SMP1340-050 [SKYWORKS]
Pin Diode, 50V V(BR), Silicon, CSP-4;
| 型号： | SMP1340-050 |
| 厂家： | 
SKYWORKS SOLUTIONS INC. |
| 描述： | Pin Diode, 50V V(BR), Silicon, CSP-4 |
| 文件： | 总4页 (文件大小：615K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Preliminary
Switching Chip Scale PIN Diodes
SMP1340-050, SMP1353-050
Features
■ Designed for Fast Speed Wireless Switch
Applications
■ Very Low Profile, 0.3 mm
■ Low Inductance (0.25 nH)
■ Designed for High Volume Wireless
Applications, Modules, VCOs
■ Supplied in Punched Paper Carrier Tape
Description
The SMP1340-050 chip scale packaged, surface
mountable PIN diode is designed for high volume switch
applications from 10 MHz to beyond 5 GHz. The
SMP1340-050 has a short carrier lifetime of typically
100 nS, resulting in a fast speed RF switching PIN diode.
The RF performance of the SMP1340-050 is assured by
virtue of its low capacitance (0.3 pF) and low resistance
(1.0 Ω at 10 mA). The SMP1353-050 chip scale
packaged, surface mountable, low capacitance (0.3 pF)
Absolute Maximum Ratings
Characteristic
Value
50 V
Reverse Voltage (V )
R
Power Dissipation @ 25°C Lead
250 mW
silicon PIN diode is designed for large signal switch
applications from 15 MHz to beyond 5 GHz.These diodes
have a reverse voltage rating of 100 V and are designed
for use in low distortion switches that are required to hold
off large RF voltages. The typical 1.5 µS carrier lifetime,
results in a PIN diode with low forward resistance and low
distortion characteristics.
Temperature (P )
D
Storage Temperature (T
)
-65°C to +150°C
-65°C to +150°C
ST
Operating Temperature (T
)
OP
Electrical Specifications at 25°C
Minimum
Breakdown
Voltage
Maximum Total
Capacitance
Maximum Series
Maximum Series
Resistance
IF = 10 mA
f = 100 MHz
(Ω)
Part
Number
Typical Forward
Resistance
IF = 1 mA
f = 100 MHz
(Ω)
Typical Carrier
Lifetime
IF = 10 mA
(nsec)
V
R
= 20 V
Voltage
@ IF = 10 mA
(mV)
I
R
= 10 µA
f = 1 MHz
(pF)
(V)
SMP1340-050
SMP1353-050
50
0.3
0.3
880
825
2.5
15
1.2
2.8
100
100
1000
Skyworks Solutions, Inc. [781] 376-3000 • Fax [781] 376-3100 • Email sales@skyworksinc.com • www.skyworksinc.com
1
Specifications subject to change without notice. 3/03A
Switching Chip Scale PIN Diodes
SMP1340-050, SMP1353-050
Label
Paper Tape Dimensions
P1
P2
P0
D0
E1
F
W
W1
Cover Tape
Reel
D1
T1 (Cover Tape Thickness)
T (Carrier Tape Thickness)
K0
5˚ MAX.
Carrier Tape
8˚ MAX.
A0
B0
Description
Cavity
Length
Width
Sym.
Chip Scale
Chip Scale (-050)
A
B
K
P
0.65 0.05
0.76 0.05
0.53 0.05
2.00 0.10
0
0
0
1
CATHODE INDICATOR
Depth
Pitch
Bottom Hole
Diameter
D
1
N/A
User Direction of Feed
Perforation
Diameter
Pitch
Standard Reel Size
7"
12,000
D
1.50 0.10
4.00 0.10
1.75 0.10
0
0
1
Standard Reel Quantity
P
E
Position
Carrier Tape
Width
-050
W
T
8.00 0.20
0.43 0.05
Thickness
Cover Tape
Width
4X 0.004
(0.102 mm)
4X 0.002
(0.051 mm)
4X 0.002
(0.051 mm)
0.011
(0.280 mm)
W
1
5.40 0.10
Tape
Thickness
T
0.062 0.01
1
4X 0.008
(0.203 mm)
0.0209
(0.530 mm)
0.0228
(0.580 mm)
Distance
Cavity to
F
3.50 0.05
Perforation
(Width Direction)
0.0264 (0.670 mm)
0.0283 (0.720 mm)
Cavity to
P
2
1.00 0.025
Perforation
(Length Direction)
0.020
(0.508 mm)
0.0025
(0.063 mm)
0.0030
Note: All dimensions are in mm.
0.012
(0.305 mm)
(0.076 mm)
2
Skyworks Solutions, Inc. [781] 376-3000 • Fax [781] 376-3100 • Email sales@skyworksinc.com • www.skyworksinc.com
Specifications subject to change without notice. 3/03A
Switching Chip Scale PIN Diodes
SMP1340-050, SMP1353-050
The solder deposit should be centered on the land pattern
as shown.
Land Pattern
The recommended surface mount pad pattern ensures
quality solder joint formation and high-yielding assembly,
while using minimum board space.The dimensions apply
to both Solder Mask Defined (SMD) as well as Non-Solder
Mask Defined (NSMD) pads. However, NSMD pads, in
which the solder mask is pulled back from the metal pad,
are preferred. This type of pad definition generally
produces improved solder joint reliability as well as an
increased gap under the component.The increased gap
is desirable for enhanced cleaning of flux residue and
component underfill for applications in which the
component will be encapsulated.
100 µm
50 µm
Component Placement
375 µm
The CSP can easily be picked and placed on most
placement systems. Care should be taken to select a pick
nozzle that matches the component footprint. Vision
alignment after pick can be done to the package edges or
the package leads, depending on the ability of the individual
placement machine.The component should be placed as
centered as possible to the pad and print patterns to assure
even wetting and an absence of tilt or skew.
600 µm
250 µm
2.00 mm
Solder Printing
The recommended land pattern, when used in
conjunction with the following solder deposit
recommendation, provides quality solder joint formation
and high yielding assembly. Solder should be deposited
with a stencil of foil thickness from 100–125 µm, and
preferably have apertures that are laser-etched and
electro-polished for optimal paste release.The chip scale
package is compatible with most lead-based and lead-free
solder pastes, though a type 3 or type 4 paste is preferred
for the fine aperture printing.
2.30 mm
0.70 mm
0.45 mm
250 µm
400 µm
350 µm
Skyworks Solutions, Inc. [781] 376-3000 • Fax [781] 376-3100 • Email sales@skyworksinc.com • www.skyworksinc.com
3
Specifications subject to change without notice. 3/03A
Switching Chip Scale PIN Diodes
SMP1340-050, SMP1353-050
Solder Reflow
Finished Product
Solder reflow is best suited to convection or IR reflow
systems, though convection reflow will always give more
rapid and uniform thermal transfer. The CSP can be
successfully reflowed in either air or nitrogen
atmospheres. The solder paste manufacturer’s
recommended reflow profile should be adhered to and
care should be taken to ensure that the profile is adjusted
for variability in thermal mass amongst components.
Attached are generic profiles for eutectic tin-lead solder
and a typical lead-free solder.
Once reflowed, the component should be fairly centered
on the land pattern. Solder should wet evenly to CSP leads
and the component should not display excessive tilt or skew.
A solvent flux clean can be safely employed if desired.
These should only be used as a guideline, with the paste
manufacturers recommended profile taking precedence.
A standard solvent flux clean can be safely employed to
remove flux residue from the device edges.
300
270
240
210
180
150
120
90
60
30
0
0
50
100
150
200
250
300
Time (s)
Lead Free Profile
240
210
180
150
120
90
60
30
0
0
50
100
150
200
250
300
Time (s)
Eutectic Tin-Lead Profile
4
Skyworks Solutions, Inc. [781] 376-3000 • Fax [781] 376-3100 • Email sales@skyworksinc.com • www.skyworksinc.com
Specifications subject to change without notice. 3/03A
相关型号：
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Pin Diode, 50V V(BR), Silicon, 1.83 X 1.43 MM, 0.80 MM HEIGHT, GREEN, HERMETIC SEALED, CERAMIC PACKAGE-2
SKYWORKS
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