CPT112S-A01-GMR [SILICON]

No firmware development required;
CPT112S-A01-GMR
型号: CPT112S-A01-GMR
厂家: SILICON    SILICON
描述:

No firmware development required

文件: 总35页 (文件大小:478K)
中文:  中文翻译
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TouchXpress™ Family  
CPT112S Data Sheet  
The CPT112S device, part of the TouchXpress family, is designed  
to quickly add capacitive touch via an I2C interface by eliminating  
the firmware complexity and reducing the development time for ca-  
pacitive sensing applications.  
KEY FEATURES  
• No firmware development required  
• Simple GUI-based configurator  
• 12 Capacitive Sensor inputs with  
programmable sensitivity  
Supporting up to 12 capacitive sensor inputs in a 3 mm x 3 mm QFN package, the  
CPT112S is a highly-integrated device that interfaces via I2C to the host processor to  
provide a simple solution for adding capacitive touch. The device also comes with ad-  
vanced features like moisture immunity, wake-on proximity, and buzzer feedback for an  
enhanced user experience. No firmware development is needed, and all the capacitive  
touch sense parameters can be configured using a simple GUI-based configurator. By  
eliminating the need for complex firmware development, the CPT112S device enables  
rapid user interface designs with minimal development effort.  
• Configurable multi-button slider  
• I2C interface to communicate to the host  
• Lowest power capacitive sense solution  
• Active — 200 µA  
• Sleep — 1 µA  
• Wake on proximity  
• Superior noise immunity: SNR up to 270:1  
• Moisture immunity  
The CPT112S device is ideal for a wide range of capacitive touch applications including  
the following:  
• Mutually-exclusive touch qualifier  
• Medical equipment  
• Home appliances  
• Button touch time-out to avoid false  
touches  
• Consumer electronics  
• Instrument / Control panels  
• Buzzer output for audible touch feedback  
• Lighting control  
• White goods  
Input  
Features  
Capacitive Touch Sensing  
Features  
Output  
Features  
Mutually-  
Touch  
Proximity Wake  
Input  
Exclusive Touch  
Qualification  
I2C Output  
I2C Event Buffer  
Qualifier  
Option for a  
Multi-Button  
Slider  
Configuration  
Profile for each  
Input  
Optional Buzzer  
Output  
Baselining  
Interrupt Pin  
Input Engine  
with  
12 Inputs  
Low Power State  
Machine  
Touch Time-Out  
Timer  
Lowest power mode with feature operational:  
Active Optimized Active  
Low Power Sleep  
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This information applies to a product under development. Its characteristics and specifications are subject to change without notice.  
Preliminary Rev. 0.1  
CPT112S Data Sheet  
Feature List and Ordering Information  
1. Feature List and Ordering Information  
The CPT112S has the following features:  
• Capacitive sensing input engine with 12 inputs  
• Post-sample touch qualification engine  
• Configuration profile space in non-volatile memory  
• I2C event buffer with interrupt pin to signal when new touch events have been qualified  
• Low power state machine to minimize current draw in all use cases  
• Capacitive proximity sensing input  
• Buzzer output  
• Mutually-exclusive touch qualifier  
• Touch time-out timer  
CP T 1 12 S A 01 G M R  
Tape and Reel (Optional)  
Package Type  
Temperature Grade — –40 to +85 °C (G)  
Firmware Revision  
Hardware Revision  
Capacitive Sense Features — Slider (S)  
Number of Capacitive Sense Inputs  
Interface Type — GPO (0), I2C (1)  
TouchXpress Family  
Silicon Labs Xpress Product Line  
Figure 1.1. CPT112S Part Numbering  
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Preliminary Rev. 0.1 | 1  
CPT112S Data Sheet  
Typical Connection Diagrams  
2. Typical Connection Diagrams  
2.1 Signal, Analog, and Power connections  
Figure 2.1 Connection Diagram on page 2 shows a typical connection diagram for the power pins of CPT112S devices.  
CPT112S  
Device  
1.8-3.6 V (in)  
4.7 µF and 0.1 µF  
VDD  
bypass capacitors  
required for the power  
pins placed as close to  
the pins as possible.  
GND  
1.8-3.6 V (in)  
Host  
EB_SCL  
Processor  
EB_SDA  
EB_INT  
CS00  
Electrode  
...  
CS10  
Electrode  
1.8-3.6 V (in)  
Config Data  
Config Clk / RSTb  
Figure 2.1. Connection Diagram  
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Preliminary Rev. 0.1 | 2  
CPT112S Data Sheet  
Typical Connection Diagrams  
2.2 Configuration  
The diagram below shows a typical connection diagram for the configuration connections pins. The ToolStick Base Adapter is available  
on the evaluation board.  
VDD  
CPT112S Device  
1 k  
Config Clk  
Config Data  
GND  
ToolStick  
Figure 2.2. Configuration Connection Diagram  
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Preliminary Rev. 0.1 | 3  
CPT112S Data Sheet  
Electrical Specifications  
3. Electrical Specifications  
3.1 Electrical Characteristics  
All electrical parameters in all tables are specified under the conditions listed in Table 3.1 Recommended Operating Conditions on page  
4, unless stated otherwise.  
3.1.1 Recommended Operating Conditions  
Table 3.1. Recommended Operating Conditions  
Parameter  
Symbol  
Test Condition  
Min  
1.8  
Typ  
2.4  
1.4  
0.3  
Max  
3.6  
Unit  
V
Operating Supply Voltage on VDD VDD  
Minimum RAM Data Retention  
Voltage on VDD1  
VRAM  
Not in Sleep Mode  
Sleep Mode  
V
0.5  
85  
V
Operating Ambient Temperature  
TA  
–40  
°C  
Note:  
1. All voltages with respect to GND.  
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Preliminary Rev. 0.1 | 4  
CPT112S Data Sheet  
Electrical Specifications  
3.1.2 Power Consumption  
See 3.4 Typical Performance Curves for power consumption plots.  
Table 3.2. Power Consumption  
Parameter  
Symbol  
IDD  
Test Condition  
Min  
Typ  
3.1  
Max  
Unit  
mA  
µA  
Active Mode Supply Current  
Optimized Active Mode Supply  
Current  
IDD  
180  
Sleep Mode Current1, 2  
IDD  
3 sensors or fewer  
4 sensors  
0.78  
0.79  
0.81  
0.82  
0.84  
0.88  
0.95  
154  
77  
µA  
µA  
µA  
µA  
µA  
µA  
µA  
µA  
µA  
µA  
µA  
µA  
µA  
µA  
µA  
µA  
µA  
5 sensors  
6 sensors  
7 sensors  
10 sensors  
12 sensors  
System Current with Varying Scan IDD  
Time — Base with One Sensor1  
Scan period = 10 ms  
Scan period = 20 ms  
Scan period = 50 ms  
Scan period = 75 ms  
Scan period = 100 ms  
Scan period = 10 ms  
Scan period = 20 ms  
Scan period = 50 ms  
Scan period = 75 ms  
Scan period = 100 ms  
31  
21  
16  
System Current with Varying Scan IDD  
Time — Each Additional Sensor1  
47  
23  
9
6
5
Note:  
1. Measured with Free Run Mode disabled and sensors set to 4x accumulation, 8x gain.  
2. Measured with scan period set to 250 ms.  
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Preliminary Rev. 0.1 | 5  
CPT112S Data Sheet  
Electrical Specifications  
3.1.3 Reset and Supply Monitor  
Table 3.3. Reset and Supply Monitor  
Parameter  
Symbol  
VVDDM  
VWARN  
VPOR  
Test Condition  
Min  
1.7  
1.8  
Typ  
1.75  
1.85  
1.75  
1.0  
Max  
1.8  
1.9  
1.3  
3
Unit  
V
VDD Supply Monitor Threshold  
Reset Trigger  
Early Warning  
V
Power-On Reset (POR) Monitor  
Threshold  
Rising Voltage on VDD  
Falling Voltage on VDD  
Time to VDD ≥ 1.8 V  
V
0.75  
V
VDD Ramp Time  
tRMP  
ms  
µs  
RST Low Time to Generate Reset tRSTL  
15  
Boot Time1  
tboot  
1 sensor  
25  
ms  
ms  
ms  
ms  
ms  
ms  
ms  
ms  
ms  
ms  
ms  
ms  
2 sensors  
3 sensors  
4 sensors  
5 sensors  
6 sensors  
7 sensors  
8 sensors  
9 sensors  
10 sensors  
11 sensors  
12 sensors  
40  
55  
70  
85  
100  
115  
130  
145  
160  
175  
200  
Note:  
1. Boot time is defined as the time from a power-on reset or /RST pin release until the first capacitive sense scan begins.  
3.1.4 Configuration Memory  
Table 3.4. Configuration Memory  
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Units  
Endurance (Write/Erase Cycles)  
NWE  
20 k  
100 k  
Cycles  
Note:  
1. Data Retention Information is published in the Quarterly Quality and Reliability Report.  
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Preliminary Rev. 0.1 | 6  
CPT112S Data Sheet  
Electrical Specifications  
3.1.5 Capacitive Sense  
Table 3.5. Capacitive Sense  
Parameter  
Symbol  
Test Condition  
Accumulation = 1x  
Accumulation = 4x  
Accumulation = 8x  
Accumulation = 16x  
Accumulation = 32x  
Accumulation = 64x  
Accumulation = 1x  
Accumulation = 4x  
Accumulation = 8x  
Accumulation = 16x  
Accumulation = 32x  
Accumulation = 64x  
Gain = 1x  
Min  
Typ  
64  
Max  
Unit  
µs  
Scan Time Per Sensor1  
tSCAN  
256  
512  
1.024  
2.048  
4.096  
90:1  
180:1  
182:1  
210:1  
230:1  
270:1  
205  
123  
98  
µs  
µs  
ms  
ms  
ms  
Signal to Noise Ratio1, 2  
SNR  
codes  
codes  
codes  
codes  
codes  
codes  
µs  
Conversion Time  
tCONV  
Gain = 2x  
µs  
Gain = 3x  
µs  
Gain = 4x  
85  
µs  
Gain = 5x  
76  
µs  
Gain = 6x  
72  
µs  
Gain = 7x  
67  
µs  
Gain = 8x  
64  
µs  
Total Processing Time3  
tPROC  
1 sensor  
576  
796  
1.0  
µs  
2 sensors  
µs  
3 sensors  
ms  
4 sensors  
1.2  
ms  
5 sensors  
1.4  
ms  
6 sensors  
1.7  
ms  
7 sensors  
1.9  
ms  
8 sensors  
2.1  
ms  
9 sensors  
2.3  
ms  
10 sensors  
2.6  
ms  
11 sensors  
2.8  
ms  
12 sensors  
3.0  
ms  
Maximum External Capacitive  
Load  
CEXTMAX Gain = 8x  
Gain = 1x  
45  
pF  
500  
pF  
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Preliminary Rev. 0.1 | 7  
CPT112S Data Sheet  
Electrical Specifications  
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
Maximum External Series Impe-  
dance  
REXTMAX Gain = 8x  
50  
kΩ  
Note:  
1. Measured with gain set to 8x.  
2. Measured with an evaluation board with 1/16" overlay using Capacitive Sense Profiler.  
3. Sensors configured to 8x gain, 1x accumulation with sensor sampling and system processing time included and mutually-exclu-  
sive buttons, slider, buzzer, and touch time-outs disabled.  
3.1.6 Buzzer Output  
Table 3.6. Buzzer Output  
Parameter  
Symbol  
VOH  
VOL  
Test Condition  
IOH = –3 mA  
IOL = 8.5 mA  
IOH = –1 mA  
IOL = 1.4 mA  
VDD = 1.8 V  
Min  
VDD – 0.7  
Typ  
Max  
Unit  
V
Output High Voltage (High Drive)  
Output Low Voltage (High Drive)  
Output High Voltage (Low Drive)  
Output Low Voltage (Low Drive)  
Weak Pull-Up Current  
0.6  
V
VOH  
VOL  
VDD – 0.7  
V
0.6  
V
IPU  
–4  
µA  
VIN = 0 V  
VDD = 3.6 V  
VIN = 0 V  
–35  
–20  
µA  
3.2 Thermal Conditions  
Table 3.7. Thermal Conditions  
Test Condition  
Parameter  
Symbol  
Min  
Typ  
Max  
Unit  
Thermal Resistance*  
θJA  
60  
°C/W  
Note:  
1. Thermal resistance assumes a multi-layer PCB with any exposed pad soldered to a PCB pad.  
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Preliminary Rev. 0.1 | 8  
CPT112S Data Sheet  
Electrical Specifications  
3.3 Absolute Maximum Ratings  
Stresses above those listed in Table 3.8 Absolute Maximum Ratings on page 9 may cause permanent damage to the device. This is  
a stress rating only and functional operation of the devices at those or any other conditions above those indicated in the operation list-  
ings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. For  
more information on the available quality and reliability data, see the Quality and Reliability Monitor Report at http://www.silabs.com/  
support/quality/pages/default.aspx.  
Table 3.8. Absolute Maximum Ratings  
Parameter  
Symbol  
TBIAS  
TSTG  
VDD  
Test Condition  
Min  
–55  
Max  
125  
Unit  
°C  
°C  
V
Ambient Temperature Under Bias  
Storage Temperature  
–65  
150  
Voltage on VDD  
GND–0.3  
GND–0.3  
4.0  
Voltage on I/O pins or RSTb  
Total Current Sunk into Supply Pin  
VIN  
VDD + 0.3  
400  
V
IVDD  
mA  
mA  
Total Current Sourced out of Ground  
Pin  
IGND  
400  
Current Sourced or Sunk by Any I/O  
Pin or RSTb  
IIO  
–100  
100  
200  
105  
mA  
mA  
°C  
Maximum Total Current through all  
Port Pins  
IIOTOT  
Operating Junction Temperature  
TJ  
–40  
Exposure to maximum rating conditions for extended periods may affect device reliability.  
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Preliminary Rev. 0.1 | 9  
CPT112S Data Sheet  
Electrical Specifications  
3.4 Typical Performance Curves  
Figure 3.1. Active Mode Processing Time Per Sensor  
Note: Active mode processing time per sensor measured with sensors configured to 1x accumulation, 8x gain. Sensor sampling and  
system processing time is included with mutually-exclusive buttons, the buzzer, slider, and touch time-outs disabled.  
Figure 3.2. Current vs. Active Mode Scan Period — Base Current Consumption  
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Preliminary Rev. 0.1 | 10  
CPT112S Data Sheet  
Electrical Specifications  
Figure 3.3. Current vs. Active Mode Scan Period — Current Consumption for Each Additional Sensor  
Note: Active mode scan period current draw measured with free run mode disabled and all 12 sensors enabled at 4x accumulation, 8x  
gain. In addition, the buzzer, slider, and mutually-exclusive button groups were disabled.  
Figure 3.4. Typical VOH Curves  
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Preliminary Rev. 0.1 | 11  
CPT112S Data Sheet  
Electrical Specifications  
Figure 3.5. Typical VOL Curves  
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Preliminary Rev. 0.1 | 12  
CPT112S Data Sheet  
Functional Description  
4. Functional Description  
4.1 Capacitive Sensing Input  
4.1.1 Introduction  
The capacitive to digital converter uses an iterative, charge-timing self-capacitance technique to measure capacitance on an input pin.  
Sampling is configured and controlled by settings in the non-volatile configuration profile, which can be changed through the 2-pin con-  
figuration interface.  
Active threshold  
Inactive threshold  
Touch delta  
Baseline  
Time  
Figure 4.1. Capacitive Sense Data Types  
4.1.2 Touch Qualification Criteria  
The device detects a touch event when an inactive (untouched) input enabled by the input enable mask detects an sequence of meas-  
urements that cross the active threshold.  
The device detects a touch release event when an active (touched) input enabled by the input enable mask detects an sequence of  
measurements that cross the inactive threshold.  
The debounce configuration profile parameter defines how many measurements in a row must cross a threshold before a touch or re-  
lease is qualified. In electrically noisy environments more heavily filtered data is used for qualification.  
4.1.3 Thresholds  
Capacitive sensing inputs use input-specific thresholds for touch qualification. Each input uses two thresholds, one to detect inactive-to-  
active transitions on the input, and another to determine active-to-inactive transitions on the input. The inputs use two thresholds to add  
hysteresis and prevent active/inactive ringing on inputs. Each threshold can be set through Simplicity Studio tools and all thresholds are  
stored in non-volatile memory in the device's configuration profile.  
Thresholds are defined as percentages of a capacitive sensing input's touch delta.  
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CPT112S Data Sheet  
Functional Description  
4.1.4 Debounce Counter  
Each capacitive sensing input maintains its own debounce counter. For an inactive sensor, this counter tracks the number of succes-  
sive samples which have crossed that input's active threshold. For an active sensor, this counter tracks the number of successive sam-  
ples which have crossed the inactive threshold. When the counter reaches a terminal value defined in the the configuration profile, the  
touch/release event is qualified.  
4.1.5 Touch Deltas  
Each capacitive sensing input uses a stored touch delta value that describes the expected difference between inactive and active ca-  
pacitive sensing output codes. This value is stored in the configuration profile for the system and is used by the touch qualification en-  
gine, which defines inactive and active thresholds relative to the touch delta.  
The touch deltas are stored in the configuration profile in a touch delta/16 format. For this reason, touch deltas must be configured as  
multiples of 16.  
4.1.6 Auto-Accumulation and Averaging  
Capacitive sensing inputs have an auto-accumulate and average post-sample filter that can be used to improve signal strength if nee-  
ded. Settings stored in the configuration profile can configure the engine to accumulate 1, 4, 8, 16, 32, or 64 samples. After the defined  
number of samples have been accumulated, the result is divided by either 1, 4, 8, 16, 32, or 64, depending on the accumulation setting.  
This auto-accumulated and averaged value is the sample output used for all touch qualification processing. Note that sample time per  
sensor increases as the level of accumulation increases. To reduce current consumption, the engine should not be set to auto-accumu-  
late unless it is required to achieve acceptable signal strength due to thick overlays or other system-level factors.  
4.1.7 Drive strength  
The drive strength of the current source used to charge the electrode being measured by the capacitive sensing input can be adjusted  
in integer increments from 1x to 8x (8x is the default). High drive strength gives the best sensitivity and resolution for small capacitors,  
such as those typically implemented as touch-sensitive PCB features. To measure larger capacitance values, the drive strength should  
be lowered accordingly. The highest drive strength setting that yields capacitive sensing output which does not saturate the sensing  
engine when the electrode is active (touched) should always be used to maximize input sensitivity.  
4.1.8 Active Mode Scan Enable  
Active mode scanning of capacitive sensing inputs is controlled by an enable setting for each capacitive sensing input. This setting is  
stored in the configuration profile.  
4.1.9 Active Mode Scan Period  
The capacitive sensing input engine stays in active mode whenever one or more inputs have qualified as active. During this time, the  
sensors scan at a periodicity defined by the active mode scan period, which is stored in the configuration profile. Every active mode  
scan pushes new samples through the processing engine, which checks for new touch and release events on all enabled inputs.  
If free run mode is enabled, the engine will repeatedly scan all enabled inputs during the active mode scan period. In this mode of  
operation, the active mode scan period is used as a timer to determine how much time has passed since the last qualified active sensor  
has been seen. When a defined amount of time without a qualified touch event has occurred, the engine switches to a low power mode  
using the sleep mode scan period, and conserves current.  
If free run mode is disabled, the engine will enter a low power state after completing one scan of all enabled inputs and processing the  
resulting samples. The engine will remain in this low power state until it wakes, at a time defined by active mode scan period, to perform  
another scan.  
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CPT112S Data Sheet  
Functional Description  
4.1.10 Active Mode Scan Type  
The active mode scan type, which is stored in the configuration profile, controls whether the capacitive sensing engine in active mode  
will scan only once during the active mode scan period before going to sleep, or whether the engine will continue scanning as quickly  
as possible during the active mode scan period, never entering a low power state.  
For optimal responsiveness, the engine should be configured to run with free run mode enabled. Setting the scan mode to 'free run'  
causes touch qualification on a new touch to occur as quickly as the scanning engine can convert and process samples on all sensors.  
In this mode, qualification time is not bounded by active mode scan period, and is only bounded by scanning configuration factors such  
as the debounce setting, the number of enabled sensors, the accumulation setting on each sensor, and the timing constraints of any  
enabled component.  
For optimal current draw when in active mode, the engine should be configured to use the 'one scan per period' mode setting. In this  
case, touch qualification is bound by the scan period and the debounce setting of the device.  
Touch Event  
(t = 0 ms)  
10 ms  
20 ms  
30 ms  
40 ms  
additional  
processing  
additional  
processing  
Active  
process  
sample  
process  
sample  
debounce  
count = 1  
touch  
qualified  
Optimized  
Active  
Sleep  
sleep  
sleep  
Figure 4.2. Timing and Current — One Sample Per Period Mode  
Touch Event  
(t = 0 ms)  
10 ms  
20 ms  
30 ms  
40 ms  
additional  
processing  
additional  
processing  
Active  
process  
sample  
process  
debounce  
count = 1  
touch  
qualified  
Optimized  
Active  
sample  
Sleep  
Figure 4.3. Timing and Current — Free Run Mode  
4.1.11 Sleep Mode Scan Period  
The sleep mode scan period defines the rate at which a scan of the inputs enabled as wake-up sources are sampled. Each enabled  
sensor can also be enabled as a wake-up source. After the sleep mode scan completes, the scan is processed for a qualified candidate  
touch. If a candidate touch is qualified, the system wakes form sleep mode and enters active mode scanning.  
The sleep mode scan period is stored in the configuration profile and is defined in units of ms.  
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CPT112S Data Sheet  
Functional Description  
4.1.12 Active Mode and Sleep Mode Transitions  
Capacitive sensing inputs will stay in active mode until no inputs detect qualified touches for a span of time defined by the counts until  
sleep parameter stored in the configuration profile. The scan period of enabled inputs is defined by the active mode scan period, also  
found in the configuration profile. If free run mode is enabled, the active mode sensing engine will remain awake and scanning the sen-  
sors as fast as possible. If free run mode is disabled, the engine will put itself into a low power state for the remainder of the active  
mode scan period, after a scan has completed.  
When in sleep mode, the sensing engine will wake at a period defined by sleep mode scan period to do a scan on sensors that have  
been enabled as wakeup sources. If the engine finds a candidate touch in this state, the system reverts to active mode to continue  
scanning.  
Note that in systems where a proximity input is selected, the sleep mode scan engine uses conversions on the proximity input instead  
of sensors enabled as wakeup sources.  
touch release  
new touch  
t
sleep scan sees  
touch, wakes,  
qualifies touch  
qualified touch  
release  
no touch  
counter = 0  
no touch  
counter = 1  
no touch  
counter = 2  
...  
no touch counter  
= counts before  
sleep  
device enters  
sleep  
Figure 4.4. Active and Sleep Transitions  
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CPT112S Data Sheet  
Functional Description  
4.2 I2C Event Buffer Interface  
4.2.1 Introduction  
The event buffer I2C interface provides an event-driven, packetized communication system describing newly qualified events generated  
by the capacitive sensing input engine.  
The interface provides access to a first-in-first-out buffer of data packets. When the sensing engine generates these packets and push-  
es them onto the buffer. The interface then signals a host to indicate that one or more packets are available in the buffer by activating  
the event buffer interrupt pin.  
The interrupt pin is defined as active-low and operates as a push-pull digital output.  
The host reads the packets through an I2C interface, with the host acting as an I2C master. Once all packets have been fully transmit-  
ted across the I2C interface, the event buffer interrupt pin is de-activated. The device will remain in active mode until no packets remain  
in the buffer, even if no sensors have been qualified as active for the period of time defined by the active mode scan period and the  
counts before sleep value.  
4.2.2 Packet Retrieval  
Event buffer access mode enables the host to retrieve host data structures from the device using a master read transaction. Transfers  
in this mode should be made in 3-byte multiples to retrieve the entire event buffer structure.  
Once the host reads the last byte of one event, that event is popped from the buffer. If only a part of the event is read, the event will  
stay in the buffer and will be transmitted again by the device during the next read.  
If the event buffer is read when no events have been pushed into the buffer for access, the bytes retrieved during a master read trans-  
action across I2C will return 3 bytes of 0xFF padding.  
If the interrupt pin goes active during a transaction where the transmission of these 3 bytes of padding are being sent, the 3 bytes of  
padding will complete their transfer before a valid event will transmit.  
If the I2C master sends a stop condition on the bus before the entire three-byte packet has been read, the device will not pop the pack-  
et from its internal buffer. Instead, the I2C state machine will reset, and the next transaction will begin with the first byte of the same  
event that was being read in the previous, prematurely-terminated transaction.  
The I2C event buffer has a depth of 22 events. If the host does not read events promptly after seeing the interrupt pin go active, there is  
the possibility of a buffer overflow. In the event of an overflow, the I2C engine will discard the oldest events first.  
New I2C packets will only be generated at the active mode sample rate, and so the buffer will only fill at a maximum of 12 packets (in  
the case of 12 simultaneous touch/releases) per sample period. If the host runs the I2C bus at 400kHz and reads packets as soon as  
the interrupt pin activates, all packets can be read from the buffer in 1 to 2 ms, which is faster than the rate at which a new active mode  
scan sequence can complete.  
The configuraion profile includes an I2C timeout register. When enabled, this register configures the maximum duration at which pack-  
ets will be stored in the I2C buffer without being read from the host. If the interrupt pin is allowed to remain active for the duration de-  
fined by the timeout register, the I2C buffer will be flushed and the interrupt pin will deactivate. This feature is useful in applications  
where it is not desireable to have the device remain in active mode indefinitely.  
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Preliminary Rev. 0.1 | 17  
CPT112S Data Sheet  
Functional Description  
4.2.3 Event Packet Structure  
Every qualified event detected by the capacitive sensing input engine generates a single packet that can be retrieved by the host pro-  
cessor through the event buffer I2C interface. The packet is an atomic data unit that fully describes the generated event.  
Note: The bytes in the packet are transmitted MSB first.  
Each packet has a standard structure that can be parsed by the host.  
Table 4.1. Standard Packet Structure  
Byte #  
Designator  
0
1
2
3
I2C Slave Address + read bit  
Packet counter and event type  
Event description (byte 1)  
Event description (byte 2)  
The packet counter is a 4-bit number stored in the upper bits of byte 1. Each new event will be assigned a counter value that is +1 from  
the last qualified event. After event 15, the counter wraps back to 0 for the next event. The counter captures the temporal nature of  
touch events so that a host can reconstruct a sequence of events over time. Also, the host can use the counter value to determine if a  
packet has been lost due to a buffer overflow.  
The event type is a 4-bit value describes the originator of the event. For instance, the source could be a capacitive sensing button. The  
event type is stored in the lower 4 bits of byte 1.  
The event description bytes define characteristics of the event that have been qualified. Event descriptions are defined relative to the  
event source. An event source that is a capacitive sensing input will have a defined set of valid event description values. Those same  
values will mean something different for a different type of event source, such as a slider. Event description values are defined relative  
to the event type field of byte 1.  
packet  
counter  
0010  
event  
type  
0000  
I2C Slave Address  
+ read bit  
CSxx index  
byte 2  
reserved  
byte 3  
Touch  
Event  
byte 0  
byte 1  
packet  
counter  
0011  
event  
type  
0001  
I2C Slave Address  
+ read bit  
Touch  
Release  
Event  
CSxx index  
byte 2  
reserved  
byte 3  
byte 0  
byte 1  
packet  
counter  
0100  
event  
type  
0010  
I2C Slave Address  
+ read bit  
slider position  
(MSB)  
slider position  
(LSB)  
Slider  
Event  
byte 0  
byte 1  
byte 2  
byte 3  
Figure 4.5. I2C Event Buffer Packet Structure  
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Preliminary Rev. 0.1 | 18  
CPT112S Data Sheet  
Functional Description  
4.2.4 Defined Event Types  
The device assigns the following event types to events.  
Table 4.2. Event Type Mapping  
Event Type Value  
Mapping  
0
1
2
Sensor activity - touch event  
Sensor activity - release event  
Slider activity  
Note that this event type value is stored in the lower 4 bits of the first byte of a packet. The upper 4 bits are a packet counter value.  
4.2.5 Description Bytes for Touch Events  
A touch or release event uses only one byte of the description field. That field identifies which sensor caused the touch or release event  
as shown below.  
Table 4.3. Touch or Release Event Sensor Mapping  
Value  
Mapping  
0
Capacitive sensing input 0  
Capacitive sensing input 1  
Capacitive sensing input 2  
Capacitive sensing input 3  
Capacitive sensing input 4  
Capacitive sensing input 5  
Capacitive sensing input 6  
Capacitive sensing input 7  
Capacitive sensing input 8  
Capacitive sensing input 9  
Capacitive sensing input 10  
Capacitive sensing input 11  
1
2
3
4
5
6
7
8
9
10  
11  
4.2.6 Description Bytes for Slider Events  
The slider activity description field uses two bytes to describe the position of the slider, which can be any value between 0 (0x0000) and  
65534 (0xFFFE). The most-significant byte of this value is transmitted in the first byte (byte 2 of the event packet), and the least-signifi-  
cant byte is transmitted second (byte 3 of the event packet).  
When the slider is released, a final slider event will be transmitted with 0xFFFF in the two-byte field.  
4.2.7 Event Buffer I2C Slave Address  
The device's I2C slave address is configurable through the configuration profile. The device will ACK its slave address only when the  
interrupt pin is low, signalling that a packet is ready to be read by the host. If the interrupt pin is logic high, the device will not ACK its  
slave address.  
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Preliminary Rev. 0.1 | 19  
CPT112S Data Sheet  
Functional Description  
4.3 Capacitive Proximity Sensing  
4.3.1 Wake on Proximity  
The wake on capacitive proximity detection engine monitors for the presence of a conductive object such as a hand to move within  
detectable range of the sensor. When the engine detects an object, the device wakes from sleep and can begin qualifying touch events  
on all sensors enabled for active mode sensing.  
4.3.2 Proximity Configuration  
The proximity sensing feature uses a single sensor input for proximity qualification. The configuration profile stores the pin chosen by  
the user. The sensor used for proximity qualification should also have a drive strength setting that is as high as possible without saturat-  
ing the input when no conductive object is in proximity to the proximity sensor. The accumulation setting of the input is also configura-  
ble.  
The proximity threshold controls the sensitivity of the input. A lower threshold setting increases sensitivity and increases the range of  
the sensor.  
A proximity sensing input cannot be used for touch qualification, and so the active and inactive thresholds are not used for proximity  
sensors. Additionally, the proximity input has no effect on other components of the device such as mutually exclusive button groups,  
buzzer output, touch time out timers, and sliders.  
4.4 Slider  
The device supports creation of a single slider that is composed of two or more capacitive sensing input pins. The pins chosen as slider  
inputs are assigned to the slider feature through the configuration profile.  
The configuration profile also stores a value designated as the highest positional value that can be derived by the slider engine. That  
highest value is used to derive the values of all intermediate positions on the slider array.  
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CPT112S Data Sheet  
Functional Description  
When a capacitive sensing input pin is designated as a slider input, it will no longer function as a 'button' input and will not generate  
button style touch/release events across the I2C buffer interface.  
Touching the slider pads and moving a finger along a slider pad generates an event packet of type Slider, with the remaining two bytes  
of the packet describing the calculated active position of the slider.  
The range of possible reported slider active positions can be 0 to the maximum value of the slider as defined in the configuration profile,  
which can be any value between 40 and 65534. The 65535 (0xFFFF) value is reserved for a slider untouched event.  
Position 0 is always assigned to the lowest CSxx sensor enabled as a slider input. The maximum position value of the slider is assigned  
to the highest CSxx sensor enabled as a slider input. All slider inputs in between are assumed to be routed to the slider contiguously,  
lowest to highest.  
Valid  
Configuration  
CS00  
CS03  
CS02  
CS02  
CS04  
CS05  
CS00  
CS03  
increasing slider  
position  
Valid  
Configuration  
CS01  
increasing slider  
position  
Invalid  
Configuration  
CS00  
CS02  
CS01  
Figure 4.6. Slider Behavior and Layout Constraints  
Slider touch qualification uses the same touch deltas and thresholds that are defined in the configuration profile for all enabled sensors.  
The user should configure slider sensors through the configuration profile, just as one would configure a sensor assigned to a capaci-  
tive button.  
For optimal performance, each sensor used in the slider should have roughly the same touch surface area dimensions.  
If the touch-timeout feature is enabled, slider-assigned inputs will also be subject to being qualified as releases by the touch-timeout  
feature.  
The mutually exclusive button grouping feature does not affect slider-assigned sensors. Even if the mutually exclusive button grouping  
feature is enabled, multiple slider-assigned sensors can still be used to resolve a finger's position on the slider.  
4.5 Touch Time-Out  
The touch time-out feature can be enabled and disabled through the configuration profile. When enabled, the device will monitor touch  
event duration on each input independently.  
When a touch event exceeds a duration specified in the configuration profile, the device forces a release event, even if the user is still  
actively touching the sensor.  
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Preliminary Rev. 0.1 | 21  
CPT112S Data Sheet  
Functional Description  
The feature qualifies a touch release by adding the configured touch delta value for that sensor to the sensor's current baseline value.  
By doing this, the raw data-to-baseline delta created by the touch will be removed, and the touch qualification engine will see this as a  
touch release event.  
When the user removes a finger from a sensor that had been qualified active but has been qualified released through touch timeout, the  
resulting raw-to-baseline negative delta will be aggressively tracked downward by the baseline, resulting in a sensor that remains sensi-  
tive to successive touches.  
The touch timeout duration is configured globally, so all inputs are monitored for the same touch duration.  
If both the touch timeout feature and the mutually exclusive button group feature are enabled, the timeout timer will only run on the  
touch that is externally reported as being active.  
4.6 Buzzer Output  
4.6.1 Introduction  
The buzzer output engine produces a square wave of a configurable duration and frequency when a capacitive sensing input goes from  
inactive to active. The feature can be enabled and disabled through the configuration profile. The configuration profile also includes the  
settings for active duration and frequency.  
Device Execution  
additional  
processing  
additional  
processing  
Active  
process  
sample  
process  
sample  
Optimized  
Active  
Sleep  
sleep  
sleep  
No Touch, Buzzer Inactive  
Figure 4.7. Effects of the Buzzer on Current Draw — Active Mode, No Touch, Buzzer Inactive  
Device Execution  
process  
sample  
process  
sample  
additional  
processing  
sleep  
(stall)  
additional  
processing  
sleep  
(stall)  
Active  
Optimized  
Active  
Sleep  
Touch Detected, Buzzer Active  
Figure 4.8. Effects of the Buzzer on Current Draw — Active Mode, Touch Detected, Buzzer Active  
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Preliminary Rev. 0.1 | 22  
CPT112S Data Sheet  
Functional Description  
4.6.2 Buzzer Configuration  
When enabled, buzzer output will appear on the CS11/buzzer pin (pin 10) of the device. When buzzer output is enabled, CS11 is not  
available for capactive input sensing.  
When activated, the buzzer will remain active for either the duration specified in the configuration profile, or until the last active sensor  
has qualified a touch release.  
The configuration profile supports configuration of output frequencies ranging from 1 kHz to 4 kHz.  
The configuration profile can configure the buzzer output pin to either push pull mode or open drain mode.  
4.7 Mutually Exclusive Buttons  
When enabled through the configuration profile, this system allows one and only one capacitive sensing input to be qualified as active  
at a time. The first sensor active will remain the only sensor active until released. The device will internally qualify multiple touch and  
release events but will not report them.  
If multiple sensors have been internally qualified as active, the first sensor's touch event will be reported. If a touch event occurs simul-  
taneously on more than one sensor, the touch with the highest touch delta will be reported.  
If two sensors are qualified as active and the sensor being reported as active qualifies a touch release, the device will report that re-  
lease and then report a touch qualification on the still-active second sensor.  
In the case where a device has simultaneously qualified more than two active sensors and the reported active sensor qualifies and  
reports a release, the remaining qualified sensor with the highest sensor name will then be reported. For example, if sensors CS00,  
CS01, and CS02 are active with CS00 externally reported as active, after CS00's release, CS02 would be externally reported as an  
active sensor unless the device has already qualified a touch release on CS02.  
If both the touch timeout feature and the mutually exclusive button group feature are enabled, the timeout timer will only run on the  
touch that is externally reported as being active.  
Device Execution  
physical touch on pad  
touch reported by CPT device  
release reported by CPT device  
Figure 4.9. Mutually-Exclusive Button Operation  
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Preliminary Rev. 0.1 | 23  
CPT112S Data Sheet  
Functional Description  
4.8 Self Testing  
4.8.1 Introduction  
When the self-test feature is enabled through the configuration profile, the device performs a check on all enabled capacitive sensing  
inputs upon startup to determine whether the sensing input pins are erroneously shorted to ground or supply. If a short or open is found  
on a sensor, the self test feature will signal that an error has been found through a port pin. The feature will then disable that sensor  
before beginning touch qualification scans on all sensors left enabled.  
4.8.2 Test Failure Signaling  
If the self test check reveals an error, the device will toggle the I2C buffer interrupt pin at a frequency of 2 Hz. This toggling will persist  
for two seconds if the device detects one or more self test errors.  
4.9 Configuration Profile  
The configuration interface is used by the device to configure default values and performance characteristics that effect capacitive  
sensing. The configuration data can be programmed through the Configuration interface (Config Clk and Config Data pins) using [Con-  
figurator] in Simplicity Studio.  
Several configuration profile templates are available in Simplicity Studio to provide a starting point for development.  
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Preliminary Rev. 0.1 | 24  
CPT112S Data Sheet  
Pin Definitions  
5. Pin Definitions  
1
16  
CS01  
CS00  
GND  
VDD  
CS06  
CS07  
CS08  
CS09  
GND  
2
3
4
5
15  
14  
13  
12  
20 pin QFN  
(Top View)  
RSTb /  
Config Clk  
GND  
Config Data  
CS10  
6
11  
Figure 5.1. CPT112S Pinout  
Table 5.1. Pin Definitions for CPT112S-QFN20  
Pin Name Description  
Pin  
Number  
1
CS01  
CS00  
Analog input  
Capactive sensing input 1  
Analog input  
2
Capacitive sensing input 0  
Ground  
3
4
5
GND  
VDD  
Supply power input  
Active-low reset /  
Configuration clock  
Configuration data  
RSTb /  
Config Clk  
Config Data  
6
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Preliminary Rev. 0.1 | 25  
CPT112S Data Sheet  
Pin Definitions  
Pin  
Pin Name  
EB_INT  
Description  
Number  
7
Push-pull digital output  
Event buffer interrupt pin  
Open drain digital output  
Event buffer I2C SCL  
Open drain digital input  
Event buffer I2C SDA  
Analog input, capacitive sensing input 11  
Digital output for buzzer  
Analog input  
8
EB_SCL  
EB_SDA  
9
10  
11  
CS11 /  
Buzzer  
CS10  
Capacitive sensing input 10  
Ground  
12  
13  
GND  
CS09  
Analog input  
Capacitive sensing input 9  
Analog input  
14  
15  
16  
17  
18  
19  
20  
CS08  
CS07  
CS06  
CS05  
CS04  
CS03  
CS02  
Capacitive sensing input 8  
Analog input  
Capacitive sensing input 7  
Analog input  
Capacitive sensing input 6  
Analog input  
Capacitive sensing input 5  
Analog input  
Capacitive sensing input 4  
Analog input  
Capacitive sensing input 3  
Analog input  
Capacitive sensing input 2  
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Preliminary Rev. 0.1 | 26  
CPT112S Data Sheet  
QFN20 Package Specifications  
6. QFN20 Package Specifications  
6.1 QFN20 Package Dimensions  
Figure 6.1. QFN20 Package Drawing  
Table 6.1. QFN20 Package Dimensions  
Dimension  
Min  
0.50  
0.00  
0.20  
0.275  
Typ  
0.55  
Max  
0.60  
0.05  
0.30  
0.375  
A
A1  
b
0.25  
b1  
D
0.325  
3.00 BSC  
1.70  
D2  
e
1.6  
1.80  
0.50 BSC  
0.513 BSC  
3.00 BSC  
1.70  
e1  
E
E2  
L
1.60  
0.35  
1.80  
0.45  
0.40  
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Preliminary Rev. 0.1 | 27  
CPT112S Data Sheet  
QFN20 Package Specifications  
Dimension  
L1  
Min  
0.00  
Typ  
Max  
0.10  
aaa  
0.10  
0.10  
0.05  
bbb  
ddd  
eee  
0.08  
Note:  
1. All dimensions shown are in millimeters (mm) unless otherwise noted.  
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.  
3. This drawing is based upon JEDEC Solid State Product Outline MO-248 but includes custom features which are toleranced per  
supplier designation.  
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.  
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Preliminary Rev. 0.1 | 28  
CPT112S Data Sheet  
QFN20 Package Specifications  
6.2 QFN20 PCB Land Pattern  
Figure 6.2. QFN20 PCB Land Pattern Drawing  
Table 6.2. QFN20 PCB Land Pattern Dimensions  
Dimension  
Min  
Max  
C1  
C2  
C3  
C4  
E
2.70  
2.70  
2.53  
2.53  
0.50 REF  
0.20  
0.24  
1.70  
0.50  
0.24  
1.70  
X1  
X2  
X3  
Y1  
Y2  
Y3  
0.30  
.034  
1.80  
0.60  
0.34  
1.80  
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Preliminary Rev. 0.1 | 29  
CPT112S Data Sheet  
QFN20 Package Specifications  
Dimension  
Note:  
Min  
Max  
1. All dimensions shown are in millimeters (mm) unless otherwise noted.  
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.  
3. This Land Pattern Design is based on the IPC-7351 guidelines.  
4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm  
minimum, all the way around the pad.  
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.  
6. The stencil thickness should be 0.125 mm (5 mils).  
7. The ratio of stencil aperture to land pad size should be 1:1 for the perimeter pads.  
8. A 2x2 array of 0.75 mm openings on a 0.95 mm pitch should be used for the center pad to assure proper paste volume.  
9. A No-Clean, Type-3 solder paste is recommended.  
10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.  
6.3 QFN20 Package Marking  
112S  
TTTT  
YWW+  
Figure 6.3. QFN20 Package Marking  
The package marking consists of:  
• 112S – The part number designation.  
• TTTT – A trace or manufacturing code. The first letter of this code is the hardware revision.  
• Y – The last digit of the assembly year.  
• WW – The 2-digit workweek when the device was assembled.  
• + – Indicates the device is RoHS-compliant.  
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Preliminary Rev. 0.1 | 30  
CPT112S Data Sheet  
Relevant Application Notes  
7. Relevant Application Notes  
The following Application Notes are applicable to the CPT112S devices:  
AN957: TouchXpress™ Configuration and Profiling Guide — This application note guides developers through the evaluation and  
configuration process of TouchXpress devices using Simplicity Studio [Xpress Configurator] and [Capacitive Sense Profiler].  
AN447: Printed Circuit Design Notes for Capacitive Sensing Performance — This document describes hardware design guidelines  
specifically for capacitive sensing applications, including button placement and other layout guidelines.  
AN949: TouchXpress™ Programming Guide — This application note discusses the production programming options available for  
TouchXpress devices.  
Application Notes can be accessed on the Silicon Labs website (www.silabs.com/interface-appnotes) or in Simplicity Studio using the  
[Application Notes] tile.  
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Preliminary Rev. 0.1 | 31  
Table of Contents  
1. Feature List and Ordering Information . . . . . . . . . . . . . . . . . . . . . . 1  
2. Typical Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . 2  
2.1 Signal, Analog, and Power connections . . . . . . . . . . . . . . . . . . . . . 2  
2.2 Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
3. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
3.1 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
3.1.1 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . 4  
3.1.2 Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
3.1.3 Reset and Supply Monitor . . . . . . . . . . . . . . . . . . . . . . . . . 6  
3.1.4 Configuration Memory . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
3.1.5 Capacitive Sense . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
3.1.6 Buzzer Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
3.2 Thermal Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
3.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . 9  
3.4 Typical Performance Curves . . . . . . . . . . . . . . . . . . . . . . . . .10  
4. Functional Description. . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
4.1 Capacitive Sensing Input . . . . . . . . . . . . . . . . . . . . . . . . . .13  
4.1.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13  
4.1.2 Touch Qualification Criteria. . . . . . . . . . . . . . . . . . . . . . . . .13  
4.1.3 Thresholds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13  
4.1.4 Debounce Counter . . . . . . . . . . . . . . . . . . . . . . . . . . .14  
4.1.5 Touch Deltas . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14  
4.1.6 Auto-Accumulation and Averaging . . . . . . . . . . . . . . . . . . . . . .14  
4.1.7 Drive strength . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14  
4.1.8 Active Mode Scan Enable . . . . . . . . . . . . . . . . . . . . . . . . .14  
4.1.9 Active Mode Scan Period . . . . . . . . . . . . . . . . . . . . . . . . .14  
4.1.10 Active Mode Scan Type . . . . . . . . . . . . . . . . . . . . . . . . .15  
4.1.11 Sleep Mode Scan Period . . . . . . . . . . . . . . . . . . . . . . . . .15  
4.1.12 Active Mode and Sleep Mode Transitions . . . . . . . . . . . . . . . . . . .16  
4.2 I2C Event Buffer Interface . . . . . . . . . . . . . . . . . . . . . . . . . .17  
4.2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17  
4.2.2 Packet Retrieval . . . . . . . . . . . . . . . . . . . . . . . . . . . .17  
4.2.3 Event Packet Structure . . . . . . . . . . . . . . . . . . . . . . . . . .18  
4.2.4 Defined Event Types . . . . . . . . . . . . . . . . . . . . . . . . . . .19  
4.2.5 Description Bytes for Touch Events . . . . . . . . . . . . . . . . . . . . . .19  
4.2.6 Description Bytes for Slider Events . . . . . . . . . . . . . . . . . . . . . .19  
4.2.7 Event Buffer I2C Slave Address . . . . . . . . . . . . . . . . . . . . . . .19  
4.3 Capacitive Proximity Sensing. . . . . . . . . . . . . . . . . . . . . . . . .20  
4.3.1 Wake on Proximity . . . . . . . . . . . . . . . . . . . . . . . . . . .20  
4.3.2 Proximity Configuration . . . . . . . . . . . . . . . . . . . . . . . . . .20  
4.4 Slider. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20  
4.5 Touch Time-Out . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21  
Table of Contents 32  
4.6 Buzzer Output. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22  
4.6.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22  
4.6.2 Buzzer Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . .23  
4.7 Mutually Exclusive Buttons . . . . . . . . . . . . . . . . . . . . . . . . .23  
4.8 Self Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24  
4.8.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24  
4.8.2 Test Failure Signaling . . . . . . . . . . . . . . . . . . . . . . . . . .24  
4.9 Configuration Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . .24  
5. Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
6. QFN20 Package Specifications. . . . . . . . . . . . . . . . . . . . . . . . 27  
6.1 QFN20 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . .27  
6.2 QFN20 PCB Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . .29  
6.3 QFN20 Package Marking . . . . . . . . . . . . . . . . . . . . . . . . . .30  
7. Relevant Application Notes . . . . . . . . . . . . . . . . . . . . . . . . . 31  
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32  
Table of Contents 33  
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