SPA-2118 [SIRENZA]

850 MHz 1 Watt Power Amplifier with Active Bias; 850兆赫1瓦功率放大器的有源偏置
SPA-2118
型号: SPA-2118
厂家: SIRENZA MICRODEVICES    SIRENZA MICRODEVICES
描述:

850 MHz 1 Watt Power Amplifier with Active Bias
850兆赫1瓦功率放大器的有源偏置

放大器 射频 微波 功率放大器
文件: 总6页 (文件大小:215K)
中文:  中文翻译
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Product Description  
SPA-2118  
Sirenza Microdevices’ SPA-2118 is a high efficiency GaAs  
Heterojunction Bipolar Transistor (HBT) amplifier housed in  
a low-cost surface-mountable plastic package. These HBT  
amplifiers are fabricated using molecular beam epitaxial  
growth technology which produces reliable and consistent  
performance from wafer to wafer and lot to lot.  
850 MHz 1 Watt Power Amplifier  
with Active Bias  
This product is specifically designed for use as a driver  
amplifier for infrastructure equipment in the 850 MHz band.  
Its high linearity makes it an ideal choice for multi-carrier and  
digital applications.  
Product Features  
High Linearity Performance:  
+20.7 dBm IS-95 CDMA Channel Power  
at -55 dBc ACP  
+47 dBm typ. OIP3  
VC1  
On-chip Active Bias Control  
Active  
VBIAS  
High Gain: 33 dB Typ.  
Bias  
RFOUT/  
Patented High Reliability GaAsHBT Technology  
Surface-Mountable Plastic Package  
VC2  
RFIN  
VPC2  
Applications  
IS-95 CDMA Systems  
Multi-Carrier Applications  
AMPS, ISM Applications  
Parameters: Test Conditions:  
Symbol  
Units  
Min.  
Typ.  
Max.  
Z0 = 50 Ohms Temp = 25ºC, VCC= 5.0V  
f0  
Frequency of Operation  
MHz  
dBm  
810  
900  
960  
Output Power at 1dB Compression  
29.0  
P1dB  
Adjacent Channel Power  
ACP  
dBc  
-55.0  
-52.0  
34.5  
IS-95 @880 MHz, ±885 KHz offset, POUT=20.7 dBm  
Small Signal Gain, 880 MHz  
Input VSWR  
dB  
-
31.5  
33.0  
S21  
VSWR  
1.5:1  
Output Third Order Intercept Point  
Power out per tone = +14 dBm  
OIP3  
NF  
dBm  
dB  
47.0  
5.0  
Noise Figure  
Device Current  
ICC  
mA  
360  
400  
425  
I
BIAS = 10mA, IC1 = 70mA, IC2 = 320mA  
VCC  
Device Voltage  
V
4.75  
5.0  
31  
5.25  
Rth j-l  
Thermal Resistance (junction - lead), TL = 85ºC  
ºC/W  
The information provided herein is believed to be reliable at press time. Sirenza Microdevices assumes no responsibility for inaccuracies or omissions.  
Sirenza Microdevices assumes no responsibility for the use of this information, and all such information shall be entirely at the user’s own risk. Prices and specifications are  
subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. Sirenza Microdevices does not  
authorize or warrant any Sirenza Microdevices product for use in life-support devices and/or systems.  
Copyright 2002 Sirenza Microdevices, Inc. All worldwide rights reserved.  
522 Almanor Ave., Sunnyvale, CA 94085  
Phone: (800) SMI-MMIC  
1
http://www.sirenza.com  
EDS-102012 Rev F  
SPA-2118 850 MHz 1 Watt Power Amp.  
850-950 MHz Application Circuit Data, Icc=400mA, Vcc=5V, IS-95, 9 Channels Forward  
880 MHz Adjacent Channel Power vs. Channel Output Power  
-40.0  
-45.0  
-40C  
25C  
-50.0  
85C  
-55.0  
-60.0  
-65.0  
-70.0  
-75.0  
-80.0  
-85.0  
11 12 13 14 15 16 17 18 19 20 21 22 23 24 25  
dBm  
IS-95 CDMA at 880 MHz  
T=+25C  
+24 dBm  
+20 dBm  
+10 dBm  
+16 dBm  
522 Almanor Ave., Sunnyvale, CA 94085  
Phone: (800) SMI-MMIC  
2
http://www.sirenza.com  
EDS-102012 Rev F  
SPA-2118 850 MHz 1 Watt Power Amp.  
850-950 MHz Application Circuit Data, ICC=400mA, VCC=5V  
Input/Output Return Loss,  
Isolation vs Frequency  
Gain vs. Frequency  
0
-10  
-20  
-30  
-40  
-50  
40  
36  
32  
28  
24  
T=+25°C  
-40C  
25C  
85C  
S22  
S11  
S12  
0.8  
0.85  
0.9  
0.95  
1
0.8  
0.85  
0.9  
0.95  
1
GHz  
GHz  
P1dB vs Frequency  
Device Current vs. Source Voltage  
600  
500  
400  
300  
200  
100  
0
36  
34  
32  
30  
28  
26  
25C  
-40C  
85C  
-40C  
25C  
85C  
0
1
2
3
4
5
6
0.8  
0.85  
0.9  
GHz  
0.95  
1
Vcc (V)  
522 Almanor Ave., Sunnyvale, CA 94085  
Phone: (800) SMI-MMIC  
3
http://www.sirenza.com  
EDS-102012 Rev F  
SPA-2118 850 MHz 1 Watt Power Amp.  
850 - 950 MHz Schematic  
Vcc  
10uF Tantalum  
External Connection  
82pF  
1000pF  
39pF  
IC2  
IC1  
2.2nH  
6.8K  
33 nH  
1
2
3
4
8
7
6
5
IBIAS  
Z=50 , 15.1°  
100pF  
6.8pF  
15pF  
1200pF  
330 Ohm  
Vpc  
850 - 950 MHz Evaluation Board Layout  
Ref. Des.  
C1  
Value  
Part Number  
Vcc  
15pF, 5%  
82pF, 5%  
Rohm MCH18 series  
Rohm MCH18 series  
AVX TAJB106K020R  
Rohm MCH18 series  
Rohm MCH18 series  
Rohm MCH18 series  
Rohm MCH18 series  
Rohm MCH18 series  
Toko LL1608-FS series  
Coilcraft 1008HQ series  
Rohm MCR03 series  
Rohm MCR03 series  
C3  
C2  
C4  
C3  
10uF, 10%  
C4  
1000pF, 5%  
39pF, 5%  
C2  
C5  
L1  
C5  
C6  
1200pF, 5%  
6.8pF, ±0.5pF  
100pF, 5%  
R1  
C1  
L2  
2012  
C7  
C8  
C8  
C7  
L1  
2.2nH, ±0.3nH  
33nH, 5%  
C6  
R2  
L2  
R1  
6.8K Ohm, 5%  
330 Ohm, 5%  
Sirenza Microdevices  
ECB-101161 Rev. C  
SOIC-8 PA  
R2  
Eval Board  
Vpc  
522 Almanor Ave., Sunnyvale, CA 94085  
Phone: (800) SMI-MMIC  
4
http://www.sirenza.com  
EDS-102012 Rev F  
SPA-2118 850 MHz 1 Watt Power Amp.  
Pin #  
1
Function  
Description  
Vc1  
VC1 is the supply voltage for the first stage transistor. The configuration as  
shown on application schematic is required for optimum RF performance.  
2
Vbias  
RF In  
Vpc2  
Vbias is the bias control pin for the active bias network. Recommended  
configuration is shown in the Application Schematic.  
RF input pin. This pin requires the use of an external DC blocking capacitor as  
shown in the Application Schematic.  
Vpc2 is the bias control pin for the active bias network for the second stage.  
The recommended configuration is shown in the Application Schematic.  
3
4
5, 6, 7, 8  
RF Out/Vc2 RF output and bias pin. Bias should be supplied to this pin through an external  
RF choke. Because DC biasing is present on this pin, a DC blocking capacitor  
should be used in most applications (see application schematic). The supply  
side of the bias network should be well bypassed. An output matching network is  
necessary for optimum performance.  
EPAD  
Gnd  
Exposed area on the bottom side of the package needs to be soldered to the  
ground plane of the board for thermal and RF performance. Several vias should  
be located under the EPAD as shown in the recommended land pattern (page 6).  
Simplified Device Schematic  
2
ACTIVE BIAS  
NETWORK  
4
5-8  
2
1
ACTIVE BIAS  
NETWORK  
Absolute Maximum Ratings  
3
Parameter (Ta = 25ºC)  
Absolute  
Limit  
Max. Supply Current (IC1) at VCC typ.  
Max. Supply Current (IC2) at VCC typ.  
Max. Device Voltage (VCC) at Icc typ.  
Max. RF Input Power  
150 mA  
750 mA  
6.0 V  
10 dBm  
+160 ºC  
+150 ºC  
Max. Junction Temp. (TJ)  
Caution: ESD sensitive  
Appropriate precautions in handling, packag-  
ing and testing devices must be observed.  
Max. Storage Temp.  
Operation of this device beyond any one of these limits  
may cause permanent damage. For reliable continuous  
operation, the device voltage and current must not exceed  
the maximum operating values specified in the table on  
page one.  
The Moisture Sensitivity Level rating for this device is level 1  
(MSL-1) based on the JEDEC 22-A113 standard classifica-  
tion. No special moisture packaging/handling is required  
Bias Conditions should also satisfy the following  
expression:  
during storage, shipment, or installation of the devices.  
ICCVCC (max) < (TJ - TL)/Rth,j-l  
522 Almanor Ave., Sunnyvale, CA 94085  
Phone: (800) SMI-MMIC  
http://www.sirenza.com  
EDS-102012 Rev F  
5
SPA-2118 850 MHz 1 Watt Power Amp.  
Part Number Ordering Information  
Part Number  
Devices Per Reel  
Reel Size  
SPA-2118  
500  
7"  
Package Outline Drawing  
(See SMDI MPO-101644 for tolerances, available on our website)  
8
7
6
5
.194 [4.93]  
EXPOSED PAD  
Lot ID  
SPA  
.236 [5.994]  
.155 [3.937]  
2118  
1
2
3
4
Beveled Edge  
.045 [1.143]  
.035 [.889]  
TOP VIEW  
BOTTOM VIEW  
.013 [.33] x 45°  
.050 [1.27]  
.016 [.406]  
.061 [1.549]  
.058 [1.473]  
.008 [.203]  
.194 [4.928]  
.155 [3.937]  
END VIEW  
SEATING PLANE  
.003 [.076]  
SEE DETAIL A  
SIDE VIEW  
Recommended Land Pattern  
PARTING LINE  
0.150 [3.81]  
Plated-Thru Holes  
0.140 [3.56]  
0.300 [7.62]  
(0.015" Dia, 0.030" Pitch)  
Machine  
Screws  
.025  
5°  
DETAIL A  
0.080 [2.03]  
0.050 [1.27]  
Note: DIMENSIONS ARE IN INCHES [MM]  
0.020 [0.51]  
522 Almanor Ave., Sunnyvale, CA 94085  
Phone: (800) SMI-MMIC  
http://www.sirenza.com  
EDS-102012 Rev F  
6

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