SI5316-B-GM [SILICON]

PRELIMINARY DATA SHEET PRECISION CLOCK JITTER ATTENUATOR; 初步数据表精确时钟抖动衰减器
SI5316-B-GM
型号: SI5316-B-GM
厂家: SILICON    SILICON
描述:

PRELIMINARY DATA SHEET PRECISION CLOCK JITTER ATTENUATOR
初步数据表精确时钟抖动衰减器

衰减器 时钟
文件: 总16页 (文件大小:584K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Si5316  
PRELIMINARY DATA SHEET  
PRECISION CLOCK JITTER ATTENUATOR  
Description  
Features  
The Si5316 is a low jitter, precision jitter attenuator for  
high-speed communication systems, including OC-48,  
OC-192, 10G Ethernet, and 10G Fibre Channel. The  
Si5316 accepts dual clock inputs in the 19, 38, 77, 155,  
311, or 622 MHz frequency range and generates a  
jitter-attenuated clock output at the same frequency.  
Within each of these clock ranges, the device can be  
tuned approximately 15% higher than nominal  
SONET/SDH frequencies, up to a maximum of  
710 MHz in the 622 MHz range. The Si5316 is based  
„ Fixed frequency jitter attenuator with selectable  
clock ranges at 19, 38, 77, 155, 311, and 622 MHz  
(710 MHz max)  
„ Support for SONET, 10GbE, 10GFC, and  
corresponding FEC rates  
„ Ultra-low jitter clock output with jitter generation as  
low as 0.3 ps  
(50 kHz–80 MHz)  
RMS  
„ Integrated loop filter with selectable loop bandwidth  
(100 Hz to 7.9 kHz)  
®
„ Meets OC-192 GR-253-CORE jitter specifications  
„ Dual clock inputs with integrated clock select mux  
on Silicon Laboratories' 3rd-generation DSPLL  
technology, which provides any-rate frequency  
synthesis and jitter attenuation in a highly integrated  
PLL solution that eliminates the need for external  
VCXO and loop filter components. The DSPLL loop  
bandwidth is digitally programmable, providing jitter  
performance optimization at the application level.  
Operating from a single 1.8, 2.5, or 3.3 V supply, the  
Si5316 is ideal for providing jitter attenuation in high  
performance timing applications.  
„ One clock input can be 1x, 4x, or 32x the frequency  
of the second clock input  
„ Single clock output with selectable signal format:  
LVPECL, LVDS, CML, CMOS  
„ LOL, LOS alarm outputs  
„ Pin programmable settings  
„ On-chip voltage regulator for 1.8, 2.5, or 3.3 V  
±10% operation  
Applications  
„ Small size (6 x 6 mm 36-lead QFN)  
„ Pb-free, RoHS compliant  
„ Optical modules  
„ SONET/SDH OC-48/OC-192 line cards  
„ 10GbE, 10GFC line cards  
„ ITU G.709 line cards  
„ Wireless basestations  
„ Test and measurement  
Xtal or Refclock  
CK1DIV  
Signal Format  
CKIN1  
÷
DSPLL®  
CKOUT  
Disable  
CK2DIV  
CKIN2  
÷
Signal  
Detect  
VDD (1.8, 2.5, or 3.3 V)  
GND  
Loss of Signal  
Frequency Bandwidth  
Select Select  
PLL  
Bypass  
Clock  
Select  
Loss of  
Lock  
Preliminary Rev. 0.24 3/07  
Copyright © 2007 by Silicon Laboratories  
Si5316  
This information applies to a product under development. Its characteristics and specifications are subject to change without notice.  
Si5316  
Table 1. Performance Specifications  
(VDD = 1.8, 2.5, or 3.3 V ±10%, TA = –40 to 85 ºC)  
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
Temperature Range  
Supply Voltage  
T
–40  
2.97  
2.25  
1.62  
25  
3.3  
2.5  
1.8  
217  
85  
ºC  
V
A
V
3.63  
2.75  
1.98  
243  
DD  
V
V
Supply Current  
I
f
= 622.08 MHz  
mA  
DD  
OUT  
LVPECL format output  
f
= 19.44 MHz  
194  
220  
mA  
OUT  
CMOS format output  
Tristate/Sleep Mode  
TBD  
TBD  
mA  
Input/Output Clock Fre-  
quency (CKIN1, CKIN2,  
CKOUT)  
CK  
FRQSEL[1:0] = LL  
FRQSEL[1:0] = LM  
FRQSEL[1:0] = LH  
FRQSEL[1:0] = ML  
FRQSEL[1:0] = MM  
FRQSEL[1:0] = MH  
19.38  
38.75  
77.5  
155.0  
310.0  
620.0  
22.28  
44.56  
89.13  
178.25  
356.5  
710.0  
MHz  
F
Input Clocks (CKIN1, CKIN2)  
Differential Voltage Swing  
Common Mode Voltage  
CKN  
CKN  
0.25  
0.9  
1.0  
1.1  
1.9  
1.4  
1.7  
1.95  
11  
V
PP  
DPP  
1.8V ±10%  
2.5V ±10%  
V
V
VCM  
3.3V ±10%  
V
Rise/Fall Time  
Duty Cycle  
CKN  
20–80%  
ns  
%
ns  
TRF  
CKN  
Whichever is less  
40  
60  
DC  
50  
Output Clock (CKOUT)  
Common Mode  
V
LVPECL  
100 load  
line-to-line  
V
– 1.42  
V – 1.25  
DD  
V
OCM  
DD  
Differential Output Swing  
Single Ended Output Swing  
V
1.1  
0.5  
1.9  
V
PP  
OD  
V
0.93  
V
SE  
Rise/Fall Time  
Duty Cycle  
CKO  
20–80%  
230  
350  
55  
ps  
%
TRF  
CKO  
45  
DC  
PLL Performance  
Jitter Generation  
J
f
= 622.08 MHz,  
0.3  
TBD  
ps rms  
GEN  
OUT  
LVPECL output format  
50 kHz–80 MHz  
12 kHz–20 MHz  
0.3  
TBD  
0.1  
ps rms  
dB  
Jitter Transfer  
J
0.05  
PK  
Note: For a more comprehensive listing of device specifications, please consult the Silicon Laboratories Any-Rate Precision  
Clock Family Reference Manual. This document can be downloaded from www.silabs.com/timing.  
2
Preliminary Rev. 0.24  
Si5316  
Table 1. Performance Specifications (Continued)  
(VDD = 1.8, 2.5, or 3.3 V ±10%, TA = –40 to 85 ºC)  
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
External Reference Jitter  
Transfer  
J
TBD  
TBD  
dB  
PKEXTN  
Phase Noise  
CKO  
f
= 622.08 MHz  
TBD  
TBD  
dBc/Hz  
PN  
OUT  
100 Hz offset  
1 kHz offset  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
dBc/Hz  
dBc/Hz  
dBc/Hz  
dBc/Hz  
dBc  
10 kHz offset  
100 kHz offset  
1 MHz offset  
Subharmonic Noise  
Spurious Noise  
Package  
SP  
SP  
Phase Noise @ 100 kHz  
Offset  
SUBH  
SPUR  
Max spur @ n x F3  
(n > 1, n x F3 < 100 MHz)  
TBD  
TBD  
dBc  
Thermal Resistance  
Junction to Ambient  
θ
Still Air  
38  
ºC/W  
JA  
Note: For a more comprehensive listing of device specifications, please consult the Silicon Laboratories Any-Rate Precision  
Clock Family Reference Manual. This document can be downloaded from www.silabs.com/timing.  
Table 2. Absolute Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
DC Supply Voltage  
V
–0.5 to 3.6  
V
V
DD  
DIG  
JCT  
STG  
LVCMOS Input Voltage  
V
–0.3 to (V + 0.3)  
DD  
Operating Junction Temperature  
Storage Temperature Range  
ESD HBM Tolerance (100 pF, 1.5 k)  
ESD MM Tolerance  
T
–55 to 150  
–55 to 150  
2
ºC  
ºC  
kV  
V
T
200  
Latch-Up Tolerance  
JESD78 Compliant  
Note: Permanent device damage may occur if the Absolute Maximum Ratings are exceeded. Functional operation should be  
restricted to the conditions as specified in the operation sections of this data sheet. Exposure to absolute maximum  
rating conditions for extended periods of time may affect device reliability.  
Preliminary Rev. 0.24  
3
Si5316  
155.52 MHz in, 622.08 MHz out  
0
-20  
-40  
-60  
-80  
-100  
-120  
-140  
-160  
100  
1000  
10000  
100000  
1000000  
10000000  
100000000  
Offset Frequency (Hz)  
Figure 1. Typical Phase Noise Plot  
4
Preliminary Rev. 0.24  
Si5316  
Figure 2. Si5316 Typical Application Circuit  
Preliminary Rev. 0.24  
5
Si5316  
The Si5316 has one differential clock output. The  
electrical format of the clock output is programmable to  
1. Functional Description  
The Si5316 is a precision jitter attenuator for high-speed support LVPECL, LVDS, CML, or CMOS loads. For  
communication systems, including OC-48, OC-192, system-level debugging, a bypass mode is available  
10G Ethernet, and 10G Fibre Channel. The Si5316 which drives the output clock directly from the input  
accepts dual clock inputs in the 19, 38, 77, 155, 311, or clock, bypassing the internal DSPLL. The device is  
622 MHz frequency range and generates a jitter- powered by a single 1.8, 2.5, or 3.3 V supply.  
attenuated clock output at the same frequency. Within  
1.1. External Reference  
each of these clock ranges, the device can be tuned  
approximately 15% higher than nominal SONET/SDH An external, 38.88 MHz clock or  
a
low-cost  
frequencies, up to a maximum of 710 MHz in the 114.285 MHz 3rd overtone crystal is used as part of a  
622 MHz range. The Si5316 is based on Silicon fixed-frequency oscillator within the DSPLL. This  
®
Laboratories' 3rd-generation DSPLL technology, which external reference is required for the device to perform  
provides any-rate frequency synthesis and jitter jitter attenuation. Silicon Laboratories recommends  
attenuation in a highly integrated PLL solution that using a high-quality crystal from TXC (www.txc.com.tw),  
eliminates the need for external VCXO and loop filter part number 7MA1400014. An external 38.88 MHz  
components. For applications which require input clocks clock from a high quality OCXO or TCXO can also be  
at different frequencies, the frequency of CKIN1 can be used as a reference for the device.  
1x, 4x, or 32x the frequency of CKIN2 as specified by  
the CK1DIV and CK2DIV inputs.  
In digital hold, the DSPLL remains locked to this  
external reference. Any changes in the frequency of this  
The Si5316 PLL loop bandwidth is selectable via the reference when the DSPLL is in digital hold will be  
BWSEL[1:0] pins and supports a range from 100 Hz to tracked by the output of the device. Note that crystals  
7.9 kHz. To calculate potential loop bandwidth values can have temperature sensitivities.  
for a given input/output clock frequency, Silicon  
1.2. Further Documentation  
Laboratories offers  
a
PC-based software utility,  
DSPLLsim, that calculates valid loop bandwidth settings Consult the Silicon Laboratories Any-Rate Precision  
automatically. This utility can be downloaded from Clock Family Reference Manual (FRM) for more  
www.silabs.com/timing.  
detailed information about the Si5316. The FRM can be  
downloaded from www.silabs.com/timing.  
The Si5316 supports manual active input clock  
selection. The Si5316 monitors both input clocks for Silicon Laboratories has developed  
a PC-based  
loss-of-signal and provides a LOS alarm when it detects software utility called DSPLLsim to simplify device  
missing pulses on either input clock. Hitless switching is configuration, including frequency planning and loop  
not supported by the Si5316. During a clock transition, bandwidth selection. This utility can be downloaded  
the phase of the output clock will slew at a rate defined from www.silabs.com/timing.  
by the PLL loop bandwidth until the original input clock  
phase to output clock phase is restored. The device  
monitors the lock status of the PLL. The lock detect  
algorithm works by continuously monitoring the phase  
of the input clock in relation to the phase of the  
feedback clock.  
6
Preliminary Rev. 0.24  
Si5316  
2. Pin Descriptions: Si5316  
36 35 34 33 32 31 30 29 28  
RST  
NC  
1
2
3
4
5
6
7
8
9
27 CK2DIV  
26  
CK1DIV  
25 FRQSEL1  
C1B  
C2B  
VDD  
XA  
24  
23  
FRQSEL0  
BWSEL1  
GND  
Pad  
22 BWSEL0  
XB  
21  
20  
19  
CS  
NC  
NC  
GND  
NC  
10 11 12 13 14 15 16 17 18  
Pin assignments are preliminary and subject to change.  
Table 3. Si5316 Pin Descriptions  
Pin #  
Pin Name I/O Signal Level  
Description  
1
RST  
I
LVCMOS  
External Reset.  
Active low input that performs external hardware reset of device.  
Resets all internal logic to a known state. Clock outputs are tristated  
during reset. After rising edge of RST signal, the Si5316 will perform  
an internal self-calibration.  
This pin has a weak pull-up.  
2, 9, 11,  
19, 20,  
28, 29, 36  
NC  
O
No Connect.  
These pins must be left unconnected for normal operation.  
3
C1B  
LVCMOS  
CKIN1 Loss of Signal.  
Active high Loss-of-signal indicator for CKIN1. Once triggered, the  
alarm will remain active until CKIN1 is validated.  
0 = CKIN1 present  
1 = LOS on CKIN1  
4
C2B  
O
LVCMOS  
Supply  
CKIN2 Loss of Signal.  
Active high Loss-of-signal indicator for CKIN2. Once triggered, the  
alarm will remain active until CKIN2 is validated.  
0 = CKIN2 present  
1 = LOS on CKIN2  
5, 10, 32  
V
V
Supply.  
DD  
DD  
The device operates from a 1.8, 2.5, or 3.3 V supply. Bypass capaci-  
tors should be associated with the following V pins:  
DD  
5
10  
32  
0.1 µF  
0.1 µF  
0.1 µF  
A 1.0 µF should be placed as close to device as is practical.  
Preliminary Rev. 0.24  
7
Si5316  
Table 3. Si5316 Pin Descriptions (Continued)  
Pin Name I/O Signal Level Description  
Pin #  
7
6
XB  
XA  
I
Analog  
External Crystal or Reference Clock.  
External crystal should be connected to these pins to use internal  
oscillator based reference. If external reference is used, apply refer-  
ence clock to XA input and leave XB pin floating. External reference  
must be from a high-quality clock source (TCXO, OCXO). Frequency  
of crystal or external clock is set by the RATE pin.  
8, 31  
15  
GND  
GND  
I
Supply  
3-Level  
Ground.  
Must be connected to system ground. Minimize the ground path  
impedance for optimal performance of this device.  
RATE  
External Crystal or Reference Clock Rate.  
Three level input that selects the type and rate of external crystal or  
reference clock to be applied to the XA/XB port.  
L = 38.88 MHz external clock  
M = 114.285 MHz 3rd OT crystal  
H = Reserved  
12  
13  
CKIN2+  
CKIN2–  
I
I
Multi  
Clock Input 2.  
Differential input clock. This input can also be driven with a single-  
ended signal.  
14  
DBL_BY  
3-Level  
Output Disable/Bypass Mode Control.  
Controls enable of CKOUT divider/output buffer path and PLL  
bypass mode.  
L = CKOUT enabled  
M = CKOUT disabled  
H = Bypass mode with CKOUT enabled  
16  
17  
CKIN1+  
CKIN1–  
I
Multi  
Clock Input 1.  
Differential input clock. This input can also be driven with a single-  
ended signal.  
18  
LOL  
O
LVCMOS  
PLL Loss of Lock Indicator.  
This pin functions as the active high PLL loss of lock indicator.  
0 = PLL locked  
1 = PLL unlocked  
21  
CS  
I
LVCMOS  
Input Clock Select.  
This pin functions as the input clock selector. This input is internally  
deglitched to prevent inadvertent clock switching during changes in  
the CKSEL input state.  
0 = Select CKIN1  
1 = Select CKIN2  
23  
22  
BWSEL1  
BWSEL0  
I
I
3-Level  
3-Level  
Bandwidth Select.  
Three level inputs that select the DSPLL closed loop bandwidth.  
Detailed operations and timing characteristics for these pins may be  
found in the Any-Rate Precision Clock Family Reference Manual.  
25  
24  
FRQSEL1  
FRQSEL0  
Frequency Select.  
Sets the output frequency of the device. When the frequency of  
CKIN1 is not equal to CKIN2, the lower frequency input clock must  
be equal to the output clock frequency.  
8
Preliminary Rev. 0.24  
Si5316  
Table 3. Si5316 Pin Descriptions (Continued)  
Pin #  
Pin Name I/O Signal Level  
Description  
Input Clock 1 Pre-Divider Select.  
26  
CK1DIV  
I
I
I
3-Level  
3-Level  
3-Level  
Pre-divider on CKIN1. Used with CK2DIV to divide input clock  
frequencies to a common value. When the frequencies applied to  
CKIN1 and CKIN2 are equal, CK1DIV must be tied low.  
L = CKIN1 input divider set to 1.  
M = CKIN1 input divider set to 4.  
H = CKIN1 input divider set to 32.  
27  
CK2DIV  
Input Clock 2 Pre-Divider Select.  
Pre-divider on CKIN2. Used with CK1DIV to divide input clock  
frequencies to a common value. When the frequencies applied to  
CKIN1 and CKIN2 are equal, CK2DIV must be tied low.  
L = CKIN2 input divider set to 1.  
M = CKIN2 input divider set to 4.  
H = CKIN2 input divider set to 32.  
33  
30  
SFOUT0  
SFOUT1  
Signal Format Select.  
Three level inputs that select the output signal format (common  
mode voltage and differential swing) for CKOUT. Valid settings  
include LVPECL, LVDS, and CML. Also includes selections for  
CMOS mode, tristate mode, and tristate/sleep mode.  
SFOUT[1:0]  
Signal Format  
Reserved  
HH  
HM  
HL  
Reserved  
CML  
MH  
MM  
ML  
LH  
LVPECL  
Reserved  
LVDS  
CMOS  
LM  
LL  
Tristate/Sleep  
Reserved  
34  
35  
CKOUT–  
CKOUT+  
O
Multi  
Clock Output.  
Differential output clock with a frequency selected from a table of val-  
ues. Output signal format is selected by SFOUT pins. Output is differ-  
ential for LVPECL, LVDS, and CML compatible modes. For CMOS  
format, both output pins drive identical single-ended clock outputs.  
GND PAD  
GND  
GND  
Supply  
Ground Pad.  
The ground pad must provide a low thermal and electrical impedance  
to a ground plane.  
Preliminary Rev. 0.24  
9
Si5316  
3. Ordering Guide  
Ordering Part Number  
Si5316-B-GM  
Package  
Temperature Range  
36-Lead 6 x 6 mm QFN  
–40 to 85 °C  
10  
Preliminary Rev. 0.24  
Si5316  
4. Package Outline: 36-Lead QFN  
Figure 3 illustrates the package details for the Si5316. Table 4 lists the values for the dimensions shown in the  
illustration.  
Figure 3. 36-Pin Quad Flat No-lead (QFN)  
Table 4. Package Dimensions  
Symbol  
Millimeters  
Symbol  
Millimeters  
Min  
0.80  
0.00  
0.18  
Nom  
0.85  
Max  
0.90  
0.05  
0.30  
Min  
0.50  
Nom  
0.60  
Max  
0.75  
12º  
A
A1  
b
L
0.01  
θ
0.23  
aaa  
bbb  
ccc  
ddd  
eee  
0.10  
0.10  
0.05  
0.10  
0.05  
D
6.00 BSC  
4.10  
D2  
e
3.95  
4.25  
0.50 BSC  
6.00 BSC  
4.10  
E
E2  
3.95  
4.25  
Notes:  
1. All dimensions shown are in millimeters (mm) unless otherwise noted.  
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.  
3. This drawing conforms to JEDEC outline MO-220, variation VJJD.  
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body  
Components.  
Preliminary Rev. 0.24  
11  
Si5316  
5. Recommended PCB Layout  
Figure 4. PCB Land Pattern Diagram  
12  
Preliminary Rev. 0.24  
Si5316  
Table 5. PCB Land Pattern Dimensions  
Dimension  
MIN  
MAX  
e
E
0.50 BSC.  
5.42 REF.  
5.42 REF.  
D
E2  
D2  
GE  
GD  
X
4.00  
4.00  
4.53  
4.53  
4.20  
4.20  
0.28  
Y
0.89 REF.  
ZE  
ZD  
6.31  
6.31  
Notes (General):  
1. All dimensions shown are in millimeters (mm) unless otherwise noted.  
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.  
3. This Land Pattern Design is based on IPC-SM-782 guidelines.  
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material  
Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm.  
Notes (Solder Mask Design):  
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the  
solder mask and the metal pad is to be 60 µm minimum, all the way around the pad.  
Notes (Stencil Design):  
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be  
used to assure good solder paste release.  
2. The stencil thickness should be 0.125 mm (5 mils).  
3. The ratio of stencil aperture to land pad size should be 1:1 for the perimeter pads.  
4. A 4 x 4 array of 0.80 mm square openings on 1.05 mm pitch should be used for the  
center ground pad.  
Notes (Card Assembly):  
1. A No-Clean, Type-3 solder paste is recommended.  
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification  
for Small Body Components.  
Preliminary Rev. 0.24  
13  
Si5316  
DOCUMENT CHANGE LIST  
Revision 0.23 to 0.24  
„ Changed LVTTL to LVCMOS in Table 2, “Absolute  
Maximum Ratings,” on page 3.  
„ Added Figure 1, “Typical Phase Noise Plot,” on page  
4.  
„ Showed preferred interface for an external reference  
clock in Figure 2, “Si5316 Typical Application  
Circuit,” on page 5.  
„ Updated 3. "Ordering Guide" on page 10.  
„ Added “5. Recommended PCB Layout”.  
14  
Preliminary Rev. 0.24  
Si5316  
NOTES:  
Preliminary Rev. 0.24  
15  
Si5316  
CONTACT INFORMATION  
Silicon Laboratories Inc.  
400 West Cesar Chavez  
Austin, TX 78701  
Tel: 1+(512) 416-8500  
Fax: 1+(512) 416-9669  
Toll Free: 1+(877) 444-3032  
Email: Clockinfo@silabs.com  
Internet: www.silabs.com  
The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice.  
Silicon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from  
the use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the functioning of undescribed features  
or parameters. Silicon Laboratories reserves the right to make changes without further notice. Silicon Laboratories makes no warranty, rep-  
resentation or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Laboratories assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation conse-  
quential or incidental damages. Silicon Laboratories products are not designed, intended, or authorized for use in applications intended to  
support or sustain life, or for any other application in which the failure of the Silicon Laboratories product could create a situation where per-  
sonal injury or death may occur. Should Buyer purchase or use Silicon Laboratories products for any such unintended or unauthorized ap-  
plication, Buyer shall indemnify and hold Silicon Laboratories harmless against all claims and damages.  
Silicon Laboratories, Silicon Labs, and 5323 are trademarks of Silicon Laboratories Inc.  
Other products or brandnames mentioned herein are trademarks or registered trademarks of their respective holders.  
16  
Preliminary Rev. 0.24  

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SI5316-C-GMR

Support Circuit, 1-Func, 6 X 6 MM, ROHS COMPLIANT, MO-220VJJD, QFN-36
SILICON

SI5316-RM

Mux/Demux, 1-Func, QFN-36
SILICON

SI5317

Pin-Controlled 1_710 MHz Jitter Cleaning Clock
SILICON

Si5317-EVB

Pin-Controlled 1_710 MHz Jitter Cleaning Clock
SILICON

SI5317-EVB

Si5317 EVALUATION BOARD
MURATA

SI5317A-C-GM

Pin-Controlled 1_710 MHz Jitter Cleaning Clock
SILICON

Si5317B-C-GM

Pin-Controlled 1_710 MHz Jitter Cleaning Clock
SILICON

SI5317C-C-GM

Pin-Controlled 1_710 MHz Jitter Cleaning Clock
SILICON

SI5317D-C-GM

Pin-Controlled 1_710 MHz Jitter Cleaning Clock
SILICON

SI5317D-C-GMR

暂无描述
SILICON