STK18TA8-R40 [SIMTEK]

Non-Volatile SRAM, 128KX8, CMOS, PDSO48, 0.300 INCH, 0.025 INCH PITCH, PLASTIC, SSOP-48;
STK18TA8-R40
型号: STK18TA8-R40
厂家: SIMTEK CORPORATION    SIMTEK CORPORATION
描述:

Non-Volatile SRAM, 128KX8, CMOS, PDSO48, 0.300 INCH, 0.025 INCH PITCH, PLASTIC, SSOP-48

静态存储器 光电二极管 内存集成电路
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中文:  中文翻译
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STK18TA8  
nvTimeTM Event Data Recorder  
Serial Peripheral Interface nvSRAM  
QuantumTrapTM CMOS  
Nonvolatile Static RAM  
Preliminary  
DESCRIPTION  
FEATURES  
Data integrity of Simtek nvSRAM Combined  
with Full-Featured Real-Time Clock  
40 MHZ SPI interface with compatible  
commands to industry standards 1 Mbit SPI  
EEPROMs  
STORE to QuantumTrap™ Nonvolatile  
Elements is Initiated by Software , device pin  
or AutoStore™ on Power Down  
RECALL to SRAM Initiated by Software or  
Power Restore  
Unlimited READ and WRITE and RECALL  
Cycles  
Watchdog Timer  
Clock Alarm with programmable Interrupts  
Capacitor or battery backup for RTC  
Single 3V +20%, -10% Operation  
Commercial and Industrial Temperatures  
High-reliability  
The Simtek STK18TA8 combines a 1 Mbit nonvolatile  
static RAM and a full-featured real-time clock, in a  
reliable, monolithic integrated circuit.  
A
Serial  
Peripheral Interface (SPI) makes system integration  
simple. The embedded nonvolatile elements  
incorporate Simtek’s QuantumTrapTM technology  
producing the world’s most reliable nonvolatile  
memory. The SRAM provides unlimited read and write  
cycles, while independent, nonvolatile data resides in  
the highly reliable QuantumTrapTM cell. Data transfers  
from the SRAM to the nonvolatile elements (the  
STORE operation) takes place automatically at power  
down. On power up, data is restored to the SRAM (the  
RECALL operation) from the nonvolatile memory.  
Both the STORE and RECALL operations are also  
available under software control.  
The Real-Time Clock function provides an accurate  
clock with leap year tracking and a programmable,  
high accuracy oscillator. The Alarm function is  
programmable for one-time alarms or periodic  
seconds, minutes, hours, or days. There is also a  
programmable Watchdog Timer for process control.  
o
o
Endurance to 1 Million Cycles  
Retention to 100 years at 85 ºC  
Package: 48-Pin SSOP  
BLOCK DIAGRAM  
VCC  
VCAP  
Quantum Trap  
1024 X 1024  
VRTCbat  
VRTCcap  
POWER  
CONTROL  
STORE  
STORE/  
RECALL  
CONTROL  
STATIC RAM  
ARRAY  
1024 X 1024  
RECALL  
HSB  
SCK  
SI  
SO  
SPI  
CONTROLLER  
HOLD  
Data  
COLUMN I/O  
CS  
COLUMN DEC  
X1  
RTC  
X2  
Address  
INT  
Figure 1. Block Diagram  
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Document Control #ML0028 rev 0.8  
STK18TA8  
PACKAGES  
VCAP  
1
2
3
4
5
6
VCC  
48  
47  
46  
45  
44  
43  
HSB  
7
8
9
10  
11  
12  
13  
14  
15  
16  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
INT  
VSS  
VSS  
VSS  
VSS  
VRTCcap  
VRTCbat  
SCK  
CS  
17  
18  
32  
31  
30  
29  
28  
27  
26  
25  
19  
20  
21  
22  
23  
24  
HOLD  
SI  
PCB area usage.  
See website for detailed  
package size specifications.  
X1  
X2  
SO  
VCC  
48 Pin SSOP  
PIN DESCRIPTIONS  
Pin Name  
I/O  
Description  
The SI pin is used to transfer data into the device. Data is latched from this pin on the rising  
edge of the SCK clock pin. Instructions, addresses and data are all transmitted over this pin.  
The SO pin is used to transfer data out of the STK18TA8. During a read cycle, data is shifted out  
on this pin after the falling edge of the serial clock.  
SI - Serial Input  
Input  
SO - Serial Output  
3-state Output  
A low level on this pin selects the device. A falling edge is required on CS before each  
command code. Nonvolatile operations which are already in progress will be completed  
regardless of the CS input signal. When the device is deselected, SO goes to the high  
impedance state allowing other devices to share the SPI bus. When CS is held high and all  
internal commands have completed the device enters the standby mode (low-power).  
The SCK is used to synchronize the communication between a master and the STK18TA8.  
Instructions, addresses, or data present on the SI pin are latched on the rising edge of the clock  
input, while data placed on the SO pin changes on the falling edge of the clock input.  
CS - Chip Select  
Input  
SCK - Serial Clock  
HOLD  
Input  
Input  
The HOLD pin is used to pause the serial interface. If HOLD is driven low, the chip ignores  
all serial input as long as CS is held low. When HOLD is again driven high, normal  
operation resumes on the next clock edge. If CS is driven high at any time, the hold  
operation is aborted. This pin has an internal pullup.  
VCC - Chip Power  
VSS - Chip Ground  
Power  
Power  
The VCC pin supplies the power for the chip during normal operation.  
Ground.  
A capacitor should be connected with a minimum of 17uF, 5V minimum. Upon power down, VCAP  
supplies the power for the AutoStoreTM operation whereby SRAM data elements are transferred  
in parallel to the nonvolatile QuantumTrapTM elements.  
VCAP - Power for Non-  
Power  
volatile AutoStoreTM  
VRTCcap  
VRTCbat  
X1 - Crystal Out  
X2 - Crystal in  
Power  
Power  
Output  
Input  
Capacitor supplied backup RTC supply voltage. (Left unconnected if VRTCbat is used.)  
Battery supplied backup RTC supply voltage. (Left unconnected if VRTCcap is used. )  
Crystal Connection, drives crystal on startup.  
Crystal Connection, 32.768Khz crystal.  
When low this output indicates a Hardware Store is in progress. When pulled low externally to  
the chip it will initiate a nonvolatile STORE operation. Left undriven the pin is weakly pulled up  
HSB - STORE  
In/Output  
request and status  
internal to the chip. STORE operation will not be started when VCC is below Vswitch  
.
Pin which can be programmed to respond to the clock alarm, the watchdog timer, or the power  
monitor. Programmable to either active high (push/pull) or active low (open-drain).  
Unlabeled pins should be left with no connections on the printed circuit board.  
INT - interrupt out  
(Blank)  
Output  
No Connect  
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STK18TA8  
ABSOLUTE MAXIMUM RATINGSa  
Notes  
-0.5V to +4.1V  
Power Supply Voltage  
Voltage on Input Relative to VSS  
Voltage on Outputs  
a: Stresses greater than those listed under “Absolute Maximum  
Ratings” may cause permanent damage to the device. This is a  
stress rating only, and functional operation of the device at con-  
ditions above those indicated in the operational sections of this  
specification is not implied. Exposure to absolute maximum rat-  
ing conditions for extended periods may affect reliability.  
-0.5V to (VCC + 0.5V)  
-0.5V to (VCC + 0.5V)  
–55°C to 125°C  
–55°C to 140°C  
–65°C to 150°C  
1W  
Temperature under Bias  
Junction Temperature  
Storage Temperature  
Power Dissipation  
DC Output Current (1 output at a time, 1s duration)  
15mA  
Package Thermal Characteristics see website: http://www.simtek.com/  
DC CHARACTERISTICS  
Commercial  
Industrial  
MIN MAX  
Symbol  
Parameter  
Units  
Notes  
MIN  
MAX  
Based on 40MHz cycle rate. Values  
obtained without output loads.  
All Inputs Don’t Care, VCC = max  
Average current for duration of STORE  
cycle (tSTORE).  
All Inputs Don’t Care  
Average current for duration of STORE  
cycle (tSTORE).  
Average VCC Current  
ICC1  
10  
10  
3
mA  
Average VCC Current during STORE  
ICC2  
3
3
mA  
mA  
Average VCAP Current during  
AutoStore™ Cycle  
ICC4  
3
All Others VIN 0.2V or (VCC – 0.2V)  
Standby current level after nonvolatile  
cycle is complete.  
VCC Standby Current  
(Standby, Stable CMOS Input Levels)  
ISB  
2
2
mA  
µA  
VCC = max  
Input Leakage Current  
IILK  
±1  
±1  
±1  
VIN = VSS to VCC  
VCC = max  
VIN = VSS to VCC  
Off-State Output Leakage Current  
IOLK  
±1  
VCC + 0.3  
0.8  
µA  
V
Input Logic “1” Voltage  
Input Logic “0” Voltage  
Output Logic “1” Voltage  
Output Logic “0” Voltage  
Operating Temperature  
VIH  
VIL  
2.0  
V
CC + 0.3  
0.8  
2.0  
VSS – 0.5  
2.4  
All Inputs  
All Inputs  
V
SS – 0.5  
2.4  
V
VOH  
VOL  
TA  
V
IOUT = –2mA  
0.4  
70  
0.4  
85  
V
IOUT = 4mA  
0
–40  
oC  
Nominal 3.0V +20%, -10% used for tested  
specifications.  
Operating Voltage  
Storage Capacitor  
VCC  
2.7  
17  
3.6  
57  
2.7  
17  
3.6  
57  
V
VCAP  
µf  
Between Vcap pin and Vss, 5V rated.  
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Document Control #ML0028 rev 0.8  
STK18TA8  
AC TEST CONDITIONS  
0V to 3V  
Input Pulse Levels  
Input Rise and Fall Times  
Input and Output Timing Reference Levels  
5ns  
1.5V  
Output Load  
See Figure 2 and Figure 3  
CAPACITANCEb  
(TA = 25°C, f = 1.0MHz)  
SYMBOL  
PARAMETER  
MAX  
UNITS  
pF  
CONDITIONS  
V = 0 to 3V  
V = 0 to 3V  
CIN  
Input Capacitance  
Output Capacitance  
7
7
COUT  
pF  
Notes  
b: These parameters are guaranteed but not tested  
3.0V  
3.0V  
577 Ohms  
577 Ohms  
OUTPUT  
OUTPUT  
30 pF  
5 pF  
789 Ohms  
789 Ohms  
INCLUDING  
SCOPE AND  
FIXTURE  
INCLUDING  
SCOPE AND  
FIXTURE  
Figure 2. AC Output Loading  
Figure 3. AC Output Loading, for tri-  
state specs ( tDIS  
)
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STK18TA8  
RTC DC CHARACTERISTICS  
Commercial  
Industrial  
Symbol  
Parameter  
Units  
Notes  
MIN  
MAX  
MIN  
MAX  
RTC Backup Current  
-
-
IBAK  
300  
350  
nA  
V
From either VRTCcap or VRTCbat  
Typical = 3.0 Volts during normal  
operation  
Typical = 2.4 Volts during normal  
operation  
RTC Battery Pin Voltage  
VRTCbat  
VRTCcap  
1.8  
1.2  
3.3  
2.7  
1.8  
1.2  
3.3  
2.7  
RTC Capacitor Pin Voltage  
V
@ MIN Temperature from Power up  
or Enable  
-
-
-
-
1
1
min  
sec  
tOSCS  
RTC Oscillator time to start  
10  
10  
@25ºC from Power up or Enable  
RTC RECOMMENDED COMPONENT CONFIGURATION  
X1  
X2  
Recommended Values  
Y1 = 32.768 KHz  
RF = 10M Ohm  
C1 = 2.2 pF  
C2 = 47 pF  
Figure 4. RTC COMPONENT CONFIGURATION  
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Document Control #ML0028 rev 0.8  
STK18TA8  
AC PARAMETERS  
STK18TA8  
NO.  
SYMBOLS  
PARAMETER  
UNITS  
MIN  
MAX  
1
2
FCLK  
tCSS  
Clock Frequency  
CS setup time  
40  
MHZ  
ns  
5
CS hold time  
3
tCSH  
25  
ns  
4
5
tWH  
tWL  
tSU  
tH  
SCK high time  
SCK low time  
SI, Setup time  
SI, hold time  
10  
10  
3
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
6
7
5
8
5
tCS  
tV  
CS high time  
Falling SCK to Output valid  
Output hold time  
9
7
3
10  
11  
tHO  
tDIS  
10  
Output Disable time  
SPITM Input Timing  
1
8
1/FCLK  
tCS  
CS  
SCK  
SI  
2
tCSS  
4
tWH  
5
tWL  
3
tCSH  
6
tSU  
7
tH  
SPITM Output Timing  
CS  
SCK  
9
11  
tDIS  
tV  
Delay Byte  
HI-Z  
7
6
5
SO  
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STK18TA8  
AutoStore™ /POWER-UP RECALL  
STK18TA8  
Notes  
NO.  
SYMBOLS  
PARAMETER  
UNITS  
MIN  
MAX  
12  
13  
14  
15  
tHRECALL  
tSTORE  
VSWITCH  
tVCCRISE  
20  
ms  
ms  
V
c
Power-up RECALL Duration  
STORE Cycle Duration  
Low Voltage Trigger Level  
VCC Rise Time  
12.5  
2.65  
d
2.55  
150  
µs  
Notes  
c: tHRECALL starts from the time VCC rises above VSWITCH  
d: If an SRAM WRITE has not taken place since the last nonvolatile cycle, no STORE will take place  
STORE occurs only if a  
No STORE occurs  
without at least one  
SRAM write.  
SRAM write has  
happened.  
VCC  
14  
VSWITCH  
15  
tVCCRISE  
AutoStoreTM  
13  
tSTORE  
13  
tSTORE  
POWER-UP RECALL  
12  
tHRECALL  
12  
tHRECALL  
Read & Write Inhibited  
POWER DOWN  
BROWN-OUT  
POWER-UP  
RECALL  
POWER-UP  
RECALL  
AutoStoreTM  
AutoStoreTM  
Note: Read and Write cycles will be ignored during STORE, RECALL and while VCC is below VSWITCH.  
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STK18TA8  
HARDWARE STORE CYCLE  
SYMBOLS  
STK18TA8  
NO.  
PARAMETER  
UNITS  
NOTES  
Standard  
tHLHX  
Alternate  
MIN  
MAX  
16  
17  
Hardware STORE Pulse Width  
15  
ns  
ns  
tHLBL  
Hardware STORE Low to STORE Busy  
300  
16  
tHLHX  
HSB (In)  
HSB (Out)  
13  
tSTORE  
17  
tHLBL  
Hi-Z  
SOFTWARE STORE CYCLE (CTLSEQ COMMAND)  
SYMBOLS  
STK18TA8  
NO.  
PARAMETER  
UNITS  
NOTES  
Standard  
Alternate  
MIN  
MAX  
tRECALL  
40  
µs  
18  
RECALL Duration  
Note: The parameter tSTORE or tRECALL are substituted for STORE or RECALL command respectively.  
Endurance Parameters  
SYMBOLS  
STK18TA8  
MIN MAX  
NO.  
PARAMETER  
UNITS  
NOTES  
Standard Alternate  
SRAM write cycles  
Number of STORE cycles  
Infinite  
1 x 106  
cycles  
cycles  
19  
20  
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STK18TA8  
HOLD Signal Timing  
SYMBOLS  
STK18TA8  
NO.  
PARAMETER  
SCK to HOLD Change  
UNITS  
NOTES  
e
Standard  
Alternate  
MIN  
MAX  
tCH  
tHQZ  
tHQX  
ns  
ns  
ns  
21  
22  
23  
5
HOLD active to Output Inactive  
HOLD Inactive to Output Active  
10  
0
Notes  
e: It is recommended that HOLD change on negative transitions of the SCK or while SCK is low.  
CS  
SCK  
21  
tCH  
21  
tCH  
HOLD  
SO  
22  
tHQZ  
23  
tHQX  
22  
tHQZ  
23  
tHQX  
Hold  
Hold  
Normal Operation  
Normal Operation  
Normal Operation  
Changes while SCK Low  
(Recommended)  
Delayed to falling  
Edge of SCK  
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STK18TA8  
SERIAL PERIPHERAL INTERFACE  
bytes and format for device operation. All instructions,  
addresses, and data are transferred MSB first, LSB  
last. Data is sampled on the first rising edge of SCK  
after CS goes low. Refer to Figure 5 which shows  
the connection of multiple SPI devices. The SO  
output is shared since only the slave selected by  
CS and a valid opcode is returns data to the master.  
If no slave is selected the SO pin is tri-stated. If the  
master device has a bi-directional pin capability, the  
SO and SI pins may be shared by having the master  
switch the pin to input when data is expected from  
one of the slave SPI devices.  
Serial Interface Description  
The STK18TA8 is a 1 Mbit Serial nvSRAM (SRAM +  
nonvolatile element in a combined cell) with 128K x 8  
organization designed to interface directly with the  
Serial Peripheral Interface (SPI) port of many popular  
microcontrollers. It may also interface with  
microcontrollers that do not have a built-in SPI port  
by using discrete I/O lines programmed properly with  
the software. The STK18TA8 SPI interface contains  
an 8-bit instruction register. Data is clocked into the  
device through the SI pin on the rising edge of SCK.  
The CS pin must be low for the entire data transfer.  
Table 1 contains a list of the possible instruction  
SLAVE: DEVICES  
MASTER: MPU  
SI  
DATA OUT (MOSI)  
SO  
DATA IN (MISO)  
SCK  
CS#  
CLOCK (SPICK)  
SS0  
SS1  
SS2  
SS3  
SI  
SO  
SCK  
CS#  
SI  
SO  
SCK  
CS#  
SI  
SO  
SCK  
CS#  
Figure 5. Multiple Device System  
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Document Control #ML0028 rev 0.8  
STK18TA8  
Table 1. SPITM INSTRUCTION SET  
Instruction  
Name  
Code Description  
READ  
0x03  
0x02  
0x0B  
0x0F  
Read SRAM data from selected address.  
WRITE  
FREAD  
CTLSEQ  
Write SRAM data from selected address.  
Fast read of SRAM data from selected address. (First byte is the delay byte).  
Device control command sequence.  
Table 2. CONTROL COMMAND SEQUENCES  
Command  
Name  
CMD Bytes Description  
0x4E38  
0xB1C7  
0x83E0  
STORE  
Commands Device to transfer the SRAM data to the nonvolatile memory elements.  
0x7C1F  
0x703F  
0x8FC0  
0x4E38  
0xB1C7  
0x83E0  
0x7C1F  
0x703F  
0x4C63  
0x4E38  
0xB1C7  
0x83E0  
0x7C1F  
0x703F  
0x4B46  
0x4E38  
0xB1C7  
0x83E0  
0x7C1F  
0x703F  
0x8B45  
RECALL  
AUTOENA  
AUTODIS  
Commands Device to transfer the nonvolatile memory contents to the SRAM memory.  
Turns on the AUTOSTORETM feature of the device, enabling automatic stores to nonvolatile memory  
when VCC drops below VSWITCH  
.
Turns off the AUTOSTORETM feature of the device, disabling the automatic stores to nonvolatile  
memory. STORES invoked by the control command STORE sequence and stores invoked by driving  
the HSB pin remain enabled.  
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Document Control #ML0028 rev 0.8  
STK18TA8  
the SCK signal when CS falls or rises. Mode 0  
has SCK=0 during SCK falls or rises. Mode 3 has  
SCK high when CS falls or rises. The mode is  
important for hardware SPI controllers and less so  
for firmware based control. Refer to Figure 6 for a  
diagram of signal waveforms.  
SPI modes explained  
SPI mode 0 and 3 are supported for the STK18TA8  
device. In both modes, data is received from the SPI  
master by presenting data tSU ns before the rising edge of  
the clock. Data is driven out the SO pin on the falling  
edge of SCK and received by the SPI master on the  
rising edge. Mode 0 and mode 3 differ in the state of  
CS  
Mode 3  
Mode 0  
Mode 3  
Mode 0  
0
1
6
7
8
9
10  
29  
30  
31  
32  
33  
38  
39  
40  
41  
46  
47  
SCK  
SI  
7
6
1
0
23 22 21  
2
1
0
7
6
1
0
7
6
1
0
SO  
Figure 6. SPI Mode Waveforms  
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STK18TA8  
DEVICE OPERATION  
On the falling edge of the 32th clock cycle (after the  
command, and 3 address bytes) the data at the  
specified address is shifted out on the SO output.  
Every falling edge of SCK will generate another data  
bit to be sampled by the master device on the next  
rising edge of SCK. The READ command can be  
continued by continuously holding the CS line low  
and supplying additional SCK pulses. Internally the  
byte address is automatically incremented and data  
will continue to be shifted out. The delay byte is only  
required on first memory access after the READ  
command. All subsequent READs are pipelined and  
are output on consecutive SCK falling edges. When  
the highest SRAM address is reached, the address  
counter will roll over to the lowest address allowing the  
entire memory to be read in one continuous READ  
cycle. When the CS line goes inactive the READ  
command is terminated.  
nvSRAM  
The STK18TA8 nvSRAM is made up of two  
functional components paired in the same physical  
cell. These are a SRAM memory cell and a  
nonvolatile QuantumTrapcell. The SRAM memory  
cell operates as a standard fast static RAM. Data in  
the SRAM can be transferred to the nonvolatile cell  
(the STORE operation), or from the nonvolatile cell  
to SRAM (the RECALL operation). This unique  
architecture allows all cells to be stored and recalled  
in parallel. During the STORE and RECALL  
operations SRAM READ and WRITE operations are  
inhibited. The STK18TA8 supports unlimited reads  
and writes just like a typical SRAM. In addition, it  
provides unlimited RECALL operations from the  
nonvolatile cells and up to 1 million STORE  
operations.  
SRAM READ  
Please note that the top 16 bytes of the memory space  
represent the RTC functions. The proper method for  
reading these registers accurately is described in the  
“Real Time Clock Operation” section of this document.  
To logically separate the RTC registers from the SRAM  
accesses, READ commands wrap back to 0x0000  
after accessing 0x1FFEF. READs from addresses  
above 0x1FFEF, which represents the RTC address  
space, do not advance the address counter. Only 1  
byte is read. As long as CS is held low the same  
byte will continue be read.  
Reading the STK18TA8 via the SO (Serial Output) pin  
requires the following sequence. After the CS line is  
pulled low to select a device, the READ op-code is  
transmitted via the SI line clocked in on each rising  
edge of SCK followed by a 3 byte address to be read  
(Refer to Table 6). All data is sent with the most  
significant bit first. After the address bytes SCK must  
complete eight cycles. This allows time for the  
memory to be access and the data to be loaded into  
the output shift register.  
Figure 7. Read Command Multi-byte Example  
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STK18TA8  
SRAM FREAD  
the 9th cycle the most significant bit of the memory byte  
is ready to on the SO output. This command is  
provided for systems that require the maximum clock  
frequency but are unable to provide the delay required  
for the SRAM access prior to valid data on SO. SO is  
not driven during the delay byte and data during this  
time period is considered invalid.  
A fast READ command is also provided on the  
STK18TA8 SPI interface. This command operates like  
the standard READ command except that a delay byte  
is inserted between the last address bit and the first  
valid data bit. The master SPI controller is required to  
supply 8 delay byte clock cycles. On the rising edge of  
Figure 8. Fast Read Command Multi-byte Example  
SRAM WRITE  
To logically separate the RTC registers from the  
SRAM access WRITE commands will wrap back to  
0x0000 after writing 0x1FFEF. WRITEs targeted for  
addresses above 0x1FFEF which represent the RTC  
address space, do not advance the address counter.  
Only one data byte is expected in write commands  
targeted for the RTC. If multiple bytes are sent, later  
bytes will overwrite bytes sent earlier.  
Writing to the STK18TA8 requires the following  
sequence. After the CS line is pulled low to select the  
device, the WRITE op-code is transmitted via the SI  
line (MSB first) followed by a three-byte address and  
the data (D7 - D0) to be programmed (Refer to Table  
6). A single or unlimited number of data bytes may be  
sent after the first byte and the address will increment  
after each byte is received. The WRITE command is  
terminated when CS pin goes inactive.  
Please note that the top 16 bytes of the memory  
space represent the RTC registers on the chip. The  
proper method for writing these registers accurately is  
described in the “Real Time Clock Operation” section  
of this document.  
Figure 9. Write Command Multi-byte Example  
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Figure 10 shows the proper connection of the storage  
capacitor (Vcap) for automatic store operation. Refer to  
the DC CHARACTERISTICS table for the size of Vcap.  
The voltage on the Vcap pin is driven to 5V by a  
charge pump internal to the chip.  
AutoStore™ OPERATION  
The STK18TA8 stores data to nvSRAM using one of  
three storage operations. These three operations are  
Hardware Store, activated by HSB , Software Store,  
activated by a SPI command, and AutoStore™,  
activated on device power down.  
To reduce unneeded nonvolatile stores, AutoStore™  
and Hardware Store operations will be ignored unless  
at least one WRITE operation has taken place since  
the most recent STORE or RECALL cycle. Software  
initiated STORE cycles are performed regardless of  
whether a WRITE operation has taken place. The  
HSB signal can be monitored by the system to detect a  
STORE cycle is in progress.  
AutoStore™ operation is a unique feature of Simtek  
QuantumTraptechnology and is enabled by default  
on the STK18TA8.  
During normal operation, the device will draw current  
from Vcc to charge a capacitor connected to the Vcap  
pin. This stored charge will be used by the chip to  
perform a single STORE operation. If the voltage on  
the Vcc pin drops below Vswitch, the part will  
automatically disconnect the Vcap pin from Vcc.  
A
STORE operation will be initiated with power provided  
by the Vcap capacitor.  
VCC  
VCAP  
VCC  
Figure 10. AutoStoreTM Mode  
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SOFTWARE STORE  
HARDWARE STORE ( HSB ) OPERATION  
Data can be transferred from the SRAM to the  
nonvolatile memory by using a SPI command. The  
STK18TA8 software STORE cycle is initiated by  
issuing a CTLSEQ command through the SPI  
interface. During the STORE cycle an erase of the  
previous nonvolatile data is first performed, followed  
by a program of the nonvolatile elements. Once a  
STORE cycle is initiated, further READ and WRITE  
commands are ignored until the cycle is completed.  
After the tSTORE cycle time has been fulfilled, the  
SRAM will again be activated for READ and WRITE  
operation. Please see Table 2 and Figure 11 for  
details on how to issue the appropriate CTLSEQ.  
The STK18TA8 provides the HSB pin for controlling and  
monitoring the STORE operations. The HSB pin can be  
used to request a hardware STORE cycle. When  
the HSB pin is driven low, the STK18TA8 will  
conditionally initiate a STORE operation. An actual  
STORE cycle will only begin if a WRITE to the SRAM  
took place since the last STORE or RECALL cycle. The  
HSB pin also acts as an open drain driver that is  
internally driven low to indicate a busy condition while  
the STORE (initiated by any means) is in progress.  
The SPI controller checks the state of the HSB pin just  
after the final bit of each byte being written. If HSB is  
active the WRITE operation is cancelled. However, if  
HSB goes low after the WRITE operation has been  
initiated the WRITE will complete before the STORE  
operation is started. Memory READ and incomplete  
SPI commands will be cancelled and/or ignored when  
SOFTWARE RECALL  
Data can be transferred from the nonvolatile  
memory to the SRAM by using a SPI command. A  
software RECALL cycle is initiated by issuing a  
CTLSEQ command through the SPI interface.  
Internally, RECALL is a two-step procedure. First,  
the SRAM data is cleared, and second, the  
nonvolatile information is transferred into the SRAM  
cells. Once a RECALL cycle is initiated, further  
READ and WRITE commands are ignored until the  
cycle is completed. After the tRECALL cycle time the  
SRAM will once again be ready for READ and  
WRITE operations. The RECALL operation in no  
way alters the data in the nonvolatile elements.  
Please see Table 2 and Figure 11 for details on how  
to issue the appropriate CTLSEQ.  
HSB  
is active. During any STORE operation,  
regardless of how it was initiated, the STK18TA8 will  
continue to drive the HSB pin low, releasing it only  
when the STORE is complete. Upon completion of the  
STORE operation the STK18TA8 will remain disabled  
until the HSB pin returns high.  
If HSB is not used, it should be left unconnected.  
HARDWARE RECALL (POWER-UP)  
During power up, or after any low-power condition (VCC  
< VSWITCH), an internal RECALL request will be latched.  
When VCC once again exceeds the sense voltage of  
VSWITCH, a RECALL cycle will automatically be initiated  
and will take tHRECALL to complete.  
Figure 11. Control Sequence Command Example  
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PREVENTING AUTOSTORETM  
changes state while SCK is high the hold state will  
not be recognized until the next falling edge of SCK.  
During the hold state SCK can toggle and devices  
sharing SO and SI can use these signal lines to  
communicate without disturbing the command in  
progress on this device. The STK18TA8 releases  
the SO pin during the duration of the hold  
operation so that other devices may communicate  
with the SPI master. CS must be held low  
selecting the device during the hold operation. If the  
CS goes high while a hold is in progress the  
command will be terminated.  
The AutoStore™ function can be disabled by initiat-  
ing an AutoStore Disable CTLSEQ command.  
The AutoStore™ can be re-enabled by initiating an  
AutoStore Enable CTLSEQ command. If the  
AutoStore™ function is disabled or re-enabled a  
manual STORE operation (Hardware or Software)  
needs to be issued to save the AutoStore state  
through subsequent power down cycles. The part  
comes from the factory with AutoStore™ enabled.  
Please see Table 2 and Figure 11 for details on  
how to issue the appropriate CTLSEQ.  
DATA PROTECTION  
When AutoStore™ is disabled as described above  
the RTC registers are not saved on power down.  
If the RTC registers are changed during system  
operation a CTLSEQ STORE needs to be issued  
to update the non-volatile memory.  
The STK18TA8 protects data from corruption during  
low-voltage conditions by inhibiting all externally  
initiated STORE and WRITE operations. The low-  
voltage condition is detected when VCC < VSWITCH .  
NOISE CONSIDERATIONS  
HOLD OPERATION  
The STK18TA8 is a high-speed memory and so  
must have a high-frequency bypass capacitor of  
approximately 0.1µF connected between VCC and  
VSS, using leads and traces that are as short as pos-  
sible. As with all high-speed CMOS ICs, careful  
routing of power, ground and signals will reduce  
circuit noise.  
The  
HOLD  
pin is used to pause serial  
communications without aborting the command in  
progress. This can be useful if the SPI master is  
interrupted during a burst read or write to service  
another device. The HOLD signal is intended to be  
asserted while SCK is low and to be de-asserted  
again while SCK is low. HOLD is recognized by the  
STK18TA8 only when SCK is low. If HOLD  
Figure 12. HOLD Operation Example  
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REAL TIME CLOCK OPERATION  
nvTIME OPERATION  
SETTING THE CLOCK  
The STK18TA8 offers internal registers that contain Setting the write bit “W” (in the flags register at  
Clock, Alarm, Watchdog, Interrupt, and Control 0x1FFF0) to a “1” halts updates to the STK18TA8  
functions. Internal double buffering of the clock and registers. The correct day, date and time can then be  
the clock/timer information registers prevents written into the registers in 24-hour BCD format. The  
accessing transitional internal clock data during a time written is referred to as the “Base Time.” This  
read or write operation. Double buffering also cir- value is stored in nonvolatile registers and used in  
cumvents disrupting normal timing counts or clock calculation of the current time. Resetting the write bit  
accuracy of the internal clock while accessing clock to “0” transfers those values to the actual clock  
data. Clock and Alarm Registers store data in BCD counters, after which the clock resumes normal  
format.  
operation.  
BACKUP POWER  
CLOCK OPERATIONS  
The RTC in the STK18TA8 is intended for  
permanently powered operation. Either the VRTCcap or  
VRTCbat pin is connected depending on whether a  
capacitor or battery is chosen for the application.  
When primary power, Vcc, fails and drops below Vswitch  
the device will switch to the backup power supply.  
The clock registers maintain time up to 9,999 years in  
one second increments. The user can set the time to  
any calendar time and the clock automatically keeps  
track of days of the week and month, leap years and  
century transitions. There are eight registers  
dedicated to the clock functions which are used to set  
time with a write cycle and to read time during a read  
cycle. These registers contain the Time of Day in  
BCD format. Bits defined as “X” are currently not used  
and are reserved for future use by Simtek.  
The clock oscillator uses very little current, which  
maximizes the backup time available from the backup  
source. Regardless of clock operation with the  
primary source removed, the data stored in nvSRAM  
is secure, having been stored in the nonvolatile  
elements as power was lost. Factors to be considered  
when choosing a backup power source include: the  
expected duration of power outages and the cost  
trade-off of using a battery versus a capacitor.  
READING THE CLOCK  
While the double-buffered RTC register structure  
reduces the chance of reading incorrect data from the  
clock, the user should halt internal updates to the  
STK18TA8 clock registers before reading clock data  
to prevent the reading of data in transition. Stopping  
the internal register updates does not affect clock  
accuracy.  
During backup operation the STK18TA8 consumes a  
maximum of 300 nanoamps at 2 volts. Capacitor or  
battery values should be chosen according to the  
application. Backup time values based on maximum  
current specs are shown below. Nominal times are  
approximately 3 times longer.  
The updating process is stopped by writing a “1” to  
the read bit “R” (in the flags register at 0x1FFF0), and  
will not restart until a “0” is written to the read bit. The  
RTC registers can then be read while the internal  
clock continues to run.  
Capacitor Value  
0.1 F  
Backup Time  
72 hours  
14 days  
30 days  
0.47 F  
1.0 F  
Within 20ms after a “0” is written to the read bit, all  
STK18TA8 registers are simultaneously updated.  
Using a capacitor has the obvious advantage of  
recharging the backup source each time the system is  
powered up.  
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If a battery is used, a 3V lithium is recommended and calibration circuit adds or subtracts counts from the  
the STK18TA8 will only source current from the bat- oscillator divider circuit.  
tery when the primary power is removed. The battery  
The number of times pulses are suppressed (sub-  
will not, however, be recharged at any time by the  
tracted, negative calibration) or split (added, positive  
STK18TA8. The battery capacity should be chosen  
calibration) depends upon the value loaded into the  
for total anticipated cumulative down-time required  
five calibration bits found in calibration register at  
over the life of the system.  
0x1FFF8. Adding counts speeds the clock up;  
subtracting counts slows the clock down. The  
Calibration bits occupy the five lower order bits in the  
control register 8. These bits can be set to represent  
STOPPING AND STARTING THE OSCIL-  
LATOR  
The OSCEN bit in calibration register at 0x1FFF8  
controls the starting and stopping of the oscillator.  
This bit is nonvolatile and shipped to customers in the  
"enabled" (set to 0) state. To preserve battery life  
while system is in storage OSCEN should be set to a  
1. This will turn off the oscillator circuit extending the  
battery life. If the OSCEN bit goes from disabled to  
enabled, it will take approximately 5 seconds (10  
seconds max) for the oscillator to start.  
any value between 0 and 31 in binary form. Bit D5 is a  
Sign bit, where a “1” indicates positive calibration and  
a “0” indicates negative calibration. Calibration occurs  
within a 64 minute cycle. The first 62 minutes in the  
cycle may, once per minute, have one second either  
shortened by 128 or lengthened by 256 oscillator  
cycles.  
If a binary “1” is loaded into the register, only the first  
2 minutes of the 64 minute cycle will be modified; if a  
binary 6 is loaded, the first 12 will be affected, and so  
on. Therefore each calibration step has the effect of  
adding 512 or subtracting 256 oscillator cycles for  
every 125,829,120 actual oscillator cycles. That is  
+4.068 or -2.034 ppm of adjustment per calibration  
step in the calibration register.  
The STK18TA8 has the ability to detect oscillator  
failure. This is recorded in the OSCF (Oscillator  
Failed bit) of the flags register at address 0x1FFF0.  
When the device is powered on (VCC goes above  
Vswitch) the OSCEN bit is checked for "enabled" status.  
If the OSCEN bit is enabled and the oscillator is not  
active, the OSCF bit is set. The user should check for  
this condition and then write a 0 to clear the flag. It  
should be noted that in addition to setting the OSCF  
flag bit, the time registers are reset to the “Base Time”  
(see the section “Setting the Clock”), which is the  
value last written to the timekeeping registers. The  
Control/Calibration register and the OSCEN bit are not  
affected by the oscillator failed condition.  
In order to determine how to set the calibration one  
may set the CAL bit in the flags register at 0x1FFF0 to  
1, which causes the INT pin to toggle at a nominal  
512 Hz. Any deviation measured from the 512 Hz will  
indicate the degree and direction of the required  
correction. For example, a reading of 512.010124 Hz  
would indicate a +20 ppm error, requiring a -10  
(001010) to be loaded into the Calibration register.  
Note that setting or changing the calibration register  
does not affect the frequency test output frequency.  
If the voltage on the backup supply (either VRTCcap or  
VRTCbat) falls below their respective minimum level the  
oscillator may fail, leading to the oscillator failed  
condition which can be detected when system power  
is restored.  
ALARM  
The alarm function compares user-programmed val-  
ues to the corresponding time-of-day values. When a  
match occurs, the alarm event occurs. The alarm  
drives an internal flag, AF, and may drive the INT pin  
if desired.  
The value of OSCF should be reset to 0 when the  
time registers are written for the first time. This will  
initialize the state of this bit which may have become  
set when the system was first powered on.  
There are four alarm match fields. They are date,  
hours, minutes and seconds. Each of these fields also  
has a Match bit that is used to determine if the field is  
used in the alarm match logic. Setting the Match bit to  
“0” indicates that the corresponding field will be used  
in the match process.  
CALIBRATING THE CLOCK  
The RTC is driven by a quartz controlled oscillator  
with a nominal frequency of 32.768 KHz. Clock  
accuracy will depend on the quality of the crystal,  
usually specified to 35 ppm limits at 25°C. This error  
could equate to + 1.53 minutes per month. The  
STK18TA8 employs a calibration circuit that can  
improve the accuracy to +1/-2 ppm at 25°C. The  
Depending on the Match bits, the alarm can occur as  
specifically as one particular second on one day of  
the month, or as frequently as once per second  
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continuously. The MSB of each alarm register is a set the WDS bit without concern that the watchdog  
Match bit. Selecting none of the Match bits (all 1’s) timer value will be modified. A logical diagram of the  
indicates that no match is required. The alarm occurs watchdog timer is shown below. Note that setting the  
every second. Setting the match select bit for seconds watchdog time-out value to 0 would be otherwise  
to “0” causes the logic to match the seconds alarm meaningless and therefore disables the watchdog  
value to the current time of day. Since a match will function.  
occur for only one value per minute, the alarm occurs  
once per minute. Likewise, setting the seconds and  
Clock  
Divider  
Oscillator  
1 Hz  
minutes Match bits causes an exact match of these  
values. Thus, an alarm will occur once per hour.  
Setting seconds, minutes and hours causes a match  
once per day. Lastly, selecting all match values  
causes an exact time and date match. Selecting other  
bit combinations will not produce meaningful results;  
however the alarm circuit should follow the functions  
described.  
32.768KH2  
32 Hz  
Zero  
Compare  
WDF  
Counter  
Load  
Register  
WDS  
WDW  
There are two ways a user can detect an alarm event,  
by reading the AF flag or monitoring the INT pin. The  
AF flag in the flags register at 0x1FFF0 will indicate  
that a date/time match has occurred. The AF bit will  
be set to 1 when a match occurs. Reading the  
Flags/Control register clears the alarm flag bit (and all  
others). A hardware interrupt pin may also be used to  
detect an alarm event.  
D
Q
Q
Watchdog  
Register  
write to  
Watchdog  
Register  
Figure 13. Watchdog Timer Block Diagram  
The output of the watchdog timer is a flag bit WDF  
that is set if the watchdog is allowed to time-out. The  
flag is set upon a watchdog time-out and cleared  
when the Flags/Control register is read by the user.  
The user can also enable an optional interrupt source  
to drive the INT pin if the watchdog time-out occurs.  
WATCHDOG TIMER  
The watchdog timer is a free running down counter  
that uses the 32 Hz clock (31.25 ms) derived from the  
crystal oscillator. The oscillator must be running for  
the watchdog to function. It begins counting down  
from the value loaded in the Watchdog Timer register.  
The counter consists of a loadable register and a free  
running counter. On power up, the watchdog time-out  
value in register 0x1FFF7 is loaded into the counter  
load register. Counting begins on power up and  
restarts from the loadable value any time the  
Watchdog Strobe (WDS) bit is set to 1. The counter is  
compared to the terminal value of 0. If the counter  
reaches this value, it causes an internal flag and an  
optional interrupt output. The user can prevent the  
time-out interrupt by setting WDS bit to 1 prior to the  
counter reaching 0. This causes the counter to be  
reloaded with the watchdog time-out value and to be  
restarted. As long as the user sets the WDS bit prior  
to the counter reaching the terminal value, the inter-  
rupt and flag never occurs.  
POWER MONITOR  
The STK18TA8 provides a power management  
scheme with power-fail interrupt capability. It also  
controls the internal switch to backup power for the  
clock and protects the memory from low-VCC access.  
The power monitor is based on an internal band-gap  
reference circuit that compares the VCC voltage to  
various thresholds.  
As described in the AutoStore™ section previously,  
when Vswitch is reached as VCC decays from power  
loss, a data store operation is initiated from SRAM to  
the nonvolatile elements, securing the last SRAM  
data state. Power is also switched from VCC to the  
backup supply (battery or capacitor) to operate the  
RTC oscillator.  
New time-out values can be written by setting the  
watchdog write bit to 0. When the WDW is 0 (from the  
previous operation), new writes to the watchdog time-  
out value bits D5-D0 allow the time-out value to be  
modified. When WDW is a 1, then writes to bits D5-D0  
will be ignored. The WDW function allows a user to  
When operating from the backup source no data may  
be read or written and the clock functions are not  
available to the user. The clock continues to operate  
in the background. Updated clock data is available to  
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the user after tHRECALL delay (See AutoStore™ According to the programming selections, the pin can  
/POWER-UP RECALL) after VCC has been restored be driven in the backup mode for an alarm interrupt.  
to the device.  
In addition, the pin can be an active low (open-drain)  
or an active high (push-pull) driver. If programmed for  
operation during backup mode, it can only be active  
low. Lastly, the pin can provide a one-shot function so  
that the active condition is a pulse or a level condition.  
In one-shot mode, the pulse width is internally fixed at  
approximately 200 ms. This mode is intended to reset  
a host microcontroller. In level mode, the pin goes to  
its active polarity until the Flags/Control register is  
read by the user. This mode is intended to be used as  
an interrupt to a host microcontroller. The control bits  
are summarized as follows:  
INTERRUPTS  
The STK18TA8 provides three potential interrupt  
sources. They include the watchdog timer, the power  
monitor, and the clock/calendar alarm. Each can be  
individually enabled and assigned to drive the INT pin.  
In addition, each has an associated flag bit that the  
host processor can use to determine the cause of the  
interrupt.  
Some of the sources have additional control bits that  
determine functional behavior. In addition, the pin  
driver has three bits that specify its behavior when an  
interrupt occurs. A functional diagram of the interrupt  
logic is shown below.  
Watchdog Interrupt Enable - WIE. When set to 1, the  
watchdog timer drives the INT pin as well as an  
internal flag when a watchdog time-out occurs. When  
WIE is set to 0, the watchdog timer affects only the  
internal flag.  
Alarm Interrupt Enable - AIE. When set to 1, the alarm  
match drives the INT pin as well as an internal flag.  
When set to 0, the alarm match only affects to internal  
flag.  
WDF  
Watchdog  
Timer  
WIE  
VCC  
PF  
PFE  
AF  
P/L  
Power Fail Interrupt Enable - PFE. When set to 1, the  
power fail monitor drives the pin as well as an internal  
flag. When set to 0, the power fail monitor affects only  
the internal flag.  
Power  
Monitor  
Pin  
Driver  
INT  
H/L  
VINT  
VSS  
Clock  
Alarm  
High/Low - H/L. When set to a 1, the INT pin is active  
high and the driver mode is push-pull. The INT pin  
can drive high only when VCC>Vswitch. When set to a 0,  
the INT pin is active low and the drive mode is open-  
drain. Active low (open drain) is operational even in  
battery backup mode.  
AIE  
Figure 14. Interrupt Block Diagram  
Pulse/Level - P/L. When set to a 1 and an interrupt  
occurs, the INT pin is driven for approximately 200  
ms. When P/L is set to a 0, the INT pin is driven high  
or low (determined by H/L) until the Flags/Control  
register is read.  
The three interrupts each have a source and an  
enable. Both the source and the enable must be  
active (true high) in order to generate an interrupt  
output. Only one source is necessary to drive the pin.  
The user can identify the source by reading the  
Flags/Control register, which contains the flags  
associated with each source. All flags are cleared to 0  
when the register is read. The cycle must be a  
complete read cycle ( WE high); otherwise the flags  
will not be cleared. The power monitor has two pro-  
grammable settings that are explained in the power  
monitor section.  
When an enabled interrupt source activates the INT  
pin, an external host can read the Flags/Control reg-  
ister to determine the cause. Remember that all flags  
will be cleared when the register is read. If the INT pin  
is programmed for Level mode, then the condition will  
clear and the INT pin will return to its inactive state. If  
the pin is programmed for Pulse mode, then reading  
the flag also will clear the flag and the pin. The pulse  
will not complete its specified duration if the  
Flags/Control register is read. If the INT pin is used as  
a host reset, then the Flags/Control register should  
not be read during a reset.  
Once an interrupt source is active, the pin driver  
determines the behavior of the output. It has two  
programmable settings as shown below. Pin driver  
control bits are located in the Interrupts register.  
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During a power-on reset with no battery, the interrupt  
register is automatically loaded with the value 24h.  
This causes power-fail interrupt to be enabled with an  
active-low pulse.  
RTC Register Map  
BCD Format Data  
Register  
Function / Range  
Years: 00-99  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
0x1FFFF  
0x1FFFE  
10s Years  
Years  
10s  
Months  
0
0
0
0
Months  
Months: 01-12  
10s Day of  
Month  
0x1FFFD  
0
Day of Month  
Day of Month: 01-31  
0x1FFFC  
0x1FFFB  
0x1FFFA  
0x1FFF9  
0
0
0
0
0
0
0
0
Day of Week  
Day of week: 01-07  
Hours: 00-23  
Minutes: 00-59  
Seconds: 00-59  
10s Hours  
10s Minutes  
10s Seconds  
Cal  
Hours  
Minutes  
Seconds  
0x1FFF8  
0x1FFF7  
0x1FFF6  
0x1FFF5  
OSCEN  
WDS  
WIE  
0
Calibration  
WDT  
H/L  
Calibration values*  
Watchdog*  
Sign  
WDW  
AIE  
0
PFE  
ABE  
P/L  
0
0
Interrupts*  
10s Alarm  
Date  
Alarm, Day of Month:  
01-31  
M
Alarm Day  
10s Alarm  
Hours  
0x1FFF4  
0x1FFF3  
0x1FFF2  
M
M
M
0
Alarm Hours  
Alarm, hours: 00-23  
Alarm, minutes: 00-59  
Alarm, seconds: 00-59  
10 Alarm Minutes  
Alarm Minutes  
10 Alarm Seconds  
10s Centuries  
Alarm Seconds  
Centuries  
0x1FFF1  
0x1FFF0  
Centuries: 00-99  
Flags*  
WDF  
AF  
PF  
OSCF  
0
CAL  
W
R
* - Is a binary value, not a BCD value.  
0 - Not implemented, reserved for future use.  
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Register Map Detail  
Timekeeping – Years  
D4 D3  
0x1FFFF  
D7  
D6  
D5  
D2  
D1  
Years  
D0  
10s Years  
Contains the lower two BCD digits of the year. Lower nibble contains the value for years; upper  
nibble contains the value for 10s of years. Each nibble operates from 0 to 9. The range for the  
register is 0-99.  
Timekeeping – Months  
0x1FFFE  
0x1FFFD  
0x1FFFC  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
0
0
0
10s Month  
Months  
Contains the BCD digits of the month. Lower nibble contains the lower digit and operates from 0 to  
9; upper nibble (one bit) contains the upper digit and operates from 0 to 1. The range for the  
register is 1-12.  
Timekeeping – Date  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
0
0
10s Day of month  
Day of month  
Contains the BCD digits for the date of the month. Lower nibble contains the lower digit and  
operates from 0 to 9; upper nibble contains the upper digit and operates from 0 to 3. The range for  
the register is 1-31. Leap years are automatically adjusted for.  
Timekeeping – Day  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
0
0
0
0
0
Day of week  
Lower nibble contains a value that correlates to day of the week. Day of the week is a ring counter  
that counts from 1 to 7 then returns to 1. The user must assign meaning to the day value, as the  
day is not integrated with the date.  
Timekeeping – Hours  
0x1FFFB  
0x1FFFA  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
12/24  
0
10s Hours  
Hours  
Contains the BCD value of hours in 24 hour format. Lower nibble contains the lower digit and  
operates from 0 to 9; upper nibble (two bits) contains the upper digit and operates from 0 to 2. The  
range for the register is 0-23.  
Timekeeping – Minutes  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
0
10s Minutes  
Minutes  
Contains the BCD value of minutes. Lower nibble contains the lower digit and operates from 0 to 9;  
upper nibble contains the upper minutes digit and operates from 0 to 5. The range for the register  
is 0-59.  
Timekeeping – Seconds  
0x1FFF9  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
0
10s Seconds  
Seconds  
Contains the BCD value of seconds. Lower nibble contains the lower digit and operates from 0 to  
9; upper nibble contains the upper digit and operates from 0 to 5. The range for the register is 0-  
59.  
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STK18TA8  
Calibration / Control  
D4 D3  
0x1FFF8  
D7  
D6  
D5  
D2  
D1  
D0  
Calibration  
Sign  
OSCEN  
0
Calibration  
Oscillator Enable. When set to 1, the oscillator is halted. When set to 0, the oscillator runs.  
Disabling the oscillator saves battery/capacitor power during storage. On a no-battery power-up,  
this bit is set to 0.  
OSCEN  
Calibration  
Sign  
Determines if the calibration adjustment is applied as an addition to or as a subtraction from the  
time-base.  
These five bits control the calibration of the clock.  
Calibration  
Watchdog Timer  
0x1FFF7  
D7  
D6  
D5  
D4  
D3  
D2  
WDT  
D1  
D0  
WDS  
WDW  
Watchdog Strobe. Setting this bit to 1 reloads and restarts the watchdog timer. Setting the bit to 0  
has no affect. The bit is cleared automatically once the watchdog timer is reset. The WDS bit is  
write only. Reading it always will return a 0.  
WDS  
Watchdog Write Enable. Setting this bit to 1 masks the watchdog time-out value (WDT5-WDT0) so  
it cannot be written. This allows the user to strobe the watchdog without disturbing the time-out  
value. Setting this bit to 0 allows bits 5-0 to be written on the next write to the Watchdog register.  
The new value will be loaded on the next internal watchdog clock after the write cycle is complete.  
This function is explained in more detail in the watchdog timer section.  
WDW  
Watchdog time-out selection. The watchdog timer interval is selected by the 6-bit value in this  
register. It represents a multiplier of the 32 Hz count (31.25 ms). The minimum range or time-out  
value is 31.25 ms (a setting of 1) and the maximum time-out is 2 seconds (setting of 3Fh). Setting  
the watchdog timer register to 0 disables the timer. These bits can be written only if the WDW bit  
was cleared to 0 on a previous cycle.  
WDT  
Interrupt Status / Control  
0x1FFF6  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
WIE  
AIE  
PFIE  
ABE  
H/L  
P/L  
0
0
Watchdog Interrupt Enable. When set to 1 and a watchdog time-out occurs, the watchdog timer  
drives the INT pin as well as the WDF flag. When set to 0, the watchdog time-out affects only the  
WDF flag.  
WIE  
Alarm Interrupt Enable. When set to 1, the alarm match drives the INT pin as well as the AF flag.  
When set to 0, the alarm match only affects the AF flag.  
Power-Fail Enable. When set to 1, the alarm match drives the INT pin as well as the AF flag. When  
set to 0, the power-fail monitor affects only the PF flag.  
AIE  
PFIE  
ABE  
H/L  
Alarm Battery-backup Enable. When set to 1, the alarm interrupt (as controlled by AIE) will function  
even in battery backup mode. When set to 0, the alarm will occur only when Vcc>Vswitch  
.
High/Low. When set to a 1, the INT pin is driven active high. When set to 0, the INT pin is open  
drain, active low.  
Pulse/Level. When set to a 1, the INT pin is driven active (determined by H/L ) by an interrupt  
source for approximately 200 ms. When set to a 0, the INT pin is driven to an active level (as set  
by H/L ) until the Flags/Control register is read.  
P/L  
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STK18TA8  
Alarm – Day  
D3  
0x1FFF5  
D7  
D6  
D5  
D4  
D2  
D1  
D0  
M
0
10s Alarm Date  
Alarm Date  
Contains the alarm value for the date of the month and the mask bit to select or deselect the date  
value.  
Match. Setting this bit to 0 causes the date value to be used in the alarm match. Setting this bit to 1  
causes the match circuit to ignore the date value.  
M
Alarm – Hours  
0x1FFF4  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
M
0
10s Alarm Hours  
Alarm Hours  
Contains the alarm value for the hours and the mask bit to select or deselect the hours value.  
Match. Setting this bit to 0 causes the hours value to be used in the alarm match. Setting this bit to  
1 causes the match circuit to ignore the hours value.  
M
Alarm – Minutes  
0x1FFF3  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
M
10s Alarm Minutes  
Alarm Minutes  
Contains the alarm value for the minutes and the mask bit to select or deselect the minutes value.  
Match. Setting this bit to 0 causes the minutes value to be used in the alarm match. Setting this bit  
to 1 causes the match circuit to ignore the minutes value.  
M
Alarm – Seconds  
0x1FFF2  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
M
10s Alarm Seconds  
Alarm Seconds  
Contains the alarm value for the seconds and the mask bit to select or deselect the seconds’  
value.  
Match. Setting this bit to 0 causes the seconds’ value to be used in the alarm match. Setting this  
bit to 1 causes the match circuit to ignore the seconds value.  
M
Timekeeping – Centuries  
0x1FFF1  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
0
0
10s Centuries  
Centuries  
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STK18TA8  
Flags  
D3  
0x1FFF0  
D7  
D6  
D5  
D4  
D2  
D1  
D0  
WDF  
AF  
PF  
OSCF  
0
CAL  
W
R
Watchdog Timer Flag. This read-only bit is set to 1 when the watchdog timer is allowed to reach 0  
without being reset by the user. It is cleared to 0 when the Flags/Control register is read.  
Alarm Flag. This read-only bit is set to 1 when the time and date match the values stored in the  
alarm registers with the match bits = 0. It is cleared when the Flags/Control register is read.  
Power-fail Flag. This read-only bit is set to 1 when power falls below the power-fail threshold  
Vswitch. It is cleared to 0 when the Flags/Control register is read.  
WDF  
AF  
PF  
Oscillator Fail Flag. Set to 1 on power-up only if the oscillator is not running in the first 5ms of  
power-on operation. This indicates that time counts are no longer valid. The user must reset this  
bit to 0 to clear this condition. The chip will not clear this flag. This bit survives power cycles.  
Calibration Mode. When set to 1, a 512Hz square wave is output on the INT pin. When set to 0,  
the INT pin resumes normal operation. This bit defaults to 0 (disabled) on power up.  
Write Time. Setting the W bit to 1 freeze updates of the timekeeping registers. The user can then  
write them with updated values. Setting the W bit to 0 causes the contents of the time registers to  
be transferred to the timekeeping counters.  
OSCF  
CAL  
W
Read Time. Setting the R bit to 1 copies a static image of the timekeeping registers and places  
them in a holding register. The user can then read them without concerns over changing values  
causing system errors. The R bit going from 0 to 1 causes the timekeeping capture, so the bit must  
be returned to 0 prior to reading again.  
R
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STK18TA8  
ORDERING INFORMATION  
STK18TA8 – R F 40 I  
Temperature Range  
Blank = Commercial (0 to 70º C)  
I = Industrial (-40 to 85ºC)  
Maximum Clock Frequency  
40 = 40 MHz  
Lead Finish  
Blank = 85% Sn / 15% Pb  
F = 100% Sn (Matte Tin) ROHS Compliant  
Package  
R = Plastic 48-pin 300 mil SSOP (25 mil pitch)  
April 2005  
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Document Control #ML0028 rev 0.8  
STK18TA8  
Document Revision History  
Revision  
Date  
Summary  
Publish new datasheet  
0.0  
June 2003  
Revised Feature Set  
0.4  
November 2004  
Changed SI hold time tH from 0 to 5 ns.  
0.5  
January 2005  
Changed tV, SCK to Data Valid from 5ns to 7ns.  
Changed tSU, SI hold time from 5ns to 3ns.  
0.6  
January 2005  
Added HOLD signal to SPI interface.  
Removed RDSR Command.  
0.7  
0.8  
January 2005  
April 2005  
Changed RTC register unused bits “X” to require zero “0” value when writing values.  
SIMTEK STK18TA8 Data Sheet, April 2005  
Copyright 2005, Simtek Corporation. All rights reserved.  
This datasheet may only be printed for the express use of Simtek Customers. No part of this datasheet may be reproduced in any other form or  
means without express written permission from Simtek Corporation. The information contained in this publication is believed to be accurate, but  
changes may be made without notice. Simtek does not assume responsibility for, or grant or imply any warranty, including MERCHANTABILITY  
or FITNESS FOR A PARTICULAR PURPOSE regarding this information, the product or its use. Nothing herein constitutes a license, grant or  
transfer of any rights to any Simtek patent, copyright, trademark or other proprietary right.  
April 2005  
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