EFR32BG12P232F1024GM68-CR

®

EFR32BG12 Blue Gecko Bluetooth 低エ

ネルギー SoC ファミリ・データ・シート

SoC の Blue Gecko Bluetooth 低エネルギー・ファミリは、Wireless

主な機能

Gecko ポートフォリオの一部です。Blue Gecko SoC は、IoT デバ

イス向けの省エネ Bluetooth 5 ネットワークの実現に最適です。

• 32 ビット ARM® Cortex®-M4 コア、最大

動作周波数 40 MHz

このシングルダイ・ソリューションは、業界トップクラスのエネルギー効率、超高速の

ウェイクアップ時間、スケーラブルな電力増幅器、統合型バラン、および優れた MCU 機

能を提供します。

• 最大フラッシュ 1 MB、RAM 256 kB

• EFR32BG ファミリとのピン互換性（5V ト

レラント・ピンは例外）

• 12 チャンネル・ペリフェラル・リフレック

ス・システム、低エネルギー・センサー・

インターフェイス & マルチチャンネル静

電容量式センス・インターフェイス

Blue Gecko アプリケーションには以下が含まれます。

• IoT センサーおよびエンド・デバイス

• 健康およびウェルネス

• 自律ハードウェア Crypto アクセラレータ

と真の乱数発生器

• ホーム・オートメーションとビル・オートメーション

• 付属品

• 最大 19 dBm (2.4 GHz) と 20 dBm（サブ

GHz）tx 電源の統合型 PA

• ヒューマン・インターフェイス・デバイス

• メータリング

• 2.4 GHz 向け統合型バラン

• 堅牢なペリフェラル・セットと最大 65

GPIO

• 業務用および小売用の照明とセンサー

Core / Memory

Clock Management

Energy Management

Other

CRYPTO

CRC

High Frequency

Crystal

Oscillator

High Frequency

RC Oscillator

Voltage

Voltage Monitor

Power-On Reset

Regulator

ARM Cortex^TMM4 processor

Memory

with DSP extensions and FPU

Protection Unit

Auxiliary High

Frequency RC

Oscillator

Low Frequency

RC Oscillator

DC-DC

Converter

True Random

Number Generator

Low Frequency

Crystal

Oscillator

Ultra Low

Frequency RC

Oscillator

Flash Program

RAM Memory

Memory

Debug Interface

with ETM

LDMA

Controller

Brown-Out

Detector

SMU

32-bit bus

Peripheral Reflex System

Radio Transceiver

Serial

I/O Ports

Timers and Triggers

Analog I/F

Interfaces

RFSENSE

Sub GHz

LNA

DEMOD

ADC

I

External

Interrupts

USART

Timer/Counter

Protocol Timer

RF Frontend

Analog

Comparator

IFADC

AGC

PGA

PA

Low Energy

UART^TM

General

Purpose I/O

Low Energy

Timer

Watchdog Timer

Q

IDAC

To Sub GHz

receive I/Q

mixers and PA

Real Time

Counter and

Calendar

RFSENSE

BALUN

Capacitive Sense

I²C

Pin Reset

Pulse Counter

2.4 GHz

LNA

I

Frequency

Synthesizer

MOD

VDAC

RF Frontend

Low Energy

Sensor Interface

Pin Wakeup

Cryotimer

Op-Amp

PA

To 2.4 GHz receive

I/Q mixers and PA

To Sub GHz

and 2.4 GHz PA

Q

Lowest power mode with peripheral operational:

EM0—Active EM1—Sleep

EM2—Deep Sleep

EM3—Stop

EM4—Hibernate

EM4—Shutoff

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Rev. 1.4

®

EFR32BG12 Blue Gecko Bluetooth 低エネルギー SoC ファミリ・データ・シート

機能リスト

第 1 章機能リスト

EFR32BG12 の主な機能を以下に示します。

• 低消費電力ワイヤレス・システム・オンチップ

• MCU ペリフェラルの幅広い選択肢

• DSP 命令と浮動小数点演算ユニットを備えた高性能 32 ビ

ット 40 MHz ARM Cortex^®-M4 による効率的な信号処理

• 12-bit 1 Msps SAR アナログ・デジタル・コンバータ（ADC）

• 2 × アナログ・コンパレータ（ACMP）

• 高度なデバッグ用エンベデッド・トレース・マクロセル

（ETM）

• 2 × デジタル・アナログ・コンバータ（VDAC）

• 3 × オペアンプ（Opamp）

• 最大 1024 kB のフラッシュ・プログラム・メモリ

• 最大 256 kB の RAM データ・メモリ

• 2.4 GHz およびサブ GHz 無線動作

• 送信電力：

• デジタル・アナログ電流コンバータ（IDAC）

• 低エネルギー・センサー・インターフェイス(LESENSE)

• マルチチャンネル静電容量式センス・インターフェイス

（CSEN）

• 2.4 GHz 無線：最大 19 dBm

• 最大 54 ピンをアナログ・チャンネル（APORT）に接続し、

アナログ・ペリフェラル間で共有

• サブ GHz 無線：最大 19 dBm

• 最大 65 個の汎用 I/O ピン（出力状態を保持して非同期割り

込みあり）

• 低消費電力

• 1 Mbps、GFSK、2.4 GHz で 10.0 mA の RX 電流

• 38.4 kbps、2GFSK、169 MHz で 8.4 mA の RX 電流

• 8.5 mA TX current at 0 dBm output power at 2.4 GHz

• 8 チャンネル DMA コントローラ

• 12 チャンネル・ペリフェラル・リフレックス・システム

（PRS）

• 868 MHz で 14 dBm の出力電力において 35.3 mA の TX 電

流

• 2 × 16 ビットのタイマ/カウンタ

• 3 または 4 コンペア/キャプチャ/PWM チャンネル

• 2 × 32 ビットのタイマ/カウンタ

• アクティブ・モードで 70 μA/MHz (EM0)

• 1.5 μA EM2 ディープ・スリープ電流（16 kB RAM 保持およ

び LFRCO から RTCC を実行）

• 3 または 4 コンペア/キャプチャ/PWM チャンネル

• 32 ビット・リアルタイム・カウンタおよびカレンダー

• 波形生成用 16 ビット低エネルギー・タイマ

• 信号強度検出、プリアンブル・パターン検出、フレーム検

出、およびタイムアウト付きウェイク・オン・ラジオ

• 高性能レシーバ

• 32 ビット超低エネルギー・タイマ/カウンタによるエネルギ

ー・モードからの定期的なウェイクアップ

• 1 Mbit/s GFSK で -94.8 dBm の感度

• 2 Mbit/s GFSK で -91.3 dBm の感度

• 250 kbps DSSS-OQPSK で -102.7 dBm の感度

• 600 bps、GFSK、916 MHz で -126.2 dBm の感度

• 2.4 kbps、GFSK、868 MHz で -120.6 dBm の感度

• 4.8 kbps、OOK、433 MHz で -107.4 dBm の感度

• 38.4 kbps、2GFSK、169 MHz で -112.2 dBm の感度

• サポートされている変調形式

• 3 × 非同期動作が可能な 16 ビットのパルス・カウンタ

• 2 × 専用 RC 発振器付き監視タイマ

• 4 × 汎用同期/非同期レシーバ/トランスミッタ(UART/SPI/

SmartCard (ISO 7816)/IrDA/I²S）

低エネルギー UART（LEUART^™）

•

2 × I²C インターフェイス（SMBus サポートおよび EM3 ス

トップでのアドレス認識機能付き）

•

• 広範な動作範囲

• 2/4 (G)FSK での変形を完全に構成可能

• BPSK / DBPSK TX

• 1.8 V ～ 3.8 V 単一電源 supply

• 統合 DC-DC、最小 1.8 V の出力と最大 200 mA の負荷電流

（システム用）

• OOK / ASK

• 変形 OQPSK / (G)MSK

• 標準（-40 °C ～ 85 °C）および拡張（-40 °C ～ 125 °C）温

度グレードを利用可能

• 構成可能 DSSS および FEC

• サポートされているプロトコル：

• Bluetooth® Low Energy (Bluetooth 5)

• 独自規格のプロトコル

• インターネット・セキュリティのサポート

• 汎用 CRC

• 真の乱数発生器

• Wireless M-Bus

• AES 128/256、SHA-1、SHA-2（SHA-224 および SHA-256）

および ECC 対応のハードウェア暗号化アクセラレーショ

ン

• 選定した IEEE 802.15.4g SUN-FSK PHYs

• 低電力広域ネットワーク

• コンプライアンス対象システムに最適：

• QFN48 7x7 mm パッケージ

• FCC Part 90.210 Mask D、FCC part 15.247、15,231、15.249 • BGA125 7x7 mm パッケージ

• ETSI Category I Operation、EN 300 220、EN 300.328

• ARIB T-108、T-96

• 中国規制当局

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Rev. 1.4 | 2

®

EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Ordering Information

2. Ordering Information

Table 2.1. Ordering Information

Frequency Band

@ Max TX Power

2.4 GHz @ 19 dBm

Sub-GHz @ 20 dBm

2.4 GHz @ 19 dBm

Sub-GHz @ 20 dBm

2.4 GHz @ 19 dBm

Sub-GHz @ 20 dBm

2.4 GHz @ 19 dBm

Sub-GHz @ 20 dBm

2.4 GHz @ 19 dBm

Protocol

Stack

Flash RAM

Ordering Code

(kB)

GPIO Package Temp Range

EFR32BG12P433F1024GL125-C Bluetooth LE

Proprietary

1024

256

65

46

28

65

31

65

31

65

46

31

65

BGA125

QFN68

QFN48

BGA125

QFN48

BGA125

QFN48

BGA125

QFN68

QFN48

BGA125

-40 to +85°C

-40 to +125°C

-40 to +85°C

-40 to +125°C

-40 to +85°C

-40 to +125°C

-40 to +85°C

-40 to +125°C

-40 to +85°C

EFR32BG12P433F1024GM68-C Bluetooth LE

Proprietary

1024

512

256

128

64

EFR32BG12P433F1024IM68-C

Bluetooth LE

Proprietary

EFR32BG12P433F1024GM48-C Bluetooth LE

Proprietary

EFR32BG12P432F1024GL125-C Bluetooth LE

Proprietary

EFR32BG12P432F1024GM48-C Bluetooth LE

Proprietary

2.4 GHz @ 19 dBm

2.4 GHz @ 10 dBm

2.4 GHz @ 0 dBm

EFR32BG12P332F1024GL125-C Bluetooth LE

Proprietary

EFR32BG12P332F1024GM48-C Bluetooth LE

Proprietary

EFR32BG12P332F1024IM48-C

Bluetooth LE

Proprietary

EFR32BG12P232F1024GL125-C Bluetooth LE

Proprietary

EFR32BG12P232F1024GM68-C Bluetooth LE

Proprietary

EFR32BG12P232F1024IM68-C

EFR32BG12P232F512GM68-C

EFR32BG12P232F512IM68-C

Bluetooth LE

Proprietary

Bluetooth LE

Proprietary

Bluetooth LE

Proprietary

512

64

EFR32BG12P232F1024GM48-C Bluetooth LE

Proprietary

1024

128

EFR32BG12P132F1024GL125-C Bluetooth LE

Proprietary

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Rev. 1.4 | 3

®

EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Ordering Information

Frequency Band

Protocol

Stack

Flash RAM

Ordering Code

@ Max TX Power

(kB)

GPIO Package Temp Range

31 QFN48 -40 to +85°C

EFR32BG12P132F1024GM48-C Bluetooth LE

Proprietary

2.4 GHz @ 0 dBm

1024

128

EFR32 X G 1 2 P 132 F 1024 G L 125 – A R

Tape and Reel (Optional)

Revision

Pin Count

Package – M (QFN), L (BGA)

Temperature Grade – G (-40 to +85 °C), -I (-40 to +125 °C)

Flash Memory Size in kB

Memory Type (Flash)

Feature Set Code – r2r1r0

r2: Reserved

r1: RF Type – 3 (TRX), 2 (RX), 1 (TX)

r0: Frequency Band – 1 (Sub-GHz), 2 (2.4 GHz), 3 (Dual-Band)

Performance Grade – P (Performance), B (Basic), V (Value)

Device Configuration

Series

Gecko

Family – M (Mighty), B (Blue), F (Flex)

Wireless Gecko 32-bit

Figure 2.1. Ordering Code Key

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Rev. 1.4 | 4

Table of Contents

1. Feature List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

2. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

3. System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.2 Radio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.2.1 Antenna Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.2.2 Fractional-N Frequency Synthesizer . . . . . . . . . . . . . . . . . . . . . 9

3.2.3 Receiver Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.2.4 Transmitter Architecture . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.2.5 Wake on Radio . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.2.6 RFSENSE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

3.2.7 Flexible Frame Handling . . . . . . . . . . . . . . . . . . . . . . . . .10

3.2.8 Packet and State Trace . . . . . . . . . . . . . . . . . . . . . . . . .10

3.2.9 Data Buffering. . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

3.2.10 Radio Controller (RAC) . . . . . . . . . . . . . . . . . . . . . . . . .10

3.2.11 Random Number Generator . . . . . . . . . . . . . . . . . . . . . . .11

3.3 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

3.3.1 Energy Management Unit (EMU) . . . . . . . . . . . . . . . . . . . . . .12

3.3.2 DC-DC Converter . . . . . . . . . . . . . . . . . . . . . . . . . . .12

3.3.3 Power Domains . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

3.4 General Purpose Input/Output (GPIO) . . . . . . . . . . . . . . . . . . . . . .13

3.5 Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

3.5.1 Clock Management Unit (CMU) . . . . . . . . . . . . . . . . . . . . . . .13

3.5.2 Internal and External Oscillators. . . . . . . . . . . . . . . . . . . . . . .13

3.6 Counters/Timers and PWM . . . . . . . . . . . . . . . . . . . . . . . . . .13

3.6.1 Timer/Counter (TIMER) . . . . . . . . . . . . . . . . . . . . . . . . .13

3.6.2 Wide Timer/Counter (WTIMER) . . . . . . . . . . . . . . . . . . . . . . .13

3.6.3 Real Time Counter and Calendar (RTCC) . . . . . . . . . . . . . . . . . . .13

3.6.4 Low Energy Timer (LETIMER) . . . . . . . . . . . . . . . . . . . . . . .14

3.6.5 Ultra Low Power Wake-up Timer (CRYOTIMER) . . . . . . . . . . . . . . . . .14

3.6.6 Pulse Counter (PCNT) . . . . . . . . . . . . . . . . . . . . . . . . . .14

3.6.7 Watchdog Timer (WDOG). . . . . . . . . . . . . . . . . . . . . . . . .14

3.7 Communications and Other Digital Peripherals . . . . . . . . . . . . . . . . . . .14

3.7.1 Universal Synchronous/Asynchronous Receiver/Transmitter (USART) . . . . . . . . . .14

3.7.2 Low Energy Universal Asynchronous Receiver/Transmitter (LEUART) . . . . . . . . . .14

2

3.7.3 Inter-Integrated Circuit Interface (I C) . . . . . . . . . . . . . . . . . . . . .14

3.7.4 Peripheral Reflex System (PRS) . . . . . . . . . . . . . . . . . . . . . .14

3.7.5 Low Energy Sensor Interface (LESENSE) . . . . . . . . . . . . . . . . . . .15

3.8 Security Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

3.8.1 General Purpose Cyclic Redundancy Check (GPCRC) . . . . . . . . . . . . . . .15

3.8.2 Crypto Accelerator (CRYPTO) . . . . . . . . . . . . . . . . . . . . . . .15

3.8.3 True Random Number Generator (TRNG) . . . . . . . . . . . . . . . . . . .15

3.8.4 Security Management Unit (SMU) . . . . . . . . . . . . . . . . . . . . . .15

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3.9 Analog. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

3.9.1 Analog Port (APORT) . . . . . . . . . . . . . . . . . . . . . . . . . .15

3.9.2 Analog Comparator (ACMP) . . . . . . . . . . . . . . . . . . . . . . . .15

3.9.3 Analog to Digital Converter (ADC) . . . . . . . . . . . . . . . . . . . . . .16

3.9.4 Capacitive Sense (CSEN). . . . . . . . . . . . . . . . . . . . . . . . .16

3.9.5 Digital to Analog Current Converter (IDAC) . . . . . . . . . . . . . . . . . . .16

3.9.6 Digital to Analog Converter (VDAC) . . . . . . . . . . . . . . . . . . . . .16

3.9.7 Operational Amplifiers . . . . . . . . . . . . . . . . . . . . . . . . . .16

3.10 Reset Management Unit (RMU) . . . . . . . . . . . . . . . . . . . . . . . .16

3.11 Core and Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

3.11.1 Processor Core . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

3.11.2 Memory System Controller (MSC) . . . . . . . . . . . . . . . . . . . . .17

3.11.3 Linked Direct Memory Access Controller (LDMA) . . . . . . . . . . . . . . . .17

3.12 Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

3.13 Configuration Summary . . . . . . . . . . . . . . . . . . . . . . . . . .20

4. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 21

4.1 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .21

4.1.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . .22

4.1.2 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . .24

4.1.3 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .26

4.1.4 DC-DC Converter . . . . . . . . . . . . . . . . . . . . . . . . . . .27

4.1.5 Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . .29

4.1.6 Wake Up Times . . . . . . . . . . . . . . . . . . . . . . . . . . . .39

4.1.7 Brown Out Detector (BOD) . . . . . . . . . . . . . . . . . . . . . . . .40

4.1.8 Frequency Synthesizer. . . . . . . . . . . . . . . . . . . . . . . . . .41

4.1.9 2.4 GHz RF Transceiver Characteristics . . . . . . . . . . . . . . . . . . . .42

4.1.10 Sub-GHz RF Transceiver Characteristics . . . . . . . . . . . . . . . . . . .55

4.1.11 Modem. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .79

4.1.12 Oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . .80

4.1.13 Flash Memory Characteristics . . . . . . . . . . . . . . . . . . . . . . .84

4.1.14 General-Purpose I/O (GPIO) . . . . . . . . . . . . . . . . . . . . . . .85

4.1.15 Voltage Monitor (VMON). . . . . . . . . . . . . . . . . . . . . . . . .87

4.1.16 Analog to Digital Converter (ADC) . . . . . . . . . . . . . . . . . . . . .88

4.1.17 Analog Comparator (ACMP) . . . . . . . . . . . . . . . . . . . . . . .90

4.1.18 Digital to Analog Converter (VDAC) . . . . . . . . . . . . . . . . . . . . .93

4.1.19 Current Digital to Analog Converter (IDAC) . . . . . . . . . . . . . . . . . .96

4.1.20 Capacitive Sense (CSEN) . . . . . . . . . . . . . . . . . . . . . . . .98

4.1.21 Operational Amplifier (OPAMP)

. . . . . . . . . . . . . . . . . . . . 1. 00

4.1.22 Pulse Counter (PCNT) . . . . . . . . . . . . . . . . . . . . . . . 1. 03

4.1.23 Analog Port (APORT) . . . . . . . . . . . . . . . . . . . . . . . . . 103

4.1.24 I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104

4.1.25 USART SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . .107

4.2 Typical Performance Curves

. . . . . . . . . . . . . . . . . . . . . . . .108

4.2.1 Supply Current

4.2.2 DC-DC Converter

4.2.3 2.4 GHz Radio

. . . . . . . . . . . . . . . . . . . . . . . . . . 1. 09

. . . . . . . . . . . . . . . . . . . . . . . . . 1.14

. . . . . . . . . . . . . . . . . . . . . . . . . . 1.16

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Rev. 1.4 | 6

5. Typical Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . .118

5.1 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118

5.2 RF Matching Networks

. . . . . . . . . . . . . . . . . . . . . . . . . .120

5.3 Other Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . 121

6. Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122

6.1 BGA125 2.4 GHz and Sub-GHz Device Pinout . . . . . . . . . . . . . . . . . .122

6.2 BGA125 2.4 GHz Device Pinout . . . . . . . . . . . . . . . . . . . . . . .125

6.3 QFN68 2.4 GHz and Sub-GHz Device Pinout. . . . . . . . . . . . . . . . . . . 128

6.4 QFN68 2.4 GHz Device Pinout

. . . . . . . . . . . . . . . . . . . . . . 1.30

6.5 QFN48 2.4 GHz and Sub-GHz Device Pinout. . . . . . . . . . . . . . . . . . . 132

6.6 QFN48 2.4 GHz Device Pinout

. . . . . . . . . . . . . . . . . . . . . . 1.34

. . . . . . . . . . . . . . . . . . . . . . . . 1. 36

6.7 GPIO Functionality Table

6.8 Alternate Functionality Overview . . . . . . . . . . . . . . . . . . . . . . . 158

6.9 Analog Port (APORT) Client Maps . . . . . . . . . . . . . . . . . . . . . .171

7. BGA125 Package Specifications . . . . . . . . . . . . . . . . . . . . . . .180

7.1 BGA125 Package Dimensions. . . . . . . . . . . . . . . . . . . . . . . . 180

7.2 BGA125 PCB Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . 182

7.3 BGA125 Package Marking . . . . . . . . . . . . . . . . . . . . . . . . . 184

8. QFN48 Package Specifications. . . . . . . . . . . . . . . . . . . . . . . . 185

8.1 QFN48 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . .185

8.2 QFN48 PCB Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . .187

8.3 QFN48 Package Marking

. . . . . . . . . . . . . . . . . . . . . . . . .189

9. QFN68 Package Specifications. . . . . . . . . . . . . . . . . . . . . . . . 190

9.1 QFN68 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . .190

9.2 QFN68 PCB Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . .192

9.3 QFN68 Package Marking

. . . . . . . . . . . . . . . . . . . . . . . . .194

10. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

System Overview

3. System Overview

3.1 Introduction

The EFR32 product family combines an energy-friendly MCU with a highly integrated radio transceiver. The devices are well suited for

any battery operated application as well as other systems requiring high performance and low energy consumption. This section gives a

short introduction to the full radio and MCU system. The detailed functional description can be found in the EFR32xG12 Wireless

Gecko Reference Manual.

A block diagram of the EFR32BG12 family is shown in Figure 3.1 Detailed EFR32BG12 Block Diagram on page 8. The diagram

shows a superset of features available on the family, which vary by OPN. For more information about specific device features, consult

Ordering Information.

Radio Transceiver

Port I/O Configuration

Digital Peripherals

IOVDD

Sub-GHz RF

SUBGRF_IP

SUBGRF_IN

SUBGRF_OP

SUBGRF_ON

I

DEMOD

IFADC

AGC

LNA

LETIMER

PA

Port A

Drivers

PGA

Q

PAn

TIMER

CRYOTIMER

PCNT

RFSENSE

BALUN

2.4 GHz RF

I

Frequency

LNA

Synthesizer

Port B

Drivers

PBn

PCn

PDn

PFn

2G4RF_IOP

2G4RF_ION

To RF

MOD

PA

Frontend

Circuits

RTC / RTCC

USART

Q

Port

Mapper

Port C

Drivers

LEUART

I2C

Reset

Management

Unit

ARM Cortex-M4 Core

RESETn

Port D

Serial Wire

and ETM

Debug /

Up to 1024 KB ISP Flash

Program Memory

CRYPTO

CRC

Drivers

Debug Signals

(shared w/GPIO)

Brown Out /

Power-On

Reset

A

H

B

A

P

B

Up to 256 KB RAM

Memory Protection Unit

Floating Point Unit

LDMA Controller

Programming

Port F

Drivers

LESENSE

Energy Management

Analog Peripherals

Port I

Drivers

PAVDD

RFVDD

IOVDD

AVDD

IDAC

Voltage

Monitor

Port J

Drivers

-

+

Watchdog

Timer

PJn

VDAC

DVDD

bypass

Op-Amp

VDD

Internal

Reference

Port K

Drivers

Clock Management

PKn

VREGVDD

VREGSW

DC-DC

Converter

Voltage

Regulator

ULFRCO

AUXHFRCO

LFRCO

12-bit ADC

DECOUPLE

Temp

Sense

LFXTAL_P

LFXTAL_N

HFXTAL_P

HFXTAL_N

LFXO

HFRCO

HFXO

Capacitive

Sense

+

-

Analog Comparator

Figure 3.1. Detailed EFR32BG12 Block Diagram

3.2 Radio

The Blue Gecko family features a radio transceiver supporting Bluetooth^®Low Energy and proprietary short range wireless protocols.

3.2.1 Antenna Interface

The 2.4 GHz antenna interface consists of two pins (2G4RF_IOP and 2G4RF_ION) that interface directly to the on-chip BALUN. The

2G4RF_ION pin should be grounded externally.

The external components and power supply connections for the antenna interface typical applications are shown in the RF Matching

Networks section.

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System Overview

3.2.2 Fractional-N Frequency Synthesizer

The EFR32BG12 contains a high performance, low phase noise, fully integrated fractional-N frequency synthesizer. The synthesizer is

used in receive mode to generate the LO frequency used by the down-conversion mixer. It is also used in transmit mode to directly

generate the modulated RF carrier.

The fractional-N architecture provides excellent phase noise performance combined with frequency resolution better than 100 Hz, with

low energy consumption. The synthesizer has fast frequency settling which allows very short receiver and transmitter wake up times to

optimize system energy consumption.

3.2.3 Receiver Architecture

The EFR32BG12 uses a low-IF receiver architecture, consisting of a Low-Noise Amplifier (LNA) followed by an I/Q down-conversion

mixer, employing a crystal reference. The I/Q signals are further filtered and amplified before being sampled by the IF analog-to-digital

converter (IFADC).

The IF frequency is configurable from 150 kHz to 1371 kHz. The IF can further be configured for high-side or low-side injection, provid-

ing flexibility with respect to known interferers at the image frequency.

The Automatic Gain Control (AGC) block adjusts the receiver gain to optimize performance and avoid saturation for excellent selectivity

and blocking performance. The 2.4 GHz radio is calibrated at production to improve image rejection performance. The sub-GHz radio

can be calibrated on-demand by the user for the desired frequency band.

Demodulation is performed in the digital domain. The demodulator performs configurable decimation and channel filtering to allow re-

ceive bandwidths ranging from 0.1 to 2530 kHz. High carrier frequency and baud rate offsets are tolerated by active estimation and

compensation. Advanced features supporting high quality communication under adverse conditions include forward error correction by

block and convolutional coding as well as Direct Sequence Spread Spectrum (DSSS) for 2.4 GHz and sub-GHz bands.

A Received Signal Strength Indicator (RSSI) is available for signal quality metrics, for level-based proximity detection, and for RF chan-

nel access by Collision Avoidance (CA) or Listen Before Talk (LBT) algorithms. An RSSI capture value is associated with each received

frame and the dynamic RSSI measurement can be monitored throughout reception.

The EFR32BG12 features integrated support for antenna diversity to mitigate the problem of frequency-selective fading due to multi-

path propagation and improve link budget. Support for antenna diversity is available for specific PHY configurations in 2.4 GHz and

sub-GHz bands. Internal configurable hardware controls an external switch for automatic switching between antennae during RF re-

ceive detection operations.

Note: Due to the shorter preamble of 802.15.4 and BLE packets, RX diversity is not supported.

3.2.4 Transmitter Architecture

The EFR32BG12 uses a direct-conversion transmitter architecture. For constant envelope modulation formats, the modulator controls

phase and frequency modulation in the frequency synthesizer. Transmit symbols or chips are optionally shaped by a digital shaping

filter. The shaping filter is fully configurable, including the BT product, and can be used to implement Gaussian or Raised Cosine shap-

ing.

Carrier Sense Multiple Access - Collision Avoidance (CSMA-CA) or Listen Before Talk (LBT) algorithms can be automatically timed by

the EFR32BG12. These algorithms are typically defined by regulatory standards to improve inter-operability in a given bandwidth be-

tween devices that otherwise lack synchronized RF channel access.

3.2.5 Wake on Radio

The Wake on Radio feature allows flexible, autonomous RF sensing, qualification, and demodulation without required MCU activity, us-

ing a subsystem of the EFR32BG12 including the Radio Controller (RAC), Peripheral Reflex System (PRS), and Low Energy peripher-

als.

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3.2.6 RFSENSE

The RFSENSE peripheral generates a system wakeup interrupt upon detection of wideband RF energy at the antenna interface, provid-

ing true RF wakeup capabilities from low energy modes including EM2, EM3 and EM4.

RFSENSE triggers on a relatively strong RF signal and is available in the lowest energy modes, allowing exceptionally low energy con-

sumption. RFSENSE does not demodulate or otherwise qualify the received signal, but software may respond to the wakeup event by

enabling normal RF reception.

Various strategies for optimizing power consumption and system response time in presence of false alarms may be employed using

available timer peripherals.

3.2.7 Flexible Frame Handling

EFR32BG12 has an extensive and flexible frame handling support for easy implementation of even complex communication protocols.

The Frame Controller (FRC) supports all low level and timing critical tasks together with the Radio Controller and Modulator/Demodula-

tor:

• Highly adjustable preamble length

• Up to 2 simultaneous synchronization words, each up to 32 bits and providing separate interrupts

• Frame disassembly and address matching (filtering) to accept or reject frames

• Automatic ACK frame assembly and transmission

• Fully flexible CRC generation and verification:

• Multiple CRC values can be embedded in a single frame

• 8, 16, 24 or 32-bit CRC value

• Configurable CRC bit and byte ordering

• Selectable bit-ordering (least significant or most significant bit first)

• Optional data whitening

• Optional Forward Error Correction (FEC), including convolutional encoding / decoding and block encoding / decoding

• Half rate convolutional encoder and decoder with constraint lengths from 2 to 7 and optional puncturing

• Optional symbol interleaving, typically used in combination with FEC

• Symbol coding, such as Manchester or DSSS, or biphase space encoding using FEC hardware

• UART encoding over air, with start and stop bit insertion / removal

• Test mode support, such as modulated or unmodulated carrier output

• Received frame timestamping

3.2.8 Packet and State Trace

The EFR32BG12 Frame Controller has a packet and state trace unit that provides valuable information during the development phase.

It features:

• Non-intrusive trace of transmit data, receive data and state information

• Data observability on a single-pin UART data output, or on a two-pin SPI data output

• Configurable data output bitrate / baudrate

• Multiplexed transmitted data, received data and state / meta information in a single serial data stream

3.2.9 Data Buffering

The EFR32BG12 features an advanced Radio Buffer Controller (BUFC) capable of handling up to 4 buffers of adjustable size from 64

bytes to 4096 bytes. Each buffer can be used for RX, TX or both. The buffer data is located in RAM, enabling zero-copy operations.

3.2.10 Radio Controller (RAC)

The Radio Controller controls the top level state of the radio subsystem in the EFR32BG12. It performs the following tasks:

• Precisely-timed control of enabling and disabling of the receiver and transmitter circuitry

• Run-time calibration of receiver, transmitter and frequency synthesizer

• Detailed frame transmission timing, including optional LBT or CSMA-CA

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3.2.11 Random Number Generator

The Frame Controller (FRC) implements a random number generator that uses entropy gathered from noise in the RF receive chain.

The data is suitable for use in cryptographic applications.

Output from the random number generator can be used either directly or as a seed or entropy source for software-based random num-

ber generator algorithms such as Fortuna.

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System Overview

3.3 Power

The EFR32BG12 has an Energy Management Unit (EMU) and efficient integrated regulators to generate internal supply voltages. Only

a single external supply voltage is required, from which all internal voltages are created. An optional integrated DC-DC buck regulator

can be utilized to further reduce the current consumption. The DC-DC regulator requires one external inductor and one external capaci-

tor.

The EFR32BG12 device family includes support for internal supply voltage scaling, as well as two different power domains groups for

peripherals. These enhancements allow for further supply current reductions and lower overall power consumption.

AVDD and VREGVDD need to be 1.8 V or higher for the MCU to operate across all conditions; however the rest of the system will

operate down to 1.62 V, including the digital supply and I/O. This means that the device is fully compatible with 1.8 V components.

Running from a sufficiently high supply, the device can use the DC-DC to regulate voltage not only for itself, but also for other PCB

components, supplying up to a total of 200 mA.

3.3.1 Energy Management Unit (EMU)

The Energy Management Unit manages transitions of energy modes in the device. Each energy mode defines which peripherals and

features are available and the amount of current the device consumes. The EMU can also be used to turn off the power to unused RAM

blocks, and it contains control registers for the DC-DC regulator and the Voltage Monitor (VMON). The VMON is used to monitor multi-

ple supply voltages. It has multiple channels which can be programmed individually by the user to determine if a sensed supply has

fallen below a chosen threshold.

3.3.2 DC-DC Converter

The DC-DC buck converter covers a wide range of load currents and provides up to 90% efficiency in energy modes EM0, EM1, EM2

and EM3, and can supply up to 200 mA to the device and surrounding PCB components. Patented RF noise mitigation allows operation

of the DC-DC converter without degrading sensitivity of radio components. Protection features include programmable current limiting,

short-circuit protection, and dead-time protection. The DC-DC converter may also enter bypass mode when the input voltage is too low

for efficient operation. In bypass mode, the DC-DC input supply is internally connected directly to its output through a low resistance

switch. Bypass mode also supports in-rush current limiting to prevent input supply voltage droops due to excessive output current tran-

sients.

3.3.3 Power Domains

The EFR32BG12 has two peripheral power domains for operation in EM2 and lower. If all of the peripherals in a peripheral power do-

main are configured as unused, the power domain for that group will be powered off in the low-power mode, reducing the overall cur-

rent consumption of the device.

Table 3.1. Peripheral Power Subdomains

Peripheral Power Domain 1

Peripheral Power Domain 2

ACMP0

ACMP1

PCNT1

PCNT2

CSEN

DAC0

PCNT0

ADC0

LETIMER0

LESENSE

APORT

LEUART0

I2C0

-

I2C1

IDAC

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3.4 General Purpose Input/Output (GPIO)

EFR32BG12 has up to 65 General Purpose Input/Output pins. Each GPIO pin can be individually configured as either an output or

input. More advanced configurations including open-drain, open-source, and glitch-filtering can be configured for each individual GPIO

pin. The GPIO pins can be overridden by peripheral connections, like SPI communication. Each peripheral connection can be routed to

several GPIO pins on the device. The input value of a GPIO pin can be routed through the Peripheral Reflex System to other peripher-

als. The GPIO subsystem supports asynchronous external pin interrupts.

3.5 Clocking

3.5.1 Clock Management Unit (CMU)

The Clock Management Unit controls oscillators and clocks in the EFR32BG12. Individual enabling and disabling of clocks to all periph-

erals is performed by the CMU. The CMU also controls enabling and configuration of the oscillators. A high degree of flexibility allows

software to optimize energy consumption in any specific application by minimizing power dissipation in unused peripherals and oscilla-

tors.

3.5.2 Internal and External Oscillators

The EFR32BG12 supports two crystal oscillators and fully integrates four RC oscillators, listed below.

• A high frequency crystal oscillator (HFXO) with integrated load capacitors, tunable in small steps, provides a precise timing refer-

ence for the MCU. Crystal frequencies in the range from 38 to 40 MHz are supported. An external clock source such as a TCXO can

also be applied to the HFXO input for improved accuracy over temperature.

• A 32.768 kHz crystal oscillator (LFXO) provides an accurate timing reference for low energy modes.

• An integrated high frequency RC oscillator (HFRCO) is available for the MCU system, when crystal accuracy is not required. The

HFRCO employs fast startup at minimal energy consumption combined with a wide frequency range.

• An integrated auxilliary high frequency RC oscillator (AUXHFRCO) is available for timing the general-purpose ADC and the Serial

Wire Viewer port with a wide frequency range.

• An integrated low frequency 32.768 kHz RC oscillator (LFRCO) can be used as a timing reference in low energy modes, when crys-

tal accuracy is not required.

• An integrated ultra-low frequency 1 kHz RC oscillator (ULFRCO) is available to provide a timing reference at the lowest energy con-

sumption in low energy modes.

3.6 Counters/Timers and PWM

3.6.1 Timer/Counter (TIMER)

TIMER peripherals keep track of timing, count events, generate PWM outputs and trigger timed actions in other peripherals through the

PRS system. The core of each TIMER is a 16-bit counter with up to 4 compare/capture channels. Each channel is configurable in one

of three modes. In capture mode, the counter state is stored in a buffer at a selected input event. In compare mode, the channel output

reflects the comparison of the counter to a programmed threshold value. In PWM mode, the TIMER supports generation of pulse-width

modulation (PWM) outputs of arbitrary waveforms defined by the sequence of values written to the compare registers, with optional

dead-time insertion available in timer unit TIMER_0 only.

3.6.2 Wide Timer/Counter (WTIMER)

WTIMER peripherals function just as TIMER peripherals, but are 32 bits wide. They keep track of timing, count events, generate PWM

outputs and trigger timed actions in other peripherals through the PRS system. The core of each WTIMER is a 32-bit counter with up to

4 compare/capture channels. Each channel is configurable in one of three modes. In capture mode, the counter state is stored in a

buffer at a selected input event. In compare mode, the channel output reflects the comparison of the counter to a programmed thresh-

old value. In PWM mode, the WTIMER supports generation of pulse-width modulation (PWM) outputs of arbitrary waveforms defined by

the sequence of values written to the compare registers, with optional dead-time insertion available in timer unit WTIMER_0 only.

3.6.3 Real Time Counter and Calendar (RTCC)

The Real Time Counter and Calendar (RTCC) is a 32-bit counter providing timekeeping in all energy modes. The RTCC includes a

Binary Coded Decimal (BCD) calendar mode for easy time and date keeping. The RTCC can be clocked by any of the on-board oscilla-

tors with the exception of the AUXHFRCO, and it is capable of providing system wake-up at user defined instances. When receiving

frames, the RTCC value can be used for timestamping. The RTCC includes 128 bytes of general purpose data retention, allowing easy

and convenient data storage in all energy modes down to EM4H.

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3.6.4 Low Energy Timer (LETIMER)

The unique LETIMER is a 16-bit timer that is available in energy mode EM2 Deep Sleep in addition to EM1 Sleep and EM0 Active. This

allows it to be used for timing and output generation when most of the device is powered down, allowing simple tasks to be performed

while the power consumption of the system is kept at an absolute minimum. The LETIMER can be used to output a variety of wave-

forms with minimal software intervention. The LETIMER is connected to the Real Time Counter and Calendar (RTCC), and can be con-

figured to start counting on compare matches from the RTCC.

3.6.5 Ultra Low Power Wake-up Timer (CRYOTIMER)

The CRYOTIMER is a 32-bit counter that is capable of running in all energy modes. It can be clocked by either the 32.768 kHz crystal

oscillator (LFXO), the 32.768 kHz RC oscillator (LFRCO), or the 1 kHz RC oscillator (ULFRCO). It can provide periodic Wakeup events

and PRS signals which can be used to wake up peripherals from any energy mode. The CRYOTIMER provides a wide range of inter-

rupt periods, facilitating flexible ultra-low energy operation.

3.6.6 Pulse Counter (PCNT)

The Pulse Counter (PCNT) peripheral can be used for counting pulses on a single input or to decode quadrature encoded inputs. The

clock for PCNT is selectable from either an external source on pin PCTNn_S0IN or from an internal timing reference, selectable from

among any of the internal oscillators, except the AUXHFRCO. The peripheral may operate in energy mode EM0 Active, EM1 Sleep,

EM2 Deep Sleep, and EM3 Stop.

3.6.7 Watchdog Timer (WDOG)

The watchdog timer can act both as an independent watchdog or as a watchdog synchronous with the CPU clock. It has windowed

monitoring capabilities, and can generate a reset or different interrupts depending on the failure mode of the system. The watchdog can

also monitor autonomous systems driven by PRS.

3.7 Communications and Other Digital Peripherals

3.7.1 Universal Synchronous/Asynchronous Receiver/Transmitter (USART)

The Universal Synchronous/Asynchronous Receiver/Transmitter is a flexible serial I/O interface. It supports full duplex asynchronous

UART communication with hardware flow control as well as RS-485, SPI, MicroWire and 3-wire. It can also interface with devices sup-

porting:

• ISO7816 SmartCards

• IrDA

I²S

•

3.7.2 Low Energy Universal Asynchronous Receiver/Transmitter (LEUART)

The unique LEUART^TMprovides two-way UART communication on a strict power budget. Only a 32.768 kHz clock is needed to allow

UART communication up to 9600 baud. The LEUART includes all necessary hardware to make asynchronous serial communication

possible with a minimum of software intervention and energy consumption.

3.7.3 Inter-Integrated Circuit Interface (I²C)

The I²C interface enables communication between the MCU and a serial I²C bus. It is capable of acting as both a master and a slave

and supports multi-master buses. Standard-mode, fast-mode and fast-mode plus speeds are supported, allowing transmission rates

from 10 kbit/s up to 1 Mbit/s. Slave arbitration and timeouts are also available, allowing implementation of an SMBus-compliant system.

The interface provided to software by the I²C peripheral allows precise timing control of the transmission process and highly automated

transfers. Automatic recognition of slave addresses is provided in active and low energy modes.

3.7.4 Peripheral Reflex System (PRS)

The Peripheral Reflex System provides a communication network between different peripherals without software involvement. Peripher-

als producing Reflex signals are called producers. The PRS routes Reflex signals from producers to consumer peripherals, which in

turn perform actions in response. Edge triggers and other functionality such as simple logic operations (AND, OR, NOT) can be applied

by the PRS to the signals. The PRS allows peripheral to act autonomously without waking the MCU core, saving power.

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3.7.5 Low Energy Sensor Interface (LESENSE)

The Low Energy Sensor Interface LESENSE^TMis a highly configurable sensor interface with support for up to 16 individually configura-

ble sensors. By controlling the analog comparators, ADC, and DAC, LESENSE is capable of supporting a wide range of sensors and

measurement schemes, and can for instance measure LC sensors, resistive sensors and capacitive sensors. LESENSE also includes a

programmable finite state machine which enables simple processing of measurement results without CPU intervention. LESENSE is

available in energy mode EM2, in addition to EM0 and EM1, making it ideal for sensor monitoring in applications with a strict energy

budget.

3.8 Security Features

3.8.1 General Purpose Cyclic Redundancy Check (GPCRC)

The GPCRC block implements a Cyclic Redundancy Check (CRC) function. It supports both 32-bit and 16-bit polynomials. The suppor-

ted 32-bit polynomial is 0x04C11DB7 (IEEE 802.3), while the 16-bit polynomial can be programmed to any value, depending on the

needs of the application.

3.8.2 Crypto Accelerator (CRYPTO)

The Crypto Accelerator is a fast and energy-efficient autonomous hardware encryption and decryption accelerator. EFR32 devices sup-

port AES encryption and decryption with 128- or 256-bit keys, ECC over both GF(P) and GF(2^m), SHA-1 and SHA-2 (SHA-224 and

SHA-256).

Supported block cipher modes of operation for AES include: ECB, CTR, CBC, PCBC, CFB, OFB, GCM, CBC-MAC, GMAC and CCM.

Supported ECC NIST recommended curves include P-192, P-224, P-256, K-163, K-233, B-163 and B-233.

The CRYPTO1 block is tightly linked to the Radio Buffer Controller (BUFC) enabling fast and efficient autonomous cipher operations on

data buffer content. It allows fast processing of GCM (AES), ECC and SHA with little CPU intervention.

CRYPTO also provides trigger signals for DMA read and write operations.

3.8.3 True Random Number Generator (TRNG)

The TRNG is a non-deterministic random number generator based on a full hardware solution. The TRNG is validated with NIST800-22

and AIS-31 test suites as well as being suitable for FIPS 140-2 certification (for the purposes of cryptographic key generation).

3.8.4 Security Management Unit (SMU)

The Security Management Unit (SMU) allows software to set up fine-grained security for peripheral access, which is not possible in the

Memory Protection Unit (MPU). Peripherals may be secured by hardware on an individual basis, such that only priveleged accesses to

the peripheral's register interface will be allowed. When an access fault occurs, the SMU reports the specific peripheral involved and

can optionally generate an interrupt.

3.9 Analog

3.9.1 Analog Port (APORT)

The Analog Port (APORT) is an analog interconnect matrix allowing access to many analog peripherals on a flexible selection of pins.

Each APORT bus consists of analog switches connected to a common wire. Since many clients can operate differentially, buses are

grouped by X/Y pairs.

3.9.2 Analog Comparator (ACMP)

The Analog Comparator is used to compare the voltage of two analog inputs, with a digital output indicating which input voltage is high-

er. Inputs are selected from among internal references and external pins. The tradeoff between response time and current consumption

is configurable by software. Two 6-bit reference dividers allow for a wide range of internally-programmable reference sources. The

ACMP can also be used to monitor the supply voltage. An interrupt can be generated when the supply falls below or rises above the

programmable threshold.

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3.9.3 Analog to Digital Converter (ADC)

The ADC is a Successive Approximation Register (SAR) architecture, with a resolution of up to 12 bits at up to 1 Msps. The output

sample resolution is configurable and additional resolution is possible using integrated hardware for averaging over multiple samples.

The ADC includes integrated voltage references and an integrated temperature sensor. Inputs are selectable from a wide range of

sources, including pins configurable as either single-ended or differential.

3.9.4 Capacitive Sense (CSEN)

The CSEN peripheral is a dedicated Capacitive Sensing block for implementing touch-sensitive user interface elements such a

switches and sliders. The CSEN peripheral uses a charge ramping measurement technique, which provides robust sensing even in

adverse conditions including radiated noise and moisture. The peripheral can be configured to take measurements on a single port pin

or scan through multiple pins and store results to memory through DMA. Several channels can also be shorted together to measure the

combined capacitance or implement wake-on-touch from very low energy modes. Hardware includes a digital accumulator and an aver-

aging filter, as well as digital threshold comparators to reduce software overhead.

3.9.5 Digital to Analog Current Converter (IDAC)

The IDAC can source or sink a configurable constant current. This current can be driven on an output pin or routed to the selected ADC

input pin for capacitive sensing. The full-scale current is programmable between 0.05 µA and 64 µA with several ranges consisting of

various step sizes.

3.9.6 Digital to Analog Converter (VDAC)

The Digital to Analog Converter (VDAC) can convert a digital value to an analog output voltage. The VDAC is a fully differential, 500

ksps, 12-bit converter. The opamps are used in conjunction with the VDAC, to provide output buffering. One opamp is used per single-

ended channel, or two opamps are used to provide differential outputs. The VDAC may be used for a number of different applications

such as sensor interfaces or sound output. The VDAC can generate high-resolution analog signals while the MCU is operating at low

frequencies and with low total power consumption. Using DMA and a timer, the VDAC can be used to generate waveforms without any

CPU intervention. The VDAC is available in all energy modes down to and including EM3.

3.9.7 Operational Amplifiers

The opamps are low power amplifiers with a high degree of flexibility targeting a wide variety of standard opamp application areas, and

are available down to EM3. With flexible built-in programming for gain and interconnection they can be configured to support multiple

common opamp functions. All pins are also available externally for filter configurations. Each opamp has a rail to rail input and a rail to

rail output. They can be used in conjunction with the VDAC peripheral or in stand-alone configurations. The opamps save energy, PCB

space, and cost as compared with standalone opamps because they are integrated on-chip.

3.10 Reset Management Unit (RMU)

The RMU is responsible for handling reset of the EFR32BG12. A wide range of reset sources are available, including several power

supply monitors, pin reset, software controlled reset, core lockup reset, and watchdog reset.

3.11 Core and Memory

3.11.1 Processor Core

The ARM Cortex-M processor includes a 32-bit RISC processor integrating the following features and tasks in the system:

• ARM Cortex-M4 RISC processor achieving 1.25 Dhrystone MIPS/MHz

• Memory Protection Unit (MPU) supporting up to 8 memory segments

• Up to 1024 kB flash program memory

• Up to 256 kB RAM data memory

• Configuration and event handling of all peripherals

• 2-pin Serial-Wire debug interface

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System Overview

3.11.2 Memory System Controller (MSC)

The Memory System Controller (MSC) is the program memory unit of the microcontroller. The flash memory is readable and writable

from both the Cortex-M and DMA. The flash memory is divided into two blocks; the main block and the information block. Program code

is normally written to the main block, whereas the information block is available for special user data and flash lock bits. There is also a

read-only page in the information block containing system and device calibration data. Read and write operations are supported in en-

ergy modes EM0 Active and EM1 Sleep.

3.11.3 Linked Direct Memory Access Controller (LDMA)

The Linked Direct Memory Access (LDMA) controller allows the system to perform memory operations independently of software. This

reduces both energy consumption and software workload. The LDMA allows operations to be linked together and staged, enabling so-

phisticated operations to be implemented.

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System Overview

3.12 Memory Map

The EFR32BG12 memory map is shown in the figures below. RAM and flash sizes are for the largest memory configuration.

Figure 3.2. EFR32BG12 Memory Map — Core Peripherals and Code Space

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System Overview

Figure 3.3. EFR32BG12 Memory Map — Peripherals

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System Overview

3.13 Configuration Summary

The features of the EFR32BG12 are a subset of the feature set described in the device reference manual. The table below describes

device specific implementation of the features. Remaining modules support full configuration.

Table 3.2. Configuration Summary

Module

Configuration

IrDA

Pin Connections

USART0

US0_TX, US0_RX, US0_CLK, US0_CS

SmartCard

I²S

USART1

US1_TX, US1_RX, US1_CLK, US1_CS

SmartCard

IrDA

USART2

USART3

US2_TX, US2_RX, US2_CLK, US2_CS

US3_TX, US3_RX, US3_CLK, US3_CS

SmartCard

I²S

SmartCard

TIMER0

with DTI

TIM0_CC[2:0], TIM0_CDTI[2:0]

TIM1_CC[3:0]

TIMER1

-

WTIMER0

WTIMER1

with DTI

-

WTIM0_CC[2:0], WTIM0_CDTI[2:0]

WTIM1_CC[3:0]

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4. Electrical Specifications

4.1 Electrical Characteristics

All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:

• Typical values are based on T_AMB=25 °C and V_DD= 3.3 V, by production test and/or technology characterization.

• Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output pow-

er-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna.

• Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature,

unless stated otherwise.

Refer to 4.1.2.1 General Operating Conditions for more details about operational supply and temperature limits.

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Electrical Specifications

4.1.1 Absolute Maximum Ratings

Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of

the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure

to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and relia-

bility data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx.

Table 4.1. Absolute Maximum Ratings

Parameter

Symbol

T_STG

Test Condition

Min

-50

-0.3

—

Typ

—

Max

150

3.8

1

Unit

°C

Storage temperature range

Voltage on any supply pin

V_DDMAX

V_DDRAMPMAX

—

V

Voltage ramp rate on any

supply pin

—

V / µs

5V tolerant GPIO pins^{1 2 3}

Standard GPIO pins

DC voltage on any GPIO pin V_DIGPIN

-0.3

—

Min of 5.25

and IOVDD

+2

V

-0.3

—

IOVDD+0.3

V

Voltage on HFXO pins

V_HFXOPIN

1.4

10

Input RF level on pins

2G4RF_IOP and

2G4RF_ION

P_RFMAX2G4

dBm

Voltage differential between V_MAXDIFF2G4

RF pins (2G4RF_IOP -

2G4RF_ION)

-50

—

50

mV

V

Absolute voltage on RF pins V_MAX2G4

2G4RF_IOP and

-0.3

3.3

2G4RF_ION

Absolute voltage on Sub-

GHz RF pins

V_MAXSUBG

Pins SUBGRF_OP and

SUBGRF_ON

-0.3

—

3.3

0.3

V

Pins SUBGRF_IP and

SUBGRF_IN,

Total current into VDD power I_VDDMAX

lines

Source

200

mA

Total current into VSS

ground lines

I_VSSMAX

Sink

—

Current per I/O pin

I_IOMAX

Sink

—

50

mA

°C

Source

Current for all I/O pins

Junction temperature

I_IOALLMAX

Sink

—

200

105

125

Source

—

T_J

-G grade devices

-I grade devices

-40

°C

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Electrical Specifications

Parameter

Note:

Symbol

Test Condition

Min

Typ

Max

Unit

1. When a GPIO pin is routed to the analog module through the APORT, the maximum voltage = IOVDD.

2. Valid for IOVDD in valid operating range or when IOVDD is undriven (high-Z). If IOVDD is connected to a low-impedance source

below the valid operating range (e.g. IOVDD shorted to VSS), the pin voltage maximum is IOVDD + 0.3 V, to avoid exceeding the

maximum IO current specifications.

3. To operate above the IOVDD supply rail, over-voltage tolerance must be enabled according to the GPIO_Px_OVTDIS register.

Pins with over-voltage tolerance disabled have the same limits as Standard GPIO.

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Electrical Specifications

4.1.2 Operating Conditions

When assigning supply sources, the following requirements must be observed:

• VREGVDD must be greater than or equal to AVDD, DVDD, RFVDD, PAVDD and all IOVDD supplies.

• VREGVDD = AVDD

• DVDD ≤ AVDD

• IOVDD ≤ AVDD

• RFVDD ≤ AVDD

• PAVDD ≤ AVDD

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Electrical Specifications

4.1.2.1 General Operating Conditions

Table 4.2. General Operating Conditions

Parameter

Symbol

Test Condition

Min

-40

1.8

Typ

25

Max

85

Unit

°C

V

Operating ambient tempera- T_A

ture range⁶

-G temperature grade

-I temperature grade

25

125

3.8

AVDD supply voltage²

V_AVDD

3.3

VREGVDD operating supply V_VREGVDD

voltage^{2 1}

DCDC in regulation

2.4

1.8

3.3

3.8

V

DCDC in bypass, 50mA load

DCDC not in use. DVDD external-

ly shorted to VREGVDD

VREGVDD current

I_VREGVDD

DCDC in bypass, T ≤ 85 °C

DCDC in bypass, T > 85 °C

—

200

100

mA

V

RFVDD operating supply

voltage

V_RFVDD

1.62

V_VREGVDD

DVDD operating supply volt- V_DVDD

age

1.62

0.75

—

V_VREGVDD

2.75

V

PAVDD operating supply

voltage

V_PAVDD

All IOVDD pins⁵

IOVDD operating supply volt- V_IOVDD

age

—

V

DECOUPLE output capaci-

tor^{3 4}

C_DECOUPLE

1.0

µF

Difference between AVDD

dV_DD

—

0.1

V

and VREGVDD, ABS(AVDD-

VREGVDD)²

HFCORECLK frequency

f_CORE

VSCALE2, MODE = WS1

VSCALE0, MODE = WS0

VSCALE2

—

40

20

40

20

MHz

HFCLK frequency

f_HFCLK

VSCALE0

Note:

1. The minimum voltage required in bypass mode is calculated using R_BYPfrom the DCDC specification table. Requirements for

other loads can be calculated as V_{DVDD_min}+I_LOAD* R_{BYP_max}

.

2. VREGVDD must be tied to AVDD. Both VREGVDD and AVDD minimum voltages must be satisfied for the part to operate.

3. The system designer should consult the characteristic specs of the capacitor used on DECOUPLE to ensure its capacitance val-

ue stays within the specified bounds across temperature and DC bias.

4. VSCALE0 to VSCALE2 voltage change transitions occur at a rate of 10 mV / usec for approximately 20 usec. During this transi-

tion, peak currents will be dependent on the value of the DECOUPLE output capacitor, from 35 mA (with a 1 µF capacitor) to 70

mA (with a 2.7 µF capacitor).

5. When the CSEN peripheral is used with chopping enabled (CSEN_CTRL_CHOPEN = ENABLE), IOVDD must be equal to AVDD.

6. The maximum limit on T_Amay be lower due to device self-heating, which depends on the power dissipation of the specific appli-

cation. T_A(max) = T_J(max) - (THETA_JAx PowerDissipation). Refer to the Absolute Maximum Ratings table and the Thermal

Characteristics table for T_Jand THETA_JA

.

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Electrical Specifications

4.1.3 Thermal Characteristics

Table 4.3. Thermal Characteristics

Parameter

Symbol

Test Condition

Min

—

Typ

75.7

61.5

55.4

30.2

26.3

24.9

90.7

73.7

66.4

45

Max

—

Unit

°C/W

Thermal resistance, QFN48 THETA_{JA_QFN48}2-Layer PCB, Air velocity = 0 m/s

Package

2-Layer PCB, Air velocity = 1 m/s

2-Layer PCB, Air velocity = 2 m/s

4-Layer PCB, Air velocity = 0 m/s

4-Layer PCB, Air velocity = 1 m/s

4-Layer PCB, Air velocity = 2 m/s

Thermal resistance, BGA125 THE-

Package TA_{JA_BGA125}

2-Layer PCB, Air velocity = 0 m/s

2-Layer PCB, Air velocity = 1 m/s

2-Layer PCB, Air velocity = 2 m/s

4-Layer PCB, Air velocity = 0 m/s

4-Layer PCB, Air velocity = 1 m/s

4-Layer PCB, Air velocity = 2 m/s

39.6

37.6

21.5

18.9

17.1

Thermal resistance, QFN68 THETA_{JA_QFN68}4-Layer PCB, Air velocity = 0 m/s

Package

4-Layer PCB, Air velocity = 1 m/s

4-Layer PCB, Air velocity = 2 m/s

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Electrical Specifications

4.1.4 DC-DC Converter

Test conditions: L_DCDC=4.7 µH (Murata LQH3NPN4R7MM0L), C_DCDC=4.7 µF (Samsung CL10B475KQ8NQNC), V_DCDC_I=3.3

V, V_DCDC_O=1.8 V, I_DCDC_LOAD=50 mA, Heavy Drive configuration, F_DCDC_LN=7 MHz, unless otherwise indicated.

Table 4.4. DC-DC Converter

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Input voltage range

V_{DCDC_I}

Bypass mode, I_{DCDC_LOAD}= 50

mA

1.8

—

V_{VREGVDD_}

V

MAX

Low noise (LN) mode, 1.8 V out-

put, I_{DCDC_LOAD}= 100 mA, or

Low power (LP) mode, 1.8 V out-

put, I_{DCDC_LOAD}= 10 mA

2.4

—

V_{VREGVDD_}

V

MAX

Low noise (LN) mode, 1.8 V out-

put, I_{DCDC_LOAD}= 200 mA

2.6

1.8

—

V_{VREGVDD_}

V

MAX

Output voltage programma- V_{DCDC_O}

ble range¹

V_VREGVDD

Regulation DC accuracy

ACC_DC

Low Noise (LN) mode, 1.8 V tar-

get output

1.7

—

1.9

2.2

V

Regulation window⁴

WIN_REG

Low Power (LP) mode,

LPCMPBIASEMxx³= 0, 1.8 V tar-

get output, I_{DCDC_LOAD}≤ 75 µA

1.63

Low Power (LP) mode,

1.63

—

2.1

V

LPCMPBIASEMxx³= 3, 1.8 V tar-

get output, I_{DCDC_LOAD}≤ 10 mA

Steady-state output ripple

V_R

Radio disabled

—

3

—

mVpp

mV

CCM Mode (LNFORCECCM³=

1), Load changes between 0 mA

and 100 mA

Output voltage under/over-

shoot

V_OV

25

60

DCM Mode (LNFORCECCM³=

0), Load changes between 0 mA

and 10 mA

—

45

90

mV

Overshoot during LP to LN

CCM/DCM mode transitions com-

pared to DC level in LN mode

—

200

40

—

mV

Undershoot during BYP/LP to LN

CCM (LNFORCECCM³= 1) mode

transitions compared to DC level

in LN mode

Undershoot during BYP/LP to LN

—

100

—

mV

DCM (LNFORCECCM³= 0) mode

transitions compared to DC level

in LN mode

DC line regulation

DC load regulation

V_REG

Input changes between

V_{VREGVDD_MAX}and 2.4 V

—

0.1

—

%

I_REG

Load changes between 0 mA and

100 mA in CCM mode

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Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Max load current

I_{LOAD_MAX}

Low noise (LN) mode, Heavy

Drive², T ≤ 85 °C

—

200

mA

Low noise (LN) mode, Heavy

Drive², T > 85 °C

—

1

—

4.7

100

50

mA

µA

Low noise (LN) mode, Medium

Drive²

Low noise (LN) mode, Light

Drive²

Low power (LP) mode,

LPCMPBIASEMxx³= 0

75

Low power (LP) mode,

LPCMPBIASEMxx³= 3

10

mA

µF

DCDC nominal output ca-

pacitor⁵

C_DCDC

25% tolerance

4.7

DCDC nominal output induc- L_DCDC

tor

20% tolerance

4.7

—

4.7

1.2

4.7

2.5

µH

Ω

Resistance in Bypass mode R_BYP

Note:

1. Due to internal dropout, the DC-DC output will never be able to reach its input voltage, V_VREGVDD

.

2. Drive levels are defined by configuration of the PFETCNT and NFETCNT registers. Light Drive: PFETCNT=NFETCNT=3; Medi-

um Drive: PFETCNT=NFETCNT=7; Heavy Drive: PFETCNT=NFETCNT=15.

3. LPCMPBIASEMxx refers to either LPCMPBIASEM234H in the EMU_DCDCMISCCTRL register or LPCMPBIASEM01 in the

EMU_DCDCLOEM01CFG register, depending on the energy mode.

4. LP mode controller is a hysteretic controller that maintains the output voltage within the specified limits.

5. Output voltage under/over-shoot and regulation are specified with C_DCDC4.7 µF. Different settings for DCDCLNCOMPCTRL

must be used if C_DCDCis lower than 4.7 µF. See Application Note AN0948 for details.

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Electrical Specifications

4.1.5 Current Consumption

4.1.5.1 Current Consumption 3.3 V without DC-DC Converter

Unless otherwise indicated, typical conditions are: VREGVDD = AVDD = DVDD = RFVDD = PAVDD = 3.3 V. T = 25 °C. DCDC is off.

Minimum and maximum values in this table represent the worst conditions across supply voltage and process variation at T = 25 °C.

Table 4.5. Current Consumption 3.3 V without DC-DC Converter

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Current consumption in EM0 I_ACTIVE

mode with all peripherals dis-

abled

38.4 MHz crystal, CPU running

while loop from flash¹

—

130

—

µA/MHz

38 MHz HFRCO, CPU running

Prime from flash

—

99

—

105

—

µA/MHz

38 MHz HFRCO, CPU running

while loop from flash

38 MHz HFRCO, CPU running

CoreMark from flash

124

102

280

88

26 MHz HFRCO, CPU running

while loop from flash

108

435

—

1 MHz HFRCO, CPU running

while loop from flash

Current consumption in EM0 I_{ACTIVE_VS}

mode with all peripherals dis-

abled and voltage scaling

enabled

19 MHz HFRCO, CPU running

while loop from flash

1 MHz HFRCO, CPU running

while loop from flash

234

80

—

38.4 MHz crystal¹

38 MHz HFRCO

26 MHz HFRCO

1 MHz HFRCO

19 MHz HFRCO

1 MHz HFRCO

Current consumption in EM1 I_EM1

mode with all peripherals dis-

abled

—

50

52

54

58

µA/MHz

230

47

400

—

Current consumption in EM1 I_{EM1_VS}

mode with all peripherals dis-

abled and voltage scaling

enabled

193

—

Current consumption in EM2 I_{EM2_VS}

mode, with voltage scaling

enabled

Full 256 kB RAM retention and

RTCC running from LFXO

—

2.9

3.2

2.1

—

µA

Full 256 kB RAM retention and

RTCC running from LFRCO

16 kB (1 bank) RAM retention and

RTCC running from LFRCO²

3.5

Current consumption in EM3 I_{EM3_VS}

mode, with voltage scaling

enabled

Full 256 kB RAM retention and

CRYOTIMER running from ULFR-

CO

—

2.56

4.8

µA

Current consumption in

EM4H mode, with voltage

scaling enabled

I_{EM4H_VS}

128 byte RAM retention, RTCC

running from LFXO

—

1.0

—

µA

128 byte RAM retention, CRYO-

TIMER running from ULFRCO

0.45

0.43

128 byte RAM retention, no RTCC

0.9

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Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Current consumption in

EM4S mode

I_EM4S

No RAM retention, no RTCC

—

0.04

0.1

µA

Note:

1. CMU_HFXOCTRL_LOWPOWER=0.

2. CMU_LFRCOCTRL_ENVREF = 1, CMU_LFRCOCTRL_VREFUPDATE = 1

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Electrical Specifications

4.1.5.2 Current Consumption 3.3 V using DC-DC Converter

Unless otherwise indicated, typical conditions are: VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD = 1.8 V DC-DC

output. T = 25 °C. Minimum and maximum values in this table represent the worst conditions across supply voltage and process varia-

tion at T = 25 °C.

Table 4.6. Current Consumption 3.3 V using DC-DC Converter

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Current consumption in EM0 I_{ACTIVE_DCM}

mode with all peripherals dis-

abled, DCDC in Low Noise

DCM mode²

38.4 MHz crystal, CPU running

while loop from flash⁴

—

88

—

µA/MHz

38 MHz HFRCO, CPU running

Prime from flash

—

70

—

µA/MHz

38 MHz HFRCO, CPU running

while loop from flash

38 MHz HFRCO, CPU running

CoreMark from flash

85

26 MHz HFRCO, CPU running

while loop from flash

77

1 MHz HFRCO, CPU running

while loop from flash

636

98

Current consumption in EM0 I_{ACTIVE_CCM}

mode with all peripherals dis-

abled, DCDC in Low Noise

CCM mode¹

38.4 MHz crystal, CPU running

while loop from flash⁴

38 MHz HFRCO, CPU running

Prime from flash

—

81

82

—

µA/MHz

38 MHz HFRCO, CPU running

while loop from flash

38 MHz HFRCO, CPU running

CoreMark from flash

95

26 MHz HFRCO, CPU running

while loop from flash

95

1 MHz HFRCO, CPU running

while loop from flash

1155

101

1128

Current consumption in EM0 I_{ACTIVE_CCM_VS}19 MHz HFRCO, CPU running

mode with all peripherals dis-

abled and voltage scaling

enabled, DCDC in Low

Noise CCM mode¹

while loop from flash

1 MHz HFRCO, CPU running

while loop from flash

38.4 MHz crystal⁴

38 MHz HFRCO

26 MHz HFRCO

1 MHz HFRCO

19 MHz HFRCO

1 MHz HFRCO

Current consumption in EM1 I_{EM1_DCM}

mode with all peripherals dis-

abled, DCDC in Low Noise

—

59

—

µA/MHz

—

41

48

—

µA/MHz

DCM mode²

610

52

Current consumption in EM1 I_{EM1_DCM_VS}

mode with all peripherals dis-

abled and voltage scaling

587

enabled, DCDC in Low

Noise DCM mode²

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Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Current consumption in EM2 I_{EM2_VS}

mode, with voltage scaling

enabled, DCDC in LP mode³

Full 256 kB RAM retention and

RTCC running from LFXO

—

2.1

—

µA

Full 256 kB RAM retention and

RTCC running from LFRCO

—

2.2

1.5

—

µA

16 kB (1 bank) RAM retention and

RTCC running from LFRCO⁵

Current consumption in EM3 I_{EM3_VS}

mode, with voltage scaling

enabled

Full 256 kB RAM retention and

CRYOTIMER running from ULFR-

CO

—

1.81

—

µA

Current consumption in

EM4H mode, with voltage

scaling enabled

I_{EM4H_VS}

128 byte RAM retention, RTCC

running from LFXO

—

0.69

0.39

—

µA

128 byte RAM retention, CRYO-

TIMER running from ULFRCO

128 byte RAM retention, no RTCC

No RAM retention, no RTCC

—

0.39

0.06

—

µA

Current consumption in

EM4S mode

I_EM4S

Note:

1. DCDC Low Noise CCM Mode = Light Drive (PFETCNT=NFETCNT=3), F=6.4 MHz (RCOBAND=4), ANASW=DVDD.

2. DCDC Low Noise DCM Mode = Light Drive (PFETCNT=NFETCNT=3), F=3.0 MHz (RCOBAND=0), ANASW=DVDD.

3. DCDC Low Power Mode = Medium Drive (PFETCNT=NFETCNT=7), LPOSCDIV=1, LPCMPBIASEM234H=0, LPCLIMILIM-

SEL=1, ANASW=DVDD.

4. CMU_HFXOCTRL_LOWPOWER=0.

5. CMU_LFRCOCTRL_ENVREF = 1, CMU_LFRCOCTRL_VREFUPDATE = 1

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Electrical Specifications

4.1.5.3 Current Consumption 1.8 V without DC-DC Converter

Unless otherwise indicated, typical conditions are: VREGVDD = AVDD = DVDD = RFVDD = PAVDD = 1.8 V. T = 25 °C. DCDC is off.

Minimum and maximum values in this table represent the worst conditions across supply voltage and process variation at T = 25 °C.

Table 4.7. Current Consumption 1.8 V without DC-DC Converter

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Current consumption in EM0 I_ACTIVE

mode with all peripherals dis-

abled

38.4 MHz crystal, CPU running

while loop from flash¹

—

130

—

µA/MHz

38 MHz HFRCO, CPU running

Prime from flash

—

99

—

µA/MHz

38 MHz HFRCO, CPU running

while loop from flash

38 MHz HFRCO, CPU running

CoreMark from flash

124

102

277

87

26 MHz HFRCO, CPU running

while loop from flash

1 MHz HFRCO, CPU running

while loop from flash

Current consumption in EM0 I_{ACTIVE_VS}

mode with all peripherals dis-

abled and voltage scaling

enabled

19 MHz HFRCO, CPU running

while loop from flash

1 MHz HFRCO, CPU running

while loop from flash

231

80

38.4 MHz crystal¹

38 MHz HFRCO

26 MHz HFRCO

1 MHz HFRCO

19 MHz HFRCO

1 MHz HFRCO

Current consumption in EM1 I_EM1

mode with all peripherals dis-

abled

—

50

52

—

µA/MHz

227

47

Current consumption in EM1 I_{EM1_VS}

mode with all peripherals dis-

abled and voltage scaling

enabled

190

Current consumption in EM2 I_{EM2_VS}

mode, with voltage scaling

enabled

Full 256 kB RAM retention and

RTCC running from LFXO

—

2.8

3.0

1.9

—

µA

Full 256 kB RAM retention and

RTCC running from LFRCO

16 kB (1 bank) RAM retention and

RTCC running from LFRCO²

Current consumption in EM3 I_{EM3_VS}

mode, with voltage scaling

enabled

Full 256 kB RAM retention and

CRYOTIMER running from ULFR-

CO

—

2.47

—

µA

Current consumption in

EM4H mode, with voltage

scaling enabled

I_{EM4H_VS}

128 byte RAM retention, RTCC

running from LFXO

—

0.91

0.35

—

µA

128 byte RAM retention, CRYO-

TIMER running from ULFRCO

128 byte RAM retention, no RTCC

No RAM retention, no RTCC

—

0.35

0.04

—

µA

Current consumption in

EM4S mode

I_EM4S

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

Parameter

Note:

Symbol

Test Condition

Min

Typ

Max

Unit

1. CMU_HFXOCTRL_LOWPOWER=0.

2. CMU_LFRCOCTRL_ENVREF = 1, CMU_LFRCOCTRL_VREFUPDATE = 1

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4.1.5.4 Current Consumption Using Radio 3.3 V with DC-DC

Unless otherwise indicated, typical conditions are: VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD = 1.8 V. T = 25

°C. Minimum and maximum values in this table represent the worst conditions across supply voltage and process variation at T = 25

°C.

Table 4.8. Current Consumption Using Radio 3.3 V with DC-DC

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Current consumption in re-

ceive mode, active packet

reception (MCU in EM1 @

38.4 MHz, peripheral clocks

disabled), T ≤ 85 °C

I_{RX_ACTIVE}

500 kbit/s, 2GFSK, F = 915 MHz,

Radio clock prescaled by 4

—

9.3

10.2

mA

38.4 kbit/s, 2GFSK, F = 868 MHz,

Radio clock prescaled by 4

—

8.6

8.4

10.0

11.5

11

10.2

—

mA

38.4 kbit/s, 2GFSK, F = 490 MHz,

Radio clock prescaled by 4

50 kbit/s, 2GFSK, F = 433 MHz,

Radio clock prescaled by 4

38.4 kbit/s, 2GFSK, F = 315 MHz,

Radio clock prescaled by 4

38.4 kbit/s, 2GFSK, F = 169 MHz,

Radio clock prescaled by 4

1 Mbit/s, 2GFSK, F = 2.4 GHz,

Radio clock prescaled by 4

2 Mbit/s, 2GFSK, F = 2.4 GHz,

Radio clock prescaled by 4

—

802.15.4 receiving frame, F = 2.4

GHz, Radio clock prescaled by 3

—

Current consumption in re-

ceive mode, active packet

reception (MCU in EM1 @

38.4 MHz, peripheral clocks

disabled), T > 85 °C

I_{RX_ACTIVE_HT}

500 kbit/s, 2GFSK, F = 915 MHz,

Radio clock prescaled by 4

—

13

38.4 kbit/s, 2GFSK, F = 868 MHz,

Radio clock prescaled by 4

—

13

38.4 kbit/s, 2GFSK, F = 490 MHz,

Radio clock prescaled by 4

—

13

50 kbit/s, 2GFSK, F = 433 MHz,

Radio clock prescaled by 4

—

13

38.4 kbit/s, 2GFSK, F = 315 MHz,

Radio clock prescaled by 4

—

13

38.4 kbit/s, 2GFSK, F = 169 MHz,

Radio clock prescaled by 4

—

13

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Current consumption in re-

ceive mode, listening for

packet (MCU in EM1 @ 38.4

MHz, peripheral clocks disa-

bled), T ≤ 85 °C

I_{RX_LISTEN}

500 kbit/s, 2GFSK, F = 915 MHz,

No radio clock prescaling

—

10.2

11

mA

38.4 kbit/s, 2GFSK, F = 868 MHz,

No radio clock prescaling

—

9.5

9.4

9.3

10.9

11.9

12.5

—

11

—

14

mA

38.4 kbit/s, 2GFSK, F = 490 MHz,

No radio clock prescaling

50 kbit/s, 2GFSK, F = 433 MHz,

No radio clock prescaling

38.4 kbit/s, 2GFSK, F = 315 MHz,

No radio clock prescaling

38.4 kbit/s, 2GFSK, F = 169 MHz,

No radio clock prescaling

1 Mbit/s, 2GFSK, F = 2.4 GHz, No

radio clock prescaling

2 Mbit/s, 2GFSK, F = 2.4 GHz, No

radio clock prescaling

802.15.4, F = 2.4 GHz, No radio

clock prescaling

Current consumption in re-

ceive mode, listening for

packet (MCU in EM1 @ 38.4

MHz, peripheral clocks disa-

bled), T > 85 °C

I_{RX_LISTEN_HT}

500 kbit/s, 2GFSK, F = 915 MHz,

No radio clock prescaling

38.4 kbit/s, 2GFSK, F = 868 MHz,

No radio clock prescaling

—

38.4 kbit/s, 2GFSK, F = 490 MHz,

No radio clock prescaling

—

50 kbit/s, 2GFSK, F = 433 MHz,

No radio clock prescaling

—

38.4 kbit/s, 2GFSK, F = 315 MHz,

No radio clock prescaling

—

38.4 kbit/s, 2GFSK, F = 169 MHz,

No radio clock prescaling

—

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Current consumption in

transmit mode (MCU in EM1

@ 38.4 MHz, peripheral

clocks disabled), T ≤ 85 °C

I_TX

F = 915 MHz, CW, 20 dBm

match, PAVDD connected directly

to external 3.3V supply

—

90.2

134.3

mA

F = 915 MHz, CW, 14 dBm

match, PAVDD connected to

DCDC output

—

36

42.5

106.7

41

mA

F = 868 MHz, CW, 20 dBm

match, PAVDD connected directly

to external 3.3V supply

79.7

35.3

93.8

20.3

34

F = 868 MHz, CW, 14 dBm

match, PAVDD connected to

DCDC output

F = 490 MHz, CW, 20 dBm

match, PAVDD connected directly

to external 3.3V supply

125.4

24

F = 433 MHz, CW, 10 dBm

match, PAVDD connected to

DCDC output

F = 433 MHz, CW, 14 dBm

match, PAVDD connected to

DCDC output

41.5

42

F = 315 MHz, CW, 14 dBm

match, PAVDD connected to

DCDC output

33.5

88.6

F = 169 MHz, CW, 20 dBm

match, PAVDD connected directly

to external 3.3V supply

116.7

F = 2.4 GHz, CW, 0 dBm output

power, Radio clock prescaled by 3

—

8.5

9.5

16.5

26

—

mA

F = 2.4 GHz, CW, 0 dBm output

power, Radio clock prescaled by 1

F = 2.4 GHz, CW, 3 dBm output

power

F = 2.4 GHz, CW, 8 dBm output

power

F = 2.4 GHz, CW, 10.5 dBm out-

put power

34

F = 2.4 GHz, CW, 16.5 dBm out-

put power, PAVDD connected di-

rectly to external 3.3V supply

86

F = 2.4 GHz, CW, 19.5 dBm out-

put power, PAVDD connected di-

rectly to external 3.3V supply

—

131

—

mA

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Current consumption in

transmit mode (MCU in EM1

@ 38.4 MHz, peripheral

clocks disabled), T > 85 °C

I_{TX_HT}

F = 915 MHz, CW, 20 dBm

match, PAVDD connected directly

to external 3.3V supply

—

134.3

mA

F = 915 MHz, CW, 14 dBm

match, PAVDD connected to

DCDC output

—

42.5

109.8

41.3

130.8

24.4

41.5

42

mA

F = 868 MHz, CW, 20 dBm

match, PAVDD connected directly

to external 3.3V supply

F = 868 MHz, CW, 14 dBm

match, PAVDD connected to

DCDC output

F = 490 MHz, CW, 20 dBm

match, PAVDD connected directly

to external 3.3V supply

F = 433 MHz, CW, 10 dBm

match, PAVDD connected to

DCDC output

F = 433 MHz, CW, 14 dBm

match, PAVDD connected to

DCDC output

F = 315 MHz, CW, 14 dBm

match, PAVDD connected to

DCDC output

F = 169 MHz, CW, 20 dBm

match, PAVDD connected directly

to external 3.3V supply

122.8

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4.1.6 Wake Up Times

Table 4.9. Wake Up Times

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Wake up time from EM1

t_{EM1_WU}

—

3

—

AHB

Clocks

Wake up from EM2

Wake up from EM3

t_{EM2_WU}

Code execution from flash

Code execution from RAM

Code execution from flash

Code execution from RAM

Executing from flash

—

10.1

3.2

—

µs

t_{EM3_WU}

10.1

3.2

Wake up from EM4H¹

Wake up from EM4S¹

t_{EM4H_WU}

t_{EM4S_WU}

t_RESET

80

Executing from flash

—

291

—

µs

Time from release of reset

source to first instruction ex-

ecution

Soft Pin Reset released

Any other reset released

—

43

—

µs

350

Power mode scaling time

t_SCALE

VSCALE0 to VSCALE2, HFCLK =

19 MHz^{4 2}

—

31.8

4.3

—

µs

VSCALE2 to VSCALE0, HFCLK =

19 MHz³

Note:

1. Time from wake up request until first instruction is executed. Wakeup results in device reset.

2. VSCALE0 to VSCALE2 voltage change transitions occur at a rate of 10 mV/µs for approximately 20 µs. During this transition,

peak currents will be dependent on the value of the DECOUPLE output capacitor, from 35 mA (with a 1 µF capacitor) to 70 mA

(with a 2.7 µF capacitor).

3. Scaling down from VSCALE2 to VSCALE0 requires approximately 2.8 µs + 29 HFCLKs.

4. Scaling up from VSCALE0 to VSCALE2 requires approximately 30.3 µs + 28 HFCLKs.

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4.1.7 Brown Out Detector (BOD)

Table 4.10. Brown Out Detector (BOD)

Parameter

Symbol

Test Condition

Min

—

Typ

—

Max

1.62

—

Unit

V

DVDD BOD threshold

V_DVDDBOD

DVDD rising

DVDD falling (EM0/EM1)

DVDD falling (EM2/EM3)

1.35

1.3

—

V

—

V

DVDD BOD hysteresis

DVDD BOD response time

AVDD BOD threshold

V_{DVDDBOD_HYST}

18

2.4

—

mV

µs

V

t_{DVDDBOD_DELAY}Supply drops at 0.1V/µs rate

—

V_AVDDBOD

AVDD rising

—

1.8

—

AVDD falling (EM0/EM1)

AVDD falling (EM2/EM3)

1.62

1.53

—

V

—

V

AVDD BOD hysteresis

AVDD BOD response time

EM4 BOD threshold

V_{AVDDBOD_HYST}

20

2.4

—

mV

µs

V

t_{AVDDBOD_DELAY}Supply drops at 0.1V/µs rate

—

V_EM4DBOD

AVDD rising

AVDD falling

—

1.7

—

1.45

—

V

EM4 BOD hysteresis

V_{EM4BOD_HYST}

25

300

—

mV

µs

EM4 BOD response time

t_{EM4BOD_DELAY}Supply drops at 0.1V/µs rate

—

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4.1.8 Frequency Synthesizer

Table 4.11. Frequency Synthesizer

Parameter

Symbol

Test Condition

2400 - 2483.5 MHz

779 - 956 MHz

584 - 717 MHz

358 - 574 MHz

191 - 358 MHz

110 - 191 MHz

2400 - 2483.5 MHz

779 - 956 MHz

584 - 717 MHz

358 - 574 MHz

191 - 358 MHz

110 - 191 MHz

2400 - 2483.5 MHz

779 - 956 MHz

584 - 717 MHz

358 - 574 MHz

191 - 358 MHz

110 - 191 MHz

2400 - 2483.5 MHz

779 - 956 MHz

584 - 717 MHz

358 - 574 MHz

191 - 358 MHz

110 - 191 MHz

Min

2400

779

584

358

191

110

—

Typ

—

Max

2483.5

956

717

574

358

191

73

Unit

MHz

Hz

RF synthesizer frequency

range

f_RANGE

LO tuning frequency resolu- f_RES

tion with 38.4 MHz crystal

—

24

Hz

—

18.3

12.2

7.3

Hz

—

Hz

—

Hz

—

4.6

Hz

Frequency deviation resolu- df_RES

tion with 38.4 MHz crystal

—

73

Hz

—

24

Hz

—

18.3

12.2

7.3

Hz

—

Hz

—

Hz

—

4.6

Hz

Maximum frequency devia-

tion with 38.4 MHz crystal

df_MAX

—

1677

559

419

280

167

105

kHz

—

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4.1.9 2.4 GHz RF Transceiver Characteristics

4.1.9.1 RF Transmitter General Characteristics for 2.4 GHz Band

Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD.

RFVDD and PAVDD path is filtered using ferrites. Crystal frequency=38.4 MHz. RF center frequency 2.45 GHz.

Table 4.12. RF Transmitter General Characteristics for 2.4 GHz Band

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Maximum TX power¹

POUT_MAX

19 dBm-rated part numbers.

PAVDD connected directly to ex-

ternal 3.3V supply

—

19.5

—

dBm

10 dBm-rated part numbers

0 dBm-rated part numbers

CW

—

10.5

—

dBm

dB

Minimum active TX Power

Output power step size

POUT_MIN

-30

1

POUT_STEP

-5 dBm< Output power < 0 dBm

—

0 dBm < output power <

POUT_MAX

0.5

dB

Output power variation vs

supply at POUT_MAX

POUT_{VAR_V}

1.8 V < V_VREGVDD< 3.3 V,

PAVDD connected directly to ex-

ternal supply, for output power >

10 dBm.

—

4.5

3.8

—

dB

1.8 V < V_VREGVDD< 3.3 V,

PAVDD connected directly to ex-

ternal supply, for output power =

10 dBm.

—

1.8 V < V_VREGVDD< 3.3 V using

DC-DC converter

—

2.2

1.5

2.2

1.5

3.4

0.4

—

dB

Output power variation vs

temperature at POUT_MAX

POUT_{VAR_T}

From -40 to +85 °C, PAVDD con-

nected to DC-DC output

From -40 to +125 °C, PAVDD

connected to DC-DC output

—

dB

From -40 to +85 °C, PAVDD con-

nected to external supply

—

dB

From -40 to +125 °C, PAVDD

connected to external supply

—

dB

Output power variation vs RF POUT_{VAR_F}

frequency at POUT_MAX

Over RF tuning frequency range

—

dB

RF tuning frequency range

F_RANGE

2400

2483.5

MHz

Note:

1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov-

ered in this datasheet can be found in the Max TX Power column of the Ordering Information Table.

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4.1.9.2 RF Receiver General Characteristics for 2.4 GHz Band

Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD.

RFVDD and PAVDD path is filtered using ferrites. Crystal frequency=38.4 MHz. RF center frequency 2.45 GHz.

Table 4.13. RF Receiver General Characteristics for 2.4 GHz Band

Parameter

Symbol

F_RANGE

SPUR_RX

Test Condition

Min

2400

—

Typ

—

Max

2483.5

—

Unit

MHz

dBm

RF tuning frequency range

Receive mode maximum

spurious emission

30 MHz to 1 GHz

1 GHz to 12 GHz

-57

—

-47

—

Max spurious emissions dur- SPUR_{RX_FCC}

ing active receive mode, per

FCC Part 15.109(a)

216 MHz to 960 MHz, Conducted

Measurement

—

-55.2

—

Above 960 MHz, Conducted

Measurement

—

-47.2

-24

—

dBm

Level above which

RFSENSE will trigger¹

RFSENSE_TRIG

CW at 2.45 GHz

Level below which

RFSENSE will not trigger¹

RFSENSE_THRESCW at 2.45 GHz

—

-50

—

dBm

1% PER sensitivity

SENS_2GFSK

2 Mbps 2GFSK signal

250 kbps 2GFSK signal

—

-89.6

—

dBm

-100.7

Note:

1. RFSENSE performance is only valid from 0 to 85 °C. RFSENSE should be disabled outside this temperature range.

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4.1.9.3 RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 1 Mbps Data Rate

Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD.

RFVDD and PAVDD path is filtered using ferrites. Crystal frequency=38.4MHz. RF center frequency 2.45 GHz. Maximum duty cycle of

85%.

Table 4.14. RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 1 Mbps Data Rate

Parameter

Symbol

TXBW

Test Condition

Min

—

Typ

781

-8.4

Max

—

Unit

Transmit 6dB bandwidth

Power spectral density limit

10 dBm

kHz

PSD_LIMIT

Per FCC part 15.247 at 10 dBm

—

dBm/

3kHz

Per FCC part 15.247 at 20 dBm

—

-0.4

10.1

1.1

—

dBm/

3kHz

Per ETSI 300.328 at 10 dBm/1

MHz

dBm

Occupied channel bandwidth OCP_ETSI328

per ETSI EN300.328

99% BW at highest and lowest

channels in band, 10 dBm

MHz

In-band spurious emissions, SPUR_INB

with allowed exceptions³

At ± 2 MHz, 10 dBm

At ± 3 MHz, 10 dBm

At ± 2 MHz, 20 dBm

At ± 3 MHz, 20 dBm

—

-39.5

-44.7

—

dBm

-20

-30

—

Emissions of harmonics out- SPUR_{HRM_FCC}2nd,3rd, 5, 6, 8, 9,10 harmonics;

-47

of-band, per FCC part

15.247

continuous transmission of modu-

lated carrier

Spurious emissions out-of-

band, excluding harmonics

captured in SPUR_HARM,FCC

Emissions taken at

POUT_MAX, PAVDD connec-

ted to external 3.3 V supply

SPUR_{OOB_FCC}

Per FCC part 15.205/15.209,

Above 2.483 GHz or below 2.4

GHz; continuous transmission of

—

-47

-26

—

dBm

dBc

.

CW carrier, Restricted Bands^{1 2}

Per FCC part 15.247, Above

2.483 GHz or below 2.4 GHz;

continuous transmission of CW

carrier, Non-Restricted Bands

Spurious emissions out-of-

band; per ETSI 300.328

SPUR_ETSI328

[2400-BW to 2400] MHz, [2483.5

to 2483.5+BW] MHz

—

-16

-26

—

dBm

[2400-2BW to 2400-BW] MHz,

[2483.5+BW to 2483.5+2BW]

MHz per ETSI 300.328

Spurious emissions per ETSI SPUR_ETSI440

EN300.440

47-74 MHz,87.5-108 MHz,

174-230 MHz, 470-862 MHz

—

-60

—

dBm

25-1000 MHz

1-12 GHz

—

-42

-36

—

dBm

Note:

1. For 2476 MHz, 1.5 dB of power backoff is used to achieve this value.

2. For 2478 MHz, 4.2 dB of power backoff is used to achieve this value.

3. Per Bluetooth Core_5.0, Vol.6 Part A, Section 3.2.2, exceptions are allowed in up to three bands of 1 MHz width, centered on a

frequency which is an integer multiple of 1 MHz. These exceptions shall have an absolute value of -20 dBm or less.

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4.1.9.4 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 1 Mbps Data Rate

Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD.

RFVDD and PAVDD path is filtered using ferrites. Crystal frequency=38.4MHz. RF center frequency 2.45 GHz.

Table 4.15. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 1 Mbps Data Rate

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Signal is reference signal². Packet

length is 20 bytes.

Max usable receiver input

level, 0.1% BER

SAT

—

10

—

dBm

Signal is reference signal². Using

DC-DC converter.

Sensitivity, 0.1% BER

SENS

—

-94.8

-94.4

—

dBm

With non-ideal signals as speci-

fied in RF-PHY.TS.4.2.2, section

4.6.1.

Signal to co-channel interfer- C/I_CC

er, 0.1% BER

Desired signal 3 dB above refer-

ence sensitivity.

—

10.3

-1.8

—

dB

N+1 adjacent channel selec- C/I₁₊

tivity, 0.1% BER, with allowa-

ble exceptions. Desired is

Interferer is reference signal at +1

MHz offset. Desired frequency

2402 MHz ≤ Fc ≤ 2480 MHz

reference signal at -67 dBm

N-1 adjacent channel selec- C/I_1-

tivity, 0.1% BER, with allowa-

ble exceptions. Desired is

Interferer is reference signal at -1

MHz offset. Desired frequency

2402 MHz ≤ Fc ≤ 2480 MHz

—

-0.7

—

dB

reference signal at -67 dBm

Alternate selectivity, 0.1%

BER, with allowable excep-

tions. Desired is reference

signal at -67 dBm

C/I₂

Interferer is reference signal at ± 2

MHz offset. Desired frequency

2402 MHz ≤ Fc ≤ 2480 MHz,

QFN48 and BGA125 packages.

-40.6

-34.1

-46.2

Interferer is reference signal at ± 2

MHz offset. Desired frequency

2402 MHz ≤ Fc ≤ 2480 MHz,

QFN68 package.

Alternate selectivity, 0.1%

BER, with allowable excep-

tions. Desired is reference

signal at -67 dBm

C/I₃

Interferer is reference signal at ± 3

MHz offset. Desired frequency

2404 MHz ≤ Fc ≤ 2480 MHz

Selectivity to image frequen- C/I_IM

cy, 0.1% BER. Desired is ref-

erence signal at -67 dBm

Interferer is reference signal at im-

age frequency with 1 MHz preci-

sion

—

-38.1

-46.5

—

dB

Selectivity to image frequen- C/I_IM+1

cy ± 1 MHz, 0.1% BER. De-

sired is reference signal at

-67 dBm

Interferer is reference signal at im-

age frequency ± 1 MHz with 1

MHz precision

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Blocking, less than 0.1%

BER. Desired is -67dBm

BLE reference signal at

2426MHz. Interferer is CW in

BLOCK_OOB

Interferer frequency 30 MHz ≤ f ≤

2000 MHz

-5

—

dBm

Interferer frequency 2003 MHz ≤ f

≤ 2399 MHz

-24

-10

-17

—

dBm

OOB range¹

Interferer frequency 2484 MHz ≤ f

≤ 2997 MHz

Interferer frequency 3 GHz ≤ f ≤ 6

GHz

—

Interferer frequency 6 GHz ≤ f ≤

12.75 GHz

—

Intermodulation performance IM

Per Core_4.1, Vol 6, Part A, Sec-

tion 4.4 with n = 3

-23.7

Note:

1. Interferer max power limited by equipment capabilities and path loss. Minimum specified at 25 °C.

2. Reference signal is defined 2GFSK at -67 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 1 Mbps, desired data = PRBS9;

interferer data = PRBS15; frequency accuracy better than 1 ppm.

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4.1.9.5 RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 2 Mbps Data Rate

Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD.

RFVDD and PAVDD path is filtered using ferrites. Crystal frequency=38.4MHz. RF center frequency 2.45 GHz. Maximum duty cycle of

85%.

Table 4.16. RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 2 Mbps Data Rate

Parameter

Symbol

TXBW

Test Condition

Min

—

Typ

1404

-12.3

Max

—

Unit

Transmit 6dB bandwidth

Power spectral density limit

10 dBm

kHz

PSD_LIMIT

Per FCC part 15.247 at 10 dBm

—

dBm/

3kHz

Per FCC part 15.247 at 20 dBm

—

-4.0

11.3

2.1

—

dBm/

3kHz

Per ETSI 300.328 at 10 dBm/1

MHz

dBm

Occupied channel bandwidth OCP_ETSI328

per ETSI EN300.328

99% BW at highest and lowest

channels in band, 10 dBm

MHz

In-band spurious emissions, SPUR_INB

with allowed exceptions⁵

At ± 4 MHz, 10 dBm

At ± 6 MHz, 10 dBm

At ± 4 MHz, 20 dBm

At ± 6 MHz, 20 dBm

—

-40.3

-43.6

-32.3

-35.6

-47

—

dBm

Emissions of harmonics out- SPUR_{HRM_FCC}2nd,3rd, 5, 6, 8, 9,10 harmonics;

of-band, per FCC part

15.247

continuous transmission of modu-

lated carrier

Spurious emissions out-of-

band, excluding harmonics

captured in SPUR_HARM,FCC

Emissions taken at

POUT_MAX, PAVDD connec-

ted to external 3.3 V supply

SPUR_{OOB_FCC}

Per FCC part 15.205/15.209,

Above 2.483 GHz or below 2.4

GHz; continuous transmission of

—

-47

-26

—

dBm

dBc

.

CW carrier, Restricted Bands^{1 2 3}

4

Per FCC part 15.247, Above

2.483 GHz or below 2.4 GHz;

continuous transmission of CW

carrier, Non-Restricted Bands

Spurious emissions out-of-

band; per ETSI 300.328

SPUR_ETSI328

[2400-BW to 2400] MHz, [2483.5

to 2483.5+BW] MHz

—

-16

-26

—

dBm

[2400-2BW to 2400-BW] MHz,

[2483.5+BW to 2483.5+2BW]

MHz per ETSI 300.328

Spurious emissions per ETSI SPUR_ETSI440

EN300.440

47-74 MHz,87.5-108 MHz,

174-230 MHz, 470-862 MHz

—

-60

—

dBm

25-1000 MHz

1-12 GHz

—

-42

-36

—

dBm

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

Parameter

Note:

Symbol

Test Condition

Min

Typ

Max

Unit

1. For 2472 MHz, 1.3 dB of power backoff is used to achieve this value.

2. For 2474 MHz, 3.8 dB of power backoff is used to achieve this value.

3. For 2476 MHz, 7 dB of power backoff is used to achieve this value.

4. For 2478 MHz, 11.2 dB of power backoff is used to achieve this value.

5. Per Bluetooth Core_5.0, Vol.6 Part A, Section 3.2.2, exceptions are allowed in up to three bands of 1 MHz width, centered on a

frequency which is an integer multiple of 1 MHz. These exceptions shall have an absolute value of -20 dBm or less.

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4.1.9.6 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 2 Mbps Data Rate

Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD.

RFVDD and PAVDD path is filtered using ferrites. Crystal frequency=38.4MHz. RF center frequency 2.45 GHz¹.

Table 4.17. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 2 Mbps Data Rate

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Signal is reference signal². Packet

length is 20 bytes.

Max usable receiver input

level, 0.1% BER

SAT

—

10

—

dBm

Signal is reference signal². Using

DC-DC converter. QFN48 and

BGA125 packages.

Sensitivity, 0.1% BER

SENS

—

-91.3

-91

—

dBm

With non-ideal signals as speci-

fied in RF-PHY.TS.4.2.2, section

4.6.1. QFN48 and BGA125 pack-

ages.

Signal is reference signal². Using

DC-DC converter. QFN68 pack-

age.

—

-91.3

-90.1

—

dBm

With non-ideal signals as speci-

fied in RF-PHY.TS.4.2.2, section

4.6.1. QFN68 package.

Signal to co-channel interfer- C/I_CC

er, 0.1% BER

Desired signal 3 dB above refer-

ence sensitivity.

—

7.3

—

dB

N+1 adjacent channel selec- C/I₁₊

tivity, 0.1% BER, with allowa-

ble exceptions. Desired is

Interferer is reference signal at +2

MHz offset. Desired frequency

2402 MHz ≤ Fc ≤ 2480 MHz

-10.4

reference signal at -67 dBm

N-1 adjacent channel selec- C/I_1-

tivity, 0.1% BER, with allowa-

ble exceptions. Desired is

Interferer is reference signal at -2

MHz offset. Desired frequency

2402 MHz ≤ Fc ≤ 2480 MHz

—

-13.9

-40.9

-43.7

—

dB

reference signal at -67 dBm

Alternate selectivity, 0.1%

BER, with allowable excep-

tions. Desired is reference

signal at -67 dBm

C/I₂

Interferer is reference signal at ± 4

MHz offset. Desired frequency

2402 MHz ≤ Fc ≤ 2480 MHz

Alternate selectivity, 0.1%

BER, with allowable excep-

tions. Desired is reference

signal at -67 dBm

C/I₃

Interferer is reference signal at ± 6

MHz offset. Desired frequency

2404 MHz ≤ Fc ≤ 2480 MHz

Selectivity to image frequen- C/I_IM

cy, 0.1% BER. Desired is ref-

erence signal at -67 dBm

Interferer is reference signal at im-

age frequency with 1 MHz preci-

sion

—

-10.4

-40.9

—

dB

Selectivity to image frequen- C/I_IM+1

cy ± 2 MHz, 0.1% BER. De-

sired is reference signal at

-67 dBm

Interferer is reference signal at im-

age frequency ± 2 MHz with 2

MHz precision

Intermodulation performance IM

Per Core_4.1, Vol 6, Part A, Sec-

tion 4.4 with n = 3

—

-25.1

—

dBm

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

Parameter

Note:

Symbol

Test Condition

Min

Typ

Max

Unit

1. For the BLE 2Mbps in-band blocking performance, there may be up to 5 spurious response channels where the requirement of

30.8% PER is not met and therefore an exception will need to be taken for each of these frequencies to meet the requirements of

the BLE standard.

2. Reference signal is defined 2GFSK at -67 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 2 Mbps, desired data = PRBS9;

interferer data = PRBS15; frequency accuracy better than 1 ppm.

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4.1.9.7 RF Transmitter Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band

Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD.

RFVDD and PAVDD path is filtered using ferrites. Crystal frequency=38.4 MHz. RF center frequency 2.45 GHz. Maximum duty cycle of

66%.

Table 4.18. RF Transmitter Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Error vector magnitude (off- EVM

set EVM), per

802.15.4-2011, not including

2415 MHz channel

Average across frequency. Signal

is DSSS-OQPSK reference pack-

et¹

—

3.8

—

% rms

Power spectral density limit

PSD_LIMIT

Relative, at carrier ± 3.5 MHz, out-

put power at POUT_MAX

—

-26

-36

—

dBc/

100kHz

Absolute, at carrier ± 3.5 MHz,

dBm/

100kHz

3

output power at POUT_MAX

Per FCC part 15.247, output pow-

er at POUT_MAX

—

-4

—

dBm/

3kHz

ETSI

—

12.1

2.25

—

dBm

MHz

Occupied channel bandwidth OCP_ETSI328

per ETSI EN300.328

99% BW at highest and lowest

channels in band

Spurious emissions of har-

monics in restricted bands

per FCC Part 15.205/15.209,

Emissions taken at

POUT_MAX, PAVDD connec-

ted to external 3.3 V supply,

Test Frequency is 2450 MHz

SPUR_{HRM_FCC_}Continuous transmission of modu-

—

-45.8

—

dBm

lated carrier

R

Spurious emissions of har-

monics in non-restricted

bands per FCC Part

SPUR_{HRM_FCC_}Continuous transmission of modu-

-26

dBc

lated carrier

NRR

15.247/15.35, Emissions tak-

en at POUT_MAX, PAVDD

connected to external 3.3 V

supply, Test Frequency is

2450 MHz

Spurious emissions out-of-

band (above 2.483 GHz or

below 2.4 GHz) in restricted

bands, per FCC part

15.205/15.209, Emissions

taken at POUT_MAX, PAVDD

connected to external 3.3 V

supply, Test Frequency =

2450 MHz

SPUR_{OOB_FCC_}Restricted bands 30-88 MHz; con-

—

-61

-58

-55

-47

—

dBm

tinuous transmission of modulated

R

carrier

Restricted bands 88-216 MHz;

continuous transmission of modu-

lated carrier

Restricted bands 216-960 MHz;

continuous transmission of modu-

lated carrier

Restricted bands >960 MHz; con-

tinuous transmission of modulated

carrier^{4 5}

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Spurious emissions out-of-

band in non-restricted bands

per FCC Part 15.247, Emis-

SPUR_{OOB_FCC_}Above 2.483 GHz or below 2.4

—

-26

—

dBc

GHz; continuous transmission of

NR

modulated carrier

sions taken at POUT_MAX

,

PAVDD connected to exter-

nal 3.3 V supply, Test Fre-

quency = 2450 MHz

Spurious emissions out-of-

band; per ETSI 300.328²

SPUR_ETSI328

[2400-BW to 2400], [2483.5 to

2483.5+BW];

—

-16

-26

—

dBm

[2400-2BW to 2400-BW],

[2483.5+BW to 2483.5+2BW]; per

ETSI 300.328

Spurious emissions per ETSI SPUR_ETSI440

EN300.440²

47-74 MHz,87.5-108 MHz,

174-230 MHz, 470-862 MHz

—

-60

-42

-36

—

dBm

25-1000 MHz, excluding above

frequencies

1G-14G

Note:

1. Reference packet is defined as 20 octet PSDU, modulated according to 802.15.4-2011 DSSS-OQPSK in the 2.4GHz band, with

pseudo-random packet data content.

2. Specified at maximum power output level of 10 dBm.

3. For 2415 MHz, 2 dB of power backoff is used to achieve this value.

4. For 2475 MHz, 2 dB of power backoff is used to achieve this value.

5. For 2480 MHz, 13 dB of power backoff is used to achieve this value.

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4.1.9.8 RF Receiver Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band

Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD.

RFVDD and PAVDD path is filtered using ferrites. Crystal frequency=38.4 MHz. RF center frequency 2.45 GHz.

Table 4.19. RF Receiver Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Signal is reference signal⁴. Packet

length is 20 octets.

Max usable receiver input

level, 1% PER

SAT

—

10

—

dBm

Sensitivity, 1% PER

SENS

Signal is reference signal. Packet

length is 20 octets. Using DC-DC

converter.

—

-102.7

—

dBm

Signal is reference signal. Packet

length is 20 octets. Without DC-

DC converter.

Co-channel interferer rejec- CCR

tion, 1% PER

Desired signal 3 dB above sensi-

tivity limit

—

-4.6

40.7

47

—

dB

High-side adjacent channel

rejection, 1% PER. Desired

is reference signal at 3dB

above reference sensitivity

ACR_P1

Interferer is reference signal at +1

channel-spacing.

Interferer is filtered reference sig-

nal²at +1 channel-spacing.

level⁵

Interferer is CW at +1 channel-

spacing³.

—

54.3

—

dB

Low-side adjacent channel

rejection, 1% PER. Desired

is reference signal at 3dB

above reference sensitivity

ACR_M1

ACR₂

IR

Interferer is reference signal at -1

channel-spacing.

—

40.8

47.5

—

dB

Interferer is filtered reference sig-

nal²at -1 channel-spacing.

level⁵

Interferer is CW at -1 channel-

spacing.

—

56.5

51.5

53.7

—

dB

Alternate channel rejection,

1% PER. Desired is refer-

ence signal at 3dB above

reference sensitivity level⁵

Interferer is reference signal at ± 2

channel-spacing

Interferer is filtered reference sig-

nal²at ± 2 channel-spacing

Interferer is CW at ± 2 channel-

spacing

—

62.4

50.4

—

dB

Interferer is CW in image band³

Image rejection , 1% PER,

Desired is reference signal at

3dB above reference sensi-

tivity level⁵

Blocking rejection of all other BLOCK

channels. 1% PER, Desired

is reference signal at 3dB

above reference sensitivity

level⁵. Interferer is reference

signal

Interferer frequency < Desired fre-

quency - 3 channel-spacing

—

58.5

56.4

—

dB

Interferer frequency > Desired fre-

quency + 3 channel-spacing

Blocking rejection of 802.11g BLOCK_80211G

signal centered at +12MHz

or -13MHz¹

Desired is reference signal at 6dB

above reference sensitivity level⁵

—

53

—

dB

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Upper limit of input power

range over which RSSI reso-

lution is maintained

RSSI_MAX

—

5

dBm

Lower limit of input power

range over which RSSI reso-

lution is maintained

RSSI_MIN

-98

—

dBm

RSSI resolution

RSSI_RES

RSSI_LIN

over RSSI_MINto RSSI_MAX

—

0.25

+/-6

—

dB

RSSI accuracy in the linear

region as defined by

802.15.4-2003

Note:

1. This is an IEEE 802.11b/g ERP-PBCC 22 MBit/s signal as defined by the IEEE 802.11 specification and IEEE 802.11g adden-

dum.

2. Filter is characterized as a symmetric bandpass centered on the adjacent channel having a 3dB bandwidth of 4.6 MHz and stop-

band rejection better than 26 dB beyond 3.15 MHz from the adjacent carrier.

3. Due to low-IF frequency, there is some overlap of adjacent channel and image channel bands. Adjacent channel CW blocker

tests place the Interferer center frequency at the Desired frequency ± 5 MHz on the channel raster, whereas the image rejection

test places the CW interferer near the image frequency of the Desired signal carrier, regardless of the channel raster.

4. Reference signal is defined as O-QPSK DSSS per 802.15.4, Frequency range = 2400-2483.5 MHz, Symbol rate = 62.5 ksym-

bols/s.

5. Reference sensitivity level is -85 dBm.

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4.1.10 Sub-GHz RF Transceiver Characteristics

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4.1.10.1 Sub-GHz RF Transmitter characteristics for 915 MHz Band

Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD.

RFVDD and PAVDD path is filtered using ferrites. Crystal frequency=38.4 MHz. RF center frequency 915 MHz.

Table 4.20. Sub-GHz RF Transmitter characteristics for 915 MHz Band

Parameter

Symbol

F_RANGE

Test Condition

Min

902

18

Typ

—

Max

930

Unit

MHz

dBm

RF tuning frequency range

Maximum TX Power¹

POUT_MAX

PAVDD connected directly to ex-

ternal 3.3V supply, 20 dBm output

power setting

19.8

23.3

PAVDD connected to DC-DC out-

put, 14 dBm output power setting

12.6

14.2

16.1

dBm

Minimum active TX Power

Output power step size

POUT_MIN

—

-45.5

0.5

—

dBm

dB

POUT_STEP

POUT_{VAR_V}

output power > 0 dBm

Output power variation vs

supply at POUT_MAX

1.8 V < V_VREGVDD< 3.3 V,

PAVDD connected to external

supply, T = 25 °C

4.8

dB

1.8 V < V_VREGVDD< 3.3 V,

PAVDD connected to DC-DC out-

put, T = 25 °C

—

1.9

—

dB

Output power variation vs

temperature, peak to peak

POUT_{VAR_T}

-40 to +85 °C with PAVDD con-

nected to external supply

—

0.6

0.7

0.2

0.3

-45

-26

1.3

1.4

0.6

-42

-20

dB

-40 to +85 °C with PAVDD con-

nected to DC-DC output

Output power variation vs RF POUT_{VAR_F}

frequency

PAVDD connected to external

supply, T = 25 °C

dB

PAVDD connected to DC-DC out-

put, T = 25 °C

dB

Spurious emissions of har-

monics at 20 dBm output

power, Conducted measure-

ment, 20dBm match, PAVDD

= 3.3V, Test Frequency =

915 MHz

SPUR_{HARM_FCC}In restricted bands, per FCC Part

dBm

dBc

15.205 / 15.209

_20

In non-restricted bands, per FCC

Part 15.231

Spurious emissions out-of-

band at 20 dBm output pow-

er, Conducted measurement,

20dBm match, PAVDD =

3.3V, Test Frequency = 915

MHz

SPUR_{OOB_FCC_}In non-restricted bands, per FCC

—

-26

-52

-61

-58

-20

-46

-56

-52

dBc

dBm

Part 15.231

20

In restricted bands (30-88 MHz),

per FCC Part 15.205 / 15.209

In restricted bands (88-216 MHz),

per FCC Part 15.205 / 15.209

In restricted bands (216-960

MHz), per FCC Part 15.205 /

15.209

In restricted bands (>960 MHz),

per FCC Part 15.205 / 15.209

—

-47

-42

dBm

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Spurious emissions of har-

monics at 14 dBm output

SPUR_{HARM_FCC}In restricted bands, per FCC Part

—

-47

-42

dBm

15.205 / 15.209

_14

power, Conducted measure-

ment, 14dBm match, PAVDD

connected to DC-DC output,

Test Frequency = 915 MHz

In non-restricted bands, per FCC

Part 15.231

—

-26

-20

dBc

Spurious emissions out-of-

band at 14 dBm output pow-

er, Conducted measurement,

14dBm match, PAVDD con-

nected to DC-DC output,

SPUR_{OOB_FCC_}In non-restricted bands, per FCC

—

-26

-52

-61

-58

-20

-46

-56

-52

dBc

dBm

Part 15.231

14

In restricted bands (30-88 MHz),

per FCC Part 15.205 / 15.209

Test Frequency = 915 MHz

In restricted bands (88-216 MHz),

per FCC Part 15.205 / 15.209

In restricted bands (216-960

MHz), per FCC Part 15.205 /

15.209

In restricted bands (>960 MHz),

per FCC Part 15.205 / 15.209

—

-45

1.0

-42

2.8

dBm

Error vector magnitude (off- EVM

set EVM), per 802.15.4-2011

Signal is DSSS-OQPSK reference

packet. Modulated according to

802.15.4-2011 DSSS-OQPSK in

the 915MHz band, with pseudo-

random packet data content.

PAVDD connected to external

3.3V supply.

%rms

Power spectral density limit

PSD

Relative, at carrier ± 1.2 MHz.

Average spectral power shall be

measured using a 100kHz resolu-

tion bandwidth. The reference lev-

el shall be the highest average

spectral power measured within ±

600kHz of the carrier frequency.

PAVDD connected to external

3.3V supply.

—

-37.1

-24.8

dBc/

100kHz

Absolute, at carrier ± 1.2 MHz.

Average spectral power shall be

measured using a 100kHz resolu-

tion bandwidth. PAVDD connec-

ted to external 3.3V supply.

—

-24.2

-20

dBm/

100kHz

Note:

1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov-

ered in this datasheet can be found in the Max TX Power column of the Ordering Information Table.

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4.1.10.2 Sub-GHz RF Receiver Characteristics for 915 MHz Band

Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD.

RFVDD and PAVDD path is filtered using ferrites. Crystal frequency=38.4 MHz. RF center frequency 915 MHz.

Table 4.21. Sub-GHz RF Receiver Characteristics for 915 MHz Band

Parameter

Symbol

Test Condition

Min

902

—

Typ

—

Max

930

—

Unit

MHz

dBm

Tuning frequency range

F_RANGE

Max usable input level, 0.1% SAT_500K

BER

Desired is reference 500 kbps

GFSK signal⁴

10

Sensitivity

SENS

Desired is reference 4.8 kbps

—

-105.2

-126.2

-108.2

-100.7

—

dBm

OOK signal³, 20% PER, T ≤ 85 °C

Desired is reference 600 bps

GFSK signal⁶, 0.1% BER

Desired is reference 50 kbps

-104.2

GFSK signal⁵, 0.1% BER, T ≤ 85

°C

Desired is reference 100 kbps

GFSK signal¹, 0.1% BER, T ≤ 85

°C

—

-105.1

-98.2

-101.5

-93.2

dBm

Desired is reference 500 kbps

GFSK signal⁴, 0.1% BER, T ≤ 85

°C

Desired is reference 400 kbps

—

-95.2

-91

—

dBm

GFSK signal², 1% PER, T ≤ 85 °C

Desired is reference O-QPSK

-100.1

DSSS signal⁷, 1% PER, Payload

length is 20 octets

Level above which

RFSENSE_TRIG

CW at 915 MHz

—

-28.1

-50

—

dBm

RFSENSE will trigger⁸

Level below which

RFSENSE will not trigger⁸

RFSENSE_THRESCW at 915 MHz

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Desired is 4.8 kbps OOK signal³

at 3dB above sensitivity level,

20% PER

Adjacent channel selectivity, C/I₁

Interferer is CW at ± 1 ×

channel-spacing

—

48.1

—

dB

Desired is 600 bps GFSK signal⁶

at 3dB above sensitivity level,

0.1% BER

—

71.4

49.8

51.1

48.1

41.4

49.1

56.3

74.7

55.8

56.4

51.8

46.8

57.7

—

dB

Desired is 50 kbps GFSK signal⁵

at 3dB above sensitivity level,

0.1% BER

Desired is 100 kbps GFSK signal¹

at 3dB above sensitivity level,

0.1% BER

Desired is 500 kbps GFSK signal⁴

at 3dB above sensitivity level,

0.1% BER

Desired is 400 kbps 4GFSK sig-

nal²at 3dB above sensitivity level,

0.1% BER

Desired is reference O-QPSK

DSSS signal⁷at 3dB above sensi-

tivity level, 1% PER

Desired is 4.8 kbps OOK signal³

at 3dB above sensitivity level,

20% PER

Alternate channel selectivity, C/I₂

Interferer is CW at ± 2 ×

channel-spacing

Desired is 600 bps GFSK signal⁶

at 3dB above sensitivity level,

0.1% BER

Desired is 50 kbps GFSK signal⁵

at 3dB above sensitivity level,

0.1% BER

Desired is 100 kbps GFSK signal¹

at 3dB above sensitivity level,

0.1% BER

Desired is 500 kbps GFSK signal⁴

at 3dB above sensitivity level,

0.1% BER

Desired is 400 kbps 4GFSK sig-

nal²at 3dB above sensitivity level,

0.1% BER

Desired is reference O-QPSK

DSSS signal⁷at 3dB above sensi-

tivity level, 1% PER

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Desired is 4.8 kbps OOK signal³

at 3dB above sensitivity level,

20% PER

Image rejection, Interferer is C/I_IMAGE

CW at image frequency

—

48.4

—

dB

Desired is 50 kbps GFSK signal⁵

at 3dB above sensitivity level,

0.1% BER

—

54.9

49.1

47.9

42.8

48.9

—

dB

Desired is 100 kbps GFSK signal¹

at 3dB above sensitivity level,

0.1% BER

Desired is 500 kbps GFSK signal⁴

at 3dB above sensitivity level,

0.1% BER

Desired is 400 kbps 4GFSK sig-

nal²at 3dB above sensitivity level,

0.1% BER

Desired is reference O-QPSK

DSSS signal⁷at 3dB above sensi-

tivity level, 1% PER

Blocking selectivity, 0.1%

BER. Desired is 100 kbps

GFSK signal at 3dB above

sensitivity level

C/I_BLOCKER

Interferer CW at Desired ± 1 MHz

Interferer CW at Desired ± 2 MHz

—

58.7

62.5

76.4

—

dB

Interferer CW at Desired ± 10

MHz

Desired is 100 kbps GFSK signal¹

at 3dB above sensitivity level

Intermod selectivity, 0.1%

BER. CW interferers at 400

kHz and 800 kHz offsets

C/I_IM

—

45

—

5

dB

Upper limit of input power

range over which RSSI reso-

lution is maintained

RSSI_MAX

RSSI_MIN

RSSI_RES

dBm

Lower limit of input power

range over which RSSI reso-

lution is maintained

-98

—

RSSI resolution

Over RSSI_MINto RSSI_MAXrange

216-960 MHz

—

0.25

-55

—

dBm

Max spurious emissions dur- SPUR_{RX_FCC}

ing active receive mode, per

FCC Part 15.109(a)

-49.2

-41.2

Above 960 MHz

-47

Max spurious emissions dur- SPUR_{RX_ARIB}

ing active receive mode,per

ARIB STD-T108 Section 3.3

Below 710 MHz, RBW=100kHz

710-900 MHz, RBW=1MHz

900-915 MHz, RBW=100kHz

915-930 MHz, RBW=100kHz

930-1000 MHz, RBW=100kHz

Above 1000 MHz, RBW=1MHz

—

-60

-61

-60

-53

-54

-55

-54

-47

dBm

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

Parameter

Note:

Symbol

Test Condition

Min

Typ

Max

Unit

1. Definition of reference signal is 100 kbps 2GFSK, BT=0.5, Δf = 50 kHz, RX channel BW = 198.024 kHz, channel spacing = 400

kHz.

2. Definition of reference signal is 400 kbps 4GFSK, BT=0.5, inner deviation = 33.3 kHz, RX channel BW = 368.920 kHz, channel

spacing = 600 kHz.

3. Definition of reference signal is 4.8 kbps OOK, RX channel BW = 306.036 kHz, channel spacing = 500 kHz.

4. Definition of reference signal is 500 kbps 2GFSK, BT=0.5, Δf = 175 kHz, RX channel BW = 835.076 kHz, channel spacing = 1

MHz.

5. Definition of reference signal is 50 kbps 2GFSK, BT=0.5, Δf = 25 kHz, RX channel BW = 99.012 kHz, channel spacing = 200 kHz.

6. Definition of reference signal is 600 bps 2GFSK, BT=0.5, Δf = 0.3 kHz, RX channel BW = 1.2 kHz, channel spacing = 300 kHz.

7. Definition of reference signal is O-QPSK DSSS per 802.15.4, Frequency Range = 902-928 MHz, Data rate = 250 kbps, 16-chip

PN sequence mapping.

8. RFSENSE performance is only valid from 0 to 85 °C. RFSENSE should be disabled outside this temperature range.

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4.1.10.3 Sub-GHz RF Transmitter characteristics for 868 MHz Band

Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD.

RFVDD and PAVDD path is filtered using ferrites. Crystal frequency=38.4 MHz. RF center frequency 868 MHz.

Table 4.22. Sub-GHz RF Transmitter characteristics for 868 MHz Band

Parameter

Symbol

F_RANGE

Test Condition

Min

863

17.1

Typ

—

Max

876

Unit

MHz

dBm

RF tuning frequency range

Maximum TX Power¹

POUT_MAX

PAVDD connected directly to ex-

ternal 3.3V supply, 20 dBm output

power setting, T ≤ 85 °C

19.3

22.9

PAVDD connected to DC-DC out-

put, 14 dBm output power setting

11.4

13.7

16.5

dBm

Minimum active TX Power

Output power step size

POUT_MIN

—

-43.5

0.5

5

—

dBm

dB

POUT_STEP

POUT_{VAR_V}

output power > 0 dBm

Output power variation vs

supply at POUT_MAX

1.8 V < V_VREGVDD< 3.3 V,

PAVDD connected to external

supply, T = 25 °C

dB

1.8 V < V_VREGVDD< 3.3 V,

PAVDD connected to DC-DC out-

put, T = 25 °C

—

2

—

dB

Output power variation vs

temperature, peak to peak

POUT_{VAR_T}

-40 to +85 °C with PAVDD con-

nected to external supply

—

0.6

0.5

0.2

-35

0.9

1.2

0.6

0.8

-30

dB

-40 to +85 °C with PAVDD con-

nected to DC-DC output

Output power variation vs RF POUT_{VAR_F}

frequency

PAVDD connected to external

supply, T = 25 °C

dB

PAVDD connected to DC-DC out-

put, T = 25 °C

dB

Spurious emissions of har-

monics, Conducted meas-

urement, PAVDD connected

to DC-DC output, Test Fre-

quency = 868 MHz

SPUR_{HARM_ETSI}Per ETSI EN 300-220, Section

7.8.2.1

dBm

Spurious emissions out-of-

band, Conducted measure-

ment, PAVDD connected to

DC-DC output, Test Fre-

quency = 868 MHz

SPUR_{OOB_ETSI}Per ETSI EN 300-220, Section

7.8.2.1 (47-74 MHz, 87.5-118

MHz, 174-230 MHz, and 470-862

MHz)

—

-59

-54

dBm

Per ETSI EN 300-220, Section

7.8.2.1 (other frequencies below 1

GHz)

—

-42

-36

5.7

-36

-30

—

dBm

Per ETSI EN 300-220, Section

7.8.2.1 (frequencies above 1

GHz)

Error vector magnitude (off- EVM

set EVM), per 802.15.4-2015

Signal is DSSS-BPSK reference

packet. Modulated according to

802.15.4-2015 DSSS-BPSK in the

868MHz band, with pseudo-ran-

dom packet data content. PAVDD

connected to external 3.3V supply

%rms

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

Parameter

Note:

Symbol

Test Condition

Min

Typ

Max

Unit

1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov-

ered in this datasheet can be found in the Max TX Power column of the Ordering Information Table.

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4.1.10.4 Sub-GHz RF Receiver Characteristics for 868 MHz Band

Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD.

RFVDD and PAVDD path is filtered using ferrites. Crystal frequency=38.4 MHz. RF center frequency 868 MHz.

Table 4.23. Sub-GHz RF Receiver Characteristics for 868 MHz Band

Parameter

Symbol

Test Condition

Min

863

—

Typ

—

Max

876

—

Unit

MHz

dBm

Tuning frequency range

F_RANGE

Max usable input level, 0.1% SAT_2k4

BER

Desired is reference 2.4 kbps

GFSK signal¹

10

Max usable input level, 0.1% SAT_38k4

BER

Desired is reference 38.4 kbps

GFSK signal²

—

10

—

dBm

Sensitivity

SENS

Desired is reference 2.4 kbps

GFSK signal¹, 0.1% BER

-120.6

-109.5

Desired is reference 38.4 kbps

-105.4

GFSK signal², 0.1% BER, T ≤ 85

°C

Desired is reference 500 kbps

GFSK signal³, 0.1% BER

—

-96.4

-110.6

-28.1

-50

—

dBm

dB

Desired is reference BPSK sig-

nal⁴, 1% PER

Level above which

RFSENSE_TRIG

CW at 868 MHz

—

RFSENSE will trigger⁵

Level below which

RFSENSE will not trigger⁵

RFSENSE_THRESCW at 868 MHz

—

Desired is 2.4 kbps GFSK signal¹

at 3dB above sensitivity level,

0.1% BER

Adjacent channel selectivity, C/I₁

Interferer is CW at ± 1 ×

channel-spacing

44.5

56.9

Desired is 38.4kbps GFSK signal²

at 3dB above sensitivity level,

0.1% BER

35.4

—

43

—

dB

Desired is 2.4kbps GFSK signal¹

at 3dB above sensitivity level,

0.1% BER

Alternate channel selectivity, C/I₂

Interferer is CW at ± 2 ×

channel-spacing

56.8

48.2

50.2

48.7

Desired is 38.4kbps GFSK signal²

at 3dB above sensitivity level,

0.1% BER

—

Desired is 2.4kbps GFSK signal¹

at 3dB above sensitivity level,

0.1% BER

Image rejection, Interferer is C/I_IMAGE

CW at image frequency

—

Desired is 38.4kbps GFSK signal²

at 3dB above sensitivity level,

0.1% BER

—

Blocking selectivity, 0.1%

BER. Desired is 2.4 kbps

GFSK signal¹at 3 dB above

sensitivity level

C/I_BLOCKER

Interferer CW at Desired ± 1 MHz

Interferer CW at Desired ± 2 MHz

—

72.1

77.5

90.4

—

dB

Interferer CW at Desired ± 10

MHz

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Upper limit of input power

range over which RSSI reso-

lution is maintained

RSSI_MAX

—

5

dBm

Lower limit of input power

range over which RSSI reso-

lution is maintained

RSSI_MIN

-98

—

dBm

RSSI resolution

RSSI_RES

Over RSSI_MINto RSSI_MAXrange

30 MHz to 1 GHz

—

0.25

-63

—

dBm

Max spurious emissions dur- SPUR_RX

ing active receive mode

-57

-47

1 GHz to 12 GHz

-53

Note:

1. Definition of reference signal is 2.4 kbps 2GFSK, BT=0.5, Δf = 1.2 kHz, RX channel BW = 4.797 kHz, channel spacing = 12.5

kHz.

2. Definition of reference signal is 38.4 kbps 2GFSK, BT=0.5, Δf = 20 kHz, RX channel BW = 74.809 kHz, channel spacing = 100

kHz.

3. Definition of reference signal is 500 kbps 2GFSK, BT=0.5, Δf = 125 kHz, RX channel BW = 753.320 kHz.

4. Definition of reference signal is 20 kbps BPSK

5. RFSENSE performance is only valid from 0 to 85 °C. RFSENSE should be disabled outside this temperature range.

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4.1.10.5 Sub-GHz RF Transmitter characteristics for 490 MHz Band

Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD.

RFVDD and PAVDD path is filtered using ferrites. Crystal frequency=38.4 MHz. RF center frequency 490 MHz.

Table 4.24. Sub-GHz RF Transmitter characteristics for 490 MHz Band

Parameter

Symbol

F_RANGE

Test Condition

Min

470

18.1

Typ

—

Max

510

Unit

MHz

dBm

RF tuning frequency range

Maximum TX Power¹

POUT_MAX

PAVDD connected directly to ex-

ternal 3.3V supply

20.3

23.7

Minimum active TX Power

Output power step size

POUT_MIN

-44.9

0.5

—

dBm

dB

POUT_STEP

POUT_{VAR_V}

output power > 0 dBm

—

Output power variation vs

supply, peak to peak

at 20 dBm;1.8 V < V_VREGVDD

3.3 V, PAVDD connected directly

to external supply, T = 25 °C

<

4.3

dB

Output power variation vs

temperature, peak to peak

POUT_{VAR_T}

-40 to +85 °C at 20 dBm

—

0.2

-40

0.9

0.4

-36

dB

Output power variation vs RF POUT_{VAR_F}

frequency

T = 25 °C

Harmonic emissions, 20

dBm output power setting,

490 MHz

SPUR_{HARM_CN}Per China SRW Requirement,

Section 2.1, frequencies below

1GHz

dBm

Per China SRW Requirement,

Section 2.1, frequencies above

1GHz

—

-36

-54

-30

—

dBm

Spurious emissions, 20 dBm SPUR_{OOB_CN}

Per China SRW Requirement,

Section 3 (48.5-72.5MHz,

output power setting, 490

MHz

76-108MHz, 167-223MHz,

470-556MHz, and 606-798MHz)

Per China SRW Requirement,

Section 2.1 (other frequencies be-

low 1GHz)

—

-42

-36

—

dBm

Per China SRW Requirement,

Section 2.1 (frequencies above

1GHz)

Note:

1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov-

ered in this datasheet can be found in the Max TX Power column of the Ordering Information Table.

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4.1.10.6 Sub-GHz RF Receiver Characteristics for 490 MHz Band

Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD.

RFVDD and PAVDD path is filtered using ferrites. Crystal frequency=38.4 MHz. RF center frequency 490 MHz.

Table 4.25. Sub-GHz RF Receiver Characteristics for 490 MHz Band

Parameter

Symbol

Test Condition

Min

470

—

Typ

—

Max

510

—

Unit

dBm

Tuning frequency range

F_RANGE

Max usable input level, 0.1% SAT_2k4

BER

Desired is reference 2.4 kbps

GFSK signal³

10

Max usable input level, 0.1% SAT_38k4

BER

Desired is reference 38.4 kbps

GFSK signal⁴

—

10

—

dBm

Sensitivity

SENS

Desired is reference 2.4 kbps

GFSK signal³, 0.1% BER

-122.2

-111.4

Desired is reference 38.4 kbps

-108.9

GFSK signal⁴, 0.1% BER, T ≤ 85

°C

Desired is reference 10 kbps

GFSK signal², 0.1% BER, T ≤ 85

°C

—

-116.8

-107.3

-113.9

-104.7

dBm

Desired is reference 100 kbps

GFSK signal¹, 0.1% BER, T ≤ 85

°C

Level above which

RFSENSE_TRIG

Desired is reference 100 kbps

GFSK signal¹, 0.1% BER

—

48

-28.1

-50

—

dBm

dB

RFSENSE will trigger⁵

Level below which

RFSENSE will not trigger⁵

RFSENSE_THRESCW at 490 MHz

Desired is 2.4 kbps GFSK signal³

at 3dB above sensitivity level,

0.1% BER

Adjacent channel selectivity, C/I₁

Interferer is CW at ± 1 ×

channel-spacing

60.3

Desired is 38.4kbps GFSK signal⁴

at 3dB above sensitivity level,

0.1% BER

38.3

—

45.6

60.4

52.6

56.5

54.1

—

dB

Desired is 2.4kbps GFSK signal³

at 3dB above sensitivity level,

0.1% BER

Alternate channel selectivity, C/I₂

Interferer is CW at ± 2 ×

channel-spacing

Desired is 38.4kbps GFSK signal⁴

at 3dB above sensitivity level,

0.1% BER

—

Desired is 2.4kbps GFSK signal³

at 3dB above sensitivity level,

0.1% BER

Image rejection, Interferer is C/I_IMAGE

CW at image frequency

—

Desired is 38.4kbps GFSK signal⁴

at 3dB above sensitivity level,

0.1% BER

—

Blocking selectivity, 0.1%

BER. Desired is 2.4 kbps

GFSK signal³at 3 dB above

sensitivity level

C/I_BLOCKER

Interferer CW at Desired ± 1 MHz

Interferer CW at Desired ± 2 MHz

—

73.9

75.4

90.2

—

dB

Interferer CW at Desired ± 10

MHz

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Upper limit of input power

range over which RSSI reso-

lution is maintained

RSSI_MAX

—

5

dBm

Lower limit of input power

range over which RSSI reso-

lution is maintained

RSSI_MIN

-98

—

dBm

RSSI resolution

RSSI_RES

Over RSSI_MINto RSSI_MAXrange

30 MHz to 1 GHz

—

0.25

-53

—

dBm

Max spurious emissions dur- SPUR_RX

ing active receive mode

-47

1 GHz to 12 GHz

-53

Note:

1. Definition of reference signal is 100 kbps 2GFSK, BT=0.5, Δf = 50 kHz, RX channel BW = 198.024 kHz.

2. Definition of reference signal is 10 kbps 2GFSK, BT=0.5, Δf = 5 kHz, RX channel BW = 20.038 kHz.

3. Definition of reference signal is 2.4 kbps 2GFSK, BT=0.5, Δf = 1.2 kHz, RX channel BW = 4.798 kHz, channel spacing = 12.5

kHz.

4. Definition of reference signal is 38.4 kbps 2GFSK, BT=0.5, Δf = 20 kHz, RX channel BW = 74.809 kHz, channel spacing = 100

kHz.

5. RFSENSE performance is only valid from 0 to 85 °C. RFSENSE should be disabled outside this temperature range.

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4.1.10.7 Sub-GHz RF Transmitter characteristics for 433 MHz Band

Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD.

RFVDD and PAVDD path is filtered using ferrites. Crystal frequency=38.4 MHz. RF center frequency 433 MHz.

Table 4.26. Sub-GHz RF Transmitter characteristics for 433 MHz Band

Parameter

Symbol

F_RANGE

Test Condition

Min

426

12.5

Typ

—

Max

445

Unit

MHz

dBm

RF tuning frequency range

Maximum TX Power¹

POUT_MAX

PAVDD connected to DCDC out-

put, 14dBm output power

15.1

17.4

PAVDD connected to DCDC out-

put, 10dBm output power

8.3

10.6

13.3

dBm

Minimum active TX Power

Output power step size

POUT_MIN

—

-42

0.5

1.7

—

dBm

dB

POUT_STEP

POUT_{VAR_V}

output power > 0 dBm

Output power variation vs

supply, peak to peak, Pout =

10dBm

At 10 dBm;1.8 V < V_VREGVDD

3.3 V, PAVDD = DC-DC output, T

= 25 °C

<

dB

Output power variation vs

temperature, peak to peak,

Pout= 10dBm

POUT_{VAR_T}

-40 to +85C at 10dBm

—

0.5

1.2

dB

Output power variation vs RF POUT_{VAR_F}

frequency, Pout = 10dBm

T = 25 °C

—

0.1

-47

-26

0.2

-42

-20

dB

Spurious emissions of har-

monics FCC, Conducted

measurement, 14dBm

match, PAVDD connected to

DCDC output, Test Frequen-

cy = 434 MHz

SPUR_{HARM_FCC}In restricted bands, per FCC Part

15.205 / 15.209

dBm

dBc

In non-restricted bands, per FCC

Part 15.231

Spurious emissions out-of-

band FCC, Conducted

measurement, 14dBm

match, PAVDD connected to

DCDC output, Test Frequen-

cy = 434 MHz

SPUR_{OOB_FCC}

In non-restricted bands, per FCC

Part 15.231

—

-26

-52

-61

-58

-20

-46

-56

-52

dBc

dBm

In restricted bands (30-88 MHz),

per FCC Part 15.205 / 15.209

In restricted bands (88-216 MHz),

per FCC Part 15.205 / 15.209

In restricted bands (216-960

MHz), per FCC Part 15.205 /

15.209

In restricted bands (>960 MHz),

per FCC Part 15.205 / 15.209

—

-47

-42

-36

-42

-36

-30

dBm

Spurious emissions of har-

monics ETSI, Conducted

measurement, 14dBm

match, PAVDD connected to

DCDC output, Test Frequen-

cy = 434 MHz

SPUR_{HARM_ETSI}Per ETSI EN 300-220, Section

7.8.2.1 (frequencies below 1Ghz)

Per ETSI EN 300-220, Section

7.8.2.1 (frequencies above 1Ghz)

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Spurious emissions out-of-

band ETSI, Conducted

measurement, 14dBm

match, PAVDD connected to

DCDC output, Test Frequen-

cy = 434 MHz

SPUR_{OOB_ETSI}Per ETSI EN 300-220, Section

7.8.2.1 (47-74 MHz, 87.5-118

MHz, 174-230 MHz, and 470-862

MHz)

—

-60

-54

dBm

Per ETSI EN 300-220, Section

7.8.2.1 (other frequencies below 1

GHz)

—

-42

-36

-30

dBm

Per ETSI EN 300-220, Section

7.8.2.1 (frequencies above 1

GHz)

Note:

1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov-

ered in this datasheet can be found in the Max TX Power column of the Ordering Information Table.

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4.1.10.8 Sub-GHz RF Receiver Characteristics for 433 MHz Band

Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD.

RFVDD and PAVDD path is filtered using ferrites. Crystal frequency=38.4 MHz. RF center frequency 433 MHz.

Table 4.27. Sub-GHz RF Receiver Characteristics for 433 MHz Band

Parameter

Symbol

Test Condition

Min

426

—

Typ

—

Max

445

—

Unit

MHz

dBm

Tuning frequency range

F_RANGE

Max usable input level, 0.1% SAT_2k4

BER

Desired is reference 2.4 kbps

GFSK signal²

10

Max usable input level, 0.1% SAT_50k

BER

Desired is reference 50 kbps

GFSK signal⁴

—

10

—

dBm

Sensitivity

SENS

Desired is reference 4.8 kbps

OOK signal³, 20% PER

-107.4

-107.3

Desired is reference 100 kbps

-105

GFSK signal¹, 0.1% BER, T ≤ 85

°C

Desired is reference 50 kbps

—

-110.3

-107.2

dBm

GFSK signal⁴, 0.1% BER, T ≤ 85

°C

Desired is reference 2.4 kbps

GFSK signal², 0.1% BER

—

-123.1

-112.6

-28.1

-50

—

-109

—

dBm

dB

Desired is reference 9.6 kbps

GFSK signal⁵, 1% PER, T ≤ 85 °C

Level above which

RFSENSE_TRIG

CW at 433 MHz

RFSENSE will trigger⁶

Level below which

RFSENSE will not trigger⁶

RFSENSE_THRESCW at 433 MHz

—

Desired is 4.8 kbps OOK signal³

at 3dB above sensitivity level,

20% PER

Adjacent channel selectivity, C/I₁

Interferer is CW at ± 1 ×

channel-spacing

51.6

—

Desired is 100 kbps GFSK signal¹

at 3dB above sensitivity level,

0.1% BER

35

47

44.1

61.5

53.1

35.7

—

dB

Desired is 2.4 kbps GFSK signal²

at 3dB above sensitivity level,

0.1% BER

Desired is 50 kbps GFSK signal⁴

at 3dB above sensitivity level,

0.1% BER

45.6

—

Desired is 9.6 kbps 4GFSK sig-

nal⁵at 3dB above sensitivity level,

1% PER

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Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Desired is 4.8 kbps OOK signal³

at 3dB above sensitivity level,

20% PER

Alternate channel selectivity, C/I₂

Interferer is CW at ± 2 ×

channel-spacing

—

57.8

—

dB

Desired is 100 kbps GFSK signal¹

at 3dB above sensitivity level,

0.1% BER

—

54.6

62.4

58.1

50.6

46.5

51.7

57.5

54.4

48

—

dB

Desired is 2.4 kbps GFSK signal²

at 3dB above sensitivity level,

0.1% BER

Desired is 50 kbps GFSK signal⁴

at 3dB above sensitivity level,

0.1% BER

Desired is 9.6 kbps 4GFSK sig-

nal⁵at 3dB above sensitivity level,

1% PER

Desired is 4.8 kbps OOK signal³

at 3dB above sensitivity level,

20% PER

Image rejection, Interferer is C/I_IMAGE

CW at image frequency

Desired is 100 kbps GFSK signal¹

at 3dB above sensitivity level,

0.1% BER

Desired is 2.4 kbps GFSK signal²

at 3dB above sensitivity level,

0.1% BER

Desired is 50 kbps GFSK signal⁴

at 3dB above sensitivity level,

0.1% BER

Desired is 9.6 kbps 4GFSK sig-

nal⁵at 3dB above sensitivity level,

1% PER

Blocking selectivity, 0.1%

BER. Desired is 2.4 kbps

GFSK signal²at 3dB above

sensitivity level

C/I_BLOCKER

Interferer CW at Desired ± 1 MHz

Interferer CW at Desired ± 2 MHz

—

75.7

77.2

92

—

dB

Interferer CW at Desired ± 10

MHz

Desired is 2.4 kbps GFSK signal²

at 3dB above sensitivity level

Intermod selectivity, 0.1%

BER. CW interferers at 12.5

kHz and 25 kHz offsets

C/I_IM

—

58.8

—

5

dB

Upper limit of input power

range over which RSSI reso-

lution is maintained

RSSI_MAX

RSSI_MIN

RSSI_RES

dBm

Lower limit of input power

range over which RSSI reso-

lution is maintained

-98

—

RSSI resolution

Over RSSI_MINto RSSI_MAXrange

216-960 MHz

—

0.25

-55

—

dBm

Max spurious emissions dur- SPUR_{RX_FCC}

ing active receive mode, per

FCC Part 15.109(a)

-49

-41

Above 960 MHz

-47

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Parameter

Symbol

Test Condition

Below 1000 MHz

Above 1000 MHz

Min

—

Typ

-63

-53

Max

-57

Unit

dBm

Max spurious emissions dur- SPUR_{RX_ETSI}

ing active receive mode, per

ETSI 300-220 Section 8.6

—

-47

Max spurious emissions dur- SPUR_{RX_ARIB}

ing active receive mode, per

ARIB STD T67 Section

Below 710 MHz, RBW=100kHz

—

-60

-54

dBm

3.3(5)

Note:

1. Definition of reference signal is 100 kbps 2GFSK, BT=0.5, Δf = 50 kHz, RX channel BW = 198.024 kHz, channel spacing = 200

kHz.

2. Definition of reference signal is 2.4 kbps 2GFSK, BT=0.5, Δf = 1.2 kHz, RX channel BW = 4.798 kHz, channel spacing = 12.5

kHz.

3. Definition of reference signal is 4.8 kbps OOK, RX channel BW = 306.036 kHz, channel spacing = 500 kHz.

4. Definition of reference signal is 50 kbps 2GFSK, BT=0.5, Δf = 25 kHz, RX channel BW = 99.012 kHz, channel spacing = 200 kHz.

5. Definition of reference signal is 9.6 kbps 4GFSK, BT=0.5, inner deviation = 0.8 kHz, RX channel BW = 8.5 kHz, channel spacing

= 12.5 kHz.

6. RFSENSE performance is only valid from 0 to 85 °C. RFSENSE should be disabled outside this temperature range.

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4.1.10.9 Sub-GHz RF Transmitter characteristics for 315 MHz Band

Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD.

RFVDD and PAVDD path is filtered using ferrites. Crystal frequency=38.4 MHz. RF center frequency 315 MHz.

Table 4.28. Sub-GHz RF Transmitter characteristics for 315 MHz Band

Parameter

Symbol

F_RANGE

Test Condition

Min

195

13.8

Typ

—

Max

358

Unit

MHz

dBm

RF tuning frequency range

Maximum TX Power¹

POUT_MAX

PAVDD connected to DC-DC out-

put, T ≤ 85 °C

17.2

21.1

Minimum active TX Power

Output power step size

POUT_MIN

-43.9

0.5

—

dBm

dB

POUT_STEP

POUT_{VAR_V}

output power > 0 dBm

—

Output power variation vs

supply

1.8 V < V_VREGVDD< 3.3 V,

PAVDD = DC-DC output, T = 25

°C

1.8

dB

Output power variation vs

temperature

POUT_{VAR_T}

-40 to +85C

—

0.5

0.1

-47

-26

1.2

0.7

-42

-20

dB

Output power variation vs RF POUT_{VAR_F}

frequency

T = 25 °C

Spurious emissions of har-

monics at 14 dBm output

power, Conducted measure-

ment, 14dBm match, PAVDD

connected to DC-DC output,

Test Frequency = 303 MHz

SPUR_{HARM_FCC}In restricted bands, per FCC Part

15.205 / 15.209

dBm

dBc

In non-restricted bands, per FCC

Part 15.231

Spurious emissions out-of-

band at 14 dBm output pow-

er, Conducted measurement,

14dBm match, PAVDD con-

nected to DC-DC output,

SPUR_{OOB_FCC}

In non-restricted bands, per FCC

Part 15.231

—

-26

-52

-61

-58

-20

-46

-56

-52

dBc

dBm

In restricted bands (30-88 MHz),

per FCC Part 15.205 / 15.209

Test Frequency = 303 MHz

In restricted bands (88-216 MHz),

per FCC Part 15.205 / 15.209

In restricted bands (216-960

MHz), per FCC Part 15.205 /

15.209

In restricted bands (>960 MHz),

per FCC Part 15.205 / 15.209

—

-47

-42

dBm

Note:

1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov-

ered in this datasheet can be found in the Max TX Power column of the Ordering Information Table.

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4.1.10.10 Sub-GHz RF Receiver Characteristics for 315 MHz Band

Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD.

RFVDD and PAVDD path is filtered using ferrites. Crystal frequency=38.4 MHz. RF center frequency 315 MHz.

Table 4.29. Sub-GHz RF Receiver Characteristics for 315 MHz Band

Parameter

Symbol

Test Condition

Min

195

—

Typ

—

Max

358

—

Unit

dBm

Tuning frequency range

F_RANGE

Max usable input level, 0.1% SAT_2k4

BER

Desired is reference 2.4 kbps

GFSK signal¹

10

Max usable input level, 0.1% SAT_38k4

BER

Desired is reference 38.4 kbps

GFSK signal²

—

10

—

dBm

Sensitivity

SENS

Desired is reference 2.4 kbps

-123.2

-120.7

GFSK signal¹, 0.1% BER, T ≤ 85

°C

Desired is reference 38.4 kbps

GFSK signal², 0.1% BER, T ≤ 85

°C

—

-111.4

-98.8

-108.6

-95.5

dBm

Desired is reference 500 kbps

GFSK signal³, 0.1% BER, T ≤ 85

°C

Level above which

RFSENSE_TRIG

CW at 315 MHz

—

-28.1

-50

—

dBm

dB

RFSENSE will trigger⁴

Level below which

RFSENSE will not trigger⁴

RFSENSE_THRESCW at 315 MHz

Desired is 2.4 kbps GFSK signal¹

at 3dB above sensitivity level,

0.1% BER

Adjacent channel selectivity, C/I₁

Interferer is CW at ± 1 ×

channel-spacing

54.1

63.6

Desired is 38.4kbps GFSK signal²

at 3dB above sensitivity level,

0.1% BER

—

49.9

64.2

56.2

—

dB

Desired is 2.4kbps GFSK signal¹

at 3dB above sensitivity level,

0.1% BER

Alternate channel selectivity, C/I₂

Interferer is CW at ± 2 ×

channel-spacing

Desired is 38.4kbps GFSK signal²

at 3dB above sensitivity level²,

0.1% BER

Desired is 2.4kbps GFSK signal¹

at 3dB above sensitivity level,

0.1% BER

Image rejection, Interferer is C/I_IMAGE

CW at image frequency

—

53

—

dB

Desired is 38.4kbps GFSK signal²

at 3dB above sensitivity level,

0.1% BER

51.4

Blocking selectivity, 0.1%

BER. Desired is 2.4 kbps

GFSK signal¹at 3 dB above

sensitivity level

C/I_BLOCKER

Interferer CW at Desired ± 1 MHz

Interferer CW at Desired ± 2 MHz

—

75

—

dB

76.5

91.9

Interferer CW at Desired ± 10

MHz

72.6

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Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Upper limit of input power

range over which RSSI reso-

lution is maintained

RSSI_MAX

—

5

dBm

Lower limit of input power

range over which RSSI reso-

lution is maintained

RSSI_MIN

-98

—

dBm

RSSI resolution

RSSI_RES

Over RSSI_MINto RSSI_MAXrange

216-960 MHz

—

0.25

-63

—

dBm

Max spurious emissions dur- SPUR_{RX_FCC}

ing active receive mode, per

FCC Part 15.109(a)

-57

-47

Above 960MHz

-53

Note:

1. Definition of reference signal is 2.4 kbps 2GFSK, BT=0.5, Δf = 1.2 kHz, RX channel BW = 4.798 kHz, channel spacing = 12.5

kHz.

2. Definition of reference signal is 38.4 kbps 2GFSK, BT=0.5, Δf = 20 kHz, RX channel BW = 74.809 kHz, channel spacing = 100

kHz.

3. Definition of reference signal is 500 kbps 2GFSK, BT=0.5, Δf = 125 kHz, RX channel BW = 753.320 kHz.

4. RFSENSE performance is only valid from 0 to 85 °C. RFSENSE should be disabled outside this temperature range.

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Electrical Specifications

4.1.10.11 Sub-GHz RF Transmitter Characteristics for 169 MHz Band

Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD.

RFVDD and PAVDD path is filtered using ferrites. Crystal frequency=38.4 MHz. RF center frequency 169 MHz.

Table 4.30. Sub-GHz RF Transmitter Characteristics for 169 MHz Band

Parameter

Symbol

F_RANGE

Test Condition

Min

169

18.1

Typ

—

Max

170

Unit

MHz

dBm

RF tuning frequency range

Maximum TX Power¹

POUT_MAX

PAVDD connected to external 3.3

V supply

19.7

22.4

Minimum active TX Power

Output power step size

POUT_MIN

-42.6

0.5

—

dBm

dB

POUT_STEP

POUT_{VAR_V}

output power > 0 dBm

—

Output power variation vs

supply, peak to peak

1.8 V < V_VREGVDD< 3.3 V,

PAVDD connected to external

supply, T = 25 °C

4.8

5.0

dB

Output power variation vs

temperature, peak to peak

POUT_{VAR_T}

-40 to +85 °C at 20 dBm

—

0.6

-42

1.2

—

dB

Spurious emissions of har-

monics, Conducted meas-

urement, PAVDD = 3.3V,

Test Frequency = 169 MHz

SPUR_{HARM_ETSI}Per ETSI EN 300-220, Section

7.8.2.1 (47-74 MHz, 87.5-118

MHz, 174-230 MHz, and 470-862

MHz)

dBm

Per ETSI EN 300-220, Section

7.8.2.1 (other frequencies below 1

GHz)²

—

-38

-36

-42

—

dBm

Per ETSI EN 300-220, Section

7.8.2.1 (frequencies above 1

GHz)²

Spurious emissions out-of-

band, Conducted measure-

ment, PAVDD = 3.3V, Test

Frequency = 169 MHz

SPUR_{OOB_ETSI}Per ETSI EN 300-220, Section

7.8.2.1 (47-74 MHz, 87.5-118

MHz, 174-230 MHz, and 470-862

MHz)

-36

Per ETSI EN 300-220, Section

7.8.2.1 (other frequencies below 1

GHz)

—

-42

-36

-30

dBm

Per ETSI EN 300-220, Section

7.8.2.1 (frequencies above 1

GHz)

Note:

1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov-

ered in this datasheet can be found in the Max TX Power column of the Ordering Information Table.

2. Typical value marginally passes specification. Additional margin can be obtained by increasing the order of the harmonic filter.

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Electrical Specifications

4.1.10.12 Sub-GHz RF Receiver Characteristics for 169 MHz Band

Unless otherwise indicated, typical conditions are: T = 25 °C, VREGVDD = AVDD = IOVDD = 3.3 V, DVDD = RFVDD = PAVDD.

RFVDD and PAVDD path is filtered using ferrites. Crystal frequency=38.4 MHz. RF center frequency 169 MHz.

Table 4.31. Sub-GHz RF Receiver Characteristics for 169 MHz Band

Parameter

Symbol

Test Condition

Min

169

—

Typ

—

Max

170

—

Unit

dBm

Tuning frequency range

F_RANGE

Max usable input level, 0.1% SAT_2k4

BER

Desired is reference 2.4 kbps

GFSK signal¹

10

Max usable input level, 0.1% SAT_38k4

BER

Desired is reference 38.4 kbps

GFSK signal²

—

10

—

dBm

Sensitivity

SENS

Desired is reference 2.4 kbps

GFSK signal¹, 0.1% BER

-124

Desired is reference 38.4 kbps

-112.2

-108

GFSK signal², 0.1% BER, T ≤ 85

°C

Desired is reference 500 kbps

—

-99.2

-96

dBm

GFSK signal³, 0.1% BER, T ≤ 85

°C

Level above which

RFSENSE_TRIG

CW at 169 MHz

—

-28.1

-50

—

dBm

dB

RFSENSE will trigger⁴

Level below which

RFSENSE will not trigger⁴

RFSENSE_THRESCW at 169 MHz

Desired is 2.4 kbps GFSK signal¹

at 3dB above sensitivity level,

0.1% BER

Adjacent channel selectivity, C/I₁

Interferer is CW at ± 1 x

channel-spacing

64.8

Desired is 38.4kbps GFSK signal¹

at 3dB above sensitivity level,

0.1% BER

43.3

—

51.4

67.4

60.6

47.1

—

dB

Desired is 2.4kbps GFSK signal¹

at 3dB above sensitivity level,

0.1% BER

Alternate channel selectivity, C/I₂

Interferer is CW at ± 2 x

channel-spacing

Desired is 38.4kbps GFSK signal²

at 3dB above sensitivity level,

0.1% BER

—

Desired is 2.4kbps GFSK signal¹

at 3dB above sensitivity level,

0.1% BER

Image rejection, Interferer is C/I_IMAGE

CW at image frequency

—

Desired is 38.4kbps GFSK signal²

at 3dB above sensitivity level,

0.1% BER

—

Blocking selectivity, 0.1%

BER. Desired is 2.4 kbps

GFSK signal¹at 3 dB above

sensitivity level

C/I_BLOCKER

Interferer CW at Desired ± 1 MHz

Interferer CW at Desired ± 2 MHz

—

80

73.4

75

—

dB

Interferer CW at Desired ± 10

MHz

90.1

Upper limit of input power

range over which RSSI reso-

lution is maintained

RSSI_MAX

—

5

dBm

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Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Lower limit of input power

range over which RSSI reso-

lution is maintained

RSSI_MIN

-98

—

dBm

RSSI resolution

RSSI_RES

Over RSSI_MINto RSSI_MAXrange

30 MHz to 1 GHz

—

0.25

-63

—

dBm

Max spurious emissions dur- SPUR_RX

ing active receive mode

-57

-47

1 GHz to 12 GHz

-53

Note:

1. Definition of reference signal is 2.4 kbps 2GFSK, BT=0.5, Δf = 1.2 kHz, RX channel BW = 4.798 kHz, channel spacing = 12.5

kHz.

2. Definition of reference signal is 38.4 kbps 2GFSK, BT=0.5, Δf = 20 kHz, RX channel BW = 74.809 kHz, channel spacing = 100

kHz.

3. Definition of reference signal is 500 kbps 2GFSK, BT=0.5, Δf = 125 kHz, RX channel BW = 753.320 kHz.

4. RFSENSE performance is only valid from 0 to 85 °C. RFSENSE should be disabled outside this temperature range.

4.1.11 Modem

Table 4.32. Modem

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Receive bandwidth

BW_RX

Configurable range with 38.4 MHz

crystal

0.1

—

2530

kHz

IF frequency

f_IF

Configurable range with 38.4 MHz

crystal. Selected steps available.

150

—

1371

kHz

DSSS symbol length

DSSS bits per symbol

SL_DSSS

Configurable in steps of 1 chip

Configurable

2

1

—

32

4

chips

BPS_DSSS

bits/

symbol

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Electrical Specifications

4.1.12 Oscillators

4.1.12.1 Low-Frequency Crystal Oscillator (LFXO)

Table 4.33. Low-Frequency Crystal Oscillator (LFXO)

Parameter

Symbol

Test Condition

Min

—

Typ

32.768

—

Max

—

Unit

kHz

kΩ

Crystal frequency

f_LFXO

Supported crystal equivalent ESR_LFXO

series resistance (ESR)

—

70

Supported range of crystal

load capacitance ¹

C_{LFXO_CL}

6

8

—

18

40

pF

On-chip tuning cap range ²

C_{LFXO_T}

On each of LFXTAL_N and

LFXTAL_P pins

On-chip tuning cap step size SS_LFXO

—

0.25

273

—

pF

nA

Current consumption after

startup ³

I_LFXO

ESR = 70 kOhm, C_L= 7 pF,

GAIN⁴= 2, AGC⁴= 1

Start- up time

t_LFXO

ESR = 70 kOhm, C_L= 7 pF,

GAIN⁴= 2

—

308

—

ms

Note:

1. Total load capacitance as seen by the crystal.

2. The effective load capacitance seen by the crystal will be C_{LFXO_T}/2. This is because each XTAL pin has a tuning cap and the

two caps will be seen in series by the crystal.

3. Block is supplied by AVDD if ANASW = 0, or DVDD if ANASW=1 in EMU_PWRCTRL register.

4. In CMU_LFXOCTRL register.

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4.1.12.2 High-Frequency Crystal Oscillator (HFXO)

Table 4.34. High-Frequency Crystal Oscillator (HFXO)

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Crystal frequency

f_HFXO

38.4 MHz required for radio trans-

ciever operation

38

38.4

40

MHz

Supported crystal equivalent ESR_{HFXO_38M4}Crystal frequency 38.4 MHz

series resistance (ESR)

—

6

—

60

12

Ω

Supported range of crystal

load capacitance ¹

C_{HFXO_CL}

pF

On-chip tuning cap range ²

C_{HFXO_T}

SS_HFXO

t_HFXO

On each of HFXTAL_N and

HFXTAL_P pins

9

20

0.04

300

—

25

—

40

pF

On-chip tuning capacitance

step

—

Startup time

38.4 MHz, ESR = 50 Ohm, C_L=

10 pF

—

µs

Frequency tolerance for the FT_HFXO

crystal

38.4 MHz, ESR = 50 Ohm, C_L=

10 pF

-40

ppm

Note:

1. Total load capacitance as seen by the crystal.

2. The effective load capacitance seen by the crystal will be C_{HFXO_T}/2. This is because each XTAL pin has a tuning cap and the

two caps will be seen in series by the crystal.

4.1.12.3 Low-Frequency RC Oscillator (LFRCO)

Table 4.35. Low-Frequency RC Oscillator (LFRCO)

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

ENVREF²= 1

Oscillation frequency

f_LFRCO

31.3

32.768

33.6

kHz

ENVREF²= 1, T > 85 °C

ENVREF²= 0

31.6

31.3

30.0

—

32.768

500

36.8

33.4

—

kHz

µs

ENVREF²= 0, T > 85 °C

Startup time

t_LFRCO

I_LFRCO

Current consumption ¹

ENVREF = 1 in

CMU_LFRCOCTRL

—

370

—

nA

ENVREF = 0 in

—

520

—

nA

CMU_LFRCOCTRL

Note:

1. Block is supplied by AVDD if ANASW = 0, or DVDD if ANASW=1 in EMU_PWRCTRL register.

2. In CMU_LFRCOCTRL register.

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4.1.12.4 High-Frequency RC Oscillator (HFRCO)

Table 4.36. High-Frequency RC Oscillator (HFRCO)

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Frequency accuracy

f_{HFRCO_ACC}

At production calibrated frequen-

cies, across supply voltage and

temperature

-2.5

—

2.5

%

Start-up time

t_HFRCO

f_HFRCO≥ 19 MHz

4 < f_HFRCO< 19 MHz

f_HFRCO≤ 4 MHz

f_HFRCO= 38 MHz

f_HFRCO= 32 MHz

f_HFRCO= 26 MHz

f_HFRCO= 19 MHz

f_HFRCO= 16 MHz

f_HFRCO= 13 MHz

f_HFRCO= 7 MHz

f_HFRCO= 4 MHz

f_HFRCO= 2 MHz

f_HFRCO= 1 MHz

—

300

1

—

ns

µs

2.5

244

204

173

143

123

110

85

—

µs

Current consumption on all

supplies

I_HFRCO

265

222

188

156

136

124

94

µA

%

32

37

28

34

26

31

Coarse trim step size (% of

period)

SS_{HFRCO_COARS}

0.8

—

E

Fine trim step size (% of pe- SS_{HFRCO_FINE}

riod)

—

0.1

0.2

—

%

Period jitter

PJ_HFRCO

% RMS

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Electrical Specifications

4.1.12.5 Auxiliary High-Frequency RC Oscillator (AUXHFRCO)

Table 4.37. Auxiliary High-Frequency RC Oscillator (AUXHFRCO)

Parameter

Symbol

Test Condition

Min

-3

Typ

Max

Unit

Frequency accuracy

f_{AUXHFRCO_ACC}At production calibrated frequen-

—

3

%

cies, across supply voltage and

temperature

Start-up time

t_AUXHFRCO

f_AUXHFRCO≥ 19 MHz

4 < f_AUXHFRCO< 19 MHz

f_AUXHFRCO≤ 4 MHz

f_AUXHFRCO= 38 MHz

f_AUXHFRCO= 32 MHz

f_AUXHFRCO= 26 MHz

f_AUXHFRCO= 19 MHz

f_AUXHFRCO= 16 MHz

f_AUXHFRCO= 13 MHz

f_AUXHFRCO= 7 MHz

f_AUXHFRCO= 4 MHz

f_AUXHFRCO= 2 MHz

f_AUXHFRCO= 1 MHz

—

400

1.4

2.5

193

157

135

108

100

77

—

ns

µs

—

µs

Current consumption on all

supplies

I_AUXHFRCO

213

175

151

122

113

88

µA

%

53

63

29

36

28

34

27

31

Coarse trim step size (% of

period)

SS_AUXHFR-

0.8

—

CO_COARSE

Fine trim step size (% of pe- SS_AUXHFR-

—

0.1

0.2

—

%

riod)

CO_FINE

Period jitter

PJ_AUXHFRCO

% RMS

4.1.12.6 Ultra-low Frequency RC Oscillator (ULFRCO)

Table 4.38. Ultra-low Frequency RC Oscillator (ULFRCO)

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Oscillation frequency

f_ULFRCO

0.95

1

1.07

kHz

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Electrical Specifications

4.1.13 Flash Memory Characteristics⁵

Table 4.39. Flash Memory Characteristics⁵

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Flash erase cycles before

failure

EC_FLASH

10000

—

cycles

Flash data retention

RET_FLASH

T ≤ 85 °C

10

20

—

30

years

µs

T ≤ 125 °C

Word (32-bit) programming

time

t_{W_PROG}

Burst write, 128 words, average

time per word

24.4

Single word

60

20

68.4

26.4

80

35

µs

Page erase time⁴

Mass erase time¹

Device erase time^{2 3}

t_PERASE

t_MERASE

t_DERASE

ms

20

26.5

35

ms

T ≤ 85 °C

—

82

—

100

110

1.6

ms

mA

T ≤ 125 °C

Page Erase

Erase current⁶

Write current⁶

I_ERASE

I_WRITE

V_FLASH

—

3.8

3.6

mA

V

Supply voltage during flash

erase and write

1.62

Note:

1. Mass erase is issued by the CPU and erases all flash.

2. Device erase is issued over the AAP interface and erases all flash, SRAM, the Lock Bit (LB) page, and the User data page Lock

Word (ULW).

3. From setting the DEVICEERASE bit in AAP_CMD to 1 until the ERASEBUSY bit in AAP_STATUS is cleared to 0. Internal setup

and hold times for flash control signals are included.

4. From setting the ERASEPAGE bit in MSC_WRITECMD to 1 until the BUSY bit in MSC_STATUS is cleared to 0. Internal setup

and hold times for flash control signals are included.

5. Flash data retention information is published in the Quarterly Quality and Reliability Report.

6. Measured at 25 °C.

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4.1.14 General-Purpose I/O (GPIO)

Table 4.40. General-Purpose I/O (GPIO)

Parameter

Symbol

Test Condition

GPIO pins

Min

—

Typ

—

Max

IOVDD*0.3

—

Unit

V

Input low voltage

Input high voltage

V_IL

V_IH

GPIO pins

IOVDD*0.7

IOVDD*0.8

—

V

Output high voltage relative V_OH

to IOVDD

Sourcing 3 mA, IOVDD ≥ 3 V,

—

V

DRIVESTRENGTH¹= WEAK

Sourcing 1.2 mA, IOVDD ≥ 1.62

V,

IOVDD*0.6

—

V

DRIVESTRENGTH¹= WEAK

Sourcing 20 mA, IOVDD ≥ 3 V,

IOVDD*0.8

—

V

DRIVESTRENGTH¹= STRONG

Sourcing 8 mA, IOVDD ≥ 1.62 V,

IOVDD*0.6

—

DRIVESTRENGTH¹= STRONG

Sinking 3 mA, IOVDD ≥ 3 V,

Output low voltage relative to V_OL

IOVDD

—

IOVDD*0.2

IOVDD*0.4

IOVDD*0.2

IOVDD*0.4

DRIVESTRENGTH¹= WEAK

Sinking 1.2 mA, IOVDD ≥ 1.62 V,

DRIVESTRENGTH¹= WEAK

Sinking 20 mA, IOVDD ≥ 3 V,

DRIVESTRENGTH¹= STRONG

Sinking 8 mA, IOVDD ≥ 1.62 V,

DRIVESTRENGTH¹= STRONG

Input leakage current

I_IOLEAK

All GPIO except LFXO pins, GPIO

≤ IOVDD, T ≤ 85 °C

—

30

15

0.1

—

30

50

nA

µA

kΩ

ns

LFXO Pins, GPIO ≤ IOVDD, T ≤

85 °C

All GPIO except LFXO pins, GPIO

≤ IOVDD, T > 85 °C

110

250

15

LFXO Pins, GPIO ≤ IOVDD, T >

85 °C

—

Input leakage current on

5VTOL pads above IOVDD

I_5VTOLLEAK

IOVDD < GPIO ≤ IOVDD + 2 V

3.3

40

25

I/O pin pull-up/pull-down re- R_PUD

sistor

65

Pulse width of pulses re-

moved by the glitch suppres-

sion filter

t_IOGLITCH

45

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Output fall time, From 70%

to 30% of V_IO

t_IOOF

C_L= 50 pF,

—

1.8

—

ns

DRIVESTRENGTH¹= STRONG,

SLEWRATE¹= 0x6

C_L= 50 pF,

—

4.5

2.2

7.4

—

ns

DRIVESTRENGTH¹= WEAK,

SLEWRATE¹= 0x6

C_L= 50 pF,

Output rise time, From 30% t_IOOR

to 70% of V_IO

DRIVESTRENGTH¹= STRONG,

SLEWRATE = 0x6¹

C_L= 50 pF,

DRIVESTRENGTH¹= WEAK,

SLEWRATE¹= 0x6

Note:

1. In GPIO_Pn_CTRL register.

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4.1.15 Voltage Monitor (VMON)

Table 4.41. Voltage Monitor (VMON)

Parameter

Symbol

I_VMON

Test Condition

Min

Typ

Max

Unit

Supply current (including

I_SENSE)

In EM0 or EM1, 1 supply moni-

tored, T ≤ 85 °C

—

6.3

10

µA

In EM0 or EM1, 1 supply moni-

tored, T > 85 °C

—

12.5

—

14

17

21

—

µA

nA

In EM0 or EM1, 4 supplies moni-

tored, T ≤ 85 °C

In EM0 or EM1, 4 supplies moni-

tored, T > 85 °C

In EM2, EM3 or EM4, 1 supply

monitored and above threshold

62

In EM2, EM3 or EM4, 1 supply

monitored and below threshold

62

In EM2, EM3 or EM4, 4 supplies

monitored and all above threshold

99

In EM2, EM3 or EM4, 4 supplies

monitored and all below threshold

99

Loading of monitored supply I_SENSE

In EM0 or EM1

—

2

—

3.4

—

µA

nA

V

In EM2, EM3 or EM4

Threshold range

V_{VMON_RANGE}

1.62

—

Threshold step size

N_{VMON_STESP}

Coarse

200

20

460

26

mV

ns

Fine

—

Response time

Hysteresis

t_{VMON_RES}

Supply drops at 1V/µs rate

—

V_{VMON_HYST}

—

mV

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4.1.16 Analog to Digital Converter (ADC)

Specified at 1 Msps, ADCCLK = 16 MHz, BIASPROG = 0, GPBIASACC = 0, unless otherwise indicated.

Table 4.42. Analog to Digital Converter (ADC)

Parameter

Symbol

Test Condition

Min

Typ

—

Max

12

Unit

Bits

V

Resolution

V_RESOLUTION

V_ADCIN

6

—

Input voltage range⁵

Single ended

Differential

—

V_FS

-V_FS/2

1

—

V_FS/2

V_AVDD

V

Input range of external refer- V_{ADCREFIN_P}

ence voltage, single ended

and differential

—

V

Power supply rejection²

PSRR_ADC

At DC

—

80

—

dB

Analog input common mode CMRR_ADC

rejection ratio

Current from all supplies, us- I_{ADC_CONTI-}

1 Msps / 16 MHz ADCCLK, BIA-

SPROG = 0, GPBIASACC = 1 ³

—

270

125

80

315

—

µA

ing internal reference buffer.

NOUS_LP

Continous operation. WAR-

MUPMODE⁴= KEEPADC-

WARM

250 ksps / 4 MHz ADCCLK, BIA-

SPROG = 6, GPBIASACC = 1 ³

62.5 ksps / 1 MHz ADCCLK, BIA-

SPROG = 15, GPBIASACC = 1 ³

Current from all supplies, us- I_{ADC_NORMAL_LP}35 ksps / 16 MHz ADCCLK, BIA-

45

SPROG = 0, GPBIASACC = 1 ³

ing internal reference buffer.

Duty-cycled operation. WAR-

MUPMODE⁴= NORMAL

5 ksps / 16 MHz ADCCLK BIA-

SPROG = 0, GPBIASACC = 1 ³

8

Current from all supplies, us- I_{ADC_STAND-}

125 ksps / 16 MHz ADCCLK, BIA-

SPROG = 0, GPBIASACC = 1 ³

105

70

ing internal reference buffer.

BY_LP

Duty-cycled operation.

35 ksps / 16 MHz ADCCLK, BIA-

SPROG = 0, GPBIASACC = 1 ³

AWARMUPMODE⁴= KEEP-

INSTANDBY or KEEPIN-

SLOWACC

Current from all supplies, us- I_{ADC_CONTI-}

1 Msps / 16 MHz ADCCLK, BIA-

SPROG = 0, GPBIASACC = 0 ³

—

325

175

125

85

—

µA

ing internal reference buffer.

NOUS_HP

Continous operation. WAR-

MUPMODE⁴= KEEPADC-

WARM

250 ksps / 4 MHz ADCCLK, BIA-

SPROG = 6, GPBIASACC = 0 ³

62.5 ksps / 1 MHz ADCCLK, BIA-

SPROG = 15, GPBIASACC = 0 ³

Current from all supplies, us- I_{ADC_NORMAL_HP}35 ksps / 16 MHz ADCCLK, BIA-

SPROG = 0, GPBIASACC = 0 ³

ing internal reference buffer.

Duty-cycled operation. WAR-

MUPMODE⁴= NORMAL

5 ksps / 16 MHz ADCCLK BIA-

SPROG = 0, GPBIASACC = 0 ³

16

Current from all supplies, us- I_{ADC_STAND-}

125 ksps / 16 MHz ADCCLK, BIA-

SPROG = 0, GPBIASACC = 0 ³

160

125

ing internal reference buffer.

BY_HP

Duty-cycled operation.

35 ksps / 16 MHz ADCCLK, BIA-

SPROG = 0, GPBIASACC = 0 ³

AWARMUPMODE⁴= KEEP-

INSTANDBY or KEEPIN-

SLOWACC

Current from HFPERCLK

I_{ADC_CLK}

HFPERCLK = 16 MHz

—

160

—

µA

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

Parameter

Symbol

f_ADCCLK

Test Condition

Min

—

Typ

—

7

Max

16

1

Unit

MHz

ADC clock frequency

Throughput rate

f_ADCRATE

t_ADCCONV

—

Msps

cycles

µs

Conversion time¹

6 bit

8 bit

12 bit

—

5

—

9

—

13

—

WARMUPMODE⁴= NORMAL

Startup time of reference

generator and ADC core

t_ADCSTART

—

WARMUPMODE⁴= KEEPIN-

STANDBY

—

58

—

67

68

2

µs

dB

WARMUPMODE⁴= KEEPINSLO-

WACC

1

Internal reference⁷, differential

measurement

SNDR at 1Msps and f_IN

10kHz

=

SNDR_ADC

—

External reference⁶, differential

measurement

Spurious-free dynamic range SFDR_ADC

(SFDR)

1 MSamples/s, 10 kHz full-scale

sine wave

—

-1

-6

75

—

2

dB

Differential non-linearity

(DNL)

DNL_ADC

12 bit resolution, No missing co-

des

LSB

Integral non-linearity (INL),

End point method

INL_ADC

12 bit resolution

6

Offset error

V_ADCOFFSETERR

V_ADCGAIN

-3

—

0

3

LSB

%

Gain error in ADC

Using internal reference

Using external reference

-0.2

-1

3.5

—

%

Temperature sensor slope

V_{TS_SLOPE}

-1.84

mV/°C

Note:

1. Derived from ADCCLK.

2. PSRR is referenced to AVDD when ANASW=0 and to DVDD when ANASW=1 in EMU_PWRCTRL.

3. In ADCn_BIASPROG register.

4. In ADCn_CNTL register.

5. The absolute voltage allowed at any ADC input is dictated by the power rail supplied to on-chip circuitry, and may be lower than

the effective full scale voltage. All ADC inputs are limited to the ADC supply (AVDD or DVDD depending on

EMU_PWRCTRL_ANASW). Any ADC input routed through the APORT will further be limited by the IOVDD supply to the pin.

6. External reference is 1.25 V applied externally to ADCnEXTREFP, with the selection CONF in the SINGLECTRL_REF or

SCANCTRL_REF register field and VREFP in the SINGLECTRLX_VREFSEL or SCANCTRLX_VREFSEL field. The differential

input range with this configuration is ± 1.25 V.

7. Internal reference option used corresponds to selection 2V5 in the SINGLECTRL_REF or SCANCTRL_REF register field. The

differential input range with this configuration is ± 1.25 V. Typical value is characterized using full-scale sine wave input. Minimum

value is production-tested using sine wave input at 1.5 dB lower than full scale.

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4.1.17 Analog Comparator (ACMP)

Table 4.43. Analog Comparator (ACMP)

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Input voltage range

V_ACMPIN

ACMPVDD =

ACMPn_CTRL_PWRSEL ¹

—

V_ACMPVDD

V

BIASPROG⁴≤ 0x10 or FULL-

BIAS⁴= 0

Supply voltage

V_ACMPVDD

1.8

2.1

—

V_{VREGVDD_}

V

MAX

0x10 < BIASPROG⁴≤ 0x20 and

FULLBIAS⁴= 1

V_{VREGVDD_}

MAX

BIASPROG⁴= 1, FULLBIAS⁴= 0

Active current not including

voltage reference²

I_ACMP

—

50

—

nA

BIASPROG⁴= 0x10, FULLBIAS⁴

= 0

306

BIASPROG⁴= 0x02, FULLBIAS⁴

= 1

—

6.5

75

50

—

92

—

µA

nA

BIASPROG⁴= 0x20, FULLBIAS⁴

= 1

Current consumption of inter- I_ACMPREF

nal voltage reference²

VLP selected as input using 2.5 V

Reference / 4 (0.625 V)

VLP selected as input using VDD

—

20

—

nA

µA

VBDIV selected as input using

1.25 V reference / 1

4.1

VADIV selected as input using

VDD/1

—

2.4

—

µA

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

HYSTSEL⁵= HYST0

HYSTSEL⁵= HYST1

HYSTSEL⁵= HYST2

HYSTSEL⁵= HYST3

HYSTSEL⁵= HYST4

HYSTSEL⁵= HYST5

HYSTSEL⁵= HYST6

HYSTSEL⁵= HYST7

HYSTSEL⁵= HYST8

HYSTSEL⁵= HYST9

HYSTSEL⁵= HYST10

HYSTSEL⁵= HYST11

HYSTSEL⁵= HYST12

HYSTSEL⁵= HYST13

HYSTSEL⁵= HYST14

HYSTSEL⁵= HYST15

BIASPROG⁴= 1, FULLBIAS⁴= 0

Hysteresis (V_CM= 1.25 V,

BIASPROG⁴= 0x10, FULL-

BIAS⁴= 1)

V_ACMPHYST

-3

0

3

mV

5

12

18

33

27

50

mV

µs

17

46

65

23

57

82

26

68

98

30

79

130

150

3

34

90

-3

0

-27

-50

-65

-82

-98

-130

-150

—

-18

-33

-45

-57

-67

-78

-88

30

-5

-12

-17

-23

-26

-30

-34

—

Comparator delay³

t_ACMPDELAY

BIASPROG⁴= 0x10, FULLBIAS⁴

= 0

—

3.7

—

µs

BIASPROG⁴= 0x02, FULLBIAS⁴

= 1

—

360

35

—

35

ns

BIASPROG⁴= 0x20, FULLBIAS⁴

= 1

BIASPROG⁴=0x10, FULLBIAS⁴

= 1

Offset voltage

V_ACMPOFFSET

-35

—

mV

Reference voltage

V_ACMPREF

Internal 1.25 V reference

Internal 2.5 V reference

1

2

1.25

2.5

1.47

2.8

—

V

CSRESSEL⁶= 0

CSRESSEL⁶= 1

CSRESSEL⁶= 2

CSRESSEL⁶= 3

CSRESSEL⁶= 4

CSRESSEL⁶= 5

CSRESSEL⁶= 6

CSRESSEL⁶= 7

Capacitive sense internal re- R_CSRES

sistance

—

infinite

kΩ

—

15

27

—

kΩ

39

51

100

162

235

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Electrical Specifications

Parameter

Note:

Symbol

Test Condition

Min

Typ

Max

Unit

1. ACMPVDD is a supply chosen by the setting in ACMPn_CTRL_PWRSEL and may be IOVDD, AVDD or DVDD.

2. The total ACMP current is the sum of the contributions from the ACMP and its internal voltage reference. I_ACMPTOTAL= I_ACMP

I_ACMPREF

+

.

3. ± 100 mV differential drive.

4. In ACMPn_CTRL register.

5. In ACMPn_HYSTERESIS registers.

6. In ACMPn_INPUTSEL register.

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4.1.18 Digital to Analog Converter (VDAC)

DRIVESTRENGTH = 2 unless otherwise specified. Primary VDAC output.

Table 4.44. Digital to Analog Converter (VDAC)

Parameter

Symbol

Test Condition

Min

0

Typ

—

Max

Unit

V

Output voltage

V_DACOUT

Single-Ended

V_VREF

Differential²

-V_VREF

—

V

Current consumption includ- I_DAC

ing references (2 channels)¹

500 ksps, 12-bit, DRIVES-

TRENGTH = 2, REFSEL = 4

—

396

72

—

µA

44.1 ksps, 12-bit, DRIVES-

TRENGTH = 1, REFSEL = 4

200 Hz refresh rate, 12-bit Sam-

ple-Off mode in EM2, DRIVES-

TRENGTH = 2, BGRREQTIME =

1, EM2REFENTIME = 9, REFSEL

= 4, SETTLETIME = 0x0A, WAR-

MUPTIME = 0x02

1.2

Current from HFPERCLK⁴

Sample rate

I_{DAC_CLK}

—

2

5.8

—

500

1

µA/MHz

ksps

MHz

µs

SR_DAC

DAC clock frequency

Conversion time

Settling time

f_DAC

—

t_DACCONV

t_DACSETTLE

t_DACSTARTUP

f_DAC= 1MHz

—

50% fs step settling to 5 LSB

—

2.5

—

µs

Startup time

Enable to 90% fs output, settling

to 10 LSB

12

µs

Output impedance

R_OUT

DRIVESTRENGTH = 2, 0.4 V ≤

V_OUT≤ V_OPA- 0.4 V, -8 mA <

I_OUT< 8 mA, Full supply range

—

2

—

Ω

DRIVESTRENGTH = 0 or 1, 0.4 V

≤ V_OUT≤ V_OPA- 0.4 V, -400 µA <

I_OUT< 400 µA, Full supply range

DRIVESTRENGTH = 2, 0.1 V ≤

V_OUT≤ V_OPA- 0.1 V, -2 mA <

I_OUT< 2 mA, Full supply range

2

Ω

DRIVESTRENGTH = 0 or 1, 0.1 V

≤ V_OUT≤ V_OPA- 0.1 V, -100 µA <

I_OUT< 100 µA, Full supply range

2

Ω

Power supply rejection ratio⁶

PSRR

Vout = 50% fs. DC

65.5

dB

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Signal to noise and distortion SNDR_DAC

ratio (1 kHz sine wave),

Noise band limited to 250

kHz

500 ksps, single-ended, internal

1.25V reference

—

60.4

—

dB

500 ksps, single-ended, internal

2.5V reference

—

61.6

64.0

63.3

64.4

65.8

65.3

66.7

70.0

67.8

69.0

68.5

—

dB

500 ksps, single-ended, 3.3V

VDD reference

500 ksps, differential, internal

1.25V reference

500 ksps, differential, internal

2.5V reference

500 ksps, differential, 3.3V VDD

reference

Signal to noise and distortion SNDR_{DAC_BAND}500 ksps, single-ended, internal

ratio (1 kHz sine wave),

Noise band limited to 22 kHz

1.25V reference

500 ksps, single-ended, internal

2.5V reference

500 ksps, single-ended, 3.3V

VDD reference

500 ksps, differential, internal

1.25V reference

500 ksps, differential, internal

2.5V reference

500 ksps, differential, 3.3V VDD

reference

Total harmonic distortion

THD

—

70.2

—

1

dB

Differential non-linearity³

Intergral non-linearity

DNL_DAC

-0.99

LSB

INL_DAC

-4

-8

—

4

8

LSB

mV

Offset error⁵

V_OFFSET

T = 25 °C

Across operating temperature

range

-25

25

Gain error⁵

V_GAIN

T = 25 °C, Low-noise internal ref-

erence (REFSEL = 1V25LN or

2V5LN)

-2.5

—

2.5

%

T = 25 °C, Internal reference (RE-

FSEL = 1V25 or 2V5)

-5

—

5

%

T = 25 °C, External reference

(REFSEL = VDD or EXT)

-1.8

-3.5

1.8

3.5

Across operating temperature

range, Low-noise internal refer-

ence (REFSEL = 1V25LN or

2V5LN)

Across operating temperature

range, Internal reference (RE-

FSEL = 1V25 or 2V5)

-7.5

-2.0

—

7.5

2.0

%

Across operating temperature

range, External reference (RE-

FSEL = VDD or EXT)

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

External load capactiance,

OUTSCALE=0

C_LOAD

—

75

pF

Note:

1. Supply current specifications are for VDAC circuitry operating with static output only and do not include current required to drive

the load.

2. In differential mode, the output is defined as the difference between two single-ended outputs. Absolute voltage on each output is

limited to the single-ended range.

3. Entire range is monotonic and has no missing codes.

4. Current from HFPERCLK is dependent on HFPERCLK frequency. This current contributes to the total supply current used when

the clock to the DAC module is enabled in the CMU.

5. Gain is calculated by measuring the slope from 10% to 90% of full scale. Offset is calculated by comparing actual VDAC output at

10% of full scale to ideal VDAC output at 10% of full scale with the measured gain.

6. PSRR calculated as 20 * log₁₀(ΔVDD / ΔV_OUT), VDAC output at 90% of full scale

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4.1.19 Current Digital to Analog Converter (IDAC)

Table 4.45. Current Digital to Analog Converter (IDAC)

Parameter

Symbol

Test Condition

Min

—

Typ

4

Max

—

Unit

ranges

µA

Number of ranges

Output current

N_{IDAC_RANGES}

I_{IDAC_OUT}

RANGSEL¹= RANGE0

RANGSEL¹= RANGE1

RANGSEL¹= RANGE2

RANGSEL¹= RANGE3

0.05

—

1.6

0.5

2

—

32

4.7

16

64

—

µA

Linear steps within each

range

N_{IDAC_STEPS}

—

steps

RANGSEL¹= RANGE0

RANGSEL¹= RANGE1

RANGSEL¹= RANGE2

RANGSEL¹= RANGE3

Step size

SS_IDAC

—

-3

50

100

500

2

—

3

nA

µA

%

Total accuracy, STEPSEL¹=

0x10

ACC_IDAC

EM0 or EM1, AVDD=3.3 V, T = 25

°C

—

EM0 or EM1, Across operating

temperature range

-18

—

-2

22

—

%

EM2 or EM3, Source mode,

RANGSEL¹= RANGE0,

AVDD=3.3 V, T = 25 °C

EM2 or EM3, Source mode,

RANGSEL¹= RANGE1,

AVDD=3.3 V, T = 25 °C

—

-1.7

-0.8

-0.5

-0.7

-0.6

-0.5

5

—

%

EM2 or EM3, Source mode,

RANGSEL¹= RANGE2,

AVDD=3.3 V, T = 25 °C

%

EM2 or EM3, Source mode,

RANGSEL¹= RANGE3,

AVDD=3.3 V, T = 25 °C

%

EM2 or EM3, Sink mode, RANG-

SEL¹= RANGE0, AVDD=3.3 V, T

= 25 °C

%

EM2 or EM3, Sink mode, RANG-

SEL¹= RANGE1, AVDD=3.3 V, T

= 25 °C

%

EM2 or EM3, Sink mode, RANG-

SEL¹= RANGE2, AVDD=3.3 V, T

= 25 °C

%

EM2 or EM3, Sink mode, RANG-

SEL¹= RANGE3, AVDD=3.3 V, T

= 25 °C

%

µs

Start up time

t_{IDAC_SU}

Output within 1% of steady state

value

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Electrical Specifications

Parameter

Symbol

Test Condition

Min

—

Typ

5

Max

—

Unit

µs

Settling time, (output settled t_{IDAC_SETTLE}

within 1% of steady state val-

ue),

Range setting is changed

Step value is changed

—

1

—

µs

Current consumption²

I_IDAC

EM0 or EM1 Source mode, ex-

cluding output current, Across op-

erating temperature range

—

11

13

18

21

µA

EM0 or EM1 Sink mode, exclud-

ing output current, Across operat-

ing temperature range

EM2 or EM3 Source mode, ex-

cluding output current, T = 25 °C

—

0.023

0.041

11

—

µA

%

EM2 or EM3 Sink mode, exclud-

ing output current, T = 25 °C

EM2 or EM3 Source mode, ex-

cluding output current, T ≥ 85 °C

EM2 or EM3 Sink mode, exclud-

ing output current, T ≥ 85 °C

13

Output voltage compliance in I_{COMP_SRC}

source mode, source current

change relative to current

sourced at 0 V

RANGESEL1=0, output voltage =

min(V_IOVDD, V_AVDD²-100 mv)

0.11

RANGESEL1=1, output voltage =

min(V_IOVDD, V_AVDD²-100 mV)

—

0.06

0.04

0.03

—

%

RANGESEL1=2, output voltage =

min(V_IOVDD, V_AVDD²-150 mV)

RANGESEL1=3, output voltage =

min(V_IOVDD, V_AVDD²-250 mV)

Output voltage compliance in I_{COMP_SINK}

sink mode, sink current

change relative to current

sunk at IOVDD

RANGESEL1=0, output voltage =

100 mV

—

0.12

0.05

0.04

0.03

—

%

RANGESEL1=1, output voltage =

100 mV

RANGESEL1=2, output voltage =

150 mV

RANGESEL1=3, output voltage =

250 mV

Note:

1. In IDAC_CURPROG register.

2. The IDAC is supplied by either AVDD, DVDD, or IOVDD based on the setting of ANASW in the EMU_PWRCTRL register and

PWRSEL in the IDAC_CTRL register. Setting PWRSEL to 1 selects IOVDD. With PWRSEL cleared to 0, ANASW selects be-

tween AVDD (0) and DVDD (1).

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4.1.20 Capacitive Sense (CSEN)

Table 4.46. Capacitive Sense (CSEN)

Parameter

Symbol

t_CNV

Test Condition

Min

—

Typ

20.2

26.4

1.55

Max

—

Unit

µs

Single conversion time (1x

accumulation)

12-bit SAR Conversions

16-bit SAR Conversions

—

µs

Delta Modulation Conversion (sin-

gle comparison)

—

µs

Maximum external capacitive C_EXTMAX

load

CS0CG=7 (Gain = 1x), including

routing parasitics

—

68

680

1

—

pF

kΩ

nA

CS0CG=0 (Gain = 10x), including

routing parasitics

Maximum external series im- R_EXTMAX

pedance

Supply current, EM2 bonded I_{CSEN_BOND}

conversions, WARMUP-

MODE=NORMAL, WAR-

MUPCNT=0

12-bit SAR conversions, 20 ms

conversion rate, CS0CG=7 (Gain

= 1x), 10 channels bonded (total

capacitance of 330 pF)¹

326

Delta Modulation conversions, 20

ms conversion rate, CS0CG=7

(Gain = 1x), 10 channels bonded

—

226

33

—

nA

(total capacitance of 330 pF)¹

12-bit SAR conversions, 200 ms

conversion rate, CS0CG=7 (Gain

= 1x), 10 channels bonded (total

capacitance of 330 pF)¹

Delta Modulation conversions,

200 ms conversion rate,

25

CS0CG=7 (Gain = 1x), 10 chan-

nels bonded (total capacitance of

330 pF)¹

Supply current, EM2 scan

conversions, WARMUP-

MODE=NORMAL, WAR-

MUPCNT=0

I_{CSEN_EM2}

12-bit SAR conversions, 20 ms

scan rate, CS0CG=0 (Gain =

—

690

515

—

nA

10x), 8 samples per scan¹

Delta Modulation conversions, 20

ms scan rate, 8 comparisons per

sample (DMCR = 1, DMR = 2),

CS0CG=0 (Gain = 10x), 8 sam-

ples per scan¹

12-bit SAR conversions, 200 ms

scan rate, CS0CG=0 (Gain =

—

79

57

—

nA

10x), 8 samples per scan¹

Delta Modulation conversions,

200 ms scan rate, 8 comparisons

per sample (DMCR = 1, DMR =

2), CS0CG=0 (Gain = 10x), 8

samples per scan¹

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Supply current, continuous

conversions, WARMUP-

MODE=KEEPCSENWARM

I_{CSEN_ACTIVE}

SAR or Delta Modulation conver-

sions of 33 pF capacitor,

CS0CG=0 (Gain = 10x), always

on

—

90.5

—

µA

HFPERCLK supply current

I_{CSEN_HFPERCLK}Current contribution from

HFPERCLK when clock to CSEN

block is enabled.

—

2.25

—

µA/MHz

Note:

1. Current is specified with a total external capacitance of 33 pF per channel. Average current is dependent on how long the module

is actively sampling channels within the scan period, and scales with the number of samples acquired. Supply current for a specif-

ic application can be estimated by multiplying the current per sample by the total number of samples per period (total_current =

single_sample_current * (number_of_channels * accumulation)).

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4.1.21 Operational Amplifier (OPAMP)

Unless otherwise indicated, specified conditions are: Non-inverting input configuration, VDD = 3.3 V, DRIVESTRENGTH = 2, MAIN-

OUTEN = 1, C_LOAD= 75 pF with OUTSCALE = 0, or C_LOAD= 37.5 pF with OUTSCALE = 1. Unit gain buffer and 3X-gain connection as

specified in table footnotes^{8 1}

.

Table 4.47. Operational Amplifier (OPAMP)

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Supply voltage (from AVDD) V_OPA

HCMDIS = 0, Rail-to-rail input

range

2

—

3.8

V

HCMDIS = 1

1.62

—

3.8

V

Input voltage

V_IN

HCMDIS = 0, Rail-to-rail input

range

V_VSS

V_OPA

HCMDIS = 1

V_VSS

100

V_VSS

—

V_OPA-1.2

—

V

MΩ

V

Input impedance

Output voltage

R_IN

V_OUT

C_LOAD

—

V_OPA

75

Load capacitance²

OUTSCALE = 0

OUTSCALE = 1

—

pF

Ω

—

37.5

—

Output impedance

R_OUT

DRIVESTRENGTH = 2 or 3, 0.4 V

≤ V_OUT≤ V_OPA- 0.4 V, -8 mA <

I_OUT< 8 mA, Buffer connection,

Full supply range

—

0.25

DRIVESTRENGTH = 0 or 1, 0.4 V

≤ V_OUT≤ V_OPA- 0.4 V, -400 µA <

I_OUT< 400 µA, Buffer connection,

Full supply range

—

0.6

0.4

1

—

Ω

DRIVESTRENGTH = 2 or 3, 0.1 V

≤ V_OUT≤ V_OPA- 0.1 V, -2 mA <

I_OUT< 2 mA, Buffer connection,

Full supply range

DRIVESTRENGTH = 0 or 1, 0.1 V

≤ V_OUT≤ V_OPA- 0.1 V, -100 µA <

I_OUT< 100 µA, Buffer connection,

Full supply range

Internal closed-loop gain

Active current⁴

G_CL

Buffer connection

3x Gain connection

16x Gain connection

0.99

2.93

15.07

—

1

1.01

3.05

16.33

—

-

2.99

15.7

580

-

I_OPA

DRIVESTRENGTH = 3, OUT-

SCALE = 0

µA

DRIVESTRENGTH = 2, OUT-

SCALE = 0

—

176

13

—

µA

DRIVESTRENGTH = 1, OUT-

SCALE = 0

DRIVESTRENGTH = 0, OUT-

SCALE = 0

4.7

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

Parameter

Symbol

Test Condition

Min

—

Typ

135

137

121

109

3.38

Max

—

Unit

dB

Open-loop gain

G_OL

DRIVESTRENGTH = 3

DRIVESTRENGTH = 2

DRIVESTRENGTH = 1

DRIVESTRENGTH = 0

—

dB

—

dB

—

dB

Loop unit-gain frequency⁷

UGF

DRIVESTRENGTH = 3, Buffer

connection

—

MHz

DRIVESTRENGTH = 2, Buffer

connection

—

0.9

132

34

—

MHz

kHz

DRIVESTRENGTH = 1, Buffer

connection

DRIVESTRENGTH = 0, Buffer

connection

kHz

DRIVESTRENGTH = 3, 3x Gain

connection

2.57

0.71

113

28

MHz

kHz

DRIVESTRENGTH = 2, 3x Gain

connection

DRIVESTRENGTH = 1, 3x Gain

connection

DRIVESTRENGTH = 0, 3x Gain

connection

kHz

Phase margin

PM

DRIVESTRENGTH = 3, Buffer

connection

67

°

DRIVESTRENGTH = 2, Buffer

connection

69

°

DRIVESTRENGTH = 1, Buffer

connection

63

°

DRIVESTRENGTH = 0, Buffer

connection

68

°

Output voltage noise

N_OUT

DRIVESTRENGTH = 3, Buffer

connection, 10 Hz - 10 MHz

146

163

170

176

313

271

247

245

µVrms

DRIVESTRENGTH = 2, Buffer

connection, 10 Hz - 10 MHz

DRIVESTRENGTH = 1, Buffer

connection, 10 Hz - 1 MHz

DRIVESTRENGTH = 0, Buffer

connection, 10 Hz - 1 MHz

DRIVESTRENGTH = 3, 3x Gain

connection, 10 Hz - 10 MHz

DRIVESTRENGTH = 2, 3x Gain

connection, 10 Hz - 10 MHz

DRIVESTRENGTH = 1, 3x Gain

connection, 10 Hz - 1 MHz

DRIVESTRENGTH = 0, 3x Gain

connection, 10 Hz - 1 MHz

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Slew rate⁵

SR

DRIVESTRENGTH = 3,

INCBW=1³

—

4.7

—

V/µs

DRIVESTRENGTH = 3,

INCBW=0

—

1.5

—

V/µs

DRIVESTRENGTH = 2,

INCBW=1³

1.27

DRIVESTRENGTH = 2,

INCBW=0

—

0.42

0.17

—

V/µs

DRIVESTRENGTH = 1,

INCBW=1³

DRIVESTRENGTH = 1,

INCBW=0

—

0.058

0.044

—

V/µs

DRIVESTRENGTH = 0,

INCBW=1³

DRIVESTRENGTH = 0,

INCBW=0

—

0.015

—

V/µs

Startup time⁶

T_START

V_OSI

DRIVESTRENGTH = 2

—

-2

—

12

2

µs

Input offset voltage

DRIVESTRENGTH = 2 or 3, T =

25 °C

mV

DRIVESTRENGTH = 1 or 0, T =

25 °C

-2

—

2

mV

DRIVESTRENGTH = 2 or 3,

across operating temperature

range

-12

12

DRIVESTRENGTH = 1 or 0,

across operating temperature

range

-30

—

30

mV

DC power supply rejection

ratio⁹

PSRR_DC

Input referred

—

70

90

—

dB

DC common-mode rejection CMRR_DC

ratio⁹

Input referred

Total harmonic distortion

THD_OPA

DRIVESTRENGTH = 2, 3x Gain

connection, 1 kHz, V_OUT= 0.1 V

to V_OPA- 0.1 V

DRIVESTRENGTH = 0, 3x Gain

connection, 0.1 kHz, V_OUT= 0.1 V

to V_OPA- 0.1 V

—

90

—

dB

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Electrical Specifications

Parameter

Note:

Symbol

Test Condition

Min

Typ

Max

Unit

1. Specified configuration for 3X-Gain configuration is: INCBW = 1, HCMDIS = 1, RESINSEL = VSS, V_INPUT= 0.5 V, V_OUTPUT= 1.5

V. Nominal voltage gain is 3.

2. If the maximum C_LOADis exceeded, an isolation resistor is required for stability. See AN0038 for more information.

3. When INCBW is set to 1 the OPAMP bandwidth is increased. This is allowed only when the non-inverting close-loop gain is ≥ 3,

or the OPAMP may not be stable.

4. Current into the load resistor is excluded. When the OPAMP is connected with closed-loop gain > 1, there will be extra current to

drive the resistor feedback network. The internal resistor feedback network has total resistance of 143.5 kOhm, which will cause

another ~10 µA current when the OPAMP drives 1.5 V between output and ground.

5. Step between 0.2V and V_OPA-0.2V, 10%-90% rising/falling range.

6. From enable to output settled. In sample-and-off mode, RC network after OPAMP will contribute extra delay. Settling error < 1mV.

7. In unit gain connection, UGF is the gain-bandwidth product of the OPAMP. In 3x Gain connection, UGF is the gain-bandwidth

product of the OPAMP and 1/3 attenuation of the feedback network.

8. Specified configuration for Unit gain buffer configuration is: INCBW = 0, HCMDIS = 0, RESINSEL = DISABLE. V_INPUT= 0.5 V,

V_OUTPUT= 0.5 V.

9. When HCMDIS=1 and input common mode transitions the region from V_OPA-1.4V to V_OPA-1V, input offset will change. PSRR

and CMRR specifications do not apply to this transition region.

4.1.22 Pulse Counter (PCNT)

Table 4.48. Pulse Counter (PCNT)

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Input frequency

F_IN

Asynchronous Single and Quad-

rature Modes

—

20

MHz

Sampled Modes with Debounce

filter set to 0.

—

8

kHz

4.1.23 Analog Port (APORT)

Table 4.49. Analog Port (APORT)

Parameter

Symbol

Test Condition

Min

—

Typ

7

Max

—

Unit

µA

Supply current^{2 1}

I_APORT

Operation in EM0/EM1

Operation in EM2/EM3

—

67

—

nA

Note:

1. Specified current is for continuous APORT operation. In applications where the APORT is not requested continuously (e.g. peri-

odic ACMP requests from LESENSE in EM2), the average current requirements can be estimated by mutiplying the duty cycle of

the requests by the specified continuous current number.

2. Supply current increase that occurs when an analog peripheral requests access to APORT. This current is not included in repor-

ted module currents. Additional peripherals requesting access to APORT do not incur further current.

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Electrical Specifications

4.1.24 I2C

4.1.24.1 I2C Standard-mode (Sm)¹

Table 4.50. I2C Standard-mode (Sm)¹

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

SCL clock frequency²

SCL clock low time

SCL clock high time

SDA set-up time

f_SCL

0

—

100

kHz

t_LOW

4.7

4

—

µs

ns

µs

t_HIGH

t_{SU_DAT}

t_{HD_DAT}

250

100

4.7

—

SDA hold time³

3450

—

Repeated START condition t_{SU_STA}

set-up time

(Repeated) START condition t_{HD_STA}

hold time

4

—

µs

STOP condition set-up time t_{SU_STO}

4

—

µs

Bus free time between a

t_BUF

4.7

STOP and START condition

Note:

1. For CLHR set to 0 in the I2Cn_CTRL register.

2. For the minimum HFPERCLK frequency required in Standard-mode, refer to the I2C chapter in the reference manual.

3. The maximum SDA hold time (t_{HD_DAT}) needs to be met only when the device does not stretch the low time of SCL (t_LOW).

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4.1.24.2 I2C Fast-mode (Fm)¹

Table 4.51. I2C Fast-mode (Fm)¹

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

SCL clock frequency²

SCL clock low time

SCL clock high time

SDA set-up time

f_SCL

0

—

400

kHz

t_LOW

1.3

0.6

—

µs

ns

µs

t_HIGH

t_{SU_DAT}

t_{HD_DAT}

100

0.6

—

SDA hold time³

900

—

Repeated START condition t_{SU_STA}

set-up time

(Repeated) START condition t_{HD_STA}

hold time

0.6

—

µs

STOP condition set-up time t_{SU_STO}

0.6

1.3

—

µs

Bus free time between a

t_BUF

STOP and START condition

Note:

1. For CLHR set to 1 in the I2Cn_CTRL register.

2. For the minimum HFPERCLK frequency required in Fast-mode, refer to the I2C chapter in the reference manual.

3. The maximum SDA hold time (t_HD,DAT) needs to be met only when the device does not stretch the low time of SCL (t_LOW).

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Electrical Specifications

4.1.24.3 I2C Fast-mode Plus (Fm+)¹

Table 4.52. I2C Fast-mode Plus (Fm+)¹

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

SCL clock frequency²

SCL clock low time

SCL clock high time

SDA set-up time

f_SCL

0

—

1000

kHz

t_LOW

0.5

0.26

50

—

µs

ns

µs

t_HIGH

t_{SU_DAT}

t_{HD_DAT}

SDA hold time

100

0.26

Repeated START condition t_{SU_STA}

set-up time

(Repeated) START condition t_{HD_STA}

hold time

0.26

—

µs

STOP condition set-up time t_{SU_STO}

0.26

0.5

—

µs

Bus free time between a

t_BUF

STOP and START condition

Note:

1. For CLHR set to 0 or 1 in the I2Cn_CTRL register.

2. For the minimum HFPERCLK frequency required in Fast-mode Plus, refer to the I2C chapter in the reference manual.

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Electrical Specifications

4.1.25 USART SPI

SPI Master Timing

Table 4.53. SPI Master Timing

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

SCLK period ^{1 3 2}

t_SCLK

2 *

t_HFPERCLK

—

ns

CS to MOSI ^{1 3}

t_{CS_MO}

t_{SCLK_MO}

t_{SU_MI}

-14.5

-8.5

—

13.5

8

ns

SCLK to MOSI ^{1 3}

MISO setup time ^{1 3}

IOVDD = 1.62 V

IOVDD = 3.0 V

92

42

—

ns

MISO hold time ^{1 3}

t_{H_MI}

-10

Note:

1. Applies for both CLKPHA = 0 and CLKPHA = 1 (figure only shows CLKPHA = 0).

2. t_HFPERCLKis one period of the selected HFPERCLK.

3. Measurement done with 8 pF output loading at 10% and 90% of V_DD(figure shows 50% of V_DD).

t_{CS_MO}

CS

t_{SCKL_MO}

SCLK

CLKPOL = 0

t_SCLK

SCLK

CLKPOL = 1

MOSI

MISO

t_{SU_MI}

t_{H_MI}

Figure 4.1. SPI Master Timing Diagram

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Electrical Specifications

SPI Slave Timing

Table 4.54. SPI Slave Timing

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

SCLK period ^{1 3 2}

t_SCLK

6 *

t_HFPERCLK

—

ns

SCLK high time^{1 3 2}

SCLK low time^{1 3 2}

t_{SCLK_HI}

2.5 *

t_HFPERCLK

—

ns

t_{SCLK_LO}

2.5 *

t_HFPERCLK

CS active to MISO ^{1 3}

CS disable to MISO ^{1 3}

MOSI setup time ^{1 3}

MOSI hold time ^{1 3 2}

SCLK to MISO ^{1 3 2}

t_{CS_ACT_MI}

t_{CS_DIS_MI}

t_{SU_MO}

4

8

7

—

70

50

—

ns

t_{H_MO}

t_{SCLK_MI}

10 + 1.5 *

t_HFPERCLK

65 + 2.5 *

t_HFPERCLK

Note:

1. Applies for both CLKPHA = 0 and CLKPHA = 1 (figure only shows CLKPHA = 0).

2. t_HFPERCLKis one period of the selected HFPERCLK.

3. Measurement done with 8 pF output loading at 10% and 90% of V_DD(figure shows 50% of V_DD).

t_{CS_ACT_MI}

CS

t_{CS_DIS_MI}

SCLK

CLKPOL = 0

t_{SCLK_HI}

t_{SCLK_LO}

SCLK

t_{SU_MO}

CLKPOL = 1

t_SCLK

t_{H_MO}

MOSI

MISO

t_{SCLK_MI}

Figure 4.2. SPI Slave Timing Diagram

4.2 Typical Performance Curves

Typical performance curves indicate typical characterized performance under the stated conditions.

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Electrical Specifications

4.2.1 Supply Current

Figure 4.3. EM0 Active Mode Typical Supply Current vs. Temperature

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Electrical Specifications

Figure 4.4. EM1 Sleep Mode Typical Supply Current vs. Temperature

Typical supply current for EM2, EM3 and EM4H using standard software libraries from Silicon Laboratories.

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Electrical Specifications

Figure 4.5. EM2, EM3, EM4H and EM4S Typical Supply Current vs. Temperature

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Electrical Specifications

Figure 4.6. EM0 and EM1 Mode Typical Supply Current vs. Supply

Typical supply current for EM2, EM3 and EM4H using standard software libraries from Silicon Laboratories.

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Electrical Specifications

Figure 4.7. EM2, EM3, EM4H and EM4S Typical Supply Current vs. Supply

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Electrical Specifications

4.2.2 DC-DC Converter

Default test conditions: CCM mode, LDCDC = 4.7 μH, CDCDC = 4.7 μF, VDCDC_I = 3.3 V, VDCDC_O = 1.8 V, FDCDC_LN = 7 MHz

Figure 4.8. DC-DC Converter Typical Performance Characteristics

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Electrical Specifications

Load Step Response in LN (CCM) mode

(Heavy Drive)

LN (CCM) and LP mode transition (load: 5mA)

DVDD

20mV/div

offset:1.8V

60mV/div

offset:1.8V

100mA

I_LOAD

1mA

V_SW

2V/div

offset:1.8V

10μs/div

100μs/div

Figure 4.9. DC-DC Converter Transition Waveforms

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Electrical Specifications

4.2.3 2.4 GHz Radio

Figure 4.10. 2.4 GHz RF Transmitter Output Power

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Electrical Specifications

Figure 4.11. 2.4 GHz RF Receiver Sensitivity

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Typical Connection Diagrams

5. Typical Connection Diagrams

5.1 Power

Typical power supply connections for direct supply, without using the internal DC-DC converter, are shown in the following figure.

V_DD

Main

Supply

+

–

VREGVDD

AVDD

IOVDD

VREGSW

HFXTAL_N

HFXTAL_P

LFXTAL_N

LFXTAL_P

VREGVSS

DVDD

DECOUPLE

RFVDD

PAVDD

Figure 5.1. EFR32BG12 Typical Application Circuit: Direct Supply Configuration without DC-DC converter

Typical power supply circuits using the internal DC-DC converter are shown below. The MCU operates from the DC-DC converter sup-

ply. For low RF transmit power applications less than 13dBm, the RF PA may be supplied by the DC-DC converter. For OPNs support-

ing high power RF transmission, the RF PA must be directly supplied by VDD for RF transmit power greater than 13 dBm.

V_DD

Main

Supply

+

–

VREGVDD

AVDD

IOVDD

V_DCDC

VREGSW

HFXTAL_N

HFXTAL_P

LFXTAL_N

LFXTAL_P

VREGVSS

DVDD

DECOUPLE

RFVDD

PAVDD

Figure 5.2. EFR32BG12 Typical Application Circuit: Configuration with DC-DC converter (PAVDD from VDCDC)

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Typical Connection Diagrams

V_DD

Main

Supply

+

–

VREGVDD

AVDD

IOVDD

V_DCDC

VREGSW

HFXTAL_N

HFXTAL_P

LFXTAL_N

LFXTAL_P

VREGVSS

DVDD

DECOUPLE

RFVDD

PAVDD

Figure 5.3. EFR32BG12 Typical Application Circuit: Configuration with DC-DC converter (PAVDD from VDD)

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Typical Connection Diagrams

5.2 RF Matching Networks

Typical RF matching network circuit diagrams are shown in Figure 5.4 Typical 2.4 GHz RF impedance-matching network circuits on

page 120 for applications in the 2.4GHz band, and in Figure 5.5 Typical Sub-GHz RF impedance-matching network circuits on page

120 for applications in the sub-GHz band. Application-specific component values can be found in the EFR32xG12 Reference Manual.

For low RF transmit power applications less than 13dBm, the two-element match is recommended. For OPNs supporting high power

RF transmission, the four-element match is recommended for high RF transmit power (> 13dBm).

4-Element Match for 2.4GHz Band

2-Element Match for 2.4GHz Band

PAVDD

2G4RF_IOP

2G4RF_ION

L0

L1

2G4RF_IOP

2G4RF_ION

50Ω

C0

C1

Figure 5.4. Typical 2.4 GHz RF impedance-matching network circuits

Sub-GHz Match Topology I (169-500 MHz)

PAVDD

L1

L2

C0

L3

C5

L5

L6

L7

SUBGRF_IN

SUBGRF_IP

50Ω

C2

C3

C4

C7

C8

C9

C10

L0

C1

L4

C6

BAL1

SUBGRF_ON

SUBGRF_OP

Sub-GHz Match Topology 2 (500-915 MHz)

C0

L3

PAVDD

L5

L6

SUBGRF_IN

50Ω

L0

C4

C7

C8

C9

SUBGRF_IP

L4

BAL1

C1

SUBGRF_ON

SUBGRF_OP

Figure 5.5. Typical Sub-GHz RF impedance-matching network circuits

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Typical Connection Diagrams

5.3 Other Connections

Other components or connections may be required to meet the system-level requirements. Application Note AN0002: "Hardware De-

sign Considerations" contains detailed information on these connections. Application Notes can be accessed on the Silicon Labs

website (www.silabs.com/32bit-appnotes).

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Pin Definitions

6. Pin Definitions

6.1 BGA125 2.4 GHz and Sub-GHz Device Pinout

Figure 6.1. BGA125 2.4 GHz and Sub-GHz Device Pinout

The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the sup-

ported features for each GPIO pin, see 6.7 GPIO Functionality Table or 6.8 Alternate Functionality Overview.

Table 6.1. BGA125 2.4 GHz and Sub-GHz Device Pinout

Pin Name

PF3

Pin(s) Description

Pin Name

PF1

Pin(s) Description

A1

A3

A5

A7

GPIO (5V)

A2

A4

A6

A8

GPIO (5V)

PC5

PC3

PC0

PC11

PC7

PC9

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Pin Definitions

Pin Name

DECOUPLE

VREGVDD

VREGVSS

Pin(s) Description

Decouple output for on-chip voltage

Pin Name

DVDD

Pin(s) Description

A9

regulator. An external decoupling ca-

pacitor is required at this pin.

A10

A12

B1

Digital power supply.

A11

Voltage regulator VDD input

VREGSW

PF8

DCDC regulator switching node

GPIO (5V)

A13

B11

B12

Voltage regulator VSS

PF2

PC4

PJ14

PC8

B2

B4

B6

B8

GPIO (5V)

PF0

PC1

B3

B5

B7

B9

GPIO (5V)

PC10

PC6

B10

F2

F11

M12

IOVDD

Digital IO power supply.

AVDD

B13

Analog power supply.

PF11

PF9

C1

C3

GPIO (5V)

GPIO

PF10

PC2

C2

C5

GPIO (5V)

GPIO

PJ15

PB14

PB12

PF13

PB11

PB9

C6

PB15

PB13

PF14

PF12

PB10

PK1

C10

C12

D1

C11

C13

D2

GPIO

GPIO (5V)

GPIO

D3

D11

D13

E2

D12

E1

GPIO (5V)

GPIO

PK0

PF15

E3

E5

E6

E7

E8

E9

F5

F6

F7

F8

F9

G5

G6

G7

G8

G9

H5

H6

H7

H8

H9

J5

VSS

Ground

PB8

E12

GPIO (5V)

J6

J7

J8

J9

K2

L2

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Pin Definitions

Pin Name

PB7

Pin(s) Description

Pin Name

PK2

Pin(s) Description

E13

F12

G1

GPIO (5V)

F1

F13

G2

GPIO (5V)

PB6

PI3

PF5

PF4

PI2

G11

G13

H2

PI1

G12

H1

PI0

PF7

PF6

PA9

H12

J1

J2

PA8

H13

GPIO (5V)

RFVDD

Radio power supply

PA7

PA5

PA4

J11

J13

K12

GPIO (5V)

GPIO

PA6

HFXTAL_N

PA3

J12

K1

GPIO (5V)

High Frequency Crystal input pin.

GPIO

K13

Brown-Out Detector Enable. This pin

may be left disconnected or tied to

AVDD.

HFXTAL_P

PA2

L1

High Frequency Crystal output pin.

BODEN

PA1

L10

L13

L12

GPIO

Reset input, active low. To apply an ex-

ternal reset source to this pin, it is re-

quired to only drive this pin low during

reset, and let the internal pull-up ensure

that reset is released.

M2

M3

M4

M5

N5

RESETn

PAVSS

M1

RFVSS

Radio Ground

M6

M7

Power Amplifier (PA) voltage regulator

VSS

M8

N8

Power Amplifier (PA) voltage regulator

VDD input

PAVDD

PD9

M9

GPIO (5V)

GPIO

PD11

PA0

M10

M13

GPIO (5V)

GPIO

PD13

M11

Sub GHz Differential RF output, positive

path.

Sub GHz Differential RF output, nega-

tive path.

SUBGRF_OP

SUBGRF_IP

N1

N3

SUBGRF_ON

SUBGRF_IN

N2

N4

Sub GHz Differential RF input, positive

path.

Sub GHz Differential RF input, negative

path.

2.4 GHz Differential RF input/output,

negative path. This pin should be exter-

nally grounded.

2.4 GHz Differential RF input/output,

positive path.

2G4RF_ION

N6

2G4RF_IOP

N7

PD8

PD12

N9

GPIO (5V)

GPIO

PD10

PD14

N10

N12

GPIO (5V)

GPIO

N11

N13

PD15

Note:

1. GPIO with 5V tolerance are indicated by (5V).

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Pin Definitions

6.2 BGA125 2.4 GHz Device Pinout

Figure 6.2. BGA125 2.4 GHz Device Pinout

The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the sup-

ported features for each GPIO pin, see 6.7 GPIO Functionality Table or 6.8 Alternate Functionality Overview.

Table 6.2. BGA125 2.4 GHz Device Pinout

Pin Name

PF3

Pin(s) Description

Pin Name

PF1

Pin(s) Description

A1

A3

A5

A7

GPIO (5V)

A2

A4

A6

A8

GPIO (5V)

PC5

PC3

PC0

PC11

PC7

PC9

Decouple output for on-chip voltage

regulator. An external decoupling ca-

pacitor is required at this pin.

DECOUPLE

VREGVDD

A9

DVDD

A10

A12

Digital power supply.

A11

Voltage regulator VDD input

VREGSW

DCDC regulator switching node

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Pin Definitions

Pin Name

Pin(s) Description

Pin Name

Pin(s) Description

A13

VREGVSS

B11

B12

Voltage regulator VSS

PF8

B1

GPIO (5V)

PF2

PC4

PJ14

PC8

B2

B4

B6

B8

GPIO (5V)

PF0

PC1

B3

B5

B7

B9

GPIO (5V)

PC10

PC6

B10

F2

F11

M12

IOVDD

Digital IO power supply.

AVDD

B13

Analog power supply.

PF11

PF9

C1

C3

GPIO (5V)

GPIO

PF10

PC2

C2

C5

GPIO (5V)

GPIO

PJ15

PB14

PB12

PF13

PB11

PB9

C6

PB15

PB13

PF14

PF12

PB10

PK1

C10

C12

D1

C11

C13

D2

GPIO

GPIO (5V)

GPIO

D3

D11

D13

E2

D12

E1

GPIO (5V)

GPIO

PK0

PF15

E3

E5

E6

E7

E8

E9

F5

F6

F7

F8

F9

G5

G6

G7

G8

G9

H5

H6

H7

H8

H9

J5

VSS

Ground

PB8

E12

GPIO (5V)

J6

J7

J8

J9

K2

L2

PB7

PB6

PF5

E13

F12

G1

GPIO (5V)

PK2

PI3

F1

F13

G2

GPIO (5V)

PF4

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Pin Definitions

Pin Name

PI2

Pin(s) Description

Pin Name

PI1

Pin(s) Description

G11

G13

H2

GPIO (5V)

G12

H1

GPIO (5V)

PI0

PF7

PF6

PA9

H12

J1

J2

PA8

H13

GPIO (5V)

RFVDD

Radio power supply

PA7

PA5

PA4

J11

J13

K12

GPIO (5V)

GPIO

PA6

HFXTAL_N

PA3

J12

K1

GPIO (5V)

High Frequency Crystal input pin.

GPIO

K13

Brown-Out Detector Enable. This pin

may be left disconnected or tied to

AVDD.

HFXTAL_P

PA2

L1

High Frequency Crystal output pin.

BODEN

PA1

L10

L13

L12

GPIO

Reset input, active low. To apply an ex-

ternal reset source to this pin, it is re-

quired to only drive this pin low during

reset, and let the internal pull-up ensure

that reset is released.

M2

M3

M4

M5

N5

RESETn

PAVSS

M1

RFVSS

Radio Ground

M6

M7

Power Amplifier (PA) voltage regulator

VSS

M8

N8

Power Amplifier (PA) voltage regulator

VDD input

PAVDD

PD9

M9

GPIO (5V)

GPIO

PD11

PA0

M10

M13

GPIO (5V)

GPIO

PD13

M11

N1

N2

N3

N4

2.4 GHz Differential RF input/output,

negative path. This pin should be exter-

nally grounded.

NC

No Connect.

2G4RF_ION

N6

2.4 GHz Differential RF input/output,

positive path.

2G4RF_IOP

N7

PD8

N9

GPIO (5V)

PD10

PD14

N10

N12

GPIO (5V)

GPIO

PD12

PD15

N11

N13

GPIO (5V)

GPIO

Note:

1. GPIO with 5V tolerance are indicated by (5V).

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Pin Definitions

6.3 QFN68 2.4 GHz and Sub-GHz Device Pinout

Figure 6.3. QFN68 2.4 GHz and Sub-GHz Device Pinout

The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the sup-

ported features for each GPIO pin, see 6.7 GPIO Functionality Table or 6.8 Alternate Functionality Overview.

Table 6.3. QFN68 2.4 GHz and Sub-GHz Device Pinout

Pin Name

VSS

Pin(s) Description

Pin Name

PC5

Pin(s) Description

0

2

4

6

Ground

1

3

5

7

GPIO (5V)

PF0

GPIO (5V)

PF1

PF2

PF3

PF8

PF9

9

PF10

PF4

8

GPIO (5V)

IOVDD

PF5

41

57

Digital IO power supply.

GPIO (5V)

10

11

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Pin Definitions

Pin Name

PF6

Pin(s) Description

Pin Name

PF7

Pin(s) Description

12

14

GPIO (5V)

13

15

GPIO (5V)

RFVDD

Radio power supply

HFXTAL_N

High Frequency Crystal input pin.

Reset input, active low. To apply an ex-

ternal reset source to this pin, it is re-

quired to only drive this pin low during

reset, and let the internal pull-up ensure

that reset is released.

HFXTAL_P

16

High Frequency Crystal output pin.

RESETn

17

Sub GHz Differential RF output, positive

path.

Sub GHz Differential RF output, nega-

tive path.

SUBGRF_OP

SUBGRF_IP

RFVSS

18

20

22

SUBGRF_ON

SUBGRF_IN

PAVSS

19

21

23

Sub GHz Differential RF input, positive

path.

Sub GHz Differential RF input, negative

path.

Power Amplifier (PA) voltage regulator

VSS

Radio Ground

2.4 GHz Differential RF input/output,

negative path. This pin should be exter-

nally grounded.

2.4 GHz Differential RF input/output,

positive path.

2G4RF_ION

PAVDD

24

26

2G4RF_IOP

PD8

25

27

Power Amplifier (PA) voltage regulator

VDD input

GPIO (5V)

PD9

PD11

PD13

PD15

PA1

28

30

32

34

36

38

40

43

45

47

49

51

53

GPIO (5V)

PD10

PD12

PD14

PA0

29

31

33

35

37

39

42

44

46

48

50

52

54

GPIO (5V)

GPIO

PA2

GPIO

PA3

GPIO

PA4

GPIO

PA5

GPIO (5V)

PB7

GPIO (5V)

PB8

GPIO (5V)

PB9

GPIO (5V)

PB10

PB12

AVDD

PB15

VREGSW

GPIO (5V)

PB11

GPIO

PB13

GPIO

Analog power supply.

GPIO

PB14

GPIO

VREGVSS

VREGVDD

Voltage regulator VSS

Voltage regulator VDD input

DCDC regulator switching node

Decouple output for on-chip voltage

regulator. An external decoupling ca-

pacitor is required at this pin.

DVDD

55

Digital power supply.

DECOUPLE

56

PC6

PC8

58

60

62

64

66

68

GPIO (5V)

PC7

PC9

PC11

PC1

PC3

59

61

63

65

67

GPIO (5V)

PC10

PC0

PC2

PC4

Note:

1. GPIO with 5V tolerance are indicated by (5V).

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Pin Definitions

6.4 QFN68 2.4 GHz Device Pinout

Figure 6.4. QFN68 2.4 GHz Device Pinout

The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the sup-

ported features for each GPIO pin, see 6.7 GPIO Functionality Table or 6.8 Alternate Functionality Overview.

Table 6.4. QFN68 2.4 GHz Device Pinout

Pin Name

VSS

Pin(s) Description

Pin Name

PC5

Pin(s) Description

0

2

4

6

Ground

1

3

5

7

GPIO (5V)

PF0

GPIO (5V)

PF1

PF2

PF3

PF8

PF9

9

PF10

PF4

8

GPIO (5V)

IOVDD

PF5

41

57

Digital IO power supply.

GPIO (5V)

10

11

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Pin Definitions

Pin Name

PF6

Pin(s) Description

Pin Name

PF7

Pin(s) Description

12

14

GPIO (5V)

13

15

GPIO (5V)

RFVDD

Radio power supply

HFXTAL_N

High Frequency Crystal input pin.

Reset input, active low. To apply an ex-

ternal reset source to this pin, it is re-

quired to only drive this pin low during

reset, and let the internal pull-up ensure

that reset is released.

HFXTAL_P

16

High Frequency Crystal output pin.

RESETn

RFVSS

17

22

18

19

20

21

NC

No Connect.

Radio Ground

2.4 GHz Differential RF input/output,

negative path. This pin should be exter-

nally grounded.

Power Amplifier (PA) voltage regulator

VSS

PAVSS

23

25

2G4RF_ION

PAVDD

24

26

2.4 GHz Differential RF input/output,

positive path.

Power Amplifier (PA) voltage regulator

VDD input

2G4RF_IOP

PD8

PD10

PD12

PD14

PA0

27

29

31

33

35

37

39

42

44

46

48

50

52

54

GPIO (5V)

GPIO

PD9

PD11

PD13

PD15

PA1

28

30

32

34

36

38

40

43

45

47

49

51

53

55

GPIO (5V)

GPIO

PA2

GPIO

PA3

GPIO

PA4

GPIO

PA5

GPIO (5V)

PB7

GPIO (5V)

GPIO

PB8

GPIO (5V)

PB9

PB10

PB12

AVDD

PB15

VREGSW

DVDD

GPIO (5V)

PB11

PB13

PB14

VREGVSS

VREGVDD

GPIO

Analog power supply.

GPIO

Voltage regulator VSS

Voltage regulator VDD input

DCDC regulator switching node

Digital power supply.

Decouple output for on-chip voltage

regulator. An external decoupling ca-

pacitor is required at this pin.

DECOUPLE

56

PC6

58

GPIO (5V)

PC7

PC9

59

61

63

65

67

GPIO (5V)

PC8

PC10

PC0

PC2

PC4

60

62

64

66

68

GPIO (5V)

PC11

PC1

PC3

Note:

1. GPIO with 5V tolerance are indicated by (5V).

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

6.5 QFN48 2.4 GHz and Sub-GHz Device Pinout

Figure 6.5. QFN48 2.4 GHz and Sub-GHz Device Pinout

The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the sup-

ported features for each GPIO pin, see 6.7 GPIO Functionality Table or 6.8 Alternate Functionality Overview.

Table 6.5. QFN48 2.4 GHz and Sub-GHz Device Pinout

Pin Name

VSS

Pin(s) Description

Pin Name

PF0

Pin(s) Description

0

2

Ground

1

3

GPIO (5V)

PF1

GPIO (5V)

PF2

GPIO (5V)

PF3

4

GPIO (5V)

PF4

5

GPIO (5V)

PF5

6

GPIO (5V)

PF6

7

GPIO (5V)

PF7

8

GPIO (5V)

RFVDD

HFXTAL_P

9

Radio power supply

High Frequency Crystal output pin.

HFXTAL_N

10

High Frequency Crystal input pin.

11

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Pin Definitions

Pin Name

Pin(s) Description

Reset input, active low. To apply an ex-

Pin Name

Pin(s) Description

ternal reset source to this pin, it is re-

quired to only drive this pin low during

reset, and let the internal pull-up ensure

that reset is released.

Sub GHz Differential RF output, positive

path.

RESETn

12

SUBGRF_OP

13

Sub GHz Differential RF output, nega-

tive path.

Sub GHz Differential RF input, positive

path.

SUBGRF_ON

SUBGRF_IN

14

16

SUBGRF_IP

RFVSS

15

17

Sub GHz Differential RF input, negative

path.

Radio Ground

2.4 GHz Differential RF input/output,

negative path. This pin should be exter-

nally grounded.

Power Amplifier (PA) voltage regulator

VSS

PAVSS

18

20

2G4RF_ION

PAVDD

19

21

2.4 GHz Differential RF input/output,

positive path.

Power Amplifier (PA) voltage regulator

VDD input

2G4RF_IOP

PD13

PD15

PA1

22

24

26

28

30

32

34

36

38

GPIO

PD14

PA0

23

25

27

29

31

33

35

37

39

GPIO

PA2

GPIO

PA3

GPIO

PA4

GPIO

PA5

GPIO (5V)

PB11

GPIO

PB12

AVDD

PB15

VREGSW

GPIO

PB13

GPIO

Analog power supply.

GPIO

PB14

GPIO

VREGVSS

VREGVDD

Voltage regulator VSS

Voltage regulator VDD input

DCDC regulator switching node

Decouple output for on-chip voltage

regulator. An external decoupling ca-

pacitor is required at this pin.

DVDD

40

Digital power supply.

DECOUPLE

41

IOVDD

PC7

42

44

46

48

Digital IO power supply.

GPIO (5V)

PC6

PC8

43

45

47

GPIO (5V)

PC9

GPIO (5V)

PC10

PC11

Note:

GPIO (5V)

1. GPIO with 5V tolerance are indicated by (5V).

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Pin Definitions

6.6 QFN48 2.4 GHz Device Pinout

Figure 6.6. QFN48 2.4 GHz Device Pinout

The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the sup-

ported features for each GPIO pin, see 6.7 GPIO Functionality Table or 6.8 Alternate Functionality Overview.

Table 6.6. QFN48 2.4 GHz Device Pinout

Pin Name

VSS

Pin(s) Description

Pin Name

PF0

Pin(s) Description

0

2

Ground

1

3

GPIO (5V)

PF1

GPIO (5V)

PF2

GPIO (5V)

PF3

4

GPIO (5V)

PF4

5

GPIO (5V)

PF5

6

GPIO (5V)

PF6

7

GPIO (5V)

PF7

8

GPIO (5V)

RFVDD

HFXTAL_P

9

Radio power supply

High Frequency Crystal output pin.

HFXTAL_N

10

High Frequency Crystal input pin.

11

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Pin Definitions

Pin Name

Pin(s) Description

Reset input, active low. To apply an ex-

Pin Name

Pin(s) Description

ternal reset source to this pin, it is re-

quired to only drive this pin low during

reset, and let the internal pull-up ensure

that reset is released.

RESETn

12

NC

13

No Connect.

Power Amplifier (PA) voltage regulator

VSS

RFVSS

2G4RF_ION

PAVDD

14

16

18

Radio Ground

PAVSS

2G4RF_IOP

PD10

15

17

19

2.4 GHz Differential RF input/output,

negative path. This pin should be exter-

nally grounded.

2.4 GHz Differential RF input/output,

positive path.

Power Amplifier (PA) voltage regulator

VDD input

GPIO (5V)

PD11

PD13

PD15

PA1

20

22

24

26

28

30

32

34

36

38

GPIO (5V)

PD12

PD14

21

23

25

27

29

31

33

35

37

39

GPIO (5V)

GPIO

PA0

GPIO

PA2

GPIO

PA3

GPIO

PA4

GPIO

PA5

GPIO (5V)

PB11

GPIO

PB12

AVDD

PB15

VREGSW

GPIO

PB13

GPIO

Analog power supply.

GPIO

PB14

GPIO

VREGVSS

VREGVDD

Voltage regulator VSS

Voltage regulator VDD input

DCDC regulator switching node

Decouple output for on-chip voltage

regulator. An external decoupling ca-

pacitor is required at this pin.

DVDD

40

Digital power supply.

DECOUPLE

41

IOVDD

PC7

42

44

46

48

Digital IO power supply.

GPIO (5V)

PC6

PC8

43

45

47

GPIO (5V)

PC9

GPIO (5V)

PC10

PC11

Note:

GPIO (5V)

1. GPIO with 5V tolerance are indicated by (5V).

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Pin Definitions

6.7 GPIO Functionality Table

A wide selection of alternate functionality is available for multiplexing to various pins. The following table shows the name of each GPIO

pin, followed by the functionality available on that pin. Refer to 6.8 Alternate Functionality Overview for a list of GPIO locations available

for each function.

Table 6.7. GPIO Functionality Table

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

Radio

Other

TIM0_CC0 #0

TIM0_CC1 #31

TIM0_CC2 #30

TIM0_CDTI0 #29

TIM0_CDTI1 #28

TIM0_CDTI2 #27

TIM1_CC0 #0

TIM1_CC1 #31

TIM1_CC2 #30

TIM1_CC3 #29

WTIM0_CC0 #0 LE-

TIM0_OUT0 #0 LE-

TIM0_OUT1 #31

PCNT0_S0IN #0

PCNT0_S1IN #31

US0_TX #0 US0_RX

#31 US0_CLK #30

US0_CS #29

US0_CTS #28

US0_RTS #27

US1_TX #0 US1_RX FRC_DFRAME #30

#31 US1_CLK #30

US1_CS #29

FRC_DCLK #0

FRC_DOUT #31

CMU_CLK1 #0

PRS_CH6 #0

PRS_CH7 #10

PRS_CH8 #9

PRS_CH9 #8

ACMP0_O #0

ACMP1_O #0

LES_CH8

BUSDY BUSCX

ADC0_EXTN

MODEM_DCLK #0

MODEM_DIN #31

MODEM_DOUT #30

MODEM_ANT0 #29

MODEM_ANT1 #28

PA0

US1_CTS #28

US1_RTS #27

LEU0_TX #0

LEU0_RX #31

I2C0_SDA #0

I2C0_SCL #31

TIM0_CC0 #1

TIM0_CC1 #0

US0_TX #1 US0_RX

#0 US0_CLK #31

US0_CS #30

US0_CTS #29

US0_RTS #28

US1_TX #1 US1_RX FRC_DFRAME #31

#0 US1_CLK #31

US1_CS #30

US1_CTS #29

US1_RTS #28

LEU0_TX #1

LEU0_RX #0

I2C0_SDA #1

I2C0_SCL #0

TIM0_CC2 #31

TIM0_CDTI0 #30

TIM0_CDTI1 #29

TIM0_CDTI2 #28

TIM1_CC0 #1

FRC_DCLK #1

FRC_DOUT #0

CMU_CLK0 #0

PRS_CH6 #1

PRS_CH7 #0

PRS_CH8 #10

PRS_CH9 #9

ACMP0_O #1

ACMP1_O #1

LES_CH9

BUSCY BUSDX

ADC0_EXTP

VDAC0_EXT

MODEM_DCLK #1

MODEM_DIN #0

MODEM_DOUT #31

MODEM_ANT0 #30

MODEM_ANT1 #29

PA1

TIM1_CC1 #0

TIM1_CC2 #31

TIM1_CC3 #30

WTIM0_CC0 #1 LE-

TIM0_OUT0 #1 LE-

TIM0_OUT1 #0

PCNT0_S0IN #1

PCNT0_S1IN #0

TIM0_CC0 #2

TIM0_CC1 #1

TIM0_CC2 #0

TIM0_CDTI0 #31

TIM0_CDTI1 #30

TIM0_CDTI2 #29

TIM1_CC0 #2

US0_TX #2 US0_RX

#1 US0_CLK #0

US0_CS #31

US0_CTS #30

US0_RTS #29

US1_TX #2 US1_RX

#1 US1_CLK #0

US1_CS #31

FRC_DCLK #2

FRC_DOUT #1

PRS_CH6 #2

PRS_CH7 #1

PRS_CH8 #0

PRS_CH9 #10

ACMP0_O #2

ACMP1_O #2

LES_CH10

VDAC0_OUT1ALT /

OPA1_OUTALT #1

BUSDY BUSCX

OPA0_P

FRC_DFRAME #0

MODEM_DCLK #2

MODEM_DIN #1

MODEM_DOUT #0

MODEM_ANT0 #31

MODEM_ANT1 #30

TIM1_CC1 #1

TIM1_CC2 #0

PA2

TIM1_CC3 #31

WTIM0_CC0 #2

WTIM0_CC1 #0 LE-

TIM0_OUT0 #2 LE-

TIM0_OUT1 #1

PCNT0_S0IN #2

PCNT0_S1IN #1

US1_CTS #30

US1_RTS #29

LEU0_TX #2

LEU0_RX #1

I2C0_SDA #2

I2C0_SCL #1

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

Radio

Other

TIM0_CC0 #3

TIM0_CC1 #2

TIM0_CC2 #1

TIM0_CDTI0 #0

TIM0_CDTI1 #31

TIM0_CDTI2 #30

TIM1_CC0 #3

US0_TX #3 US0_RX

#2 US0_CLK #1

US0_CS #0

US0_CTS #31

US0_RTS #30

US1_TX #3 US1_RX

#2 US1_CLK #1

US1_CS #0

FRC_DCLK #3

FRC_DOUT #2

PRS_CH6 #3

PRS_CH7 #2

PRS_CH8 #1

PRS_CH9 #0

ACMP0_O #3

ACMP1_O #3

LES_CH11

FRC_DFRAME #1

MODEM_DCLK #3

MODEM_DIN #2

MODEM_DOUT #1

MODEM_ANT0 #0

MODEM_ANT1 #31

BUSCY BUSDX

VDAC0_OUT0 /

OPA0_OUT

TIM1_CC1 #2

TIM1_CC2 #1

PA3

TIM1_CC3 #0

US1_CTS #31

US1_RTS #30

LEU0_TX #3

LEU0_RX #2

I2C0_SDA #3

I2C0_SCL #2

WTIM0_CC0 #3

WTIM0_CC1 #1 LE-

TIM0_OUT0 #3 LE-

TIM0_OUT1 #2

PCNT0_S0IN #3

PCNT0_S1IN #2

GPIO_EM4WU8

TIM0_CC0 #4

TIM0_CC1 #3

TIM0_CC2 #2

TIM0_CDTI0 #1

TIM0_CDTI1 #0

TIM0_CDTI2 #31

TIM1_CC0 #4

TIM1_CC1 #3

TIM1_CC2 #2

TIM1_CC3 #1

WTIM0_CC0 #4

WTIM0_CC1 #2

WTIM0_CC2 #0 LE-

TIM0_OUT0 #4 LE-

TIM0_OUT1 #3

PCNT0_S0IN #4

PCNT0_S1IN #3

US0_TX #4 US0_RX

#3 US0_CLK #2

US0_CS #1

US0_CTS #0

FRC_DCLK #4

FRC_DOUT #3

PRS_CH6 #4

PRS_CH7 #3

PRS_CH8 #2

PRS_CH9 #1

ACMP0_O #4

ACMP1_O #4

LES_CH12

US0_RTS #31

US1_TX #4 US1_RX

#3 US1_CLK #2

US1_CS #1

VDAC0_OUT1ALT /

OPA1_OUTALT #2

BUSDY BUSCX

OPA0_N

FRC_DFRAME #2

MODEM_DCLK #4

MODEM_DIN #3

MODEM_DOUT #2

MODEM_ANT0 #1

MODEM_ANT1 #0

PA4

US1_CTS #0

US1_RTS #31

LEU0_TX #4

LEU0_RX #3

I2C0_SDA #4

I2C0_SCL #3

US0_TX #5 US0_RX

#4 US0_CLK #3

US0_CS #2

TIM0_CC0 #5

TIM0_CC1 #4

TIM0_CC2 #3

US0_CTS #1

TIM0_CDTI0 #2

TIM0_CDTI1 #1

TIM0_CDTI2 #0

TIM1_CC0 #5

TIM1_CC1 #4

TIM1_CC2 #3

US0_RTS #0

US1_TX #5 US1_RX

#4 US1_CLK #3

US1_CS #2

US1_CTS #1

US1_RTS #0

US2_TX #0 US2_RX

#31 US2_CLK #30

US2_CS #29

CMU_CLKI0 #4

PRS_CH6 #5

PRS_CH7 #4

PRS_CH8 #3

PRS_CH9 #2

ACMP0_O #5

ACMP1_O #5

LES_CH13

FRC_DCLK #5

FRC_DOUT #4

FRC_DFRAME #3

MODEM_DCLK #5

MODEM_DIN #4

MODEM_DOUT #3

MODEM_ANT0 #2

MODEM_ANT1 #1

VDAC0_OUT0ALT /

OPA0_OUTALT #0

BUSCY BUSDX

PA5

TIM1_CC3 #2

WTIM0_CC0 #5

WTIM0_CC1 #3

WTIM0_CC2 #1 LE-

TIM0_OUT0 #5 LE-

TIM0_OUT1 #4

PCNT0_S0IN #5

PCNT0_S1IN #4

US2_CTS #28

US2_RTS #27

LEU0_TX #5

LEU0_RX #4

I2C0_SDA #5

I2C0_SCL #4

ETM_TCLK #1

WTIM0_CC0 #6

WTIM0_CC1 #4

WTIM0_CC2 #2

PCNT1_S0IN #0

PCNT1_S1IN #31

PCNT2_S0IN #0

PCNT2_S1IN #31

US2_TX #1 US2_RX

#0 US2_CLK #31

US2_CS #30

LES_CH14

ETM_TD0 #1

PA6

BUSDY BUSCX

US2_CTS #29

US2_RTS #28

I2C1_SDA #0

I2C1_SCL #31

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Timers Communication Radio

Analog

Other

WTIM0_CC0 #7

WTIM0_CC1 #5

WTIM0_CC2 #3

PCNT1_S0IN #1

PCNT1_S1IN #0

PCNT2_S0IN #1

PCNT2_S1IN #0

US2_TX #2 US2_RX

#1 US2_CLK #0

US2_CS #31

LES_CH15

ETM_TD1 #1

PA7

BUSCY BUSDX

US2_CTS #30

US2_RTS #29

I2C1_SDA #1

I2C1_SCL #0

WTIM0_CC0 #8

WTIM0_CC1 #6

WTIM0_CC2 #4

WTIM0_CDTI0 #0

PCNT1_S0IN #2

PCNT1_S1IN #1

PCNT2_S0IN #2

PCNT2_S1IN #1

US2_TX #3 US2_RX

#2 US2_CLK #1

US2_CS #0

BUSACMP0Y BU-

SACMP0X

LES_ALTEX0

ETM_TD2 #1

PA8

US2_CTS #31

US2_RTS #30

I2C1_SDA #2

I2C1_SCL #1

WTIM0_CC0 #9

WTIM0_CC1 #7

WTIM0_CC2 #5

WTIM0_CDTI0 #1

PCNT1_S0IN #3

PCNT1_S1IN #2

PCNT2_S0IN #3

PCNT2_S1IN #2

US2_TX #4 US2_RX

#3 US2_CLK #2

US2_CS #1

BUSACMP0Y BU-

SACMP0X

LES_ALTEX1

ETM_TD3 #1

PA9

US2_CTS #0

US2_RTS #31

I2C1_SDA #3

I2C1_SCL #2

US2_TX #9 US2_RX

#8 US2_CLK #7

US2_CS #6

WTIM0_CC0 #10

WTIM0_CC1 #8

WTIM0_CC2 #6

WTIM0_CDTI0 #2

WTIM0_CDTI1 #0

PCNT1_S0IN #6

PCNT1_S1IN #5

PCNT2_S0IN #6

PCNT2_S1IN #5

US2_CTS #5

US2_RTS #4

US3_TX #10

US3_RX #9

US3_CLK #8

US3_CS #7

US3_CTS #6

US3_RTS #5

I2C1_SDA #6

I2C1_SCL #5

CMU_CLKI0 #3

ETM_TD1 #2

PB6

BUSDY BUSCX

US2_TX #10

US2_RX #9

US2_CLK #8

US2_CS #7

US2_CTS #6

US2_RTS #5

US3_TX #11

US3_RX #10

US3_CLK #9

US3_CS #8

US3_CTS #7

US3_RTS #6

I2C1_SDA #7

I2C1_SCL #6

WTIM0_CC0 #11

WTIM0_CC1 #9

WTIM0_CC2 #7

WTIM0_CDTI0 #3

WTIM0_CDTI1 #1

PCNT1_S0IN #7

PCNT1_S1IN #6

PCNT2_S0IN #7

PCNT2_S1IN #6

PB7

BUSCY BUSDX

ETM_TD2 #2

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Timers Communication Radio

Analog

Other

US2_TX #11

US2_RX #10

US2_CLK #9

US2_CS #8

US2_CTS #7

US2_RTS #6

US3_TX #12

US3_RX #11

US3_CLK #10

US3_CS #9

WTIM0_CC0 #12

WTIM0_CC1 #10

WTIM0_CC2 #8

WTIM0_CDTI0 #4

WTIM0_CDTI1 #2

WTIM0_CDTI2 #0

PCNT1_S0IN #8

PCNT1_S1IN #7

PCNT2_S0IN #8

PCNT2_S1IN #7

PB8

BUSDY BUSCX

ETM_TD3 #2

US3_CTS #8

US3_RTS #7

I2C1_SDA #8

I2C1_SCL #7

US2_TX #12

US2_RX #11

US2_CLK #10

US2_CS #9

WTIM0_CC0 #13

WTIM0_CC1 #11

WTIM0_CC2 #9

WTIM0_CDTI0 #5

WTIM0_CDTI1 #3

WTIM0_CDTI2 #1

PCNT1_S0IN #9

PCNT1_S1IN #8

PCNT2_S0IN #9

PCNT2_S1IN #8

US2_CTS #8

US2_RTS #7

US3_TX #13

US3_RX #12

US3_CLK #11

US3_CS #10

US3_CTS #9

US3_RTS #8

I2C1_SDA #9

I2C1_SCL #8

OPA2_OUTALT #0

BUSCY BUSDX

PB9

US2_TX #13

US2_RX #12

US2_CLK #11

US2_CS #10

US2_CTS #9

US2_RTS #8

US3_TX #14

US3_RX #13

US3_CLK #12

US3_CS #11

US3_CTS #10

US3_RTS #9

I2C1_SDA #10

I2C1_SCL #9

WTIM0_CC0 #14

WTIM0_CC1 #12

WTIM0_CC2 #10

WTIM0_CDTI0 #6

WTIM0_CDTI1 #4

WTIM0_CDTI2 #2

PCNT1_S0IN #10

PCNT1_S1IN #9

PCNT2_S0IN #10

PCNT2_S1IN #9

OPA2_OUTALT #1

BUSDY BUSCX

PB10

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Timers Communication Radio

Analog

Other

TIM0_CC0 #6

TIM0_CC1 #5

TIM0_CC2 #4

US0_TX #6 US0_RX

#5 US0_CLK #4

US0_CS #3

TIM0_CDTI0 #3

TIM0_CDTI1 #2

TIM0_CDTI2 #1

TIM1_CC0 #6

US0_CTS #2

US0_RTS #1

US1_TX #6 US1_RX

#5 US1_CLK #4

US1_CS #3

FRC_DCLK #6

FRC_DOUT #5

TIM1_CC1 #5

PRS_CH6 #6

PRS_CH7 #5

PRS_CH8 #4

PRS_CH9 #3

ACMP0_O #6

ACMP1_O #6

TIM1_CC2 #4

TIM1_CC3 #3

US1_CTS #2

US1_RTS #1

US3_TX #15

US3_RX #14

US3_CLK #13

US3_CS #12

US3_CTS #11

US3_RTS #10

LEU0_TX #6

FRC_DFRAME #4

MODEM_DCLK #6

MODEM_DIN #5

MODEM_DOUT #4

MODEM_ANT0 #3

MODEM_ANT1 #2

BUSCY BUSDX

OPA2_P

PB11

WTIM0_CC0 #15

WTIM0_CC1 #13

WTIM0_CC2 #11

WTIM0_CDTI0 #7

WTIM0_CDTI1 #5

WTIM0_CDTI2 #3

LETIM0_OUT0 #6

LETIM0_OUT1 #5

PCNT0_S0IN #6

PCNT0_S1IN #5

LEU0_RX #5

I2C0_SDA #6

I2C0_SCL #5

TIM0_CC0 #7

TIM0_CC1 #6

TIM0_CC2 #5

TIM0_CDTI0 #4

TIM0_CDTI1 #3

TIM0_CDTI2 #2

TIM1_CC0 #7

TIM1_CC1 #6

TIM1_CC2 #5

US0_TX #7 US0_RX

#6 US0_CLK #5

US0_CS #4

US0_CTS #3

US0_RTS #2

US1_TX #7 US1_RX

#6 US1_CLK #5

US1_CS #4

FRC_DCLK #7

FRC_DOUT #6

PRS_CH6 #7

PRS_CH7 #6

PRS_CH8 #5

PRS_CH9 #4

ACMP0_O #7

ACMP1_O #7

FRC_DFRAME #5

MODEM_DCLK #7

MODEM_DIN #6

MODEM_DOUT #5

MODEM_ANT0 #4

MODEM_ANT1 #3

TIM1_CC3 #4

BUSDY BUSCX

OPA2_OUT

PB12

WTIM0_CC0 #16

WTIM0_CC1 #14

WTIM0_CC2 #12

WTIM0_CDTI0 #8

WTIM0_CDTI1 #6

WTIM0_CDTI2 #4

WTIM1_CC0 #0 LE-

TIM0_OUT0 #7 LE-

TIM0_OUT1 #6

PCNT0_S0IN #7

PCNT0_S1IN #6

US1_CTS #3

US1_RTS #2

LEU0_TX #7

LEU0_RX #6

I2C0_SDA #7

I2C0_SCL #6

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Rev. 1.4 | 140

®

EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

Radio

Other

TIM0_CC0 #8

TIM0_CC1 #7

TIM0_CC2 #6

TIM0_CDTI0 #5

TIM0_CDTI1 #4

TIM0_CDTI2 #3

TIM1_CC0 #8

TIM1_CC1 #7

TIM1_CC2 #6

US0_TX #8 US0_RX

#7 US0_CLK #6

US0_CS #5

US0_CTS #4

US0_RTS #3

US1_TX #8 US1_RX

#7 US1_CLK #6

US1_CS #5

CMU_CLKI0 #0

PRS_CH6 #8

PRS_CH7 #7

PRS_CH8 #6

PRS_CH9 #5

ACMP0_O #8

ACMP1_O #8

DBG_SWO #1

GPIO_EM4WU9

FRC_DCLK #8

FRC_DOUT #7

FRC_DFRAME #6

MODEM_DCLK #8

MODEM_DIN #7

MODEM_DOUT #6

MODEM_ANT0 #5

MODEM_ANT1 #4

TIM1_CC3 #5

BUSCY BUSDX

OPA2_N

PB13

WTIM0_CC0 #17

WTIM0_CC1 #15

WTIM0_CC2 #13

WTIM0_CDTI0 #9

WTIM0_CDTI1 #7

WTIM0_CDTI2 #5

WTIM1_CC0 #1 LE-

TIM0_OUT0 #8 LE-

TIM0_OUT1 #7

PCNT0_S0IN #8

PCNT0_S1IN #7

US1_CTS #4

US1_RTS #3

LEU0_TX #8

LEU0_RX #7

I2C0_SDA #8

I2C0_SCL #7

TIM0_CC0 #9

TIM0_CC1 #8

TIM0_CC2 #7

TIM0_CDTI0 #6

TIM0_CDTI1 #5

TIM0_CDTI2 #4

TIM1_CC0 #9

US0_TX #9 US0_RX

#8 US0_CLK #7

US0_CS #6

TIM1_CC1 #8

TIM1_CC2 #7

TIM1_CC3 #6

US0_CTS #5

US0_RTS #4

US1_TX #9 US1_RX

#8 US1_CLK #7

US1_CS #6

FRC_DCLK #9

FRC_DOUT #8

CMU_CLK1 #1

PRS_CH6 #9

PRS_CH7 #8

PRS_CH8 #7

PRS_CH9 #6

ACMP0_O #9

ACMP1_O #9

FRC_DFRAME #7

MODEM_DCLK #9

MODEM_DIN #8

MODEM_DOUT #7

MODEM_ANT0 #6

MODEM_ANT1 #5

BUSDY BUSCX

LFXTAL_N

WTIM0_CC0 #18

WTIM0_CC1 #16

WTIM0_CC2 #14

WTIM0_CDTI0 #10

WTIM0_CDTI1 #8

WTIM0_CDTI2 #6

WTIM1_CC0 #2

WTIM1_CC1 #0 LE-

TIM0_OUT0 #9 LE-

TIM0_OUT1 #8

PCNT0_S0IN #9

PCNT0_S1IN #8

PB14

US1_CTS #5

US1_RTS #4

LEU0_TX #9

LEU0_RX #8

I2C0_SDA #9

I2C0_SCL #8

silabs.com | Building a more connected world.

Rev. 1.4 | 141

®

EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

Radio

Other

TIM0_CC0 #10

TIM0_CC1 #9

TIM0_CC2 #8

TIM0_CDTI0 #7

TIM0_CDTI1 #6

TIM0_CDTI2 #5

TIM1_CC0 #10

TIM1_CC1 #9

US0_TX #10

US0_RX #9

US0_CLK #8

US0_CS #7

US0_CTS #6

US0_RTS #5

US1_TX #10

US1_RX #9

US1_CLK #8

US1_CS #7

US1_CTS #6

US1_RTS #5

LEU0_TX #10

LEU0_RX #9

I2C0_SDA #10

I2C0_SCL #9

FRC_DCLK #10

FRC_DOUT #9

CMU_CLK0 #1

PRS_CH6 #10

PRS_CH7 #9

PRS_CH8 #8

PRS_CH9 #7

ACMP0_O #10

ACMP1_O #10

TIM1_CC2 #8

TIM1_CC3 #7

FRC_DFRAME #8

MODEM_DCLK #10

MODEM_DIN #9

MODEM_DOUT #8

MODEM_ANT0 #7

MODEM_ANT1 #6

BUSCY BUSDX

LFXTAL_P

WTIM0_CC0 #19

WTIM0_CC1 #17

WTIM0_CC2 #15

WTIM0_CDTI0 #11

WTIM0_CDTI1 #9

WTIM0_CDTI2 #7

WTIM1_CC0 #3

WTIM1_CC1 #1 LE-

TIM0_OUT0 #10 LE-

TIM0_OUT1 #9

PCNT0_S0IN #10

PCNT0_S1IN #9

PB15

WTIM0_CC0 #20

WTIM0_CC1 #18

WTIM0_CC2 #16

WTIM0_CDTI0 #12

WTIM0_CDTI1 #10

WTIM0_CDTI2 #8

WTIM1_CC0 #4

WTIM1_CC1 #2

WTIM1_CC2 #0

PCNT1_S0IN #13

PCNT1_S1IN #12

PCNT2_S0IN #13

PCNT2_S1IN #12

US3_TX #18

US3_RX #17

US3_CLK #16

US3_CS #15

US3_CTS #14

US3_RTS #13

I2C1_SDA #13

I2C1_SCL #12

PC0

BUSBY BUSAX

WTIM0_CC0 #21

WTIM0_CC1 #19

WTIM0_CC2 #17

WTIM0_CDTI0 #13

WTIM0_CDTI1 #11

WTIM0_CDTI2 #9

WTIM1_CC0 #5

WTIM1_CC1 #3

WTIM1_CC2 #1

PCNT1_S0IN #14

PCNT1_S1IN #13

PCNT2_S0IN #14

PCNT2_S1IN #13

US3_TX #19

US3_RX #18

US3_CLK #17

US3_CS #16

US3_CTS #15

US3_RTS #14

I2C1_SDA #14

I2C1_SCL #13

PC1

BUSAY BUSBX

silabs.com | Building a more connected world.

Rev. 1.4 | 142

®

EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

Radio

Other

WTIM0_CC0 #22

WTIM0_CC1 #20

WTIM0_CC2 #18

WTIM0_CDTI0 #14

WTIM0_CDTI1 #12

WTIM0_CDTI2 #10

WTIM1_CC0 #6

WTIM1_CC1 #4

WTIM1_CC2 #2

WTIM1_CC3 #0

PCNT1_S0IN #15

PCNT1_S1IN #14

PCNT2_S0IN #15

PCNT2_S1IN #14

US3_TX #20

US3_RX #19

US3_CLK #18

US3_CS #17

US3_CTS #16

US3_RTS #15

I2C1_SDA #15

I2C1_SCL #14

PC2

BUSBY BUSAX

WTIM0_CC0 #23

WTIM0_CC1 #21

WTIM0_CC2 #19

WTIM0_CDTI0 #15

WTIM0_CDTI1 #13

WTIM0_CDTI2 #11

WTIM1_CC0 #7

WTIM1_CC1 #5

WTIM1_CC2 #3

WTIM1_CC3 #1

PCNT1_S0IN #16

PCNT1_S1IN #15

PCNT2_S0IN #16

PCNT2_S1IN #15

US3_TX #21

US3_RX #20

US3_CLK #19

US3_CS #18

US3_CTS #17

US3_RTS #16

I2C1_SDA #16

I2C1_SCL #15

PC3

PC4

PC5

BUSAY BUSBX

BUSBY BUSAX

BUSAY BUSBX

WTIM0_CC0 #24

WTIM0_CC1 #22

WTIM0_CC2 #20

WTIM0_CDTI0 #16

WTIM0_CDTI1 #14

WTIM0_CDTI2 #12

WTIM1_CC0 #8

WTIM1_CC1 #6

WTIM1_CC2 #4

WTIM1_CC3 #2

PCNT1_S0IN #17

PCNT1_S1IN #16

PCNT2_S0IN #17

PCNT2_S1IN #16

US3_TX #22

US3_RX #21

US3_CLK #20

US3_CS #19

US3_CTS #18

US3_RTS #17

I2C1_SDA #17

I2C1_SCL #16

WTIM0_CC0 #25

WTIM0_CC1 #23

WTIM0_CC2 #21

WTIM0_CDTI0 #17

WTIM0_CDTI1 #15

WTIM0_CDTI2 #13

WTIM1_CC0 #9

WTIM1_CC1 #7

WTIM1_CC2 #5

WTIM1_CC3 #3

PCNT1_S0IN #18

PCNT1_S1IN #17

PCNT2_S0IN #18

PCNT2_S1IN #17

US3_TX #23

US3_RX #22

US3_CLK #21

US3_CS #20

US3_CTS #19

US3_RTS #18

I2C1_SDA #18

I2C1_SCL #17

silabs.com | Building a more connected world.

Rev. 1.4 | 143

®

EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

Radio

Other

TIM0_CC0 #11

TIM0_CC1 #10

TIM0_CC2 #9

TIM0_CDTI0 #8

TIM0_CDTI1 #7

TIM0_CDTI2 #6

TIM1_CC0 #11

US0_TX #11

US0_RX #10

US0_CLK #9

US0_CS #8

TIM1_CC1 #10

CMU_CLK0 #2

CMU_CLKI0 #2

PRS_CH0 #8

PRS_CH9 #11

PRS_CH10 #0

PRS_CH11 #5

ACMP0_O #11

ACMP1_O #11

ETM_TCLK #3

TIM1_CC2 #9

TIM1_CC3 #8

US0_CTS #7

US0_RTS #6

US1_TX #11

US1_RX #10

US1_CLK #9

US1_CS #8

US1_CTS #7

US1_RTS #6

LEU0_TX #11

LEU0_RX #10

I2C0_SDA #11

I2C0_SCL #10

FRC_DCLK #11

FRC_DOUT #10

WTIM0_CC0 #26

WTIM0_CC1 #24

WTIM0_CC2 #22

WTIM0_CDTI0 #18

WTIM0_CDTI1 #16

WTIM0_CDTI2 #14

WTIM1_CC0 #10

WTIM1_CC1 #8

WTIM1_CC2 #6

WTIM1_CC3 #4 LE-

TIM0_OUT0 #11 LE-

TIM0_OUT1 #10

PCNT0_S0IN #11

PCNT0_S1IN #10

FRC_DFRAME #9

MODEM_DCLK #11

MODEM_DIN #10

MODEM_DOUT #9

MODEM_ANT0 #8

MODEM_ANT1 #7

PC6

BUSBY BUSAX

TIM0_CC0 #12

TIM0_CC1 #11

TIM0_CC2 #10

TIM0_CDTI0 #9

TIM0_CDTI1 #8

TIM0_CDTI2 #7

TIM1_CC0 #12

US0_TX #12

US0_RX #11

US0_CLK #10

US0_CS #9

TIM1_CC1 #11

TIM1_CC2 #10

TIM1_CC3 #9

US0_CTS #8

US0_RTS #7

US1_TX #12

US1_RX #11

US1_CLK #10

US1_CS #9

US1_CTS #8

US1_RTS #7

LEU0_TX #12

LEU0_RX #11

I2C0_SDA #12

I2C0_SCL #11

FRC_DCLK #12

FRC_DOUT #11

CMU_CLK1 #2

PRS_CH0 #9

PRS_CH9 #12

PRS_CH10 #1

PRS_CH11 #0

ACMP0_O #12

ACMP1_O #12

ETM_TD0 #3

WTIM0_CC0 #27

WTIM0_CC1 #25

WTIM0_CC2 #23

WTIM0_CDTI0 #19

WTIM0_CDTI1 #17

WTIM0_CDTI2 #15

WTIM1_CC0 #11

WTIM1_CC1 #9

WTIM1_CC2 #7

WTIM1_CC3 #5 LE-

TIM0_OUT0 #12 LE-

TIM0_OUT1 #11

PCNT0_S0IN #12

PCNT0_S1IN #11

FRC_DFRAME #10

MODEM_DCLK #12

MODEM_DIN #11

MODEM_DOUT #10

MODEM_ANT0 #9

MODEM_ANT1 #8

PC7

BUSAY BUSBX

silabs.com | Building a more connected world.

Rev. 1.4 | 144

®

EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

Radio

Other

TIM0_CC0 #13

TIM0_CC1 #12

TIM0_CC2 #11

TIM0_CDTI0 #10

TIM0_CDTI1 #9

TIM0_CDTI2 #8

TIM1_CC0 #13

TIM1_CC1 #12

TIM1_CC2 #11

US0_TX #13

US0_RX #12

US0_CLK #11

US0_CS #10

US0_CTS #9

US0_RTS #8

US1_TX #13

US1_RX #12

US1_CLK #11

US1_CS #10

US1_CTS #9

US1_RTS #8

LEU0_TX #13

LEU0_RX #12

I2C0_SDA #13

I2C0_SCL #12

FRC_DCLK #13

FRC_DOUT #12

PRS_CH0 #10

PRS_CH9 #13

PRS_CH10 #2

PRS_CH11 #1

ACMP0_O #13

ACMP1_O #13

ETM_TD1 #3

TIM1_CC3 #10

WTIM0_CC0 #28

WTIM0_CC1 #26

WTIM0_CC2 #24

WTIM0_CDTI0 #20

WTIM0_CDTI1 #18

WTIM0_CDTI2 #16

WTIM1_CC0 #12

WTIM1_CC1 #10

WTIM1_CC2 #8

WTIM1_CC3 #6 LE-

TIM0_OUT0 #13 LE-

TIM0_OUT1 #12

PCNT0_S0IN #13

PCNT0_S1IN #12

FRC_DFRAME #11

MODEM_DCLK #13

MODEM_DIN #12

MODEM_DOUT #11

MODEM_ANT0 #10

MODEM_ANT1 #9

PC8

BUSBY BUSAX

TIM0_CC0 #14

TIM0_CC1 #13

TIM0_CC2 #12

TIM0_CDTI0 #11

TIM0_CDTI1 #10

TIM0_CDTI2 #9

TIM1_CC0 #14

TIM1_CC1 #13

TIM1_CC2 #12

US0_TX #14

US0_RX #13

US0_CLK #12

US0_CS #11

US0_CTS #10

US0_RTS #9

US1_TX #14

US1_RX #13

US1_CLK #12

US1_CS #11

US1_CTS #10

US1_RTS #9

LEU0_TX #14

LEU0_RX #13

I2C0_SDA #14

I2C0_SCL #13

FRC_DCLK #14

FRC_DOUT #13

PRS_CH0 #11

PRS_CH9 #14

PRS_CH10 #3

PRS_CH11 #2

ACMP0_O #14

ACMP1_O #14

ETM_TD2 #3

TIM1_CC3 #11

WTIM0_CC0 #29

WTIM0_CC1 #27

WTIM0_CC2 #25

WTIM0_CDTI0 #21

WTIM0_CDTI1 #19

WTIM0_CDTI2 #17

WTIM1_CC0 #13

WTIM1_CC1 #11

WTIM1_CC2 #9

WTIM1_CC3 #7 LE-

TIM0_OUT0 #14 LE-

TIM0_OUT1 #13

PCNT0_S0IN #14

PCNT0_S1IN #13

FRC_DFRAME #12

MODEM_DCLK #14

MODEM_DIN #13

MODEM_DOUT #12

MODEM_ANT0 #11

MODEM_ANT1 #10

PC9

BUSAY BUSBX

silabs.com | Building a more connected world.

Rev. 1.4 | 145

®

EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

Radio

Other

TIM0_CC0 #15

TIM0_CC1 #14

TIM0_CC2 #13

TIM0_CDTI0 #12

TIM0_CDTI1 #11

TIM0_CDTI2 #10

TIM1_CC0 #15

TIM1_CC1 #14

TIM1_CC2 #13

US0_TX #15

US0_RX #14

US0_CLK #13

US0_CS #12

US0_CTS #11

US0_RTS #10

US1_TX #15

US1_RX #14

US1_CLK #13

US1_CS #12

US1_CTS #11

US1_RTS #10

LEU0_TX #15

LEU0_RX #14

I2C0_SDA #15

I2C0_SCL #14

I2C1_SDA #19

I2C1_SCL #18

CMU_CLK1 #3

PRS_CH0 #12

PRS_CH9 #15

PRS_CH10 #4

PRS_CH11 #3

ACMP0_O #15

ACMP1_O #15

ETM_TD3 #3

TIM1_CC3 #12

FRC_DCLK #15

FRC_DOUT #14

WTIM0_CC0 #30

WTIM0_CC1 #28

WTIM0_CC2 #26

WTIM0_CDTI0 #22

WTIM0_CDTI1 #20

WTIM0_CDTI2 #18

WTIM1_CC0 #14

WTIM1_CC1 #12

WTIM1_CC2 #10

WTIM1_CC3 #8 LE-

TIM0_OUT0 #15 LE-

TIM0_OUT1 #14

PCNT0_S0IN #15

PCNT0_S1IN #14

PCNT2_S0IN #19

PCNT2_S1IN #18

FRC_DFRAME #13

MODEM_DCLK #15

MODEM_DIN #14

MODEM_DOUT #13

MODEM_ANT0 #12

MODEM_ANT1 #11

PC10

BUSBY BUSAX

GPIO_EM4WU12

TIM0_CC0 #16

TIM0_CC1 #15

TIM0_CC2 #14

TIM0_CDTI0 #13

TIM0_CDTI1 #12

TIM0_CDTI2 #11

TIM1_CC0 #16

TIM1_CC1 #15

TIM1_CC2 #14

US0_TX #16

US0_RX #15

US0_CLK #14

US0_CS #13

US0_CTS #12

US0_RTS #11

US1_TX #16

US1_RX #15

US1_CLK #14

US1_CS #13

US1_CTS #12

US1_RTS #11

LEU0_TX #16

LEU0_RX #15

I2C0_SDA #16

I2C0_SCL #15

I2C1_SDA #20

I2C1_SCL #19

TIM1_CC3 #13

FRC_DCLK #16

FRC_DOUT #15

CMU_CLK0 #3

PRS_CH0 #13

PRS_CH9 #16

PRS_CH10 #5

PRS_CH11 #4

ACMP0_O #16

ACMP1_O #16

DBG_SWO #3

WTIM0_CC0 #31

WTIM0_CC1 #29

WTIM0_CC2 #27

WTIM0_CDTI0 #23

WTIM0_CDTI1 #21

WTIM0_CDTI2 #19

WTIM1_CC0 #15

WTIM1_CC1 #13

WTIM1_CC2 #11

WTIM1_CC3 #9 LE-

TIM0_OUT0 #16 LE-

TIM0_OUT1 #15

PCNT0_S0IN #16

PCNT0_S1IN #15

PCNT2_S0IN #20

PCNT2_S1IN #19

FRC_DFRAME #14

MODEM_DCLK #16

MODEM_DIN #15

MODEM_DOUT #14

MODEM_ANT0 #13

MODEM_ANT1 #12

PC11

BUSAY BUSBX

silabs.com | Building a more connected world.

Rev. 1.4 | 146

®

EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

Radio

Other

WTIM0_CC1 #30

WTIM0_CC2 #28

WTIM0_CDTI0 #24 US3_TX #0 US3_RX

WTIM0_CDTI1 #22

WTIM0_CDTI2 #20

WTIM1_CC0 #16

WTIM1_CC1 #14

WTIM1_CC2 #12

WTIM1_CC3 #10

#31 US3_CLK #30

US3_CS #29

US3_CTS #28

US3_RTS #27

PD8

BUSDY BUSCX

LES_CH0

TIM0_CC0 #17

TIM0_CC1 #16

TIM0_CC2 #15

TIM0_CDTI0 #14

TIM0_CDTI1 #13

TIM0_CDTI2 #12

TIM1_CC0 #17

TIM1_CC1 #16

TIM1_CC2 #15

TIM1_CC3 #14

WTIM0_CC1 #31

WTIM0_CC2 #29

WTIM0_CDTI0 #25

US0_TX #17

US0_RX #16

US0_CLK #15

US0_CS #14

US0_CTS #13

US0_RTS #12

US1_TX #17

US1_RX #16

US1_CLK #15

US1_CS #14

US1_CTS #13

US1_RTS #12

FRC_DCLK #17

FRC_DOUT #16

CMU_CLK0 #4

PRS_CH3 #8

PRS_CH4 #0

PRS_CH5 #6

PRS_CH6 #11

ACMP0_O #17

ACMP1_O #17

LES_CH1

FRC_DFRAME #15

MODEM_DCLK #17

MODEM_DIN #16

MODEM_DOUT #15

MODEM_ANT0 #14

MODEM_ANT1 #13

PD9

BUSCY BUSDX

WTIM0_CDTI1 #23 US3_TX #1 US3_RX

WTIM0_CDTI2 #21

WTIM1_CC0 #17

WTIM1_CC1 #15

WTIM1_CC2 #13

WTIM1_CC3 #11 LE-

TIM0_OUT0 #17 LE-

TIM0_OUT1 #16

#0 US3_CLK #31

US3_CS #30

US3_CTS #29

US3_RTS #28

LEU0_TX #17

LEU0_RX #16

I2C0_SDA #17

I2C0_SCL #16

PCNT0_S0IN #17

PCNT0_S1IN #16

TIM0_CC0 #18

TIM0_CC1 #17

TIM0_CC2 #16

TIM0_CDTI0 #15

TIM0_CDTI1 #14

TIM0_CDTI2 #13

TIM1_CC0 #18

TIM1_CC1 #17

TIM1_CC2 #16

TIM1_CC3 #15

US0_TX #18

US0_RX #17

US0_CLK #16

US0_CS #15

US0_CTS #14

US0_RTS #13

US1_TX #18

US1_RX #17

US1_CLK #16

US1_CS #15

FRC_DCLK #18

FRC_DOUT #17

CMU_CLK1 #4

PRS_CH3 #9

PRS_CH4 #1

PRS_CH5 #0

PRS_CH6 #12

ACMP0_O #18

ACMP1_O #18

LES_CH2

FRC_DFRAME #16

MODEM_DCLK #18

MODEM_DIN #17

MODEM_DOUT #16

MODEM_ANT0 #15

MODEM_ANT1 #14

WTIM0_CC2 #30

WTIM0_CDTI0 #26

WTIM0_CDTI1 #24

WTIM0_CDTI2 #22

WTIM1_CC0 #18

WTIM1_CC1 #16

WTIM1_CC2 #14

WTIM1_CC3 #12 LE-

TIM0_OUT0 #18 LE-

TIM0_OUT1 #17

PCNT0_S0IN #18

PCNT0_S1IN #17

PD10

BUSDY BUSCX

US1_CTS #14

US1_RTS #13

US3_TX #2 US3_RX

#1 US3_CLK #0

US3_CS #31

US3_CTS #30

US3_RTS #29

LEU0_TX #18

LEU0_RX #17

I2C0_SDA #18

I2C0_SCL #17

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Analog

Timers

Communication

Radio

Other

TIM0_CC0 #19

TIM0_CC1 #18

TIM0_CC2 #17

TIM0_CDTI0 #16

TIM0_CDTI1 #15

TIM0_CDTI2 #14

TIM1_CC0 #19

TIM1_CC1 #18

TIM1_CC2 #17

TIM1_CC3 #16

US0_TX #19

US0_RX #18

US0_CLK #17

US0_CS #16

US0_CTS #15

US0_RTS #14

US1_TX #19

US1_RX #18

US1_CLK #17

US1_CS #16

FRC_DCLK #19

FRC_DOUT #18

PRS_CH3 #10

PRS_CH4 #2

PRS_CH5 #1

PRS_CH6 #13

ACMP0_O #19

ACMP1_O #19

LES_CH3

FRC_DFRAME #17

MODEM_DCLK #19

MODEM_DIN #18

MODEM_DOUT #17

MODEM_ANT0 #16

MODEM_ANT1 #15

WTIM0_CC2 #31

WTIM0_CDTI0 #27

WTIM0_CDTI1 #25

WTIM0_CDTI2 #23

WTIM1_CC0 #19

WTIM1_CC1 #17

WTIM1_CC2 #15

WTIM1_CC3 #13 LE-

TIM0_OUT0 #19 LE-

TIM0_OUT1 #18

PCNT0_S0IN #19

PCNT0_S1IN #18

PD11

BUSCY BUSDX

US1_CTS #15

US1_RTS #14

US3_TX #3 US3_RX

#2 US3_CLK #1

US3_CS #0

US3_CTS #31

US3_RTS #30

LEU0_TX #19

LEU0_RX #18

I2C0_SDA #19

I2C0_SCL #18

TIM0_CC0 #20

TIM0_CC1 #19

TIM0_CC2 #18

TIM0_CDTI0 #17

TIM0_CDTI1 #16

TIM0_CDTI2 #15

TIM1_CC0 #20

TIM1_CC1 #19

TIM1_CC2 #18

TIM1_CC3 #17

WTIM0_CDTI0 #28

WTIM0_CDTI1 #26

US0_TX #20

US0_RX #19

US0_CLK #18

US0_CS #17

US0_CTS #16

US0_RTS #15

US1_TX #20

US1_RX #19

US1_CLK #18

US1_CS #17

US1_CTS #16

US1_RTS #15

FRC_DCLK #20

FRC_DOUT #19

PRS_CH3 #11

PRS_CH4 #3

PRS_CH5 #2

PRS_CH6 #14

ACMP0_O #20

ACMP1_O #20

LES_CH4

FRC_DFRAME #18

MODEM_DCLK #20

MODEM_DIN #19

MODEM_DOUT #18

MODEM_ANT0 #17

MODEM_ANT1 #16

VDAC0_OUT1ALT /

OPA1_OUTALT #0

BUSDY BUSCX

PD12

WTIM0_CDTI2 #24 US3_TX #4 US3_RX

WTIM1_CC0 #20

WTIM1_CC1 #18

WTIM1_CC2 #16

WTIM1_CC3 #14 LE-

TIM0_OUT0 #20 LE-

TIM0_OUT1 #19

#3 US3_CLK #2

US3_CS #1

US3_CTS #0

US3_RTS #31

LEU0_TX #20

LEU0_RX #19

I2C0_SDA #20

I2C0_SCL #19

PCNT0_S0IN #20

PCNT0_S1IN #19

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®

EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Timers Communication Radio

Analog

Other

TIM0_CC0 #21

TIM0_CC1 #20

TIM0_CC2 #19

TIM0_CDTI0 #18

TIM0_CDTI1 #17

TIM0_CDTI2 #16

TIM1_CC0 #21

TIM1_CC1 #20

TIM1_CC2 #19

TIM1_CC3 #18

WTIM0_CDTI0 #29

WTIM0_CDTI1 #27

US0_TX #21

US0_RX #20

US0_CLK #19

US0_CS #18

US0_CTS #17

US0_RTS #16

US1_TX #21

US1_RX #20

US1_CLK #19

US1_CS #18

US1_CTS #17

US1_RTS #16

FRC_DCLK #21

FRC_DOUT #20

PRS_CH3 #12

PRS_CH4 #4

PRS_CH5 #3

PRS_CH6 #15

ACMP0_O #21

ACMP1_O #21

LES_CH5

VDAC0_OUT0ALT /

OPA0_OUTALT #1

BUSCY BUSDX

OPA1_P

FRC_DFRAME #19

MODEM_DCLK #21

MODEM_DIN #20

MODEM_DOUT #19

MODEM_ANT0 #18

MODEM_ANT1 #17

PD13

WTIM0_CDTI2 #25 US3_TX #5 US3_RX

WTIM1_CC0 #21

WTIM1_CC1 #19

WTIM1_CC2 #17

WTIM1_CC3 #15 LE-

TIM0_OUT0 #21 LE-

TIM0_OUT1 #20

#4 US3_CLK #3

US3_CS #2

US3_CTS #1

US3_RTS #0

LEU0_TX #21

LEU0_RX #20

I2C0_SDA #21

I2C0_SCL #20

PCNT0_S0IN #21

PCNT0_S1IN #20

TIM0_CC0 #22

TIM0_CC1 #21

TIM0_CC2 #20

TIM0_CDTI0 #19

TIM0_CDTI1 #18

TIM0_CDTI2 #17

TIM1_CC0 #22

TIM1_CC1 #21

TIM1_CC2 #20

TIM1_CC3 #19

WTIM0_CDTI0 #30

WTIM0_CDTI1 #28

US0_TX #22

US0_RX #21

US0_CLK #20

US0_CS #19

US0_CTS #18

US0_RTS #17

US1_TX #22

US1_RX #21

US1_CLK #20

US1_CS #19

US1_CTS #18

US1_RTS #17

CMU_CLK0 #5

PRS_CH3 #13

PRS_CH4 #5

PRS_CH5 #4

PRS_CH6 #16

ACMP0_O #22

ACMP1_O #22

LES_CH6

FRC_DCLK #22

FRC_DOUT #21

FRC_DFRAME #20

MODEM_DCLK #22

MODEM_DIN #21

MODEM_DOUT #20

MODEM_ANT0 #19

MODEM_ANT1 #18

BUSDY BUSCX

VDAC0_OUT1 /

OPA1_OUT

PD14

WTIM0_CDTI2 #26 US3_TX #6 US3_RX

WTIM1_CC0 #22

WTIM1_CC1 #20

WTIM1_CC2 #18

WTIM1_CC3 #16 LE-

TIM0_OUT0 #22 LE-

TIM0_OUT1 #21

#5 US3_CLK #4

US3_CS #3

GPIO_EM4WU4

US3_CTS #2

US3_RTS #1

LEU0_TX #22

LEU0_RX #21

I2C0_SDA #22

I2C0_SCL #21

PCNT0_S0IN #22

PCNT0_S1IN #21

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®

EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Timers Communication Radio

Analog

Other

TIM0_CC0 #23

TIM0_CC1 #22

TIM0_CC2 #21

TIM0_CDTI0 #20

TIM0_CDTI1 #19

TIM0_CDTI2 #18

TIM1_CC0 #23

TIM1_CC1 #22

TIM1_CC2 #21

TIM1_CC3 #20

WTIM0_CDTI0 #31

WTIM0_CDTI1 #29

US0_TX #23

US0_RX #22

US0_CLK #21

US0_CS #20

US0_CTS #19

US0_RTS #18

US1_TX #23

US1_RX #22

US1_CLK #21

US1_CS #20

US1_CTS #19

US1_RTS #18

CMU_CLK1 #5

PRS_CH3 #14

PRS_CH4 #6

PRS_CH5 #5

PRS_CH6 #17

ACMP0_O #23

ACMP1_O #23

LES_CH7

FRC_DCLK #23

FRC_DOUT #22

VDAC0_OUT0ALT /

OPA0_OUTALT #2

BUSCY BUSDX

OPA1_N

FRC_DFRAME #21

MODEM_DCLK #23

MODEM_DIN #22

MODEM_DOUT #21

MODEM_ANT0 #20

MODEM_ANT1 #19

PD15

WTIM0_CDTI2 #27 US3_TX #7 US3_RX

WTIM1_CC0 #23

WTIM1_CC1 #21

WTIM1_CC2 #19

WTIM1_CC3 #17 LE-

TIM0_OUT0 #23 LE-

TIM0_OUT1 #22

#6 US3_CLK #5

US3_CS #4

DBG_SWO #2

US3_CTS #3

US3_RTS #2

LEU0_TX #23

LEU0_RX #22

I2C0_SDA #23

I2C0_SCL #22

PCNT0_S0IN #23

PCNT0_S1IN #22

US0_TX #24

US0_RX #23

US0_CLK #22

US0_CS #21

US0_CTS #20

US0_RTS #19

US1_TX #24

US1_RX #23

US1_CLK #22

US1_CS #21

US1_CTS #20

US1_RTS #19

US2_TX #14

US2_RX #13

US2_CLK #12

US2_CS #11

US2_CTS #10

US2_RTS #9

LEU0_TX #24

LEU0_RX #23

I2C0_SDA #24

I2C0_SCL #23

TIM0_CC0 #24

TIM0_CC1 #23

TIM0_CC2 #22

TIM0_CDTI0 #21

TIM0_CDTI1 #20

TIM0_CDTI2 #19

TIM1_CC0 #24

TIM1_CC1 #23

TIM1_CC2 #22

TIM1_CC3 #21

WTIM0_CDTI1 #30

WTIM0_CDTI2 #28

WTIM1_CC0 #24

WTIM1_CC1 #22

WTIM1_CC2 #20

WTIM1_CC3 #18 LE-

TIM0_OUT0 #24 LE-

TIM0_OUT1 #23

PCNT0_S0IN #24

PCNT0_S1IN #23

FRC_DCLK #24

FRC_DOUT #23

PRS_CH0 #0

PRS_CH1 #7

PRS_CH2 #6

PRS_CH3 #5

ACMP0_O #24

ACMP1_O #24

DBG_SWCLKTCK

BOOT_TX

FRC_DFRAME #22

MODEM_DCLK #24

MODEM_DIN #23

MODEM_DOUT #22

MODEM_ANT0 #21

MODEM_ANT1 #20

PF0

BUSBY BUSAX

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Timers Communication Radio

Analog

Other

US0_TX #25

US0_RX #24

US0_CLK #23

US0_CS #22

US0_CTS #21

US0_RTS #20

US1_TX #25

US1_RX #24

US1_CLK #23

US1_CS #22

US1_CTS #21

US1_RTS #20

US2_TX #15

US2_RX #14

US2_CLK #13

US2_CS #12

US2_CTS #11

US2_RTS #10

LEU0_TX #25

LEU0_RX #24

I2C0_SDA #25

I2C0_SCL #24

TIM0_CC0 #25

TIM0_CC1 #24

TIM0_CC2 #23

TIM0_CDTI0 #22

TIM0_CDTI1 #21

TIM0_CDTI2 #20

TIM1_CC0 #25

TIM1_CC1 #24

TIM1_CC2 #23

TIM1_CC3 #22

WTIM0_CDTI1 #31

WTIM0_CDTI2 #29

WTIM1_CC0 #25

WTIM1_CC1 #23

WTIM1_CC2 #21

WTIM1_CC3 #19 LE-

TIM0_OUT0 #25 LE-

TIM0_OUT1 #24

PCNT0_S0IN #25

PCNT0_S1IN #24

FRC_DCLK #25

FRC_DOUT #24

PRS_CH0 #1

PRS_CH1 #0

PRS_CH2 #7

PRS_CH3 #6

ACMP0_O #25

ACMP1_O #25

DBG_SWDIOTMS

BOOT_RX

FRC_DFRAME #23

MODEM_DCLK #25

MODEM_DIN #24

MODEM_DOUT #23

MODEM_ANT0 #22

MODEM_ANT1 #21

PF1

BUSAY BUSBX

TIM0_CC0 #26

TIM0_CC1 #25

TIM0_CC2 #24

TIM0_CDTI0 #23

TIM0_CDTI1 #22

TIM0_CDTI2 #21

TIM1_CC0 #26

TIM1_CC1 #25

TIM1_CC2 #24

TIM1_CC3 #23

WTIM0_CDTI2 #30

WTIM1_CC0 #26

WTIM1_CC1 #24

WTIM1_CC2 #22

WTIM1_CC3 #20 LE-

TIM0_OUT0 #26 LE-

TIM0_OUT1 #25

PCNT0_S0IN #26

PCNT0_S1IN #25

US0_TX #26

US0_RX #25

US0_CLK #24

US0_CS #23

US0_CTS #22

US0_RTS #21

US1_TX #26

US1_RX #25

US1_CLK #24

US1_CS #23

US1_CTS #22

US1_RTS #21

LEU0_TX #26

LEU0_RX #25

I2C0_SDA #26

I2C0_SCL #25

CMU_CLK0 #6

PRS_CH0 #2

PRS_CH1 #1

PRS_CH2 #0

PRS_CH3 #7

ACMP0_O #26

ACMP1_O #26

DBG_TDO

FRC_DCLK #26

FRC_DOUT #25

FRC_DFRAME #24

MODEM_DCLK #26

MODEM_DIN #25

MODEM_DOUT #24

MODEM_ANT0 #23

MODEM_ANT1 #22

PF2

BUSBY BUSAX

DBG_SWO #0

GPIO_EM4WU0

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Timers Communication Radio

Analog

Other

US0_TX #27

US0_RX #26

US0_CLK #25

US0_CS #24

US0_CTS #23

US0_RTS #22

US1_TX #27

US1_RX #26

US1_CLK #25

US1_CS #24

US1_CTS #23

US1_RTS #22

US2_TX #16

US2_RX #15

US2_CLK #14

US2_CS #13

US2_CTS #12

US2_RTS #11

LEU0_TX #27

LEU0_RX #26

I2C0_SDA #27

I2C0_SCL #26

TIM0_CC0 #27

TIM0_CC1 #26

TIM0_CC2 #25

TIM0_CDTI0 #24

TIM0_CDTI1 #23

TIM0_CDTI2 #22

TIM1_CC0 #27

TIM1_CC1 #26

TIM1_CC2 #25

TIM1_CC3 #24

WTIM0_CDTI2 #31

WTIM1_CC0 #27

WTIM1_CC1 #25

WTIM1_CC2 #23

WTIM1_CC3 #21 LE-

TIM0_OUT0 #27 LE-

TIM0_OUT1 #26

PCNT0_S0IN #27

PCNT0_S1IN #26

FRC_DCLK #27

FRC_DOUT #26

CMU_CLK1 #6

PRS_CH0 #3

PRS_CH1 #2

PRS_CH2 #1

PRS_CH3 #0

ACMP0_O #27

ACMP1_O #27

DBG_TDI

FRC_DFRAME #25

MODEM_DCLK #27

MODEM_DIN #26

MODEM_DOUT #25

MODEM_ANT0 #24

MODEM_ANT1 #23

PF3

BUSAY BUSBX

US0_TX #28

US0_RX #27

US0_CLK #26

US0_CS #25

US0_CTS #24

US0_RTS #23

US1_TX #28

US1_RX #27

US1_CLK #26

US1_CS #25

US1_CTS #24

US1_RTS #23

US2_TX #17

US2_RX #16

US2_CLK #15

US2_CS #14

US2_CTS #13

US2_RTS #12

LEU0_TX #28

LEU0_RX #27

I2C0_SDA #28

I2C0_SCL #27

TIM0_CC0 #28

TIM0_CC1 #27

TIM0_CC2 #26

TIM0_CDTI0 #25

TIM0_CDTI1 #24

TIM0_CDTI2 #23

TIM1_CC0 #28

TIM1_CC1 #27

TIM1_CC2 #26

TIM1_CC3 #25

WTIM1_CC0 #28

WTIM1_CC1 #26

WTIM1_CC2 #24

WTIM1_CC3 #22 LE-

TIM0_OUT0 #28 LE-

TIM0_OUT1 #27

PCNT0_S0IN #28

PCNT0_S1IN #27

FRC_DCLK #28

FRC_DOUT #27

PRS_CH0 #4

PRS_CH1 #3

PRS_CH2 #2

PRS_CH3 #1

ACMP0_O #28

ACMP1_O #28

FRC_DFRAME #26

MODEM_DCLK #28

MODEM_DIN #27

MODEM_DOUT #26

MODEM_ANT0 #25

MODEM_ANT1 #24

PF4

BUSBY BUSAX

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Timers Communication Radio

Analog

Other

US0_TX #29

US0_RX #28

US0_CLK #27

US0_CS #26

US0_CTS #25

US0_RTS #24

US1_TX #29

US1_RX #28

US1_CLK #27

US1_CS #26

US1_CTS #25

US1_RTS #24

US2_TX #18

US2_RX #17

US2_CLK #16

US2_CS #15

US2_CTS #14

US2_RTS #13

LEU0_TX #29

LEU0_RX #28

I2C0_SDA #29

I2C0_SCL #28

TIM0_CC0 #29

TIM0_CC1 #28

TIM0_CC2 #27

TIM0_CDTI0 #26

TIM0_CDTI1 #25

TIM0_CDTI2 #24

TIM1_CC0 #29

TIM1_CC1 #28

TIM1_CC2 #27

TIM1_CC3 #26

WTIM1_CC0 #29

WTIM1_CC1 #27

WTIM1_CC2 #25

WTIM1_CC3 #23 LE-

TIM0_OUT0 #29 LE-

TIM0_OUT1 #28

PCNT0_S0IN #29

PCNT0_S1IN #28

FRC_DCLK #29

FRC_DOUT #28

PRS_CH0 #5

PRS_CH1 #4

PRS_CH2 #3

PRS_CH3 #2

ACMP0_O #29

ACMP1_O #29

FRC_DFRAME #27

MODEM_DCLK #29

MODEM_DIN #28

MODEM_DOUT #27

MODEM_ANT0 #26

MODEM_ANT1 #25

PF5

BUSAY BUSBX

US0_TX #30

US0_RX #29

US0_CLK #28

US0_CS #27

US0_CTS #26

US0_RTS #25

US1_TX #30

US1_RX #29

US1_CLK #28

US1_CS #27

US1_CTS #26

US1_RTS #25

US2_TX #19

US2_RX #18

US2_CLK #17

US2_CS #16

US2_CTS #15

US2_RTS #14

LEU0_TX #30

LEU0_RX #29

I2C0_SDA #30

I2C0_SCL #29

TIM0_CC0 #30

TIM0_CC1 #29

TIM0_CC2 #28

TIM0_CDTI0 #27

TIM0_CDTI1 #26

TIM0_CDTI2 #25

TIM1_CC0 #30

TIM1_CC1 #29

TIM1_CC2 #28

TIM1_CC3 #27

WTIM1_CC0 #30

WTIM1_CC1 #28

WTIM1_CC2 #26

WTIM1_CC3 #24 LE-

TIM0_OUT0 #30 LE-

TIM0_OUT1 #29

PCNT0_S0IN #30

PCNT0_S1IN #29

PCNT1_S0IN #19

PCNT1_S1IN #18

FRC_DCLK #30

FRC_DOUT #29

CMU_CLK1 #7

PRS_CH0 #6

PRS_CH1 #5

PRS_CH2 #4

PRS_CH3 #3

ACMP0_O #30

ACMP1_O #30

FRC_DFRAME #28

MODEM_DCLK #30

MODEM_DIN #29

MODEM_DOUT #28

MODEM_ANT0 #27

MODEM_ANT1 #26

PF6

BUSBY BUSAX

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®

EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Timers Communication Radio

Analog

Other

US0_TX #31

US0_RX #30

US0_CLK #29

US0_CS #28

US0_CTS #27

US0_RTS #26

US1_TX #31

US1_RX #30

US1_CLK #29

US1_CS #28

US1_CTS #27

US1_RTS #26

US2_TX #20

US2_RX #19

US2_CLK #18

US2_CS #17

US2_CTS #16

US2_RTS #15

LEU0_TX #31

LEU0_RX #30

I2C0_SDA #31

I2C0_SCL #30

TIM0_CC0 #31

TIM0_CC1 #30

TIM0_CC2 #29

TIM0_CDTI0 #28

TIM0_CDTI1 #27

TIM0_CDTI2 #26

TIM1_CC0 #31

TIM1_CC1 #30

TIM1_CC2 #29

TIM1_CC3 #28

WTIM1_CC0 #31

WTIM1_CC1 #29

WTIM1_CC2 #27

WTIM1_CC3 #25 LE-

TIM0_OUT0 #31 LE-

TIM0_OUT1 #30

PCNT0_S0IN #31

PCNT0_S1IN #30

PCNT1_S0IN #20

PCNT1_S1IN #19

CMU_CLKI0 #1

CMU_CLK0 #7

PRS_CH0 #7

PRS_CH1 #6

PRS_CH2 #5

PRS_CH3 #4

ACMP0_O #31

ACMP1_O #31

GPIO_EM4WU1

FRC_DCLK #31

FRC_DOUT #30

FRC_DFRAME #29

MODEM_DCLK #31

MODEM_DIN #30

MODEM_DOUT #29

MODEM_ANT0 #28

MODEM_ANT1 #27

PF7

BUSAY BUSBX

US2_TX #21

US2_RX #20

US2_CLK #19

US2_CS #18

US2_CTS #17

US2_RTS #16

I2C1_SDA #21

I2C1_SCL #20

WTIM1_CC1 #30

WTIM1_CC2 #28

WTIM1_CC3 #26

PCNT1_S0IN #21

PCNT1_S1IN #20

PCNT2_S0IN #21

PCNT2_S1IN #20

PF8

BUSBY BUSAX

BUSAY BUSBX

BUSBY BUSAX

ETM_TCLK #0

ETM_TD0 #0

ETM_TD1 #0

US2_TX #22

US2_RX #21

US2_CLK #20

US2_CS #19

US2_CTS #18

US2_RTS #17

I2C1_SDA #22

I2C1_SCL #21

WTIM1_CC1 #31

WTIM1_CC2 #29

WTIM1_CC3 #27

PCNT1_S0IN #22

PCNT1_S1IN #21

PCNT2_S0IN #22

PCNT2_S1IN #21

PF9

US2_TX #23

US2_RX #22

US2_CLK #21

US2_CS #20

US2_CTS #19

US2_RTS #18

I2C1_SDA #23

I2C1_SCL #22

WTIM1_CC2 #30

WTIM1_CC3 #28

PCNT1_S0IN #23

PCNT1_S1IN #22

PCNT2_S0IN #23

PCNT2_S1IN #22

PF10

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Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Timers Communication Radio

Analog

Other

US2_TX #24

US2_RX #23

US2_CLK #22

US2_CS #21

US2_CTS #20

US2_RTS #19

US3_TX #24

US3_RX #23

US3_CLK #22

US3_CS #21

US3_CTS #20

US3_RTS #19

I2C1_SDA #24

I2C1_SCL #23

WTIM1_CC2 #31

WTIM1_CC3 #29

PCNT1_S0IN #24

PCNT1_S1IN #23

PCNT2_S0IN #24

PCNT2_S1IN #23

PF11

BUSAY BUSBX

ETM_TD2 #0

US2_TX #25

US2_RX #24

US2_CLK #23

US2_CS #22

US2_CTS #21

US2_RTS #20

US3_TX #25

US3_RX #24

US3_CLK #23

US3_CS #22

US3_CTS #21

US3_RTS #20

I2C1_SDA #25

I2C1_SCL #24

WTIM1_CC3 #30

PCNT1_S0IN #25

PCNT1_S1IN #24

PCNT2_S0IN #25

PCNT2_S1IN #24

PF12

PF13

PF14

BUSBY BUSAX

BUSAY BUSBX

BUSBY BUSAX

ETM_TD3 #0

US2_TX #26

US2_RX #25

US2_CLK #24

US2_CS #23

US2_CTS #22

US2_RTS #21

US3_TX #26

US3_RX #25

US3_CLK #24

US3_CS #23

US3_CTS #22

US3_RTS #21

I2C1_SDA #26

I2C1_SCL #25

WTIM1_CC3 #31

PCNT1_S0IN #26

PCNT1_S1IN #25

PCNT2_S0IN #26

PCNT2_S1IN #25

US2_TX #27

US2_RX #26

US2_CLK #25

US2_CS #24

US2_CTS #23

US2_RTS #22

US3_TX #27

US3_RX #26

US3_CLK #25

US3_CS #24

US3_CTS #23

US3_RTS #22

I2C1_SDA #27

I2C1_SCL #26

PCNT1_S0IN #27

PCNT1_S1IN #26

PCNT2_S0IN #27

PCNT2_S1IN #26

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Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Timers Communication Radio

Analog

Other

US2_TX #28

US2_RX #27

US2_CLK #26

US2_CS #25

US2_CTS #24

US2_RTS #23

US3_TX #28

US3_RX #27

US3_CLK #26

US3_CS #25

US3_CTS #24

US3_RTS #23

I2C1_SDA #28

I2C1_SCL #27

PCNT1_S0IN #28

PCNT1_S1IN #27

PCNT2_S0IN #28

PCNT2_S1IN #27

PF15

BUSAY BUSBX

US2_TX #5 US2_RX

#4 US2_CLK #3

US2_CS #2

BUSADC0Y BU-

SADC0X

PI0

PI1

LES_ALTEX4

LES_ALTEX5

US2_CTS #1

US2_RTS #0

US2_TX #6 US2_RX

#5 US2_CLK #4

US2_CS #3

BUSADC0Y BU-

SADC0X

US2_CTS #2

US2_RTS #1

US2_TX #7 US2_RX

#6 US2_CLK #5

US2_CS #4

US2_CTS #3

PCNT1_S0IN #4

PCNT1_S1IN #3

PCNT2_S0IN #4

PCNT2_S1IN #3

US2_RTS #2

BUSADC0Y BU-

SADC0X

US3_TX #8 US3_RX

#7 US3_CLK #6

US3_CS #5

LES_ALTEX6

ETM_TCLK #2

PI2

US3_CTS #4

US3_RTS #3

I2C1_SDA #4

I2C1_SCL #3

US2_TX #8 US2_RX

#7 US2_CLK #6

US2_CS #5

US2_CTS #4

PCNT1_S0IN #5

PCNT1_S1IN #4

PCNT2_S0IN #5

PCNT2_S1IN #4

US2_RTS #3

BUSADC0Y BU-

SADC0X

US3_TX #9 US3_RX

#8 US3_CLK #7

US3_CS #6

LES_ALTEX7

ETM_TD0 #2

PI3

US3_CTS #5

US3_RTS #4

I2C1_SDA #5

I2C1_SCL #4

US3_TX #16

US3_RX #15

US3_CLK #14

US3_CS #13

US3_CTS #12

US3_RTS #11

I2C1_SDA #11

I2C1_SCL #10

PCNT1_S0IN #11

PCNT1_S1IN #10

PCNT2_S0IN #11

PCNT2_S1IN #10

BUSACMP1Y BU-

SACMP1X

PJ14

LES_ALTEX2

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Pin Definitions

GPIO Name

Pin Alternate Functionality / Description

Timers Communication Radio

Analog

Other

US3_TX #17

US3_RX #16

US3_CLK #15

US3_CS #14

US3_CTS #13

US3_RTS #12

I2C1_SDA #12

I2C1_SCL #11

PCNT1_S0IN #12

PCNT1_S1IN #11

PCNT2_S0IN #12

PCNT2_S1IN #11

BUSACMP1Y BU-

SACMP1X

PJ15

LES_ALTEX3

US2_TX #29

US2_RX #28

US2_CLK #27

US2_CS #26

US2_CTS #25

US2_RTS #24

US3_TX #29

US3_RX #28

US3_CLK #27

US3_CS #26

US3_CTS #25

US3_RTS #24

I2C1_SDA #29

I2C1_SCL #28

PCNT1_S0IN #29

PCNT1_S1IN #28

PCNT2_S0IN #29

PCNT2_S1IN #28

PK0

PK1

PK2

IDAC0_OUT

US2_TX #30

US2_RX #29

US2_CLK #28

US2_CS #27

US2_CTS #26

US2_RTS #25

US3_TX #30

US3_RX #29

US3_CLK #28

US3_CS #27

US3_CTS #26

US3_RTS #25

I2C1_SDA #30

I2C1_SCL #29

PCNT1_S0IN #30

PCNT1_S1IN #29

PCNT2_S0IN #30

PCNT2_S1IN #29

US2_TX #31

US2_RX #30

US2_CLK #29

US2_CS #28

US2_CTS #27

US2_RTS #26

US3_TX #31

US3_RX #30

US3_CLK #29

US3_CS #28

US3_CTS #27

US3_RTS #26

I2C1_SDA #31

I2C1_SCL #30

PCNT1_S0IN #31

PCNT1_S1IN #30

PCNT2_S0IN #31

PCNT2_S1IN #30

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Pin Definitions

6.8 Alternate Functionality Overview

A wide selection of alternate functionality is available for multiplexing to various pins. The following table shows the name of the alter-

nate functionality in the first column, followed by columns showing the possible LOCATION bitfield settings and the associated GPIO

pin. Refer to 6.7 GPIO Functionality Table for a list of functions available on each GPIO pin.

Note: Some functionality, such as analog interfaces, do not have alternate settings or a LOCATION bitfield. In these cases, the pinout

is shown in the column corresponding to LOCATION 0.

Table 6.8. Alternate Functionality Overview

Alternate

LOCATION

12 - 15 16 - 19

16: PC11 20: PD12 24: PF0

Functionality

0 - 3

4 - 7

8 - 11

20 - 23

24 - 27

28 - 31

Description

0: PA0

1: PA1

2: PA2

3: PA3

4: PA4

5: PA5

6: PB11

7: PB12

8: PB13

9: PB14

12: PC7

13: PC8

28: PF4

29: PF5

30: PF6

31: PF7

Analog comparator

ACMP0, digital out-

put.

17: PD9 21: PD13 25: PF1

18: PD10 22: PD14 26: PF2

15: PC10 19: PD11 23: PD15 27: PF3

ACMP0_O

ACMP1_O

ADC0_EXTN

ADC0_EXTP

BOOT_RX

BOOT_TX

10: PB15 14: PC9

11: PC6

0: PA0

1: PA1

2: PA2

3: PA3

4: PA4

5: PA5

6: PB11

7: PB12

8: PB13

9: PB14

12: PC7

16: PC11 20: PD12 24: PF0

17: PD9 21: PD13 25: PF1

18: PD10 22: PD14 26: PF2

15: PC10 19: PD11 23: PD15 27: PF3

28: PF4

29: PF5

30: PF6

31: PF7

Analog comparator

ACMP1, digital out-

put.

13: PC8

10: PB15 14: PC9

11: PC6

0: PA0

0: PA1

0: PF1

0: PF0

Analog to digital

converter ADC0 ex-

ternal reference in-

put negative pin.

Analog to digital

converter ADC0 ex-

ternal reference in-

put positive pin.

Bootloader RX.

Bootloader TX.

0: PA1

4: PD9

5: PD14

6: PF2

7: PF7

Clock Management

Unit, clock output

number 0.

1: PB15

2: PC6

3: PC11

CMU_CLK0

CMU_CLK1

CMU_CLKI0

0: PA0

4: PD10

5: PD15

6: PF3

Clock Management

Unit, clock output

number 1.

1: PB14

2: PC7

3: PC10

7: PF6

0: PB13

1: PF7

2: PC6

3: PB6

4: PA5

Clock Management

Unit, clock input

number 0.

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

Alternate

LOCATION

12 - 15 16 - 19

Functionality

0 - 3

4 - 7

8 - 11

20 - 23

24 - 27

28 - 31

Description

0: PF0

Debug-interface

Serial Wire clock

input and JTAG

Test Clock.

DBG_SWCLKTCK

DBG_SWDIOTMS

DBG_SWO

Note that this func-

tion is enabled to

the pin out of reset,

and has a built-in

pull down.

0: PF1

Debug-interface

Serial Wire data in-

put / output and

JTAG Test Mode

Select.

Note that this func-

tion is enabled to

the pin out of reset,

and has a built-in

pull up.

0: PF2

Debug-interface

Serial Wire viewer

Output.

1: PB13

2: PD15

3: PC11

Note that this func-

tion is not enabled

after reset, and

must be enabled by

software to be

used.

0: PF3

Debug-interface

JTAG Test Data In.

Note that this func-

tion becomes avail-

able after the first

valid JTAG com-

mand is received,

and has a built-in

pull up when JTAG

is active.

DBG_TDI

0: PF2

Debug-interface

JTAG Test Data

Out.

Note that this func-

tion becomes avail-

able after the first

valid JTAG com-

mand is received.

DBG_TDO

ETM_TCLK

0: PF8

1: PA5

2: PI2

Embedded Trace

Module ETM clock .

3: PC6

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Pin Definitions

Alternate

LOCATION

12 - 15 16 - 19

Functionality

0 - 3

4 - 7

8 - 11

20 - 23

24 - 27

28 - 31

Description

0: PF9

1: PA6

2: PI3

Embedded Trace

Module ETM data

0.

ETM_TD0

3: PC7

0: PF10

1: PA7

2: PB6

3: PC8

Embedded Trace

Module ETM data

1.

ETM_TD1

0: PF11

1: PA8

2: PB7

3: PC9

Embedded Trace

Module ETM data

2.

ETM_TD2

0: PF12

1: PA9

2: PB8

3: PC10

Embedded Trace

Module ETM data

3.

ETM_TD3

0: PA0

1: PA1

2: PA2

3: PA3

4: PA4

5: PA5

6: PB11

7: PB12

8: PB13

9: PB14

10: PB15 14: PC9

12: PC7

13: PC8

16: PC11 20: PD12 24: PF0

17: PD9 21: PD13 25: PF1

18: PD10 22: PD14 26: PF2

15: PC10 19: PD11 23: PD15 27: PF3

28: PF4

29: PF5

30: PF6

31: PF7

Frame Controller,

Data Sniffer Clock.

FRC_DCLK

11: PC6

0: PA2

1: PA3

2: PA4

3: PA5

4: PB11

5: PB12

6: PB13

7: PB14

8: PB15

9: PC6

10: PC7

11: PC8

12: PC9 16: PD10 20: PD14 24: PF2

13: PC10 17: PD11 21: PD15 25: PF3

28: PF6

29: PF7

30: PA0

31: PA1

Frame Controller,

Data Sniffer Frame

active

FRC_DFRAME

FRC_DOUT

14: PC11 18: PD12 22: PF0

26: PF4

27: PF5

15: PD9

19: PD13 23: PF1

0: PA1

1: PA2

2: PA3

3: PA4

4: PA5

8: PB14

9: PB15

10: PC6

11: PC7

12: PC8

13: PC9

16: PD9 20: PD13 24: PF1

17: PD10 21: PD14 25: PF2

28: PF5

29: PF6

30: PF7

31: PA0

Frame Controller,

Data Sniffer Out-

put.

5: PB11

6: PB12

7: PB13

14: PC10 18: PD11 22: PD15 26: PF3

15: PC11 19: PD12 23: PF0 27: PF4

0: PF2

Pin can be used to

wake the system

up from EM4

GPIO_EM4WU0

GPIO_EM4WU1

GPIO_EM4WU4

GPIO_EM4WU8

GPIO_EM4WU9

GPIO_EM4WU12

0: PF7

Pin can be used to

wake the system

up from EM4

0: PD14

0: PA3

0: PB13

0: PC10

Pin can be used to

wake the system

up from EM4

Pin can be used to

wake the system

up from EM4

Pin can be used to

wake the system

up from EM4

Pin can be used to

wake the system

up from EM4

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

Alternate

LOCATION

Functionality

0 - 3

4 - 7

8 - 11

12 - 15

16 - 19

20 - 23

24 - 27

28 - 31

Description

0: PA1

1: PA2

2: PA3

3: PA4

4: PA5

8: PB14

9: PB15

10: PC6

11: PC7

12: PC8

13: PC9

16: PD9

17: PD10 21: PD14 25: PF2

20: PD13 24: PF1

28: PF5

29: PF6

30: PF7

31: PA0

5: PB11

6: PB12

7: PB13

I2C0 Serial Clock

Line input / output.

I2C0_SCL

14: PC10 18: PD11 22: PD15 26: PF3

15: PC11 19: PD12 23: PF0 27: PF4

0: PA0

1: PA1

2: PA2

3: PA3

4: PA4

5: PA5

6: PB11

7: PB12

8: PB13

9: PB14

10: PB15 14: PC9

12: PC7

13: PC8

16: PC11 20: PD12 24: PF0

17: PD9 21: PD13 25: PF1

18: PD10 22: PD14 26: PF2

15: PC10 19: PD11 23: PD15 27: PF3

28: PF4

29: PF5

30: PF6

31: PF7

I2C0 Serial Data in-

put / output.

I2C0_SDA

11: PC6

0: PA7

1: PA8

2: PA9

3: PI2

4: PI3

8: PB9

9: PB10

10: PJ14 14: PC2

11: PJ15 15: PC3

12: PC0

13: PC1

16: PC4

17: PC5

20: PF8

21: PF9

24: PF12 28: PK0

25: PF13 29: PK1

5: PB6

6: PB7

7: PB8

I2C1 Serial Clock

Line input / output.

I2C1_SCL

18: PC10 22: PF10 26: PF14 30: PK2

19: PC11 23: PF11 27: PF15 31: PA6

0: PA6

1: PA7

2: PA8

3: PA9

4: PI2

5: PI3

6: PB6

7: PB7

8: PB8

9: PB9

10: PB10 14: PC1

11: PJ14 15: PC2

12: PJ15 16: PC3

20: PC11 24: PF11 28: PF15

13: PC0

17: PC4

18: PC5

21: PF8

22: PF9

25: PF12 29: PK0

26: PF13 30: PK1

I2C1 Serial Data in-

put / output.

I2C1_SDA

19: PC10 23: PF10 27: PF14 31: PK2

0: PK0

0: PA8

0: PA9

0: PJ14

0: PJ15

0: PI0

IDAC0_OUT

LES_ALTEX0

LES_ALTEX1

LES_ALTEX2

LES_ALTEX3

LES_ALTEX4

LES_ALTEX5

LES_ALTEX6

LES_ALTEX7

IDAC0 output.

LESENSE alternate

excite output 0.

LESENSE alternate

excite output 1.

LESENSE alternate

excite output 2.

LESENSE alternate

excite output 3.

LESENSE alternate

excite output 4.

0: PI1

LESENSE alternate

excite output 5.

0: PI2

LESENSE alternate

excite output 6.

0: PI3

LESENSE alternate

excite output 7.

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Pin Definitions

Alternate

LOCATION

12 - 15 16 - 19

Functionality

0 - 3

4 - 7

8 - 11

20 - 23

24 - 27

28 - 31

Description

0: PD8

LESENSE channel

0.

LES_CH0

LES_CH1

LES_CH2

LES_CH3

LES_CH4

LES_CH5

LES_CH6

LES_CH7

LES_CH8

LES_CH9

LES_CH10

LES_CH11

LES_CH12

0: PD9

0: PD10

0: PD11

0: PD12

0: PD13

0: PD14

0: PD15

0: PA0

LESENSE channel

1.

LESENSE channel

2.

LESENSE channel

3.

LESENSE channel

4.

LESENSE channel

5.

LESENSE channel

6.

LESENSE channel

7.

LESENSE channel

8.

0: PA1

LESENSE channel

9.

0: PA2

LESENSE channel

10.

0: PA3

LESENSE channel

11.

0: PA4

LESENSE channel

12.

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Pin Definitions

Alternate

LOCATION

12 - 15 16 - 19

Functionality

0 - 3

4 - 7

8 - 11

20 - 23

24 - 27

28 - 31

Description

0: PA5

LESENSE channel

13.

LES_CH13

LES_CH14

LES_CH15

LETIM0_OUT0

LETIM0_OUT1

LEU0_RX

0: PA6

0: PA7

LESENSE channel

14.

LESENSE channel

15.

0: PA0

1: PA1

2: PA2

3: PA3

4: PA4

5: PA5

6: PB11

7: PB12

8: PB13

9: PB14

10: PB15 14: PC9

12: PC7

13: PC8

16: PC11 20: PD12 24: PF0

17: PD9 21: PD13 25: PF1

18: PD10 22: PD14 26: PF2

15: PC10 19: PD11 23: PD15 27: PF3

28: PF4

29: PF5

30: PF6

31: PF7

Low Energy Timer

LETIM0, output

channel 0.

11: PC6

0: PA1

1: PA2

2: PA3

3: PA4

4: PA5

8: PB14

9: PB15

10: PC6

11: PC7

12: PC8

13: PC9

16: PD9

20: PD13 24: PF1

28: PF5

29: PF6

30: PF7

31: PA0

Low Energy Timer

LETIM0, output

channel 1.

5: PB11

6: PB12

7: PB13

17: PD10 21: PD14 25: PF2

14: PC10 18: PD11 22: PD15 26: PF3

15: PC11 19: PD12 23: PF0 27: PF4

0: PA1

1: PA2

2: PA3

3: PA4

4: PA5

8: PB14

9: PB15

10: PC6

11: PC7

12: PC8

13: PC9

16: PD9

20: PD13 24: PF1

28: PF5

29: PF6

30: PF7

31: PA0

5: PB11

6: PB12

7: PB13

17: PD10 21: PD14 25: PF2

LEUART0 Receive

input.

14: PC10 18: PD11 22: PD15 26: PF3

15: PC11 19: PD12 23: PF0 27: PF4

0: PA0

1: PA1

2: PA2

3: PA3

4: PA4

5: PA5

6: PB11

7: PB12

8: PB13

9: PB14

10: PB15 14: PC9

12: PC7

13: PC8

16: PC11 20: PD12 24: PF0

17: PD9 21: PD13 25: PF1

18: PD10 22: PD14 26: PF2

15: PC10 19: PD11 23: PD15 27: PF3

28: PF4

29: PF5

30: PF6

31: PF7

LEUART0 Transmit

output. Also used

as receive input in

half duplex commu-

nication.

LEU0_TX

11: PC6

0: PB14

Low Frequency

Crystal (typically

32.768 kHz) nega-

tive pin. Also used

as an optional ex-

ternal clock input

pin.

LFXTAL_N

0: PB15

Low Frequency

Crystal (typically

32.768 kHz) posi-

tive pin.

LFXTAL_P

0: PA3

1: PA4

2: PA5

3: PB11

4: PB12

5: PB13

6: PB14

7: PB15

8: PC6

9: PC7

10: PC8

11: PC9

12: PC10 16: PD11 20: PD15 24: PF3

28: PF7

29: PA0

30: PA1

31: PA2

MODEM antenna

control output 0,

used for antenna

diversity.

13: PC11 17: PD12 21: PF0

14: PD9 18: PD13 22: PF1

15: PD10 19: PD14 23: PF2

25: PF4

26: PF5

27: PF6

MODEM_ANT0

MODEM_ANT1

MODEM_DCLK

0: PA4

1: PA5

2: PB11

3: PB12

4: PB13

5: PB14

6: PB15

7: PC6

8: PC7

9: PC8

10: PC9

12: PC11 16: PD12 20: PF0

24: PF4

25: PF5

26: PF6

27: PF7

28: PA0

29: PA1

30: PA2

31: PA3

MODEM antenna

control output 1,

used for antenna

diversity.

13: PD9

17: PD13 21: PF1

14: PD10 18: PD14 22: PF2

11: PC10 15: PD11 19: PD15 23: PF3

0: PA0

1: PA1

2: PA2

3: PA3

4: PA4

5: PA5

6: PB11

7: PB12

8: PB13

9: PB14

10: PB15 14: PC9

11: PC6

12: PC7

16: PC11 20: PD12 24: PF0

17: PD9 21: PD13 25: PF1

18: PD10 22: PD14 26: PF2

15: PC10 19: PD11 23: PD15 27: PF3

28: PF4

29: PF5

30: PF6

31: PF7

13: PC8

MODEM data clock

out.

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

Alternate

LOCATION

Functionality

0 - 3

4 - 7

8 - 11

12 - 15

16 - 19

20 - 23

24 - 27

28 - 31

Description

0: PA1

1: PA2

2: PA3

3: PA4

4: PA5

8: PB14

9: PB15

10: PC6

11: PC7

12: PC8

13: PC9

16: PD9

17: PD10 21: PD14 25: PF2

20: PD13 24: PF1

28: PF5

29: PF6

30: PF7

31: PA0

5: PB11

6: PB12

7: PB13

MODEM_DIN

MODEM_DOUT

OPA0_N

MODEM data in.

14: PC10 18: PD11 22: PD15 26: PF3

15: PC11 19: PD12 23: PF0 27: PF4

0: PA2

1: PA3

2: PA4

3: PA5

4: PB11

5: PB12

6: PB13

7: PB14

8: PB15

9: PC6

10: PC7

11: PC8

12: PC9 16: PD10 20: PD14 24: PF2

13: PC10 17: PD11 21: PD15 25: PF3

14: PC11 18: PD12 22: PF0

15: PD9

28: PF6

29: PF7

30: PA0

31: PA1

MODEM data out.

26: PF4

27: PF5

19: PD13 23: PF1

0: PA4

Operational Amplifi-

er 0 external nega-

tive input.

0: PA2

Operational Amplifi-

er 0 external posi-

tive input.

OPA0_P

0: PD15

0: PD13

0: PB13

0: PB12

Operational Amplifi-

er 1 external nega-

tive input.

OPA1_N

Operational Amplifi-

er 1 external posi-

tive input.

OPA1_P

Operational Amplifi-

er 2 external nega-

tive input.

OPA2_N

Operational Amplifi-

er 2 output.

OPA2_OUT

OPA2_OUTALT

OPA2_P

0: PB9

1: PB10

Operational Amplifi-

er 2 alternative out-

put.

0: PB11

Operational Amplifi-

er 2 external posi-

tive input.

0: PA0

1: PA1

2: PA2

3: PA3

4: PA4

5: PA5

6: PB11

7: PB12

8: PB13

9: PB14

10: PB15 14: PC9

12: PC7

13: PC8

16: PC11 20: PD12 24: PF0

17: PD9 21: PD13 25: PF1

18: PD10 22: PD14 26: PF2

15: PC10 19: PD11 23: PD15 27: PF3

28: PF4

29: PF5

30: PF6

31: PF7

Pulse Counter

PCNT0 input num-

ber 0.

PCNT0_S0IN

PCNT0_S1IN

PCNT1_S0IN

11: PC6

0: PA1

1: PA2

2: PA3

3: PA4

4: PA5

8: PB14

9: PB15

10: PC6

11: PC7

12: PC8

13: PC9

16: PD9

20: PD13 24: PF1

28: PF5

29: PF6

30: PF7

31: PA0

Pulse Counter

PCNT0 input num-

ber 1.

5: PB11

6: PB12

7: PB13

17: PD10 21: PD14 25: PF2

14: PC10 18: PD11 22: PD15 26: PF3

15: PC11 19: PD12 23: PF0 27: PF4

0: PA6

1: PA7

2: PA8

3: PA9

4: PI2

5: PI3

6: PB6

7: PB7

8: PB8

9: PB9

10: PB10 14: PC1

11: PJ14 15: PC2

12: PJ15 16: PC3

13: PC0

20: PF7

21: PF8

22: PF9

24: PF11 28: PF15

25: PF12 29: PK0

26: PF13 30: PK1

Pulse Counter

PCNT1 input num-

ber 0.

17: PC4

18: PC5

19: PF6

23: PF10 27: PF14 31: PK2

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

Alternate

LOCATION

Functionality

0 - 3

4 - 7

4: PI3

5: PB6

6: PB7

7: PB8

8 - 11

12 - 15

16 - 19

20 - 23

24 - 27

28 - 31

Description

0: PA7

1: PA8

2: PA9

3: PI2

8: PB9

9: PB10

10: PJ14 14: PC2

11: PJ15 15: PC3

12: PC0

13: PC1

16: PC4

17: PC5

18: PF6

19: PF7

20: PF8

21: PF9

22: PF10 26: PF14 30: PK2

23: PF11 27: PF15 31: PA6

24: PF12 28: PK0

25: PF13 29: PK1

Pulse Counter

PCNT1 input num-

ber 1.

PCNT1_S1IN

PCNT2_S0IN

PCNT2_S1IN

PRS_CH0

PRS_CH1

PRS_CH2

PRS_CH3

PRS_CH4

PRS_CH5

PRS_CH6

PRS_CH7

PRS_CH8

PRS_CH9

0: PA6

1: PA7

2: PA8

3: PA9

4: PI2

5: PI3

6: PB6

7: PB7

8: PB8

9: PB9

10: PB10 14: PC1

11: PJ14 15: PC2

12: PJ15 16: PC3

20: PC11 24: PF11 28: PF15

Pulse Counter

PCNT2 input num-

ber 0.

13: PC0

17: PC4

18: PC5

21: PF8

22: PF9

25: PF12 29: PK0

26: PF13 30: PK1

19: PC10 23: PF10 27: PF14 31: PK2

0: PA7

1: PA8

2: PA9

3: PI2

4: PI3

8: PB9

9: PB10

10: PJ14 14: PC2

11: PJ15 15: PC3

12: PC0

13: PC1

16: PC4

17: PC5

20: PF8

21: PF9

24: PF12 28: PK0

25: PF13 29: PK1

Pulse Counter

PCNT2 input num-

ber 1.

5: PB6

6: PB7

7: PB8

18: PC10 22: PF10 26: PF14 30: PK2

19: PC11 23: PF11 27: PF15 31: PA6

0: PF0

1: PF1

2: PF2

3: PF3

4: PF4

5: PF5

6: PF6

7: PF7

8: PC6

9: PC7

10: PC8

11: PC9

12: PC10

13: PC11

Peripheral Reflex

System PRS, chan-

nel 0.

0: PF1

1: PF2

2: PF3

3: PF4

4: PF5

5: PF6

6: PF7

7: PF0

Peripheral Reflex

System PRS, chan-

nel 1.

0: PF2

1: PF3

2: PF4

3: PF5

4: PF6

5: PF7

6: PF0

7: PF1

Peripheral Reflex

System PRS, chan-

nel 2.

0: PF3

1: PF4

2: PF5

3: PF6

4: PF7

5: PF0

6: PF1

7: PF2

8: PD9

9: PD10

10: PD11 14: PD15

11: PD12

12: PD13

13: PD14

Peripheral Reflex

System PRS, chan-

nel 3.

0: PD9

4: PD13

5: PD14

6: PD15

Peripheral Reflex

System PRS, chan-

nel 4.

1: PD10

2: PD11

3: PD12

0: PD10

1: PD11

2: PD12

3: PD13

4: PD14

5: PD15

6: PD9

Peripheral Reflex

System PRS, chan-

nel 5.

0: PA0

1: PA1

2: PA2

3: PA3

4: PA4

5: PA5

6: PB11

7: PB12

8: PB13

9: PB14

10: PB15 14: PD12

12: PD10 16: PD14

13: PD11 17: PD15

Peripheral Reflex

System PRS, chan-

nel 6.

11: PD9

15: PD13

0: PA1

1: PA2

2: PA3

3: PA4

4: PA5

8: PB14

9: PB15

10: PA0

Peripheral Reflex

System PRS, chan-

nel 7.

5: PB11

6: PB12

7: PB13

0: PA2

1: PA3

2: PA4

3: PA5

4: PB11

5: PB12

6: PB13

7: PB14

8: PB15

9: PA0

10: PA1

Peripheral Reflex

System PRS, chan-

nel 8.

0: PA3

1: PA4

2: PA5

3: PB11

4: PB12

5: PB13

6: PB14

7: PB15

8: PA0

9: PA1

10: PA2

11: PC6

12: PC7

13: PC8

14: PC9

15: PC10

16: PC11

Peripheral Reflex

System PRS, chan-

nel 9.

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

Alternate

LOCATION

12 - 15 16 - 19

Functionality

0 - 3

4 - 7

8 - 11

20 - 23

24 - 27

28 - 31

Description

0: PC6

1: PC7

2: PC8

3: PC9

4: PC10

5: PC11

Peripheral Reflex

System PRS, chan-

nel 10.

PRS_CH10

PRS_CH11

TIM0_CC0

TIM0_CC1

TIM0_CC2

TIM0_CDTI0

TIM0_CDTI1

TIM0_CDTI2

TIM1_CC0

TIM1_CC1

TIM1_CC2

TIM1_CC3

US0_CLK

0: PC7

1: PC8

2: PC9

3: PC10

4: PC11

5: PC6

Peripheral Reflex

System PRS, chan-

nel 11.

0: PA0

1: PA1

2: PA2

3: PA3

4: PA4

5: PA5

6: PB11

7: PB12

8: PB13

9: PB14

10: PB15 14: PC9

12: PC7

13: PC8

16: PC11 20: PD12 24: PF0

17: PD9 21: PD13 25: PF1

18: PD10 22: PD14 26: PF2

15: PC10 19: PD11 23: PD15 27: PF3

28: PF4

29: PF5

30: PF6

31: PF7

Timer 0 Capture

Compare input /

output channel 0.

11: PC6

0: PA1

1: PA2

2: PA3

3: PA4

4: PA5

8: PB14

9: PB15

10: PC6

11: PC7

12: PC8

13: PC9

16: PD9

20: PD13 24: PF1

28: PF5

29: PF6

30: PF7

31: PA0

Timer 0 Capture

Compare input /

output channel 1.

5: PB11

6: PB12

7: PB13

17: PD10 21: PD14 25: PF2

14: PC10 18: PD11 22: PD15 26: PF3

15: PC11 19: PD12 23: PF0 27: PF4

0: PA2

1: PA3

2: PA4

3: PA5

4: PB11

5: PB12

6: PB13

7: PB14

8: PB15

9: PC6

10: PC7

11: PC8

12: PC9 16: PD10 20: PD14 24: PF2

13: PC10 17: PD11 21: PD15 25: PF3

14: PC11 18: PD12 22: PF0

15: PD9 19: PD13 23: PF1

28: PF6

29: PF7

30: PA0

31: PA1

Timer 0 Capture

Compare input /

output channel 2.

26: PF4

27: PF5

0: PA3

1: PA4

2: PA5

3: PB11

4: PB12

5: PB13

6: PB14

7: PB15

8: PC6

9: PC7

10: PC8

11: PC9

12: PC10 16: PD11 20: PD15 24: PF3

13: PC11 17: PD12 21: PF0

14: PD9 18: PD13 22: PF1

28: PF7

29: PA0

30: PA1

31: PA2

Timer 0 Compli-

mentary Dead Time

Insertion channel 0.

25: PF4

26: PF5

27: PF6

15: PD10 19: PD14 23: PF2

0: PA4

1: PA5

2: PB11

3: PB12

4: PB13

5: PB14

6: PB15

7: PC6

8: PC7

9: PC8

10: PC9

12: PC11 16: PD12 20: PF0

13: PD9

14: PD10 18: PD14 22: PF2

24: PF4

25: PF5

26: PF6

27: PF7

28: PA0

29: PA1

30: PA2

31: PA3

Timer 0 Compli-

mentary Dead Time

Insertion channel 1.

17: PD13 21: PF1

11: PC10 15: PD11 19: PD15 23: PF3

0: PA5

4: PB14

5: PB15

6: PC6

7: PC7

8: PC8

9: PC9

12: PD9

13: PD10 17: PD14 21: PF2

16: PD13 20: PF1

24: PF5

25: PF6

26: PF7

27: PA0

28: PA1

29: PA2

30: PA3

31: PA4

Timer 0 Compli-

mentary Dead Time

Insertion channel 2.

1: PB11

2: PB12

3: PB13

10: PC10 14: PD11 18: PD15 22: PF3

11: PC11 15: PD12 19: PF0 23: PF4

0: PA0

1: PA1

2: PA2

3: PA3

4: PA4

5: PA5

6: PB11

7: PB12

8: PB13

9: PB14

10: PB15 14: PC9

12: PC7

16: PC11 20: PD12 24: PF0

17: PD9 21: PD13 25: PF1

18: PD10 22: PD14 26: PF2

15: PC10 19: PD11 23: PD15 27: PF3

28: PF4

29: PF5

30: PF6

31: PF7

Timer 1 Capture

Compare input /

output channel 0.

13: PC8

11: PC6

0: PA1

1: PA2

2: PA3

3: PA4

4: PA5

8: PB14

9: PB15

10: PC6

11: PC7

12: PC8

13: PC9

16: PD9

20: PD13 24: PF1

28: PF5

29: PF6

30: PF7

31: PA0

Timer 1 Capture

Compare input /

output channel 1.

5: PB11

6: PB12

7: PB13

17: PD10 21: PD14 25: PF2

14: PC10 18: PD11 22: PD15 26: PF3

15: PC11 19: PD12 23: PF0 27: PF4

0: PA2

1: PA3

2: PA4

3: PA5

4: PB11

5: PB12

6: PB13

7: PB14

8: PB15

9: PC6

10: PC7

11: PC8

12: PC9 16: PD10 20: PD14 24: PF2

13: PC10 17: PD11 21: PD15 25: PF3

14: PC11 18: PD12 22: PF0

15: PD9 19: PD13 23: PF1

28: PF6

29: PF7

30: PA0

31: PA1

Timer 1 Capture

Compare input /

output channel 2.

26: PF4

27: PF5

0: PA3

1: PA4

2: PA5

3: PB11

4: PB12

5: PB13

6: PB14

7: PB15

8: PC6

9: PC7

10: PC8

11: PC9

12: PC10 16: PD11 20: PD15 24: PF3

28: PF7

29: PA0

30: PA1

31: PA2

Timer 1 Capture

Compare input /

output channel 3.

13: PC11 17: PD12 21: PF0

14: PD9 18: PD13 22: PF1

15: PD10 19: PD14 23: PF2

25: PF4

26: PF5

27: PF6

0: PA2

1: PA3

2: PA4

3: PA5

4: PB11

5: PB12

6: PB13

7: PB14

8: PB15

9: PC6

10: PC7

11: PC8

12: PC9

16: PD10 20: PD14 24: PF2

28: PF6

29: PF7

30: PA0

31: PA1

13: PC10 17: PD11 21: PD15 25: PF3

14: PC11 18: PD12 22: PF0

15: PD9 19: PD13 23: PF1

USART0 clock in-

put / output.

26: PF4

27: PF5

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

Alternate

LOCATION

12 - 15 16 - 19

12: PC10 16: PD11 20: PD15 24: PF3

Functionality

0 - 3

4 - 7

8 - 11

20 - 23

24 - 27

28 - 31

Description

0: PA3

1: PA4

2: PA5

3: PB11

4: PB12

5: PB13

6: PB14

7: PB15

8: PC6

9: PC7

10: PC8

11: PC9

28: PF7

29: PA0

30: PA1

31: PA2

13: PC11 17: PD12 21: PF0

14: PD9 18: PD13 22: PF1

25: PF4

26: PF5

27: PF6

USART0 chip se-

lect input / output.

US0_CS

15: PD10 19: PD14 23: PF2

0: PA4

1: PA5

2: PB11

3: PB12

4: PB13

5: PB14

6: PB15

7: PC6

8: PC7

9: PC8

10: PC9

12: PC11 16: PD12 20: PF0

24: PF4

25: PF5

26: PF6

27: PF7

28: PA0

29: PA1

30: PA2

31: PA3

USART0 Clear To

Send hardware

flow control input.

13: PD9

17: PD13 21: PF1

US0_CTS

US0_RTS

14: PD10 18: PD14 22: PF2

11: PC10 15: PD11 19: PD15 23: PF3

0: PA5

4: PB14

5: PB15

6: PC6

7: PC7

8: PC8

9: PC9

12: PD9

16: PD13 20: PF1

24: PF5

25: PF6

26: PF7

27: PA0

28: PA1

29: PA2

30: PA3

31: PA4

USART0 Request

To Send hardware

flow control output.

1: PB11

2: PB12

3: PB13

13: PD10 17: PD14 21: PF2

10: PC10 14: PD11 18: PD15 22: PF3

11: PC11 15: PD12 19: PF0 23: PF4

0: PA1

1: PA2

2: PA3

3: PA4

4: PA5

8: PB14

9: PB15

10: PC6

11: PC7

12: PC8

13: PC9

16: PD9

17: PD10 21: PD14 25: PF2

20: PD13 24: PF1

28: PF5

29: PF6

30: PF7

31: PA0

USART0 Asynchro-

nous Receive.

5: PB11

6: PB12

7: PB13

14: PC10 18: PD11 22: PD15 26: PF3

15: PC11 19: PD12 23: PF0 27: PF4

USART0 Synchro-

nous mode Master

Input / Slave Out-

put (MISO).

US0_RX

0: PA0

1: PA1

2: PA2

3: PA3

4: PA4

5: PA5

6: PB11

7: PB12

8: PB13

9: PB14

10: PB15 14: PC9

12: PC7

13: PC8

16: PC11 20: PD12 24: PF0

17: PD9 21: PD13 25: PF1

18: PD10 22: PD14 26: PF2

15: PC10 19: PD11 23: PD15 27: PF3

28: PF4

29: PF5

30: PF6

31: PF7

USART0 Asynchro-

nous Transmit. Al-

so used as receive

input in half duplex

communication.

11: PC6

US0_TX

USART0 Synchro-

nous mode Master

Output / Slave In-

put (MOSI).

0: PA2

1: PA3

2: PA4

3: PA5

4: PB11

5: PB12

6: PB13

7: PB14

8: PB15

9: PC6

10: PC7

11: PC8

12: PC9

16: PD10 20: PD14 24: PF2

28: PF6

29: PF7

30: PA0

31: PA1

13: PC10 17: PD11 21: PD15 25: PF3

14: PC11 18: PD12 22: PF0

15: PD9 19: PD13 23: PF1

USART1 clock in-

put / output.

US1_CLK

US1_CS

26: PF4

27: PF5

0: PA3

1: PA4

2: PA5

3: PB11

4: PB12

5: PB13

6: PB14

7: PB15

8: PC6

9: PC7

10: PC8

11: PC9

12: PC10 16: PD11 20: PD15 24: PF3

13: PC11 17: PD12 21: PF0

14: PD9 18: PD13 22: PF1

28: PF7

29: PA0

30: PA1

31: PA2

25: PF4

26: PF5

27: PF6

USART1 chip se-

lect input / output.

15: PD10 19: PD14 23: PF2

0: PA4

1: PA5

2: PB11

3: PB12

4: PB13

5: PB14

6: PB15

7: PC6

8: PC7

9: PC8

10: PC9

12: PC11 16: PD12 20: PF0

24: PF4

25: PF5

26: PF6

27: PF7

28: PA0

29: PA1

30: PA2

31: PA3

USART1 Clear To

Send hardware

flow control input.

13: PD9

17: PD13 21: PF1

US1_CTS

US1_RTS

14: PD10 18: PD14 22: PF2

11: PC10 15: PD11 19: PD15 23: PF3

0: PA5

4: PB14

5: PB15

6: PC6

7: PC7

8: PC8

9: PC9

12: PD9

16: PD13 20: PF1

24: PF5

25: PF6

26: PF7

27: PA0

28: PA1

29: PA2

30: PA3

31: PA4

USART1 Request

To Send hardware

flow control output.

1: PB11

2: PB12

3: PB13

13: PD10 17: PD14 21: PF2

10: PC10 14: PD11 18: PD15 22: PF3

11: PC11 15: PD12 19: PF0 23: PF4

0: PA1

1: PA2

2: PA3

3: PA4

4: PA5

8: PB14

9: PB15

10: PC6

11: PC7

12: PC8

13: PC9

16: PD9

17: PD10 21: PD14 25: PF2

20: PD13 24: PF1

28: PF5

29: PF6

30: PF7

31: PA0

USART1 Asynchro-

nous Receive.

5: PB11

6: PB12

7: PB13

14: PC10 18: PD11 22: PD15 26: PF3

15: PC11 19: PD12 23: PF0 27: PF4

USART1 Synchro-

nous mode Master

Input / Slave Out-

put (MISO).

US1_RX

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®

EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

Alternate

LOCATION

12 - 15 16 - 19

16: PC11 20: PD12 24: PF0

Functionality

0 - 3

4 - 7

8 - 11

20 - 23

24 - 27

28 - 31

Description

0: PA0

1: PA1

2: PA2

3: PA3

4: PA4

5: PA5

6: PB11

7: PB12

8: PB13

9: PB14

12: PC7

13: PC8

28: PF4

29: PF5

30: PF6

31: PF7

USART1 Asynchro-

nous Transmit. Al-

so used as receive

input in half duplex

communication.

17: PD9 21: PD13 25: PF1

18: PD10 22: PD14 26: PF2

15: PC10 19: PD11 23: PD15 27: PF3

10: PB15 14: PC9

11: PC6

US1_TX

USART1 Synchro-

nous mode Master

Output / Slave In-

put (MOSI).

0: PA7

1: PA8

2: PA9

3: PI0

4: PI1

5: PI2

6: PI3

7: PB6

8: PB7

9: PB8

10: PB9

12: PF0

13: PF1

14: PF3

16: PF5

17: PF6

18: PF7

19: PF8

20: PF9

21: PF10 25: PF14 29: PK2

22: PF11 26: PF15 30: PA5

24: PF13 28: PK1

USART2 clock in-

put / output.

US2_CLK

US2_CS

11: PB10 15: PF4

23: PF12 27: PK0

31: PA6

0: PA8

1: PA9

2: PI0

3: PI1

4: PI2

5: PI3

6: PB6

7: PB7

8: PB8

9: PB9

10: PB10 14: PF4

12: PF1

13: PF3

16: PF6

17: PF7

18: PF8

19: PF9

20: PF10 24: PF14 28: PK2

21: PF11 25: PF15 29: PA5

22: PF12 26: PK0

23: PF13 27: PK1

USART2 chip se-

lect input / output.

30: PA6

31: PA7

11: PF0

15: PF5

0: PA9

1: PI0

2: PI1

3: PI2

4: PI3

8: PB9

12: PF3

13: PF4

14: PF5

15: PF6

16: PF7

17: PF8

18: PF9

20: PF11 24: PF15 28: PA5

USART2 Clear To

Send hardware

flow control input.

5: PB6

6: PB7

7: PB8

9: PB10

10: PF0

11: PF1

21: PF12 25: PK0

22: PF13 26: PK1

29: PA6

30: PA7

31: PA8

US2_CTS

US2_RTS

19: PF10 23: PF14 27: PK2

0: PI0

1: PI1

2: PI2

3: PI3

4: PB6

5: PB7

6: PB8

7: PB9

8: PB10

9: PF0

10: PF1

11: PF3

12: PF4

13: PF5

14: PF6

15: PF7

16: PF8

17: PF9

18: PF10 22: PF14 26: PK2

19: PF11 23: PF15 27: PA5

20: PF12 24: PK0

21: PF13 25: PK1

28: PA6

29: PA7

30: PA8

31: PA9

USART2 Request

To Send hardware

flow control output.

0: PA6

1: PA7

2: PA8

3: PA9

4: PI0

5: PI1

6: PI2

7: PI3

8: PB6

9: PB7

10: PB8

11: PB9

12: PB10 16: PF4

20: PF8

21: PF9

22: PF10 26: PF14 30: PK2

23: PF11 27: PF15 31: PA5

24: PF12 28: PK0

25: PF13 29: PK1

USART2 Asynchro-

nous Receive.

13: PF0

14: PF1

15: PF3

17: PF5

18: PF6

19: PF7

USART2 Synchro-

nous mode Master

Input / Slave Out-

put (MISO).

US2_RX

0: PA5

1: PA6

2: PA7

3: PA8

4: PA9

5: PI0

6: PI1

7: PI2

8: PI3

12: PB9

13: PB10 17: PF4

14: PF0

15: PF1

16: PF3

20: PF7

21: PF8

22: PF9

24: PF11 28: PF15 USART2 Asynchro-

9: PB6

10: PB7

11: PB8

25: PF12 29: PK0

26: PF13 30: PK1

nous Transmit. Al-

so used as receive

input in half duplex

communication.

18: PF5

19: PF6

23: PF10 27: PF14 31: PK2

US2_TX

USART2 Synchro-

nous mode Master

Output / Slave In-

put (MOSI).

0: PD10

1: PD11

2: PD12

3: PD13

4: PD14

5: PD15

6: PI2

8: PB6

9: PB7

10: PB8

11: PB9

12: PB10 16: PC0

13: PB11 17: PC1

14: PJ14 18: PC2

15: PJ15 19: PC3

20: PC4

21: PC5

22: PF11 26: PF15 30: PD8

23: PF12 27: PK0 31: PD9

24: PF13 28: PK1

25: PF14 29: PK2

USART3 clock in-

put / output.

US3_CLK

US3_CS

7: PI3

0: PD11

1: PD12

2: PD13

3: PD14

4: PD15

5: PI2

6: PI3

8: PB7

9: PB8

10: PB9

12: PB11 16: PC1

13: PJ14 17: PC2

14: PJ15 18: PC3

20: PC5 24: PF14 28: PK2

21: PF11 25: PF15 29: PD8

22: PF12 26: PK0

23: PF13 27: PK1

USART3 chip se-

lect input / output.

30: PD9

31: PD10

7: PB6

11: PB10 15: PC0

19: PC4

0: PD12

1: PD13

2: PD14

3: PD15

4: PI2

5: PI3

6: PB6

7: PB7

8: PB8

9: PB9

10: PB10 14: PC0

11: PB11 15: PC1

12: PJ14 16: PC2

13: PJ15 17: PC3

20: PF11 24: PF15 28: PD8

USART3 Clear To

Send hardware

flow control input.

21: PF12 25: PK0

22: PF13 26: PK1

23: PF14 27: PK2

29: PD9

30: PD10

31: PD11

US3_CTS

18: PC4

19: PC5

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

Alternate

LOCATION

12 - 15 16 - 19

12: PJ15 16: PC3

Functionality

0 - 3

4 - 7

4: PI3

5: PB6

6: PB7

7: PB8

8 - 11

20 - 23

24 - 27

28 - 31

Description

0: PD13

1: PD14

2: PD15

3: PI2

8: PB9

9: PB10

20: PF12 24: PK0

21: PF13 25: PK1

22: PF14 26: PK2

28: PD9

USART3 Request

To Send hardware

flow control output.

13: PC0

10: PB11 14: PC1

11: PJ14 15: PC2

17: PC4

18: PC5

19: PF11 23: PF15 27: PD8

29: PD10

30: PD11

31: PD12

US3_RTS

US3_RX

0: PD9

4: PD13

5: PD14

6: PD15

7: PI2

8: PI3

12: PB9

16: PJ15 20: PC3

24: PF12 28: PK0

25: PF13 29: PK1

26: PF14 30: PK2

USART3 Asynchro-

nous Receive.

1: PD10

2: PD11

3: PD12

9: PB6

10: PB7

11: PB8

13: PB10 17: PC0

14: PB11 18: PC1

15: PJ14 19: PC2

21: PC4

22: PC5

23: PF11 27: PF15 31: PD8

USART3 Synchro-

nous mode Master

Input / Slave Out-

put (MISO).

0: PD8

1: PD9

2: PD10

3: PD11

4: PD12

5: PD13

6: PD14

7: PD15

8: PI2

9: PI3

10: PB6

11: PB7

12: PB8

13: PB9

14: PB10 18: PC0

15: PB11 19: PC1

16: PJ14 20: PC2

17: PJ15 21: PC3

24: PF11 28: PF15 USART3 Asynchro-

25: PF12 29: PK0

26: PF13 30: PK1

27: PF14 31: PK2

nous Transmit. Al-

so used as receive

input in half duplex

communication.

22: PC4

23: PC5

US3_TX

USART3 Synchro-

nous mode Master

Output / Slave In-

put (MOSI).

0: PA1

0: PA3

Digital to analog

converter VDAC0

external reference

input pin.

VDAC0_EXT

Digital to Analog

Converter DAC0

output channel

number 0.

VDAC0_OUT0 /

OPA0_OUT

0: PA5

1: PD13

2: PD15

Digital to Analog

Converter DAC0 al-

ternative output for

channel 0.

VDAC0_OUT0AL

T / OPA0_OUT-

ALT

0: PD14

Digital to Analog

Converter DAC0

output channel

number 1.

VDAC0_OUT1 /

OPA1_OUT

0: PD12

1: PA2

2: PA4

Digital to Analog

Converter DAC0 al-

ternative output for

channel 1.

VDAC0_OUT1AL

T / OPA1_OUT-

ALT

0: PA0

1: PA1

2: PA2

3: PA3

4: PA4

5: PA5

6: PA6

7: PA7

8: PA8

9: PA9

10: PB6

11: PB7

12: PB8

13: PB9

14: PB10 18: PB14 22: PC2

15: PB11 19: PB15 23: PC3

16: PB12 20: PC0

17: PB13 21: PC1

24: PC4

25: PC5

26: PC6

27: PC7

28: PC8

29: PC9

30: PC10 put / output channel

31: PC11 0.

Wide timer 0 Cap-

ture Compare in-

WTIM0_CC0

WTIM0_CC1

WTIM0_CC2

0: PA2

1: PA3

2: PA4

3: PA5

4: PA6

5: PA7

6: PA8

7: PA9

8: PB6

9: PB7

10: PB8

11: PB9

12: PB10 16: PB14 20: PC2

13: PB11 17: PB15 21: PC3

14: PB12 18: PC0

15: PB13 19: PC1

24: PC6

25: PC7

26: PC8

27: PC9

28: PC10 Wide timer 0 Cap-

29: PC11 ture Compare in-

30: PD8

31: PD9

22: PC4

23: PC5

put / output channel

1.

0: PA4

1: PA5

2: PA6

3: PA7

4: PA8

5: PA9

6: PB6

7: PB7

8: PB8

9: PB9

12: PB12 16: PC0

13: PB13 17: PC1

20: PC4

21: PC5

22: PC6

23: PC7

24: PC8

25: PC9

28: PD8

29: PD9

Wide timer 0 Cap-

ture Compare in-

10: PB10 14: PB14 18: PC2

11: PB11 15: PB15 19: PC3

26: PC10 30: PD10 put / output channel

27: PC11 31: PD11 2.

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

Alternate

LOCATION

Functionality

0 - 3

4 - 7

8 - 11

12 - 15

16 - 19

20 - 23

24 - 27

28 - 31

Description

0: PA8

1: PA9

2: PB6

3: PB7

4: PB8

5: PB9

6: PB10

7: PB11

8: PB12

9: PB13

10: PB14 14: PC2

11: PB15 15: PC3

12: PC0

13: PC1

16: PC4

17: PC5

18: PC6

19: PC7

20: PC8

21: PC9

24: PD8

25: PD9

28: PD12 Wide timer 0 Com-

29: PD13 plimentary Dead

WTIM0_CDTI0

WTIM0_CDTI1

WTIM0_CDTI2

WTIM1_CC0

WTIM1_CC1

WTIM1_CC2

WTIM1_CC3

22: PC10 26: PD10 30: PD14 Time Insertion

23: PC11 27: PD11 31: PD15 channel 0.

0: PB6

1: PB7

2: PB8

3: PB9

4: PB10

5: PB11

6: PB12

7: PB13

8: PB14

9: PB15

10: PC0

11: PC1

12: PC2

13: PC3

14: PC4

15: PC5

16: PC6

17: PC7

18: PC8

19: PC9

20: PC10 24: PD10 28: PD14 Wide timer 0 Com-

21: PC11 25: PD11 29: PD15 plimentary Dead

22: PD8

23: PD9

26: PD12 30: PF0

27: PD13 31: PF1

Time Insertion

channel 1.

0: PB8

1: PB9

2: PB10

3: PB11

4: PB12

5: PB13

6: PB14

7: PB15

8: PC0

9: PC1

10: PC2

11: PC3

12: PC4

13: PC5

14: PC6

15: PC7

16: PC8

17: PC9

20: PD8

21: PD9

24: PD12 28: PF0

25: PD13 29: PF1

Wide timer 0 Com-

plimentary Dead

Time Insertion

channel 2.

18: PC10 22: PD10 26: PD14 30: PF2

19: PC11 23: PD11 27: PD15 31: PF3

0: PB12

1: PB13

2: PB14

3: PB15

4: PC0

5: PC1

6: PC2

7: PC3

8: PC4

9: PC5

10: PC6

11: PC7

12: PC8

13: PC9

16: PD8

17: PD9

20: PD12 24: PF0

21: PD13 25: PF1

28: PF4

29: PF5

30: PF6

31: PF7

Wide timer 1 Cap-

ture Compare in-

put / output channel

0.

14: PC10 18: PD10 22: PD14 26: PF2

15: PC11 19: PD11 23: PD15 27: PF3

0: PB14

1: PB15

2: PC0

3: PC1

4: PC2

5: PC3

6: PC4

7: PC5

8: PC6

9: PC7

10: PC8

11: PC9

12: PC10 16: PD10 20: PD14 24: PF2

13: PC11 17: PD11 21: PD15 25: PF3

14: PD8

15: PD9

28: PF6

29: PF7

30: PF8

31: PF9

Wide timer 1 Cap-

ture Compare in-

put / output channel

1.

18: PD12 22: PF0

19: PD13 23: PF1

26: PF4

27: PF5

0: PC0

1: PC1

2: PC2

3: PC3

4: PC4

5: PC5

6: PC6

7: PC7

8: PC8

9: PC9

12: PD8

13: PD9

16: PD12 20: PF0

17: PD13 21: PF1

24: PF4

25: PF5

26: PF6

27: PF7

28: PF8

29: PF9

Wide timer 1 Cap-

ture Compare in-

10: PC10 14: PD10 18: PD14 22: PF2

11: PC11 15: PD11 19: PD15 23: PF3

30: PF10 put / output channel

31: PF11 2.

0: PC2

1: PC3

2: PC4

3: PC5

4: PC6

5: PC7

6: PC8

7: PC9

8: PC10

9: PC11

10: PD8

11: PD9

12: PD10 16: PD14 20: PF2

13: PD11 17: PD15 21: PF3

14: PD12 18: PF0

15: PD13 19: PF1

24: PF6

25: PF7

26: PF8

27: PF9

28: PF10 Wide timer 1 Cap-

29: PF11 ture Compare in-

30: PF12 put / output channel

31: PF13 3.

22: PF4

23: PF5

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

6.9 Analog Port (APORT) Client Maps

The Analog Port (APORT) is an infrastructure used to connect chip pins with on-chip analog clients such as analog comparators, ADCs,

DACs, etc. The APORT consists of a set of shared buses, switches, and control logic needed to configurably implement the signal rout-

ing. Figure 6.7 APORT Connection Diagram on page 171 shows the APORT routing for this device family (note that available features

may vary by part number). A complete description of APORT functionality can be found in the Reference Manual.

1X

IDAC0

1Y

ACMP1X

ACMP1Y

PB15

0X

1X

2X

3X

4X

NEXT1

NEXT0

PB14

0X

1X

2X

3X

4X

NEXT1

NEXT0

POS

NEG

PF0

PF1

PB13

POS

NEG

OPA2_N

0Y

1Y

2Y

3Y

4Y

PF2

ACMP0

PB12

PB11

0Y

1Y

2Y

3Y

PF3

ACMP1

OUT2

PF8

NEXT1

4Y

NEXT1

NEXT0

OPA2_P

PF9

PF10

PF11

PF12

PF13

PF14

PF15

PK0

PK1

PK2

PF4

PB10

PB9

VDAC0_OPA2ALT

0X

1X

2X

3X

4X

NEXT0

NEXT2

OUT2ALT

POS

NEG

PB8

PB7

0Y

1Y

2Y

3Y

4Y

NEXT1

ADC0

PB6

PI3

PI2

EXTP

EXTN

PI1

OPA1_P

1X

2X

3X

4X

PI0

POS

OPA0_P

1X

2X

3X

4X

PF5

PA9

POS

NEG

PF6

PA8

OPA1_N

1Y

2Y

3Y

4Y

PF7

PA7 LESENSE

PA6 LESENSE

NEG

OUT

OPA0_N

1Y

2Y

3Y

4Y

OPA1

OPA0

PA5 LESENSE

PA4 LESENSE

PA3 LESENSE

PA2 LESENSE

OUT1

OUT1ALT

OUT1

OUT2

OUT3

VDAC0_OUT0ALT

VDAC0_OUT1ALT

OUT0ALT

OUT1ALT

OUT0

OUT0ALT

OUT1

OUT2

OUT3

OPA0_INN0

OUT

OPA0_N

OUT4

NEXT1

OUT4

NEXT0

OPA0_OUT

OUT0

VDAC0_OUT1ALT

OUT1ALT

OPA2_P

1X

POS

NEG

OPA0_INP0

ADC0_EXTP

2X

3X

4X

OPA0_P

PA1 LESENSE

PA0 LESENSE

ADC_EXTP

OPA2_N

1Y

2Y

3Y

4Y

ADC0_EXTN

OPA0ALT

ADC_EXTN

OUT0ALT

OPA2

PD15 LESENSE

OPA1_INN0

OUT2

OUT2ALT

OUT1

OPA1N

OUT

OUT2

OUT3

OUT4

NEXT2

1X

1Y

3X

3Y

CEXT

CSEN

2X

2Y

nX, nY

APORTnX, APORTnY

CEXT_SENSE

4X

4Y

AX, BY, …

BUSAX, BUSBY, ...

ADC0X,

ADC0Y

BUSADC0X,

BUSADC0Y

ACMP0X,

BUSACMP0X,

ACMP1Y, … BUSACMP1Y, ...

Figure 6.7. APORT Connection Diagram

Client maps for each analog circuit using the APORT are shown in the following tables. The maps are organized by bus, and show the

peripheral's port connection, the shared bus, and the connection from specific bus channel numbers to GPIO pins.

In general, enumerations for the pin selection field in an analog peripheral's register can be determined by finding the desired pin con-

nection in the table and then combining the value in the Port column (APORT__), and the channel identifier (CH__). For example, if pin

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

PF7 is available on port APORT2X as CH23, the register field enumeration to connect to PF7 would be APORT2XCH23. The shared

bus used by this connection is indicated in the Bus column.

Table 6.9. ACMP0 Bus and Pin Mapping

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Pin Definitions

Table 6.10. ACMP1 Bus and Pin Mapping

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Pin Definitions

Table 6.11. ADC0 Bus and Pin Mapping

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

Table 6.12. CSEN Bus and Pin Mapping

CEXT

CEXT_SENSE

Table 6.13. IDAC0 Bus and Pin Mapping

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

Table 6.14. VDAC0 / OPA Bus and Pin Mapping

OPA0_N

OPA0_P

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

OPA1_N

OPA1_P

OPA2_N

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

OPA2_OUT

OPA2_P

VDAC0_OUT0 / OPA0_OUT

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

Pin Definitions

VDAC0_OUT1 / OPA1_OUT

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

BGA125 Package Specifications

7. BGA125 Package Specifications

7.1 BGA125 Package Dimensions

Figure 7.1. BGA125 Package Drawing

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

BGA125 Package Specifications

Table 7.1. BGA125 Package Dimensions

Dimension

Min

0.80

0.16

0.61

0.17

6.90

—

Typ

0.87

0.21

0.66

0.21

7.00

6.00

0.50

0.30

0.10

0.08

0.15

0.05

Max

0.94

0.26

0.71

0.25

7.10

—

A

A1

A2

c

D

E

D1

E1

e

—

b

0.25

0.35

aaa

bbb

ddd

eee

fff

Note:

1. All dimensions shown are in millimeters (mm) unless otherwise noted.

2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

BGA125 Package Specifications

7.2 BGA125 PCB Land Pattern

Figure 7.2. BGA125 PCB Land Pattern Drawing

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

BGA125 Package Specifications

Table 7.2. BGA125 PCB Land Pattern Dimensions

Dimension

Min

Nom

0.25

6.00

0.5

Max

X

C1

C2

E1

E2

0.5

Note:

1. All dimensions shown are in millimeters (mm) unless otherwise noted.

2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.

3. This Land Pattern Design is based on the IPC-7351 guidelines.

4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm

minimum, all the way around the pad.

5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.

6. The stencil thickness should be 0.125 mm (5 mils).

7. The ratio of stencil aperture to land pad size should be 1:1.

8. A No-Clean, Type-3 solder paste is recommended.

9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body Components.

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

BGA125 Package Specifications

7.3 BGA125 Package Marking

EFR32

PPPPPPPPPP

YYWWTTTTTT

Figure 7.3. BGA125 Package Marking

The package marking consists of:

• PPPPPPPPP – The part number designation.

1. Family Code (B | M | F)

2. G (Gecko)

3. Series (1, 2,...)

4. Device Configuration (1, 2,...)

5. Performance Grade (P | B | V)

6. Feature Code (1 to 7)

7. TRX Code (3 = TXRX | 2= RX | 1 = TX)

8. Band (1 = Sub-GHz | 2 = 2.4 GHz | 3 = Dual-band)

9. Flash (J = 1024K | H = 512K | G = 256K | F = 128K | E = 64K | D = 32K)

10. Temperature Grade (G = -40 to 85 | I = -40 to 125)

• YY – The last 2 digits of the assembly year.

• WW – The 2-digit workweek when the device was assembled.

• TTTTTT – A trace or manufacturing code. The first letter is the device revision.

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EFR32BG12 Blue Gecko Bluetooth Low Energy SoC Family Data Sheet

QFN48 Package Specifications

8. QFN48 Package Specifications

8.1 QFN48 Package Dimensions

Figure 8.1. QFN48 Package Drawing

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QFN48 Package Specifications

Table 8.1. QFN48 Package Dimensions

Dimension

Min

0.80

0.00

Typ

0.85

Max

0.90

0.05

A

A1

A3

b

0.02

0.20 REF

0.25

0.18

6.90

5.15

0.30

7.10

5.45

D

7.00

E

7.00

D2

E2

e

5.30

0.50 BSC

0.40

L

0.30

0.20

0.09

0.50

—

K

—

R

—

aaa

bbb

ccc

ddd

eee

fff

0.15

0.10

0.05

0.08

0.10

Note:

1. All dimensions shown are in millimeters (mm) unless otherwise noted.

2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.

3. This drawing conforms to the JEDEC Solid State Outline MO-220, Variation VKKD-4.

4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.

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QFN48 Package Specifications

8.2 QFN48 PCB Land Pattern

Figure 8.2. QFN48 PCB Land Pattern Drawing

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QFN48 Package Specifications

Table 8.2. QFN48 PCB Land Pattern Dimensions

Dimension

Typ

6.01

4.70

0.50

0.26

0.86

S1

S

L1

W1

e

W

L

Note:

1. All dimensions shown are in millimeters (mm) unless otherwise noted.

2. This Land Pattern Design is based on the IPC-7351 guidelines.

3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm

minimum, all the way around the pad.

4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.

5. The stencil thickness should be 0.125 mm (5 mils).

6. The ratio of stencil aperture to land pad size can be 1:1 for all perimeter pads.

7. A 4x4 array of 0.75 mm square openings on a 1.00 mm pitch can be used for the center ground pad.

8. A No-Clean, Type-3 solder paste is recommended.

9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.

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QFN48 Package Specifications

8.3 QFN48 Package Marking

EFR32

PPPPPPPPPP

YYWWTTTTTT

Figure 8.3. QFN48 Package Marking

The package marking consists of:

• PPPPPPPPP – The part number designation.

1. Family Code (B | M | F)

2. G (Gecko)

3. Series (1, 2,...)

4. Device Configuration (1, 2,...)

5. Performance Grade (P | B | V)

6. Feature Code (1 to 7)

7. TRX Code (3 = TXRX | 2= RX | 1 = TX)

8. Band (1 = Sub-GHz | 2 = 2.4 GHz | 3 = Dual-band)

9. Flash (J = 1024K | H = 512K | G = 256K | F = 128K | E = 64K | D = 32K)

10. Temperature Grade (G = -40 to 85 | I = -40 to 125)

• YY – The last 2 digits of the assembly year.

• WW – The 2-digit workweek when the device was assembled.

• TTTTTT – A trace or manufacturing code. The first letter is the device revision.

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QFN68 Package Specifications

9. QFN68 Package Specifications

9.1 QFN68 Package Dimensions

Figure 9.1. QFN68 Package Drawing

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QFN68 Package Specifications

Table 9.1. QFN68 Package Dimensions

Dimension

Min

0.80

0.00

Typ

0.85

Max

0.90

0.05

A

A1

A3

b

0.02

0.20 REF

0.20

0.15

7.90

6.05

0.25

8.10

6.35

D

8.00

E

8.00

D2

E2

e

6.20

0.40 BSC

0.40

L

0.30

0.20

0.50

—

K

—

R

0.075

—

aaa

bbb

ccc

ddd

eee

fff

0.10

0.07

0.10

0.05

0.08

0.10

Note:

1. All dimensions shown are in millimeters (mm) unless otherwise noted.

2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.

3. This drawing conforms to the JEDEC Solid State Outline MO-220, Variation VKKD-4.

4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.

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QFN68 Package Specifications

9.2 QFN68 PCB Land Pattern

Figure 9.2. QFN68 PCB Land Pattern Drawing

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QFN68 Package Specifications

Table 9.2. QFN68 PCB Land Pattern Dimensions

Dimension

Typ

0.86

0.22

0.40

7.01

6.35

L

W

e

S

S1

L1

W1

Note:

1. All dimensions shown are in millimeters (mm) unless otherwise noted.

2. This Land Pattern Design is based on the IPC-7351 guidelines.

3. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabri-

cation Allowance of 0.05mm.

4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm

minimum, all the way around the pad.

5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.

6. The stencil thickness should be 0.100 mm (4 mils).

7. The ratio of stencil aperture to land pad size can be 1:1 for all pads.

8. A 3x3 array of 1.50 mm square openings on a 1.80 mm pitch can be used for the center ground pad.

9. A No-Clean, Type-3 solder paste is recommended.

10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.

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QFN68 Package Specifications

9.3 QFN68 Package Marking

EFR32

PPPPPPPPPP

YYWWTTTTTT

Figure 9.3. QFN68 Package Marking

The package marking consists of:

• PPPPPPPPPP – The part number designation.

• TTTTTT – A trace or manufacturing code. The first letter is the device revision.

• YY – The last 2 digits of the assembly year.

• WW – The 2-digit workweek when the device was assembled.

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Revision History

10. Revision History

Revision 1.4

June, 2019

• Added new orderable part numbers for QFN68 I-grade variants

• System Overview Sections: Minor wording and typographical error fixes

Revision 1.3

June, 2018

• Added new orderable part numbers for QFN68 variants and associated packaging, pinout, and electrical specifications.

• Table 3.2 Configuration Summary on page 20: Corrected listed features for USART1 and USART3.

• : Added footnote to clarify IOVDD over-voltage operation conditions.

• 4.1.5.4 Current Consumption Using Radio 3.3 V with DC-DC: Updated typical 802.15.4 receive current specifications.

• Table 6.7 GPIO Functionality Table on page 136: Changed presentation to order table by pin name instead of pin location.

• Figure 6.7 APORT Connection Diagram on page 171: Corrected OPA output connections to route through "Y" buses.

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Revision History

Revision 1.1

October, 2017

• Updated Ordering Table to revision-C OPNs.

• Added high-temperature part numbers to Ordering Table and added associated specifications / content throughout document.

• Updated product highlights on Front Page and Feature List for consistency across EFR32xG1x family documentation.

• System Overview Updates

• Expanded Receiver Architecture section.

• Clarified / corrected energy mode mentions in RTCC and Opamp sections.

• Memory maps updated with LE peripherals and new formatting.

• Absolute Maximum Ratings Table:

• Removed redundant I_VSSMAXline.

• Added footnote to clarify V_DIGPINspecification for 5V tolerant GPIO.

• General Operating Conditions Table:

• Removed redundant footnote about shorting VREGVDD and AVDD together.

• Added footnote about IOVDD voltage restriction when CSEN peripheral is used with chopping enabled.

• Added footnote for additional information on peak current during voltage scaling operations.

• RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 1 Mbps Data Rate Table:

• Sensitivity, Co-channel interferer and Selectivity typical numbers updated to latest phy characterization data.

• BLOCK_OOBspecifications changed to show Min values instead of Typ.

• RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 2 Mbps Data Rate Table:

• SAT Typical value corrected from 5 to 10 dBm.

• BLOCK_OOBspecifications removed (not part of BLE 2 Mbps specification).

• RF Receiver Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band Table: Footnote added to BLOCK_80211Gspecifica-

tion to clarify blocker signal definition.

• Sub-GHz RF Receiver Characteristics for 915 MHz Band Table: Added O-QPSK DSSS phy specifications.

• Sub-GHz RF Transmitter Characteristics for 868 MHz Band Table: SPUR_{OOB_ETSI}below 1 GHz Typ corrected from -60 to -42

dBm.

• Sub-GHz RF Receiver Characteristics for 490 MHz Band Table: Corrected 10 kbps 2GFSK reference signal bandwidth to 20.038

kHz.

• Flash Memory Characteristics Table:

• Added timing measurement clarification for Device Erase and Mass Erase.

• Device Erase Time typical values corrected from 69 to 82 ms.

• Analog to Digital Converter (ADC) Table:

• Added header text for general specification conditions.

• Added footnote for clarification of input voltage limits.

• Digital to Analog Converter (VDAC) Table: Gain Error min/max specifications relaxed for REFSEL on 1V25LN, VDD, and EXT

settings.

• Current Digital to Analog Converter (IDAC) Table: Total accuracy STEPSEL value setting corrected from 0x80 to 0x10.

• Analog Port (APORT) Table: Operation in EM2/EM3 supply current changed from 915 to 67 nA (silicon fix from rev B to C).

• 2.4 GHz RF Transmitter Output Power Figure: Extended temperature range to 125 C.

• 2.4 GHz RF Receiver Sensitivity Figure: Updated with latest characterization data and added 125 C operational plots.

• Typical Sub-GHz Impedance-matching network circuits Figure: Corrected split between two examples from 450 MHz to 500

MHz.

• Minor typographical corrections, including capitalization, mis-spellings and punctuation marks, throughout document.

• Minor formatting and styling updates, including table formats, TOC location, and boilerplate information throughout document.

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Revision History

Revision 1.0

2017-04-14

• Added Thermal Characteristics table.

• Finalized specification tables. All tables were updated with latest characterization data and production test limits.

• Updated typical performance graphs for DC-DC.

• Minor typographical, clarity, and consistency improvements.

• Condensed pin function tables with new formatting.

Revision 0.6

2017-02-23

• Updated 2 Mbps BLE receiver specifications with latest characteriztion data.

• Added table-wide conditions to BLE 1 Mbps and 2 Mbps receiver tables.

• Clarified opamp noise measurement conditions in electrical spec table.

Revision 0.5

2017-02-03

• New corporate stylesheet applied.

• Updated device block diagrams on front page and in System Overview.

• Updated Feature List with latest characterization numbers.

• "Bluetooth Smart" changed to "Bluetooth Low Energy" throughout document.

• All OPNs changed to revision B.

• Minor typographical corrections and clarifications in System Overview.

• Electrical Characteristics Table Changes

• All specification tables updated with latest characterization data and production test limits.

• Split 2.4 GHz BLE tables into separate tables for 1 Mbps and 2 Mbps data rates.

• Split HFRCO/AUXHFRCO table into separate tables for HFRCO and AUXHFRCO.

• OPAMP, CSEN, and VDAC specification line items updated to match test conditions.

• Added tables for Analog Port (APORT) and Pulse Counter (PCNT).

• Added Typical Performance Curves for supply current, DCDC, and RF parameters.

• Added missing alternate functions and descriptions to Pinout and Alternate Function tables.

• Added APORT Connection Diagram.

• Corrected Package Marking description for QFN48 and BGA125.

• Corrected Package Marking diagram for QFN48.

Revision 0.2

2016-09-21

Initial release.

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Disclaimer

Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or

intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical"

parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes

without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information.

Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the

performance of the product. Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly grant

any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket

approval is required or Life Support Systems without the specific written consent of Silicon Labs. A "Life Support System" is any product or system intended to support or sustain life and/or

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型号：	EFR32BG12P232F1024GM68-CR
厂家：	SILICON
描述：	SPECIALTY TELECOM CIRCUIT,
文件：	总198页 (文件大小：2533K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

EFR32BG12P232F1024GM68-CR [SILICON]

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