EFM32GG900F512G-D-D1I [SILICON]
This change is considered a minor change which does not affect form, fit, function, quality, or reliability.;
| 型号： | EFM32GG900F512G-D-D1I |
| 厂家： | 
SILICON |
| 描述： | This change is considered a minor change which does not affect form, fit, function, quality, or reliability. |
| 文件： | 总1页 (文件大小：61K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Bulletin #1412112
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Bulletin Date: 12/11/2014
Bulletin Effective Date: 12/11/2014
Title: EFM32GG900 Datasheet Revision Notification
Originator: Ted Batey
Phone: 512-532-5279
Dept: Marketing
Dept: Sales
Customer Contact: Kathy Haggar
Phone: 512-532-5261
Bulletin Details
Description:
Silicon Labs is pleased to announce version 1.1 of the EFM32GG900 Giant Gecko wafer sale datasheet
is now available. This revision updates section 3.4 Bonding Instructions with a recommendation to use
gold bond wires. An Environmental section (3.5.1) has also been added which discusses potential bare
die sensitivity to ambient light.
Reason:
This bulletin recommends that customers purchasing wafers and designing their own packages use gold
bond wires. Customers using bare die also need to be aware of potential light sensitivity.
Product Identification:
EFM32GG900F512G-D-D1I
EFM32GG900F1024G-D-D1I
This change is considered a minor change which does not affect form, fit, function, quality, or
reliability. The information is being provided as a customer courtesy.
Please contact your local Silicon Labs sales representative with any questions about this notification.
A list of Silicon Labs sales representatives may be found at www.silabs.com
Customer Actions Needed:
Review packaging and bonding design to ensure use of gold bond wires.
W7206F2 Silicon Labs Bulletin rev J
The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in
part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 3
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