GRM155R71H102KA01 [SKYWORKS]
High Power (26 dBm) 802.11n WLAN Power Amplifier with Integrated Power Detector;
| 型号： | GRM155R71H102KA01 |
| 厂家： | 
SKYWORKS SOLUTIONS INC. |
| 描述： | High Power (26 dBm) 802.11n WLAN Power Amplifier with Integrated Power Detector 局域网 WLAN 无线局域网 |
| 文件： | 总11页 (文件大小：644K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PRELIMINARY DATA SHEET
SE2605L: High Power (+26 dBm) 802.11n WLAN Power
Amplifier with Integrated Power Detector
Applications
Description
The SE2605L is a 2 GHz Microwave Monolithic Integrated Circuit
(MMIC) Power Amplifier (PA) with superior output power, linearity,
and efficiency. These features make the SE2605L ideal for
Wireless Local Area Network (WLAN IEEE 802.11n) applications.
IEEE 802.11n WLAN enabled:
Access points
Media gateways
Set top boxes
LCD TVs
The device is fabricated using SiGe BiCMOS technology. The
device is internally matched and mounted in a 20-pin, 4 x 4 mm
Quad Flat No-Lead (QFN) Surface-Mounted Technology (SMT)
package, which allows for a highly manufacturable low cost
solution.
Other broadband triple-play multimedia applications
Features
Linear output power for IEEE 802.11n, 64-QAM,
EVM ≤ 3% = +26 dBm @ 5.0 V
A block diagram of the SE2605L is shown in Figure 1.The device
package and pinout for the 16-pin QFN are shown in Figure 2.
Signal pin assignments and functional pin descriptions are
described in Table 1.
High gain: 32 dB
Power shutdown mode
Superior gain flatness
Fully matched at RF input/output ports
Load insensitive power detector
Small footprint QFN (16-pin, 3 x 3 mm) SMT package (MSL3,
260 C per JEDEC J-STD-020)
Skyworks GreenTM products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of GreenTM, document number
SQ04–0074.
Bias
PA_EN
RF_IN
Input
Match
Inter-Stage
Match
Inter-Stage
Match
RF_OUT
Detector
VCC1
VCC2
Figure 1. SE2605L Block Diagram
VDET
VCC3
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
203009E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • February 10, 2016
1
PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA
13
15
14
16
RF_IN
EN
1
2
GND
12
11
RF_OUT
RF_OUT
GND
GND
VCC0
3
4
10
9
7
8
5
6
Y0251
Figure 2. SE2605L Pinout
(Top View)
Table 1. SE2605L Signal Descriptions
Pin
1
Name
RF_IN
Description
Pin
Name
Description
RF Input
9
GND
RF_OUT
Ground
2
EN
Power amplifier enable
10
11
12
13
14
15
16
RF output
RF output
Ground
3
GND
VCC0
GND
GND
DET
N/C
Ground
RF_OUT
GND
4
Power supply for bias circuit
5
Ground
VCC2
N/C
Power supply for second stage
Not connected. Can be left floating or grounded.
Power Supply driver stages
Ground
6
Ground
7
Power detector output
VCC1
GND
8
Not connected. Can be left floating or grounded.
Technical Description
Electrical and Mechanical Specifications
The SE2605L PA contains all of the needed RF matching and DC
biasing circuits. The device also provides an output power
detector voltage.
The absolute maximum ratings of the SE2605L are provided in
Table 2. Recommended operating conditions are specified in
Table 3. Electrical specifications are provided in Tables 4, 5,
and 6.
The SE2605L is a three-stage, SiGe BiCMOS device optimized for
high linearity and power efficiency. These features make the
device suitable for wideband digital applications, where PA
linearity and power consumption are of critical importance (e.g.,
WiFi systems or WLANs).
The device has been characterized with the highest specified data
rates for IEEE 802.11n (64 QAM). Under these stringent test
conditions, the device exhibits excellent spectral purity and power
efficiency.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
February 10, 2016 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 203009E
2
PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA
Table 2. SE2605L Absolute Maximum Ratings1
Parameter
Symbol
Minimum
–0.3
Maximum
+5.5
+3.6
+12
Units
V
Supply voltage
VCC1, VCC2, VCC3
Enable voltage
PA_EN
PIN
–0.3
V
RF input power
dBm
C
Operating temperature
Storage temperature
Junction temperature
Thermal resistance
Electrostatic discharge:
Human Body Model (HBM), Class 1C
TOP
TST
–40
–40
+85
+150
+160
13
C
TJ
C
ΘJC
ESD
C/W
1000
V
1
Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set
at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. SE2605L Recommended Operating Conditions
Parameter
Symbol
VCC1, VCC2, VCC3
PA_EN
Minimum
3.0
Typical
Maximum
5.25
Units
Supply voltage
Enable voltage
5.00
V
V
1.8
3.6
Case operating temperature
TOP
–40
+25
+85
C
Table 4. SE2605L Electrical Specifications: DC Characteristics1
(VCC1 = VCC2 = VCC3 = 5.0 V, PA_EN = 3.3 V, TOP = +25 C as Measured on the Evaluation Board, Unless Otherwise Noted)
Parameter
Supply current
Symbol
Test Condition
802.11n:
Min
Typical
Max
Units
ICC
POUT = +26 dBm,
MCS7, 54 Mbps, 64 QAM
400
600
500
560
mA
POUT = +29 dBm, 11Mbps,
CCK signal, BT = 0.45
μA
650
10
690
100
PA_EN = 0 V, No RF
No RF
Quiescent Current
ICQ
220
mA
Enable voltage:
High
Low
PAEN_H
PAEN_L
1.8
0
3.6
0.5
V
V
Enable current
IEN
300
10
μA
Enable pin input impedance
ZEN
Passive pull down
kΩ
1
Performance is guaranteed only under the conditions listed in this table.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
203009E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • February 10, 2016
3
PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA
Table 5. SE2605L Electrical Specifications: General1
(VCC1 = VCC2 = VCC3 = 5.0 V, PA_EN = 3.3 V, TOP = +25 C, Unless Otherwise Noted)
Parameter
Frequency range
Symbol
Test Condition
Min
Typical
Max
Units
f
2.4
2.5
GHz
Output power
POUT
54 Mbps OFDM signal, 64 QAM,
3% EVM
+24
+26
dBm
11 Mbps CCK signal,
BT = 0.045 , mask
+27
+29
30
+29
+32
33
dBm
dBm
dB
1 dB output compression point
Small signal gain
OP1dB
|S21|
PIN = CW
36
Input return loss
|S11|
10
15
dB
Gain variation
S21
Over 40 MHz channel
Over entire band
0.5
1.0
dB
dB
2nd and 3rd harmonics
Rise and fall time
2fo, 3fo
tR, tF
POUT = +29 dBm
–50
–45
dBm/MHz
50% of VEN edge to 10%/90%
of final power level
0.5
μs
Stability
POUT = +29 dBm,
VSWR = 4:1, all phases
All non-harmonically related outputs
< –42 dBm/MHz
Ruggedness
Ru
PIN = +12dBm, 50% duty cycle,
VSWR = 6:1, all phases
No damage
1
Performance is guaranteed only under the conditions listed in this table.
Table 6. SE2605L Electrical Specifications: Power Detector Characteristics1
(VCC = 5.0 V, PA_EN = 3.3 V, TOP = +25 C, f = 2.45 GHz, Unless Otherwise Noted)
Parameter
Output power detector range
Detector voltage
Symbol
PDR
Test Condition
Min
Typical
Max
Units
0
OP1dB
1.15
dBm
VDET
POUT = +30 dBm
0.90
0.65
0.30
1.00
0.73
0.33
V
V
V
POUT = +26 dBm
POUT = 5 dB
0.82
0.36
Detector accuracy
ERRDET
VSWR = 3:1
–1.5 to +1.5 dB
–1.5
+1.5
dB
kΩ
kΩ
Output impedance
DC load impedance
PDZOUT
2.3
PDZLOAD
26.5
1
Performance is guaranteed only under the conditions listed in this table.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
February 10, 2016 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 203009E
4
PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA
Evaluation Board Description
The RF lines should be well separated from each other with
The SE2605L Evaluation Board is used to test the performance of
the SE2605L WLAN PA. A schematic diagram of the SE2605L
Evaluation Board is shown in Figure 3. A photograph of the
Evaluation Board is shown in Figure 4. Component values for the
SE2605L Evaluation Board are listed in Table 7.
solid ground in between traces to maximize input-to-output
isolation.
NOTE: A poor connection between the slug and ground increases
junction temperature (TJ), which reduces the life of the
device.
Circuit Design Considerations
Evaluation Board Setup Procedure
The following design considerations are general in nature and
must be followed regardless of final use or configuration:
1. Connect system ground to pin 1 of connector J5.
2. Apply 5.0 V to pins 3 and 4 of connector J5.
Paths to ground should be made as short as possible.
3. By applying 3.3 V on PA_EN (pin 1 of the J4 header), the PA is
enabled. By placing a ground on PA_EN, the PA is disabled and
placed in a shutdown state, drawing minimal current.
The ground pad of the SE2605L has special electrical and
thermal grounding requirements. This pad is the main thermal
conduit for heat dissipation. Since the circuit board acts as the
heat sink, it must shunt as much heat as possible from the
device.
4. The 2 GHz amplifier performance can be monitored by applying
an RF signal to connector J1 (RF_IN). Monitor the output power
on the RF_OUT port connector, J1.
Therefore, design the connection to the ground pad to dissipate
the maximum wattage produced by the circuit board. Multiple
vias to the grounding layer are required. For further information,
refer to the Skyworks Application Note PCB Design Guidelines
for High Power Dissipation Packages, document number
201211.
Detector performance can be monitored on pin 4 of connector J4.
CAUTION: Do not overdrive the amplifier by applying too much
RF on the device input. A suitable starting input power
setting is –20 dBm.
Bypass capacitors should be used on the DC supply lines. Refer
to the schematic drawing in Figure 3 for further details.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
203009E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • February 10, 2016
5
PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA
J5
1
2
VCC0 / N/C
3
4
5
VCC
VCC
VCC
VCC
R2
91 Ω
C6
C5
C3
C4
1 nF
10 pF
1 μF
DNI
Header 5
VCC
17
PAD
16
15
14
13
GND VCC1 N/C
VCC2
C9
DNI
C10
DNI
C12
2.2 pF
C11
4.7 μF
1
12
RF Input
VEN
GND
RF_IN
C2
J1
SMA
DNI
R3
0 Ω
2
3
4
11
10
C18
3.3 pF
C15
RF_OUT
RF_OUT
EN
L3
1.5 nH
C7
T5
SE2605L
50 Ω
DNI
T2
T1
J2
GND
T3
C14
T4
C16
15 pF
SMA
C17
1.2 pF
9
VCC0
GND
2.4 pF
2.4 pF
VCC0 / N/C
GND
5
GND
DET
N/C
C20
100 nF
6
7
8
U1
VDET
Header 4
4
C19
R1
26.1K
DNI
VDET
3
2
1
VEN
J4
Y0254
Figure 3. SE2605L Evaluation Board Schematic
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
February 10, 2016 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 203009E
6
PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA
Y0262
Figure 4. SE2605L Evaluation Board
Table 7. SE2605L Evaluation Board Bill of Materials
Component
C2,C4,C7,C9,C10,C19
Quantity
Value
Vendor
Part Number
6
DNI
C3
C5
1
1
1 μF
Murata
Murata
GRM155R60J105KE19
GRM1555C1H100JZ01
10 Pf
GRM155R71H102KA01
GRM188R60J475KE19
GRM1555C1H2R2CZ01
GRM1555C1H2R4CZ01
GRM1555C1H150JZ01
GRM1555C1H1R2CZ01
GRM1555C1H3R3CZ01
GRM155R61A104KA01
142-0701-851
C6
1
1
1
2
1
1
1
1
2
1
1
1
1
1
1
1
1 nF
Murata
Murata
Murata
Murata
Murata
Murata
Murata
Murata
Johnson
Samtec
Samtec
Murata
C11
4.7 μF
2.2 pF
2.4 pF
1.2 pF
3.3 pF
27 Ω
C12
C14 and C16
C15
C17
C18
C20
100 nF
SMA
J1 and J2
J4
TSW-104-07-G-S
TSW-105-07-G-S
LQG15HN1N5S02D
Z264-B
Header 4
Header 5
1.5 nH
J5
L3
PCB1
R1
Z264-B
26.7 K
Skyworks
Panasonic
Panasonic
ERJ2RKF2672
ERJ2GEJ910
R2
91 Ω
R3
U1
0 Ω
Panasonic
Skyworks
ERJ3GEJ0R0
SE2605L
SE2605L
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
203009E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • February 10, 2016
7
PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA
Package Dimensions
Package and Handling Information
The PCB layout footprint for the SE2605L is provided in
Figure 5. Typical part markings are shown in Figure 6. Package
dimensions are shown in Figure 7, and tape and reel
dimensions are provided in Figure 8.
Since the device package is sensitive to moisture absorption, it
is baked and vacuum packed before shipping. Instructions on
the shipping container label regarding exposure to moisture
after the container seal is broken must be followed. Otherwise,
problems related to moisture absorption may occur when the
part is subjected to high temperature during solder assembly.
The SE2605L is rated to Moisture Sensitivity Level 3 (MSL3) at
260 C. It can be used for lead or lead-free soldering. For
additional information, refer to the Skyworks Application Note,
Solder Reflow Information, document number 200164.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
3.20
3 x 3 QFN
Package Outline
3.30
3.20
0.25 Typ
0.35 Typ
15
0.25 Typ
0.50 Typ
16
14
13
0.50 Typ
16
15
14
13
16
15
14
13
0.60 Typ
1
2
3
4
12
11
10
9
1
2
3
4
12
11
10
9
1
12
11
10
9
3.30
3.20
0.10
2
3
4
0.500
Typ
0.500
Typ
1.80
1.70
0.58
Typ
0.675 Typ
3.20
0.500
Typ
5
6
7
8
5
6
7
8
5
6
7
8
5X Ø0.254
0.58 Typ
0.675 Typ
0.10
1.70
1.80
Board Metal and Via Pattern
(Note 4)
Stencil Pattern
Solder Mask Pattern
(Note 6)
(Note 5)
NOTES:
63% Solder Coverage on Center Pad
1. All dimensions are in millimeters.
2. Dimensions and tolerances per ASME Y14.5M-1994.
3. Unless specified, dimensions are symmetrical about center lines.
4. Via hole recommendations:
Size (Ø): 0.150 to 0.300 mm
Pitch: 0.500
Cu via wall plating: 30-35 μm
Should be tented with solder mask on PCB backside and filled with solder.
5. Stencil recommendations: 0.127 mm stencil thickness.
Y0264
6. Solder mask recommendations: Aperture array to tarret approximately 50 to 80% coverage
of solder mask openings, except as noted.
Figure 5. PCB Layout Footprint for the SE2605L
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
February 10, 2016 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 203009E
8
PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA
Pin 1
Indicator
Pin 1
Indicator
SiGe
2605L
XXXXX
SKY
Part Number
Part Number
2605L
Lot Code
Lot Code
XXXXX
Y0189
Figure 6. Typical Part Markings
(Top View)
1.700 0.050
3.000 0.050
A
0.10
M
C A B
2X
0.15 C
0.850 0.050
0.203 Ref.
See Note 3
B
0.300 X 45°
16
15
14
13
13
14
15
16
1
2
3
4
12
11
10
9
12
1
2
1.700 0.050 11
0.500
3.000 0.050
10
3
4
R0.075 Typ.
9
0.10
M C A B
Seating
Plane
8
16X 0.250 0.050
7
6
5
2X
0.15 C
5
6
7
8
0 – 0.05
0.10
M
M C A B
C
C
0.05
16X 0.350 0.050
Top View
Bottom View
NOTES:
1. All measurements are in millimeters.
2. Dimensioning and tolerancing according to ASME Y14.5M-1994.
Unless otherwise specified the following values apply:
Decimal Tolerance:Angular Tolerance:
X.X (1 place) 0.1 mm
1ꢀ
X.XX (2 places) 0.05 mm
X.XXX (3 places) 0.025 mm
3. Terminal #1 identification mark located within marked area.
4. Coplanarity applies to the exposed heat sink ground pad as well as the terminals.
5. Unless specified, dimensions are symmetrical about center lines.
Y0265
Figure 7. SE2605L Package Dimensions
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
203009E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • February 10, 2016
9
PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA
2.00 0.05
1.75 0.10
4.00 0.10
8.00 0.10
∅
1.50 0.10
B
Reference Pin
1.13 0.10 (Ko)
Indicator
A
A
4.25 0.10
o
B
10 Max
∅
1.50 0.25
0.229 0.02 (T)
o
10 Max
B
Notes:
1. Carrier tape material: black conductive polycarbonate
or polysterene
4.25 0.10 (Ao)
2. Cover tape material: transparent conductive PSA
3. Cover tape size: 9.3 mm width
8
4. ESD surface resistivity is ≤1 x 10 Ohms/square per EIA, JEDEC
A
tape and reel specification.
5. Tolerance: .XX = 0.10
6. All measurements are in millimeters
S2585
Figure 8. SE2605L Tape and Reel Dimensions
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
February 10, 2016 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 203009E
10
PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA
Ordering Information
Model Name
Manufacturing Part Number
Evaluation Board Part Number
SE2605L-EK1
SE2605L High Power WLAN Power Amplifier
SE2605L
Copyright © 2012-2014, 2016 Skyworks Solutions, Inc. All Rights Reserved.
Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by
Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the
information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to
update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.
No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or
information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and Conditions
of Sale.
THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A
PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY
DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS
SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION,
LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGE.
Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury,
death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any
damages resulting from such improper use or sale.
Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of
products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for
applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters.
Skyworks and the Skyworks symbol are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and names are for
identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com, are incorporated by
reference.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
203009E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • February 10, 2016
11
相关型号：
GRM155R71H103KA88J
Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.01uF, Surface Mount, 0402, CHIP, ROHS COMPLIANT
MURATA
©2020 ICPDF网 联系我们和版权申明