SP3222EUCA-L/TR [SIPEX]

Line Transceiver, 2 Func, 2 Driver, 2 Rcvr, CMOS, PDSO20, LEAD FREE, PLASTIC, SSOP-20;


型号：	SP3222EUCA-L/TR
厂家：	SIPEX CORPORATION
描述：	Line Transceiver, 2 Func, 2 Driver, 2 Rcvr, CMOS, PDSO20, LEAD FREE, PLASTIC, SSOP-20 光电二极管
文件：	总20页 (文件大小：285K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SP3222EU/3232EU

3.3V, 1000 Kbps RS-232Transceivers

FEATURES

SHDN

■ Meets true EIA/TIA-232-F Standards

from a +3.0V to +5.5V power supply

■ Interoperable with EIA/TIA - 232 and

adheres to EIA/TIA - 562 down to a +2.7V

power source

VCC

C1+

V+

GND

C1-

T1OUT

R1IN

SP3222EU

C2+

C2-

V-

■ 1µA Low-Power Shutdown with Receivers

Active (SP3222EU)

R1OUT

T1IN

■ Enhanced ESD Specifications:

±15kV Human Body Model

T2OUT

R2IN

T2IN

R2OUT

±15kV IEC1000-4-2 Air Discharge

±8kV IEC1000-4-2 Contact Discharge

■ 1000 kbps Minimum Transmission Rate

■ Ideal for Handheld, Battery Operated

Applications

DIP/SO

Now Available in Lead Free Packaging

DESCRIPTION

The SP3222EU and the SP3232EU are 2 driver, 2 receiver RS-232 transceiver solutions

intended for portable or hand-held applications such as notebook or palmtop computers.

Their data transmission rate of 1000 kbps meets the demands of high speed RS-232

applications. Both ICs have a high-efficiency, charge-pump power supply that requires only

0.1µFcapacitorsin3.3Voperation. ThischargepumpallowstheSP3222EUandthe3232EU

to deliver true RS-232 performance from a single power supply ranging from +3.0V to +5.5V.

The ESD tolerance of the SP3222EU/3232EU devices are over ±15kV for both Human Body

Model and IEC1000-4-2 Air discharge test methods.

The SP3222EU device has a low-power shutdown mode where the devices' driver outputs

and charge pumps are disabled. During shutdown, the supply current falls to less than 1uA.

SELECTION TABLE

RS-232

Drivers

RS-232

External

TTL

No. of

Pins

MODEL

Power Supplies

Shutdown

Receivers Components

3-State

+3.0V to +5.5V

Yes

18, 20

SP3222EU

SP3232EU

Date: 02/31/06

SP3222EU, SP3232EU 3.3V, 1000Kbps RS-232 Transceivers

ABSOLUTE MAXIMUM RATINGS

These are stress ratings only and functional

operation of the device at these ratings or any other

above those indicated in the operation sections of

the specifications below is not implied. Exposure to

absolute maximum rating conditions for extended

periods of time may affect reliability and cause

permanent damage to the device.

Output Voltages

TxOUT.......................................................±13.2V

RxOUT............. ..................-0.3V to (V_CC+ 0.3V)

Short-Circuit Duration

TxOUT.................................................Continuous

Storage Temperature.................-65°C to +150°C

Power Dissipation Per Package

V_CC...................................................... -0.3V to +6.0V

V+ (NOTE 1) ...................................... -0.3V to +7.0V

V- (NOTE 1) ....................................... +0.3V to -7.0V

V+ + |V-| (NOTE 1)........................................... +13V

20-pin SSOP (derate 9.25mW/^oC above +70^oC) ........ 750mW

18-pin PDIP (derate 15.2mW/^oC above +70^oC) ....... 1220mW

18-pin SOIC (derate 15.7mW/^oC above +70^oC) ....... 1260mW

20-pin TSSOP (derate 11.1mW/^oC above +70^oC)...... 890mW

16-pin SSOP (derate 9.69mW/^oC above +70^oC) ........ 775mW

16-pin PDIP (derate 14.3mW/^oC above +70^oC) ....... 1150mW

16-pin Wide SOIC (derate 11.2mW/^oC above +70^oC) .... 900mW

16-pin TSSOP (derate 10.5mW/^oC above +70^oC)...... 850mW

16-pin nSOIC (derate 13.57mW/°C above +70°C) ...... 1086mW

I_CC(DC V_CCor GND current)......................... ±100mA

Input Voltages

TxIN, EN SHDN ...................... -0.3V to + VCC +0.3V

RxIN .................................................................. ±25V

NOTE 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.

ELECTRICAL CHARACTERISTICS

Unless otherwise noted, the following specifications apply for V_CC= +3.0V to +5.5V with T_AMB= T_MINto T_MAX, C₁to

C₄=0.1µF

PARAMETER

MIN.

TYP.

MAX. UNITS CONDITIONS

DC CHARACTERISTICS

Supply Current

0.3

1.0

mA no load, T_AMB= +25°C, V_CC= 3.3V,

TxIN = GND or V_CC

Shutdown Supply Current

µA

SHDN = GND,T_AMB= +25°C,

V_CC= +3.3V, TxIN = GND or V_CC

LOGIC INPUTS AND RECEIVER OUTPUTS

Input Logic Threshold LOW

Input Logic Threshold HIGH

GND

0.8

TxIN, EN, SHDN, Note 2

2.0

V_CC= 3.3V, Note2

2.4

V_CC

V_CC= 5.0V, Note 2

Input Leakage Current

±0.01

±0.05

±1.0

µA

TxIN, EN, SHDN, T_AMB= +25°C,

VIN= 0V to V_CC

Output Leakage Current

Output Voltage LOW

Output Voltage HIGH

DRIVER OUTPUTS

Output Voltage Swing

±10

0.4

µA

receivers disabled, V_OUT= 0V to V_CC

I_OUT= 1.6mA

I_OUT= -1.0mA

V_CC-0.6

V_CC-0.1

±5.0

±5.4

3kΩ load to ground at all driver

outputs,T_AMB= +25°C

Output Resistance

300

Ωꢀ V_CC= V+ = V- = 0V, T_OUT= +2V

Output Short-Circuit Current

Output Leakage Current

±35

±60

±25

µA

V_OUT= 0V

V_OUT= +12V,V_CC= 0V to 5.5V,drivers

disabled

Date: 02/31/06

SP3222EU, SP3232EU 3.3V, 1000Kbps RS-232 Transceivers

ELECTRICAL CHARACTERISTICS

Unless otherwise noted, the following specifications apply for V_CC= +3.0V to +5.5V with T_AMB= T_MINto T_MAX, C₁to

C₄=0.1µF. Typical Values apply at V_CC= +3.3V or +5.5V and T_AMB= 25^oC.

PARAMETER

MIN.

TYP. MAX. UNITS

CONDITIONS

RECEIVER INPUTS

Input Voltage Range

Input Threshold LOW

-25

+25

0.6

1.2

1.5

V_CC=3.3V

V_CC=5.0V

0.8

Input Threshold HIGH

1.5

2.4

V_CC=3.3V

1.8

V_CC=5.0V

Input Hysteresis

Input Resistance

0.3

kΩ

TIMING CHARACTERISTICS

Maximum Data Rate

1000

kbps

R_L=3kΩ, C_L=250pF, one driver

switching

Receiver Propagation Delay

0.15

µs

t_PHL, RxIN to RxOUT, C_L=150pF

t_PLH, RxIN to RxOUT, C_L=150pF

Receiver Output Enable Time

Receiver Output Disable Time

Driver Skew

200

100

| t_PHL- t_PLH|, T_AMB= 25°C

| t_PHL- t_PLH|

Receiver Skew

Transition-Region Slew Rate

V/µs

V_CC= 3.3V, R_L= 3KΩ, T_AMB= 25°C,

measurements taken from -3.0V to

+3.0V or +3.0V to -3.0V

NOTE 2: Driver input hysteresis is typically 250mV.

Date: 02/31/06

SP3222EU, SP3232EU 3.3V, 1000Kbps RS-232 Transceivers

TYPICAL PERFORMANCE CHARACTERISTICS

Unless otherwise noted, the following performance characteristics apply for V_CC= +3.3V, 1000kbps data rates, all drivers

loaded with 3kΩ, 0.1µF charge pump capacitors, and T_AMB= +25°C.

120

100

T1 at 1Mbps

T2 at 62.5Kbps

T1 at 1Mbps

T2 at 62.5Kbps

All TX loaded 3K // CLoad

-2

-4

-6

250

500

1000

1500

250

500

1000

1500

2000

Load Capacitance (pF)

Figure 1. Transmitter Output Voltage vs Load

Capacitance for the SP3222EU and the SP3232EU

Figure 2. Slew Rate vs Load Capacitance for the

SP3222EU and the SP3232EU

T1 at Mbps

T2 at 62.5Kbps

T1 at 1Mbps

T2 at 62.5Kbps

250

500

1000

1500

2.7

3.5

4.5

Load Capacitance (pF)

Supply Voltage (V)

Figure 4. Supply Current vs Supply Voltage for the

SP3222EU and the SP3232EU

Figure 3. Supply Current vs Load Capacitance when

Transmitting Data for the SP3222EU and the SP3232EU

200

150

100

T1 at 1Mbps

-2

-4

-6

T2 at 62.5Kbps

T1 at 500Kbps

T2 at 31.2Kbps

All TX loaded 3K // CLoad

250

500

1000

1500

2000

2.7

3.5

4.5

Load Capacitance (pF)

Supply Voltage (V)

Figure 5. Transmitter Output Voltage vs Supply Voltage

for the SP3222EU and the SP3232EU

Figure 6. Transmitter Skew vs Load Capacitance for the

SP3222EU and the SP3232EU

Date: 02/31/06

SP3222EU, SP3232EU 3.3V, 1000Kbps RS-232 Transceivers

PIN NUMBER

SP3222EU

NAME

FUNCTION

SP3232EU

SSOP

DIP/SO

TSSOP

Receiver Enable. Apply logic LOW for normal operation.

Apply logic HIGH to disable the receiver outputs (high-Z state).

C1+

V+

Positive terminal of the voltage doubler charge-pump capacitor.

+5.5V generated by the charge pump.

C1-

C2+

C2-

V-

Negative terminal of the voltage doubler charge-pump capacitor.

Positive terminal of the inverting charge-pump capacitor.

Negative terminal of the inverting charge-pump capacitor.

-5.5V generated by the charge pump.

T1OUT RS-232 driver output.

T2OUT RS-232 driver output.

R1IN

R2IN

RS-232 receiver input.

R1OUT TTL/CMOS reciever output.

R2OUT TTL/CMOS reciever output.

T1IN

T2IN

GND

V_CC

TTL/CMOS driver input.

Ground.

+3.0V to +5.5V supply voltage

Shutdown Control Input. Drive HIGH for normal device operation.

SHDN Drive LOW to shutdown the drivers (high-Z output) and the on-

board power supply.

N.C.

No Connect.

11, 14

Table 1. Device Pin Description

Date: 04/25/06

SP3222EU, SP3232EU 3.3V, 1000Kbps RS-232 Transceivers

SHDN

VCC

C1+

V+

VCC

C1+

V+

GND

C1-

T1OUT

R1IN

C1-

T1OUT

R1IN

SP3222EU

C2+

C2-

V-

SP3222EU

C2+

C2-

V-

R1OUT

N.C.

T1IN

T2OUT

R2IN

T1IN

T2OUT

R2IN

T2IN

12 T2IN

N.C.

R2OUT

DIP/SO

SSOP/TSSOP

Figure 7. Pinout Configurations for the SP3222EU

C1+

V+

GND

C1-

T1OUT

R1IN

SP3232EU

C2+

C2-

R1OUT

T1IN

V-

T2OUT

R2IN

T2IN

R2OUT

Figure 8. Pinout Configuration for the SP3232EU

Date: 04/25/06

SP3222EU, SP3232EU 3.3V, 1000Kbps RS-232 Transceivers

VCC

0.1µF

C1+

V+

V-

C1+

V+

V-

0.1µF

*C3

0.1µF

*C3

C1-

C2+

SP3222EU

C2+

SP3222EU

DIP/SO

SSOP

0.1µF

TSSOP

C2-

T1OUT

T2OUT

13 T1IN

T1OUT

T2OUT

12 T1IN

LOGIC

RS-232

LOGIC

RS-232

INPUTS

T2IN

OUTPUTS

INPUTS

T2IN

OUTPUTS

R1IN

R1OUT

R2OUT

R1IN

R1OUT

R2OUT

5kΩ

RS-232

INPUTS

LOGIC

5kΩ

RS-232

INPUTS

LOGIC

OUTPUTS

R2IN

5kΩ

1 EN

SHDN

GND

*can be returned to

either VCC or GND

*can be returned to

either VCC or GND

Figure 9. SP3222EU Typical Operating Circuits

0.1µF

C1+

V+

V-

0.1µF

*C3

C1-

C2+

SP3232EU

0.1µF

C2-

T1OUT

T2OUT

11 T1IN

LOGIC

RS-232

INPUTS

T2IN

OUTPUTS

R1IN 13

R1OUT

R2OUT

5kΩ

RS-232

INPUTS

LOGIC

OUTPUTS

R2IN

GND

*can be returned to

either VCC or GND

Figure 10. SP3232EU Typical Operating Circuit

Date: 04/25/06

SP3222EU, SP3232EU 3.3V, 1000Kbps RS-232 Transceivers

DESCRIPTION

Figure 11 shows a loopback test circuit used

to the RS-232 drivers. Figure 12 shows the

test results of the loopback circuit with all

drivers active at 250kbps with RS-232 loads in

parallel with 1000pF capacitors. Figure 13

shows the test results where one driver was

active at 1000kbps and all drivers loaded with

an RS-232 receiver in parallel with a 250pF

capacitor.

The SP3222EU and SP3232EU are 2 driver/

2receiver devices ideal for portable or hand-

held applications. The SP3222EU features a

1µA shutdown mode that reduces power

consumption and extends battery life in

portable systems. Its receivers remain active

in shutdown mode, allowing external devices

such as modems to be monitored using only 1

µA supply current.

The SP3222EU driver's output stages are

tristated in shutdown mode. When the power

is off, the SP3222EU device permits the

outputs to be driven up to ±12V. Because the

driver's inputs do not have pull-up resistors,

unused inputs should be connected to V_CCor

GND.

The SP3222EU/3232EU transceivers meet the

EIA/TIA-232 and V.28/V.24 communication

protocols They feature Sipex's proprietary on-

board charge pump circuitry that generates 2 x

V_CCfor RS-232 voltage levels from a single

+3.0V to +5.5V power supply. The

SP3222EU/3232EU drivers operate at a

minimum data rate of 1000kbps.

In the shutdown mode, the supply current is

less than 1µA, where SHDN = LOW. When

the SP3222EU device is shut down, the

device's driver outputs are disabled (tri-stated)

and the charge pumps are turned off with V+

pulled down to V_CCand V- pulled to GND.

The time required to exit shutdown is typically

100µs. Connect SHDN to V_CCif the shutdown

mode is not used.

THEORY OF OPERATION

The SP3222EU/3232EU series are made up of

three basic circuit blocks: 1. Drivers, 2.

Receivers, and 3. the Sipex proprietary

charge pump.

Drivers

Receivers

The drivers are inverting level transmitters that

convert TTL or CMOS logic levels to ±5.0V

EIA/TIA-232 levels inverted relative to the

input logic levels. Typically, the RS-232

output voltage swing is ±5.5V with no load

and at least ±5V minimum fully loaded. The

driver outputs are protected against infinite

short-circuits to ground without degradation in

reliability. Driver outputs will meet EIA/TIA-

562 levels of ±3.7V with supply voltages as

low as 2.7V.

The receivers convert EIA/TIA-232 levels to

TTL or CMOS logic output levels. The

SP3222EU receivers have an inverting tri-state

output. Receiver outputs (RxOUT) are tri-

stated when the enable control EN = HIGH.

In the shutdown mode, the receivers can be

active or inactive. EN has no effect on

TxOUT. The truth table logic of the

SP3222EU driver and receiver outputs can be

found in Table 2.

The drivers have a minimum data rate of

1000kbps fully loaded with 3KΩ in

parallel with 250pF, ensuring compatibility

with PC-to-PC communication software.

Date: 04/25/06

SP3222EU, SP3232EU 3.3V, 1000Kbps RS-232 Transceivers

VCC

0.1µF

C1+

V+

V-

0.1µF

C1-

SP3222EU

SP3232EU

C2+

0.1µF

C2-

TxOUT

TxIN

LOGIC

INPUTS

RxIN

RxOUT

LOGIC

OUTPUTS

5kΩ

*SHDN

VCC

GND

250pF or 1000pF

* SP3222EB only

Figure 11. SP3222EU/3232EU Driver Loopback Test Circuit

Figure 12. Driver Loopback Test All Drivers at 250kbps

Figure 13. Driver Loopback Test One Driver 1Mbps

Date: 04/25/06

SP3222EU, SP3232EU 3.3V, 1000Kbps RS-232 Transceivers

Since receiver input is usually from a trans-

mission line where long cable lengths and

system interference can degrade the signal and

inject noise, the inputs have a typical hyster-

esis margin of 300mV. Should an input be left

unconnected, a 5kΩ pulldown resistor to

ground will commit the output of the receiver

to a HIGH state.

output voltages are less than a magnitude of

5.5V, the charge pumps are enabled. If the

output voltage exceed a magnitude of 5.5V,

the charge pumps are disabled. This oscillator

controls the four phases of the voltage

shifting. A description of each phase follows.

Phase 1

— V_SScharge storage — During this phase of

the clock cycle, the positive side of capacitors

C₁and C₂are initially charged to V_CC. C_l⁺is

then switched to GND and the charge in C₁^–is

Charge Pump

The charge pump is a Sipex–patented design

(5,306,954) and uses a unique approach

compared to older less–efficient designs. The

charge pump still requires four external

capacitors, but uses a four–phase voltage

shifting technique to attain symmetrical 5.5V

power supplies. The internal power supply

consists of a regulated dual charge pump that

provides output voltages 5.5V regardless of

the input voltage (V_CC) over the +3.0V to

+5.5V range.

–

transferred to C₂. Since C₂⁺is connected to

V_CC, the voltage potential across capacitor C₂

is now 2 times V_CC.

Phase 2

— V_SStransfer — Phase two of the clock

connects the negative terminal of C₂to the V_SS

storage capacitor and the positive terminal of

C₂to GND. This transfers a negative gener-

ated voltage to C₃. This generated voltage is

regulated to a minimum voltage of -5.5V.

Simultaneous with the transfer of the voltage

to C₃, the positive side of capacitor C₁is

switched to V_CCand the negative side is

connected to GND.

In most circumstances, decoupling the power

supply can be achieved adequately using a

0.1µF bypass capacitor at C5 (refer to Figures

9 and 10). In applications that are sensitive to

power-supply noise, decouple V_CCto ground

with a capacitor of the same value as charge-

pump capacitor C1. Physically connect

bypass capacitors as close to the IC as

possible.

Phase 3

— V_DDcharge storage — The third phase of

the clock is identical to the first phase — the

charge transferred in C₁produces –V_CCin the

negative terminal of C₁, which is applied to

The charge pumps operate in a discontinuous

mode using an internal oscillator. If the

the negative side of capacitor C₂. Since C₂is

at V_CC, the voltage potential across C₂is 2

times V_CC.

Phase 4

SHDN

TxOUT

Tri-state

Active

RxOUT

Active

— V_DDtransfer — The fourth phase of the

clock connects the negative terminal of C₂to

GND, and transfers this positive generated

voltage across C₂to C₄, the V_DDstorage

capacitor. This voltage is regulated to +5.5V.

At this voltage, the internal oscillator is

disabled. Simultaneous with the transfer of

the voltage to C₄, the positive side of capaci-

tor C₁is switched to V_CCand the negative side

Tri-state

Active

Tri-state

Table 2. SP3222EU Truth Table Logic for Shutdown

and Enable Control

Date: 02/31/06

SP3222EU, SP3232EU 3.3V, 1000Kbps RS-232 Transceivers

is connected to GND, allowing the charge

pump cycle to begin again. The charge pump

cycle will continue as long as the operational

conditions for the internal oscillator are

present.

manufacturing areas where the ICs tend to be

handled

frequently.

The IEC-1000-4-2, formerly IEC801-2, is

generally used for testing ESD on equipment

and systems. For system manufacturers, they

must guarantee a certain amount of ESD

protection since the system itself is exposed to

the outside environment and human presence.

The premise with IEC1000-4-2 is that the

system is required to withstand an amount of

static electricity when ESD is applied to

points and surfaces of the equipment that are

accessible to personnel during normal usage.

The transceiver IC receives most of the ESD

current when the ESD source is applied to the

connector pins. The test circuit for IEC1000-4-2

is shown on Figure 21. There are two

methods within IEC1000-4-2, the Air Dis-

charge method and the Contact Discharge

method.

Since both V⁺and V^–are separately generated

from V_CC; in a no–load condition V⁺and V^–

will be symmetrical. Older charge pump

approaches that generate V^–from V⁺will

show a decrease in the magnitude of V^–

compared to V⁺due to the inherent inefficien-

cies in the design.

The clock rate for the charge pump typically

operates at 250kHz. The external capacitors

can be as low as 0.1µF with a 16V breakdown

voltage rating.

ESD Tolerance

The SP3222EU/3232EU series incorporates

ruggedized ESD cells on all driver output and

receiver input pins. The ESD structure is

improved over our previous family for more

rugged applications and environments

sensitive to electrostatic discharges and

associated

With the Air Discharge Method, an ESD

voltage is applied to the equipment under

test (EUT) through air. This simulates an

electrically charged person ready to connect a

cable onto the rear of the system only to find

an unpleasant zap just before the person

touches the back panel. The high energy

potential on the person discharges through

an arcing path to the rear panel of the system

before he or she even touches the system.

This energy, whether discharged directly or

through air, is predominantly a function of the

discharge current rather than the discharge

voltage.

transients. The improved ESD tolerance is at

least ±15kV without damage nor latch-up.

There are different methods of ESD testing

applied:

a) MIL-STD-883, Method 3015.7

b) IEC1000-4-2 Air-Discharge

c) IEC1000-4-2 Direct Contact

The Human Body Model has been the

generally accepted ESD testing method for

semiconductors. This method is also speci-

fied in MIL-STD-883, Method 3015.7 for

ESD testing. The premise of this ESD test is

to simulate the human body’s potential to

store electrostatic energy and

Variables with an air discharge such as

approach speed of the object carrying the ESD

potential to the system and humidity will tend

to change the discharge current. For example,

the rise time of the discharge current varies

with the approach speed.

discharge it to an integrated circuit. The

simulation is performed by using a test model

as shown in Figure 20. This method will test

the IC’s capability to withstand an ESD

transient during normal handling such as in

The Contact Discharge Method applies the

ESD current directly to the DUT.

Date: 02/31/06

SP3222EU, SP3232EU 3.3V, 1000Kbps RS-232 Transceivers

= +5V

+5V

–

Storage Capacitor

–

–5V

Figure 15. Charge Pump — Phase 1

= +5V

–

Storage Capacitor

–

–10V

Figure 16. Charge Pump — Phase 2

[

]

+6V

a) C²⁺

GND

b) C -

-6V

Ch1 2.00V Ch2 2.00V M 1.00µs Ch1 5.48V

Figure 17. Charge Pump Waveforms

= +5V

+5V

–

Storage Capacitor

–

–5V

Figure 18. Charge Pump — Phase 3

= +5V

+10V

–

Storage Capacitor

–

Figure 19. Charge Pump — Phase 4

Date: 02/31/06

SP3222EU, SP3232EU 3.3V, 1000Kbps RS-232 Transceivers

SW2

SW1

Device

Under

Test

DC Power

Source

Figure 20. ESD Test Circuit for Human Body Model

This method was devised to reduce the

unpredictability of the ESD arc. The dis-

charge current rise time is constant since the

energy is directly transferred without the air-

gap arc. In situations such as hand held

systems, the ESD charge can be directly

discharged to the equipment from a person

already holding the equipment. The current is

transferred on to the keypad or the serial port

of the equipment directly and then travels

through the PCB and finally to the IC.

represent the typical ESD testing circuits used

for all three methods. The C_Sis initially

charged with the DC power supply when the

first switch (SW1) is on. Now that the

capacitor is charged, the second switch (SW2)

is on while SW1 switches off. The voltage

stored in the capacitor is then applied through

R_S, the current limiting resistor, onto the

device under test (DUT). In ESD tests, the

SW2 switch is pulsed so that the device under

test receives a duration of voltage.

The circuit models in Figures 20 and 21

Contact-Discharge Module

SW2

SW1

Device

Under

Test

DC Power

Source

and R add up to 330Ω for IEC1000-4-2.

Figure 21. ESD Test Circuit for IEC1000-4-2

Date: 02/31/06

SP3222EU, SP3232EU 3.3V, 1000Kbps RS-232 Transceivers

For the Human Body Model, the current

limiting resistor (R_S) and the source capacitor

(C_S) are 1.5kΩ an 100pF, respectively. For

IEC-1000-4-2, the current limiting resistor

(R_S) and the source capacitor (C_S) are 330Ωꢀ

an 150pF, respectively.

30A

15A

The higher C_Svalue and lower R_Svalue in

the IEC1000-4-2 model are more stringent

than the Human Body Model. The larger

storage capacitor injects a higher voltage to

the test point when SW2 is switched on. The

lower current limiting resistor increases the

t=0ns

t=30ns

t ➙

current charge onto the test point.

Figure 22. ESD Test Waveform for IEC1000-4-2

Device Pin

Tested

Human Body

Model

IEC1000-4-2

Air Discharge Direct Contact

Level

Driver Outputs

Receiver Inputs

±15kV

±8kV

Table 3. Transceiver ESD Tolerance Levels

Date: 02/31/06

SP3222EU, SP3232EU 3.3V, 1000Kbps RS-232 Transceivers

PACKAGE: PLASTIC SHRINK

SMALL OUTLINE

(SSOP)

DIMENSIONS (Inches)

Minimum/Maximum

(mm)

16–PIN

20–PIN

0.068/0.078

(1.73/1.99)

0.068/0.078

(1.73/1.99)

0.002/0.008

(0.05/0.21)

0.002/0.008

(0.05/0.21)

0.010/0.015

(0.25/0.38)

0.010/0.015

(0.25/0.38)

0.239/0.249

(6.07/6.33)

0.278/0.289

(7.07/7.33)

0.205/0.212

(5.20/5.38)

0.205/0.212

(5.20/5.38)

0.0256 BSC

(0.65 BSC)

0.0256 BSC

(0.65 BSC)

0.301/0.311

(7.65/7.90)

0.301/0.311

(7.65/7.90)

0.022/0.037

(0.55/0.95)

0.022/0.037

(0.55/0.95)

0°/8°

(0°/8°)

Date: 02/31/06

SP3222EU, SP3232EU 3.3V, 1000Kbps RS-232 Transceivers

PACKAGE: PLASTIC

DUAL–IN–LINE

(NARROW)

D1 = 0.005" min.

(0.127 min.)

A1 = 0.015" min.

(0.381min.)

A = 0.210" max.

(5.334 max).

= 0.300 BSC

(7.620 BSC)

e = 0.100 BSC

(2.540 BSC)

ALTERNATE

END PINS

(BOTH ENDS)

DIMENSIONS (Inches)

Minimum/Maximum

(mm)

16–PIN

18–PIN

0.115/0.195

(2.921/4.953)

0.014/0.022

(0.356/0.559)

0.045/0.070

(1.143/1.778)

0.008/0.014

(0.203/0.356)

0.780/0.800

0.880/0.920

(19.812/20.320) (22.352/23.368)

0.300/0.325

(7.620/8.255)

0.240/0.280

(6.096/7.112)

0.115/0.150

(2.921/3.810)

0°/ 15°

(0°/15°)

Date: 02/31/06

SP3222EU, SP3232EU 3.3V, 1000Kbps RS-232 Transceivers

PACKAGE: PLASTIC

SMALL OUTLINE (SOIC)

(WIDE)

DIMENSIONS (Inches)

Minimum/Maximum

(mm)

16–PIN

18–PIN

0.090/0.104

(2.29/2.649)

0.090/0.104

(2.29/2.649))

0.004/0.012

(0.102/0.300) (0.102/0.300)

0.013/0.020

(0.330/0.508) (0.330/0.508)

0.398/0.413 0.447/0.463

(10.10/10.49) (11.35/11.74)

0.291/0.299 0.291/0.299

(7.402/7.600) (7.402/7.600)

0.050 BSC

(1.270 BSC)

0.394/0.419

(10.00/10.64) (10.00/10.64)

0.016/0.050

(0.406/1.270) (0.406/1.270)

0°/8°

(0°/8°)

Date: 02/31/06

SP3222EU, SP3232EU 3.3V, 1000Kbps RS-232 Transceivers

PACKAGE: PLASTIC

SMALL OUTLINE (SOIC)

(NARROW)

h x 45°

DIMENSIONS (Inches)

Minimum/Maximum

(mm)

16–PIN

0.053/0.069

(1.346/1.748)

0.004/0.010

(0.102/0.249)

0.013/0.020

(0.330/0.508)

0.386/0.394

(9.802/10.000)

0.150/0.157

(3.802/3.988)

0.050 BSC

(1.270 BSC)

0.228/0.244

(5.801/6.198)

0.010/0.020

(0.254/0.498)

0.016/0.050

(0.406/1.270)

0°/8°

(0°/8°)

Date: 02/31/06

SP3222EU, SP3232EU 3.3V, 1000Kbps RS-232 Transceivers

PACKAGE: PLASTIC THIN

SMALL OUTLINE

(TSSOP)

DIMENSIONS

in inches (mm) Minimum/Maximum

Symbol

14 Lead

16 Lead 20 Lead 24 Lead

28 Lead

38 Lead

0.193/0.201 0.193/0.201 0.252/0.260 0.303/0.311 0.378/0.386 0.378/0.386

(4.90/5.10) (4.90/5.10) (6.40/6.60) (7.70/7.90) (9.60/9.80) (9.60/9.80)

0.026 BSC 0.026 BSC 0.026 BSC 0.026 BSC 0.026 BSC 0.020 BSC

(0.65 BSC) (0.65 BSC) (0.65 BSC) (0.65 BSC) (0.65 BSC) (0.50 BSC)

0.126 BSC (3.2 BSC)

0.252 BSC (6.4 BSC)

1.0 OIA

0.169 (4.30)

0.177 (4.50)

0.039 (1.0)

0’-8’ 12’REF

e/2

0.039 (1.0)

0.043 (1.10) Max

0.033 (0.85)

0.037 (0.95)

0.007 (0.19)

0.012 (0.30)

0.002 (0.05)

0.006 (0.15)

(θ2)

0.008 (0.20)

0.004 (0.09) Min

Gage

Plane

(θ3)

0.020 (0.50)

0.026 (0.75)

(θ1)

0.010 (0.25)

1.0 REF

Date: 02/31/06

SP3222EU, SP3232EU 3.3V, 1000Kbps RS-232 Transceivers

ORDERING INFORMATION

Temperature Range

Model

Package Type

SP3222EUCA .......................................... 0C to +70C .......................................... 20-Pin SSOP

SP3222EUCA/TR .................................... 0C to +70C .......................................... 20-Pin SSOP

SP3222EUCP .......................................... 0C to +70C ............................................ 18-Pin PDIP

SP3222EUCT .......................................... 0C to +70C ........................................ 18-Pin WSOIC

SP3222EUCT/TR ..................................... 0C to +70C ........................................ 18-Pin WSOIC

SP3222EUCY .......................................... 0C to +70C ........................................ 20-Pin TSSOP

SP3222EUCY/TR .................................... 0C to +70C ........................................ 20-Pin TSSOP

SP3232EUCA .......................................... 0C to +70C .......................................... 16-Pin SSOP

SP3232EUCA/TR .................................... 0C to +70C .......................................... 16-Pin SSOP

SP3232EUCP .......................................... 0C to +70C ............................................ 16-Pin PDIP

SP3232EUCT .......................................... 0C to +70C ........................................ 16-Pin WSOIC

SP3232EUCT/TR ..................................... 0C to +70C ........................................ 16-Pin WSOIC

SP3232EUCY .......................................... 0C to +70C ........................................ 16-Pin TSSOP

SP3232EUCY/TR .................................... 0C to +70C ........................................ 16-Pin TSSOP

SP3232EUCN........................................... 0C to +70C ......................................... 16-Pin nSOIC

SP3232EUCN/TR..................................... 0C to +70C .......................................... 16-Pin nSOIC

SP3222EUEA .......................................... -40°C to +85°C .......................................... 20-Pin SSOP

SP3222EUEA/TR .................................... -40°C to +85°C .......................................... 20-Pin SSOP

SP3222EUEY .......................................... -40°C to +85°C ........................................ 20-Pin TSSOP

SP3222EUEY/TR .................................... -40°C to +85°C ........................................ 20-Pin TSSOP

SP3232EUEA .......................................... -40°C to +85°C .......................................... 16-Pin SSOP

SP3232EUEA/TR .................................... -40°C to +85°C .......................................... 16-Pin SSOP

SP3232EUEY .......................................... -40°C to +85°C ........................................ 16-Pin TSSOP

SP3232EUEY/TR .................................... -40°C to +85°C ........................................ 16-Pin TSSOP

Available in lead free packaging. To order add “-L” suffix to part number.

Example: SP3232EUCN/TR = standard; SP3232EUCN-L/TR = lead free

/TR = Tape and Reel

Pack quantity is 1,500 for SSOP, TSSOP, or WSOIC and 2,500 for NSOIC.

Corporation

ANALOG EXCELLENCE

Sipex Corporation

Headquarters and

Sales Office

233 South Hillview Drive

Milpitas, CA 95035

TEL: (408) 934-7500

FAX: (408) 935-7600

Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the

application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others.

Date: 02/31/06

SP3222EU, SP3232EU 3.3V, 1000Kbps RS-232 Transceivers

SP3222EUCA-L/TR [SIPEX]

相关型号：

SP3222EUCA/TR

SP3222EUCP

SP3222EUCP-L

SP3222EUCP-L

SP3222EUCT

SP3222EUCT-L

SP3222EUCT-L

SP3222EUCT-L/TR

SP3222EUCT/TR

SP3222EUCY

SP3222EUCY-L

SP3222EUCY-L/TR