STK12C68-L [SIMTEK]
Statement of Material Content Ceramic LCC Packages; 材质含量陶瓷LCC封装声明
| 型号： | STK12C68-L |
| 厂家： | 
SIMTEK CORPORATION |
| 描述： | Statement of Material Content Ceramic LCC Packages |
| 文件： | 总2页 (文件大小：31K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Statement of Material Content
Ceramic LCC Packages
STK11C68-L
STK12C68-L
STK14C88-L
This package type is not available in a lead-free version.
Unit
Detail
28 350 LEADLESS CHIP CARRIER
32 450 LEADLESS CHIP CARRIER
PACKAGE MATERIALS
Simtek Package ID
Pin/Lead Count
L [hot solder dip lead finish]
28
L [hot solder dip lead finish]
32
Simtek package pn
Package Manufacturer
Mfg Pkg ID/Simtek part ID/Dwg ID
Simtek package Outline
JEDEC Case Outline
Mil Case Outline ID
Assembly Facility
Plant
STK-91-01-2303
Kyocera
STK-91-01-3202
NTK Technical Ceramics
IRK32F1-5379C / STK-91-01-3202
STK-40-05-011
PB-CA1771 / STK-91-01-2803
STK-40-05-007
MO-041
MO-041
Figure C11, CQCC3-N28
Amkor Technologies
ATP1
Figure C11, CQCC3-N32
Amkor Technologies
ATP1
Leadframe Plating
Plating Process
Gold Plate 60µ" min over 80-250µ" Nickel Gold Plate 80µ" min Over 50-350µ" Nickel
Electrolytic
Electrolytic
Kyocera 440 Black [Al2O3 90%]
Alloy 42 [Fe 58% / Ni 42%]
Gold Plate 80µ"
Ceramic
NTK ALN
Leads
Alloy 42 [Fe 58% / Ni 42%]
Gold Plate 80µ"
Sn/Pb 60/40%
Lead Plating [Gold Underplate]
Leads [Hot Solder Dip Finish]
Sn/Pb 60/40%
PACKAGE DIMENSIONS & CHARACTERISTICS
in3
mil
Nominal Cavity Volume
Die Size
.0035
.0062
146x153x19
144x374x19
mil
Pad Size
214x205
310x440
C/W
C/W
C/W
Theta Ja [still air] -approx
Theta Ja [200fpm/1mps] - approx
Theta Jc
98
73
55
42
3
3
Lead Resistance
800 mOhm Max
3pF max [1MHz]
500 mOhm Max
3pF max [1MHz]
pF
Lead to Lead Capacitance
SHIPPING INFORMATION
Carrier Type
rail
34
rail
34
qty
gm
Units Per Rail
Total Product Weight
0.9
1.3
LID DETAIL
Manufacturer
Lid Type
Williams Advanced Materials
Hi Rel Lid with Preform
STK-92-10-0003
Williams Advanced Materials
Hi Rel Lid with Preform
STK-92-10-0007
Simtek Lid ID
Dimensions
Lid Material
Plating
in
.330x.530 .280x.480 .01"
Kovar [Fe 54% / Co 17% / Ni 29%]
Gold 25µ" min on Nickel 50-350µ"
Electrolytic
.430x.530 .360x.500 .01 "
Kovar [Fe 54% / Co 17% / Ni 29%]
Gold 25µ" min on Nickel 50-350µ"
Electrolytic
µ"
Plating Process
Frame
Au 80% / Sn 20%
Au 80% / Sn 20%
in
Frame Thickness
.002"
.002"
PL0122
Simtek Corporation
August 07
Statement of Material Content
Ceramic LCC Packages
STK11C68-L
STK12C68-L
STK14C88-L
This package type is not available in a lead-free version.
Unit
Detail
28 350 LEADLESS CHIP CARRIER
32 450 LEADLESS CHIP CARRIER
ASSEMBLY MATERIALS
Die Attach
JMI 7000
Johnson Matthey
Silver Glass
0.5 - 1.0 mil
19 mil
JMI 7000
Manufacturer
Johnson Matthey
Silver Glass
0.5 - 1.0 mil
19 mil
Die Attach Type
Die Attach Thickness
Die Thickness
mil
mil
Die Coating
None
None
Wire Bond Material
Wire Bond Diameter
Al 99.99%
1.25 mil
Al 99.99%
1.25 mil
mil
ASSEMBLY PROCESS FLOW
Flow ID
P596-0501-0202
P596-0501-0202
Wafer Mount
Non Contact
Non Contact
Scribe Method
Complete Saw Through
CO2 bubbler
Complete Saw Through
CO2 bubbler
Saw/Clean
2nd optical
High Power. 100%
High Power. 45 C=0
Manual
High Power. 100%
High Power. 45 C=0
Manual
2nd optical QA
Die Attach Method
Die Attach Cure
Bonder: Manual/Auto
Bond Type: Forward/Reverse
Bond Type: At The Die
Bond Type: At The Paddle
3rd Optical
150-160°C, 10-30 minutes
Automatic
150-160°C, 10-30 minutes
Automatic
Reverse
Reverse
Ball
Ball
Stitch
Stitch
Low & High Power. 100%
Low & High Power. 45 C=0
Furnace / Nitrogen
Peak 420+/-5°C
Low & High Power. 100%
Low & High Power. 45 C=0
Furnace / Nitrogen
Peak 420+/-5°C
3rd Optical QA
Seal Method/Atmosphere
Lid Seal Temp Profile
°C
min
min
Dwell 7-10 Minutes @ 410°C
Rise 60.5 Min 100-400°C
Cool 2.0-3.5 minutes 400-200°C
Markem 4489 White
[lot #] [assembly country]
150°C+10°C -0°C 1hr +30 -0 minutes
100% 10 cycles, -65°C to +150°C
100% 30KG
Dwell 7-10 Minutes @ 410°C
Rise 60.5 Min 100-400°C
Cool 2.0-3.5 minutes 400-200°C
Markem 4489 White
[lot #] [assembly country]
150°C+10°C -0°C 1hr +30 -0 minutes
100% 10 cycles, -65°C to +150°C
100% 30KG
Marking Ink
Backside Mark
Ink Cure
Temp Cycle
Centrifuge
100% He 5x10-8 atm cc/sec
100% 5torr 0.5H 75psig 1H
100%
100% He 5x10-8 atm cc/sec
100% 5torr 0.5H 75psig 1H
100%
Fine Leak
Gross Leak
Final Visual QA
Pack & Ship
45, C=0
45, C=0
PROCESS MONITORS
Wire Bond Monitor
Die Attach Monitor
Lid Seal Monitor
Amkor Procedure
Amkor Procedure
Amkor Procedure
Amkor Procedure
Amkor Procedure
Amkor Procedure
PIND Monitor
Amkor Procedure
Amkor Procedure
Lead Trim Monitor
Seal Area Particulate Monitor
Area Particle Count Limits
Amkor Procedure
Amkor Procedure
Amkor Procedure
Amkor Procedure
10,000 In D/A, Wire Bond Areas
10,000 In D/A, Wire Bond Areas
PL0122
Simtek Corporation
August 07
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