SP385E-L-1EA-L-L [SIPEX]

Line Transceiver, 2 Func, 2 Driver, 2 Rcvr, CMOS, PDSO20, SSOP-20;


型号：	SP385E-L-1EA-L-L
厂家：	SIPEX CORPORATION
描述：	Line Transceiver, 2 Func, 2 Driver, 2 Rcvr, CMOS, PDSO20, SSOP-20 光电二极管
文件：	总11页 (文件大小：98K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SP385E-1

True +3V or +5V RS-232 Line Driver/Receiver

■ Operates from 3.3V or 5V Power Supply

■ Meets True EIA/TIA-232-F Standards

from a +3.0V to +5.5V Power Supply

■ Meets EIA-562 Specifications at V_CC≥

2.7V

■ Two Drivers and Receivers

■ Operates with 0.1µF Capacitors

■ High Data Rate — 120kbps Under Load

■ Low Power Shutdown ≤1µA

■ 3-State TTL/CMOS Receiver Outputs

■ Low Power CMOS — <1mA Operation

■ Improved ESD Specifications:

+15kV Human Body Model

+15kV IEC1000-4-2 Air Discharge

+8kV IEC1000-4-2 Contact Discharge

DESCRIPTION

The Sipex SP385E-1 is an enhanced version of the Sipex SP200 family of RS232 line

drivers/receivers. The SP385E-1 offers +3.3V operation for EIA-562 and EIA-232 applica-

tions. The SP385E-1 maintains the same performance features offered in its predecessors.

The SP385E-1 is available in plastic SOIC or SSOP packages operating over the commercial

and industrial temperature ranges. The SP385E-1 is pin compatible to the LTC1385 EIA-562

transceiver, except the drivers in the SP385E-1 can only be disabled with the ON/OFF pin.

RS232 OUTPUTS

RS232 INPUTS

Charge

Pumps

TTL/CMOS INPUTS

TTL/CMOS OUTPUTS

Rev. 07/26/02

SP385E-1 True +3V to +5V RS-232 Line Driver/Receiver

Output Voltages

ABSOLUTE MAXIMUM RATINGS

T_OUT^{....................................................................................................}(V+, +0.3V) to (V-, -0.3V)

R_OUT^{................................................................................................................}-0.3V to (Vcc +0.3V)

Short Circuit Duration

T_OUT^{.........................................................................................................................................}Continuous

Power Dissipation

CERDIP .............................................................................. 675mW

(derate 9.5mW/°C above +70°C)

Plastic DIP .......................................................................... 375mW

(derate 7mW/°C above +70°C)

This is a stress rating only and functional operation of the device at

these or any other conditions above those indicated in the operation

sections of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods of time may affect

reliability.

V_cc^{.................................................................................................................................................................}+6V

V^{+ ....................................................................................................................}(Vcc-0.3V) to +13.2V

V^{- ..............................................................................................................................................................}13.2V

Input Voltages

T_IN^{.........................................................................................................................}-0.3 to (Vcc +0.3V)

R_IN^{............................................................................................................................................................}±15V

Small Outline ...................................................................... 375mW

(derate 7mW/°C above +70°C)

SPECIFICATIONS

V_CC= +3.3V ± 10%; cap on (V ) and (V ) = 1.0µF, C1 = C2 = 0.1µF; T_MINto T_MAXunless otherwise noted.

PARAMETERS

MIN.

TYP.

MAX.

UNITS

CONDITIONS

TTL INPUT

Logic Threshold

Low

High

Logic Pullup Current

Maximum Data Rate

0.8

Volts

µA

T_IN; ON/OFF Vcc = 3.3V

T_IN= 0V

2.0

0.01

200

120

kbps

C_L= 2500pF, R_L= 3kΩ

TTL OUTPUT

TTL/CMOS Output

Voltage, Low

Voltage, High

0.4

Volts

µA

_OUT= 1.6mA; Vcc = 3.3V

I_OUT= -1.0mA

ON/OFF=0V 0 ≤ V_OUT≤ V_CC

V_CC-0.6

Leakage Current; T_A= +25°C

0.05

±10

EIA-562 OUTPUT

Output Voltage Swing

±3.7

±4.2

Volts

All transmitter outputs loaded

with 3kΩ to ground

Power-Off Output Resistance

Output Short Circuit Current

300

Ω

_CC= 0V; V_OUT= ±2V

±35

Infinite duration

EIA-562 INPUT

Voltage Range

Voltage Threshold

Low

High

Hysteresis

Resistance

-15

0.6

+15

Volts

1.2

1.5

0.5

Volts

kΩ

V_CC= 3.3V, T_A= +25°C

2.4

1.0

V_CC= 3.3V, T_A= +25°C

V_IN= 15V to –15V

DYNAMIC CHARACTERISTICS

Driver Propagation Delay

Receiver Propagation Delay

Instantaneous Slew Rate

1.0

0.3

µs

V/µs

TTL to RS-562

RS-562 to TTL

C_L= 10pF, R_L= 3kΩ - 7kΩ;

T_A= +25°C

Transition Region Slew Rate

V/µs

C_L= 2500pF, R_L= 3kΩ;

measured from +2V to -2V

or -2V to +2V

Output Enable Time

Output Disable Time

200

POWER REQUIREMENTS

V_CCPower Supply Current

0.5

µA

No load, T_A= +25°C;

V_CC= 3.3V

All transmitters R_L= 3kΩ

T_A= +25°C

Shutdown Supply Current

0.010

V_CC= 3.3V, T_A= +25°C

Rev. 07/26/02

SP385E-1 True +3V to +5V RS-232 Line Driver/Receiver

SPECIFICATIONS

V_CC= +3.3V ± 10%; cap on (V ) and (V ) = 1.0µF, C1 = C2 = 0.1µF; T_MINto T_MAXunless otherwise noted.

PARAMETERS

MIN.

TYP.

MAX.

UNITS

CONDITIONS

TTL INPUT

Logic Threshold

Low

High

Logic Pullup Current

Maximum Data Rate

0.8

Volts

µA

T_IN; ON/OFF

T_IN= 0V

2.4

0.01

200

120

kbps

C_L= 2500pF, R_L= 3kΩ

TTL OUTPUT

TTL/CMOS Output

Voltage, Low

Voltage, High

0.4

Volts

µA

I_OUT= 1.6mA; Vcc = +5V

I_OUT= -1.0mA

EN = V_CC, 0V ≤ V_OUT≤ V_CC

V_CC-0.6

Leakage Current; T_A= +25°C

0.05

±10

EIA-232 OUTPUT

Output Voltage Swing

±5

±9

Volts

All transmitter outputs loaded

with 3kΩ to ground.

V_CC= 0V; V = ±2V

Infinite dura^Oti^Uo^Tn

Power-Off Output Resistance

Output Short Circuit Current

300

Ω

±35

EIA-562 INPUT

Voltage Range

Voltage Threshold

Low

High

Hysteresis

Resistance

-15

0.8

+15

Volts

1.5

1.8

0.5

Volts

kΩ

V_CC= 5V, T = +25°C

V_CC= 5V, T^A= +25°C

V_CC= 5V, T_A^A= +25°C

V_IN= 15V to –15V

2.4

1.0

DYNAMIC CHARACTERISTICS

Propagation Delay, RS-232 to TTL

Instantaneous Slew Rate

µs

V/µs

TTL to RS-562

C_L= 10pF, R_L= 3kΩ - 7kΩ;

T =+25°C

Transition Region Slew Rate

V/µs

C_L^A= 2500pF, R_L= 3kΩ;

measured from +3V to -3V

or -3V to +3V

Output Enable Time

Output Disable Time

200

POWER REQUIREMENTS

V_CCPower Supply Current

0.5

µA

No load,

T_A= +25°C; V_CC= 5V

All transmitters R_L= 3kΩ;

T_A= +25°C

Shutdown Supply Current

V_CC= 5V, T_A= +25°C

PERFORMANCE CURVES

-11

-10

-9

8.4

8.2

8.0

7.8

= 5V

-8

= 5V

= 4V

= 5V

-7

7.6

Load current = 0mA

= 4V

= 25°C

-6

7.4

7.2

= 4V

-5

= 3V

-4

7.0

6.8

-3

10 12 14

10 15 20 25 30 35 40

Load Current (mA)

-55 -40

125

4.5

4.75

5.0

5.25

5.5

Load Current (mA)

Temperature (°C)

(Volts)

Rev. 07/26/02

SP385E-1 True +3V to +5V RS-232 Line Driver/Receiver

PINOUT

N/C

ON/OFF

N/C

ON/OFF

C +

GND

V+

GND

C -

OUT

C -

OUT

C +

C -

OUT

V-

C -

OUT

T OUT

V-

OUT

T OUT

18-pin SOIC

R IN

R OUT

N/C

20-pin SSOP

TYPICAL OPERATING CIRCUIT

+5V INPUT

0.1µF

Vcc

0.1µF

16V

+5V to +10V

Voltage

0.1µF

6.3V

+5V to +10V

V+

V-

6.3V

Voltage Doubler

Doubler

+10V to -10V

Voltage

Inverter

0.1µF

+10V to -10V

0.1µF

16V

0.1µF

16V

0.1µF

16V

Voltage Inverter

400kΩ

T OUT

OUT

400kΩ

OUT

5kΩ

OUT

SP385E-1

GND 16

ON/OFF

SP385E-1

GND 18

SSOP Package

ON/OFF

SOIC Package

Rev. 07/26/02

SP385E-1 True +3V to +5V RS-232 Line Driver/Receiver

Driver/Transmitter

FEATURES…

The drivers are inverting level transmitters, that

convert TTL or CMOS logic levels to ±5.0V

EIA/TIA-232 levels inverted relative to the

input logic levels. Typically the RS-232 output

voltage swing is ±5.5V with no load and at least

±5V minimum fully loaded. The driver outputs

are protected against infinite short-circuits to

ground without degradation in reliability. Driver

outputs will meet EIA/TIA-562 levels of ±3.7V

with supply voltages as low as 2.7V.

The Sipex SP385E-1 is a +3V to +5V EIA-232/

EIA-562 line transceiver. It is a pin-for-pin

alternative for the SP310A and will operate in

the same socket with 0.1µF capacitors, either

polarized or non–polarized, in +3V supplies.

The SP385E-1 offers the same features such as

120kbps guaranteed transmission rate, increased

drive current for longer and more flexible cable

configurations, low power dissipation and

overall ruggedized construction for commercial

and industrial environments. The SP385E-1

also includes a shutdown feature that tri-states

the drivers and the receivers.

The instantaneous slew rate of the transmitter

output is internally limited to a maximum of

30V/µs in order to meet the standards [EIA 232-

D 2.1.7, Paragraph (5)]. However, the transition

region slew rate of these enhanced products is

typically 10V/µs. The smooth transition of the

loaded output from V_OLto V_OHclearly meets

the monotonicity requirements of the standard

[EIA 232-D 2.1.7, Paragraphs (1) & (2)].

The SP385E-1 includes a charge pump voltage

converter which allows it to operate from a single

+3.3V or +5V supply. These converters double the

V_CCvoltage input in order to generate the EIA-232

or EIA-562 output levels. For +5V operation, the

SP385E-1 driver outputs adhere to all EIA-232-F

and CCITT V.28 specifications. While at +3.3V

operation, the outputs adhere to EIA-562 specifica-

tions. Due to Sipex's efficient charge pump design,

the charge pump levels and the driver outputs are

less noisy than other 3V EIA-232 transceivers.

Receivers

The receivers convert RS-232 input signals to

inverted TTL signals. Since the input is usually

from a transmission line, where long cable

lengths and system interference can degrade the

signal, the inputs have a typical hysteresis

margin of 500mV. This ensures that the receiver

is virtually immune to noisy transmission lines.

The SP385E-1 has a single control line which

simultaneously shuts down the internal DC/DC

converter and puts all transmitter and receiver

outputs into a high impedance state.

The input thresholds are 0.8V minimum and

2.4V maximum, again well within the ±3V RS-

232 requirements. The receiver inputs are also

protected against voltages up to ±15V. Should

an input be left unconnected, a 5kΩ pull-down

resistor to ground will commit the output of the

receiver to a high state.

The SP385E-1 is available in 18-pin plastic

SOIC and 20-pin plastic SSOP packages for

operation over commercial and industrial

temperature ranges. Please consult the factory

for surface-mount packaged parts supplied on

tape-on-reel as well as parts screened to MIL-

M-38510.

In actual system applications, it is quite possible

for signals to be applied to the receiver inputs

before power is applied to the receiver circuitry.

This occurs for example when a PC user

attempts to print only to realize the printer

wasn’t turned on. In this case an RS-232 signal

from the PC will appear on the receiver input at

the printer. When the printer power is turned on,

the receiver will operate normally. All of these

enhanced devices are fully protected.

The SP385E-1 is ideal for +3.3V battery

applications requiring low power operation.

The charge pump strength allows the drivers

to provide ±4.0V signals, plenty for typical

EIA-562 applications since the EIA-562

receivers have input sensitivity levels of less

than ±3V.

THEORY OF OPERATION

The SP385E-1 device is made up of three basic

circuit blocks — 1) a driver/transmitter, 2) a

receiver and 3) a charge pump.

Rev. 07/26/02

SP385E-1 True +3V to +5V RS-232 Line Driver/Receiver

the negative side of capacitor C₂. Since C₂⁺is

at +5V, the voltage potential across C₂is l0V.

CHARGE PUMP

The charge pump is a Sipex–patented design

(5,306,954) and uses a unique approach

compared to older less–efficient designs. The

charge pump still requires four external

capacitors, but uses a four–phase voltage

shifting technique to attain symmetrical 10V

power supplies. There is a free–running

oscillator that controls the four phases of the

voltage shifting. A description of each phase

follows.

Phase 4

— V_DDtransfer — The fourth phase of the

clock connects the negative terminal of C₂to

ground,

and transfers the generated l0V across C₂to

C₄, the V_DDstorage capacitor. Again, simulta-

neously

with this, the positive side of capacitor C₁is

switched to +5V and the negative side is

connected to ground, and the cycle begins

again.

Phase 1

— V_SScharge storage —During this phase of

the clock cycle, the positive side of capacitors

C₁and C₂are initially charged to +5V. C_l⁺is

Since both V⁺and V^–are separately generated

from V_CC; in a no–load condition V⁺and V^–

will

be symmetrical. Older charge pump ap-

proaches that generate V^–from V⁺will show

a decrease in the magnitude of V^–compared

to V⁺due to the inherent inefficiencies in the

design.

–

then switched to ground and the charge in C₁

–

is transferred to C₂. Since C₂⁺is connected to

+5V, the voltage potential across capacitor C₂

is now 10V.

Phase 2

— V_SStransfer — Phase two of the clock

connects the negative terminal of C₂to the

V_SSstorage capacitor and the positive

terminal of C₂to ground, and transfers the

generated –l0V to C₃. Simultaneously, the

positive side of capacitor C ₁is switched to

+5V and the negative side is connected to

ground.

The clock rate for the charge pump typically

operates at 15kHz. The external capacitors

can be as low as 0.1µF with a 16V breakdown

voltage rating.

= +5V

–

Storage Capacitor

–

Phase 3

–10V

— V_DDcharge storage — The third phase of

the clock is identical to the first phase — the

charge transferred in C₁produces –5V in the

negative terminal of C₁, which is applied to

Figure 2. Charge Pump — Phase 2

= +5V

10V

C2+

+5V

–

Storage Capacitor

–

GND

–5V

GND

C2-

Figure 1. Charge Pump — Phase 1

-10V

Figure 3. Charge Pump Waveforms

Rev. 07/26/02

SP385E-1 True +3V to +5V RS-232 Line Driver/Receiver

in MIL-STD-883, Method 3015.7 for ESD

testing. The premise of this ESD test is to

simulate the human body’s potential to store

electro-static energy and discharge it to an

integrated circuit. The simulation is

performed by using a test model as shown in

Figure 6. This method will test the IC’s

capability to withstand an ESD transient

during normal handling such as in

= +5V

+5V

–

Storage Capacitor

–

–5V

Figure 4. Charge Pump — Phase 3

manufacturing areas where the ICs tend to be

handled frequently.

= +5V

+10V

The IEC-1000-4-2, formerly IEC801-2, is

generally used for testing ESD on equipment

and systems. For system manufacturers, they

must guarantee a certain amount of ESD

protection since the system itself is exposed to

the outside environment and human presence.

The premise with IEC1000-4-2 is that the

system is required to withstand an amount of

static electricity when ESD is applied to points

and surfaces of the equipment that are

accessible to personnel during normal usage.

The transceiver IC receives most of the ESD

current when the ESD source is applied to the

connector pins. The test circuit for IEC1000-

4-2 is shown on Figure 7. There are two

methods within IEC1000-4-2, the Air

–

Storage Capacitor

–

Figure 5. Charge Pump — Phase 4

Shutdown (ON/OFF)

The SP385E-1 has a shut-down/standby mode

to conserve power in battery-powered

systems. To activate the shutdown mode,

which stops the operation of the charge pump,

a logic "0" is applied to the appropriate

control line. The shutdown mode is controlled

on the SP385E-1 by a logic "0" on the ON/

OFF control line (pin 18 for the SOIC and pin

20 for the SSOP packages); this puts the

transmitter outputs in a tri-state mode.

Discharge method and the Contact Discharge

method.

ESD Tolerance

The SP385E-1 device incorporates rugge-

dized ESD cells on all driver output and

receiver input pins. The ESD structure is

improved over our previous family for more

rugged applications and environments

sensitive to electro-static

SW2

SW1

Device

Under

Test

DC Power

Source

discharges and associated transients. The

improved ESD tolerance is at least ±15KV

without damage nor latch-up.

Figure 6. ESD Test Circuit for Human Body Model

CCoonnttaacctt--DDiisscchhaarrggee MMoodduullee

There are different methods of ESD testing

applied:

SW2

SW1

a) MIL-STD-883, Method 3015.7

b) IEC1000-4-2 Air-Discharge

c) IEC1000-4-2 Direct Contact

Device

Under

Test

DC Power

Source

The Human Body Model has been the

and R add up to 330Ω for IEC1000-4-2.

generally accepted ESD testing method for

semiconductors. This method is also specified

Figure 7. ESD Test Circuit for IEC1000-4-2

Rev. 07/26/02

SP385E-1 True +3V to +5V RS-232 Line Driver/Receiver

the ESD arc. The discharge current rise time

is constant since the energy is directly

transferred without the air-gap arc. In

situations such as hand held systems, the ESD

charge can be directly discharged to the

equipment from a person already holding the

equipment. The current is transferred on to

the keypad or the serial port of the equipment

directly and then travels through the PCB and

finally to the IC.

30A

15A

The circuit models in Figures 6 and 7

represent the typical ESD testing circuit used

for all three methods. The C_Sis initially

charged with the DC power supply when the

first switch (SW1) is on. Now that the

capacitor is charged, the second switch (SW2)

is on while SW1 switches off. The voltage

stored in the capacitor is then applied through

R_S, the current limiting resistor, onto the

device under test (DUT). In ESD tests, the

SW2 switch is pulsed so that the device under

test receives a duration of voltage.

0ns

30ns

Figure 8. ESD Test Waveform for IEC1000-4-2

With the Air Discharge Method, an ESD

voltage is applied to the equipment under test

(EUT) through air. This simulates an

electrically charged person ready to connect a

cable onto the rear of the system only to find

an unpleasant zap just before the person

touches the back panel. The high energy

potential on the person discharges through an

arcing path to the rear panel of the system

before he or she even touches the system.

This energy, whether discharged directly or

through air, is predominantly a function of the

discharge current rather than the discharge

voltage. Variables with an air discharge such

as approach speed of the object carrying the

ESD potential to the system and humidity will

tend to change the discharge current. For

example, the rise time of the discharge current

varies with the approach speed.

For the Human Body Model, the current

limiting resistor (R_S) and the source capacitor

(C_S) are 1.5kΩ an 100pF, respectively. For

IEC-1000-4-2, the current limiting resistor

(R_S) and the source capacitor (C_S) are 330Ω an

150pF, respectively.

The higher C value and lower R_Svalue in the

IEC1000-4-2^Smodel are more stringent than

the Human Body Model. The larger storage

capacitor injects a higher voltage to the test

point when SW2 is switched on. The lower

current limiting resistor increases the current

charge onto the test point.

The Contact Discharge Method applies the

ESD current directly to the EUT. This method

was devised to reduce the unpredictability of

SP385E-1

Family

HUMAN BODY

MODEL

IEC1000-4-2

Air Discharge Direct Contact

Level

Driver Outputs

Receiver Inputs

±15kV

±8kV

Table 1. Transceiver ESD Tolerance Levels

Rev. 07/26/02

SP385E-1 True +3V to +5V RS-232 Line Driver/Receiver

PACKAGE: PLASTIC

SMALL OUTLINE (SOIC)

(WIDE)

DIMENSIONS (Inches)

Minimum/Maximum

(mm)

18–PIN

0.090/0.104

(2.29/2.649))

0.004/0.012

(0.102/0.300)

0.013/0.020

(0.330/0.508)

0.447/0.463

(11.35/11.74)

0.291/0.299

(7.402/7.600)

0.050 BSC

(1.270 BSC)

0.394/0.419

(10.00/10.64)

0.016/0.050

(0.406/1.270)

0°/8°

(0°/8°)

Rev. 07/26/02

SP385E-1 True +3V to +5V RS-232 Line Driver/Receiver

PACKAGE: PLASTIC SHRINK

SMALL OUTLINE

(SSOP)

DIMENSIONS (Inches)

Minimum/Maximum

(mm)

20–PIN

0.068/0.078

(1.73/1.99)

0.002/0.008

(0.05/0.21)

0.010/0.015

(0.25/0.38)

0.278/0.289

(7.07/7.33)

0.205/0.212

(5.20/5.38)

0.0256 BSC

(0.65 BSC)

0.301/0.311

(7.65/7.90)

0.022/0.037

(0.55/0.95)

0°/8°

(0°/8°)

Rev. 07/26/02

SP385E-1 True +3V to +5V RS-232 Line Driver/Receiver

ORDERING INFORMATION

Temperature Range

Part Number

Package

SP385E-1CA ........................................... 0°C to +70°C .......................................... 20–pin SSOP

SP385E-1EA.......................................... –40°C to +85°C........................................ 20–pin SSOP

SP385E-1CT ............................................ 0°C to +70°C ........................................... 18–pin SOIC

SP385E-1ET .......................................... –40°C to +85°C......................................... 18–pin SOIC

CT and ET packages available Tape–on–Reel. Please consult the factory for pricing and availability for this option, and for parts screened to

MIL–STD–883.

Co rp o ra tio n

SIGNAL PROCESSING EXCELLENCE

Sipex Corporation

Headquarters and

Sales Office

22 Linnell Circle

Billerica, MA 01821

TEL: (978) 667-8700

FAX: (978) 670-9001

e-mail: sales@sipex.com

Sales Office

233 South Hillview Drive

Milpitas, CA 95035

TEL: (408) 934-7500

FAX: (408) 935-7600

Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the

application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others.

Rev. 07/26/02

SP385E-1 True +3V to +5V RS-232 Line Driver/Receiver

SP385E-L-1EA-L-L [SIPEX]

相关型号：

SP385E-L-1ET-L-L

SP385ECA

SP385ECA-L

SP385ECA-L

SP385ECA-L-TR

SP385ECA-L/TR

SP385ECA-L/TR

SP385ECA/TR

SP385ECT

SP385ECT-L

SP385ECT-L

SP385ECT-L-TR