SI4709-C [SILICON]

BROADCAST FM RADIO TUNER FOR PORTABLE APPLICATIONS;
SI4709-C
型号: SI4709-C
厂家: SILICON    SILICON
描述:

BROADCAST FM RADIO TUNER FOR PORTABLE APPLICATIONS

文件: 总40页 (文件大小:1398K)
中文:  中文翻译
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Si4708/09-C  
BROADCAST FM RADIO TUNER FOR PORTABLE APPLICATIONS  
Features  
Worldwide FM band support  
Adjustable soft mute  
Volume control  
(76–108 MHz)  
Digital low-IF receiver  
Line-level analog output  
32.768 kHz reference clock  
Frequency synthesizer with  
integrated VCO  
2-wire and 3-wire control  
Adjustable seek tuning  
interface  
Ordering Information:  
Automatic frequency control  
2.7 to 5.5 V supply voltage  
D
See page 34.  
(AFC)  
2.7 to 5.5 V supply voltage  
A
Automatic gain control (AGC)  
Excellent overload immunity  
Signal strength measurement  
Integrated LDO regulator allows  
Pin Assignments  
(Top View)  
direct connection to battery  
2.5 x 2.5 mm 16-pin QFN  
package  
Pb-free/RoHS compliant  
RDS/RBDS Processor (Si4709)  
Programmable de-emphasis  
(50/75 µs)  
Si4708/09-GM  
Adaptive noise suppression  
1
2
16  
15  
14  
13  
LOUT  
Applications  
FMI  
12 ROUT  
GND  
PAD  
Cellular handsets  
MP3 players  
Portable navigation USB FM radio  
Consumer electronics PDAs  
RFGND  
3
11 GND  
4
5
10 VD  
9
RST  
SEN  
Portable radios  
Mobile Internet  
Notebook PCs  
Net PCs  
6
7
8
devices  
Description  
The Si4708/09 is the world's smallest FM broadcast receiver, integrating  
the complete tuner function from antenna input to stereo audio output with  
RDS (Si4709).  
This product, its features, and/or its  
architecture is covered by one or  
more of the following patents, as well  
as other patents, pending and  
issued, both foreign and domestic:  
7,127,217; 7,272,373; 7,272,375;  
7,321,324; 7,355,476; 7,426,376;  
7,471,940; 7,339,503; 7,339,504.  
Functional Block Diagram  
Headphone  
Si4708/09  
Cable  
I
LOUT  
DAC  
DAC  
GPIO  
Notes:  
ADC  
FMI  
1. To ensure proper operation and FM  
receiver performance, follow the  
guidelines in “AN350: Si4708/09  
Antenna, Schematic, Layout, and  
Design Guidelines" and “AN383:  
Si47xx Antenna Selection and  
Universal Layout Guidelines.” Silicon  
Laboratories will evaluate schematics  
and layouts for qualified customers.  
2. Place Si4708/09 as close as possible  
to antenna jack and keep the FMI  
trace as short as possible.  
LNA  
PGA  
DSP  
RFGND  
Q
ADC  
ROUT  
GPO  
AGC  
TUNE  
REG  
0 / 90  
LOW-IF  
32.768 kHz  
VIO  
RST  
RCLK  
RDS  
(Si4709)  
AFC  
SDIO  
SCLK  
SEN  
VA  
VD  
RSSI  
Rev. 1.2 10/10  
Copyright © 2010 by Silicon Laboratories  
Si4708/09-C  
Si4708/09-C  
2
Rev. 1.2  
Si4708/09-C  
TABLE OF CONTENTS  
Section  
Page  
1. Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4  
2. Typical Application Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12  
3. Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12  
4. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13  
4.1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13  
4.2. FM Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14  
4.3. General Purpose Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14  
4.4. RDS/RBDS Processor and Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14  
4.5. Stereo Audio Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15  
4.6. Tuning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15  
4.7. Reference Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16  
4.8. Control Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16  
4.9. Reset, Powerup, and Powerdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17  
4.10. Audio Output Summation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18  
4.11. Initialization Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18  
4.12. Programming Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18  
5. Register Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19  
6. Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20  
7. Pin Descriptions: Si4708/09-GM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33  
8. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34  
9. Package Markings (Top Marks) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35  
9.1. Si4708 Top Mark . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35  
9.2. Si4709 Top Mark . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35  
9.3. Top Mark Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35  
10. Package Outline: Si4708/09-GM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36  
11. PCB Land Pattern: Si4708/09-GM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37  
12. Additional Reference Resources. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38  
Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39  
Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40  
Rev. 1.2  
3
Si4708/09-C  
1. Electrical Specifications  
Table 1. Recommended Operating Conditions  
Parameter  
Symbol Test Condition  
Min  
2.7  
2.7  
1.62  
–20  
10  
Typ  
Max  
5.5  
5.5  
3.6  
85  
Unit  
V
Digital Supply Voltage  
V
D
Analog Supply Voltage  
V
V
A
Interface Supply Voltage  
V
V
IO  
Ambient Temperature  
T
25  
°C  
µs  
µs  
µs  
A
Digital Power Supply Power-Up Rise Time  
Analog Power Supply Power-Up Rise Time  
Interface Power Supply Power-Up Rise Time  
V
DRISE  
V
10  
ARISE  
V
10  
IRISE  
Note: All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions.  
Typical values apply at V = V = 3.3 V and 25 °C unless otherwise stated. Parameters are tested in production unless  
D
A
otherwise stated.  
Table 2. Absolute Maximum Ratings1,2  
Parameter  
Symbol  
Value  
–0.5 to 5.8  
–0.5 to 5.8  
–0.5 to 3.9  
±10  
Unit  
V
Digital Supply Voltage  
Analog Supply Voltage  
Interface Supply Voltage  
V
D
V
V
A
V
V
IO  
IN  
3
Input Current  
I
mA  
V
3
Input Voltage  
V
–0.3 to (V + 0.3)  
IN  
IO  
Operating Temperature  
Storage Temperature  
T
–40 to 95  
–55 to 150  
0.4  
°C  
°C  
OP  
T
STG  
4
RF Input Level  
V
pK  
Notes:  
1. Permanent device damage may occur if the above Absolute Maximum Ratings are exceeded. Functional operation  
should be restricted to the conditions as specified in the operational sections of this data sheet. Exposure beyond  
recommended operating conditions for extended periods may affect device reliability.  
2. The Si4708/09 device is a high-performance RF integrated circuit with an ESD rating of < 2 kV HBM. Handling and  
assembly of this device should only be done at ESD-protected workstations.  
3. For input pins SCLK, SEN, SDIO, RST, RCLK, and GPO.  
4. At RF input pins.  
4
Rev. 1.2  
Si4708/09-C  
Table 3. DC Characteristics  
(VD = VA = 2.7 to 3.6 V, VIO = 1.62 to 3.6 V, TA = –20 to 85 °C)  
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
FM Receiver to Line Output  
V
V
V
Supply Current  
Supply Current  
I
I
I
16.4  
18.2  
17  
19.3  
21.1  
19.8  
mA  
mA  
mA  
DD  
DD  
DD  
FM  
FM  
FM  
1
Low SNR level  
2
RDS Supply Current  
Supplies and Interface  
Interface Supply Current  
I
300  
2.6  
4.4  
4.0  
µA  
µA  
µA  
µA  
V
IO  
Digital Powerdown Current  
Analog Powerdown Current  
I
DDPD  
I
Enable = 0  
APD  
V
Powerdown Current  
I
SCLK, RCLK inactive  
IO  
IOPD  
3
High Level Input Voltage  
V
0.7 x V  
–0.3  
–10  
–10  
V
+ 0.3  
IO  
IH  
IO  
3
Low Level Input Voltage  
V
0.3 x V  
10  
V
IL  
IO  
3
High Level Input Current  
I
V
= V = 3.6 V  
µA  
µA  
IH  
IN  
IO  
3
Low Level Input Current  
I
V
= 0 V,  
IN  
10  
IL  
V
= 3.6 V  
IO  
4
High Level Output Voltage  
V
I
= 500 µA  
0.8 x V  
V
V
OH  
OUT  
OUT  
IO  
4
Low Level Output Voltage  
V
I
= –500 µA  
0.2 x V  
OL  
IO  
Notes:  
1. LNA is automatically switched to higher current mode for optimum sensitivity in weak signal conditions.  
2. Guaranteed by characterization.  
3. For input pins SCLK, SEN, SDIO, RST, RCLK, DCLK, DFS, GPO1, GPO2, and GPO3.  
4. For output pins SDIO, DOUT, GPO1, GPO2, and GPO3.  
Rev. 1.2  
5
Si4708/09-C  
Table 4. Reset Timing Characteristics (Busmode Select Method)1,2,3  
(VDD = 2.7 to 5.5 V, VIO = 1.62 to 3.6 V, TA = –20 to 85 °C)  
Parameter  
Symbol  
Min  
30  
Typ  
Max  
Unit  
ns  
SEN Input to RSTSetup  
SEN Input to RSTHold  
Notes:  
t
SRST1  
t
30  
ns  
HRST1  
1. When selecting 2-wire Mode, the user must ensure that a 2-wire start condition (falling edge of SDIO while SCLK is  
high) does not occur within 300 ns before the rising edge of RST.  
2. When selecting 3-wire Mode, the user must ensure that a rising edge of SCLK does not occur within 300 ns before the  
rising edge of RST.  
3. When selecting 2-wire mode, the user must ensure that SCLK is high during the rising edge of RST, and stays high until  
after the 1st start condition.  
tSRST  
tHRST  
70%  
30%  
RST  
SEN  
70%  
30%  
Figure 1. Reset Timing Parameters  
6
Rev. 1.2  
Si4708/09-C  
Table 5. 3-Wire Control Interface Characteristics  
(VD = VA = 2.7 to 5.5 V, VIO = 1.62 to 3.6 V, TA = –20 to 85 °C)  
Parameter  
Symbol  
Test Condition  
Min  
0
Typ  
Max  
2.5  
Unit  
MHz  
ns  
SCLK Frequency  
f
CLK  
SCLK High Time  
t
25  
25  
20  
10  
10  
10  
2
HIGH  
SCLK Low Time  
t
ns  
LOW  
SDIO Input, SEN to SCLKSetup  
SDIO Input to SCLKHold  
SEN Input to SCLKHold  
SEN Input to SCLKHold  
SCLKto SDIO Output Valid  
SCLKto SDIO Output High Z  
t
ns  
S
t
t
ns  
HSDIO  
ns  
HSEN1  
HSEN2  
t
ns  
t
Read  
Read  
25  
25  
ns  
CDV  
t
2
ns  
CDZ  
Note: When selecting 3-wire Mode, the user must ensure that a rising edge of SCLK does not occur within 300 ns before the  
rising edge of RST.  
70%  
SCLK  
30%  
tHSDIO  
tHIGH  
tLOW  
tHSEN1  
tHSEN2  
tS  
70%  
30%  
tS  
SEN  
A6-A5,  
R/W,  
A4-A1  
70%  
30%  
A7  
A0  
D15  
D14-D1  
D0  
SDIO  
Address In  
Data In  
Figure 2. 3-Wire Control Interface Write Timing Parameters  
70%  
30%  
SCLK  
SEN  
tHSDIO  
tCDV  
tHSEN1  
tHSEN2  
tS  
tCDZ  
70%  
30%  
tS  
80%  
20%  
A6-A5,  
R/W,  
A4-A1  
A7  
A0  
D15  
D14-D1  
D0  
SDIO  
½ Cycle Bus  
Turnaround  
Address In  
Data Out  
Figure 3. 3-Wire Control Interface Read Timing Parameters  
Rev. 1.2  
7
Si4708/09-C  
Table 6. 2-Wire Control Interface Characteristics1,2,3  
(VD = VA = 2.7 to 5.5 V, VIO = 1.62 to 3.6 V, TA = –20 to 85 °C)  
Parameter  
Symbol Test Condition  
Min  
0
Typ  
Max  
400  
Unit  
kHz  
µs  
SCLK Frequency  
SCLK Low Time  
SCLK High Time  
f
SCL  
t
1.3  
0.6  
0.6  
LOW  
t
µs  
HIGH  
SCLK Input to SDIOSetup  
t
t
µs  
SU:STA  
(START)  
SCLK Input to SDIOHold (START)  
SDIO Input to SCLKSetup  
0.6  
100  
µs  
ns  
ns  
µs  
µs  
ns  
ns  
HD:STA  
SU:DAT  
t
t
4,5  
SDIO Input to SCLKHold  
0
900  
HD:DAT  
SU:STO  
SCLK input to SDIOSetup (STOP)  
STOP to START Time  
t
0.6  
t
1.3  
BUF  
SDIO Output Fall Time  
t
20 + 0.1 C  
20 + 0.1 C  
250  
300  
f:OUT  
b
b
SDIO Input, SCLK Rise/Fall Time  
t
t
f:IN  
r:IN  
SCLK, SDIO Capacitive Loading  
Input Filter Pulse Suppression  
Notes:  
C
50  
50  
pF  
ns  
b
t
SP  
1. When VIO = 0 V, SCLK and SDIO are low impedance.  
2. When selecting 2-wire mode, the user must ensure that SCLK is high during the rising edge of RST, and stays high  
until after the 1st start condition.  
3. When selecting 2-wire Mode, the user must ensure that a 2-wire start condition (falling edge of SDIO while SCLK is  
high) does not occur within 300 ns before the rising edge of RST.  
4. As a 2-wire transmitter, the Si4708/09-C delays SDIO by a minimum of 300 ns from the VIH threshold of SCLK to  
comply with the 0 ns tHD:DAT specification.  
5. The maximum tHD:DAT has only to be met when fSCL = 400 kHz. At frequencies below 400 kHz, tHD:DAT may be violated  
so long as all other timing parameters are met.  
8
Rev. 1.2  
Si4708/09-C  
tSU:STA tHD:STA  
tLOW  
tHIGH  
tr:IN  
tf:IN  
tSP  
tSU:STO  
tBUF  
70%  
30%  
SCLK  
SDIO  
70%  
30%  
tf:IN,  
tf:OUT  
START  
tHD:DAT tSU:DAT  
tr:IN  
STOP  
START  
Figure 4. 2-Wire Control Interface Read and Write Timing Parameters  
SCLK  
A6-A0,  
R/W  
D7-D0  
D7-D0  
SDIO  
START  
ADDRESS + R/W  
ACK  
DATA  
ACK  
DATA  
ACK  
STOP  
Figure 5. 2-Wire Control Interface Read and Write Timing Diagram  
Rev. 1.2  
9
Si4708/09-C  
Table 7. FM Receiver Characteristics1,2  
(V = V = 2.7 to 5.5 V, V = 1.62 to 3.6 V, TA = –20 to 85 °C)  
D
A
IO  
Parameter  
Symbol  
Test Condition  
Min  
76  
Typ  
Max  
108  
3.5  
Unit  
MHz  
Input Frequency  
f
RF  
3,4,5,6,7  
Sensitivity  
(S+N)/N = 26 dB  
(S+N)/N = 26 dB  
1.7  
1.1  
µVEMF  
µVEMF  
Sensitivity (50 matching  
3,4,5,6,8  
network)  
8
RDS Sensitivity  
f = 2 kHz,  
15  
µVEMF  
RDS BLER < 5%  
8,9  
LNA Input Resistance  
3
4
4
5
5
6
k  
pF  
8,9  
LNA Input Capacitance  
8,10  
Input IP3  
103  
40  
35  
60  
35  
106  
55  
200  
50  
90  
1
dBµVEMF  
dB  
3,4,5,8,9  
AM Suppression  
m = 0.3  
±200 kHz  
±400 kHz  
In-band  
Adjacent Channel Selectivity  
Alternate Channel Selectivity  
Spurious Response Rejection  
RCLK Frequency  
50  
dB  
70  
dB  
8
dB  
32.768  
kHz  
11  
RCLK Frequency Tolerance  
SPACE[1:0] = 00 or 01 –200  
ppm  
SPACE[1:0] = 10  
–50  
72  
3,4,5,9  
Audio Output Voltage  
80  
mV  
RMS  
3,4,9,12  
8
Audio Output L/R Imbalance  
dB  
–3 dB  
–3 dB  
30  
Hz  
kHz  
dB  
Audio Frequency Response Low  
8
15  
25  
Audio Frequency Response High  
3,9,12  
Audio Stereo Separation  
Notes:  
1. Additional testing information is available in Application Note AN388. Volume = maximum for all tests.  
2. Important Note: To ensure proper operation and FM receiver performance, follow the guidelines in “AN350: Si4708/09  
Antenna, Schematic, Layout, and Design Guidelines.” Silicon Laboratories will evaluate schematics and layouts for  
qualified customers.  
3. F  
= 1 kHz, 75 µs de-emphasis  
MOD  
4. MONO = 1, and L = R unless noted otherwise.  
5. f = 22.5 kHz.  
6. B = 300 Hz to 15 kHz, A-weighted.  
AF  
7. Typical sensitivity with headphone matching network.  
8. Guaranteed by characterization.  
9. V  
= 1 mV.  
EMF  
10. |f – f | > 1 MHz, f = 2 x f – f . AGC is disabled by setting AGCD = 1. Refer to "6. Register Descriptions" on page  
2
1
0
1
2
20.  
11. The channel spacing is selected with the SPACE[1:0] bits. Refer to "6. Register Descriptions" on page 20. Seek/Tune  
timing is guaranteed for 100 and 200 kHz channel spacing. ±50 ppm PCLK tolerance required for 50 kHz channel  
spacing.  
12. f = 75 kHz.  
13. The de-emphasis time constant is selected with the DE bit. Refer to "6. Register Descriptions" on page 20.  
14. At LOUT and ROUT pins.  
15. Do not enable STC interrupts before the powerup time is complete. If STC interrupts are enabled before the powerup  
time is complete, an interrupt will be generated within the powerup interval when the initial default tune operation is  
complete. See "AN349: Si4708/09 Programming Guide" for more information.  
16. Minimum and maximum at room temperature (25 °C).  
10  
Rev. 1.2  
Si4708/09-C  
Table 7. FM Receiver Characteristics1,2 (Continued)  
(V = V = 2.7 to 5.5 V, V = 1.62 to 3.6 V, TA = –20 to 85 °C)  
D
A
IO  
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
BLNDADJ = 10  
10 dB stereo separation  
3,8,12  
Mono/Stereo Switching Level  
34  
dBµVEMF  
3,4,5,6,9  
Audio Mono S/N  
55  
60  
58  
dB  
dB  
%
3,5,6,8  
Audio Stereo S/N  
BLNDADJ = 10  
3,4,9,12  
Audio THD  
0.1  
75  
0.5  
80  
54  
0.9  
13  
De-emphasis Time Constant  
DE = 0  
DE = 1  
70  
µs  
µs  
V
45  
50  
14  
Audio Common Mode Voltage  
ENABLE = 1  
0.65  
0.8  
ENABLE = 0  
AHIZEN = 1  
14  
8,14  
Audio Common Mode Voltage  
0.5 x V  
V
IO  
Audio Output Load Resistance  
R
Single-ended  
Single-ended  
10  
50  
60  
k  
L
8,14  
Audio Output Load Capacitance  
C
pF  
L
8,11  
Seek/Tune Time  
SPACE[1:0] = 0x,  
RCLK  
ms/  
channel  
tolerance = 200 ppm,  
(x = 0 or 1)  
15  
Powerup Time  
From powerdown  
(Write ENABLE bit to 1)  
110  
3
ms  
dB  
16  
RSSI Offset  
Input levels of 8 and  
60 dBµV at RF input  
–3  
Notes:  
1. Additional testing information is available in Application Note AN388. Volume = maximum for all tests.  
2. Important Note: To ensure proper operation and FM receiver performance, follow the guidelines in “AN350: Si4708/09  
Antenna, Schematic, Layout, and Design Guidelines.” Silicon Laboratories will evaluate schematics and layouts for  
qualified customers.  
3. F  
= 1 kHz, 75 µs de-emphasis  
MOD  
4. MONO = 1, and L = R unless noted otherwise.  
5. f = 22.5 kHz.  
6. B = 300 Hz to 15 kHz, A-weighted.  
AF  
7. Typical sensitivity with headphone matching network.  
8. Guaranteed by characterization.  
9. V  
= 1 mV.  
EMF  
10. |f – f | > 1 MHz, f = 2 x f – f . AGC is disabled by setting AGCD = 1. Refer to "6. Register Descriptions" on page  
2
1
0
1
2
20.  
11. The channel spacing is selected with the SPACE[1:0] bits. Refer to "6. Register Descriptions" on page 20. Seek/Tune  
timing is guaranteed for 100 and 200 kHz channel spacing. ±50 ppm PCLK tolerance required for 50 kHz channel  
spacing.  
12. f = 75 kHz.  
13. The de-emphasis time constant is selected with the DE bit. Refer to "6. Register Descriptions" on page 20.  
14. At LOUT and ROUT pins.  
15. Do not enable STC interrupts before the powerup time is complete. If STC interrupts are enabled before the powerup  
time is complete, an interrupt will be generated within the powerup interval when the initial default tune operation is  
complete. See "AN349: Si4708/09 Programming Guide" for more information.  
16. Minimum and maximum at room temperature (25 °C).  
Rev. 1.2  
11  
Si4708/09-C  
2. Typical Application Schematic  
R1  
GPO  
LOUT  
1
12  
11  
10  
9
ROUT  
NC  
2
ROUT  
GND  
VD  
FMI  
FMIP  
3
4
VBATTERY  
2.7 to 5.5 V  
RFGND  
RFGND  
RST  
RCLK  
C1  
RST  
SEN  
RCLK  
SCLK  
SDIO  
VIO  
1.62 to 3.6 V  
Notes:  
1. Place C1 close to V pin.  
D
2. All grounds connect directly to GND plane on PCB.  
3. Pins 1 and 16 are no connects, leave floating.  
4. Important Note: FM Receiver performance is subject to adherence to antenna design guidelines in “AN350: Si4708/09  
Antenna, Schematic, Layout, and Design Guidelines.” Failure to use these guidelines may negatively affect the  
performance of the Si4708/09, particularly in weak signal and noisy environments. Silicon Laboratories will evaluate  
schematics and layouts for qualified customers.  
5. Pin 2 connects to the antenna interface, refer to “AN350: Si4708/09 Antenna, Schematic, Layout, and Design  
Guidelines” and "AN383: Si47xx Antenna, Schematic, Layout, and Design Guidelines."  
6. RFGND should be locally isolated from GND, refer to “AN350: Si4708/09 Antenna, Schematic, Layout, and Design  
Guidelines.”  
7. Place Si4708/09 as close as possible to antenna jack and keep the FMI trace as short as possible.  
8. V and V may be supplied from the same V or may be supplied by independent power supplies.  
A
D
BAT  
9. Place R1 on the opposite side of the PCB as the tuner (as close to pin 15 as possible), and route the GPO trace to the  
system controller on this layer.  
3. Bill of Materials  
Component(s)  
Value/Description  
Supplier(s)  
C1  
R1  
U1  
Supply bypass capacitor, 22 nF, ±20%, Z5U/X7R  
GPO resistor, 1 k  
Murata  
Venkel  
Si4708/09 FM Radio Tuner  
Silicon Laboratories  
12  
Rev. 1.2  
Si4708/09-C  
4. Functional Description  
Headphone  
Cable  
Si4708/09  
I
LOUT  
DAC  
ADC  
FMI  
LNA  
PGA  
DSP  
RFGND  
Q
ADC  
ROUT  
GPO  
DAC  
AGC  
0 / 90  
LOW-IF  
GPIO  
32.768 kHz  
VIO  
RST  
RCLK  
TUNE  
RDS  
(Si4709)  
AFC  
SDIO  
SCLK  
SEN  
VA  
REG  
VD  
RSSI  
Figure 6. Si4708/09 FM Receiver Block Diagram  
RDS status, data, and block errors. Si4709 RDS  
4.1. Overview  
software is backwards compatible to the proven  
Si4701/03, adopted by leading cell-phone and MP3  
manufacturers world-wide.  
The Si4708/09 extends Silicon Laboratories Si4700 FM  
tuner family, and further increases the ease and  
attractiveness of adding FM radio reception to mobile  
devices through small size and board area, minimum  
component count, flexible programmability, and  
superior, proven performance. Si4708/09 software is  
backwards compatible to existing Si4700/01/02/03 FM  
Tuner designs and leverages Silicon Laboratories'  
highly successful and patented Si4700/01/02/03 FM  
tuner. The Si4708/09 benefits from proven digital  
integration and 100% CMOS process technology,  
resulting in a completely integrated solution. It is the  
The Si4708/09 is based on the superior, proven  
performance of Silicon Laboratories' Si4700/01/02/03  
architecture offering unmatched interference rejection  
and leading sensitivity. The device uses the same  
programming interface as the Si4700/01/02/03 and  
supports multiple bus modes. Power management is  
simplified with an integrated regulator allowing direct  
connection to a 2.7 to 5.5 V battery for V and 2.7 to 5.5  
D
V battery for V .  
A
industry's smallest footprint FM tuner IC requiring only The Si4708/09 device’s high level of integration and  
2
6.25 mm board space and one external bypass complete FM system production testing increases  
capacitor.  
quality to manufacturers, improves device yields, and  
simplifies device manufacturing and final testing.  
The device offers significant programmability, catering  
to the subjective nature of FM listeners’ audio  
preferences and variable FM broadcast environments  
worldwide.  
*Note: RDS/RBDS is referred to as RDS throughout the  
remainder of this document.  
The Si4709 incorporates a digital processor for the  
European Radio Data System (RDS) and the US Radio  
Broadcast Data System (RBDS) including all required  
symbol decoding, block synchronization, error  
detection, and error correction functions.  
RDS/RDBS* enables data such as station identification  
and song name to be displayed to the user. The Si4709  
offers a detailed RDS view and a standard view,  
allowing adopters to selectively choose granularity of  
Rev. 1.2  
13  
Si4708/09-C  
4.2. FM Receiver  
4.4. RDS/RBDS Processor and  
Functionality  
The Si4708/09 architecture and antenna design  
increases system performance. To ensure proper  
performance and operation, designers should refer to  
the guidelines in "AN350: Si4708/09 Antenna,  
The Si4709 implements an RDS/RBDS processor for  
symbol decoding, block synchronization, error  
detection, and error correction. RDS functionality is  
enabled by setting the RDS bit. The device offers two  
RDS modes, a standard mode and a verbose mode.  
The primary difference is increased visibility to RDS  
block-error levels and synchronization status with  
verbose mode.  
Schematic,  
Layout,  
and  
Design  
Guidelines".  
Conformance to these guidelines will help to ensure  
excellent performance in weak signal, noisy, and  
crowded signal environments where many strong  
channels are present.  
The Si4708/09’s patented digital low-IF architecture  
reduces external components and eliminates the need  
for factory adjustments. The receive (RX) section  
integrates a low noise amplifier (LNA) supporting the  
worldwide FM broadcast band (76 to 108 MHz). An  
automatic gain control (AGC) circuit controls the gain of  
the LNA to optimize sensitivity and rejection of strong  
interferers.  
Setting the RDS mode (RDSM) bit low places the  
device in standard RDS mode (default). The device will  
set the RDS ready (RDSR) bit for a minimum of 40 ms  
when a valid RDS group has been received. Setting the  
RDS interrupt enable (RDSIEN) bit and GPO[1:0] = 01  
will configure GPO to pulse low for a minimum of 5 ms  
when a valid RDS group has been received. If an invalid  
group is received, RDSR will not be set and GPO will  
not pulse low. In standard mode RDS synchronization  
(RDSS) and block error rate A, B, C and D (BLERA,  
BLERB, BLERC, and BLERD) are unused and will read  
0. This mode is backward compatible with earlier  
firmware revisions.  
An image-reject mixer downconverts the RF signal to  
low-IF. The quadrature mixer output is amplified,  
filtered,  
and  
digitized  
with  
high  
resolution  
analog-to-digital converters (ADCs). This advanced  
architecture achieves superior performance by using  
digital signal processing (DSP) to perform channel  
selection, FM demodulation, and stereo audio  
Setting the RDS mode bit high places the device in RDS  
verbose mode. The device sets RDSS high when  
synchronized and low when synchronization is lost. If  
the device is synchronized, RDS ready (RDSR) will be  
set for a minimum of 40 ms when a RDS group has  
been received. Setting the RDS interrupt enable  
(RDSIEN) bit and GPO[1:0] = 01 will configure GPO to  
pulse low for a minimum of 5 ms if the device is  
synchronized and an RDS group has been received.  
BLERA, BLERB, BLERC and BLERD provide  
block-error levels for the RDS group. The number of bit  
errors in each block within the group is encoded as  
follows: 00 = no errors, 01 = one to two errors, 10 =  
three to five errors, 11 = six or more errors. Six or more  
errors in a block indicate the block is uncorrectable and  
should not be used.  
processing  
compared  
to  
traditional  
analog  
architectures.  
4.3. General Purpose Output  
The GPO pin can serve multiple functions. After  
powerup of the device, the GPO pin can be used as a  
general purpose input/output, and can be used as an  
interrupt request pin for the seek/tune or RDS ready  
functions. See register 04h, bits [3:2] in Section “6.  
Register Descriptions” for information on GPO control. It  
is recommended that the GPO pin not be used as an  
interrupt request output until the powerup time has  
completed (see Section “4.9. Reset, Powerup, and  
Powerdown”). The GPO pin is powered from the V  
IO  
supply; therefore, general purpose input/output  
functionality is available regardless of the state of the V  
A
and V supplies, or the ENABLE and DISABLE bits.  
D
14  
Rev. 1.2  
Si4708/09-C  
High-fidelity stereo digital-to-analog converters (DACs)  
drive analog audio signals onto the LOUT and ROUT  
pins. The audio output may be muted with the DMUTE  
bit. Volume can be adjusted digitally with the  
VOLUME[3:0] bits. The volume dynamic range can be  
set to either –28 dBFS (default) or –58 dBFS by setting  
VOLEXT=1.  
4.5. Stereo Audio Processing  
The output of the FM demodulator is a stereo  
multiplexed (MPX) signal. The MPX standard was  
developed in 1961 and is used worldwide. Today's MPX  
signal format consists of left + right (L+R) audio, left –  
right (L–R) audio, a 19 kHz pilot tone, and RDS/RBDS  
data as shown in Figure 7.  
The soft mute feature is available to attenuate the audio  
outputs and minimize audible noise in very weak signal  
conditions. The soft mute attack and decay rate can be  
adjusted with the SMUTER[1:0] bits where 00 is the  
fastest setting. The soft mute attenuation level can be  
adjusted with the SMUTEA[1:0] bits where 00 is the  
most attenuated. The soft mute disable (DSMUTE) bit  
may be set high to disable this feature.  
Mono Audio  
Left + Right  
Stereo  
Pilot  
Stereo Audio  
RDS/  
Left - Right  
RBDS  
4.6. Tuning  
0
15 19 23  
38  
53 57  
The Si4708/09 uses Silicon Laboratories’ patented and  
proven frequency synthesizer technology including a  
completely integrated VCO. The frequency synthesizer  
generates the quadrature local oscillator signal used to  
downconvert the RF input to a low intermediate  
frequency. The VCO frequency is locked to the  
reference clock and adjusted with an automatic  
frequency control (AFC) servo loop during reception.  
Frequency (kHz)  
Figure 7. MPX Signal Spectrum  
The  
Si4708/09's  
integrated  
stereo  
decoder  
automatically decodes the MPX signal. The 0 to 15 kHz  
(L+R) signal is the mono output of the FM tuner. Stereo  
is generated from the (L+R), (L-R), and a 19 kHz pilot  
tone. The pilot tone is used as a reference to recover  
the (L-R) signal. Separate left and right channels are  
obtained by adding and subtracting the (L+R) and (L-R)  
signals, respectively. The Si4709 uses frequency  
information from the 19 kHz stereo pilot to recover the  
57 kHz RDS/RBDS signal.  
The tuning frequency is defined as:  
Freq (MHz) = Spacing (kHz) Channel + Bottom of Band (MHz)  
Channel spacing of 50, 100 or 200 KHz is selected with  
bits SPACE[1:0]. The channel is selected with bits  
CHAN[9:0]. The bottom of the band is set to 76 MHz or  
87.5 MHz with the bits BAND[1:0]. The tuning operation  
begins by setting the TUNE bit. After tuning completes,  
the seek/tune complete (STC) bit will be set and the  
RSSI level is available by reading bits RSSI[7:0]. The  
TUNE bit must be set low after the STC bit is set high in  
order to complete the tune operation and clear the STC  
bit.  
Adaptive noise suppression is employed to gradually  
combine the stereo left and right audio channels to a  
mono (L+R) audio signal as the signal quality degrades  
to maintain optimum sound fidelity under varying  
reception conditions. The signal level range over which  
the stereo to mono blending occurs can be adjusted by  
setting the BLNDADJ[1:0] register. Stereo/mono status  
can be monitored with the ST register bit and mono  
operation can be forced with the MONO register bit.  
Seek tuning searches up or down for a channel with an  
RSSI greater than or equal to the seek threshold set  
with the SEEKTH[7:0] bits. In addition, an optional SNR  
and/or impulse noise detector may be used to qualify  
valid stations. The SKSNR[3:0] bits set the SNR  
threshold required. The SKCNT[3:0] bits set the impulse  
noise threshold. Using the extra seek qualifiers can  
reduce false stops and, in combination with lowering the  
RSSI seek threshold, increase the number of found  
stations. The SNR and impulse noise detectors are  
disabled by default.  
Pre-emphasis and de-emphasis is a technique used by  
FM broadcasters to improve the signal-to-noise ratio of  
FM receivers by reducing the effects of high frequency  
interference and noise. When the FM signal is  
transmitted,  
a
pre-emphasis filter is applied to  
accentuate the high audio frequencies. All FM receivers  
incorporate a de-emphasis filter which attenuates high  
frequencies to restore a flat frequency response. Two  
time constants, 50 or 75 µs, are used in various regions.  
The de-emphasis time constant is programmable with  
the DE bit.  
Two seek modes are available. When the seek mode  
(SKMODE) bit is low and a seek is initiated, the device  
seeks through the band, wraps from one band edge to  
the other, and continues seeking. If the seek operation  
Rev. 1.2  
15  
Si4708/09-C  
was unable to find a channel, the seek failure/band limit  
(SF/BL) bit will be set high and the device will return to  
the channel selected before the seek operation began.  
When the SKMODE bit is high and a seek is initiated,  
the device seeks through the band until the band limit is  
reached and the SF/BL bit will be set high. A seek  
operation is initiated by setting the SEEK and SEEKUP  
bits. After the seek operation completes, the STC bit will  
be set, and the RSSI level and tuned channel are  
available by reading bits RSSI[7:0] and bits  
4.8. Control Interface  
Two-wire slave-transceiver and three-wire interfaces  
are provided for the controller IC to read and write the  
control registers. Refer to “4.9. Reset, Powerup, and  
Powerdown” for a description of bus mode selection.  
Registers may be written and read when the V supply  
is applied regardless of the state of the V or V  
IO  
D
A
supplies. RCLK is not required for proper register  
operation.  
4.8.1. 3-Wire Control Interface  
READCHAN[9:0].  
During  
a
seek  
operation  
READCHAN[9:0] is also updated and may be read to For three-wire operation, a transfer begins when the  
determine seek progress. The STC bit will be set after SEN pin is sampled low by the device on a rising SCLK  
the seek operation completes. The channel is valid if the edge. The control word is latched internally on rising  
seek operation completes and the SF/BL bit is set low. SCLK edges and is nine bits in length, comprised of a  
At other times, such as before a seek operation or after four bit chip address A7:A4 = 0110b, a read/write bit  
a seek completes and the SF/BL bit is set high, the (write = 0 and read = 1), and a four bit register address,  
channel is valid if the AFC Rail (AFCRL) bit is set low A3:A0. The ordering of the control word is A7:A5, R/W,  
and the value of RSSI[7:0] is greater than or equal to A4:A0. Refer to Section 5. "Register Summary" on page  
SEEKTH[7:0]. Note that if the AFCRL bit is set, the 19 for a list of all registers and their addresses.  
audio output is muted as in the softmute case discussed  
For write operations, the serial control word is followed  
in Section “4.5. Stereo Audio Processing”. The SEEK bit  
by a 16-bit data word and is latched internally on rising  
must be set low after the STC bit is set high in order to  
SCLK edges.  
complete the seek operation and clear the STC and  
For read operations, a bus turn-around of half a cycle is  
SF/BL bits. The seek operation may be aborted by  
followed by a 16-bit data word shifted out on rising  
setting the SEEK bit low at any time.  
SCLK edges and is clocked into the system controller  
The device can be configured to generate an interrupt  
on falling SCLK edges. The transfer ends on the rising  
on GPO when a tune or seek operation completes.  
SCLK edge after SEN is set high. Note that 26 SCLK  
Setting the seek/tune complete (STCIEN) bit and  
cycles are required for a transfer, however, SCLK may  
GPO[1:0] = 01 will configure GPO for a 5 ms low  
run continuously.  
interrupt when the STC bit is set by the device.  
For details on timing specifications and diagrams, refer  
For additional recommendations on optimizing the seek  
to Table 5, “3-Wire Control Interface Characteristics,” on  
function, consult "AN349: Si4708/09 Programming  
Guide."  
page 7, Figure 2, “3-Wire Control Interface Write Timing  
Parameters,” on page 7, and Figure 3, “3-Wire Control  
Interface Read Timing Parameters,” on page 7.  
4.7. Reference Clock  
The Si4708/09-C accepts a 32.768 kHz reference clock  
to the RCLK pin. The reference clock is required  
whenever the ENABLE bit is set high. Refer to Table 3,  
“DC Characteristics,” on page 5 for input switching  
voltage  
levels  
and  
Table 7,  
"FM  
Receiver  
Characteristics," on page 10 for frequency tolerance  
information.  
16  
Rev. 1.2  
Si4708/09-C  
4.8.2. 2-Wire Control Interface  
4.9. Reset, Powerup, and Powerdown  
For two-wire operation, the SCLK and SDIO pins  
function in open-drain mode (pull-down only) and must  
be pulled up by an external device. A transfer begins  
with the START condition (falling edge of SDIO while  
SCLK is high). The control word is latched internally on  
rising SCLK edges and is eight bits in length, comprised  
of a seven bit device address equal to 0010000b and a  
read/write bit (write = 0 and read = 1).  
Driving the RST pin low will disable the Si4708/09 and  
its control bus interface, and reset the registers to their  
default settings. Driving the RST pin high will bring the  
device out of reset. As the part is brought out of reset,  
the SEN pin is used to select between 2-wire and 3-wire  
control interface operation.  
Table 8. Selecting 2-Wire or 3-Wire Control  
Interface Busmode Operation  
The device acknowledges the address by driving SDIO  
low after the next falling SCLK edge, for 1 cycle. For  
write operations, the device acknowledge is followed by  
an eight bit data word latched internally on rising edges  
of SCLK. The device acknowledges each byte of data  
written by driving SDIO low after the next falling SCLK  
edge, for 1 cycle. An internal address counter  
automatically increments to allow continuous data byte  
writes, starting with the upper byte of register 02h,  
Bus Mode  
3-wire  
SEN  
0
1
2-wire  
Note: All parameters applied on rising edge of RST.  
followed by the lower byte of register 02h, and onward The bus mode selection method requires the use of the  
until the lower byte of the last register is reached. The SEN pin. To select 2-wire operation, the SEN pin must  
internal address counter then automatically wraps be sampled high by the device on the rising edge of  
around to the upper byte of register 00h and proceeds RST. To select 3-wire operation, the SEN pin must be  
from there until continuous writes end. Data transfer sampled low by the device on the rising edge of RST.  
ends with the STOP condition (rising edge of SDIO  
while SCLK is high). After every STOP condition, the  
ENABLE and DISABLE bits in register 02h can be used  
internal address counter is reset.  
When proper voltages are applied to the Si4708/09, the  
to select between powerup and powerdown modes.  
For read operations, the device acknowledge is When voltage is first applied to the device, ENABLE =  
followed by an eight bit data word shifted out on falling DISABLE = 0. Setting ENABLE = 1 and DISABLE = 0  
SCLK edges. An internal address counter automatically puts the device in powerup mode. To power down the  
increments to allow continuous data byte reads, starting device, disable RDS (Si4709 only), set Reg4(5:4),  
with the upper byte of register 0Ah, followed by the Reg4(3:2), and Reg4(1:0) to 0b10. then write 1 to the  
lower byte of register 0Ah, and onward until the lower ENABLE and DISABLE bits. After being written to 1,  
byte of the last register is reached. The internal address both bits will get cleared as part of the internal device  
counter then automatically wraps around to the upper powerdown sequence. To put the device back into  
byte of register 00h and proceeds from there until powerup mode, set ENABLE = 1 and DISABLE = 0 as  
continuous reads cease. After each byte of data is read, described above. The ENABLE bit should never be  
the controller IC must drive an acknowledge (SDIO = 0) written to a 0.  
if an additional byte of data will be requested. Data  
transfer ends with the STOP condition. After every  
STOP condition, the internal address counter is reset.  
For details on timing specifications and diagrams, refer  
to  
Table 6,  
“2-Wire  
Control  
Interface  
1,2,3  
Characteristics  
,” on page 8, Figure 4, “2-Wire  
Control Interface Read and Write Timing Parameters,”  
on page 9 and Figure 5, “2-Wire Control Interface Read  
and Write Timing Diagram,” on page 9.  
Rev. 1.2  
17  
Si4708/09-C  
1. Note that V is still supplied in this scenario. If V is  
4.10. Audio Output Summation  
IO  
IO  
not supplied, refer to device initialization procedure  
above.  
The audio outputs LOUT and ROUT may be  
capacitively summed with another device. Setting the  
audio high-Z enable (AHIZEN) bit maintains a dc bias of  
2. (Optional) Set the AHIZEN bit low to disable the dc  
bias of 0.5 x V volts at the LOUT and ROUT pins,  
IO  
0.5 x V on the LOUT and ROUT pins to prevent the  
IO  
but preserve the states of the other bits in Register  
07h. Note that in powerup the LOUT and ROUT pins  
are set to the common mode voltage specified in  
Table 7 on page 10, regardless of the state of  
AHIZEN.  
ESD diodes from clamping to the V or GND rail in  
response to the output swing of the other device. The  
IO  
bias point is set with a 370 kresistor to V and GND.  
IO  
Register 07h containing the AHIZEN bit must not be  
written during the powerup sequence and only takes  
effect when in powerdown and V is supplied. In 3. Supply V and V .  
IO  
A
D
powerup the LOUT and ROUT pins are set to the  
4. Provide RCLK. Steps 3 and 4 may be reversed when  
using an external oscillator.  
common mode voltage specified in Table 7, “FM  
1,2  
Receiver Characteristics ,” on page 10, regardless of  
5. Set the ENABLE bit high and the DISABLE bit low to  
powerup the device. Software should wait for the  
powerup time (as specified by Table 7, “FM Receiver  
the state of AHIZEN. Bits 13:0 of register 07h must be  
preserved as 0x0100 while in powerdown and as  
0x3C04 while in powerup.  
1,2  
Characteristics ,” on page 10) before continuing  
with normal part operation.  
4.11. Initialization Sequence  
Refer to Figure 8, “Initialization Sequence,” on page 18.  
To initialize the device:  
VA,VD Supply  
VIO Supply  
RST Pin  
1. Supply V and V .  
A
D
2. Supply V while keeping the RST pin low. Note that  
IO  
steps 1 and 2 may be reversed. Power supplies may  
be sequenced in any order.  
3. Select 2-wire or 3-wire control interface bus mode  
operation as described in Section 4.9. "Reset,  
Powerup, and Powerdown" on page 17.  
RCLK Pin  
ENABLE Bit  
4. Provide RCLK. Steps 3 and 4 may be reversed when  
using an external oscillator.  
1
2
3
4
5
5. Set the ENABLE bit high and the DISABLE bit low to  
powerup the device. Software should wait for the  
powerup time (as specified by Table 7, “FM Receiver  
Figure 8. Initialization Sequence  
4.12. Programming Guide  
1,2  
Characteristics ,” on page 10) before continuing  
with normal part operation.  
Refer to "AN349: Si4708/09 Programming Guide" for  
control interface programming information.  
To power down the device:  
1. (Optional) Set the AHIZEN bit high to maintain a dc  
bias of 0.5 x V volts at the LOUT and ROUT pins  
IO  
while in powerdown, but preserve the states of the  
other bits in Register 07h. Note that in powerup the  
LOUT and ROUT pins are set to the common mode  
voltage specified in Table 7 on page 10, regardless  
of the state of AHIZEN.  
2. Set the ENABLE bit high and the DISABLE bit high  
to place the device in powerdown mode. Note that all  
register states are maintained so long as V is  
IO  
supplied and the RST pin is high.  
3. (Optional) Remove RCLK.  
4. Remove V and V supplies as needed.  
A
D
To power up the device (after power down):  
18  
Rev. 1.2  
Si4708/09-C  
Rev. 1.2  
19  
Si4708/09-C  
6. Register Descriptions  
Register 00h. Device ID  
Bit  
D15 D14 D13 D12 D11 D10 D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Name  
Type  
PN[3:0]  
R
MFGID[11:0]  
R
Reset value = 0x1242  
Bit  
Name  
Function  
15:12  
PN[3:0]  
Part Number.  
0x01 = Si4708/09  
11:0  
MFGID[11:0]  
Manufacturer ID.  
0x242  
Register 01h. Chip ID  
Bit  
D15 D14 D13 D12 D11 D10 D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Name  
Type  
REV[5:0]  
R
DEV[3:0]  
R
FIRMWARE[5:0]  
R
Si4708C Reset value = 0x1093 or 0x109E if ENABLE = 1  
Si4708C Reset value = 0x1000 or 0x101E if ENABLE = 0  
Si4709C Reset value = 0x1293 or 0x0129E if ENABLE = 1  
Si4709C Reset value = 0x1200 or 0x121E if ENABLE = 0  
Bit  
Name  
Function  
15:10  
REV[5:0]  
Chip Version.  
0x04 = Rev C  
9:6  
DEV[3:0]  
Device.  
0000 before powerup = Si4708.  
1000 before powerup = Si4709.  
0010 after powerup = Si4708.  
1010 after powerup = Si4709.  
5:0  
FIRMWARE[5:0] Firmware Version.  
0 before powerup.  
Firmware version after powerup = 010011 or 011110.  
20  
Rev. 1.2  
Si4708/09-C  
Register 02h. Power Configuration  
Bit  
D15  
D14 D13 D12 D11  
D10  
D9  
D8 D7  
D6  
DISABLE  
R/W  
D5 D4 D3 D2 D1  
D0  
ENABLE  
R/W  
DSMUTE DMUTE MONO  
0
RDSM SKMODE SEEKUP SEEK  
0
0
0
0
0
0
Name  
Type  
R/W  
R/W  
R/W R/W R/W R/W R/W R/W R/W  
R/W R/W R/W R/W R/W  
Reset value = 0x0000  
Bit  
Name  
Function  
15  
DSMUTE  
Softmute Disable.  
0 = Softmute enable (default).  
1 = Softmute disable.  
14  
13  
DMUTE  
MONO  
Mute Disable.  
0 = Mute enable (default).  
1 = Mute disable.  
Mono Select.  
0 = Stereo (default).  
1 = Force mono.  
12  
11  
Reserved  
RDSM  
Reserved.  
Always write to 0.  
RDS Mode (Si4709 only).  
0 = Standard (default).  
1 = Verbose.  
Refer to “4.4. RDS/RBDS Processor and Functionality”.  
10  
9
SKMODE  
SEEKUP  
SEEK  
Seek Mode.  
0 = Wrap at the upper or lower band limit and continue seeking (default).  
1 = Stop seeking at the upper or lower band limit.  
Seek Direction.  
0 = Seek down (default).  
1 = Seek up.  
8
Seek.  
0 = Disable (default).  
1 = Enable.  
Notes:  
1. Seek begins at the current channel, and goes in the direction specified with the SEEKUP  
bit. Seek operation stops when a channel is qualified as valid according to the seek  
parameters, the entire band has been searched (SKMODE = 0), or the upper or lower  
band limit has been reached (SKMODE = 1).  
2. The STC bit is set high when the seek operation completes and/or the SF/BL bit is set  
high if the seek operation was unable to find a channel qualified as valid according to the  
seek parameters. The STC and SF/BL bits must be set low by setting the SEEK bit low  
before the next seek or tune may begin.  
3. Seek performance for 50 kHz channel spacing varies according to RCLK tolerance.  
Silicon Laboratories recommends ±50 ppm RCLK crystal tolerance for 50 kHz seek  
performance.  
4. A seek operation may be aborted by setting SEEK = 0.  
7
Reserved  
Always write to 0.  
Rev. 1.2  
21  
Si4708/09-C  
Bit  
Name  
Function  
6
DISABLE  
Powerup Disable.  
Refer to “4.9. Reset, Powerup, and Powerdown”.  
Default = 0.  
5:1  
0
Reserved  
ENABLE  
Always write to 0.  
Powerup Enable.  
Refer to “4.9. Reset, Powerup, and Powerdown”.  
Default = 0.  
Register 03h. Channel  
Bit  
D15  
D14 D13 D12 D11 D10 D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Name TUNE  
0
0
0
0
0
CHANNEL[9:0]  
R/W  
Type R/W R/W R/W R/W R/W R/W  
Reset value = 0x0000  
Bit  
Name  
Function  
15  
TUNE  
Tune.  
0 = Disable (default).  
1 = Enable.  
The tune operation begins when the TUNE bit is set high. The STC bit is set high  
when the tune operation completes. The STC bit must be set low by setting the TUNE  
bit low before the next tune or seek may begin.  
14:10  
9:0  
Reserved  
Always write to 0.  
CHAN[9:0]  
Channel Select.  
Channel value for tune operation.  
If BAND 05h[7:6] = 00, then Freq (MHz) = Spacing (kHz) x Channel + 87.5 MHz.  
If BAND 05h[7:6] = 01, BAND 05h[7:6] = 10, then  
Freq (MHz) = Spacing (kHz) x Channel + 76 MHz.  
CHAN[9:0] is not updated during a seek operation. READCHAN[9:0] provides the  
current tuned channel and is updated during a seek operation and after a seek or  
tune operation completes. Channel spacing is set with the bits SPACE 05h[5:4].  
22  
Rev. 1.2  
Si4708/09-C  
Register 04h. System Configuration 1  
Bit  
D15  
D14  
D13 D12 D11 D10 D9  
D8  
0
D7  
D6  
D5 D4 D3 D2 D1 D0  
RDSIEN STCIEN  
0
RDS  
R/W  
DE  
AGCD  
R/W  
0
BLNDADJ[1:0]  
R/W  
0
0
GPO[1:0]  
R/W  
0
0
Name  
Type  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W R/W  
R/W R/W  
Reset value = 0x0000  
Bit  
Name  
Function  
15  
RDSIEN  
RDS Interrupt Enable (Si4709 only).  
0 = Disable Interrupt (default).  
1 = Enable Interrupt.  
Setting RDSIEN = 1 and GPO[1:0] = 01 will generate a 5 ms low pulse on GPO when the  
RDSR 0Ah[15] bit is set.  
14  
STCIEN  
Seek/Tune Complete Interrupt Enable.  
0 = Disable Interrupt (default).  
1 = Enable Interrupt.  
Setting STCIEN = 1 and GPO[1:0] = 01 will generate a 5 ms low pulse on GPO when the  
STC 0Ah[14] bit is set.  
13  
12  
Reserved  
RDS  
Always write to 0.  
RDS Enable (Si4709 only).  
0 = Disable (default).  
1 = Enable.  
11  
10  
DE  
De-emphasis.  
0 = 75 µs. Used in USA (default).  
1 = 50 µs. Used in Europe, Australia, Japan.  
AGCD  
AGC Disable.  
0 = AGC enable (default).  
1 = AGC disable.  
9:8  
Reserved  
Always write to 0.  
7:6 BLNDADJ[1:0] Stereo/Mono Blend Level Adjustment.  
Sets the RSSI range for stereo/mono blend.  
00 = 31–49 RSSI dBµV (default).  
01 = 37–55 RSSI dBµV (+6 dB).  
10 = 19–37 RSSI dBµV (–12 dB).  
11 = 25–43 RSSI dBµV (–6 dB).  
ST bit set for RSSI values greater than low end of range.  
5:4  
Reserved  
Always write to 10.  
Rev. 1.2  
23  
Si4708/09-C  
Bit  
Name  
Function  
3:2  
GPO[1:0]  
General Purpose I/O.  
00 = High impedance (default).  
01 = STC/RDS interrupt. A logic high will be output unless an interrupt occurs as  
described below.  
10 = Low.  
11 = High.  
Setting STCIEN = 1 will generate a 5 ms low pulse on GPO when the STC 0Ah[14] bit is  
set. Setting RDSIEN = 1 will generate a 5 ms low pulse on GPO when the RDSR 0Ah[15]  
bit is set.  
1:0  
Reserved  
Always write to 10.  
24  
Rev. 1.2  
Si4708/09-C  
Register 05h. System Configuration 2  
Bit  
D15 D14 D13 D12 D11 D10 D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Name  
Type  
SEEKTH[7:0]  
R/W  
BAND[1:0] SPACE[1:0]  
VOLUME[3:0]  
R/W  
R/W  
R/W  
Reset value = 0x0000  
Bit  
Name  
Function  
15:8  
SEEKTH[7:0]  
RSSI Seek Threshold.  
0x00 = min RSSI (default).  
0x7F = max RSSI.  
SEEKTH presents the logarithmic RSSI threshold for the seek operation. The  
Si4708/09 will not validate channels with RSSI below the SEEKTH value. SEEKTH is  
one of multiple parameters that can be used to validate channels. For more informa-  
tion, see "AN349: Si4708/09 Programming Guide."  
7:6  
BAND[1:0]  
Band Select.  
00 = 87.5–108 MHz (US/Europe, Default).  
01 = 76–108 MHz (Japan wide band).  
10 = 76–90 MHz (Japan).  
11 = Reserved.  
5:4  
3:0  
SPACE[1:0]  
Channel Spacing.  
00 = 200 kHz (USA, Australia) (default).  
01 = 100 kHz (Europe, Japan).  
10 = 50 kHz.  
VOLUME[3:0] Volume.  
Relative value of volume is shifted –30 dBFS with the VOLEXT 06h[8] bit.  
VOLEXT = 0 (default).  
0000 = mute (default).  
0001 = –28 dBFS.  
:
:
1110 = –2 dBFS.  
1111 = 0 dBFS.  
VOLEXT = 1.  
0000 = mute.  
0001 = –58 dBFS.  
:
:
1110 = –32 dBFS.  
1111 = –30 dBFS.  
FS = full scale.  
Volume scale is logarithmic.  
Rev. 1.2  
25  
Si4708/09-C  
Register 06h. System Configuration 3  
Bit  
Name SMUTER[1:0] SMUTEA[1:0]  
Type R/W R/W  
Reset value = 0x0000  
D15  
D14  
D13 D12  
D11  
D10  
D9  
D8  
VOLEXT  
R/W  
D7 D6 D5 D4 D3 D2 D1 D0  
0
0
0
SKSNR[3:0]  
R/W  
SKCNT[3:0]  
R/W  
R/W R/W R/W  
Bit  
Name  
Function  
15:14  
SMUTER[1:0] Softmute Attack/Recover Rate.  
00 = fastest (default).  
01 = fast.  
10 = slow.  
11 = slowest.  
13:12  
SMUTEA[1:0] Softmute Attenuation.  
00 = 16 dB (default).  
01 = 14 dB.  
10 = 12 dB.  
11 = 10 dB.  
11:9  
8
Reserved  
VOLEXT  
Always write to zero.  
Extended Volume Range.  
0 = disabled (default).  
1 = enabled.  
This bit attenuates the output by 30 dB. With the bit set to 0, the 15 volume settings  
adjust the volume between 0 and –28 dBFS. With the bit set to 1, the 15 volume set-  
tings adjust the volume between –30 and –58 dBFS.  
Refer to 4.5. "Stereo Audio Processing" on page 15.  
7:4  
3:0  
SKSNR[3:0]  
SKCNT[3:0]  
Seek SNR Threshold.  
0000 = disabled (default).  
0001 = min (most stops).  
1111 = max (fewest stops).  
Required channel SNR for a valid seek channel.  
Seek FM Impulse Detection Threshold.  
0000 = disabled (default).  
0001 = max (most stops).  
1111 = min (fewest stops).  
Allowable number of FM impulses for a valid seek channel.  
26  
Rev. 1.2  
Si4708/09-C  
Register 07h. Test 1  
Bit  
Name Reserved AHIZEN  
Type R/W R/W  
Reset value = 0x0100  
D15  
D14  
D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0  
Reserved  
R/W  
Bit  
15  
14  
Name  
Function  
Reserved  
AHIZEN  
Always write to zero.  
Audio High-Z Enable.  
0 = Disable (default).  
1 = Enable.  
Setting AHIZEN maintains a dc bias of 0.5 x V on the LOUT and ROUT pins to pre-  
IO  
vent the ESD diodes from clamping to the V or GND rail in response to the output  
IO  
swing of another device. Register 07h containing the AHIZEN bit must not be written  
during the powerup sequence and high-Z only takes effect when in powerdown and  
V
is supplied. Bits 13:0 of register 07h must be preserved as 0x0100 while in pow-  
IO  
erdown and as 0x3C04 while in powerup.  
13:0  
Reserved  
If written, these bits should be read first and then written with their pre-existing values.  
Do not write during powerup.  
Register 08h. Test 2  
Bit  
D15 D14 D13 D12 D11 D10 D9  
D8  
Reserved  
R/W  
D7 D6 D5 D4 D3 D2 D1 D0  
Name  
Type  
Reset value = 0x0000  
Bit  
Name  
Function  
15:0  
Reserved  
If written, these bits should be read first and then written with their pre-existing values.  
Do not write during powerup.  
Rev. 1.2  
27  
Si4708/09-C  
Register 09h. Boot Configuration  
Bit  
D15 D14 D13 D12 D11 D10 D9  
D8  
Reserved  
R/W  
D7 D6 D5 D4 D3 D2 D1 D0  
Name  
Type  
Reset value = 0x0000  
Bit  
Name  
Function  
15:0  
Reserved  
If written, these bits should be read first and then written with their pre-existing values.  
Do not write during powerup.  
Register 0Ah. Status RSSI  
Bit  
Name RDSR STC SF/BL AFCRL RDSS BLERA[1:0] ST  
Type  
Reset value = 0x0000  
D15 D14 D13  
D12  
D11 D10 D9  
D8  
D7 D6 D5 D4 D3 D2 D1 D0  
RSSI[7:0]  
R
R
R
R
R
R
R
R
Bit  
Name  
Function  
15  
RDSR  
RDS Ready (Si4709 only).  
0 = No RDS group ready (default).  
1 = New RDS group ready.  
Refer to “4.4. RDS/RBDS Processor and Functionality”.  
14  
13  
STC  
Seek/Tune Complete.  
0 = Not complete (default).  
1 = Complete.  
The seek/tune complete flag is set when the seek or tune operation completes. Setting  
the SEEK 02h[8] or TUNE 03h[15] bit low will clear STC.  
SF/BL  
Seek Fail/Band Limit.  
0 = Seek successful.  
1 = Seek failure/Band limit reached.  
The SF/BL flag is set high when SKMODE 02h[10] = 0 and the seek operation fails to  
find a channel qualified as valid according to the seek parameters.  
The SF/BL flag is set high when SKMODE 02h[10] = 1 and the upper or lower band limit  
has been reached.  
The SEEK 02h[8] bit must be set low to clear SF/BL.  
12  
AFCRL  
AFC Rail.  
0 = AFC not railed.  
1 = AFC railed, indicating an invalid channel. Audio output is softmuted when set.  
AFCRL is updated after a tune or seek operation completes and indicates a valid or  
invalid channel. During normal operation, AFCRL is updated to reflect changing RF envi-  
ronments.  
28  
Rev. 1.2  
Si4708/09-C  
Bit  
Name  
Function  
11  
RDSS  
RDS Synchronized (Si4709 only).  
0 = RDS decoder not synchronized (default).  
1 = RDS decoder synchronized.  
Available only in RDS Verbose mode (RDSM 02h[11] = 1).  
Refer to “4.4. RDS/RBDS Processor and Functionality”.  
10:9  
BLERA[1:0] RDS Block A Errors (Si4709 only).  
00 = 0 errors requiring correction.  
01 = 1–2 errors requiring correction.  
10 = 3–5 errors requiring correction.  
11 = 6+ errors or error in checkword, correction not possible.  
Available only in RDS Verbose mode (RDSM 02h[11] = 1).  
Refer to “4.4. RDS/RBDS Processor and Functionality”.  
8
ST  
Stereo Indicator.  
0 = Mono.  
1 = Stereo.  
7:0  
RSSI[7:0]  
RSSI (Received Signal Strength Indicator).  
RSSI is measured units of dBµV in 1 dB increments with a maximum of approximately  
75 dBµV. Si4708/09-C does not report RSSI levels greater than 75 dBuV.  
Rev. 1.2  
29  
Si4708/09-C  
Register 0Bh. Read Channel  
Bit  
D15 D14 D13 D12 D11 D10 D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Name BLERB[1:0] BLERC[1:0] BLERD[1:0]  
READCHAN[9:0]  
R
Type  
R
R
R
Reset value = 0x0000  
Bit  
Name  
Function  
15:14  
BLERB[1:0]  
RDS Block B Errors (Si4709 only).  
00 = 0 errors requiring correction.  
01 = 1–2 errors requiring correction.  
10 = 3–5 errors requiring correction.  
11 = 6+ errors or error in checkword, correction not possible.  
Available only in RDS Verbose mode (RDSM = 1).  
Refer to “4.4. RDS/RBDS Processor and Functionality”.  
13:12  
11:10  
9:0  
BLERC[1:0]  
BLERD[1:0]  
RDS Block C Errors (Si4709 only).  
00 = 0 errors requiring correction.  
01 = 1–2 errors requiring correction.  
10 = 3–5 errors requiring correction.  
11 = 6+ errors or error in checkword, correction not possible.  
Available only in RDS Verbose mode (RDSM = 1).  
Refer to “4.4. RDS/RBDS Processor and Functionality”.  
RDS Block D Errors (Si4709 only).  
00 = 0 errors requiring correction.  
01 = 1–2 errors requiring correction.  
10 = 3–5 errors requiring correction.  
11 = 6+ errors or error in checkword, correction not possible.  
Available only in RDS Verbose mode (RDSM = 1).  
Refer to “4.4. RDS/RBDS Processor and Functionality”.  
READCHAN[9:0] Read Channel.  
If BAND 05h[7:6] = 00, then Freq (MHz) = Spacing (kHz) x Channel + 87.5 MHz.  
If BAND 05h[7:6] = 01, BAND 05h[7:6] = 10, then  
Freq (MHz) = Spacing (kHz) x Channel + 76 MHz.  
READCHAN[9:0] provides the current tuned channel and is updated during a seek  
operation and after a seek or tune operation completes. Spacing and channel are set  
with the bits SPACE 05h[5:4] and CHAN 03h[9:0].  
30  
Rev. 1.2  
Si4708/09-C  
Register 0Ch. RDSA  
Bit  
D15 D14 D13 D12 D11 D10 D9  
D8  
D7 D6 D5 D4 D3 D2 D1 D0  
Name  
RDSA[15:0]  
R
Type  
Reset value = 0x0000  
Bit  
Name  
Function  
15:0  
RDSA  
RDS Block A Data (Si4709 only).  
Register 0Dh. RDSB  
Bit  
D15 D14 D13 D12 D11 D10 D9  
D8  
D7 D6 D5 D4 D3 D2 D1 D0  
Name  
RDSB[15:0]  
R
Type  
Reset value = 0x0000  
Bit  
Name  
Function  
15:0  
RDSB  
RDS Block B Data (Si4709 only).  
Rev. 1.2  
31  
Si4708/09-C  
Register 0Eh. RDSC  
Bit  
D15 D14 D13 D12 D11 D10 D9  
D8  
D7 D6 D5 D4 D3 D2 D1 D0  
Name  
RDSC[15:0]  
R
Type  
Reset value = 0x0000  
Bit  
Name  
Function  
15:0  
RDSC  
RDS Block C Data (Si4709 only).  
Register 0Fh. RDSD  
Bit  
D15 D14 D13 D12 D11 D10 D9  
D8  
D7 D6 D5 D4 D3 D2 D1 D0  
Name  
RDSD[15:0]  
R
Type  
Reset value = 0x0000  
Bit  
Name  
Function  
15:0  
RDSD  
RDS Block D Data (Si4709 only).  
32  
Rev. 1.2  
Si4708/09-C  
7. Pin Descriptions: Si4708/09-GM  
1
2
16  
15  
14  
13  
LOUT  
FMI  
12 ROUT  
GND  
PAD  
RFGND  
3
11 GND  
4
5
10 VD  
9
RST  
SEN  
6
7
8
Top View  
Pin Number(s)  
Name  
NC  
Description  
1, 16  
No Connect. Leave floating.  
FM RF inputs.  
2
FMI  
3
RFGND  
RST  
RF ground. Connect to ground plane on PCB.  
Device reset input (active low).  
Serial enable input (active low).  
Serial clock input.  
4
5
SEN  
6
SCLK  
SDIO  
7
8
Serial data input/output.  
V
I/O supply voltage.  
IO  
9
RCLK  
External reference oscillator input.  
10  
V
Digital supply voltage. May be connected directly to battery.  
Ground. Connect to ground plane on PCB.  
Right audio output.  
D
11, PAD  
12  
GND  
ROUT  
LOUT  
13  
Left audio output.  
14  
V
Analog supply voltage. May be connected directly to battery.  
General purpose input/output.  
A
15  
GPO  
Rev. 1.2  
33  
Si4708/09-C  
8. Ordering Guide  
Part  
Package  
Type  
Operating  
Temperature  
Description  
Number*  
Si4708-C-GM Portable Broadcast Radio Tuner  
FM Stereo  
QFN  
Pb-free  
–20 to 85 °C  
–20 to 85 °C  
Si4709-C-GM Portable Broadcast Radio Tuner  
FM Stereo with RDS  
QFN  
Pb-free  
*Note: Add an “(R)” at the end of the device part number to denote tape and reel option.  
34  
Rev. 1.2  
Si4708/09-C  
9. Package Markings (Top Marks)  
9.1. Si4708 Top Mark  
9.2. Si4709 Top Mark  
9.3. Top Mark Explanation  
Mark Method:  
YAG Laser  
Line 1 Marking:  
Device Number  
4708 = Si4708  
4709 = Si4709  
Line 2 Marking:  
Line 3 Marking:  
TTTT = Mfg Code  
Line 2 from the "Markings" section of the Assem-  
bly Purchase Order form.  
Pin 1 Identifier.  
Circle = 0.3 mm Diameter  
YWW = Date Code  
Assigned by the Assembly House. Corresponds  
to the last digit of the current year (Y) and the  
workweek (WW) of the assembly release.  
Rev. 1.2  
35  
Si4708/09-C  
10. Package Outline: Si4708/09-GM  
Figure 9 illustrates the package details for the Si4708/09-GM. Table 9 lists the values for the dimensions shown in  
the illustration.  
Figure 9. 16-Pin Quad Flat No-Lead (QFN)  
Table 9. Package Dimensions  
Symbol  
Millimeters  
Nom  
Symbol  
Millimeters  
Nom  
Min  
Max  
Min  
Max  
A
A1  
b
0.50  
0.00  
0.18  
0.25  
0.55  
0.02  
0.60  
0.05  
0.28  
0.35  
E2  
f
1.35  
1.40  
1.45  
2.00 BSC  
0.23  
L
0.25  
0.30  
0.35  
0.05  
0.05  
0.08  
0.10  
0.10  
c
0.30  
aaa  
bbb  
ccc  
ddd  
eee  
D
2.50 BSC  
1.40  
D2  
e
1.35  
1.45  
0.50 BSC  
2.50 BSC  
E
Notes:  
1. All dimensions are shown in millimeters unless otherwise noted.  
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.  
36  
Rev. 1.2  
Si4708/09-C  
11. PCB Land Pattern: Si4708/09-GM  
Figure 10 illustrates the PCB land pattern details for the Si4708/09-GM. Table 10 lists the values for the dimensions  
shown in the illustration.  
Figure 10. PCB Land Pattern  
Table 10. PCB Land Pattern Dimensions  
Symbol  
Millimeters  
Symbol  
Millimeters  
Min  
Max  
Min  
Max  
D
D2  
e
2.60 REF  
GE  
W
1.95  
1.35  
1.45  
0.30  
0.30  
0.50 BSC  
2.60 REF  
X
E
Y
0.65 REF  
E2  
f
1.35  
1.95  
1.45  
ZE  
ZD  
3.25  
3.25  
2.00 BSC  
GD  
Notes: General  
1. All dimensions shown are in millimeters (mm) unless otherwise noted.  
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.  
3. This Land Pattern Design is based on IPC-SM-782 guidelines.  
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based  
on a Fabrication Allowance of 0.05 mm.  
Notes: Solder Mask Design  
1. All pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be  
60 µm minimum, all the way around the pad.  
Notes: Stencil Design  
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder  
paste release.  
2. The stencil thickness should be 0.125 mm (5 mils).  
3. The ratio of stencil aperture to land pad size should be 1:1 for the perimeter pads.  
4. A 1.18x1.18 mm square aperture should be used for the center pad. This provides approximately 70%  
solder paste coverage on the pad, which is optimum to assure correct component stand-off.  
Notes: Card Assembly  
1. A No-Clean, Type-3 solder paste is recommended.  
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.  
Rev. 1.2  
37  
Si4708/09-C  
12. Additional Reference Resources  
AN230: Si4700/01/02/03 Programming Guide  
AN235: Si4700/01/02/03/08/09 EVB Quick Start Guide  
AN243: Using RDS/RBDS with the Si4701/03/09  
AN316: AM/FM Tuner Field Test ProcedureSi4700/01/02/03  
AN349: Si4708/09 Programming Guide  
AN350: Si4708/09 Antenna, Schematic, Layout, and Design Guidelines  
AN388: Si470x/1x/2x/3x/4x Evaluation Board Test Procedure  
Si4708/09 EVB User’s Guide  
Customer Support Site: http://www.silabs.com  
This site contains all application notes, evaluation board schematics and layouts, and evaluation software. NDA  
is required for access. To request access, register at http://www.mysilabs.com and send user’s first and last  
name, company, NDA reference number, and mysilabs user name to fminfo@silabs.com. Silicon Labs  
recommends an all lower case user name.  
38  
Rev. 1.2  
Si4708/09-C  
DOCUMENT CHANGE LIST  
Revision 0.6 to Revision 1.0  
Updated patent list on cover page  
Updated Table 3 with full production values  
Updated Table 4  
Updated Table 7 to reflect specifications from 76–  
108 MHz  
Added Table 7 to reflect specifications from 64–  
75.9 MHz  
Revision 1.0 to Revision 1.1  
FM frequency range 64-76.9 MHz no longer  
supported  
Chip ID register values changed  
Typical VDD Supply Current values changed in  
Table 3  
Minimum V value changed in Table 2  
IO  
Revision 1.1 to Revision 1.2  
Min V value changed in Table 1, Table 5, Table 6,  
IO  
and Table 7  
Chip ID register value changed  
Rev. 1.2  
39  
Smart.  
Connected.  
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Products  
www.silabs.com/products  
Quality  
www.silabs.com/quality  
Support and Community  
community.silabs.com  
Disclaimer  
Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers  
using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific  
device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories  
reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy  
or completeness of the included information. Silicon Laboratories shall have no liability for the consequences of use of the information supplied herein. This document does not imply  
or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products must not be used within any Life Support System without the specific  
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thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZMac®, EZRadio®, EZRadioPRO®, DSPLL®, ISOmodem ®, Precision32®, ProSLIC®, SiPHY®,  
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