8503003YA [SIPEX]
Three Terminal Voltage Reference, 1 Output, 10V, Trim/Adjustable, Hybrid, DIP-14;型号: | 8503003YA |
厂家: | SIPEX CORPORATION |
描述: | Three Terminal Voltage Reference, 1 Output, 10V, Trim/Adjustable, Hybrid, DIP-14 输出元件 |
文件: | 总14页 (文件大小:92K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
REVISIONS
LTR
A
DESCRIPTION
DATE (YR-MO-DA)
86-12-31
APPROVED
N. A. Hauck
Change to Military drawing format. Page 8 table I; change group A
subgroup for +VR and -VR; add end-point electrical limits for +VRINT
and -VRINT. Page 10: Change output offset adjust and temperature
effect for device types 03 and 04 trim circuits.
B
C
Add device types 05 and 06. Inactivate case outline X. Add case
outlines C, Y, and 3. Add vendors CAGE 33256 and 34707. Change
drawing CAGE code to 67268. Editorial changes throughout.
89-08-01
92-12-22
W. Heckman
Changed to reflect MIL-H-38534 processing. Update document.
Editorial changes throughout.
K. A. Cottongim
D
E
F
Changes in accordance with NOR 5962-R212-93.
Changes in accordance with NOR 5962-R045-94.
Changes to table I, note 1.
93-08-17
93-11-18
99-01-08
05-01-10
K. A. Cottongim
K. A. Cottongim
K. A. Cottongim
Raymond Monnin
G
Corrections to sheet 1, figure 1- case outlines X and Y, and figure 3.
Update drawing boilerplate.
H
Figure 1, case outline Y, correct the row to row spacing symbol from
L1 to E1.
07-01-26
Joseph Rodenbeck
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
CURRENT CAGE CODE 67268
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
REV
H
1
H
2
H
3
H
4
H
5
H
6
H
7
H
8
H
9
H
H
H
SHEET
10
11
12
PMIC N/A
PREPARED BY
Donald R. Osborne
DEFENSE SUPPLY CENTER COLUMBUS
POST OFFICE BOX 3990
STANDARD
MICROCIRCUIT
DRAWING
CHECKED BY
D. A. Di Cenzo
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
APPROVED BY
N. A. Hauck
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
MICROCIRCUIT, HYBRID, LINEAR,
PRECISION VOLTAGE REFERENCES,
THIN FILM
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DRAWING APPROVAL DATE
86-04-28
AMSC N/A
REVISION LEVEL
H
SIZE
A
CAGE CODE
85030
14933
SHEET
1 OF 12
DSCC FORM 2233
APR 97
5962-E045-07
1. SCOPE
1.1 Scope. This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with
MIL-PRF-38534 and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying
Number (PIN).
1.2 PIN. The PIN shall be as shown in the following example:
85030
01
X
X
⎮
⎮
⎮
⎮
⎮
⎮
⎮
⎮
⎮
⎮
⎮
⎮
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type
Generic number
Circuit function
01, 02
03, 04
05, 06
2700
2702
2701
Precision +10.000-volt reference
Precision ±10.000-volt reference
Precision -10.000-volt reference
1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
C
X
Y
3
GDIP1-T14, CDIP1-T14
See figure 1
14
14
14
28
Dual-in-line
Dual-in-line
Dual-in-line
Square leadless chip-carrier
See figure 1
CQCC1-N28
1.2.3 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 1/
Supply voltage (VS):
V
V
CC (device types 01, 02, 03, 04).............................................
EE (device types 03, 04, 05, 06).............................................
+20 V dc
-20 V dc
Power dissipation (PD), TA = +25°C:
Device types 01, 02, 05, 06 .....................................................
Device types 03, 04 .................................................................
Storage temperature range .........................................................
Lead temperature (soldering, 10 seconds)..................................
Short circuit protection (to GND) .................................................
Thermal resistance:
300 mW
450 mW
-65°C to +150°C
+300°C
Continuous
Junction-to-case (θJC):
Case outlines C and 3..........................................................
Case outline X......................................................................
Case outline Y......................................................................
Junction-to-ambient (θJA):
See MIL-STD-1835
7°C/W
8°C/W
Case outline X......................................................................
Case outline Y......................................................................
30°C/W
25°C/W
1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
SIZE
STANDARD
MICROCIRCUIT DRAWING
85030
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
H
2
DSCC FORM 2234
APR 97
1.4 Recommended operating conditions.
Supply voltage range (VCC)..........................................................
Supply voltage (VEE)....................................................................
Output current .............................................................................
Ambient operating temperature range (TA)..................................
+13.5 V dc to +16.5 V dc
-13.5 V dc to -16.5 V dc
5 mA 1/
-55°C to +125°C
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil
or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device class H shall be in accordance with MIL-
PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device
manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may
eliminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-
38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or
function of the device for the applicable device class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38534 and herein.
1/ With resistive load to pin 7 (common).
SIZE
STANDARD
MICROCIRCUIT DRAWING
85030
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
H
3
DSCC FORM 2234
APR 97
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Trim circuits. The trim circuits shall be as specified on figure 3.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with
the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,
for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those
which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be
made available to the preparing activity (DSCC-VA) upon request.
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets
the performance requirements of MIL-PRF-38534 and herein.
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form,
fit, or function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply:
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit
shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified
in method 1015 of MIL-STD-883.
(2) TA as specified in accordance with table I of method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
SIZE
STANDARD
MICROCIRCUIT DRAWING
85030
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
H
4
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Test
Symbol
+VR
Conditions 1/
Group A
Device
type
Limits
Unit
-55°C ≤ TA ≤ +125°C
unless otherwise specified
subgroups
Min
-5.0
Max
+5.0 mV
Selection output error 2/
+10.000 V output
+10.000 V output
+10.000 V output
-10.000 V output
-10.000 V output
4
5,6
4
01
-8.0
-2.5
-5.5
-5.0
+8.0
02,04
03
+2.5 mV
+5.5
5,6
4
+5.0 mV
5,6
4
-10
+5.0
+10
+10
-5.0
-10
-2.5
-VR
03,05
04,06
mV
mV
mV
mV
5,6
4
+2.5
+5.5
-5
5,6
1
-5.5
+5
Interim output error
+VRINT
+10.000 V output Initial
TA = +25°C
01,02,
03,04
End-point
-10
+10
-VRINT
-10.000 V output Initial
TA = +25°C
1
03,04,
05,06
+5
-5
-10
+20
End-point
+10
-20
Output adjust range for trim
circuits (see figure 3)
+VRADJ
-VRADJ
ICC
+10.000 V output, TA = +25°C
1
1
1
1
01,02,
03,04
mV
mV
mA
mA
-10.000 V output, TA = +25°C
03,04,
05,06
+20
-20
+14
+17
Quiescent current
VCC = +15 V, no load
TA = +25°C
01,02
V
V
CC = +15 V,
03,04
EE = -15 V, no load
TA = +25°C
IEE
VCC = +15 V, no load
VEE = -15 V
1
1
03,04
05,06
-4
mA
mA
TA = +25°C
V
CC = +15 V,
-14
VEE = -15 V, no load
TA = +25°C
See footnotes at end of table.
SIZE
STANDARD
MICROCIRCUIT DRAWING
85030
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
H
5
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
Limits
Unit
Min
Max
Line regulation
+VRL
-VRL
+10.000 V output, TA = +25°C,
+13.5 V ≤ VCC ≤ +16.5 V
1
1
1
1
01,02,
03,04
-900
+900
-900
+500
-500
µV
-10.000 V output, TA = +25°C,
-13.5 V ≤ VEE ≤ -16.5 V
03,04,
05,06
+900
-500
+500
µV
µV
µV
mA
Load regulation
Output current
+VRLOAD +10.000 V output, TA = +25°C,
0 ≤ IL ≤ 10 mA
01,02,
03,04
-VRLOAD
-10.000 V output, TA = +25°C,
0 ≤ IL ≤ 10 mA
03,04,
05,06
+IL
1
2,3
1
01,02,
03,04
10
5
-IL
03,04,
05,06
10
5
mA
2,3
4
Output noise 3/
VOUT = 10 V, no load,
0.1 Hz ≤ BW ≤ 10 Hz,
TA = +25°C
01,02,
03,04,
05,06
150
µV/p-p
1/ Unless otherwise specified, VIN = +15 V, RL = 2 kΩ to pin 7 (common).
2/ Output voltage change as a function of temperature is determined using the box method. Each device is tested at -55°C,
+25°C, and +125°C. At each temperature the output voltage (VOUT) must fall within the rectangular area bounded by the
minimum and maximum temperatures. This method gives a maximum temperature coefficient of 9 ppm/°C and a typical
value of 3 ppm/°C.
3/ Parameter shall be tested as part of device initial characterization and after design and process changes. Parameter shall
be guaranteed to the limits specified in table I for all lots not specifically tested.
SIZE
STANDARD
MICROCIRCUIT DRAWING
85030
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
H
6
DSCC FORM 2234
APR 97
Case outline X.
Symbol
Inches
Millimeters
Notes
Min
.215
.175
.016
.860
.490
.295
Max
.250
.215
.020
.885
.520
.305
Max
5.46
4.44
Min
6.35
5.46
A
A1
∅b
D
E
E1
e
0.41
0.51
7
3
3
6
4
21.84
12.45
7.49
22.48
13.21
7.75
.100 BSC
2.54 BSC
L
.130
.255
.290
.035
.160
.180
15°
3.30
3.81
0.51
2.54
2.03
0°
6.48
7.37
0.89
4.07
4.57
15°
L1
Q
S
S1
α
.150
.020
.100
.080
0°
2
5
NOTES:
1. Index area: A notch, square-package corner, or a pin one index point shall be located adjacent to pin one and
within the shaded area shown. The manufacturer's identification shall not be used as a pin one identification mark.
2. Dimension Q shall be measured from the seating plane to the base plane.
3. This dimension allows for off-center lid, meniscus, and weld squash.
4. The basic pin spacing is .100 inch (2.54 mm) between centerlines. Each pin centerline shall be located within
±.010 inch (0.25 mm) of its exact longitudinal position relative to pins 1 and 14.
5. Dimension S1 is not used.
6. Lead center when α = 00. E1 shall be measured at the centerline of the leads (see MIL-STD-1835).
7. All leads: Increase maximum limit by .003 inch (0.08 mm) measured at the widest diameter when lead finish A or B
is applied.
8. If this configuration is used, no polymer or organic materials shall be applied or molded to the bottom of the
package or cover the leads.
FIGURE 1. Case outline(s).
SIZE
STANDARD
MICROCIRCUIT DRAWING
85030
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
H
7
DSCC FORM 2234
APR 97
Case outline Y.
Symbol
Inches
Millimeters
Max
3.56
0.36
0.76
0.20
19.56
12.19
7.49
Notes
2
Min
.140
.014
.030
.008
.770
.480
.295
Max
.200
.023
.070
.015
.810
.510
.305
Min
5.08
0.58
1.78
0.38
20.57
12.95
7.75
A
b
b1
c
D
E
E1
e
6
4
.100 BSC
2.54 BSC
L
.150
.200
---
.035
.137
---
3.81
4.57
0.38
---
5.08
---
0.89
3.48
---
L1
Q
S
.180
.015
---
3
5
5
S1
.060
1.52
NOTES:
1. Index area: A notch or a one identification mark is located adjacent to lead one.
2. The minimum dimension for b1 may be .023 inch (0.58 mm) for all four corner leads only.
3. Dimension Q shall be measured from the seating plane to the base plane.
4. The basic pin spacing is .100 inch (2.54 mm) between centerlines.
5. Applies to all four corners
6. E1 shall be measured at the centerline of the leads.
FIGURE 1. Case outline(s) - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
85030
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
H
8
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
Device types
Case outlines
Device types 01 and 02
(2700)
Device types 03 and 04
(2702)
Device types 05 and 06
(2701)
C, X, Y
3
C, X, Y
3
C, X, Y
3
Terminal
number
Terminal symbol
Terminal symbol
Terminal symbol
1
2
3
4
NC
NC
NC
NC
NC
VO SEN
-IN
REF GND
GND SEN
-10 V ADJ
-10 V OUT
-10 V ADJ
VEE
VO SEN
NC
NC
NC
NC
NC
NC
-IN
REF GND
GND SEN
NC
NC
REF GND
GND SENSE
NC
5
NC
NC
6
NC
NC
NC
NC
NC
NC
7
GND
NC
GND
-VOS
GND
-VOS
8
NC
NC
NC
-VOS
NC
-VOS
9
NC
NC
NC
VEE
NC
VEE
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
TEST POINT
VCC
+10 V ADJ
+10 V OUT
+10 V ADJ
NC
NC
NC
NC
NC
NC
NC
NC
TEST POINT
VCC
+10 V ADJ
+10 V OUT
+10 V ADJ
+IN
VCC
NC
-IN
TEST POINT
VEE
-10 V ADJ
-10 V OUT
-10 V ADJ
+IN
NC
PWR GND
-IN
VO FORCE
VO SENSE
VO SENSE
NC
VO FORCE
-10 V REF OUT
VO SENSE
+10 V IN
VZ
VZ
ZENER GND
NC
VZ
ZENER GND
NC
ZENER GND
NC
NC
VOS
VOS
NC
VOS
VOS
NC
NC
NC
NC
NC
NC
NC
NC
POWER GND
VCC
POWER GND
VCC
+IN
+IN
VO FORCE
+10 V REF OUT
VO FORCE
+10 V REF OUT
FIGURE 2. Terminal connections.
SIZE
STANDARD
MICROCIRCUIT DRAWING
85030
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
H
9
DSCC FORM 2234
APR 97
Device types 01 and 02.
Device types 03 and 04.
Device types 05 and 06.
NOTES:
1. External 10 kΩ potentiometer provides a ±20 mV minimum output offset adjust. Temperature effect is 4 µV/°C per
mV of offset correction (external adjustment optional).
2. Dual-in-line package only.
FIGURE 3. Trim circuit(s).
SIZE
STANDARD
MICROCIRCUIT DRAWING
85030
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
H
10
DSCC FORM 2234
APR 97
TABLE II. Electrical test requirements.
MIL-PRF-38534 test requirements
Subgroups
(in accordance with
MIL-PRF-38534, group
A test table)
Interim electrical parameters
Final electrical parameters
Group A test requirements
---
1*, 2, 3, 4
1, 2, 3, 4, 5, 6
1
Group C end-point electrical
parameters
* PDA applies to subgroup 1.
4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance
with MIL-PRF-38534 and as specified herein.
4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows:
a. Tests shall be as specified in table II herein.
b. Subgroups 7, 8, 9, 10, and 11 shall be omitted.
4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534.
4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows:
a. End-point electrical parameters shall be as specified in table II herein.
b. Steady-state life test, method 1005 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit
shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified
in method 1005 of MIL-STD-883.
(2) TA as specified in accordance with table I of method 1005 of MIL-STD-883.
(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534.
SIZE
STANDARD
MICROCIRCUIT DRAWING
85030
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
H
11
DSCC FORM 2234
APR 97
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a
contractor-prepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished in accordance with MIL-PRF-38534.
6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system
application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used
for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962)
should contact DSCC-VA, telephone (614) 692-0544.
6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Post Office Box 3990, Columbus, Ohio 43218-
3990, or telephone (614) 692-1081.
6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK-103
and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DSCC-VA and have agreed to this drawing.
SIZE
STANDARD
MICROCIRCUIT DRAWING
85030
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
H
12
DSCC FORM 2234
APR 97
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 07-01-26
Approved sources of supply for SMD 85030 are listed below for immediate acquisition information only and shall be
added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be revised
to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate
of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next
dated revisions of MIL-HDBK-103 and QML-38534. DSCC maintains an online database of all current sources of
supply at http://www.dscc.dla.mil/Programs/Smcr/.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
8503001CX
8503001XX
8503001YX
8503001YA
85030013A
8503001YA
3/
3/
3/
27851
27851
34031
HS2700SD
2700SD/883B
HS2700SD
HC2700SD/883B
HC2700SLCC/883B
AD2700SD/883B
8503002CX
8503002XX
8503002YX
8503002YA
85030023A
8503002YA
3/
3/
3/
27851
27851
34031
HS2700UD
2700UD/883B
HS2700UD
HC2700UD/883B
HC2700ULCC/883B
AD2700UD/883B
8503003CX
8503003XX
8503003YX
8503003YA
85030033A
8503003YA
3/
3/
3/
27851
27851
34031
HS2702SD
2702SD/883B
HS2702SD
HC2702SD/883B
HC2702SLCC/883B
AD2702SD/883B
8503004CX
8503004XX
8503004YX
8503004YA
85030043A
8503004YA
8503004YC
3/
3/
3/
27851
27851
34031
3/
HS2702UD
2702UD/883B
HS2702UD
HC2702UD/883B
HC2702ULCC/883B
AD2702UD/883B
AD2702UD/883B
1/ The lead finish shown for each PIN, representing a hermetic package, is the most readily available from the
manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to determine
availability.
2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the
performance requirements of this drawing.
3/ Not available from an approved source.
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STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued.
DATE: 07-01-26
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
8503005CX
8503005XX
8503005YX
8503005YA
85030053A
8503005YA
3/
3/
3/
27851
27851
3/
HS2701SD
2701SD/883B
HS2701SD
HC2701SD/883B
HC2701SLCC/883B
AD2701SD/883B
8503006CX
8503006XX
8503006YX
8503006YA
85030063A
8503006YC
3/
3/
3/
27851
27851
3/
HS2701UD
2701UD/883B
HS2701UD
HC2701UD/883B
HC2701ULCC/883B
AD2701UD/883B
1/ The lead finish shown for each PIN, representing a hermetic package, is the most readily available from the
manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to determine
availability.
2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the
performance requirements of this drawing.
3/ Not available from an approved source.
Vendor CAGE
number
Vendor name
and address
27851
Satcon Electronics
165 Cedar Hill Street
Marlborough, MA 01752
34031
Analog Devices
7910 Triad Center Drive
Greensboro, NC 27409-9605
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
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