BTA26 [SIRECT]

Discrete Triacs(Non-Isolated/Isolated); 离散双向可控硅(非隔离/隔离)
BTA26
型号: BTA26
厂家: Sirectifier Global Corp.    Sirectifier Global Corp.
描述:

Discrete Triacs(Non-Isolated/Isolated)
离散双向可控硅(非隔离/隔离)

可控硅
文件: 总4页 (文件大小:266K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BTB/BTA26  
Discrete Triacs(Non-Isolated/Isolated)  
Dimensions TO-220AB  
Dim.  
Inches  
Min. Max.  
Milimeter  
Min. Max.  
A
B
C
D
E
F
G
H
J
K
M
N
Q
R
0.500 0.550  
0.580 0.630  
0.390 0.420  
0.139 0.161  
0.230 0.270  
0.100 0.125  
0.045 0.065  
0.110 0.230  
0.025 0.040  
12.70 13.97  
14.73 16.00  
9.91 10.66  
G
T2  
T1  
3.54  
5.85  
2.54  
1.15  
2.79  
0.64  
2.54  
4.32  
1.14  
0.35  
2.29  
4.08  
6.85  
3.18  
1.65  
5.84  
1.01  
BSC  
4.82  
1.39  
0.56  
2.79  
T2  
G
0.100  
BSC  
0.170 0.190  
0.045 0.055  
0.014 0.022  
0.090 0.110  
T1  
ABSOLUTE MAXIMUM RATINGS  
Parameter  
RMS on-state current (full sine wave)  
Value  
Unit  
Symbol  
I
T(RMS)  
25  
TO-220AB  
A
Tc = 100°C  
t = 16.7 ms  
t = 20 ms  
I
Non repetitive surge peak on-state  
current (full cycle, Tj initial = 25°C)  
F = 60 Hz  
F = 50 Hz  
A
260  
250  
TSM  
²
²
²
tp = 10 ms  
A s  
I t  
I t Value for fusing  
340  
50  
Critical rate of rise of on-state current  
dI/dt  
/V  
F = 120 Hz  
tp = 10 ms  
tp = 20 µs  
Tj = 125°C  
A/µs  
V
_
, tr < 100 ns  
GT  
I
= 2 x I  
G
V
/V  
Non repetitive surge peak off-state  
voltage  
DRM RRM  
V
Tj = 25°C  
DSM RSM  
+ 100  
I
Peak gate current  
Tj = 125°C  
4
1
A
GM  
P
Average gate p ower diss ipation  
Tj = 125°C  
W
G(AV)  
T
Storage junction temperature range  
Operating junction temperature range  
- 40 to + 150  
- 40 to + 125  
stg  
°C  
T
j
ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified)  
SNUBBERLESS™ and LOGIC LEVEL(3 Quadrants)  
Symbol  
Test Conditions  
Quadrant  
BTA/BTB  
Unit  
CW  
35  
BW  
50  
I
(1)  
mA  
I - II - III  
I - II - III  
I - II - III  
MAX.  
MAX.  
GT  
V
V = 12 V  
R = 33  
D
L
V
V
GT  
1.3  
0.2  
V
V = V  
R = 3.3 k  
Tj = 125°C  
GD  
(2)  
D
DRM  
L
MIN.  
MAX.  
MAX.  
I
I = 500 mA  
50  
70  
80  
75  
80  
mA  
mA  
H
T
I
I = 1.2 I  
I - III  
II  
G
GT  
L
100  
dV/dt (2)  
V
V
67 %  
DRM  
V/µs  
=
gate open Tj = 125°C  
Tj = 125°C  
D
MIN.  
MIN.  
500  
13  
1000  
22  
(dI/dt)c (2) Without snubber  
A/ms  
BTB/BTA26  
Discrete Triacs(Non-Isolated/Isolated)  
STANDARD (4 Quadrants)  
Symbol  
(1)  
Test Conditions  
Quadrant  
Value  
Unit  
I
I - II - III  
IV  
50  
100  
GT  
MAX.  
mA  
V = 12 V  
R = 33  
D
L
V
V
GT  
ALL  
ALL  
MAX.  
MIN.  
1.3  
0.2  
V
V
V = V  
DRM  
R = 3.3  
Tj = 125°C  
GD  
(2)  
D
L
I
I = 500 mA  
MAX.  
MAX.  
H
80  
70  
mA  
T
I
I = 1.2 I  
I - III - IV  
II  
G
GT  
L
mA  
160  
V = 67 % V  
gate open Tj = 125°C  
Tj = 125°C  
MIN.  
MIN.  
V/µs  
V/µs  
D
DRM  
dV/dt (2)  
500  
10  
(dV/dt)c (2) (dI/dt)c =13.3A/ms  
STATIC CHARACTERISTICS  
Symbol  
Test Conditions  
Tj = 25°C  
Value  
Unit  
I
= 35 A  
tp = 380 µs  
MAX.  
1.55  
V
V
V
(2)  
(2)  
TM  
TM  
V
Threshold voltage  
Tj = 125°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
0.85  
16  
5
MAX.  
MAX.  
to  
R (2)  
Dynamic resistance  
m  
d
I
I
V
= V  
RRM  
µA  
DRM  
RRM  
DRM  
MAX.  
3
mA  
Note 1: minimum IGT is guaranted at 5% of IGT max.  
Note 2: for both polarities of A2 referenced to A1  
THERMAL RESISTANCES  
Symbol  
Parameter  
Value  
Unit  
R
Junction to case (AC)  
Junction to ambient  
°C/W  
0.8  
60  
th(j-c)  
R
°C/W  
th(j-a)  
PRODUCT SELECTOR  
Part Number  
Voltage (xxx)  
Sensitivity  
Type  
Package  
~~  
200 V  
1000 V  
BTBV/BTA26  
X
X
50 mA  
Standard  
TO-220AB  
OTHER INFORMATION  
Base  
quantity  
Packing  
mode  
Part Number  
Marking  
Weight  
2.3 g  
250  
Bulk  
BTB/BTA26  
BTB/BTA26  
BTB/BTA26  
Discrete Triacs(Non-Isolated/Isolated)  
Fig. 1: Maximum power dissipation versus R MS  
on-state current (full cycle).  
Fig. 2-1: R MS on-state current versus case  
temperature (full cycle).  
P
(W)  
IT(R MS ) (A)  
30  
30  
25  
20  
15  
10  
5
B TB /T25  
25  
20  
15  
10  
5
B TA24  
B TA25/26  
IT(R MS ) (A)  
10 15  
Tc(°C)  
0
0
0
25  
50  
75  
100  
125  
0
5
20  
25  
Fig. 4:  
values).  
On-state characteristics (maximum  
Fig. 3: R elative variation of thermal impedance  
versus pulse duration.  
ITM (A)  
K =[Zth/R th]  
1E +0  
300  
100  
Zth(j-c)  
Tj max  
1E -1  
Zth(j-a)  
BTA/BTB24/T25  
10  
1
Tj=25°C  
1E -2  
Zth(j-a)  
BTA26  
Tj max.  
Vto 0.8V5  
R d 16 m  
=
=
tp (s )  
1E +0  
VTM (V)  
2.5  
1E -3  
1E -3  
1E -2  
1E -1  
1E +1  
1E +2 5E +2  
0.5  
1.0  
1.5  
2.0  
3.0  
3.5  
4.0  
4.5  
Fig. 5: S urge peak on-state current versus  
number of cycles.  
ITS M (A)  
300  
250  
t=20ms  
One cycle  
Non repetitive  
200  
Tj initial=25°C  
150  
R epetitive  
Tc=75°C  
100  
50  
Number of yccles  
0
1
10  
100  
1000  
BTB/BTA26  
Discrete Triacs(Non-Isolated/Isolated)  
Fig. 6: Non-repetitive surge peak on-state  
current for sinusoidal pulse with width  
tp < 10ms, and corresponding value of I²t.  
Fig. 7: R elative variation of gate trigger current,  
holding current and latching current versus  
junction temperature (typical values).  
a
IGT,IH,IL[Tj] / IG,TIH,IL [Tj=25°C]  
2.5  
ITS M (A),It² (As² )  
3000  
Tj initial=25°C  
2.0  
dI/dt limitation:  
50A/µs  
IGT  
1000  
1.5  
IH & IL  
ITS M  
I²t  
1.0  
0.5  
Tj(°C)  
tp (ms )  
0.0  
100  
0.01  
-40 -20  
0
20  
40  
60  
80 100 120 140  
0.10  
1.00  
10.00  
Fig. 8: R elative variation of critical rate of  
decrease of main current versus (dV/dt)c (typical  
values).  
Fig. 9: R elative variation of critical rate of  
decrease of main current versus junction  
temperature.  
(dI/dt)c [Tj] / (dI/dt)c [Tj s pecified]  
(dI/dt)c [(dV/dt)c] / S pecified (dI/dt)c  
2.4  
6
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
5
4
3
2
1
0
BW/CW/T2535  
B
0.6  
Tj (°C)  
(dV/dt)c (V/µs )  
0.4  
0.1  
1.0  
10.0  
100.0  
0
25  
50  
75  
100  
125  

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