of crystal

load capacitance ¹

C_{LFXO_CL}

6

8

—

18

40

pF

On-chip tuning cap range ²

C_{LFXO_T}

On each of LFXTAL_N and

LFXTAL_P pins

On-chip tuning cap step size SS_LFXO

—

0.25

273

—

pF

nA

Current consumption after

startup ³

I_LFXO

ESR = 70 kOhm, C_L= 7 pF,

GAIN⁴= 2, AGC⁴= 1

Start- up time

t_LFXO

ESR = 70 kOhm, C_L= 7 pF,

GAIN⁴= 2

—

308

—

ms

Note:

1. Total load capacitance as seen by the crystal.

2. The effective load capacitance seen by the crystal will be C_{LFXO_T}/2. This is because each XTAL pin has a tuning cap and the

two caps will be seen in series by the crystal.

3. Block is supplied by AVDD if ANASW = 0, or DVDD if ANASW=1 in EMU_PWRCTRL register.

4. In CMU_LFXOCTRL register.

4.1.9.2 High-Frequency Crystal Oscillator (HFXO)

Table 4.22. High-Frequency Crystal Oscillator (HFXO)

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Crystal frequency

f_HFXO

38.4 MHz required for radio trans-

ciever operation

—

38.4

—

MHz

Frequency tolerance for the FT_HFXO

crystal

-40

—

40

ppm

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

4.1.9.3 Low-Frequency RC Oscillator (LFRCO)

Table 4.23. Low-Frequency RC Oscillator (LFRCO)

Parameter

Symbol

Test Condition

ENVREF¹= 1

ENVREF¹= 0

Min

Typ

Max

Unit

Oscillation frequency

f_LFRCO

31.3

32.768

33.6

kHz

31.3

—

32.768

500

33.4

—

kHz

µs

Startup time

t_LFRCO

I_LFRCO

Current consumption ²

ENVREF = 1 in

CMU_LFRCOCTRL

—

342

—

nA

ENVREF = 0 in

—

494

—

nA

CMU_LFRCOCTRL

Note:

1. In CMU_LFRCOCTRL register.

2. Block is supplied by AVDD if ANASW = 0, or DVDD if ANASW=1 in EMU_PWRCTRL register.

4.1.9.4 Precision Low-Frequency RC Oscillator (PLFRCO)

Table 4.24. Precision Low-Frequency RC Oscillator (PLFRCO)

Parameter

Symbol

Test Condition

Min

—

Typ

32.768

—

Max

—

Unit

kHz

ppm

Oscillation frequency

f_PLFRCO

Frequency accuracy^{1 2}

f_{PLFRCO_ACC}

Across operating temperature

range

-500

500

Startup time

t_PLFRCO

—

64.2

—

ms

Note:

1. The Frequency accuracy limits, calculated with 3-sigma standard deviation, apply for temperatures -20 °C to 85 °C for G temp-

grade and -20 °C to 125 °C for I temp-grade.

2. 99.953% (3.5 sigma) of the overall device population comply to the Max. and Min. limits.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

4.1.9.5 High-Frequency RC Oscillator (HFRCO)

Table 4.25. High-Frequency RC Oscillator (HFRCO)

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Frequency accuracy

f_{HFRCO_ACC}

At production calibrated frequen-

cies, across supply voltage and

temperature

-2.5

—

2.5

%

Start-up time

t_HFRCO

f_HFRCO≥ 19 MHz

4 < f_HFRCO< 19 MHz

f_HFRCO≤ 4 MHz

f_HFRCO= 38 MHz

f_HFRCO= 32 MHz

f_HFRCO= 26 MHz

f_HFRCO= 19 MHz

f_HFRCO= 16 MHz

f_HFRCO= 13 MHz

f_HFRCO= 7 MHz

f_HFRCO= 4 MHz

f_HFRCO= 2 MHz

f_HFRCO= 1 MHz

—

300

1

—

ns

µs

2.5

267

224

189

154

133

118

89

—

µs

Current consumption on all

supplies

I_HFRCO

299

248

211

172

148

135

100

44

µA

%

34

29

40

26

36

Coarse trim step size (% of

period)

SS_{HFRCO_COARS}

0.8

—

E

Fine trim step size (% of pe- SS_{HFRCO_FINE}

riod)

—

0.1

—

%

Period jitter

PJ_HFRCO

—

0.2

—

% RMS

MHz

Frequency limits

f_{HFRCO_BAND}

FREQRANGE = 0, FINETUNIN-

GEN = 0

3.47

6.15

FREQRANGE = 3, FINETUNIN-

GEN = 0

6.24

11.3

—

11.45

19.8

22.8

29.0

40.63

48

MHz

FREQRANGE = 6, FINETUNIN-

GEN = 0

FREQRANGE = 7, FINETUNIN-

GEN = 0

13.45

16.5

FREQRANGE = 8, FINETUNIN-

GEN = 0

FREQRANGE = 10, FINETUNIN-

GEN = 0

23.11

27.27

33.33

FREQRANGE = 11, FINETUNIN-

GEN = 0

FREQRANGE = 12, FINETUNIN-

GEN = 0

54

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

4.1.9.6 Ultra-low Frequency RC Oscillator (ULFRCO)

Table 4.26. Ultra-low Frequency RC Oscillator (ULFRCO)

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Oscillation frequency

f_ULFRCO

0.95

1

1.07

kHz

4.1.10 Flash Memory Characteristics¹

Table 4.27. Flash Memory Characteristics¹

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Flash erase cycles before

failure

EC_FLASH

10000

—

cycles

Flash data retention

RET_FLASH

t_{W_PROG}

10

20

—

years

µs

Word (32-bit) programming

time

Burst write, 128 words, average

time per word

26.3

30

Single word

62

20

68.9

29.5

80

40

µs

Page erase time²

Mass erase time³

Device erase time^{4 5}

Erase current⁶

t_PERASE

t_MERASE

t_DERASE

I_ERASE

ms

20

—

30

56.2

—

40

70

ms

mA

V

Page Erase

—

2.0

3.5

3.6

Write current⁶

I_WRITE

—

Supply voltage during flash

erase and write

V_FLASH

1.62

—

Note:

1. Flash data retention information is published in the Quarterly Quality and Reliability Report.

2. From setting the ERASEPAGE bit in MSC_WRITECMD to 1 until the BUSY bit in MSC_STATUS is cleared to 0. Internal setup

and hold times for flash control signals are included.

3. Mass erase is issued by the CPU and erases all flash.

4. Device erase is issued over the AAP interface and erases all flash, SRAM, the Lock Bit (LB) page, and the User data page Lock

Word (ULW).

5. From setting the DEVICEERASE bit in AAP_CMD to 1 until the ERASEBUSY bit in AAP_STATUS is cleared to 0. Internal setup

and hold times for flash control signals are included.

6. Measured at 25 °C.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

4.1.11 General-Purpose I/O (GPIO)

Table 4.28. General-Purpose I/O (GPIO)

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Input low voltage¹

Input high voltage¹

V_IL

V_IH

GPIO pins

—

IOVDD*0.3

V

GPIO pins

IOVDD*0.7

IOVDD*0.8

—

V

Output high voltage relative V_OH

to IOVDD

Sourcing 3 mA, IOVDD ≥ 3 V,

DRIVESTRENGTH²= WEAK

Sourcing 1.2 mA, IOVDD ≥ 1.62

V,

IOVDD*0.6

—

V

DRIVESTRENGTH²= WEAK

Sourcing 20 mA, IOVDD ≥ 3 V,

IOVDD*0.8

—

0.1

—

V

DRIVESTRENGTH²= STRONG

Sourcing 8 mA, IOVDD ≥ 1.62 V,

IOVDD*0.6

—

DRIVESTRENGTH²= STRONG

Sinking 3 mA, IOVDD ≥ 3 V,

Output low voltage relative to V_OL

IOVDD

—

IOVDD*0.2

IOVDD*0.4

IOVDD*0.2

IOVDD*0.4

30

V

DRIVESTRENGTH²= WEAK

Sinking 1.2 mA, IOVDD ≥ 1.62 V,

V

DRIVESTRENGTH²= WEAK

Sinking 20 mA, IOVDD ≥ 3 V,

V

DRIVESTRENGTH²= STRONG

Sinking 8 mA, IOVDD ≥ 1.62 V,

V

DRIVESTRENGTH²= STRONG

Input leakage current

I_IOLEAK

All GPIO except LFXO pins, GPIO

≤ IOVDD

nA

LFXO Pins, GPIO ≤ IOVDD

—

0.1

3.3

50

15

nA

µA

Input leakage current on

I_5VTOLLEAK

IOVDD < GPIO ≤ IOVDD + 2 V

5VTOL pads above IOVDD

I/O pin pull-up/pull-down re- R_PUD

sistor³

30

15

40

25

65

45

kΩ

ns

Pulse width of pulses re-

moved by the glitch suppres-

sion filter

t_IOGLITCH

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Output fall time, From 70%

to 30% of V_IO

t_IOOF

C_L= 50 pF,

—

1.8

—

ns

DRIVESTRENGTH²= STRONG,

SLEWRATE²= 0x6

C_L= 50 pF,

—

4.5

2.2

7.4

—

ns

DRIVESTRENGTH²= WEAK,

SLEWRATE²= 0x6

C_L= 50 pF,

Output rise time, From 30% t_IOOR

to 70% of V_IO

DRIVESTRENGTH²= STRONG,

SLEWRATE = 0x6²

C_L= 50 pF,

DRIVESTRENGTH²= WEAK,

SLEWRATE²= 0x6

Note:

1. GPIO input threshold are proportional to the IOVDD supply, except for RESETn which is proportional to AVDD.

2. In GPIO_Pn_CTRL register.

3. GPIO pull-ups are referenced to the IOVDD supply, except for RESETn, which connects to AVDD.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

4.1.12 Voltage Monitor (VMON)

Table 4.29. Voltage Monitor (VMON)

Parameter

Symbol

I_VMON

Test Condition

Min

—

Typ

6.3

Max

8

Unit

µA

Supply current (including

I_SENSE)

In EM0 or EM1, 1 active channel

In EM0 or EM1, All channels ac-

tive

—

12.5

15

µA

In EM2, EM3 or EM4, 1 channel

active and above threshold

—

62

99

—

nA

In EM2, EM3 or EM4, 1 channel

active and below threshold

In EM2, EM3 or EM4, All channels

active and above threshold

In EM2, EM3 or EM4, All channels

active and below threshold

Loading of monitored supply I_SENSE

In EM0 or EM1

—

2

—

3.4

—

µA

nA

V

In EM2, EM3 or EM4

Threshold range

V_{VMON_RANGE}

1.62

—

Threshold step size

N_{VMON_STESP}

Coarse

200

20

460

26

mV

ns

Fine

—

Response time

Hysteresis

t_{VMON_RES}

Supply drops at 1V/µs rate

—

V_{VMON_HYST}

—

mV

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

4.1.13 Analog to Digital Converter (ADC)

Specified at 1 Msps, ADCCLK = 16 MHz, BIASPROG = 0, GPBIASACC = 0, unless otherwise indicated.

Table 4.30. Analog to Digital Converter (ADC)

Parameter

Symbol

Test Condition

Min

Typ

—

Max

12

Unit

Bits

V

Resolution

V_RESOLUTION

V_ADCIN

6

—

Input voltage range¹

Single ended

Differential

—

V_FS

-V_FS/2

1

—

V_FS/2

V_AVDD

V

Input range of external refer- V_{ADCREFIN_P}

ence voltage, single ended

and differential

—

V

Power supply rejection²

PSRR_ADC

At DC

—

80

—

dB

Analog input common mode CMRR_ADC

rejection ratio

Current from all supplies, us- I_{ADC_CONTINU-}

1 Msps / 16 MHz ADCCLK, BIA-

SPROG = 0, GPBIASACC = 1 ⁴

—

270

125

80

290

—

µA

ing internal reference buffer.

OUS_LP

Continuous operation. WAR-

MUPMODE³= KEEPADC-

WARM

250 ksps / 4 MHz ADCCLK, BIA-

SPROG = 6, GPBIASACC = 1 ⁴

62.5 ksps / 1 MHz ADCCLK, BIA-

SPROG = 15, GPBIASACC = 1 ⁴

Current from all supplies, us- I_{ADC_NORMAL_LP}35 ksps / 16 MHz ADCCLK, BIA-

45

SPROG = 0, GPBIASACC = 1 ⁴

ing internal reference buffer.

Duty-cycled operation. WAR-

MUPMODE³= NORMAL

5 ksps / 16 MHz ADCCLK BIA-

SPROG = 0, GPBIASACC = 1 ⁴

8

Current from all supplies, us- I_{ADC_STAND-}

125 ksps / 16 MHz ADCCLK, BIA-

SPROG = 0, GPBIASACC = 1 ⁴

105

70

ing internal reference buffer.

BY_LP

Duty-cycled operation.

35 ksps / 16 MHz ADCCLK, BIA-

SPROG = 0, GPBIASACC = 1 ⁴

AWARMUPMODE³= KEEP-

INSTANDBY or KEEPIN-

SLOWACC

Current from all supplies, us- I_{ADC_CONTINU-}

1 Msps / 16 MHz ADCCLK, BIA-

SPROG = 0, GPBIASACC = 0 ⁴

—

325

175

125

85

—

µA

ing internal reference buffer.

OUS_HP

Continuous operation. WAR-

MUPMODE³= KEEPADC-

WARM

250 ksps / 4 MHz ADCCLK, BIA-

SPROG = 6, GPBIASACC = 0 ⁴

62.5 ksps / 1 MHz ADCCLK, BIA-

SPROG = 15, GPBIASACC = 0 ⁴

Current from all supplies, us- I_{ADC_NORMAL_HP}35 ksps / 16 MHz ADCCLK, BIA-

SPROG = 0, GPBIASACC = 0 ⁴

ing internal reference buffer.

Duty-cycled operation. WAR-

MUPMODE³= NORMAL

5 ksps / 16 MHz ADCCLK BIA-

SPROG = 0, GPBIASACC = 0 ⁴

16

Current from all supplies, us- I_{ADC_STAND-}

125 ksps / 16 MHz ADCCLK, BIA-

SPROG = 0, GPBIASACC = 0 ⁴

160

125

ing internal reference buffer.

BY_HP

Duty-cycled operation.

35 ksps / 16 MHz ADCCLK, BIA-

SPROG = 0, GPBIASACC = 0 ⁴

AWARMUPMODE³= KEEP-

INSTANDBY or KEEPIN-

SLOWACC

Current from HFPERCLK

I_{ADC_CLK}

HFPERCLK = 16 MHz

—

140

—

µA

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

Parameter

Symbol

f_ADCCLK

Test Condition

Min

—

Typ

—

7

Max

16

1

Unit

MHz

ADC clock frequency

Throughput rate

f_ADCRATE

t_ADCCONV

—

Msps

cycles

µs

Conversion time⁵

6 bit

8 bit

12 bit

—

5

—

9

—

13

—

WARMUPMODE³= NORMAL

Startup time of reference

generator and ADC core

t_ADCSTART

—

WARMUPMODE³= KEEPIN-

STANDBY

—

58

—

67

68

2

µs

dB

WARMUPMODE³= KEEPINSLO-

WACC

1

Internal reference⁶, differential

measurement

SNDR at 1Msps and f_IN

10kHz

=

SNDR_ADC

—

External reference⁷, differential

measurement

Spurious-free dynamic range SFDR_ADC

(SFDR)

1 MSamples/s, 10 kHz full-scale

sine wave

—

-1

-6

75

—

2

dB

Differential non-linearity

(DNL)

DNL_ADC

12 bit resolution, No missing co-

des

LSB

Integral non-linearity (INL),

End point method

INL_ADC

12 bit resolution

6

Offset error

V_ADCOFFSETERR

V_ADCGAIN

-3

—

0

3

LSB

%

Gain error in ADC

Using internal reference

Using external reference

-0.2

-1

3.5

—

%

Temperature sensor slope

V_{TS_SLOPE}

-1.84

mV/°C

Note:

1. The absolute voltage allowed at any ADC input is dictated by the power rail supplied to on-chip circuitry, and may be lower than

the effective full scale voltage. All ADC inputs are limited to the ADC supply (AVDD or DVDD depending on

EMU_PWRCTRL_ANASW). Any ADC input routed through the APORT will further be limited by the IOVDD supply to the pin.

2. PSRR is referenced to AVDD when ANASW=0 and to DVDD when ANASW=1 in EMU_PWRCTRL.

3. In ADCn_CTRL register.

4. In ADCn_BIASPROG register.

5. Derived from ADCCLK.

6. Internal reference option used corresponds to selection 2V5 in the SINGLECTRL_REF or SCANCTRL_REF register field. The

differential input range with this configuration is ± 1.25 V. Typical value is characterized using full-scale sine wave input. Minimum

value is production-tested using sine wave input at 1.5 dB lower than full scale.

7. External reference is 1.25 V applied externally to ADCnEXTREFP, with the selection CONF in the SINGLECTRL_REF or

SCANCTRL_REF register field and VREFP in the SINGLECTRLX_VREFSEL or SCANCTRLX_VREFSEL field. The differential

input range with this configuration is ± 1.25 V.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

4.1.14 Analog Comparator (ACMP)

Table 4.31. Analog Comparator (ACMP)

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Input voltage range

V_ACMPIN

ACMPVDD =

ACMPn_CTRL_PWRSEL ¹

—

V_ACMPVDD

V

BIASPROG²≤ 0x10 or FULL-

BIAS²= 0

Supply voltage

V_ACMPVDD

1.8

2.1

—

V_{VREGVDD_}

V

MAX

0x10 < BIASPROG²≤ 0x20 and

FULLBIAS²= 1

V_{VREGVDD_}

MAX

BIASPROG²= 1, FULLBIAS²= 0

Active current not including

voltage reference³

I_ACMP

—

50

—

nA

BIASPROG²= 0x10, FULLBIAS²

= 0

306

BIASPROG²= 0x02, FULLBIAS²

= 1

—

6.1

74

50

11

92

—

µA

nA

BIASPROG²= 0x20, FULLBIAS²

= 1

Current consumption of inter- I_ACMPREF

nal voltage reference³

VLP selected as input using 2.5 V

Reference / 4 (0.625 V)

VLP selected as input using VDD

—

20

—

nA

µA

VBDIV selected as input using

1.25 V reference / 1

4.1

VADIV selected as input using

VDD/1

—

2.4

—

µA

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

HYSTSEL⁴= HYST0

HYSTSEL⁴= HYST1

HYSTSEL⁴= HYST2

HYSTSEL⁴= HYST3

HYSTSEL⁴= HYST4

HYSTSEL⁴= HYST5

HYSTSEL⁴= HYST6

HYSTSEL⁴= HYST7

HYSTSEL⁴= HYST8

HYSTSEL⁴= HYST9

HYSTSEL⁴= HYST10

HYSTSEL⁴= HYST11

HYSTSEL⁴= HYST12

HYSTSEL⁴= HYST13

HYSTSEL⁴= HYST14

HYSTSEL⁴= HYST15

BIASPROG²= 1, FULLBIAS²= 0

Hysteresis (V_CM= 1.25 V,

BIASPROG²= 0x10, FULL-

BIAS²= 1)

V_ACMPHYST

-3

0

3

mV

5

12

18

33

27

50

mV

µs

17

46

67

23

57

86

26

68

104

130

155

3

30

79

34

90

-3

0

-27

-50

-67

-86

-104

-130

-155

—

-18

-33

-45

-57

-67

-78

-88

30

-5

-12

-17

-23

-26

-30

-34

95

Comparator delay⁵

t_ACMPDELAY

BIASPROG²= 0x10, FULLBIAS²

= 0

—

3.7

10

µs

BIASPROG²= 0x02, FULLBIAS²

= 1

—

360

35

1000

—

ns

BIASPROG²= 0x20, FULLBIAS²

= 1

BIASPROG²=0x10, FULLBIAS²

= 1

Offset voltage

V_ACMPOFFSET

-35

—

35

mV

Reference voltage

V_ACMPREF

Internal 1.25 V reference

Internal 2.5 V reference

1

1.25

2.5

1.47

2.8

—

V

1.98

—

CSRESSEL⁶= 0

CSRESSEL⁶= 1

CSRESSEL⁶= 2

CSRESSEL⁶= 3

CSRESSEL⁶= 4

CSRESSEL⁶= 5

CSRESSEL⁶= 6

CSRESSEL⁶= 7

Capacitive sense internal re- R_CSRES

sistance

infinite

kΩ

—

15

27

—

kΩ

39

51

102

164

239

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

Parameter

Note:

Symbol

Test Condition

Min

Typ

Max

Unit

1. ACMPVDD is a supply chosen by the setting in ACMPn_CTRL_PWRSEL and may be IOVDD, AVDD or DVDD.

2. In ACMPn_CTRL register.

3. The total ACMP current is the sum of the contributions from the ACMP and its internal voltage reference. I_ACMPTOTAL= I_ACMP

I_ACMPREF

+

.

4. In ACMPn_HYSTERESIS registers.

5. ± 100 mV differential drive.

6. In ACMPn_INPUTSEL register.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

4.1.15 Digital to Analog Converter (VDAC)

DRIVESTRENGTH = 2 unless otherwise specified. Primary VDAC output.

Table 4.32. Digital to Analog Converter (VDAC)

Parameter

Symbol

Test Condition

Single-Ended

Min

Typ

—

Max

Unit

V

Output voltage

V_DACOUT

0

V_VREF

Differential¹

-V_VREF

—

V

Current consumption includ- I_DAC

ing references (2 channels)²

500 ksps, 12-bit, DRIVES-

TRENGTH = 2, REFSEL = 4

396

72

—

µA

44.1 ksps, 12-bit, DRIVES-

TRENGTH = 1, REFSEL = 4

—

200 Hz refresh rate, 12-bit Sam-

ple-Off mode in EM2, DRIVES-

TRENGTH = 2, REFSEL = 4,

SETTLETIME = 0x02, WARMUP-

TIME = 0x0A

1.2

Current from HFPERCLK³

Sample rate

I_{DAC_CLK}

—

2

5.8

—

500

1

µA/MHz

ksps

MHz

µs

SR_DAC

DAC clock frequency

Conversion time

Settling time

f_DAC

—

t_DACCONV

t_DACSETTLE

t_DACSTARTUP

f_DAC= 1MHz

—

50% fs step settling to 5 LSB

—

2.5

—

µs

Startup time

Enable to 90% fs output, settling

to 10 LSB

12

µs

Output impedance

R_OUT

DRIVESTRENGTH = 2, 0.4 V ≤

V_OUT≤ V_OPA- 0.4 V, -8 mA <

I_OUT< 8 mA, Full supply range

—

2

—

Ω

DRIVESTRENGTH = 0 or 1, 0.4 V

≤ V_OUT≤ V_OPA- 0.4 V, -400 µA <

I_OUT< 400 µA, Full supply range

DRIVESTRENGTH = 2, 0.1 V ≤

V_OUT≤ V_OPA- 0.1 V, -2 mA <

I_OUT< 2 mA, Full supply range

2

Ω

DRIVESTRENGTH = 0 or 1, 0.1 V

≤ V_OUT≤ V_OPA- 0.1 V, -100 µA <

I_OUT< 100 µA, Full supply range

2

Ω

Power supply rejection ratio⁴

PSRR

Vout = 50% fs. DC

65.5

dB

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Signal to noise and distortion SNDR_DAC

ratio (1 kHz sine wave),

Noise band limited to 250

kHz

500 ksps, single-ended, internal

1.25V reference

—

60.4

—

dB

500 ksps, single-ended, internal

2.5V reference

—

61.6

64.0

63.3

64.4

65.8

65.3

66.7

70.0

67.8

69.0

68.5

—

dB

500 ksps, single-ended, 3.3V

VDD reference

500 ksps, differential, internal

1.25V reference

500 ksps, differential, internal

2.5V reference

500 ksps, differential, 3.3V VDD

reference

Signal to noise and distortion SNDR_{DAC_BAND}500 ksps, single-ended, internal

ratio (1 kHz sine wave),

Noise band limited to 22 kHz

1.25V reference

500 ksps, single-ended, internal

2.5V reference

500 ksps, single-ended, 3.3V

VDD reference

500 ksps, differential, internal

1.25V reference

500 ksps, differential, internal

2.5V reference

500 ksps, differential, 3.3V VDD

reference

Total harmonic distortion

THD

—

70.2

—

1

dB

Differential non-linearity⁵

Intergral non-linearity

DNL_DAC

-0.99

LSB

INL_DAC

-4

-8

—

4

8

LSB

mV

Offset error⁶

V_OFFSET

T = 25 °C

Across operating temperature

range

-25

25

Gain error⁶

V_GAIN

T = 25 °C, Low-noise internal ref-

erence (REFSEL = 1V25LN or

2V5LN)

-2.5

—

2.5

%

T = 25 °C, Internal reference (RE-

FSEL = 1V25 or 2V5)

-5

—

5

%

T = 25 °C, External reference

(REFSEL = VDD or EXT)

-1.8

-3.5

1.8

3.5

Across operating temperature

range, Low-noise internal refer-

ence (REFSEL = 1V25LN or

2V5LN)

Across operating temperature

range, Internal reference (RE-

FSEL = 1V25 or 2V5)

-7.5

-2.0

—

7.5

2.0

%

Across operating temperature

range, External reference (RE-

FSEL = VDD or EXT)

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

External load capactiance,

OUTSCALE=0

C_LOAD

—

75

pF

Note:

1. In differential mode, the output is defined as the difference between two single-ended outputs. Absolute voltage on each output is

limited to the single-ended range.

2. Supply current specifications are for VDAC circuitry operating with static output only and do not include current required to drive

the load.

3. Current from HFPERCLK is dependent on HFPERCLK frequency. This current contributes to the total supply current used when

the clock to the DAC peripheral is enabled in the CMU.

4. PSRR calculated as 20 * log₁₀(ΔVDD / ΔV_OUT), VDAC output at 90% of full scale

5. Entire range is monotonic and has no missing codes.

6. Gain is calculated by measuring the slope from 10% to 90% of full scale. Offset is calculated by comparing actual VDAC output at

10% of full scale to ideal VDAC output at 10% of full scale with the measured gain.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

4.1.16 Current Digital to Analog Converter (IDAC)

Table 4.33. Current Digital to Analog Converter (IDAC)

Parameter

Symbol

Test Condition

Min

—

Typ

4

Max

—

Unit

ranges

µA

Number of ranges

Output current

N_{IDAC_RANGES}

I_{IDAC_OUT}

RANGESEL¹= RANGE0

RANGESEL¹= RANGE1

RANGESEL¹= RANGE2

RANGESEL¹= RANGE3

0.05

—

1.6

0.5

2

—

32

4.7

16

64

—

µA

Linear steps within each

range

N_{IDAC_STEPS}

—

steps

RANGESEL¹= RANGE0

RANGESEL¹= RANGE1

RANGESEL¹= RANGE2

RANGESEL¹= RANGE3

Step size

SS_IDAC

—

-3

50

100

500

2

—

3

nA

µA

%

Total accuracy, STEPSEL¹=

0x10

ACC_IDAC

EM0 or EM1, AVDD=3.3 V, T = 25

°C

—

EM0 or EM1, Across operating

temperature range

-18

—

-2

22

—

%

EM2 or EM3, Source mode, RAN-

GESEL¹= RANGE0, AVDD=3.3

V, T = 25 °C

EM2 or EM3, Source mode, RAN-

GESEL¹= RANGE1, AVDD=3.3

V, T = 25 °C

—

-1.7

-0.8

-0.5

-0.7

-0.6

-0.5

—

%

EM2 or EM3, Source mode, RAN-

GESEL¹= RANGE2, AVDD=3.3

V, T = 25 °C

EM2 or EM3, Source mode, RAN-

GESEL¹= RANGE3, AVDD=3.3

V, T = 25 °C

EM2 or EM3, Sink mode, RAN-

GESEL¹= RANGE0, AVDD=3.3

V, T = 25 °C

EM2 or EM3, Sink mode, RAN-

GESEL¹= RANGE1, AVDD=3.3

V, T = 25 °C

EM2 or EM3, Sink mode, RAN-

GESEL¹= RANGE2, AVDD=3.3

V, T = 25 °C

EM2 or EM3, Sink mode, RAN-

GESEL¹= RANGE3, AVDD=3.3

V, T = 25 °C

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Start up time

t_{IDAC_SU}

Output within 1% of steady state

value

—

5

—

µs

Settling time, (output settled t_{IDAC_SETTLE}

within 1% of steady state val-

ue),

Range setting is changed

Step value is changed

—

5

1

—

µs

Current consumption²

I_IDAC

EM0 or EM1 Source mode, ex-

cluding output current, Across op-

erating temperature range

—

11

15

µA

EM0 or EM1 Sink mode, exclud-

ing output current, Across operat-

ing temperature range

—

13

18

µA

EM2 or EM3 Source mode, ex-

cluding output current, T = 25 °C

—

0.023

0.041

11

—

µA

%

EM2 or EM3 Sink mode, exclud-

ing output current, T = 25 °C

EM2 or EM3 Source mode, ex-

cluding output current, T ≥ 85 °C

EM2 or EM3 Sink mode, exclud-

ing output current, T ≥ 85 °C

13

RANGESEL¹= RANGE0, output

Output voltage compliance in I_{COMP_SRC}

source mode, source current

change relative to current

sourced at 0 V

0.11

voltage = min(V_IOVDD

V_AVDD²-100 mV)

,

RANGESEL¹= RANGE1, output

—

0.06

0.04

0.03

—

%

voltage = min(V_IOVDD

,

V_AVDD²-100 mV)

RANGESEL¹= RANGE2, output

voltage = min(V_IOVDD

,

V_AVDD²-150 mV)

RANGESEL¹= RANGE3, output

voltage = min(V_IOVDD

,

V_AVDD²-250 mV)

RANGESEL¹= RANGE0, output

voltage = 100 mV

Output voltage compliance in I_{COMP_SINK}

sink mode, sink current

change relative to current

sunk at IOVDD

—

0.12

0.05

0.04

0.03

—

%

RANGESEL¹= RANGE1, output

voltage = 100 mV

RANGESEL¹= RANGE2, output

voltage = 150 mV

RANGESEL¹= RANGE3, output

voltage = 250 mV

Note:

1. In IDAC_CURPROG register.

2. The IDAC is supplied by either AVDD, DVDD, or IOVDD based on the setting of ANASW in the EMU_PWRCTRL register and

PWRSEL in the IDAC_CTRL register. Setting PWRSEL to 1 selects IOVDD. With PWRSEL cleared to 0, ANASW selects be-

tween AVDD (0) and DVDD (1).

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

4.1.17 Capacitive Sense (CSEN)

Table 4.34. Capacitive Sense (CSEN)

Parameter

Symbol

t_CNV

Test Condition

Min

—

Typ

20.2

26.4

1.55

Max

—

Unit

µs

Single conversion time (1x

accumulation)

12-bit SAR Conversions

16-bit SAR Conversions

—

µs

Delta Modulation Conversion (sin-

gle comparison)

—

µs

Maximum external capacitive C_EXTMAX

load

IREFPROG=7 (Gain = 1x), includ-

ing routing parasitics

—

68

680

1

—

pF

kΩ

nA

IREFPROG=0 (Gain = 10x), in-

cluding routing parasitics

Maximum external series im- R_EXTMAX

pedance

Supply current, EM2 bonded I_{CSEN_BOND}

conversions, WARMUP-

MODE=NORMAL, WAR-

MUPCNT=0

12-bit SAR conversions, 20 ms

conversion rate, IREFPROG=7

(Gain = 1x), 10 channels bonded

(total capacitance of 330 pF)¹

326

Delta Modulation conversions, 20

ms conversion rate, IRE-

—

226

—

nA

FPROG=7 (Gain = 1x), 10 chan-

nels bonded (total capacitance of

330 pF)¹

12-bit SAR conversions, 200 ms

conversion rate, IREFPROG=7

(Gain = 1x), 10 channels bonded

—

33

25

—

nA

(total capacitance of 330 pF)¹

Delta Modulation conversions,

200 ms conversion rate, IRE-

FPROG=7 (Gain = 1x), 10 chan-

nels bonded (total capacitance of

330 pF)¹

Supply current, EM2 scan

conversions, WARMUP-

MODE=NORMAL, WAR-

MUPCNT=0

I_{CSEN_EM2}

12-bit SAR conversions, 20 ms

scan rate, IREFPROG=0 (Gain =

—

690

515

—

nA

10x), 8 samples per scan¹

Delta Modulation conversions, 20

ms scan rate, 8 comparisons per

sample (DMCR = 1, DMR = 2),

IREFPROG=0 (Gain = 10x), 8

samples per scan¹

12-bit SAR conversions, 200 ms

scan rate, IREFPROG=0 (Gain =

—

79

57

—

nA

10x), 8 samples per scan¹

Delta Modulation conversions,

200 ms scan rate, 8 comparisons

per sample (DMCR = 1, DMR =

2), IREFPROG=0 (Gain = 10x), 8

samples per scan¹

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Supply current, continuous

conversions, WARMUP-

MODE=KEEPCSENWARM

I_{CSEN_ACTIVE}

SAR or Delta Modulation conver-

sions of 33 pF capacitor, IRE-

FPROG=0 (Gain = 10x), always

on

—

90.5

—

µA

HFPERCLK supply current

I_{CSEN_HFPERCLK}Current contribution from

HFPERCLK when clock to CSEN

block is enabled.

—

2.25

—

µA/MHz

Note:

1. Current is specified with a total external capacitance of 33 pF per channel. Average current is dependent on how long the periph-

eral is actively sampling channels within the scan period, and scales with the number of samples acquired. Supply current for a

specific application can be estimated by multiplying the current per sample by the total number of samples per period (total_cur-

rent = single_sample_current * (number_of_channels * accumulation)).

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

4.1.18 Operational Amplifier (OPAMP)

Unless otherwise indicated, specified conditions are: Non-inverting input configuration, VDD = 3.3 V, DRIVESTRENGTH = 2, MAIN-

OUTEN = 1, C_LOAD= 75 pF with OUTSCALE = 0, or C_LOAD= 37.5 pF with OUTSCALE = 1. Unit gain buffer and 3X-gain connection as

specified in table footnotes^{1 2}

.

Table 4.35. Operational Amplifier (OPAMP)

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Supply voltage (from AVDD) V_OPA

HCMDIS = 0, Rail-to-rail input

range

2

—

3.8

V

HCMDIS = 1

1.62

—

3.8

V

Input voltage

V_IN

HCMDIS = 0, Rail-to-rail input

range

V_VSS

V_OPA

HCMDIS = 1

V_VSS

100

V_VSS

—

V_OPA-1.2

—

V

MΩ

V

Input impedance

Output voltage

R_IN

V_OUT

C_LOAD

—

V_OPA

75

Load capacitance³

OUTSCALE = 0

OUTSCALE = 1

—

pF

Ω

—

37.5

—

Output impedance

R_OUT

DRIVESTRENGTH = 2 or 3, 0.4 V

≤ V_OUT≤ V_OPA- 0.4 V, -8 mA <

I_OUT< 8 mA, Buffer connection,

Full supply range

—

0.25

DRIVESTRENGTH = 0 or 1, 0.4 V

≤ V_OUT≤ V_OPA- 0.4 V, -400 µA <

I_OUT< 400 µA, Buffer connection,

Full supply range

—

0.6

0.4

1

—

Ω

DRIVESTRENGTH = 2 or 3, 0.1 V

≤ V_OUT≤ V_OPA- 0.1 V, -2 mA <

I_OUT< 2 mA, Buffer connection,

Full supply range

DRIVESTRENGTH = 0 or 1, 0.1 V

≤ V_OUT≤ V_OPA- 0.1 V, -100 µA <

I_OUT< 100 µA, Buffer connection,

Full supply range

Internal closed-loop gain

Active current⁴

G_CL

Buffer connection

3x Gain connection

16x Gain connection

0.99

2.93

15.07

—

1

1.01

3.05

16.33

—

-

2.99

15.7

580

-

I_OPA

DRIVESTRENGTH = 3, OUT-

SCALE = 0

µA

DRIVESTRENGTH = 2, OUT-

SCALE = 0

—

176

13

—

µA

DRIVESTRENGTH = 1, OUT-

SCALE = 0

DRIVESTRENGTH = 0, OUT-

SCALE = 0

4.7

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

Parameter

Symbol

Test Condition

Min

—

Typ

135

137

121

109

3.38

Max

—

Unit

dB

Open-loop gain

G_OL

DRIVESTRENGTH = 3

DRIVESTRENGTH = 2

DRIVESTRENGTH = 1

DRIVESTRENGTH = 0

—

dB

—

dB

—

dB

Loop unit-gain frequency⁵

UGF

DRIVESTRENGTH = 3, Buffer

connection

—

MHz

DRIVESTRENGTH = 2, Buffer

connection

—

0.9

132

34

—

MHz

kHz

DRIVESTRENGTH = 1, Buffer

connection

DRIVESTRENGTH = 0, Buffer

connection

kHz

DRIVESTRENGTH = 3, 3x Gain

connection

2.57

0.71

113

28

MHz

kHz

DRIVESTRENGTH = 2, 3x Gain

connection

DRIVESTRENGTH = 1, 3x Gain

connection

DRIVESTRENGTH = 0, 3x Gain

connection

kHz

Phase margin

PM

DRIVESTRENGTH = 3, Buffer

connection

67

°

DRIVESTRENGTH = 2, Buffer

connection

69

°

DRIVESTRENGTH = 1, Buffer

connection

63

°

DRIVESTRENGTH = 0, Buffer

connection

68

°

Output voltage noise

N_OUT

DRIVESTRENGTH = 3, Buffer

connection, 10 Hz - 10 MHz

146

163

170

176

313

271

247

245

µVrms

DRIVESTRENGTH = 2, Buffer

connection, 10 Hz - 10 MHz

DRIVESTRENGTH = 1, Buffer

connection, 10 Hz - 1 MHz

DRIVESTRENGTH = 0, Buffer

connection, 10 Hz - 1 MHz

DRIVESTRENGTH = 3, 3x Gain

connection, 10 Hz - 10 MHz

DRIVESTRENGTH = 2, 3x Gain

connection, 10 Hz - 10 MHz

DRIVESTRENGTH = 1, 3x Gain

connection, 10 Hz - 1 MHz

DRIVESTRENGTH = 0, 3x Gain

connection, 10 Hz - 1 MHz

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Slew rate⁶

SR

DRIVESTRENGTH = 3,

INCBW=1⁷

—

4.7

—

V/µs

DRIVESTRENGTH = 3,

INCBW=0

—

1.5

—

V/µs

DRIVESTRENGTH = 2,

INCBW=1⁷

1.27

DRIVESTRENGTH = 2,

INCBW=0

—

0.42

0.17

—

V/µs

DRIVESTRENGTH = 1,

INCBW=1⁷

DRIVESTRENGTH = 1,

INCBW=0

—

0.058

0.044

—

V/µs

DRIVESTRENGTH = 0,

INCBW=1⁷

DRIVESTRENGTH = 0,

INCBW=0

—

0.015

—

V/µs

Startup time⁸

T_START

V_OSI

DRIVESTRENGTH = 2

—

-2

—

12

2

µs

Input offset voltage

DRIVESTRENGTH = 2 or 3, T =

25 °C

mV

DRIVESTRENGTH = 1 or 0, T =

25 °C

-2

—

2

mV

DRIVESTRENGTH = 2 or 3,

across operating temperature

range

-12

12

DRIVESTRENGTH = 1 or 0,

across operating temperature

range

-30

—

30

mV

DC power supply rejection

ratio⁹

PSRR_DC

Input referred

—

70

90

—

dB

DC common-mode rejection CMRR_DC

ratio⁹

Input referred

Total harmonic distortion

THD_OPA

DRIVESTRENGTH = 2, 3x Gain

connection, 1 kHz, V_OUT= 0.1 V

to V_OPA- 0.1 V

DRIVESTRENGTH = 0, 3x Gain

connection, 0.1 kHz, V_OUT= 0.1 V

to V_OPA- 0.1 V

—

90

—

dB

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

Parameter

Note:

Symbol

Test Condition

Min

Typ

Max

Unit

1. Specified configuration for Unit gain buffer configuration is: INCBW = 0, HCMDIS = 0, RESINSEL = DISABLE. V_INPUT= 0.5 V,

V_OUTPUT= 0.5 V.

2. Specified configuration for 3X-Gain configuration is: INCBW = 1, HCMDIS = 1, RESINSEL = VSS, V_INPUT= 0.5 V, V_OUTPUT= 1.5

V. Nominal voltage gain is 3.

3. If the maximum C_LOADis exceeded, an isolation resistor is required for stability. See AN0038 for more information.

4. Current into the load resistor is excluded. When the OPAMP is connected with closed-loop gain > 1, there will be extra current to

drive the resistor feedback network. The internal resistor feedback network has total resistance of 143.5 kOhm, which will cause

another ~10 µA current when the OPAMP drives 1.5 V between output and ground.

5. In unit gain connection, UGF is the gain-bandwidth product of the OPAMP. In 3x Gain connection, UGF is the gain-bandwidth

product of the OPAMP and 1/3 attenuation of the feedback network.

6. Step between 0.2V and V_OPA-0.2V, 10%-90% rising/falling range.

7. When INCBW is set to 1 the OPAMP bandwidth is increased. This is allowed only when the non-inverting close-loop gain is ≥ 3,

or the OPAMP may not be stable.

8. From enable to output settled. In sample-and-off mode, RC network after OPAMP will contribute extra delay. Settling error < 1mV.

9. When HCMDIS=1 and input common mode transitions the region from V_OPA-1.4V to V_OPA-1V, input offset will change. PSRR

and CMRR specifications do not apply to this transition region.

4.1.19 Pulse Counter (PCNT)

Table 4.36. Pulse Counter (PCNT)

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Input frequency

F_IN

Asynchronous Single and Quad-

rature Modes

—

10

MHz

Sampled Modes with Debounce

filter set to 0.

—

8

kHz

4.1.20 Analog Port (APORT)

Table 4.37. Analog Port (APORT)

Parameter

Symbol

Test Condition

Min

—

Typ

7

Max

—

Unit

µA

Supply current^{1 2}

I_APORT

Operation in EM0/EM1

Operation in EM2/EM3

—

63

—

nA

Note:

1. Supply current increase that occurs when an analog peripheral requests access to APORT. This current is not included in repor-

ted peripheral currents. Additional peripherals requesting access to APORT do not incur further current.

2. Specified current is for continuous APORT operation. In applications where the APORT is not requested continuously (e.g. peri-

odic ACMP requests from LESENSE in EM2), the average current requirements can be estimated by mutiplying the duty cycle of

the requests by the specified continuous current number.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

4.1.21 I2C

4.1.21.1 I2C Standard-mode (Sm)¹

Table 4.38. I2C Standard-mode (Sm)¹

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

SCL clock frequency²

SCL clock low time

SCL clock high time

SDA set-up time

f_SCL

0

—

100

kHz

t_LOW

4.7

4

—

µs

ns

µs

t_HIGH

t_{SU_DAT}

t_{HD_DAT}

250

100

4.7

—

SDA hold time³

3450

—

Repeated START condition t_{SU_STA}

set-up time

(Repeated) START condition t_{HD_STA}

hold time

4

—

µs

STOP condition set-up time t_{SU_STO}

4

—

µs

Bus free time between a

t_BUF

4.7

STOP and START condition

Note:

1. For CLHR set to 0 in the I2Cn_CTRL register.

2. For the minimum HFPERCLK frequency required in Standard-mode, refer to the I2C chapter in the reference manual.

3. The maximum SDA hold time (t_{HD_DAT}) needs to be met only when the device does not stretch the low time of SCL (t_LOW).

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

4.1.21.2 I2C Fast-mode (Fm)¹

Table 4.39. I2C Fast-mode (Fm)¹

Test Condition

Parameter

Symbol

Min

Typ

Max

Unit

SCL clock frequency²

SCL clock low time

SCL clock high time

SDA set-up time

f_SCL

0

—

400

kHz

t_LOW

1.3

0.6

—

µs

ns

µs

t_HIGH

t_{SU_DAT}

t_{HD_DAT}

100

0.6

—

SDA hold time³

900

—

Repeated START condition t_{SU_STA}

set-up time

(Repeated) START condition t_{HD_STA}

hold time

0.6

—

µs

STOP condition set-up time t_{SU_STO}

0.6

1.3

—

µs

Bus free time between a

t_BUF

STOP and START condition

Note:

1. For CLHR set to 1 in the I2Cn_CTRL register.

2. For the minimum HFPERCLK frequency required in Fast-mode, refer to the I2C chapter in the reference manual.

3. The maximum SDA hold time (t_HD,DAT) needs to be met only when the device does not stretch the low time of SCL (t_LOW).

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

4.1.21.3 I2C Fast-mode Plus (Fm+)¹

Table 4.40. I2C Fast-mode Plus (Fm+)¹

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

SCL clock frequency²

SCL clock low time

SCL clock high time

SDA set-up time

f_SCL

0

—

1000

kHz

t_LOW

0.5

0.26

50

—

µs

ns

µs

t_HIGH

t_{SU_DAT}

t_{HD_DAT}

SDA hold time

100

0.26

Repeated START condition t_{SU_STA}

set-up time

(Repeated) START condition t_{HD_STA}

hold time

0.26

—

µs

STOP condition set-up time t_{SU_STO}

0.26

0.5

—

µs

Bus free time between a

t_BUF

STOP and START condition

Note:

1. For CLHR set to 0 or 1 in the I2Cn_CTRL register.

2. For the minimum HFPERCLK frequency required in Fast-mode Plus, refer to the I2C chapter in the reference manual.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

4.1.22 USART SPI

SPI Master Timing

Table 4.41. SPI Master Timing

Test Condition

Parameter

Symbol

Min

Typ

Max

Unit

SCLK period ^{1 2 3}

t_SCLK

2 *

t_HFPERCLK

—

ns

CS to MOSI ^{1 2}

t_{CS_MO}

t_{SCLK_MO}

t_{SU_MI}

-12.5

-8.5

—

14

ns

SCLK to MOSI ^{1 2}

MISO setup time ^{1 2}

10.5

IOVDD = 1.62 V

IOVDD = 3.0 V

90

42

-9

—

ns

MISO hold time ^{1 2}

t_{H_MI}

Note:

1. Applies for both CLKPHA = 0 and CLKPHA = 1 (figure only shows CLKPHA = 0).

2. Measurement done with 8 pF output loading at 10% and 90% of V_DD(figure shows 50% of V_DD).

3. t_HFPERCLKis one period of the selected HFPERCLK.

t_{CS_MO}

CS

t_{SCKL_MO}

SCLK

CLKPOL = 0

t_SCLK

SCLK

CLKPOL = 1

MOSI

MISO

t_{SU_MI}

t_{H_MI}

Figure 4.1. SPI Master Timing Diagram

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Electrical Specifications

SPI Slave Timing

Table 4.42. SPI Slave Timing

Test Condition

Parameter

Symbol

Min

Typ

Max

Unit

SCLK period ^{1 2 3}

t_SCLK

6 *

t_HFPERCLK

—

ns

SCLK high time^{1 2 3}

SCLK low time^{1 2 3}

t_{SCLK_HI}

2.5 *

t_HFPERCLK

—

ns

t_{SCLK_LO}

2.5 *

t_HFPERCLK

CS active to MISO ^{1 2}

CS disable to MISO ^{1 2}

MOSI setup time ^{1 2}

MOSI hold time ^{1 2 3}

SCLK to MISO ^{1 2 3}

t_{CS_ACT_MI}

t_{CS_DIS_MI}

t_{SU_MO}

4

—

70

50

—

ns

12.5

13

t_{H_MO}

t_{SCLK_MI}

6 + 1.5 *

t_HFPERCLK

45 + 2.5 *

t_HFPERCLK

Note:

1. Applies for both CLKPHA = 0 and CLKPHA = 1 (figure only shows CLKPHA = 0).

2. Measurement done with 8 pF output loading at 10% and 90% of V_DD(figure shows 50% of V_DD).

3. t_HFPERCLKis one period of the selected HFPERCLK.

t_{CS_ACT_MI}

CS

t_{CS_DIS_MI}

SCLK

CLKPOL = 0

t_{SCLK_HI}

t_{SCLK_LO}

SCLK

t_{SU_MO}

CLKPOL = 1

t_SCLK

t_{H_MO}

MOSI

MISO

t_{SCLK_MI}

Figure 4.2. SPI Slave Timing Diagram

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Typical Connection Diagrams

5. Typical Connection Diagrams

5.1 Typical BGM13S Connections

Typical connections for the BGM13S module are shown in Figure 5.1 Typical Connections for BGM13S with UART Network Co-Pro-

cessor on page 67. This diagram shows connections for:

• Power supplies

Note: The 1V8 pin is the 1.8V output of the internal DC-DC converer. This pin should be left unconnected. Do not add external de-

coupling or power external circuits from this pin.

• Antenna loop for internal antenna usage or external antenna connection - The RF and ANTENNA pins should be tied together for

correct operation of the module. An optional 0R resistor can be added between RF and ANTENNA, making it possible to measure

the signal between these pins.

• Reset line

Note:

It is recommended to connect the RESETn line to an open-drain IO pin on the host CPU when NCP mode is used.

RESETn includes an internal pull-up to the VBATT supply and input logic levels on RESETn are referenced to VBATT. In systems

where IOVDD is not equal to VBATT, additional considerations may need to be taken.

• UART connection to an external host for Network Co-Processor (NCP) usage (optional)

• 32.768 kHz crystal - Required in applications that must meet 500 ppm Bluetooth Sleep Clock accuracy requirement. More accurate

crystals can be used to reduce the listening window and thereby reduce overall current consumption. Recommended crystal is KDS

part number 1TJG125DP1A0012 or equivalent.

Battery or Regulator

Battery / Supply Voltage

Inductor or capacitor

for antenna fine tuning

RESETn

GPIO

ANTENNA

RF

Use 0R to connect the

antenna to the RF output

PA0 / UART_TX

RX

TX

Host CPU

PA1 / UART_RX

PA2 / UART_CTS

PA3 / UART_RTS

RTS

CTS

Wireless

Module

TCK / SWCLK

(optional)

PF0 / TCK / SWCLK

PF1 / TMS / SWDIO

PF2 / TDO / SWO

PF3 / TDI

PB15 / LFXTAL_P

PB14 / LFXTAL_N

TMS / SWDIO

TDO / SWO

TDI

32.768 kHz XTAL

PTI_FRAME

PTI_DATA

PB13 / PTI_FRAME

PB12 / PTI_DATA

Figure 5.1. Typical Connections for BGM13S with UART Network Co-Processor

Note: It is possible to power the IOVDD pin at 1.8 V from the DC-DC output (1V8). However, the 1V8 output is off by default, and

IOVDD must be powered when programming the device. Any system that powers IOVDD directly from 1V8 must power IOVDD exter-

nally during initial programming.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Typical Connection Diagrams

Two common debug interface options are shown in Figure 5.2 Common Debug Connections on page 68. Refer to AN958 for more

information and additional options.

3 V

1

3

5

7

9

11

13

15

17

19

2

4

6

8

10

12

14

16

18

20

TMS / SWDIO / PF1

TCK / SWCLK / PF0

TDO / SWO / PF2

TDI / PF3

3 V

RESETn

1

3

5

7

9

2

4

6

8

RESETn

UART_TX / PA0

TMS / SWDIO / PF1

PTI_FRAME / PB13

UART_RX / PA1

TDO / SWO / PF2

TCK / SWCLK / PF0

PTI_DATA / PB12

10

Standard ARM Cortex Debug Connector

Mini Simplicity Debug Connector

Figure 5.2. Common Debug Connections

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Layout Guidelines

6. Layout Guidelines

For optimal performance of the BGM13S, please follow the PCB layout guidelines and ground plane recommendations indicated in this

section.

6.1 Layout Guidelines

This section contains generic PCB layout and design guidelines for the BGM13S module. For optimal performance:

• Place the module at the edge of the PCB, as shown in the figures in this chapter.

• Do not place any metal (traces, components, etc.) in the antenna clearance area.

• Connect all ground pads directly to a solid ground plane.

• Place the ground vias as close to the ground pads as possible.

Figure 6.1. BGM13S PCB Top Layer Design

The following rules are recommended for the PCB design:

• Trace to copper clearance 150um

• PTH drill size 300um

• PTH annular ring 150um

Important:

The antenna area must align with the pads precisely. Please refer to the recommended PCB land pattern for exact dimensions.

Figure 6.2. BGM13S PCB Middle and Bottom Layer Design

Figure 6.3. Practical Installation of BGM13S on Application PCB

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Layout Guidelines

Figure 6.4. Poor Layout Designs for the BGM13S

Layout checklist for BGM13S:

1. Antenna area is aligned relative to the module pads as shown in the recommended PCB land pattern.

2. Clearance area within the inner layers and bottom layer is covering the whole antenna area as shown in the layout guidelines.

3. The antenna loop is implemented on the top layer as shown in the layoyt guidelines.

4. All dimensions within the antenna area are precisely as shown in the recommended PCB land pattern.

5. The module is placed near the edge of the PCB with max 1mm indentation.

6. The module is not placed in the corner of the PCB.

6.2 Effect of PCB Width

The BGM13S module should be placed at the center of the PCB edge. The width of the board has an impact to the radiated efficiency

and, more importantly, there should be enough ground plane on both sides of the module for optimal antenna performance. Figure

6.5 BGM13S PCB Top Layer Design on page 70 gives an indcation of ground plane size vs. maximum achievable range.

Figure 6.5. BGM13S PCB Top Layer Design

The impact of the board size to the radiated performance is a generic feature of all PCB and chip antennas and it is not a unique fea-

ture of the BGM13S. For the BGM13S the depth of the board is not important and does not impact the radiated performance.

6.3 Effect of Plastic and Metal Materials

The antenna on the BGM13S is insensitive to the effects of nearby plastic and other materials with low dielectric constant. No separa-

tion between the BGM13S and plastic or other materials is needed. The board thickness has an impact on the module and the addition-

al inductor/capacitor will help to tune the antenna to any board thickness.

In some cases, it may be necessary to fine tune the antenna to optimize for any specific application layout or mechanical design. A

capacitor or an inductor in parallel with the antenna input can be used for optimizing the antenna for any PCB layouts. A capacitor

moves the antenna frequency lower and an inductor moves the antenna frequency higher. Capacitor values between 0.1 pF-10 pF and

inductor values 3.6 nH-10 nH can be used.

The antenna is extremely robust against any objects in close proximity or in direct contact with the antenna and it is recommended not

to adjust the dimensions of the antenna area unless it is clear that a metal object, such as a coin cell battery, within the antenna area is

detuning the antenna.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Layout Guidelines

6.4 Effects of Human Body

Placing the module in contact with or very close to the human body will negatively impact antenna efficiency and reduce range.

6.5 2D Radiation Pattern Plots

Figure 6.6. Typical 2D Radiation Pattern – Front View

Figure 6.7. Typical 2D Radiation Pattern – Side View

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Layout Guidelines

Figure 6.8. Typical 2D Radiation Pattern – Top View

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

7. Pin Definitions

7.1 BGM13S Device Pinout

Figure 7.1. BGM13S Device Pinout

The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the sup-

ported features for each GPIO pin, see 7.2 GPIO Functionality Table or 7.3 Alternate Functionality Overview.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

Table 7.1. BGM13S Device Pinout

Pin Name

Pin(s) Description

1

4

5

20

31

VSS

45

46

48

49

50

51

Ground

ANTENNA

2

50 Ohm input pin for internal antenna.

50 Ohm I/O for external antenna con-

nection.

RF

3

PD9

6

GPIO (5V)

PD10

PD12

PD14

PA0

7

GPIO (5V)

GPIO

PD11

PD13

PD15

PA1

8

GPIO (5V)

GPIO

9

10

12

14

16

18

21

11

13

15

17

19

GPIO

PA2

GPIO

PA3

GPIO

PA4

GPIO

PA5

GPIO (5V)

GPIO

PB15

GPIO

PB14

1.8V output of the internal DC-DC con-

verter. Internally decoupled - do not add

external decoupling.

Battery supply voltage input to the inter-

nal DC-DC and analog supply.

VBATT

22

1V8

23

IOVDD

PC6

24

26

28

30

33

35

37

39

41

Digital IO power supply.

GPIO (5V)

GPIO

NC

PC7

PF2

25

27

29

32

34

36

38

40

42

No Connect.

GPIO (5V)

GPIO

PC8

PC9

PC10

PF0

PC11

PF1

PB13

PB11

PF4

PB12

PF3

GPIO

GPIO (5V)

PF5

PF6

Reset input, active low. This pin is inter-

nally pulled up to AVDD. To apply an

external reset source to this pin, it is re-

quired to only drive this pin low during

reset, and let the internal pull-up ensure

that reset is released.

PF7

43

47

GPIO (5V)

RESETn

44

ANT_GND

Antenna ground.

Note:

1. GPIO with 5V tolerance are indicated by (5V).

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

7.2 GPIO Functionality Table

A wide selection of alternate functionality is available for multiplexing to various pins. The following table shows the name of each GPIO

pin, followed by the functionality available on that pin. Refer to 7.3 Alternate Functionality Overview for a list of GPIO locations available

for each function.

Table 7.2. GPIO Functionality Table

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

US0_TX #0

Radio

Other

TIM0_CC0 #0

TIM0_CC1 #31

TIM0_CC2 #30

TIM0_CDTI0 #29

TIM0_CDTI1 #28

TIM0_CDTI2 #27

TIM1_CC0 #0

US0_RX #31

US0_CLK #30

US0_CS #29

US0_CTS #28

US0_RTS #27

US1_TX #0

CMU_CLK1 #0

PRS_CH6 #0

PRS_CH7 #10

PRS_CH8 #9

PRS_CH9 #8

ACMP0_O #0

ACMP1_O #0

LES_CH8

FRC_DCLK #0

FRC_DOUT #31

BUSDY

BUSCX

US1_RX #31

US1_CLK #30

US1_CS #29

US1_CTS #28

US1_RTS #27

LEU0_TX #0

LEU0_RX #31

I2C0_SDA #0

I2C0_SCL #31

FRC_DFRAME #30

MODEM_DCLK #0

MODEM_DIN #31

MODEM_DOUT #30

PA0

TIM1_CC1 #31

TIM1_CC2 #30

TIM1_CC3 #29

WTIM0_CC0 #0

LETIM0_OUT0 #0

LETIM0_OUT1 #31

PCNT0_S0IN #0

PCNT0_S1IN #31

ADC0_EXTN

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

US0_TX #1

Radio

Other

TIM0_CC0 #1

TIM0_CC1 #0

US0_RX #0

US0_CLK #31

US0_CS #30

US0_CTS #29

US0_RTS #28

US1_TX #1

TIM0_CC2 #31

TIM0_CDTI0 #30

TIM0_CDTI1 #29

TIM0_CDTI2 #28

TIM1_CC0 #1

CMU_CLK0 #0

PRS_CH6 #1

PRS_CH7 #0

PRS_CH8 #10

PRS_CH9 #9

ACMP0_O #1

ACMP1_O #1

LES_CH9

FRC_DCLK #1

FRC_DOUT #0

BUSCY

BUSDX

US1_RX #0

FRC_DFRAME #31

MODEM_DCLK #1

MODEM_DIN #0

MODEM_DOUT #31

PA1

TIM1_CC1 #0

ADC0_EXTP

VDAC0_EXT

US1_CLK #31

US1_CS #30

US1_CTS #29

US1_RTS #28

LEU0_TX #1

LEU0_RX #0

I2C0_SDA #1

I2C0_SCL #0

US0_TX #2

TIM1_CC2 #31

TIM1_CC3 #30

WTIM0_CC0 #1

LETIM0_OUT0 #1

LETIM0_OUT1 #0

PCNT0_S0IN #1

PCNT0_S1IN #0

TIM0_CC0 #2

TIM0_CC1 #1

US0_RX #1

TIM0_CC2 #0

US0_CLK #0

US0_CS #31

US0_CTS #30

US0_RTS #29

US1_TX #2

TIM0_CDTI0 #31

TIM0_CDTI1 #30

TIM0_CDTI2 #29

TIM1_CC0 #2

PRS_CH6 #2

PRS_CH7 #1

PRS_CH8 #0

PRS_CH9 #10

ACMP0_O #2

ACMP1_O #2

LES_CH10

FRC_DCLK #2

FRC_DOUT #1

VDAC0_OUT1ALT /

OPA1_OUTALT #1

TIM1_CC1 #1

US1_RX #1

FRC_DFRAME #0

MODEM_DCLK #2

MODEM_DIN #1

MODEM_DOUT #0

BUSDY

BUSCX

OPA0_P

PA2

TIM1_CC2 #0

US1_CLK #0

US1_CS #31

US1_CTS #30

US1_RTS #29

LEU0_TX #2

LEU0_RX #1

I2C0_SDA #2

I2C0_SCL #1

TIM1_CC3 #31

WTIM0_CC0 #2

WTIM0_CC1 #0

LETIM0_OUT0 #2

LETIM0_OUT1 #1

PCNT0_S0IN #2

PCNT0_S1IN #1

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

US0_TX #3

Radio

Other

TIM0_CC0 #3

TIM0_CC1 #2

US0_RX #2

TIM0_CC2 #1

US0_CLK #1

US0_CS #0

TIM0_CDTI0 #0

TIM0_CDTI1 #31

TIM0_CDTI2 #30

TIM1_CC0 #3

US0_CTS #31

US0_RTS #30

US1_TX #3

PRS_CH6 #3

PRS_CH7 #2

PRS_CH8 #1

PRS_CH9 #0

ACMP0_O #3

ACMP1_O #3

LES_CH11

FRC_DCLK #3

FRC_DOUT #2

BUSCY

BUSDX

TIM1_CC1 #2

US1_RX #2

FRC_DFRAME #1

MODEM_DCLK #3

MODEM_DIN #2

MODEM_DOUT #1

PA3

TIM1_CC2 #1

US1_CLK #1

US1_CS #0

VDAC0_OUT0 /

OPA0_OUT

TIM1_CC3 #0

WTIM0_CC0 #3

WTIM0_CC1 #1

LETIM0_OUT0 #3

LETIM0_OUT1 #2

PCNT0_S0IN #3

PCNT0_S1IN #2

TIM0_CC0 #4

US1_CTS #31

US1_RTS #30

LEU0_TX #3

LEU0_RX #2

I2C0_SDA #3

I2C0_SCL #2

GPIO_EM4WU8

US0_TX #4

US0_RX #3

US0_CLK #2

US0_CS #1

US0_CTS #0

US0_RTS #31

US1_TX #4

TIM0_CC1 #3

TIM0_CC2 #2

TIM0_CDTI0 #1

TIM0_CDTI1 #0

TIM0_CDTI2 #31

TIM1_CC0 #4

PRS_CH6 #4

PRS_CH7 #3

PRS_CH8 #2

PRS_CH9 #1

ACMP0_O #4

ACMP1_O #4

LES_CH12

FRC_DCLK #4

FRC_DOUT #3

VDAC0_OUT1ALT /

OPA1_OUTALT #2

TIM1_CC1 #3

US1_RX #3

US1_CLK #2

US1_CS #1

US1_CTS #0

US1_RTS #31

LEU0_TX #4

LEU0_RX #3

I2C0_SDA #4

I2C0_SCL #3

FRC_DFRAME #2

MODEM_DCLK #4

MODEM_DIN #3

MODEM_DOUT #2

BUSDY

BUSCX

OPA0_N

PA4

TIM1_CC2 #2

TIM1_CC3 #1

WTIM0_CC0 #4

WTIM0_CC1 #2

WTIM0_CC2 #0

LETIM0_OUT0 #4

LETIM0_OUT1 #3

PCNT0_S0IN #4

PCNT0_S1IN #3

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

US0_TX #5

Radio

Other

US0_RX #4

US0_CLK #3

US0_CS #2

TIM0_CC0 #5

TIM0_CC1 #4

US0_CTS #1

US0_RTS #0

US1_TX #5

TIM0_CC2 #3

TIM0_CDTI0 #2

TIM0_CDTI1 #1

TIM0_CDTI2 #0

TIM1_CC0 #5

CMU_CLKI0 #4

PRS_CH6 #5

PRS_CH7 #4

PRS_CH8 #3

PRS_CH9 #2

ACMP0_O #5

ACMP1_O #5

LES_CH13

US1_RX #4

US1_CLK #3

US1_CS #2

FRC_DCLK #5

FRC_DOUT #4

VDAC0_OUT0ALT /

OPA0_OUTALT #0

TIM1_CC1 #4

US1_CTS #1

US1_RTS #0

US2_TX #0

FRC_DFRAME #3

MODEM_DCLK #5

MODEM_DIN #4

MODEM_DOUT #3

PA5

TIM1_CC2 #3

BUSCY

BUSDX

TIM1_CC3 #2

WTIM0_CC0 #5

WTIM0_CC1 #3

WTIM0_CC2 #1

LETIM0_OUT0 #5

LETIM0_OUT1 #4

PCNT0_S0IN #5

PCNT0_S1IN #4

US2_RX #31

US2_CLK #30

US2_CS #29

US2_CTS #28

US2_RTS #27

LEU0_TX #5

LEU0_RX #4

I2C0_SDA #5

I2C0_SCL #4

ETM_TCLK #1

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

Radio

Other

TIM0_CC0 #6

TIM0_CC1 #5

TIM0_CC2 #4

US0_TX #6

US0_RX #5

US0_CLK #4

US0_CS #3

US0_CTS #2

US0_RTS #1

US1_TX #6

US1_RX #5

US1_CLK #4

US1_CS #3

US1_CTS #2

US1_RTS #1

LEU0_TX #6

LEU0_RX #5

I2C0_SDA #6

I2C0_SCL #5

TIM0_CDTI0 #3

TIM0_CDTI1 #2

TIM0_CDTI2 #1

TIM1_CC0 #6

TIM1_CC1 #5

FRC_DCLK #6

FRC_DOUT #5

PRS_CH6 #6

PRS_CH7 #5

PRS_CH8 #4

PRS_CH9 #3

ACMP0_O #6

ACMP1_O #6

TIM1_CC2 #4

BUSCY

BUSDX

OPA2_P

TIM1_CC3 #3

FRC_DFRAME #4

MODEM_DCLK #6

MODEM_DIN #5

MODEM_DOUT #4

PB11

WTIM0_CC0 #15

WTIM0_CC1 #13

WTIM0_CC2 #11

WTIM0_CDTI0 #7

WTIM0_CDTI1 #5

WTIM0_CDTI2 #3

LETIM0_OUT0 #6

LETIM0_OUT1 #5

PCNT0_S0IN #6

PCNT0_S1IN #5

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

Radio

Other

TIM0_CC0 #7

TIM0_CC1 #6

TIM0_CC2 #5

US0_TX #7

US0_RX #6

US0_CLK #5

US0_CS #4

US0_CTS #3

US0_RTS #2

US1_TX #7

US1_RX #6

US1_CLK #5

US1_CS #4

US1_CTS #3

US1_RTS #2

LEU0_TX #7

LEU0_RX #6

I2C0_SDA #7

I2C0_SCL #6

TIM0_CDTI0 #4

TIM0_CDTI1 #3

TIM0_CDTI2 #2

TIM1_CC0 #7

TIM1_CC1 #6

FRC_DCLK #7

FRC_DOUT #6

PRS_CH6 #7

PRS_CH7 #6

PRS_CH8 #5

PRS_CH9 #4

ACMP0_O #7

ACMP1_O #7

TIM1_CC2 #5

BUSDY

BUSCX

TIM1_CC3 #4

FRC_DFRAME #5

MODEM_DCLK #7

MODEM_DIN #6

MODEM_DOUT #5

PB12

WTIM0_CC0 #16

WTIM0_CC1 #14

WTIM0_CC2 #12

WTIM0_CDTI0 #8

WTIM0_CDTI1 #6

WTIM0_CDTI2 #4

LETIM0_OUT0 #7

LETIM0_OUT1 #6

PCNT0_S0IN #7

PCNT0_S1IN #6

OPA2_OUT

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

Radio

Other

TIM0_CC0 #8

TIM0_CC1 #7

TIM0_CC2 #6

US0_TX #8

US0_RX #7

US0_CLK #6

US0_CS #5

US0_CTS #4

US0_RTS #3

US1_TX #8

US1_RX #7

US1_CLK #6

US1_CS #5

US1_CTS #4

US1_RTS #3

LEU0_TX #8

LEU0_RX #7

I2C0_SDA #8

I2C0_SCL #7

TIM0_CDTI0 #5

TIM0_CDTI1 #4

TIM0_CDTI2 #3

TIM1_CC0 #8

CMU_CLKI0 #0

PRS_CH6 #8

PRS_CH7 #7

PRS_CH8 #6

PRS_CH9 #5

ACMP0_O #8

ACMP1_O #8

DBG_SWO #1

GPIO_EM4WU9

TIM1_CC1 #7

FRC_DCLK #8

FRC_DOUT #7

TIM1_CC2 #6

BUSCY

BUSDX

OPA2_N

TIM1_CC3 #5

FRC_DFRAME #6

MODEM_DCLK #8

MODEM_DIN #7

MODEM_DOUT #6

PB13

WTIM0_CC0 #17

WTIM0_CC1 #15

WTIM0_CC2 #13

WTIM0_CDTI0 #9

WTIM0_CDTI1 #7

WTIM0_CDTI2 #5

LETIM0_OUT0 #8

LETIM0_OUT1 #7

PCNT0_S0IN #8

PCNT0_S1IN #7

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

Radio

Other

TIM0_CC0 #9

TIM0_CC1 #8

TIM0_CC2 #7

US0_TX #9

US0_RX #8

US0_CLK #7

US0_CS #6

US0_CTS #5

US0_RTS #4

US1_TX #9

US1_RX #8

US1_CLK #7

US1_CS #6

US1_CTS #5

US1_RTS #4

LEU0_TX #9

LEU0_RX #8

I2C0_SDA #9

I2C0_SCL #8

TIM0_CDTI0 #6

TIM0_CDTI1 #5

TIM0_CDTI2 #4

TIM1_CC0 #9

CMU_CLK1 #1

PRS_CH6 #9

PRS_CH7 #8

PRS_CH8 #7

PRS_CH9 #6

ACMP0_O #9

ACMP1_O #9

TIM1_CC1 #8

FRC_DCLK #9

FRC_DOUT #8

TIM1_CC2 #7

BUSDY

BUSCX

TIM1_CC3 #6

FRC_DFRAME #7

MODEM_DCLK #9

MODEM_DIN #8

MODEM_DOUT #7

PB14

WTIM0_CC0 #18

WTIM0_CC1 #16

WTIM0_CC2 #14

WTIM0_CDTI0 #10

WTIM0_CDTI1 #8

WTIM0_CDTI2 #6

LETIM0_OUT0 #9

LETIM0_OUT1 #8

PCNT0_S0IN #9

PCNT0_S1IN #8

LFXTAL_N

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

Radio

Other

TIM0_CC0 #10

TIM0_CC1 #9

TIM0_CC2 #8

US0_TX #10

US0_RX #9

TIM0_CDTI0 #7

TIM0_CDTI1 #6

TIM0_CDTI2 #5

TIM1_CC0 #10

TIM1_CC1 #9

US0_CLK #8

US0_CS #7

US0_CTS #6

US0_RTS #5

US1_TX #10

US1_RX #9

CMU_CLK0 #1

PRS_CH6 #10

PRS_CH7 #9

PRS_CH8 #8

PRS_CH9 #7

ACMP0_O #10

ACMP1_O #10

FRC_DCLK #10

FRC_DOUT #9

TIM1_CC2 #8

BUSCY

BUSDX

TIM1_CC3 #7

FRC_DFRAME #8

MODEM_DCLK #10

MODEM_DIN #9

MODEM_DOUT #8

PB15

WTIM0_CC0 #19

WTIM0_CC1 #17

WTIM0_CC2 #15

WTIM0_CDTI0 #11

WTIM0_CDTI1 #9

WTIM0_CDTI2 #7

LETIM0_OUT0 #10

LETIM0_OUT1 #9

PCNT0_S0IN #10

PCNT0_S1IN #9

US1_CLK #8

US1_CS #7

LFXTAL_P

US1_CTS #6

US1_RTS #5

LEU0_TX #10

LEU0_RX #9

I2C0_SDA #10

I2C0_SCL #9

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

Radio

Other

TIM0_CC0 #11

TIM0_CC1 #10

TIM0_CC2 #9

US0_TX #11

US0_RX #10

US0_CLK #9

US0_CS #8

TIM0_CDTI0 #8

TIM0_CDTI1 #7

TIM0_CDTI2 #6

TIM1_CC0 #11

TIM1_CC1 #10

TIM1_CC2 #9

CMU_CLK0 #2

CMU_CLKI0 #2

PRS_CH0 #8

US0_CTS #7

US0_RTS #6

US1_TX #11

US1_RX #10

US1_CLK #9

US1_CS #8

FRC_DCLK #11

FRC_DOUT #10

PRS_CH9 #11

PRS_CH10 #0

PRS_CH11 #5

ACMP0_O #11

ACMP1_O #11

ETM_TCLK #3

BUSBY

BUSAX

TIM1_CC3 #8

FRC_DFRAME #9

MODEM_DCLK #11

MODEM_DIN #10

MODEM_DOUT #9

PC6

WTIM0_CC0 #26

WTIM0_CC1 #24

WTIM0_CC2 #22

WTIM0_CDTI0 #18

WTIM0_CDTI1 #16

WTIM0_CDTI2 #14

LETIM0_OUT0 #11

LETIM0_OUT1 #10

PCNT0_S0IN #11

PCNT0_S1IN #10

US1_CTS #7

US1_RTS #6

LEU0_TX #11

LEU0_RX #10

I2C0_SDA #11

I2C0_SCL #10

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

Radio

Other

TIM0_CC0 #12

TIM0_CC1 #11

TIM0_CC2 #10

TIM0_CDTI0 #9

TIM0_CDTI1 #8

TIM0_CDTI2 #7

TIM1_CC0 #12

TIM1_CC1 #11

TIM1_CC2 #10

TIM1_CC3 #9

US0_TX #12

US0_RX #11

US0_CLK #10

US0_CS #9

US0_CTS #8

US0_RTS #7

US1_TX #12

US1_RX #11

US1_CLK #10

US1_CS #9

CMU_CLK1 #2

PRS_CH0 #9

PRS_CH9 #12

PRS_CH10 #1

PRS_CH11 #0

ACMP0_O #12

ACMP1_O #12

ETM_TD0

FRC_DCLK #12

FRC_DOUT #11

BUSAY

BUSBX

FRC_DFRAME #10

MODEM_DCLK #12

MODEM_DIN #11

MODEM_DOUT #10

PC7

WTIM0_CC0 #27

WTIM0_CC1 #25

WTIM0_CC2 #23

WTIM0_CDTI0 #19

WTIM0_CDTI1 #17

WTIM0_CDTI2 #15

LETIM0_OUT0 #12

LETIM0_OUT1 #11

PCNT0_S0IN #12

PCNT0_S1IN #11

US1_CTS #8

US1_RTS #7

LEU0_TX #12

LEU0_RX #11

I2C0_SDA #12

I2C0_SCL #11

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

Radio

Other

TIM0_CC0 #13

TIM0_CC1 #12

TIM0_CC2 #11

US0_TX #13

US0_RX #12

US0_CLK #11

US0_CS #10

US0_CTS #9

US0_RTS #8

US1_TX #13

US1_RX #12

US1_CLK #11

US1_CS #10

US1_CTS #9

US1_RTS #8

LEU0_TX #13

LEU0_RX #12

I2C0_SDA #13

I2C0_SCL #12

TIM0_CDTI0 #10

TIM0_CDTI1 #9

TIM0_CDTI2 #8

TIM1_CC0 #13

PRS_CH0 #10

PRS_CH9 #13

PRS_CH10 #2

PRS_CH11 #1

ACMP0_O #13

ACMP1_O #13

ETM_TD1

TIM1_CC1 #12

FRC_DCLK #13

FRC_DOUT #12

TIM1_CC2 #11

BUSBY

BUSAX

TIM1_CC3 #10

FRC_DFRAME #11

MODEM_DCLK #13

MODEM_DIN #12

MODEM_DOUT #11

PC8

WTIM0_CC0 #28

WTIM0_CC1 #26

WTIM0_CC2 #24

WTIM0_CDTI0 #20

WTIM0_CDTI1 #18

WTIM0_CDTI2 #16

LETIM0_OUT0 #13

LETIM0_OUT1 #12

PCNT0_S0IN #13

PCNT0_S1IN #12

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

Radio

Other

TIM0_CC0 #14

TIM0_CC1 #13

TIM0_CC2 #12

US0_TX #14

US0_RX #13

US0_CLK #12

US0_CS #11

US0_CTS #10

US0_RTS #9

US1_TX #14

US1_RX #13

US1_CLK #12

US1_CS #11

US1_CTS #10

US1_RTS #9

LEU0_TX #14

LEU0_RX #13

I2C0_SDA #14

I2C0_SCL #13

TIM0_CDTI0 #11

TIM0_CDTI1 #10

TIM0_CDTI2 #9

TIM1_CC0 #14

PRS_CH0 #11

PRS_CH9 #14

PRS_CH10 #3

PRS_CH11 #2

ACMP0_O #14

ACMP1_O #14

ETM_TD2

TIM1_CC1 #13

FRC_DCLK #14

FRC_DOUT #13

TIM1_CC2 #12

BUSAY

BUSBX

TIM1_CC3 #11

FRC_DFRAME #12

MODEM_DCLK #14

MODEM_DIN #13

MODEM_DOUT #12

PC9

WTIM0_CC0 #29

WTIM0_CC1 #27

WTIM0_CC2 #25

WTIM0_CDTI0 #21

WTIM0_CDTI1 #19

WTIM0_CDTI2 #17

LETIM0_OUT0 #14

LETIM0_OUT1 #13

PCNT0_S0IN #14

PCNT0_S1IN #13

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

Radio

Other

TIM0_CC0 #15

TIM0_CC1 #14

US0_TX #15

US0_RX #14

US0_CLK #13

US0_CS #12

US0_CTS #11

US0_RTS #10

US1_TX #15

US1_RX #14

US1_CLK #13

US1_CS #12

US1_CTS #11

US1_RTS #10

LEU0_TX #15

LEU0_RX #14

I2C0_SDA #15

I2C0_SCL #14

I2C1_SDA #19

I2C1_SCL #18

TIM0_CC2 #13

TIM0_CDTI0 #12

TIM0_CDTI1 #11

TIM0_CDTI2 #10

TIM1_CC0 #15

CMU_CLK1 #3

PRS_CH0 #12

PRS_CH9 #15

PRS_CH10 #4

PRS_CH11 #3

ACMP0_O #15

ACMP1_O #15

ETM_TD3

TIM1_CC1 #14

FRC_DCLK #15

FRC_DOUT #14

TIM1_CC2 #13

BUSBY

BUSAX

TIM1_CC3 #12

FRC_DFRAME #13

MODEM_DCLK #15

MODEM_DIN #14

MODEM_DOUT #13

PC10

WTIM0_CC0 #30

WTIM0_CC1 #28

WTIM0_CC2 #26

WTIM0_CDTI0 #22

WTIM0_CDTI1 #20

WTIM0_CDTI2 #18

LETIM0_OUT0 #15

LETIM0_OUT1 #14

PCNT0_S0IN #15

PCNT0_S1IN #14

GPIO_EM4WU12

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Rev. 1.1 | 88

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

Radio

Other

TIM0_CC0 #16

TIM0_CC1 #15

US0_TX #16

US0_RX #15

US0_CLK #14

US0_CS #13

US0_CTS #12

US0_RTS #11

US1_TX #16

US1_RX #15

US1_CLK #14

US1_CS #13

US1_CTS #12

US1_RTS #11

LEU0_TX #16

LEU0_RX #15

I2C0_SDA #16

I2C0_SCL #15

I2C1_SDA #20

I2C1_SCL #19

TIM0_CC2 #14

TIM0_CDTI0 #13

TIM0_CDTI1 #12

TIM0_CDTI2 #11

TIM1_CC0 #16

CMU_CLK0 #3

PRS_CH0 #13

PRS_CH9 #16

PRS_CH10 #5

PRS_CH11 #4

ACMP0_O #16

ACMP1_O #16

DBG_SWO #3

TIM1_CC1 #15

FRC_DCLK #16

FRC_DOUT #15

TIM1_CC2 #14

BUSAY

BUSBX

TIM1_CC3 #13

FRC_DFRAME #14

MODEM_DCLK #16

MODEM_DIN #15

MODEM_DOUT #14

PC11

WTIM0_CC0 #31

WTIM0_CC1 #29

WTIM0_CC2 #27

WTIM0_CDTI0 #23

WTIM0_CDTI1 #21

WTIM0_CDTI2 #19

LETIM0_OUT0 #16

LETIM0_OUT1 #15

PCNT0_S0IN #16

PCNT0_S1IN #15

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Rev. 1.1 | 89

®

BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

Radio

Other

TIM0_CC0 #17

TIM0_CC1 #16

US0_TX #17

US0_RX #16

US0_CLK #15

US0_CS #14

US0_CTS #13

US0_RTS #12

US1_TX #17

US1_RX #16

US1_CLK #15

US1_CS #14

US1_CTS #13

US1_RTS #12

LEU0_TX #17

LEU0_RX #16

I2C0_SDA #17

I2C0_SCL #16

TIM0_CC2 #15

TIM0_CDTI0 #14

TIM0_CDTI1 #13

TIM0_CDTI2 #12

TIM1_CC0 #17

CMU_CLK0 #4

PRS_CH3 #8

PRS_CH4 #0

PRS_CH5 #6

PRS_CH6 #11

ACMP0_O #17

ACMP1_O #17

LES_CH1

FRC_DCLK #17

FRC_DOUT #16

TIM1_CC1 #16

TIM1_CC2 #15

BUSCY

BUSDX

FRC_DFRAME #15

MODEM_DCLK #17

MODEM_DIN #16

MODEM_DOUT #15

PD9

TIM1_CC3 #14

WTIM0_CC1 #31

WTIM0_CC2 #29

WTIM0_CDTI0 #25

WTIM0_CDTI1 #23

WTIM0_CDTI2 #21

LETIM0_OUT0 #17

LETIM0_OUT1 #16

PCNT0_S0IN #17

PCNT0_S1IN #16

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Rev. 1.1 | 90

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

Radio

Other

TIM0_CC0 #18

TIM0_CC1 #17

US0_TX #18

US0_RX #17

US0_CLK #16

US0_CS #15

US0_CTS #14

US0_RTS #13

US1_TX #18

US1_RX #17

US1_CLK #16

US1_CS #15

US1_CTS #14

US1_RTS #13

LEU0_TX #18

LEU0_RX #17

I2C0_SDA #18

I2C0_SCL #17

TIM0_CC2 #16

TIM0_CDTI0 #15

TIM0_CDTI1 #14

TIM0_CDTI2 #13

TIM1_CC0 #18

CMU_CLK1 #4

PRS_CH3 #9

PRS_CH4 #1

PRS_CH5 #0

PRS_CH6 #12

ACMP0_O #18

ACMP1_O #18

LES_CH2

FRC_DCLK #18

FRC_DOUT #17

TIM1_CC1 #17

BUSDY

BUSCX

TIM1_CC2 #16

FRC_DFRAME #16

MODEM_DCLK #18

MODEM_DIN #17

MODEM_DOUT #16

PD10

TIM1_CC3 #15

WTIM0_CC2 #30

WTIM0_CDTI0 #26

WTIM0_CDTI1 #24

WTIM0_CDTI2 #22

LETIM0_OUT0 #18

LETIM0_OUT1 #17

PCNT0_S0IN #18

PCNT0_S1IN #17

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Rev. 1.1 | 91

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

Radio

Other

TIM0_CC0 #19

TIM0_CC1 #18

US0_TX #19

US0_RX #18

US0_CLK #17

US0_CS #16

US0_CTS #15

US0_RTS #14

US1_TX #19

US1_RX #18

US1_CLK #17

US1_CS #16

US1_CTS #15

US1_RTS #14

LEU0_TX #19

LEU0_RX #18

I2C0_SDA #19

I2C0_SCL #18

TIM0_CC2 #17

TIM0_CDTI0 #16

TIM0_CDTI1 #15

TIM0_CDTI2 #14

TIM1_CC0 #19

PRS_CH3 #10

PRS_CH4 #2

PRS_CH5 #1

PRS_CH6 #13

ACMP0_O #19

ACMP1_O #19

LES_CH3

FRC_DCLK #19

FRC_DOUT #18

TIM1_CC1 #18

BUSCY

BUSDX

TIM1_CC2 #17

FRC_DFRAME #17

MODEM_DCLK #19

MODEM_DIN #18

MODEM_DOUT #17

PD11

TIM1_CC3 #16

WTIM0_CC2 #31

WTIM0_CDTI0 #27

WTIM0_CDTI1 #25

WTIM0_CDTI2 #23

LETIM0_OUT0 #19

LETIM0_OUT1 #18

PCNT0_S0IN #19

PCNT0_S1IN #18

TIM0_CC0 #20

US0_TX #20

US0_RX #19

US0_CLK #18

US0_CS #17

US0_CTS #16

US0_RTS #15

US1_TX #20

US1_RX #19

US1_CLK #18

US1_CS #17

US1_CTS #16

US1_RTS #15

LEU0_TX #20

LEU0_RX #19

I2C0_SDA #20

I2C0_SCL #19

TIM0_CC1 #19

TIM0_CC2 #18

TIM0_CDTI0 #17

TIM0_CDTI1 #16

TIM0_CDTI2 #15

TIM1_CC0 #20

PRS_CH3 #11

PRS_CH4 #3

PRS_CH5 #2

PRS_CH6 #14

ACMP0_O #20

ACMP1_O #20

LES_CH4

FRC_DCLK #20

FRC_DOUT #19

VDAC0_OUT1ALT /

OPA1_OUTALT #0

TIM1_CC1 #19

FRC_DFRAME #18

MODEM_DCLK #20

MODEM_DIN #19

MODEM_DOUT #18

PD12

TIM1_CC2 #18

BUSDY

BUSCX

TIM1_CC3 #17

WTIM0_CDTI0 #28

WTIM0_CDTI1 #26

WTIM0_CDTI2 #24

LETIM0_OUT0 #20

LETIM0_OUT1 #19

PCNT0_S0IN #20

PCNT0_S1IN #19

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Rev. 1.1 | 92

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

Radio

Other

TIM0_CC0 #21

US0_TX #21

US0_RX #20

US0_CLK #19

US0_CS #18

US0_CTS #17

US0_RTS #16

US1_TX #21

US1_RX #20

US1_CLK #19

US1_CS #18

US1_CTS #17

US1_RTS #16

LEU0_TX #21

LEU0_RX #20

I2C0_SDA #21

I2C0_SCL #20

TIM0_CC1 #20

TIM0_CC2 #19

TIM0_CDTI0 #18

TIM0_CDTI1 #17

TIM0_CDTI2 #16

TIM1_CC0 #21

PRS_CH3 #12

PRS_CH4 #4

PRS_CH5 #3

PRS_CH6 #15

ACMP0_O #21

ACMP1_O #21

LES_CH5

FRC_DCLK #21

FRC_DOUT #20

VDAC0_OUT0ALT /

OPA0_OUTALT #1

TIM1_CC1 #20

FRC_DFRAME #19

MODEM_DCLK #21

MODEM_DIN #20

MODEM_DOUT #19

BUSCY

BUSDX

OPA1_P

PD13

TIM1_CC2 #19

TIM1_CC3 #18

WTIM0_CDTI0 #29

WTIM0_CDTI1 #27

WTIM0_CDTI2 #25

LETIM0_OUT0 #21

LETIM0_OUT1 #20

PCNT0_S0IN #21

PCNT0_S1IN #20

TIM0_CC0 #22

US0_TX #22

US0_RX #21

US0_CLK #20

US0_CS #19

US0_CTS #18

US0_RTS #17

US1_TX #22

US1_RX #21

US1_CLK #20

US1_CS #19

US1_CTS #18

US1_RTS #17

LEU0_TX #22

LEU0_RX #21

I2C0_SDA #22

I2C0_SCL #21

TIM0_CC1 #21

TIM0_CC2 #20

TIM0_CDTI0 #19

TIM0_CDTI1 #18

TIM0_CDTI2 #17

TIM1_CC0 #22

CMU_CLK0 #5

PRS_CH3 #13

PRS_CH4 #5

PRS_CH5 #4

PRS_CH6 #16

ACMP0_O #22

ACMP1_O #22

LES_CH6

FRC_DCLK #22

FRC_DOUT #21

BUSDY

BUSCX

TIM1_CC1 #21

FRC_DFRAME #20

MODEM_DCLK #22

MODEM_DIN #21

MODEM_DOUT #20

PD14

TIM1_CC2 #20

VDAC0_OUT1 /

OPA1_OUT

TIM1_CC3 #19

WTIM0_CDTI0 #30

WTIM0_CDTI1 #28

WTIM0_CDTI2 #26

LETIM0_OUT0 #22

LETIM0_OUT1 #21

PCNT0_S0IN #22

PCNT0_S1IN #21

GPIO_EM4WU4

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Rev. 1.1 | 93

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

Radio

Other

TIM0_CC0 #23

US0_TX #23

US0_RX #22

US0_CLK #21

US0_CS #20

US0_CTS #19

US0_RTS #18

US1_TX #23

US1_RX #22

US1_CLK #21

US1_CS #20

US1_CTS #19

US1_RTS #18

LEU0_TX #23

LEU0_RX #22

I2C0_SDA #23

I2C0_SCL #22

TIM0_CC1 #22

TIM0_CC2 #21

TIM0_CDTI0 #20

TIM0_CDTI1 #19

TIM0_CDTI2 #18

TIM1_CC0 #23

CMU_CLK1 #5

PRS_CH3 #14

PRS_CH4 #6

PRS_CH5 #5

PRS_CH6 #17

ACMP0_O #23

ACMP1_O #23

LES_CH7

FRC_DCLK #23

FRC_DOUT #22

VDAC0_OUT0ALT /

OPA0_OUTALT #2

TIM1_CC1 #22

FRC_DFRAME #21

MODEM_DCLK #23

MODEM_DIN #22

MODEM_DOUT #21

BUSCY

BUSDX

OPA1_N

PD15

TIM1_CC2 #21

TIM1_CC3 #20

WTIM0_CDTI0 #31

WTIM0_CDTI1 #29

WTIM0_CDTI2 #27

LETIM0_OUT0 #23

LETIM0_OUT1 #22

PCNT0_S0IN #23

PCNT0_S1IN #22

DBG_SWO #2

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Rev. 1.1 | 94

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

US0_TX #24

US0_RX #23

US0_CLK #22

US0_CS #21

US0_CTS #20

US0_RTS #19

US1_TX #24

US1_RX #23

US1_CLK #22

US1_CS #21

US1_CTS #20

US1_RTS #19

US2_TX #14

US2_RX #13

US2_CLK #12

US2_CS #11

US2_CTS #10

US2_RTS #9

LEU0_TX #24

LEU0_RX #23

I2C0_SDA #24

I2C0_SCL #23

Radio

Other

TIM0_CC0 #24

TIM0_CC1 #23

TIM0_CC2 #22

TIM0_CDTI0 #21

TIM0_CDTI1 #20

TIM0_CDTI2 #19

TIM1_CC0 #24

PRS_CH0 #0

PRS_CH1 #7

PRS_CH2 #6

PRS_CH3 #5

ACMP0_O #24

ACMP1_O #24

DBG_SWCLKTCK

BOOT_TX

FRC_DCLK #24

FRC_DOUT #23

BUSBY

BUSAX

TIM1_CC1 #23

FRC_DFRAME #22

MODEM_DCLK #24

MODEM_DIN #23

MODEM_DOUT #22

PF0

TIM1_CC2 #22

TIM1_CC3 #21

WTIM0_CDTI1 #30

WTIM0_CDTI2 #28

LETIM0_OUT0 #24

LETIM0_OUT1 #23

PCNT0_S0IN #24

PCNT0_S1IN #23

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Rev. 1.1 | 95

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

US0_TX #25

US0_RX #24

US0_CLK #23

US0_CS #22

US0_CTS #21

US0_RTS #20

US1_TX #25

US1_RX #24

US1_CLK #23

US1_CS #22

US1_CTS #21

US1_RTS #20

US2_TX #15

US2_RX #14

US2_CLK #13

US2_CS #12

US2_CTS #11

US2_RTS #10

LEU0_TX #25

LEU0_RX #24

I2C0_SDA #25

I2C0_SCL #24

Radio

Other

TIM0_CC0 #25

TIM0_CC1 #24

TIM0_CC2 #23

TIM0_CDTI0 #22

TIM0_CDTI1 #21

TIM0_CDTI2 #20

TIM1_CC0 #25

PRS_CH0 #1

PRS_CH1 #0

PRS_CH2 #7

PRS_CH3 #6

ACMP0_O #25

ACMP1_O #25

DBG_SWDIOTMS

BOOT_RX

FRC_DCLK #25

FRC_DOUT #24

BUSAY

BUSBX

TIM1_CC1 #24

FRC_DFRAME #23

MODEM_DCLK #25

MODEM_DIN #24

MODEM_DOUT #23

PF1

TIM1_CC2 #23

TIM1_CC3 #22

WTIM0_CDTI1 #31

WTIM0_CDTI2 #29

LETIM0_OUT0 #25

LETIM0_OUT1 #24

PCNT0_S0IN #25

PCNT0_S1IN #24

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Rev. 1.1 | 96

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

US0_TX #26

US0_RX #25

US0_CLK #24

US0_CS #23

US0_CTS #22

US0_RTS #21

US1_TX #26

US1_RX #25

US1_CLK #24

US1_CS #23

US1_CTS #22

US1_RTS #21

LEU0_TX #26

LEU0_RX #25

I2C0_SDA #26

I2C0_SCL #25

Radio

Other

TIM0_CC0 #26

TIM0_CC1 #25

TIM0_CC2 #24

CMU_CLK0 #6

PRS_CH0 #2

PRS_CH1 #1

PRS_CH2 #0

PRS_CH3 #7

ACMP0_O #26

ACMP1_O #26

DBG_TDO

TIM0_CDTI0 #23

TIM0_CDTI1 #22

TIM0_CDTI2 #21

TIM1_CC0 #26

FRC_DCLK #26

FRC_DOUT #25

BUSBY

BUSAX

FRC_DFRAME #24

MODEM_DCLK #26

MODEM_DIN #25

MODEM_DOUT #24

PF2

TIM1_CC1 #25

TIM1_CC2 #24

TIM1_CC3 #23

WTIM0_CDTI2 #30

LETIM0_OUT0 #26

LETIM0_OUT1 #25

PCNT0_S0IN #26

PCNT0_S1IN #25

DBG_SWO #0

GPIO_EM4WU0

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Rev. 1.1 | 97

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

US0_TX #27

US0_RX #26

US0_CLK #25

US0_CS #24

US0_CTS #23

US0_RTS #22

US1_TX #27

US1_RX #26

US1_CLK #25

US1_CS #24

US1_CTS #23

US1_RTS #22

US2_TX #16

US2_RX #15

US2_CLK #14

US2_CS #13

US2_CTS #12

US2_RTS #11

LEU0_TX #27

LEU0_RX #26

I2C0_SDA #27

I2C0_SCL #26

Radio

Other

TIM0_CC0 #27

TIM0_CC1 #26

TIM0_CC2 #25

TIM0_CDTI0 #24

TIM0_CDTI1 #23

TIM0_CDTI2 #22

TIM1_CC0 #27

CMU_CLK1 #6

PRS_CH0 #3

PRS_CH1 #2

PRS_CH2 #1

PRS_CH3 #0

ACMP0_O #27

ACMP1_O #27

DBG_TDI

FRC_DCLK #27

FRC_DOUT #26

BUSAY

BUSBX

FRC_DFRAME #25

MODEM_DCLK #27

MODEM_DIN #26

MODEM_DOUT #25

PF3

TIM1_CC1 #26

TIM1_CC2 #25

TIM1_CC3 #24

WTIM0_CDTI2 #31

LETIM0_OUT0 #27

LETIM0_OUT1 #26

PCNT0_S0IN #27

PCNT0_S1IN #26

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Rev. 1.1 | 98

®

BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

US0_TX #28

US0_RX #27

US0_CLK #26

US0_CS #25

US0_CTS #24

US0_RTS #23

US1_TX #28

US1_RX #27

US1_CLK #26

US1_CS #25

US1_CTS #24

US1_RTS #23

US2_TX #17

US2_RX #16

US2_CLK #15

US2_CS #14

US2_CTS #13

US2_RTS #12

LEU0_TX #28

LEU0_RX #27

I2C0_SDA #28

I2C0_SCL #27

Radio

Other

TIM0_CC0 #28

TIM0_CC1 #27

TIM0_CC2 #26

TIM0_CDTI0 #25

TIM0_CDTI1 #24

TIM0_CDTI2 #23

TIM1_CC0 #28

FRC_DCLK #28

FRC_DOUT #27

PRS_CH0 #4

PRS_CH1 #3

PRS_CH2 #2

PRS_CH3 #1

ACMP0_O #28

ACMP1_O #28

BUSBY

BUSAX

FRC_DFRAME #26

MODEM_DCLK #28

MODEM_DIN #27

MODEM_DOUT #26

PF4

TIM1_CC1 #27

TIM1_CC2 #26

TIM1_CC3 #25

LETIM0_OUT0 #28

LETIM0_OUT1 #27

PCNT0_S0IN #28

PCNT0_S1IN #27

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Rev. 1.1 | 99

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

US0_TX #29

US0_RX #28

US0_CLK #27

US0_CS #26

US0_CTS #25

US0_RTS #24

US1_TX #29

US1_RX #28

US1_CLK #27

US1_CS #26

US1_CTS #25

US1_RTS #24

US2_TX #18

US2_RX #17

US2_CLK #16

US2_CS #15

US2_CTS #14

US2_RTS #13

LEU0_TX #29

LEU0_RX #28

I2C0_SDA #29

I2C0_SCL #28

Radio

Other

TIM0_CC0 #29

TIM0_CC1 #28

TIM0_CC2 #27

TIM0_CDTI0 #26

TIM0_CDTI1 #25

TIM0_CDTI2 #24

TIM1_CC0 #29

FRC_DCLK #29

FRC_DOUT #28

PRS_CH0 #5

PRS_CH1 #4

PRS_CH2 #3

PRS_CH3 #2

ACMP0_O #29

ACMP1_O #29

BUSAY

BUSBX

FRC_DFRAME #27

MODEM_DCLK #29

MODEM_DIN #28

MODEM_DOUT #27

PF5

TIM1_CC1 #28

TIM1_CC2 #27

TIM1_CC3 #26

LETIM0_OUT0 #29

LETIM0_OUT1 #28

PCNT0_S0IN #29

PCNT0_S1IN #28

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Rev. 1.1 | 100

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

US0_TX #30

US0_RX #29

US0_CLK #28

US0_CS #27

US0_CTS #26

US0_RTS #25

US1_TX #30

US1_RX #29

US1_CLK #28

US1_CS #27

US1_CTS #26

US1_RTS #25

US2_TX #19

US2_RX #18

US2_CLK #17

US2_CS #16

US2_CTS #15

US2_RTS #14

LEU0_TX #30

LEU0_RX #29

I2C0_SDA #30

I2C0_SCL #29

Radio

Other

TIM0_CC0 #30

TIM0_CC1 #29

TIM0_CC2 #28

TIM0_CDTI0 #27

TIM0_CDTI1 #26

TIM0_CDTI2 #25

TIM1_CC0 #30

CMU_CLK1 #7

PRS_CH0 #6

PRS_CH1 #5

PRS_CH2 #4

PRS_CH3 #3

ACMP0_O #30

ACMP1_O #30

FRC_DCLK #30

FRC_DOUT #29

BUSBY

BUSAX

FRC_DFRAME #28

MODEM_DCLK #30

MODEM_DIN #29

MODEM_DOUT #28

PF6

TIM1_CC1 #29

TIM1_CC2 #28

TIM1_CC3 #27

LETIM0_OUT0 #30

LETIM0_OUT1 #29

PCNT0_S0IN #30

PCNT0_S1IN #29

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

US0_TX #31

US0_RX #30

US0_CLK #29

US0_CS #28

US0_CTS #27

US0_RTS #26

US1_TX #31

US1_RX #30

US1_CLK #29

US1_CS #28

US1_CTS #27

US1_RTS #26

US2_TX #20

US2_RX #19

US2_CLK #18

US2_CS #17

US2_CTS #16

US2_RTS #15

LEU0_TX #31

LEU0_RX #30

I2C0_SDA #31

I2C0_SCL #30

Radio

Other

TIM0_CC0 #31

TIM0_CC1 #30

TIM0_CC2 #29

CMU_CLKI0 #1

CMU_CLK0 #7

PRS_CH0 #7

PRS_CH1 #6

PRS_CH2 #5

PRS_CH3 #4

ACMP0_O #31

ACMP1_O #31

GPIO_EM4WU1

TIM0_CDTI0 #28

TIM0_CDTI1 #27

TIM0_CDTI2 #26

TIM1_CC0 #31

FRC_DCLK #31

FRC_DOUT #30

BUSAY

BUSBX

FRC_DFRAME #29

MODEM_DCLK #31

MODEM_DIN #30

MODEM_DOUT #29

PF7

TIM1_CC1 #30

TIM1_CC2 #29

TIM1_CC3 #28

LETIM0_OUT0 #31

LETIM0_OUT1 #30

PCNT0_S0IN #31

PCNT0_S1IN #30

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

7.3 Alternate Functionality Overview

A wide selection of alternate functionality is available for multiplexing to various pins. The following table shows the name of the alter-

nate functionality in the first column, followed by columns showing the possible LOCATION bitfield settings and the associated GPIO

pin. Refer to 7.2 GPIO Functionality Table for a list of functions available on each GPIO pin.

Note: Some functionality, such as analog interfaces, do not have alternate settings or a LOCATION bitfield. In these cases, the pinout

is shown in the column corresponding to LOCATION 0.

Table 7.3. Alternate Functionality Overview

Alternate

LOCATION

12 - 15 16 - 19

16: PC11 20: PD12 24: PF0

17: PD9 21: PD13 25: PF1

18: PD10 22: PD14 26: PF2

15: PC10 19: PD11 23: PD15 27: PF3

Functionality

0 - 3

0: PA0

1: PA1

2: PA2

3: PA3

0: PA0

1: PA1

2: PA2

3: PA3

0: PA0

4 - 7

4: PA4

5: PA5

6: PB11

7: PB12

4: PA4

5: PA5

6: PB11

7: PB12

8 - 11

8: PB13

9: PB14

20 - 23

24 - 27

28 - 31

28: PF4

29: PF5

30: PF6

31: PF7

28: PF4

29: PF5

30: PF6

31: PF7

Description

12: PC7

13: PC8

Analog comparator

ACMP0, digital out-

put.

ACMP0_O

ACMP1_O

10: PB15 14: PC9

11: PC6

8: PB13

9: PB14

12: PC7

16: PC11 20: PD12 24: PF0

17: PD9 21: PD13 25: PF1

18: PD10 22: PD14 26: PF2

15: PC10 19: PD11 23: PD15 27: PF3

Analog comparator

ACMP1, digital out-

put.

13: PC8

10: PB15 14: PC9

11: PC6

Analog to digital

converter ADC0 ex-

ternal reference in-

put negative pin.

ADC0_EXTN

ADC0_EXTP

0: PA1

Analog to digital

converter ADC0 ex-

ternal reference in-

put positive pin.

BOOT_RX

BOOT_TX

0: PF1

0: PF0

0: PA1

1: PB15

2: PC6

3: PC11

0: PA0

1: PB14

2: PC7

3: PC10

0: PB13

1: PF7

2: PC6

Bootloader RX.

Bootloader TX.

4: PD9

5: PD14

6: PF2

7: PF7

4: PD10

5: PD15

6: PF3

7: PF6

4: PA5

Clock Management

Unit, clock output

number 0.

CMU_CLK0

Clock Management

Unit, clock output

number 1.

CMU_CLK1

CMU_CLKI0

Clock Management

Unit, clock input

number 0.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

Alternate

LOCATION

12 - 15 16 - 19

Functionality

0 - 3

4 - 7

8 - 11

20 - 23

24 - 27

28 - 31

Description

0: PF0

Debug-interface

Serial Wire clock

input and JTAG

Test Clock.

DBG_SWCLKTCK

DBG_SWDIOTMS

DBG_SWO

Note that this func-

tion is enabled to

the pin out of reset,

and has a built-in

pull down.

0: PF1

Debug-interface

Serial Wire data in-

put / output and

JTAG Test Mode

Select.

Note that this func-

tion is enabled to

the pin out of reset,

and has a built-in

pull up.

0: PF2

Debug-interface

Serial Wire viewer

Output.

1: PB13

2: PD15

3: PC11

Note that this func-

tion is not enabled

after reset, and

must be enabled by

software to be

used.

0: PF3

Debug-interface

JTAG Test Data In.

Note that this func-

tion becomes avail-

able after the first

valid JTAG com-

mand is received,

and has a built-in

pull up when JTAG

is active.

DBG_TDI

0: PF2

Debug-interface

JTAG Test Data

Out.

Note that this func-

tion becomes avail-

able after the first

valid JTAG com-

mand is received.

DBG_TDO

1: PA5

3: PC6

3: PC7

Embedded Trace

Module ETM clock .

ETM_TCLK

ETM_TD0

Embedded Trace

Module ETM data

0.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

Alternate

LOCATION

12 - 15 16 - 19

Functionality

0 - 3

4 - 7

8 - 11

20 - 23

24 - 27

28 - 31

Description

3: PC8

Embedded Trace

Module ETM data

1.

ETM_TD1

ETM_TD2

ETM_TD3

3: PC9

Embedded Trace

Module ETM data

2.

3: PC10

Embedded Trace

Module ETM data

3.

0: PA0

1: PA1

2: PA2

3: PA3

0: PA2

1: PA3

2: PA4

3: PA5

0: PA1

1: PA2

2: PA3

3: PA4

0: PF2

4: PA4

8: PB13

9: PB14

12: PC7

16: PC11 20: PD12 24: PF0

17: PD9 21: PD13 25: PF1

18: PD10 22: PD14 26: PF2

15: PC10 19: PD11 23: PD15 27: PF3

12: PC9 16: PD10 20: PD14 24: PF2

13: PC10 17: PD11 21: PD15 25: PF3

28: PF4

29: PF5

30: PF6

31: PF7

28: PF6

29: PF7

30: PA0

31: PA1

28: PF5

29: PF6

30: PF7

31: PA0

5: PA5

13: PC8

Frame Controller,

Data Sniffer Clock.

FRC_DCLK

6: PB11

7: PB12

4: PB11

5: PB12

6: PB13

7: PB14

4: PA5

10: PB15 14: PC9

11: PC6

8: PB15

9: PC6

Frame Controller,

Data Sniffer Frame

active

FRC_DFRAME

FRC_DOUT

10: PC7

11: PC8

8: PB14

9: PB15

10: PC6

11: PC7

14: PC11 18: PD12 22: PF0

26: PF4

27: PF5

15: PD9

12: PC8

13: PC9

19: PD13 23: PF1

16: PD9

17: PD10 21: PD14 25: PF2

20: PD13 24: PF1

Frame Controller,

Data Sniffer Out-

put.

5: PB11

6: PB12

7: PB13

14: PC10 18: PD11 22: PD15 26: PF3

15: PC11 19: PD12 23: PF0 27: PF4

Pin can be used to

wake the system

up from EM4

GPIO_EM4WU0

GPIO_EM4WU1

GPIO_EM4WU4

GPIO_EM4WU8

GPIO_EM4WU9

GPIO_EM4WU12

0: PF7

Pin can be used to

wake the system

up from EM4

0: PD14

0: PA3

Pin can be used to

wake the system

up from EM4

Pin can be used to

wake the system

up from EM4

0: PB13

0: PC10

Pin can be used to

wake the system

up from EM4

Pin can be used to

wake the system

up from EM4

0: PA1

1: PA2

2: PA3

3: PA4

4: PA5

8: PB14

9: PB15

10: PC6

11: PC7

12: PC8

13: PC9

16: PD9

20: PD13 24: PF1

28: PF5

29: PF6

30: PF7

31: PA0

5: PB11

6: PB12

7: PB13

17: PD10 21: PD14 25: PF2

I2C0 Serial Clock

Line input / output.

I2C0_SCL

14: PC10 18: PD11 22: PD15 26: PF3

15: PC11 19: PD12 23: PF0 27: PF4

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

Alternate

LOCATION

12 - 15 16 - 19

16: PC11 20: PD12 24: PF0

17: PD9 21: PD13 25: PF1

18: PD10 22: PD14 26: PF2

Functionality

0 - 3

0: PA0

1: PA1

2: PA2

3: PA3

4 - 7

4: PA4

5: PA5

6: PB11

7: PB12

8 - 11

8: PB13

9: PB14

20 - 23

24 - 27

28 - 31

28: PF4

29: PF5

30: PF6

31: PF7

Description

12: PC7

13: PC8

I2C0 Serial Data in-

put / output.

I2C0_SDA

I2C1_SCL

10: PB15 14: PC9

11: PC6

15: PC10 19: PD11 23: PD15 27: PF3

18: PC10

I2C1 Serial Clock

Line input / output.

19: PC11

19: PC10 20: PC11

I2C1 Serial Data in-

put / output.

I2C1_SDA

LES_CH1

LES_CH2

LES_CH3

LES_CH4

LES_CH5

LES_CH6

LES_CH7

LES_CH8

LES_CH9

LES_CH10

LES_CH11

LES_CH12

LES_CH13

0: PD9

0: PD10

0: PD11

0: PD12

0: PD13

0: PD14

0: PD15

0: PA0

0: PA1

0: PA2

0: PA3

0: PA4

0: PA5

LESENSE channel

1.

LESENSE channel

2.

LESENSE channel

3.

LESENSE channel

4.

LESENSE channel

5.

LESENSE channel

6.

LESENSE channel

7.

LESENSE channel

8.

LESENSE channel

9.

LESENSE channel

10.

LESENSE channel

11.

LESENSE channel

12.

LESENSE channel

13.

0: PA0

1: PA1

2: PA2

3: PA3

0: PA1

1: PA2

2: PA3

3: PA4

4: PA4

8: PB13

9: PB14

12: PC7

16: PC11 20: PD12 24: PF0

17: PD9 21: PD13 25: PF1

18: PD10 22: PD14 26: PF2

15: PC10 19: PD11 23: PD15 27: PF3

28: PF4

29: PF5

30: PF6

31: PF7

28: PF5

29: PF6

30: PF7

31: PA0

Low Energy Timer

LETIM0, output

channel 0.

5: PA5

13: PC8

LETIM0_OUT0

LETIM0_OUT1

6: PB11

7: PB12

4: PA5

10: PB15 14: PC9

11: PC6

8: PB14

9: PB15

10: PC6

11: PC7

12: PC8

13: PC9

16: PD9

20: PD13 24: PF1

Low Energy Timer

LETIM0, output

channel 1.

5: PB11

6: PB12

7: PB13

17: PD10 21: PD14 25: PF2

14: PC10 18: PD11 22: PD15 26: PF3

15: PC11 19: PD12 23: PF0 27: PF4

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

Alternate

LOCATION

Functionality

0 - 3

0: PA1

1: PA2

2: PA3

3: PA4

0: PA0

1: PA1

2: PA2

3: PA3

0: PB14

4 - 7

4: PA5

8 - 11

8: PB14

9: PB15

10: PC6

11: PC7

8: PB13

9: PB14

12 - 15

16 - 19

20 - 23

24 - 27

28 - 31

28: PF5

29: PF6

30: PF7

31: PA0

28: PF4

29: PF5

30: PF6

31: PF7

Description

12: PC8

13: PC9

16: PD9

20: PD13 24: PF1

5: PB11

6: PB12

7: PB13

4: PA4

17: PD10 21: PD14 25: PF2

LEUART0 Receive

input.

LEU0_RX

LEU0_TX

14: PC10 18: PD11 22: PD15 26: PF3

15: PC11 19: PD12 23: PF0 27: PF4

16: PC11 20: PD12 24: PF0

17: PD9 21: PD13 25: PF1

18: PD10 22: PD14 26: PF2

15: PC10 19: PD11 23: PD15 27: PF3

12: PC7

13: PC8

LEUART0 Transmit

output. Also used

as receive input in

half duplex commu-

nication.

5: PA5

6: PB11

7: PB12

10: PB15 14: PC9

11: PC6

Low Frequency

Crystal (typically

32.768 kHz) nega-

tive pin. Also used

as an optional ex-

ternal clock input

pin.

LFXTAL_N

0: PB15

Low Frequency

Crystal (typically

32.768 kHz) posi-

tive pin.

LFXTAL_P

0: PA0

1: PA1

2: PA2

3: PA3

0: PA1

1: PA2

2: PA3

3: PA4

0: PA2

1: PA3

2: PA4

3: PA5

0: PA4

4: PA4

8: PB13

9: PB14

12: PC7

16: PC11 20: PD12 24: PF0

17: PD9 21: PD13 25: PF1

18: PD10 22: PD14 26: PF2

15: PC10 19: PD11 23: PD15 27: PF3

28: PF4

29: PF5

30: PF6

31: PF7

28: PF5

29: PF6

30: PF7

31: PA0

28: PF6

29: PF7

30: PA0

31: PA1

5: PA5

13: PC8

MODEM data clock

out.

MODEM_DCLK

6: PB11

7: PB12

4: PA5

10: PB15 14: PC9

11: PC6

8: PB14

9: PB15

10: PC6

11: PC7

8: PB15

9: PC6

12: PC8

13: PC9

16: PD9

20: PD13 24: PF1

5: PB11

6: PB12

7: PB13

4: PB11

5: PB12

6: PB13

7: PB14

17: PD10 21: PD14 25: PF2

MODEM_DIN

MODEM data in.

MODEM data out.

14: PC10 18: PD11 22: PD15 26: PF3

15: PC11 19: PD12 23: PF0 27: PF4

12: PC9 16: PD10 20: PD14 24: PF2

13: PC10 17: PD11 21: PD15 25: PF3

MODEM_DOUT

10: PC7

11: PC8

14: PC11 18: PD12 22: PF0

15: PD9 19: PD13 23: PF1

26: PF4

27: PF5

Operational Amplifi-

er 0 external nega-

tive input.

OPA0_N

OPA0_P

OPA1_N

OPA1_P

0: PA2

Operational Amplifi-

er 0 external posi-

tive input.

0: PD15

0: PD13

Operational Amplifi-

er 1 external nega-

tive input.

Operational Amplifi-

er 1 external posi-

tive input.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

Alternate

LOCATION

12 - 15 16 - 19

Functionality

0 - 3

4 - 7

8 - 11

20 - 23

24 - 27

28 - 31

Description

0: PB13

Operational Amplifi-

er 2 external nega-

tive input.

OPA2_N

0: PB12

0: PB11

Operational Amplifi-

er 2 output.

OPA2_OUT

OPA2_P

Operational Amplifi-

er 2 external posi-

tive input.

0: PA0

1: PA1

2: PA2

3: PA3

0: PA1

1: PA2

2: PA3

3: PA4

0: PF0

1: PF1

2: PF2

3: PF3

0: PF1

1: PF2

2: PF3

3: PF4

0: PF2

1: PF3

2: PF4

3: PF5

0: PF3

1: PF4

2: PF5

3: PF6

0: PD9

1: PD10

2: PD11

3: PD12

4: PA4

5: PA5

6: PB11

7: PB12

4: PA5

5: PB11

6: PB12

7: PB13

4: PF4

5: PF5

6: PF6

7: PF7

4: PF5

5: PF6

6: PF7

7: PF0

4: PF6

5: PF7

6: PF0

7: PF1

4: PF7

5: PF0

6: PF1

7: PF2

4: PD13

5: PD14

6: PD15

8: PB13

9: PB14

12: PC7

16: PC11 20: PD12 24: PF0

17: PD9 21: PD13 25: PF1

18: PD10 22: PD14 26: PF2

15: PC10 19: PD11 23: PD15 27: PF3

28: PF4

29: PF5

30: PF6

31: PF7

28: PF5

29: PF6

30: PF7

31: PA0

Pulse Counter

PCNT0 input num-

ber 0.

13: PC8

PCNT0_S0IN

PCNT0_S1IN

PRS_CH0

PRS_CH1

PRS_CH2

PRS_CH3

PRS_CH4

10: PB15 14: PC9

11: PC6

8: PB14

9: PB15

10: PC6

11: PC7

8: PC6

12: PC8

13: PC9

16: PD9

20: PD13 24: PF1

Pulse Counter

PCNT0 input num-

ber 1.

17: PD10 21: PD14 25: PF2

14: PC10 18: PD11 22: PD15 26: PF3

15: PC11 19: PD12 23: PF0

12: PC10

27: PF4

Peripheral Reflex

System PRS, chan-

nel 0.

9: PC7

13: PC11

10: PC8

11: PC9

Peripheral Reflex

System PRS, chan-

nel 1.

Peripheral Reflex

System PRS, chan-

nel 2.

8: PD9

12: PD13

13: PD14

Peripheral Reflex

System PRS, chan-

nel 3.

9: PD10

10: PD11 14: PD15

11: PD12

Peripheral Reflex

System PRS, chan-

nel 4.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

Alternate

LOCATION

12 - 15 16 - 19

Functionality

0 - 3

0: PD10

1: PD11

2: PD12

3: PD13

0: PA0

1: PA1

2: PA2

3: PA3

0: PA1

1: PA2

2: PA3

3: PA4

0: PA2

1: PA3

2: PA4

3: PA5

0: PA3

1: PA4

2: PA5

3: PB11

0: PC6

1: PC7

2: PC8

3: PC9

0: PC7

1: PC8

2: PC9

3: PC10

0: PA0

1: PA1

2: PA2

3: PA3

0: PA1

1: PA2

2: PA3

3: PA4

4 - 7

4: PD14

5: PD15

6: PD9

8 - 11

20 - 23

24 - 27

28 - 31

Description

Peripheral Reflex

System PRS, chan-

nel 5.

PRS_CH5

PRS_CH6

PRS_CH7

PRS_CH8

PRS_CH9

PRS_CH10

PRS_CH11

TIM0_CC0

TIM0_CC1

4: PA4

8: PB13

9: PB14

12: PD10 16: PD14

13: PD11 17: PD15

Peripheral Reflex

System PRS, chan-

nel 6.

5: PA5

6: PB11

7: PB12

4: PA5

10: PB15 14: PD12

11: PD9

8: PB14

9: PB15

10: PA0

15: PD13

Peripheral Reflex

System PRS, chan-

nel 7.

5: PB11

6: PB12

7: PB13

4: PB11

5: PB12

6: PB13

7: PB14

4: PB12

5: PB13

6: PB14

7: PB15

4: PC10

5: PC11

8: PB15

9: PA0

Peripheral Reflex

System PRS, chan-

nel 8.

10: PA1

8: PA0

9: PA1

10: PA2

11: PC6

12: PC7

13: PC8

14: PC9

15: PC10

16: PC11

Peripheral Reflex

System PRS, chan-

nel 9.

Peripheral Reflex

System PRS, chan-

nel 10.

4: PC11

5: PC6

Peripheral Reflex

System PRS, chan-

nel 11.

4: PA4

8: PB13

9: PB14

12: PC7

16: PC11 20: PD12 24: PF0

17: PD9 21: PD13 25: PF1

18: PD10 22: PD14 26: PF2

15: PC10 19: PD11 23: PD15 27: PF3

28: PF4

29: PF5

30: PF6

31: PF7

28: PF5

29: PF6

30: PF7

31: PA0

Timer 0 Capture

Compare input /

output channel 0.

5: PA5

13: PC8

6: PB11

7: PB12

4: PA5

10: PB15 14: PC9

11: PC6

8: PB14

9: PB15

10: PC6

11: PC7

12: PC8

13: PC9

16: PD9

20: PD13 24: PF1

Timer 0 Capture

Compare input /

output channel 1.

5: PB11

6: PB12

7: PB13

17: PD10 21: PD14 25: PF2

14: PC10 18: PD11 22: PD15 26: PF3

15: PC11 19: PD12 23: PF0 27: PF4

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

Alternate

LOCATION

12 - 15 16 - 19

12: PC9 16: PD10 20: PD14 24: PF2

13: PC10 17: PD11 21: PD15 25: PF3

Functionality

0 - 3

0: PA2

1: PA3

2: PA4

3: PA5

0: PA3

1: PA4

2: PA5

3: PB11

0: PA4

1: PA5

2: PB11

3: PB12

0: PA5

1: PB11

2: PB12

3: PB13

0: PA0

1: PA1

2: PA2

3: PA3

0: PA1

1: PA2

2: PA3

3: PA4

0: PA2

1: PA3

2: PA4

3: PA5

0: PA3

1: PA4

2: PA5

3: PB11

0: PA2

1: PA3

2: PA4

3: PA5

4 - 7

4: PB11

5: PB12

6: PB13

7: PB14

4: PB12

5: PB13

6: PB14

7: PB15

4: PB13

5: PB14

6: PB15

7: PC6

8 - 11

8: PB15

9: PC6

20 - 23

24 - 27

28 - 31

28: PF6

29: PF7

30: PA0

31: PA1

28: PF7

29: PA0

30: PA1

31: PA2

28: PA0

29: PA1

30: PA2

31: PA3

28: PA1

29: PA2

30: PA3

31: PA4

28: PF4

29: PF5

30: PF6

31: PF7

28: PF5

29: PF6

30: PF7

31: PA0

28: PF6

29: PF7

30: PA0

31: PA1

28: PF7

29: PA0

30: PA1

31: PA2

28: PF6

29: PF7

30: PA0

31: PA1

Description

Timer 0 Capture

Compare input /

output channel 2.

TIM0_CC2

TIM0_CDTI0

TIM0_CDTI1

TIM0_CDTI2

TIM1_CC0

TIM1_CC1

TIM1_CC2

TIM1_CC3

US0_CLK

10: PC7

11: PC8

8: PC6

14: PC11 18: PD12 22: PF0

15: PD9 19: PD13 23: PF1

26: PF4

27: PF5

12: PC10 16: PD11 20: PD15 24: PF3

Timer 0 Compli-

mentary Dead Time

Insertion channel 0.

9: PC7

13: PC11 17: PD12 21: PF0

14: PD9 18: PD13 22: PF1

25: PF4

26: PF5

27: PF6

24: PF4

25: PF5

26: PF6

27: PF7

24: PF5

25: PF6

26: PF7

27: PA0

10: PC8

11: PC9

8: PC7

15: PD10 19: PD14 23: PF2

12: PC11 16: PD12 20: PF0

Timer 0 Compli-

mentary Dead Time

Insertion channel 1.

9: PC8

13: PD9

17: PD13 21: PF1

10: PC9

14: PD10 18: PD14 22: PF2

11: PC10 15: PD11 19: PD15 23: PF3

4: PB14

5: PB15

6: PC6

8: PC8

9: PC9

12: PD9

16: PD13 20: PF1

Timer 0 Compli-

mentary Dead Time

Insertion channel 2.

13: PD10 17: PD14 21: PF2

10: PC10 14: PD11 18: PD15 22: PF3

11: PC11 15: PD12 19: PF0 23: PF4

7: PC7

4: PA4

8: PB13

9: PB14

12: PC7

16: PC11 20: PD12 24: PF0

17: PD9 21: PD13 25: PF1

18: PD10 22: PD14 26: PF2

15: PC10 19: PD11 23: PD15 27: PF3

Timer 1 Capture

Compare input /

output channel 0.

5: PA5

13: PC8

6: PB11

7: PB12

4: PA5

10: PB15 14: PC9

11: PC6

8: PB14

9: PB15

10: PC6

11: PC7

8: PB15

9: PC6

12: PC8

13: PC9

16: PD9

20: PD13 24: PF1

Timer 1 Capture

Compare input /

output channel 1.

5: PB11

6: PB12

7: PB13

4: PB11

5: PB12

6: PB13

7: PB14

4: PB12

5: PB13

6: PB14

7: PB15

4: PB11

5: PB12

6: PB13

7: PB14

17: PD10 21: PD14 25: PF2

14: PC10 18: PD11 22: PD15 26: PF3

15: PC11 19: PD12 23: PF0 27: PF4

12: PC9 16: PD10 20: PD14 24: PF2

13: PC10 17: PD11 21: PD15 25: PF3

Timer 1 Capture

Compare input /

output channel 2.

10: PC7

11: PC8

8: PC6

14: PC11 18: PD12 22: PF0

15: PD9 19: PD13 23: PF1

26: PF4

27: PF5

12: PC10 16: PD11 20: PD15 24: PF3

Timer 1 Capture

Compare input /

output channel 3.

9: PC7

13: PC11 17: PD12 21: PF0

14: PD9 18: PD13 22: PF1

15: PD10 19: PD14 23: PF2

12: PC9

13: PC10 17: PD11 21: PD15 25: PF3

25: PF4

26: PF5

27: PF6

10: PC8

11: PC9

8: PB15

9: PC6

16: PD10 20: PD14 24: PF2

USART0 clock in-

put / output.

10: PC7

11: PC8

14: PC11 18: PD12 22: PF0

15: PD9 19: PD13 23: PF1

26: PF4

27: PF5

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

Alternate

LOCATION

12 - 15 16 - 19

12: PC10 16: PD11 20: PD15 24: PF3

Functionality

0 - 3

0: PA3

1: PA4

2: PA5

3: PB11

0: PA4

1: PA5

2: PB11

3: PB12

0: PA5

1: PB11

2: PB12

3: PB13

0: PA1

1: PA2

2: PA3

3: PA4

4 - 7

4: PB12

5: PB13

6: PB14

7: PB15

4: PB13

5: PB14

6: PB15

7: PC6

8 - 11

8: PC6

9: PC7

10: PC8

11: PC9

8: PC7

9: PC8

10: PC9

20 - 23

24 - 27

28 - 31

28: PF7

29: PA0

30: PA1

31: PA2

28: PA0

29: PA1

30: PA2

31: PA3

28: PA1

29: PA2

30: PA3

31: PA4

28: PF5

29: PF6

30: PF7

31: PA0

Description

13: PC11 17: PD12 21: PF0

14: PD9 18: PD13 22: PF1

25: PF4

26: PF5

27: PF6

24: PF4

25: PF5

26: PF6

27: PF7

24: PF5

25: PF6

26: PF7

27: PA0

USART0 chip se-

lect input / output.

US0_CS

15: PD10 19: PD14 23: PF2

12: PC11 16: PD12 20: PF0

USART0 Clear To

Send hardware

flow control input.

13: PD9

17: PD13 21: PF1

US0_CTS

US0_RTS

14: PD10 18: PD14 22: PF2

11: PC10 15: PD11 19: PD15 23: PF3

4: PB14

5: PB15

6: PC6

8: PC8

9: PC9

12: PD9

16: PD13 20: PF1

USART0 Request

To Send hardware

flow control output.

13: PD10 17: PD14 21: PF2

10: PC10 14: PD11 18: PD15 22: PF3

11: PC11 15: PD12 19: PF0 23: PF4

7: PC7

4: PA5

8: PB14

9: PB15

10: PC6

11: PC7

12: PC8

13: PC9

16: PD9

17: PD10 21: PD14 25: PF2

20: PD13 24: PF1

USART0 Asynchro-

nous Receive.

5: PB11

6: PB12

7: PB13

USART0 Synchro-

nous mode Master

Input / Slave Out-

put (MISO).

US0_RX

14: PC10 18: PD11 22: PD15 26: PF3

15: PC11 19: PD12 23: PF0 27: PF4

0: PA0

1: PA1

2: PA2

3: PA3

4: PA4

5: PA5

6: PB11

7: PB12

8: PB13

9: PB14

12: PC7

16: PC11 20: PD12 24: PF0

17: PD9 21: PD13 25: PF1

18: PD10 22: PD14 26: PF2

15: PC10 19: PD11 23: PD15 27: PF3

28: PF4

29: PF5

30: PF6

31: PF7

USART0 Asynchro-

nous Transmit. Al-

so used as receive

input in half duplex

communication.

13: PC8

10: PB15 14: PC9

US0_TX

11: PC6

USART0 Synchro-

nous mode Master

Output / Slave In-

put (MOSI).

0: PA2

1: PA3

2: PA4

3: PA5

0: PA3

1: PA4

2: PA5

3: PB11

0: PA4

1: PA5

2: PB11

3: PB12

4: PB11

5: PB12

6: PB13

7: PB14

4: PB12

5: PB13

6: PB14

7: PB15

4: PB13

5: PB14

6: PB15

7: PC6

8: PB15

9: PC6

10: PC7

11: PC8

8: PC6

9: PC7

10: PC8

11: PC9

8: PC7

9: PC8

10: PC9

12: PC9

16: PD10 20: PD14 24: PF2

28: PF6

29: PF7

30: PA0

31: PA1

28: PF7

29: PA0

30: PA1

31: PA2

28: PA0

29: PA1

30: PA2

31: PA3

13: PC10 17: PD11 21: PD15 25: PF3

USART1 clock in-

put / output.

US1_CLK

US1_CS

14: PC11 18: PD12 22: PF0

15: PD9 19: PD13 23: PF1

26: PF4

27: PF5

12: PC10 16: PD11 20: PD15 24: PF3

13: PC11 17: PD12 21: PF0

14: PD9 18: PD13 22: PF1

25: PF4

26: PF5

27: PF6

24: PF4

25: PF5

26: PF6

27: PF7

USART1 chip se-

lect input / output.

15: PD10 19: PD14 23: PF2

12: PC11 16: PD12 20: PF0

USART1 Clear To

Send hardware

flow control input.

13: PD9

17: PD13 21: PF1

US1_CTS

14: PD10 18: PD14 22: PF2

11: PC10 15: PD11 19: PD15 23: PF3

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

Alternate

LOCATION

12 - 15 16 - 19

12: PD9 16: PD13 20: PF1

13: PD10 17: PD14 21: PF2

Functionality

0 - 3

0: PA5

1: PB11

2: PB12

3: PB13

0: PA1

1: PA2

2: PA3

3: PA4

4 - 7

4: PB14

5: PB15

6: PC6

7: PC7

4: PA5

8 - 11

8: PC8

9: PC9

20 - 23

24 - 27

24: PF5

25: PF6

26: PF7

27: PA0

28 - 31

28: PA1

29: PA2

30: PA3

31: PA4

28: PF5

29: PF6

30: PF7

31: PA0

Description

USART1 Request

To Send hardware

flow control output.

US1_RTS

US1_RX

10: PC10 14: PD11 18: PD15 22: PF3

11: PC11 15: PD12 19: PF0 23: PF4

8: PB14

9: PB15

10: PC6

11: PC7

12: PC8

13: PC9

16: PD9

17: PD10 21: PD14 25: PF2

20: PD13 24: PF1

USART1 Asynchro-

nous Receive.

5: PB11

6: PB12

7: PB13

USART1 Synchro-

nous mode Master

Input / Slave Out-

put (MISO).

14: PC10 18: PD11 22: PD15 26: PF3

15: PC11 19: PD12 23: PF0 27: PF4

0: PA0

1: PA1

2: PA2

3: PA3

4: PA4

5: PA5

6: PB11

7: PB12

8: PB13

9: PB14

12: PC7

16: PC11 20: PD12 24: PF0

17: PD9 21: PD13 25: PF1

18: PD10 22: PD14 26: PF2

15: PC10 19: PD11 23: PD15 27: PF3

28: PF4

29: PF5

30: PF6

31: PF7

USART1 Asynchro-

nous Transmit. Al-

so used as receive

input in half duplex

communication.

13: PC8

10: PB15 14: PC9

11: PC6

US1_TX

USART1 Synchro-

nous mode Master

Output / Slave In-

put (MOSI).

12: PF0

13: PF1

14: PF3

15: PF4

12: PF1

13: PF3

14: PF4

15: PF5

12: PF3

13: PF4

14: PF5

15: PF6

12: PF4

13: PF5

14: PF6

15: PF7

13: PF0

14: PF1

15: PF3

16: PF5

17: PF6

18: PF7

30: PA5

29: PA5

28: PA5

USART2 clock in-

put / output.

US2_CLK

US2_CS

11: PF0

16: PF6

17: PF7

USART2 chip se-

lect input / output.

10: PF0

11: PF1

16: PF7

USART2 Clear To

Send hardware

flow control input.

US2_CTS

US2_RTS

9: PF0

27: PA5

USART2 Request

To Send hardware

flow control output.

10: PF1

11: PF3

16: PF4

17: PF5

18: PF6

19: PF7

31: PA5

USART2 Asynchro-

nous Receive.

USART2 Synchro-

nous mode Master

Input / Slave Out-

put (MISO).

US2_RX

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

Alternate

LOCATION

Functionality

0 - 3

4 - 7

8 - 11

12 - 15

16 - 19

16: PF3

17: PF4

18: PF5

19: PF6

20 - 23

24 - 27

28 - 31

Description

0: PA5

14: PF0

15: PF1

20: PF7

USART2 Asynchro-

nous Transmit. Al-

so used as receive

input in half duplex

communication.

US2_TX

USART2 Synchro-

nous mode Master

Output / Slave In-

put (MOSI).

0: PA1

0: PA3

Digital to analog

converter VDAC0

external reference

input pin.

VDAC0_EXT

Digital to Analog

Converter DAC0

output channel

number 0.

VDAC0_OUT0 /

OPA0_OUT

0: PA5

Digital to Analog

Converter DAC0 al-

ternative output for

channel 0.

VDAC0_OUT0AL

T / OPA0_OUT-

ALT

1: PD13

2: PD15

0: PD14

Digital to Analog

Converter DAC0

output channel

number 1.

VDAC0_OUT1 /

OPA1_OUT

0: PD12

1: PA2

2: PA4

0: PA0

1: PA1

2: PA2

3: PA3

0: PA2

1: PA3

2: PA4

3: PA5

0: PA4

1: PA5

Digital to Analog

Converter DAC0 al-

ternative output for

channel 1.

VDAC0_OUT1AL

T / OPA1_OUT-

ALT

4: PA4

5: PA5

15: PB11 16: PB12

17: PB13

26: PC6

27: PC7

28: PC8

29: PC9

30: PC10

31: PC11

28: PC10

29: PC11

31: PD9

Wide timer 0 Cap-

ture Compare in-

put / output channel

0.

WTIM0_CC0

WTIM0_CC1

WTIM0_CC2

18: PB14

19: PB15

13: PB11 16: PB14

14: PB12 17: PB15

15: PB13

24: PC6

25: PC7

26: PC8

27: PC9

24: PC8

25: PC9

Wide timer 0 Cap-

ture Compare in-

put / output channel

1.

11: PB11 12: PB12

13: PB13

22: PC6

23: PC7

29: PD9

Wide timer 0 Cap-

ture Compare in-

put / output channel

2.

30: PD10

14: PB14

26: PC10 31: PD11

27: PC11

15: PB15

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

Alternate

LOCATION

Functionality

0 - 3

4 - 7

8 - 11

8: PB12

9: PB13

10: PB14

11: PB15

8: PB14

9: PB15

12 - 15

16 - 19

20 - 23

20: PC8

21: PC9

24 - 27

28 - 31

Description

7: PB11

18: PC6

19: PC7

25: PD9

28: PD12

Wide timer 0 Com-

plimentary Dead

Time Insertion

channel 0.

26: PD10 29: PD13

WTIM0_CDTI0

WTIM0_CDTI1

WTIM0_CDTI2

22: PC10 27: PD11 30: PD14

23: PC11 31: PD15

5: PB11

6: PB12

7: PB13

16: PC6

17: PC7

18: PC8

19: PC9

16: PC8

17: PC9

20: PC10 24: PD10 28: PD14

21: PC11 25: PD11 29: PD15

Wide timer 0 Com-

plimentary Dead

Time Insertion

channel 1.

23: PD9

26: PD12 30: PF0

27: PD13 31: PF1

24: PD12 28: PF0

3: PB11

4: PB12

5: PB13

6: PB14

7: PB15

14: PC6

15: PC7

21: PD9

Wide timer 0 Com-

plimentary Dead

Time Insertion

channel 2.

22: PD10 25: PD13 29: PF1

18: PC10 23: PD11 26: PD14 30: PF2

19: PC11 27: PD15 31: PF3

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

7.4 Analog Port (APORT) Client Maps

The Analog Port (APORT) is an infrastructure used to connect chip pins with on-chip analog clients such as analog comparators, ADCs,

DACs, etc. The APORT consists of a set of shared buses, switches, and control logic needed to configurably implement the signal rout-

ing. Figure 7.2 APORT Connection Diagram on page 115 shows the APORT routing for this device family (note that available features

may vary by part number). A complete description of APORT functionality can be found in the Reference Manual.

1X

2X

3X

4X

NEXT1

NEXT0

1X

2X

3X

4X

NEXT1

NEXT0

POS

NEG

POS

NEG

PB15

PF0

ACMP1

PB14

PB13

PF1

PF2

1Y

2Y

3Y

4Y

NEXT1

NEXT0

ACMP0

1Y

2Y

3Y

4Y

NEXT1

NEXT0

OPA2_N

OUT2

PF3

PF4

1X

2X

3X

4X

NEXT0

NEXT2

PB12

PB11

PF5

PF6

PF7

POS

NEG

OPA2_P

1Y

2Y

3Y

4Y

ADC0

1X

1Y

IDAC0

NEXT1

EXTP

EXTN

OPA1_P

1X

PA5

PA4

VDAC0_OUT0ALT

VDAC0_OUT1ALT

POS

NEG

OPA0_P

1X

2X

3X

4X

2X

3X

4X

OUT0ALT

OPA0_N

POS

NEG

OPA1_N

1Y

OUT1ALT

OUT0

OPA0_N

1Y

2Y

3Y

4Y

2Y

3Y

4Y

OPA1

PA3

PA2

OPA0

OPA0_P

OUT1

OUT1ALT

OUT1

VDAC0_OUT1ALT

OUT0

OUT0ALT

OUT1

OUT2

OUT3

OUT1ALT

ADC_EXTP

OUT

OUT2

OUT3

OUT4

OUT

PA1

PA0

NEXT1

ADC_EXTN

OUT4

NEXT0

OPA2_P

1X

2X

3X

4X

OPA1_N

PD15

POS

NEG

VDAC0_OUT0ALT

OUT0ALT

OPA2_N

1Y

2Y

OPA2

3Y

4Y

OUT2

OUT2ALT

OUT1

OUT2

OUT

OUT3

OUT4

NEXT2

1X

1Y

3X

3Y

CEXT

CSEN

2X

2Y

CEXT_SENSE

4X

4Y

nX, nY

APORTnX, APORTnY

AX, BY, …

BUSAX, BUSBY, ...

Figure 7.2. APORT Connection Diagram

Client maps for each analog circuit using the APORT are shown in the following tables. The maps are organized by bus, and show the

peripheral's port connection, the shared bus, and the connection from specific bus channel numbers to GPIO pins.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

In general, enumerations for the pin selection field in an analog peripheral's register can be determined by finding the desired pin con-

nection in the table and then combining the value in the Port column (APORT__), and the channel identifier (CH__). For example, if pin

PF7 is available on port APORT2X as CH23, the register field enumeration to connect to PF7 would be APORT2XCH23. The shared

bus used by this connection is indicated in the Bus column.

Table 7.4. ACMP0 Bus and Pin Mapping

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

Table 7.5. ACMP1 Bus and Pin Mapping

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

Table 7.6. ADC0 Bus and Pin Mapping

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

Table 7.7. CSEN Bus and Pin Mapping

CEXT

CEXT_SENSE

Table 7.8. IDAC0 Bus and Pin Mapping

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

Table 7.9. VDAC0 / OPA Bus and Pin Mapping

OPA0_N

OPA0_P

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

OPA1_N

OPA1_P

OPA2_N

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

OPA2_OUT

OPA2_P

VDAC0_OUT0 / OPA0_OUT

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Pin Definitions

VDAC0_OUT1 / OPA1_OUT

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Package Specifications

8. Package Specifications

8.1 BGM13S Package Dimensions

Figure 8.1. BGM13S Package Dimensions

Dimension

MIN

1.20

0.26

0.95

0.27

NOM

1.30

0.30

1.00

0.32

MAX

1.40

0.34

1.05

0.37

A

A1

A2

b

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Package Specifications

Dimension

D

MIN

NOM

MAX

6.50 BSC

2.92 BSC

4.50 BSC

0.68 BSC

0.60 BSC

0.50 BSC

6.50 BSC

1.00 BSC

5.50 BSC

4.00 BSC

0.60 BSC

0.48

D2

D3

D4

D5

e

E

E2

E3

E4

E5

L

0.43

0.11

0.34

0.24

0.14

0.62

0.53

0.21

0.44

0.34

0.24

0.72

L1

0.16

L2

0.39

L3

0.29

L4

0.19

L5

0.67

eD1

eD2

eD3

eD4

eE1

eE2

eE3

eE4

eE5

aaa

bbb

ccc

ddd

eee

1.20 BSC

2.40 BSC

0.07 BSC

1.50 BSC

0.30 BSC

0.20 BSC

1.60 BSC

1.65 BSC

0.80 BSC

0.10

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Package Specifications

Dimension

MIN

NOM

MAX

Note:

1. All dimensions shown are in millimeters (mm) unless otherwise noted.

2. Tolerances are:

a. Decimal:

X.X = ±0.1

X.XX = ±0.05

X.XXX = ±0.03

b. Angular:

±0.1 Degrees

3. Dimensioning and Tolerancing per ANSI Y14.5M-1994.

4. This drawing conforms to the JEDEC Solid State Outline MO-220.

5. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.

6. Hatching lines means package shielding area.

7. Solid pattern (3.1x3.1mm) shows non-shielding area including its side walls. For side wall, borderline between shielding area and

not-shielding area could not be defined clearly like top side.

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Package Specifications

8.2 BGM13S Recommeded PCB Land Pattern

This section describes the recommended PCB land pattern for the BGM13S. The antenna copper clearance area is shown in Figure

8.2 BGM13S Recommended Antenna Clearance on page 127, while the X-Y cordinates of pads relative to the origin are shown in

Table 8.1 BGM13S Pad Coordinates and Sizing on page 128. The origin is the center point of pin number 47. It is very important to

align the antenna area relative to the module pads precisely.

Figure 8.2. BGM13S Recommended Antenna Clearance

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Package Specifications

Table 8.1. BGM13S Pad Coordinates and Sizing

Pad No.

47

1

Pad coordinates (X,Y)

Pad Center, Origin (0,0)

(0,-1.60)

Pad size (mm)

0.32 x 0.48

2

(0,-2.10)

9

(0,-5.60)

10

19

20

31

32

36

45

49

46

50

51

(0.60,-5.75)

(5.10,-5.75)

(5.70,-5.60)

(5.70,-0.10)

(5.10,-0.05)

(5.10,-1.65)

(0.60,-1.65)

(0,-1.00)

(2.92,0)

1.65,-3.70)

0.67 x 0.67

4.05,-3.70)

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Package Specifications

Figure 8.3. BGM13S Recommended PCB Land Pattern

Table 8.2. BGM13S Recommended PCB Land Pattern

Symbol

b

NOM (mm)

0.32 BSC

5.50 BSC

3.70 BSC

4.00 BSC

0.05 BSC

1.65 BSC

1.00 BSC

0.60 BSC

0.15 BSC

0.50 BSC

5.70 BSC

5.10 BSC

3.60 BSC

2.92 BSC

1.65 BSC

4.50 BSC

0.48 BSC

D1

D2

D3

D4

D5

eD1

eD2

eD3

e

E1

E2

E3

E4

E5

E6

E7

L

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Package Specifications

Symbol

L1

NOM (mm)

0.67 BSC

0.60 BSC

2.40 BSC

eE1

eE2

eE3

Notes:

1. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05mm is assumed.

2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.

3. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.

4. The stencil thickness should be 0.100mm (4 mils).

5. The stencil aperture to land pad size recommendation is 70% paste coverage.

6. Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different

parameters and fine tune their SMT process as required for their application and tooling.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Package Specifications

8.3 BGM13S Package Marking

The figure below shows the package markings printed on the module.

Figure 8.4. BGM13S Package Marking

Explanations:

Marking

Explanation

BGM13Sxxx

FCCIDQOQ13

IC5123A-13

Model Number

FCC Certification ID

IC5123A-13

R-CRM-BGT-13

YWWTTTT

KC (Korea) Certification ID

1. Y = Manufacturing Year

2. WW = Manufacturing Work Week

3. TTTT = Trace Code

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Tape and Reel Specifications

9. Tape and Reel Specifications

9.1 Tape and Reel Packaging

This section contains information regarding the tape and reel packaging for the BGM13S Blue Gecko Module.

9.2 Reel and Tape Specifications

• Reel material: Polystyrene (PS)

• Reel diameter: 13 inches (330 mm)

• Number of modules per reel: 1000 pcs

• Disk deformation, folding whitening and mold imperfections: Not allowed

• Disk set: consists of two 13 inch (330 mm) rotary round disks and one central axis (100 mm)

• Antistatic treatment: Required

Surface resistivity: 10⁴- 10⁹Ω/sq.

•

Figure 9.1. Reel Dimensions - Side View

Symbol

W0

Dimensions [mm]

32.5 ± 0.3

W1

37.1 ± 1.0

Figure 9.2. Cover tape information

Symbol

Thickness (T)

Width (W)

Dimensions [mm]

0.061

25.5 + 0.2

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Tape and Reel Specifications

Figure 9.3. Tape information

9.3 Orientation and Tape Feed

The user direction of feed, start and end of tape on reel and orientation of the modules on the tape are shown in the figure below.

Figure 9.4. Module Orientation and Feed Direction

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Tape and Reel Specifications

9.4 Tape and Reel Box Dimensions

Figure 9.5. Tape and Reel Box Dimensions

Symbol

W₂

Dimensions [mm]

368

338

72

W₃

W₄

9.5 Moisture Sensitivity Level

Reels are delivered in packing which conforms to MSL3 (Moisture Sensitivity Level 3) requirements.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Soldering Recommendations

10. Soldering Recommendations

10.1 Soldering Recommendations

The BGM13S is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the ther-

mal mass of the entire populated PCB, heat transfer efficiency of the oven, and particular type of solder paste used.

• Refer to technical documentations of particular solder paste for profile configurations.

• Avoid using more than two reflow cycles.

• A no-clean, type-3 solder paste is recommended.

• A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.

• Recommended stencil thickness is 0.100mm (4 mils).

• Refer to the recommended PCB land pattern for an example stencil aperture size.

• For further recommendation, please refer to the JEDEC/IPC J-STD-020, IPC-SM-782 and IPC 7351 guidelines.

• Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different

parameters and fine tune their SMT process as required for their application and tooling.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Certifications

11. Certifications

11.1 Qualified Antenna Types

The BGM13S variants supporting an external antenna have been designed to operate with a standard 2.14 dBi dipole antenna. Any

antenna of a different type or with a gain higher than 2.14 dBi is strictly prohibited for use with this device. Using an antenna of a differ-

ent type or gain more than 2.14 dBi will require additional testing for FCC, CE and IC. The required antenna impedance is 50 Ω.

Table 11.1. Qualified Antennas for BGM13S

Antenna Type

Maximum Gain

Dipole

2.14 dBi

11.2 Bluetooth

The BGM13S is pre-qualified as a Low Energy RF-PHY tested component, having Declaration ID of D039577 and QDID of 119769. For

the qualification of an end product embedding the BGM13S, the above should be combined with the most up to date Wireless Gecko

Link Layer and Host components.

11.3 CE

The BGM13S22 module is in conformity with the essential requirements and other relevant requirements of the Radio Equipment Direc-

tive (RED) (2014/53/EU). Please note that every application using the BGM13S22 will need to perform the radio EMC tests on the end

product, according to EN 301 489-17. It is ultimately the responsibility of the manufacturer to ensure the compliance of the end-product.

The specific product assembly may have an impact to RF radiated characteristics, and manufacturers should carefully consider RF

radiated testing with the end-product assembly. A formal DoC is available via www.silabs.com

The BGM13S32 module is in conformity with the essential requirements and other relevant requirements of the Radio Equipment Direc-

tive(RED) at up to 10 dBm RF transmit power when not using Adaptive Frequency Hopping (AFH). With early module firmware versions

that do not support AFH and that do not have built-in functionality to limit the max RF transmit power to 10 dBm automatically, it is

responsibility of the end-product's manufacturer to limit output power accordingly. With newer firmware versions supporting AFH, the

end-product’s manufacturer has the option to enable AFH and transmit at full output power while the module remains compliant or, al-

ternatively, to disable AFH in which case the max RF transmit power will be automatically limited to 10 dBm, making the module compli-

ant in all cases. Please refer to the firmware change log to verify which version introduced AFH.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Certifications

11.4 FCC

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

1. This device may not cause harmful interference, and

2. This device must accept any interference received, including interference that may cause undesirable operation.

Any changes or modifications not expressly approved by Silicon Labs could void the user’s authority to operate the equipment.

FCC RF Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specif-

ic operating instructions for satisfying RF exposure compliance. This transmitter meets both portable and mobile limits as demonstrated

in the RF Exposure Analysis. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter

except in accordance with FCC multi-transmitter product procedures.

OEM Responsibilities to comply with FCC Regulations:

OEM integrator is responsible for testing their end-product for any additional compliance requirements required with this module instal-

led (for example, digital device emissions, PC peripheral requirements, etc.).

• With BGM13S32 the antenna(s) must be installed such that a minimum separation distance of 50.5 mm is maintained between the

radiator (antenna) and all persons at all times.

• With BGM13S22 the antenna(s) must be installed such that a minimum separation distance of 0 mm is maintained between the radi-

ator (antenna) and all persons at all times.

• The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter except in accord-

ance with FCC multi-transmitter product procedures.

Important Note:

In the event that the above conditions cannot be met (for certain configurations or co-location with another transmitter), then the FCC

authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM inte-

grator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.

End Product Labeling

The variants of BGM13S Modules are labeled with their own FCC ID. If the FCC ID is not visible when the module is installed inside

another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed

module. In that case, the final end product must be labeled in a visible area with the following:

"Contains Transmitter Module FCC ID: QOQ13"

Or

"Contains FCC ID: QOQ13"

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or

change RF related parameters in the user manual of the end product.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Certifications

11.5 ISED Canada

ISEDC

This radio transmitter (IC: 5123A-13) has been approved by Industry Canada to operate with the antenna types listed above, with the

maximum permissible gain indicared. Antenna types not included in this list, having a gain greater than the maximum gain indicated for

that type, are strictly prohibited for use with this device.

This device complies with Industry Canada’s license-exempt RSS standards. Operation is subject to the following two conditions:

1. This device may not cause interference; and

2. This device must accept any interference, including interference that may cause undesired operation of the device

RF Exposure Statement

Exception from routine SAR evaluation limits are given in RSS-102 Issue 5.

The models BGM13S32A and BGM13S32N meet the given requirements when the minimum separation distance to human body is 40

mm.

The models BGM13S22A and BGM13S22N meet the given requirements when the minimum separation distance to human body is 15

mm.

RF exposure or SAR evaluation is not required when the separation distance is same or more than stated above. If the separation dis-

tance is less than stated above the OEM integrator is responsible for evaluating the SAR.

OEM Responsibilities to comply with IC Regulations

The BGM13S modules have been certified for integration into products only by OEM integrators under the following conditions:

• The antenna(s) must be installed such that a minimum separation distance as stated above is maintained between the radiator (an-

tenna) and all persons at all times.

• The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter.

As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still respon-

sible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital

device emissions, PC peripheral requirements, etc.).

IMPORTANT NOTE

In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter), then the ISEDC

authorization is no longer considered valid and the IC ID cannot be used on the final product. In these circumstances, the OEM integra-

tor will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate ISEDC authorization.

End Product Labeling

The BGM13S module is labeled with its own IC ID. If the IC ID is not visible when the module is installed inside another device, then the

outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final

end product must be labeled in a visible area with the following:

“Contains Transmitter Module IC: 5123A-13 ”

or

“Contains IC: 5123A-13”

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or

change RF related parameters in the user manual of the end product.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Certifications

ISEDC (Français)

Industrie Canada a approuvé l’utilisation de cet émetteur radio (IC: 5123A-13) en conjonction avec des antennes de type dipolaire à

2.14dBi ou des antennes embarquées, intégrée au produit. L’utilisation de tout autre type d’antenne avec ce composant est proscrite.

Ce composant est conforme aux normes RSS, exonérées de licence d'Industrie Canada. Son mode de fonctionnement est soumis aux

deux conditions suivantes:

1. Ce composant ne doit pas générer d’interférences.

2. Ce composant doit pouvoir est soumis à tout type de perturbation y compris celle pouvant nuire à son bon fonctionnement.

Déclaration d'exposition RF

L'exception tirée des limites courantes d'évaluation SAR est donnée dans le document RSS-102 Issue 5.

Les modules BGM13S32A and BGM13S32N répondent aux exigences requises lorsque la distance minimale de séparation avec le

corps humain est de 40 mm.

Les modules BGM13S22A and BGM13S22N répondent aux exigences requises lorsque la distance minimale de séparation avec le

corps humain est de 15 mm.

La déclaration d’exposition RF ou l'évaluation SAR n'est pas nécessaire lorsque la distance de séparation est identique ou supérieure à

celle indiquée ci-dessus. Si la distance de séparation est inférieure à celle mentionnées plus haut, il incombe à l'intégrateur OEM de

procédé à une évaluation SAR.

Responsabilités des OEM pour une mise en conformité avec le Règlement du Circuit Intégré

Le module BGM13S a été approuvé pour l'intégration dans des produits finaux exclusivement réalisés par des OEM sous les conditions

suivantes:

• L'antenne (s) doit être installée de sorte qu'une distance de séparation minimale indiquée ci-dessus soit maintenue entre le radiateur

(antenne) et toutes les personnes avoisinante, ce à tout moment.

• Le module émetteur ne doit pas être localisé ou fonctionner avec une autre antenne ou un autre transmetteur que celle indiquée

plus haut.

Tant que les deux conditions ci-dessus sont respectées, il n’est pas nécessaire de tester ce transmetteur de façon plus poussée. Ce-

pendant, il incombe à l’intégrateur OEM de s’assurer de la bonne conformité du produit fini avec les autres normes auxquelles il pour-

rait être soumis de fait de l’utilisation de ce module (par exemple, les émissions des périphériques numériques, les exigences de pé-

riphériques PC, etc.).

REMARQUE IMPORTANTE

ans le cas où ces conditions ne peuvent être satisfaites (pour certaines configurations ou co-implantation avec un autre émetteur), l'au-

torisation ISEDC n'est plus considérée comme valide et le numéro d’identification ID IC ne peut pas être apposé sur le produit final.

Dans ces circonstances, l'intégrateur OEM sera responsable de la réévaluation du produit final (y compris le transmetteur) et de l'ob-

tention d'une autorisation ISEDC distincte.

Étiquetage des produits finis

Les modules BGM13S sont étiquetés avec leur propre ID IC. Si l'ID IC n'est pas visible lorsque le module est intégré au sein d'un autre

produit, cet autre produit dans lequel le module est installé devra porter une étiquette faisant apparaitre les référence du module inté-

gré. Dans un tel cas, sur le produit final doit se trouver une étiquette aisément lisible sur laquelle figurent les informations suivantes:

“Contient le module transmetteur: 5123A-13 ”

or

“Contient le circuit: 5123A-13”

L'intégrateur OEM doit être conscient qu’il ne doit pas fournir, dans le manuel d’utilisation, d'informations relatives à la façon d'installer

ou de d’enlever ce module RF ainsi que sur la procédure à suivre pour modifier les paramètres liés à la radio.

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Certifications

11.6 Japan

The BGM13S22A and BGM13S22N are certified in Japan with certification number 209-J00306.

Since September 1, 2014 it is allowed (and highly recommended) that a manufacturer who integrates a radio module in their host

equipment can place the certification mark and certification number (the same marking/number as depicted on the label of the radio

module) on the outside of the host equipment. The certification mark and certification number must be placed close to the text in the

Japanese language which is provided below. This change in the Radio Law has been made in order to enable users of the combination

of host and radio module to verify if they are actually using a radio device which is approved for use in Japan.

Certification Text to be Placed on the Outside Surface of the Host Equipment:

Translation of the text:

“This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under

the Radio Law.”

The "Giteki" marking shown in the figures below must be affixed to an easily noticeable section of the specified radio equipment. Note

that additional information may be required if the device is also subject to a telecom approval.

Figure 11.1. GITEKI Mark and ID

Figure 11.2. GITEKI Mark

11.7 KC South Korea

The BGM13S22A and BGM13S22N have certification in South-Korea.

Certification number: R-C-BGT-13

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BGM13S Blue Gecko Bluetooth SiP Module Data Sheet

Revision History

12. Revision History

Revision 1.1

August 2019

• Updated OPNs in 2. Ordering Information.

• Added 11.7 KC South Korea with updated certification ID number.

• Updated certification ID number in 11.6 Japan.

• Updated RF Exposure Statement to 15 mm distance for BGM13S22A and BGM13S22N in 11.5 ISED Canada.

• Added PLFRCO block and associated specifications.

• Added PLFRCO block in Figure 3.1 BGM13S Block Diagram on page 7.

• Added PLFRCO current consumption value in Table 4.4 Current Consumption 3.3 V using DC-DC Converter on page 22, Table

4.5 Current Consumption 1.8 V (DC-DC Converter in Bypass Mode) on page 24, and Table 4.6 Current Consumption 3.3 V (DC-DC

Converter in Bypass Mode) on page 26.

• Added 4.1.9.4 Precision Low-Frequency RC Oscillator (PLFRCO) section.

• Added 9. Tape and Reel Specifications.

• Updated Figure 5.1 Typical Connections for BGM13S with UART Network Co-Processor on page 67 with the new layout guidelines.

• Updated 6.3 Effect of Plastic and Metal Materials with the new layout guidelines.

• Removed the Antenna Tuning image from 6.3 Effect of Plastic and Metal Materials.

• Updated Figure 8.2 BGM13S Recommended Antenna Clearance on page 127 in 8.2 BGM13S Recommeded PCB Land Pattern.

• Updated Figure 6.1 BGM13S PCB Top Layer Design on page 69 and Figure 6.2 BGM13S PCB Middle and Bottom Layer Design on

page 69.

• Added Figure 6.3 Practical Installation of BGM13S on Application PCB on page 69.

• Changed "BLE" to "Bluetooth Low Energy" throughout.

• Changed "Bluetooth 5.0 LE" to "Bluetooth 5" throughout.

Revision 1.0

October 2018

• Added Electrical Specifications Tables for VDAC, CSEN, OPAMP, PCNT and APORT.

• 5.1 Typical BGM13S Connections: Updated diagram to show IOVDD connection to Host CPU supply.

• Table 7.2 GPIO Functionality Table on page 75: Sorted by GPIO name.

• Removed unbonded I/O from APORT mapping tables.

• Packaging figures updated with latest annotations.

• Removed tape and reel specifications section.

• Added package marking specifications in 8.3 BGM13S Package Marking.

• Added certification chapter .

Revision 0.5

April 2018

• Removed PLFRCO content.

• Added V2 part numbers to Table 2.1 Ordering Information on page 3.

• Updated 4.1 Electrical Characteristics with latest characterization data and test limits.

• : Added optional 32.768 kHz crystal connection.

• : Corrected RTS/CTS naming on Host CPU for UART connection.

• : Corrected TCK/TMS order on standard ARM Cortex debug connector.

• 7.1 BGM13S Device Pinout: Changed pin 47 name from VSS to ANT_GND.

• 7.1 BGM13S Device Pinout: Corrected numbering of pins 50 and 51.

• Updated 8.2 BGM13S Recommeded PCB Land Pattern with latest drawings and dimension recommendations.

Revision 0.1

July 10, 2017

• Initial Release.

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Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or

intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical"

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Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the

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型号：	BGM13S32F512GN-V3R
厂家：	SILICON
描述：	Blue Gecko Bluetooth Â® SiP Module
文件：	总142页 (文件大小：3362K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BGM13S32F512GN-V3R [SILICON]

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