SKY77768-11_技术文档

DATA SHEET

SKY77768 Power Amplifier Module for WCDMA / HSDPA /

HSUPA / HSPA+ / LTE – Band VIII (880 MHz–915 MHz)

Applications

• WCDMA handsets

• HSDPA

Description

The SKY77768 Power Amplifier Module (PAM) is a fully matched 10-pad surface mount module

developed for Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient

module packs full 880-915 MHz bandwidth coverage into a single compact package. Because of high

efficiencies attained throughout the entire power range, the SKY77768 delivers unsurpassed talk-time

advantages. The SKY77768 meets the stringent spectral linearity requirements of High Speed

Downlink Packet Access (HSDPA), High Speed Uplink Packet Access (HSUPA), and Long Term

Evolution (LTE) data transmission with high power added efficiency. An integrated directional coupler

eliminates the need for any external coupler.

• HSUPA

• HSPA+

• LTE

Features

• Low voltage positive bias

supply 3.2 V to 4.2 V

The Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all amplifier

active circuitry, including input and interstage matching circuits. The silicon CMOS support die,

providing precision biasing for the MMIC affords a true CMOS-compatible control interface. Output

match into a 50-ohm load, realized off-chip within the module package, optimizes efficiency and

power performance.

• Good linearity

• High efficiency

- 50% at 28.5 dBm

The SKY77768 is manufactured with Skyworks' InGaP GaAs Heterojunction Bipolar Transistor (HBT)

process which provides for all positive voltage DC supply operation and maintains high efficiency and

good linearity. While primary bias to the SKY77768 can be supplied directly from any suitable battery

with an output of 3.2 V to 4.2 V, optimal performance is obtained with VCC2 sourced from a DCDC

power supply adjusted within 0.5 V to 3.6 V based on target output power levels. Power down

executes by setting VENABLE to zero volts. No external supply side switch is needed as typical "off"

leakage is a few microamperes with full primary voltage supplied from the battery.

• Large dynamic range

• Small, low profile package

- 3 mm x 3 mm x 0.9 mm

- 10-pad configuration

• Power down control

• InGaP

• Supports low collector

voltage operation

• Digital Enable

• No V^REFrequired

• CMOS compatible control

signals

• Integrated Directional

Coupler

FIGURE 1. SKY77768 FUNCTIONAL BLOCK DIAGRAM

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

201722F • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 29, 2012

1

DATA SHEET

SKY77768 POWER AMPLIFIER MODULE for WCDMA /

HSDPA / HSUPA / HSPA+ / LTE – BAND VIII (880–915 MHz)

conditions are listed in Table 4. Table 3 presents a truth table for

the power settings. Tables 5 through 8 provide the standard test

configurations for WCDMA (STC1), HSDPA (STC2), and HSUPA

(STC3, STC4) respectively.

Electrical Specifications

The following tables list the electrical characteristics of the

SKY77768 Power Amplifier. Table 1 lists the absolute maximum

ratings and Table 2 shows the recommended operating

conditions. Electrical specifications for nominal operating

TABLE 1. ABSOLUTE MAXIMUM OPERATING CONDITIONS

No damage assuming only one parameter set at limit at a time with all other parameters set at nominal value.

Parameter

Symbol

Minimum

Nominal

Maximum

Unit

RF Input Power

No RF VCC1

With RF

—

0

10

6.0

dBm

Volts

1

Supply Voltage

3.8

3.4

1.8

+25

—

5.0

No RF VCC2

With RF

—

6.0

—

4.6

Enable Control Voltage

Mode Control Voltage

VEN

—

4.2

Volts

VMODE0

—

4.2

VMODE1

TCASE

TSTG

—

4.2

2

Case Temperature

Operating

Storage

–30

–40

+110

+150

°C

1

Overvoltage shutdown circuitry turns on at approximately 5 V.

2

Case Operating Temperature (TCASE) refers to the temperature of the GROUND PAD at the underside of the package.

TABLE 2. RECOMMENDED OPERATING CONDITIONS

Parameter

Symbol

Minimum

Nominal

Maximum

Unit

1

RF Output Power

WCDMA

HSDPA

HSUPA

LTE

POUT_MAX

28.50

27.50

24.85

27.50

880.0

—

dBm

—

Operating Frequency

Supply Voltage

ƒO

897.5

3.4

—

915.0

4.5

3.6

0.5

3.1

0.5

3.1

+85

MHz

Volts

2

VCC1

3.0

VCC2

0.5

0.0

Enable Control Voltage

Mode Control Voltage

Low

High

Low

VEN_L

VEN_H

VMODE0

VMODE1

VMODE0

VMODE1

TCASE

0.0

1.8

0.0

1.8

+25

Volts

1.35

0.0

High

1.35

–20

3

Case Operating Temperature

°C

1

For VCC < 3.4 V, output power back-off = 0.5 dB.

2

Recommended minimum VCC for maximum power output is indicated. VCC2 down to 0.5 V may be used for backed-off power when using DC/DC converter to conserve battery current.

Equivalent to –30 °C to +75 °C Ambient Operating Temperature

3

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

November 29, 2012 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 201722F

2

SKY77768 POWER AMPLIFIER MODULE for WCDMA /

DATA SHEET

VCC

HSDPA / HSUPA / HSPA+ / LTE – BAND VIII (880–915 MHz)

TABLE 3. MODES OF OPERATION

Power Setting

ENABLE

VMODE0

VMODE1

Power Down Mode

Low

High

Low

—

Low

—

On

Standby Mode

High Power Mode (17.0 dBm ≤ POUT ≤ 28.5 dBm)

Medium Power Mode (7.0 dBm ≤ POUT ≤ 17.0 dBm)

Low Power Mode (POUT ≤ 7.0 dBm)

Low

High

—

Low

High

TABLE 4. ELECTRICAL SPECIFICATIONS FOR NOMINAL OPERATING CONDITIONS

Per Table 2 over dynamic range up to 28.5 dBm output power for STC1 modulation, unless otherwise specified.

Characteristics Symbol Condition Minimum Typical Maximum Unit

POUT = 7.0 dBm

1

Gain

GLOW

10.0

19.0

14.0

24.0

21.5

28.0

dB

VCC2 = 0.8 V

GMED

POUT = 17.0 dBm

VCC2 = 1.5 V

GHIGH

POUT = 28.5 dBm

25.0

—

28.0

—

31.0

–0.5

–3.0

–6.0

—

Rx Band Gain

RxG

—

dB

%

RxG_GPS

RxG_ISM

PAELOW

PAEMED

PAEHIGH

ICC_LOW

ICC_MED

ICC_HIGH

IQ_LOW

IQ_MED

IEN

—

Power Added Efficiency

Total Supply Current

Quiescent Current

POUT = 7.0 dBm

10.5

22.0

43.0

—

13.0

26.5

50.0

44

POUT = 17.0 dBm

POUT = 28.5 dBm

POUT = 7.0 dBm

POUT = 17.0 dBm

POUT = 28.5 dBm

Low Power Mode

Medium Power Mode

—

55

mA

—

122

420

22

150

500

28

—

38

45

Enable Control Current

Mode Control Current

—

20

40

µA

IMODE0

IMODE1

IPD

—

20

40

—

20

40

Total Supply Current in Power Down Mode

VCC = 3.4 V

VEN = Low

—

20

µA

V^MODE0= Low

VMODE1 = Low

ICC1 Current

ICC1_HIGH

—

POUT = 7.0 dBm

POUT = 17.0 dBm

POUT = 28.5 dBm

POUT = 7.0 dBm

POUT = 17.0 dBm

POUT = 28.5 dBm

—

10

mA

2

Adjacent Channel Leakage power Ratio

5 MHz offset ACLR5

–43

–45

–41

–59

–56

–58

–40.0

–38.5

–50.0

dBc

10 MHz offset ACLR10

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

201722F • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 29, 2012

3

DATA SHEET

SKY77768 POWER AMPLIFIER MODULE for WCDMA /

HSDPA / HSUPA / HSPA+ / LTE – BAND VIII (880–915 MHz)

TABLE 4. [CONTINUED] ELECTRICAL SPECIFICATIONS FOR NOMINAL OPERATING CONDITIONS

Per Table 2 over dynamic range up to 28.5 dBm output power for STC1 modulation, unless otherwise specified.

Characteristics

Symbol

Condition

Minimum Typical Maximum Unit

3

4

Adjacent Channel Leakage power Ratio

EUTRA offset ACLR_EUTRA

POUT ≤ (POUT_MAX – MPR )

—

–40

–42

—

dBc

UTRA offset

ACLR1_UTRA

ACLR2_UTRA

—

Harmonic Suppression

Second f02

POUT ≤ 28.5 dBm

–45

–50

–35

–45

dBc

Third

Rx Band 1

GPS Rx

f03

1

Tx Noise in Rx Bands

925 MHz–960 MHz

—

–22

—

–136

—

–134

–140

–143

3.35

2.50

20

dBm/Hz

1574 MHz–1577 MHz

ISM Rx

2400 MHz–2483.5 MHz

—

EVM

EVM1

POUT = POUT_MAX

—

%

EVM2

POUT = POUT_MAX – 3

—

Rise / Fall Time

DC

RF

TON_DC

TOFF_DC

TON_RF

TOFF_RF

CPL

—

µs

—

20

—

6

—

6

Coupling Factor

POUT = POUT_MAX

–20

±0.4

–18

—

dB

CPL_OUT / POUT Power Ratio Variation Over Output VSWR

2.5:1 VSWR at POUT

all VSWR phases

CPL_IN 50 Ω terminated

Daisy-chain

VSWR

CPL_IN and CPL_OUT ports

698 MHz to 2620 MHz

VEN = Low

—

1.3:1

0.45

Insertion Loss

CPL_IN to CPL_OUT ports

698 MHz to 2620 MHz

V^EN= Low

dB

Input Voltage Standing Wave Ratio

VSWR

S

—

6:1 VSWR All phases

POUT ≤ 28.5 dBm

—

1.2:1

—

1.9:1

–70

—

dBc

1

Stability (Spurious output)

1,5

Ruggedness – no damage

Ru

10:1

—

VSWR

1

Over conditions

2

ACLR is expressed as a ratio of total adjacent power to WCDMA modulated in-band, both measured in 3.84 MHz bandwidth at specified offsets.

3

4

5

LTE: EVM and ACLR are measured with QPSK modulation with 1.4 MHz bandwidth and 5 resource blocks. (Maximum Power Reduction = 0 dBm per 3GPP TS36.101.

MPR is the maximum power reduction as defined in 3GPP TS36.101

All phases, time = 10 seconds.

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

November 29, 2012 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 201722F

4

SKY77768 POWER AMPLIFIER MODULE for WCDMA /

DATA SHEET

HSDPA / HSUPA / HSPA+ / LTE – BAND VIII (880–915 MHz)

TABLE 5. STANDARD TEST CONFIGURATION – STC1 WCDMA MODE

Parameter

DPCCH

Level

Spread Code Spread Factor

I/Q

Q

βc

8/15

—

βd

—

βhs

—

βec

—

βed

—

Relative Power (dB)

–6.547

15 kbps

60 kbps

0

256

64

DPDCH

16

I

15/15

—

–1.087

TABLE 6. STANDARD TEST CONFIGURATION – STC2 HSDPA MODE

Parameter

DPCCH

Level

Spread Code Spread Factor

I/Q

Q

βc

12/15

—

βd

—

βhs

—

βec

—

βed

—

Relative Power (dB)

–7.095

15 kbps

60 kbps

15 kbps

0

256

64

DPDCH

16

64

I

15/15

—

–5.157

HS-DPCCH

256

Q

—

24/15

—

–3.012

TABLE 7. STANDARD TEST CONFIGURATION – STC3 HSUPA MODE

Parameter

DPCCH

Level

Spread Code Spread Factor

I/Q

βc

8/15

—

βd

—

βhs

—

βec

—

βed

—

Relative Power (dB)

–19.391

15 kbps

960 kbps

15 kbps

960 kbps

0

1

256

4

Q

I

DPDCH

15/15

—

–13.931

HS- DPCCH

E-DPCCH

E-DPDCH

64

1

256

4

Q

I

—

8/15

—

–19.391

—

10/15

—

–17.338

2

I

—

71.5/15

–0.371

TABLE 8. STANDARD TEST CONFIGURATION – STC4 HSUPA MODE

Parameter

DPCCH

Level

Spread Code Spread Factor

I/Q

βc

6/15

—

βd

—

βhs

—

βec

—

βed

—

Relative Power (dB)

–12.499

15 kbps

960 kbps

15 kbps

960 kbps

0

1

256

4

Q

I

DPDCH

15/15

—

–4.540

HS- DPCCH

E-DPCCH

E-DPDCH

64

1

256

4

Q

I

—

2/15

—

–22.041

—

12/15

—

–6.478

2

I

—

15/15

–4.425

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

201722F • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 29, 2012

5

DATA SHEET

SKY77768 POWER AMPLIFIER MODULE for WCDMA /

HSDPA / HSUPA / HSPA+ / LTE – BAND VIII (880–915 MHz)

diagrams are included for preliminary analysis and design. Figure

2 shows the basic schematic of the board for the 880 MHz to 915

MHz range shown in Figure 3. Figure 4 is a schematic of the

recommended application shown in Figure 5.

Evaluation Board Description

The evaluation board is a platform for testing and interfacing

design circuitry. To accommodate the interface testing of the

SKY77768, the evaluation board schematic and assembly

FIGURE 2. EVALUATION BOARD SCHEMATIC

FIGURE 3. EVALUATION BOARD ASSEMBLY DIAGRAM

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

November 29, 2012 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 201722F

6

SKY77768 POWER AMPLIFIER MODULE for WCDMA/

DATA SHEET

HSDPA / HSUPA / HSPA+ / LTE – BAND VIII (880–915 MHz)

FIGURE 4. SKY77768 SCHEMATIC FOR RECOMMENDED APPLICATION DIAGRAM

FIGURE 5. SKY77768 RECOMMENDED APPLICATION DIAGRAM

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

201722F • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 29, 2012

7

DATA SHEET

SKY77768 POWER AMPLIFIER MODULE for WCDMA /

HSDPA / HSUPA / HSPA+ / LTE – BAND VIII (880–915 MHz)

recommended phone board layout footprint for the PAM to help

the designer attain optimum thermal conductivity, good

grounding, and minimum RF discontinuity for the 50-ohm

terminals.

Package Dimensions

The SKY77768 is a multi-layer laminate base, overmold

encapsulated modular package designed for surface mount solder

attachment to a printed circuit board. Figure 6 is a mechanical

drawing of the pad layout for this package. Figure 7 provides a

FIGURE 6. DIMENSIONAL DIAGRAM FOR 3 mm X 3 mm X 0.9 mm PACKAGE – SKY77768 SPECIFIC

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8

SKY77768 POWER AMPLIFIER MODULE for WCDMA/

DATA SHEET

HSDPA / HSUPA / HSPA+ / LTE – BAND VIII (880–915 MHz)

FIGURE 7. PHONE PCB LAYOUT DIAGRAM – 3 mm X 3 mm, 10-PAD PACKAGE – SKY77768

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

201722F • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 29, 2012

9

DATA SHEET

SKY77768 POWER AMPLIFIER MODULE for WCDMA /

HSDPA / HSUPA / HSPA+ / LTE – BAND VIII (880–915 MHz)

increments counter-clockwise around the package. Typical case

markings are illustrated in Figure 9.

Package Description

Figure 8 shows the pad functions and the pad numbering

convention, which starts with pad 1 in the upper left and

when the part is subjected to high temperature during solder

assembly.

The SKY77768 is capable of withstanding an MSL3/260 °C solder

reflow. Care must be taken when attaching this product, whether

it is done manually or in a production solder reflow environment.

If the part is attached in a reflow oven, the temperature ramp rate

should not exceed 3 °C per second; maximum temperature

should not exceed 260 °C. If the part is manually attached,

precaution should be taken to insure that the part is not subjected

to temperatures exceeding 260 °C for more than 10 seconds. For

details on attachment techniques, precautions, and handling

procedures recommended by Skyworks, please refer to Skyworks

Application Note: PCB Design and SMT Assembly/Rework,

Document Number 101752. Additional information on standard

SMT reflow profiles can also be found in the JEDEC Standard

J-STD-020.

Production quantities of this product are shipped in the standard

tape-and-reel format (Figure 10).

FIGURE 8. SKY77768 PAD NAMES AND CONFIGURATION (TOP VIEW)

Electrostatic Discharge (ESD) Sensitivity

The SKY77768 meets class 1C JESD22-A114 Human Body Model

(HBM), class IV JESD22-C101 Charged-Device Model (CDM), and

class A JESD22-A115 Machine Model (MM) electrostatic

discharge (ESD) sensitivity classification.

To avoid ESD damage, both latent and visible, it is very important

that the product assembly and test areas follow the ESD handling

precautions listed below.

• Personnel Grounding

- Wrist Straps

- Conductive Smocks, Gloves and Finger Cots

- Antistatic ID Badges

• Protective Workstation

- Dissipative Table Top

- Protective Test Equipment (Properly Grounded)

- Grounded Tip Soldering Irons

- Solder Conductive Suckers

- Static Sensors

• Facility

FIGURE 9. TYPICAL CASE MARKINGS

- Relative Humidity Control and Air Ionizers

- Dissipative Floors (less than 1,000 MΩ to GND)

Package Handling Information

• Protective Packaging and Transportation

- Bags and Pouches (Faraday Shield)

- Protective Tote Boxes (Conductive Static Shielding)

- Protective Trays

- Grounded Carts

- Protective Work Order Holders

Because of its sensitivity to moisture absorption, this device

package is baked and vacuum-packed prior to shipment.

Instructions on the shipping container label must be followed

regarding exposure to moisture after the container seal is broken,

otherwise, problems related to moisture absorption may occur

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

November 29, 2012 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 201722F

10

SKY77768 POWER AMPLIFIER MODULE for WCDMA/

DATA SHEET

HSDPA / HSUPA / HSPA+ / LTE – BAND VIII (880–915 MHz)

FIGURE 10. DIMENSIONAL DIAGRAM FOR CARRIER TAPE BODY SIZE – 3 mm X 3 mm X 0.75 / 0.90 mm – MCM

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

201722F • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 29, 2012

11

Ordering Information

Product Name

Order Number

Evaluation Board Part Number

SKY77768 Power Amplifier Module

SKY77768-11

EN40-D345-003

Revision History

Revision

Date

Description

A

B

C

December 20, 2011

January 25, 2012

March 9, 2012

Initial Release – Information

Revise: Figure 1; Table 1

Revise: Table 4; Figures 2, 3, 6, 7

Add: Figures 4, 5

D

E

F

September 19, 2012

October 26, 2012

Revise: Figures 2–5; Tables 2, 4; Ordering Information Table (last page)

Revise: Change Data Sheet status from ADVANCE to FINAL; Table 4; Ordering Information table

November 29, 2012

Revise: Table 1 (Supply Voltage, Case Operating Temperature); Table 2 (Case Operating Temperature

footnote)

References

Skyworks Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752.

Standard SMT Reflow Profiles: JEDEC Standard J–STD–020

Electrostatic Discharge Sensitivity (ESD) Testing: JEDEC Standard, JESD22-A114 Human Body Model (HBM)

Electrostatic Discharge Sensitivity (ESD) Testing: JEDEC Standard, JESD22-A115 Machine Model (MM)

Electrostatic Discharge Sensitivity (ESD) Testing: JEDEC Standard, JESD22-C101 Charged Device Model (CDM).

Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by

Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the

information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to

update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.

No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or

information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and Conditions of

Sale.

THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A

PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY

DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS

SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION,

LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE

POSSIBILITY OF SUCH DAMAGE.

Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury,

death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any

damages resulting from such improper use or sale.

Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of

products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for

applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters.

Skyworks, the Skyworks symbol, “Breakthrough Simplicity,” DCR, Helios, HIP3, Innovation to Go, Intera, iPAC, LIPA, Polar Loop, and System Smart are trademarks or registered trademarks of

Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and names are for identification purposes only, and are the property of their respective owners. Additional

information, including relevant terms and conditions, posted at www.skyworksinc.com, are incorporated by reference.


型号：	SKY77768-11
厂家：	SKYWORKS SOLUTIONS INC.
描述：	RF and Baseband Circuit, Bipolar, GREEN, PACKAGE-10 电信电信集成电路
文件：	总12页 (文件大小：1858K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SKY77768-11 [SKYWORKS]

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