SKY66288-11 [SKYWORKS]
700 to 800 MHz High-Efficiency 4 W Power Amplifier;
| 型号： | SKY66288-11 |
| 厂家： | 
SKYWORKS SOLUTIONS INC. |
| 描述： | 700 to 800 MHz High-Efficiency 4 W Power Amplifier |
| 文件： | 总14页 (文件大小：1375K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
SKY66296-11: 700 to 800 MHz High-Efficiency
4 W Power Amplifier
Applications
VBIAS PAEN VCC3
VCC1
FDD and TDD 2G/3G/4G LTE systems
3GPP bands 12, 13, 14, 17, 29, and 44 small cell base stations
Driver amplifier for micro-base and macro-base stations
Active antenna array and massive MIMO
Active Bias
Input
Match
Output
Match
RFOUT
RFIN
Stage2
PA
Stage 1
PA
Features
203931-001
High efficiency: PAE = 43% @ +28 dBm
Figure 1. SKY66296-11 Block Diagram
High linearity: +28 dBm with < 50 dBc linearized ACLR
(20 MHz LTE, 8.5 dB PAR signal)
Description
High gain: 35 dB
The SKY66296-11 is a high-efficiency fully input/output matched
power amplifier (PA) with high gain and linearity. The compact
5 5 mm PA is designed for FDD and TDD 2G/3G/4G LTE small
cell base stations operating from 700 to 800 MHz. The active
biasing circuitry is integrated to compensate PA performance over
temperature, voltage, and process variation.
Excellent input and output return loss: to 50 system
Integrated active bias: performance compensated over temp
Integrated enable On/Off function: PAEN = 1.7 to 2.5 V
Single supply voltage: 5.0 V
Pin-to-pin compatible PA family supporting all 3GPP bands
The SKY66296-11 is part of high-efficiency, pin-to-pin compatible
PA family supporting all 3GPP bands.
Compact (16-pin, 5 5 1.3 mm) package
(MSL3, 260 C per JEDEC J-STD-020)
A block diagram of the SKY66296-11 is shown in Figure 1. The
device package and pinout for the 16-pin device are shown in
Figure 2. Table 1 lists the pin-to-pin compatible parts in the PA
family. Signal pin assignments and functional pin descriptions are
described in Table 2.
Skyworks GreenTM products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of GreenTM, document number
SQ04–0074.
Table 1. Pin-to-Pin Compatible PA Family
Part Number
SKY66296-11
SKY66289-11
SKY66295-11
SKY66298-11
SKY66291-11
SKY66299-11
SKY66294-11
SKY66292-11
SKY66297-11
SKY66293-21
SKY66288-11
Frequency (MHz)
700 to 800
3GPP Band
Bands 12, 13, 14, 17, 29, and 44
Band 20
791 to 821
800 to 900
Bands 5, 18, 19, 20, 26 and 27
Band 8
900 to 990
1805 to 1880
1900 to 2000
2000 to 2300
2300 to 2400
2490 to 2690
3400 to 3800
5150 to 5925
Bands 3 and 9
Bands 2, 25, 33, 36, and 37
Bands 1, 4, 10, and 23
Bands 30 and 40
Bands 7, 38, and 41
CBRS, Bands 22, 42, 43, and 48
Band 46
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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DATA SHEET • SKY66296-11: 700 TO 800 MHz HIGH-EFFICIENCY 4 W POWER AMPLIFIER
16
15
14
13
GND
RFIN
GND
GND
1
12
11
10
9
VCC3
GND
2
3
GND
4
RFOUT
5
6
7
8
203931-002
Figure 2. SKY66296-11 Pinout
(Top View)
Table 2. SKY66296-11 Signal Descriptions1
Pin
1
Name
Description
Pin
9
Name
Description
GND
RFIN
GND
GND
VBIAS
PAEN
GND
GND
Ground
RFOUT
RF output port
Ground
2
RF input port
Ground
10
11
12
13
14
15
16
GND
GND
VCC3
GND
N/U
3
Ground
4
Ground
Stage 3 collector voltage
Ground
5
Bias voltage
PA enable
Ground
6
Not used
7
GND
VCC1
Ground
8
Ground
Stage 1 collector voltage
1
The center ground pad must have a low inductance and low thermal resistance connection to the application’s printed circuit board ground plane.
Technical Description
Electrical and Mechanical Specifications
The matching circuits are contained within the device. An on-chip
active bias circuit is included within the device for both input and
output stages, which provides excellent gain tracking over
temperature and voltage variations.
The absolute maximum ratings of the SKY66296-11 are provided
in Table 3. Recommended operating conditions are specified in
Table 4 and electrical specifications are provided in Table 5.
Typical performance characteristics are shown in Figures 3
through 16.
The SKY66296-11 is internally matched for maximum output
power and efficiency. The input and output stages are
independently supplied using the VCC1 and VCC3 supply lines
(pins 16 and 12, respectively). The DC control voltage that sets
the bias is supplied by the VBIAS signal (pin 5).
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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2
DATA SHEET • SKY66296-11: 700 TO 800 MHz HIGH-EFFICIENCY 4 W POWER AMPLIFIER
Table 3. SKY66296-11 Absolute Maximum Ratings1
Parameter
RF input power (CW,50 load)
Supply voltage (VCC1, VCC3, VBIAS)
PA enable
Symbol
Minimum
Maximum
+5
Units
dBm
V
PIN
VCC
VEN
TC
5.5
3
V
Operating temperature
Storage temperature
40
55
+100
+125
+150
1.2
C
TSTG
TJ
C
Junction temperature
C
Power dissipation
PD
W
Device thermal resistance
Electrostatic discharge:
JC
29
C/W
Charged Device Model (CDM)
Human Body Model (HBM)
500
1000
V
V
1
Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set
at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
ESD HANDLING:Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device.
This device must be protected at all times from ESD when handling or transporting. Static charges may easily produce
potentials of several kilovolts on the human body or equipment, which can discharge without detection.
Industry-standard ESD handling precautions should be used at all times.
Table 4. SKY66296-11 Recommended Operating Conditions
Parameter
Supply voltage (VCC1, VCC3, VBIAS)
PA enable:
Symbol
VCC1, VCC3, VBIAS
PAEN
Minimum
Typical
Maximum
Units
4.75
5
5.25
V
ON
OFF
1.7
2.0
0
2.5
0.5
V
V
PA enable current
IEN
f
1
12
A
MHz
C
Operating frequency
Operating temperature
728
768
+85
TC
40
+25
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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DATA SHEET • SKY66296-11: 700 TO 800 MHz HIGH-EFFICIENCY 4 W POWER AMPLIFIER
Table 5. SKY66296-11 Electrical Specifications1
(VCC1 = VCC3 = VBIAS = 5 V, PAEN = 2.0 V, f = 748 MHz, TC = +25 C, Input/Output Load = 50 , Unless Otherwise Noted)
Parameter
Symbol
Test Condition
Min
728
34
Typical
Max
Units
MHz
dB
Frequency
f
768
Small signal gain
Gain @ +28 dBm
Input return loss
Output return loss
|S21|
|S21|@28dBm
|S11|
|S22|
|S12|
ACLR
PSAT
PIN = 30 dBm
35.5
35
CW, POUT = +28 dBm
PIN = 20 dBm
33.5
14
dB
21
dB
PIN = 20 dBm
10
15
dB
2
Reverse isolation
PIN = 30 dBm
55
dB
ACLR @ +28 dBm
POUT = +28 dBm (20 MHz LTE, 8.5 dB PAR signal)
CW, PIN = +5 dBm
28.5
+35.3
+33.1
40
70
43
–27
dBc
dBm
dBm
dBc
dBc
%
Saturated output power
Output power at 3 dB gain compression
2nd harmonic
34
32
3
P3dB
2fO
CW, reference to small signal gain
CW, POUT = +28 dBm
CW, POUT = +28 dBm
CW, POUT = +28 dBm
No RF signal
–35
–60
3rd harmonic
3fO
Power added efficiency
Quiescent current
PAE
38
ICCQ
70
95
mA
1
2
3
Performance is guaranteed only under the conditions listed in this table.
Not tested in production. Verified by design.
Refer to the performance plot in Figure 14.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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DATA SHEET • SKY66296-11: 700 TO 800 MHz HIGH EFFICIENCY 4 W POWER AMPLIFIER
Typical Performance Characteristics
(VCC1 = VCC2 = VCC3 = VBIAS = 5 V, PAEN = 2.0 V, f = 748 MHz, TC = +25 C, Input/Output Load = 50 ,
Unless Otherwise Noted)
55
50
45
40
35
30
25
20
15
10
5
55
50
45
40
35
30
25
20
15
10
5
728 MHz
748 MHz
768 MHz
–40 °C
+25 °C
+85 °C
0
0
10
12
14
16
18
20
22
24
26
28
30
10
12
14
16
18
20
22
24
26
28
30
POUT (dBm)
POUT (dBm)
Figure 4. PAE vs POUT Across Temperature
Figure 3. PAE vs POUT Across Frequency
–25
–27
–29
–31
–33
–35
–25
–27
–29
–31
–33
–35
–40 °C
+25 °C
+85°C
-40 °C
+25 °C
728 MHz
748 MHz
768 MHz
25.0
25.5
26.0
26.5
27.0
27.5
28.0
28.5
29.0
25.0
25.5
26.0
26.5
27.0
27.5
28.0
28.5
29.0
P
OUT (dBm)
P
OUT (dBm)
Figure 6. ACLR vs POUT Across Temperature
Figure 5. ACLR vs. Pout Across Frequency
38
37
36
35
34
33
32
31
30
29
28
37
36
35
34
33
32
31
30
29
28
–40 °C
+25 °C
+85°C
728 MHz
748 MHz
768 MHz
27
6
8
10 12 14 16 18 20 22 24 26 28 30 32 34 36
OUT (dBm)
6
8
10 12 14 16 18 20 22 24 26 28 30 32 34 36
OUT (dBm)
P
P
Figure 8. Gain vs POUT Across Temperature
Figure 7. Gain vs POUT Across Frequency
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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DATA SHEET • SKY66296-11: 700 TO 800 MHz HIGH-EFFICIENCY 4 W POWER AMPLIFIER
2000
1750
1500
1250
1000
750
1750
1500
1250
1000
750
500
250
0
–40 °C
+25 °C
+85°C
728 MHz
748 MHz
768 MHz
500
250
0
6
8
10 12 14 16 18 20 22 24 26 28 30 32 34 36
6
8
10 12 14 16 18 20 22 24 26 28 30 32 34 36
POUT (dBm)
POUT (dBm)
Figure 9. Operating Current vs POUT Across Frequency
Figure 10. Operating Current vs POUT Across Temperature
–35
–37
–39
–41
–43
–45
–47
–66
–40 °C
+25 °C
+85°C
–40 °C
+25 °C
+85°C
–68
–70
–72
–74
–76
–78
728
738
748
758
768
728
738
748
758
768
Frequency (MHz)
Frequency (MHz)
Figure 11. 2nd Harmonic vs Frequency Across Temperature
@ POUT = +28 dBm (CW)
Figure 12. 3rd Harmonic vs Frequency Across Temperature
@ POUT = +28 dBm(CW)
37.0
60
–40 °C
+25 °C
+85°C
36.5
36.0
35.5
35.0
34.5
34.0
40
20
0
S21
–20
–40
–60
728
733
738
743
748
753
758
763
768
0
500
1000
1500
2000
2500
3000
3500
4000
4500
5000
Vcc (V)
Frequency (MHz)
Figure 13. Small Signal Gain vs Frequency Across Temperature
(PIN = −30 dBm)
Figure 14. Wide Band Small Signal Gain vs Frequency
(PIN = –30 dBm)
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DATA SHEET • SKY66296-11: 700 TO 800 MHz HIGH EFFICIENCY 4 W POWER AMPLIFIER
–12
–16
–20
–24
–28
–32
–36
–40
–12.0
–40 °C
+25 °C
+85°C
–12.5
–13.0
–13.5
–14.0
–14.5
–40 °C
+25 °C
+85°C
–15.0
–15.5
–16.0
728
733
738
743
748
Vcc (V)
753
758
763
768
728
733
738
743
748
Vcc (V)
753
758
763
768
Figure 16. Output Return Loss vs Frequency Across Temperature
(Small Signal, PIN = −20 dBm)
Figure 15. Input Return Loss vs Frequency Across Temperature
(Small Signal, PIN = −20 dBm)
Evaluation Board Test Procedure
Turn-On Sequence
Evaluation Board Description
The SKY66296-11 Evaluation Board is used to test the
performance of the SKY66296-11 PA. An Application schematic is
provided in Figure 17. Table 6 provides the Bill of Materials (BOM)
list for Evaluation Board components.
1. Connect 50 test equipment or load to the input and
output RF ports of the Evaluation Board.
2. Connect the DC ground.
An assembly drawing for the Evaluation Board is shown in
Figure 18. Layer details are shown in Figure 19. Layer details
physical characteristics are noted in Figure 20.
3. Connect all VCCs and VBIAS lines to a +5 V supply.
Connect PAEN to a 2.0 V supply.
4. Without applying RF, turn on the 5 V supply, then turn on
the 2 V PAEN.
Circuit Design Considerations
5. Apply RF signal at –30 dBm and observe that the gain of
the device complies with the values in Table 5. Begin
measurements.
The following design considerations are general in nature and
must be followed regardless of final use or configuration:
Turn-Off Sequence
Paths to ground should be made as short as possible.
The ground pad of the SKY66296-11 has special electrical and
thermal grounding requirements. This pad is the main thermal
conduit for heat dissipation. Because the circuit board acts as
the heat sink, it must shunt as much heat as possible from the
device.
1. Turn off the RF input to the device.
2. Turn off PAEN (set to 0 V).
3. Turn off all VCCs and VBIAS.
NOTE: It is important to adjust the VCC voltage sources so that
+5 V is measured at the board. High collector currents drop the
collector voltage significantly if long leads are used. Adjust the
bias voltage to compensate.
Therefore, design the connection to the ground pad to dissipate
the maximum wattage produced by the circuit board. Multiple
vias to the grounding layer are required.
NOTE: A poor connection between the ground pad and ground
increases junction temperature (TJ), which reduces the life of the
device.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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DATA SHEET • SKY66296-11: 700 TO 800 MHz HIGH-EFFICIENCY 4 W POWER AMPLIFIER
VCC1
C11
C12
U1
16
15
14
13
17
1
GND_PAD
GND
12
11
10
9
VCC3
VCC3
C6
C7
C8
J7
C1
GND6
2
SKY66296-11
RFIN
L1
3
GND5
GND1
GND2
SMA
J8
4
RFOUT
1
2
3
4
5
6
7
8
PAEN
V
BIAS
RFOUT
5
6
7
8
V
BIAS
V
CC1
C3
C4
V
CC
2
(Do not connect)
PAEN
Notes:
V
CC3
The C1 component shown in this assembly is a 0 Ω resistor.
The L1 component shown in this assembly is DNI.
8-Pin Header
203931-017
Figure 17. SKY66296-11 Application Schematic
Table. 6. SKY66296-11 Evaluation Board Bill of Materials (BOM)
Component
Description
Size
0402
0402
0402
1206
DNI
C1
Resistor, 0 , jumper, 0.063 W
C3, C4, C7, C11
C6
Ceramic capacitor, 3300 pF, X7R, 10%, 50 V
Ceramic capacitor, 100 pF
Ceramic capacitor, 10 F, 16 V, 10% , X7R
DNI
C8, C12
L1, C9, C10
TW21-D690-051
Evaluation Board
-
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DATA SHEET • SKY66296-11: 700 TO 800 MHz HIGH-EFFICIENCY 4 W POWER AMPLIFIER
J1
PAEN VBIAS GND VCC1 GND VCC2 GND VCC3
RF IN
C12
C11
C10
RF OUT
J8
C9
C8
C6 C7
C1
J19
U1
L1
C3
C4
203931-018
Notes:
1. Evaluation Board Gerber files available upon request.
2. The C1 component shown in this assembly is a 0 Ω resistor.
3. C9 and C10 are not installed.
4. VCC2 is not used.
Figure 18. Evaluation Board Assembly Drawing
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DATA SHEET • SKY66296-11: 700 TO 800 MHz HIGH-EFFICIENCY 4 W POWER AMPLIFIER
Layer 2
Layer 1
Layer 4
Layer 3
Figure 19. Evaluation Board Layer Details
50 Ohm
Materials
Name
Cross Section
Thickness (mm)
TMask
L1
Dielectric
L2
Dielectric
L3
Dielectric
L4
0.010
0.035
0.250
0.035
0.350
0.035
0.250
0.035
0.010
Solder Resist
Cu, 1 oz.
R04350
Cu, 1 oz.
FR4
Cu, 1 oz.
FR4
Cu, 1 oz.
Solder Resist
W = 0.500 mm
BMask
203931-020
Figure 20. Layer Detail Physical Characteristics
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DATA SHEET • SKY66296-11: 700 TO 800 MHz HIGH-EFFICIENCY 4 W POWER AMPLIFIER
Application Circuit Notes
Package Dimensions
Center Ground. It is extremely important to sufficiently ground
the bottom ground pad of the device for both thermal and stability
reasons. Multiple small vias are acceptable and work well under
the device if solder migration is an issue.
Typical part marking for the SKY66296-11 is shown in Figure 21.
The PCB layout footprint for the SKY66296-11 is shown in
Figure 22. Package dimensions are shown in Figure 23, and tape
and reel dimensions are provided in Figure 24.
GND (pins 1, 3, 4, 7, 8, 10, 11, 13, and 15). Attach all ground
pins to the RF ground plane with the largest diameter and lowest
inductance via that the layout allows. Multiple small vias are
acceptable and will work well under the device if solder migration
is an issue.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
VBIAS (pin 5). The bias supply voltage for each stage, nominally
set to +5 V.
RFOUT (pin 9). Amplifier RF output pin (ZO = 50 ). The module
includes an onboard internal DC blocking capacitor. All
impedance matching is provided internal to the module.
The SKY66296-11 is rated to Moisture Sensitivity Level 3 (MSL3)
at 250 C. It can be used for lead or lead-free soldering. For
additional information, refer to Skyworks Application Note, PCB
Design and SMT Assembly/Rework Guidelines for MCM-L
Packages, document number 101752.
VCC1 and VCC3 (pin 16 and 12, respectively). Supply voltage for
each stage collector bias is nominally set to 5 V. Bypass and
decoupling capacitors C6 through C12 should be placed in the
approximate location shown on the evaluation board assembly
drawing, although exact placement is not critical.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
RFIN (pin 2). Amplifier RF input pin (ZO = 50 ). The module
includes an onboard internal DC blocking capacitor. All
impedance matching is provided internal to the module.
Pin 1
Indicator
Skyworks
Part Number
Lot Code
66296-11
XXXXXXXXX
YYWW CC
Date Code:
YY = Calendar Year
WW = Work Week
203931-021
CC = Country Code
Figure 21. Typical Part Marking
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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DATA SHEET • SKY66296-11: 700 TO 800 MHz HIGH-EFFICIENCY 4 W POWER AMPLIFIER
5.3 mm
16X 0.5 mm
16X 0.67 mm
Pin 16
Pin 1 Indicator
0.20 X 45°
Pin 1
Stencil aperture size for center ground pad should be
80% to 100% (by area) of the solder mask opening
5.3 mm
9X ø0.875 mm
0.8 mm Pitch
Package Outline
0.125 mm Typ
Stencil Aperture
Top View
5.3 mm
5.4 mm
0.6 mm Pitch
16X 0.6 mm
16X 0.77 mm
Pin 16
Pin 16
Pin 1 Indicator
0.20 X 45°
Pin 1
7X 0.67 mm
7X 0.5 mm
Pin 1
0.6 mm Pitch
5.4 mm
2X 1.4375 mm
5.3 mm
0.8 mm Pitch
Thermal via array Ø0.3 mm
on 0.6 mm pitch improves
thermal performance
Package Outline
Package Outline
Opening size of 60% to 100%
of exposed center opening shown
0.8 mm Pitch
2X 1.4375 mm
0.25 mm Typ
Metallization
Top View
Solder Mask Opening
Top View
Notes:
1. Thermal vias should be resin filled and capped in accordance with IPC–4761 type VII vias.
2. Recommended Cu thickness is 30 to 35 μm.
203931-022
Figure 22. SKY66296-11 PCB Layout Footprint
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DATA SHEET • SKY66296-11: 700 TO 800 MHz HIGH-EFFICIENCY 4 W POWER AMPLIFIER
5
B
16X SMT Pad
Top
0.1
M A B C
Pin 16
Pin 1 Indicator
Solder Mask Opening
Pin 1 Indicator
C
0.2
A B C
See Detail C
Pin 1
4X 1.2
4X 0.4
5
0
See Detail B
6X 1
6X 1
See Detail A
8X 2.4
A
1.3 0.1
0.15
A B C
0.1
Top View
Side View
Bottom View
0.42 0.1
(0.1)
0.20 x 45°
0.875
Metal Pad Edge
0.875
5X R0.05 Max.
0.6 0.05
0.875
0.5 0.05
4X R0.05 Max.
0.875
Solder Mask Edges
Solder Mask Edge
Solder Mask Edges
Detail C
Pad
Scale: 2X
1X this rotation
Detail A
Detail B
Pad
Pad
Scale: 2X
Scale: 2X
8X this rotation
4X this rotation
4X rotated 180°
4X rotated 90° CW
4X rotated 90° CCW
Notes:
1. Dimensions are in millimeters (unless otherwise specified).
2. Dimensions and tolerances are in accordance with ASME Y14.5M–1994.
203931-023
Figure 23. SKY66296-11 Package Dimensions
Ø1.50
Pin 1
2.00 0.10
4.00 0.10
1.75 0.10
0.25 0.20
0.10
Ø1.50 0.10
1.40 0.10
8.00 0.10
Notes:
1.Carrier tapes must meet all requirements of Skyworks GP01-D232 procurement spec for tape and reel shipping.
2.Carrier tape shall be black conductive polycarbonate.
5.25 0.10
3.Cover tape shall be transparent conductive material.
4.ESD-surface resistivity shall be ≤ 1 × 1010 Ω/square per EJA, JEDEC TNR specification.
5.All measurements are in millimeters.
203931-024
Figure 24. SKY66296-11 Tape and Reel Dimensions
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
203931C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • May 31, 2017
13
DATA SHEET • SKY66296-11: 700 TO 800 MHz HIGH-EFFICIENCY 4 W POWER AMPLIFIER
Ordering Information
Model Name
Manufacturing Part Number
SKY66296-11
Evaluation Board Part Number
SKY66296-11: 700 to 800 MHz High-Efficiency 4 W Power Amplifier
SKY66296-11-EVB
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May 31, 2017 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 203931C
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