SMS7620-109 [SKYWORKS]

Mixer Diode, Low Barrier, Silicon, HERMETIC SEALED PACKAGE-1;
SMS7620-109
型号: SMS7620-109
厂家: SKYWORKS SOLUTIONS INC.    SKYWORKS SOLUTIONS INC.
描述:

Mixer Diode, Low Barrier, Silicon, HERMETIC SEALED PACKAGE-1

文件: 总8页 (文件大小:820K)
中文:  中文翻译
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data sheet  
Silicon Schottky Barrier Diodes: Packaged, Bondable Chips  
and Beam-Leads  
Applications  
l
Detectors  
Features  
l
Both P-type and N-type low barrier silicon available  
l
Low 1/f noise  
l
Bonded junctions for reliability  
l
Planar passivated beam-lead and chip construction  
l
See also zero bias silicon schottky barrier detector diodes  
Description  
Skyworks packaged, beam-lead and chip Schottky barrier detector  
diodes are designed for applications through 40 GHz in Ka band.  
Applications  
They are made by the deposition of a suitable barrier metal on an  
These diodes are categorized by TSS (Tangential Signal Sensitivity)  
epitaxial silicon substrate to form the junction. The process and  
for detector applications in four frequency ranges: S, X, Ku, and Ka  
choice of materials result in low series resistance along with a  
band. However, they can also be used as modulators, high-speed  
narrow spread of capacitance values for close impedance control.  
switches and low-power limiters.  
p-type silicon is used to obtain superior 1/f noise characteristics.  
TSS is a parameter that describes a diode’s detector sensitivity. It  
is defined as the amount of signal power, below a one-milliwatt  
reference level, to produce an output pulse whose amplitude is  
sufficient to raise the noise fluctuations by an amount equal to the  
average noise level. TSS is approximately 4 dB above the Minimum  
Detectable Signal.  
n-type silicon is also available.  
Packaged diodes are suitable for use in waveguide, coaxial, and  
stripline applications.  
Beam-lead and chip diodes can also be mounted in a variety of  
packages or on special customer substrates.  
Unmounted beam-lead diodes are especially well suited for use in  
MIC applications. Mounted beam-lead diodes can be easily used in  
MIC, stripline or other such circuitry.  
The p-type Schottky diodes in this data sheet are optimized for  
low noise, in the 1/f region. They require a small forward bias (to  
reduce video resistance) if efficient operation is required. Bias not  
only increases sensitivity but also reduces parameter variation  
due to temperature change. Video impedance is a direct function  
of bias and follows the 26/l (mA) relationship. This is important to  
pulse fidelity, since the video impedance in conjunction with the  
detector output capacitance affects the effective amplifier  
bandwidth.  
The “Universal Chips” are designed for a high degree of device  
reliability in both commercial and industrial uses. The offset  
bond pad assures that no mechanical damage will occur at the  
junction during the wire bonding. Additionally the 4 mil bond pad  
eliminates performance variation due to bonding and is ideal for  
automated assembly, and improves efficiency during manual  
operations as well.  
Bias does, however, increase typical noise, particularly in the 1/f  
region. Therefore, it should be kept at as low a level as possible  
(typically 5–50 microamps). Typical voltage output versus power  
input as a function of load resistance and bias is shown in Figures  
1a and 1b.  
The choice on n- and p-type silicon allows for the designer to opti-  
mize the silicon material for the intended application.  
l
Doppler mixers, high-sensitivity detectors will benefit from using  
the low noise characteristics of the p-type silicon.  
l
Low conversion loss mixers and biased detectors can be  
designed using standard n-type material.  
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com  
200847 Rev. A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • October 3, 2008  
1
Data Sheet • Silicon Schottky Barrier DioDeS: PackageD, BonDaBle chiPS anD Beam-leaDS  
Wire Bonding  
Assembly and Handling Procedure  
Two methods can be used to connect wire, ribbon, and wire mesh  
to the chips:  
Die Attach Methods  
Universal chips are compatible with both eutectic and conductive  
epoxy die attach methods.  
l
Thermocompression  
l
Ballbonding  
Eutectic composition performs of Au/Sn or Au/Ge are useful when  
soldering devices in circuit. Gold/silicon eutectic die attach can  
be accomplished by scrubbing the chip directly to the gold plated  
bonding area.  
Skyworks recommends use of pure gold wire  
(0.7–1.25 mil diameter).  
Epoxy die attach with silver or gold filled conductive epoxies can  
also be used where thermal heat sinking is not a requirement.  
Beam-Lead P-Type Detector Schottky Diodes  
tꢅsꢃ  
eꢆꢅꢇꢃꢂꢈꢇꢀꢆ cꢉꢀꢂꢀꢇꢃꢅꢂꢈsꢃꢈꢇs  
cꢊꢁdꢈꢃꢈꢊꢁs  
V
F
V
B
Frꢀquꢀncy  
Bꢀꢁd  
Pꢀꢂꢃ  
nuꢄbꢅꢂ  
tss –  
dBꢄ  
r
(W)  
c @ 0V  
(pF)  
@ 1 ꢄa  
(ꢄv)  
@ 10 ꢄa  
(V)  
Frꢀquꢀncy  
(ghz)  
ouꢃꢆꢈꢁꢅ  
Dꢂꢀwꢈꢁꢋ  
V
J
1,2  
typ.  
mꢈꢁ.  
mꢀx.  
mꢀx.  
X
Ku  
K
DDB2503–000  
DDB2504–000  
DDB2265–000  
50  
48  
50  
500  
500  
800  
700  
700  
1200  
0.15  
0.10  
0.10  
200–350  
200–350  
300–450  
2
2
3
10  
16  
24.15  
491–006  
491–006  
491–006  
3
3
3
1. Bias = 50 µA.  
2. Video bandwidth = 10 MHz.  
3. Bias = 30 µA.  
Epoxy and Hermetic Packaged Beam-Lead P-Type Detector Schottky Diodes  
epꢊxꢌ Sꢃꢂꢈpꢆꢈꢁꢅ  
250  
epꢊxꢌ Sꢃꢂꢈpꢆꢈꢁꢅ  
230  
hꢅꢂꢄꢅꢃꢈꢇ Sꢃꢂꢈpꢆꢈꢁꢅ  
220  
DDB2503-250  
DDB2504-250  
DDB2265-250  
DDB2503-230  
DDB2504-230  
DDB2265-230  
DDB2503-220  
DDB2504-220  
DDB2265-220  
P-Type Detector Schottky Diode Universal Chips  
eꢆꢅꢇꢃꢂꢈꢇꢀꢆ cꢉꢀꢂꢀꢇꢃꢅꢂꢈsꢃꢈꢇs  
V
r
V
B
F
t
Frꢀquꢀncy  
Bꢀꢁd  
Pꢀꢂꢃ  
nuꢄbꢅꢂ  
tss –  
dBꢄ  
c @ 0V  
(pF)  
@ 1 ꢄa  
(ꢄv)  
@ 10 ꢄa  
(W)  
@ 10 ꢄa  
(V)  
ouꢃꢆꢈꢁꢅ  
Dꢂꢀwꢈꢁꢋ  
J
1,2,4  
mꢈꢁ.  
mꢀx.  
mꢀx.  
mꢈꢁ.  
Ku  
K
CDB7620–000  
CDB7619–000  
40  
50  
0.15  
0.10  
250–350  
300–450  
30  
40  
2
3
571–006  
571–006  
3
1. Bias = 50 µA.  
2. Video bandwidth = 10 MHz.  
3. Bias = 30 µA.  
4. RV = 2800 W.  
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com  
October 3, 2008 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200847 Rev. A  
2
Data Sheet • Silicon Schottky Barrier DioDeS: PackageD, BonDaBle chiPS anD Beam-leaDS  
Hermetic Packaged P-Type Detector Schottky Diode Chips  
Hermetic Pill  
207  
Hermetic Pill  
203  
Hermetic  
109  
CDB7620-207  
CDB7619-207  
CDB7620-203  
CDB7619-203  
SMS7620-109  
SMS7619-109  
N-Type Detector Schottky Diode Chips  
eꢆꢅꢇꢃꢂꢈꢇꢀꢆ cꢉꢀꢂꢀꢇꢃꢅꢂꢈsꢃꢈꢇs  
mꢀx. r  
V
mꢈꢁ. V  
B
@ 10 µa  
(V)  
ouꢃꢆꢈꢁꢅ  
Dꢂꢀwꢈꢁꢋ  
nuꢄbꢅꢂ  
F
t
Frꢀquꢀncy  
Bꢀꢁd  
Pꢀꢂꢃ  
nuꢄbꢅꢂ  
@ 1 ꢄa  
(ꢄv)  
mꢀx. c @ 0V  
@ 10 ꢄa  
J
Bꢀꢂꢂꢈꢅꢂ  
(pF)  
(W)  
X
K
Ku  
K
CDF7623–000  
CDF7621–000  
CME7660–000  
CDE7618–000  
CDP7624–000  
Low  
Low  
Med  
Med  
Med/High  
240–300  
270–350  
350–450  
375–500  
450–575  
0.30  
0.10  
0.15  
0.10  
0.15  
10  
20  
10  
20  
15  
2
2
3
3
3
571-011  
571-011  
571-011  
571-011  
571-011  
Ku  
Hermetic Packaged Beam-Lead N-Type Detector Schottky Diode Chips  
hꢅꢂꢄꢅꢃꢈꢇ cꢅꢂꢀꢄꢈꢇ Pꢈꢆꢆ  
hꢅꢂꢄꢅꢃꢈꢇ cꢅꢂꢀꢄꢈꢇ Pꢈꢆꢆ  
hꢅꢂꢄꢅꢃꢈꢇ Suꢂfꢀꢇꢅ mꢊuꢁꢃ  
207  
203  
108  
CDF7623-207  
CDF7621-207  
CME7660-207  
CDE7618-207  
CDP7624-207  
CDF7623-203  
CDF7621-203  
CME7660-203  
CDE7618-203  
CDP7624-203  
SMS7623-108  
SMS7621-108  
SMS7660-108  
SMS7618-108  
SMS7624-108  
SPICE Model Parameters  
Shipping Information  
Pꢀꢂꢃ nuꢄbꢅꢂ  
Individual Chips  
Pꢀꢂꢀꢄꢅꢃꢅꢂ Uꢁꢈꢃ cDF7620-000 cDF7621-000 cDc7623-000 cDB7619-000  
Standard packaging procedures at Skyworks are for “waffle  
pack” delivery. Devices can also be packaged on “Gel Pack”  
carriers.  
I
A
W
4e–08  
4
9e–08  
6
1.1e–7  
5
3e–08  
30  
S
R
S
n
1.2  
1.1  
1.1  
1.04  
1e–11  
0.11  
0.32  
0.69  
0.54  
2
Wafer Shipment for Whole Wafer  
T
s
1e–11  
0.15  
0.35  
0.69  
0.495  
2
1e–11  
0.11  
0.3  
1e–11  
0.2  
D
Packaging options include delivery for devices on film frame  
where wafer is sawn on wafer gel pack for uncut, unsawn wafer.  
C
J0  
pF  
m
0.3  
E
eV  
V
0.69  
0.51  
2
0.69  
0.51  
2
G
V
J
X
TI  
FC  
0.5  
0.5  
0.5  
0.5  
B
V
V
10  
2.5  
2.5  
3
I
A
1e–05  
1e–05  
1e–05  
1e–05  
BV  
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com  
200847 Rev. A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • October 3, 2008  
3
Data Sheet • Silicon Schottky Barrier DioDeS: PackageD, BonDaBle chiPS anD Beam-leaDS  
Typical I-V Characteristics  
Typical Performance Data  
10000.00  
10-1  
RL = 10 kW  
RL = 1 MW  
RL = 100 kW  
RL = 1 kW  
RL = 100 W  
1000.00  
10-2  
10-3  
100.00  
10.00  
1.00  
RL = 10 W  
10-4  
10-5  
10-6  
RL = 1 W  
Test Conditions:  
F = 9.375 GHz  
DC Bias = 0  
0.10  
-30  
-20  
-10  
0
10  
20  
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0  
Power Input (dBm)  
VF (V)  
Figure 1a. Voltage Output vs. Power Input  
As a Function of Load Resistance  
cDF7621-000  
10000.00  
1000.00  
100.00  
10.00  
10-1  
10-2  
RL = 1 MW  
RL = 1 kW  
50 µA  
50 µA  
10-3  
5 µA  
RL = 10 W  
10-4  
10-5  
10-6  
5 µA  
1.00  
Test Conditions:  
F = 9.375 GHz  
5 µA  
-20  
0.10  
-30  
-10  
Power Input (dBm)  
Figure 1b. Voltage Output vs. Power Input  
As a Function of Load Resistance and Bias  
0
10  
20  
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0  
VF (V)  
cDB7619-000  
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com  
October 3, 2008 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200847 Rev. A  
4
Data Sheet • Silicon Schottky Barrier DioDeS: PackageD, BonDaBle chiPS anD Beam-leaDS  
a) Unbiased  
Input  
491–006  
RF Bypass  
0.013 (0.33 mm)  
0.011 (0.28 mm)  
Video Output  
Load Resistor  
DC Return  
0.011 (0.28 mm)  
0.009 (0.23 mm)  
0.006 (0.15 mm)  
0.004 (0.10 mm)  
2 Plcs.  
Bias Supply  
0.009 (0.23 mm)  
0.007 (0.18 mm)  
0.009 (0.23 mm)  
0.007 (0.18 mm)  
a) Biased  
Input  
RF Bypass  
0.006 (0.015 mm)  
0.003 (0.005 mm)  
Video Output  
0.0025 (0.06 mm)  
Max.  
Load Resistor  
Top View  
DC Return  
Schematic  
Multi-Octave–High Sensitivity  
a) Unbiased  
Input  
RF Bypass  
Video Output  
Load Resistor  
Bias Supply  
a) Biased  
Input  
RF Bypass  
Video Output  
Load Resistor  
50 W  
Broadband–Low Sensitivity  
Figure 2. Typical Video Detector Circuits  
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com  
200847 Rev. A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • October 3, 2008  
5
Data Sheet • Silicon Schottky Barrier DioDeS: PackageD, BonDaBle chiPS anD Beam-leaDS  
-250  
-220  
Schematic  
-011 (220)  
Schematic  
1
2
1
2
0.100 (2.54 mm)  
Dia.  
0.090 (2.28 mm)  
0.110 (2.79 mm)  
2 Plcs.  
Colored Dot  
Denotes Cathode  
0.185 (4.70 mm)  
0.145 (3.68 mm)  
3 Plcs.  
0.068 (1.73 mm)  
0.064 (1.63 mm)  
Dia.  
1
2
0.018 (0.45 mm)  
0.122 (0.55 mm)  
2 Plcs.  
50 Deg.  
40 Deg.  
Epoxy Encapsulation  
Au-Plated Leads  
0.018 (0.45 mm)  
0.122 (0.55 mm)  
0.022 (0.56 mm)  
0.018 (0.46 mm)  
3 Plcs.  
Colored Dot  
Denotes Cathode  
0.003 (0.08 mm)  
0.005 (0.13 mm)  
0.070 (1.78 mm)  
Sq.  
0.050 (1.27 mm)  
Max.  
130-011  
-230  
0.042 (1.07 mm)  
0.028 (0.71 mm)  
0.005 (0.13 mm)  
0.003 (0.08 mm)  
3 Plcs.  
Schematic  
1
2
2
404-011  
Colored Dot  
Denotes Cathode  
0.090 (2.29 mm)  
Min. 2 Plcs.  
-207  
1
0.013 (0.33 mm)  
0.017 (0.43 mm)  
2 Plcs.  
50 Deg.  
40 Deg.  
Epoxy Encapsulation  
Schematic  
P-type  
Schematic  
N-type  
Au-Plated Leads  
0.030  
(0.76 mm)  
Max.  
0.003 (0.08 mm)  
0.005 (0.13 mm)  
0.0ꢀ6 (2.1ꢀ mm)  
Max. Dia.  
0.064 (1.63 mm)  
0.060 (1.52 mm)  
Dia. 2 Plcs.  
0.008 (0.20 mm)  
0.012 (0.30 mm)  
Ceramic Base  
0.051 (1.30 mm)  
0.055 (1.40 mm)  
464-011  
Metal  
Ceramic  
-203  
Schematic  
N-Type  
0.200 (5.0ꢀ mm)  
Nom.  
0.076 (2.10 mm)  
0.006 (1.7ꢀ mm)  
0.050 (1.27 mm)  
0.040 (1.02 mm)  
Metal  
0.062 (1.63 mm)  
0.002 (1.52 mm)  
2 Plcs  
0.055 (1.40 mm)  
0.051 (1.30 mm)  
Dia.  
207-001  
247-001  
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com  
October 3, 2008 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200847 Rev. A  
6
Data Sheet • Silicon Schottky Barrier DioDeS: PackageD, BonDaBle chiPS anD Beam-leaDS  
-108  
-109  
0.35 Max. Typ.  
0.35 Max. Typ.  
0.43 0.05  
0.43 0.05  
Cathode  
Indicator  
0.60 Typ.  
0.60 Typ.  
2
1
0.35 Max. Typ.  
0.35 Max. Typ.  
Cathode  
Pin 1 Indicator  
0.45 0.05 2 ꢀPlc.  
Bottom View  
0.45 0.05 2 Plcꢀ.  
Bottom View  
1
2
2
1
1.83 0.10  
1.00 (Max.)  
Gold-Plated  
Kovar Lid  
1.83 0.10  
1.00 (Max.)  
Gold-Plated  
Kovar Lid  
X X  
X X  
1.43 0.10  
1.43 0.10  
0.15 Typ.  
0.15 Typ.  
Cathode Indilator  
Top View  
Side View  
Top View  
Side View  
586-011  
APP dimencionc in mm  
All dimensions in mm  
585-006  
571-011  
571–006  
Cathode/Bonding Pad  
Diameter 0.0035–0.0045  
Anode/Bonding Pad  
Diameter 0.0035–0.0045  
0.013 (0.33 mm)  
0.011 (0.28 mm)  
0.013 (0.33 mm)  
0.011 (0.28 mm)  
0.013 (0.33 mm)  
0.011 (0.28 mm)  
0.013 (0.33 mm)  
0.011 (0.28 mm)  
0.0085 (0.216 mm)  
0.0065 (0.165 mm)  
0.0085 (0.216 mm)  
0.0065 (0.165 mm)  
Backside Contact (Andode)  
Gold Metallization  
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com  
200847 Rev. A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • October 3, 2008  
7
Data Sheet • Silicon Schottky Barrier DioDeS: PackageD, BonDaBle chiPS anD Beam-leaDS  
Copyright © 2002, 2003, 2004, 2005, 2006, 2007, 2008, Skyworks Solutions, Inc. All Rights Reserved.  
Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided  
by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the  
information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to  
update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.  
No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or  
information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and  
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THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A  
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Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury,  
death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any  
damages resulting from such improper use or sale.  
Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of  
products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for  
applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters.  
Skyworks, the Skyworks symbol, and “Breakthrough Simplicity” are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands  
and names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com, are  
incorporated by reference.  
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com  
8
October 3, 2008 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200847 Rev. A  

相关型号:

SMS7621

Surface Mount Mixer and Detector Schottky Diodes
SKYWORKS

SMS7621-001

Surface Mount Mixer and Detector Schottky Diodes
ALPHA

SMS7621-001

Surface Mount Mixer and Detector Schottky Diodes
SKYWORKS

SMS7621-001LF

Surface Mount Mixer and Detector Schottky Diodes
SKYWORKS

SMS7621-005

Surface Mount Mixer and Detector Schottky Diodes
ALPHA

SMS7621-005

Surface Mount Mixer and Detector Schottky Diodes
SKYWORKS

SMS7621-005LF

Surface Mount Mixer and Detector Schottky Diodes
SKYWORKS

SMS7621-006

Surface Mount Mixer and Detector Schottky Diodes
ALPHA

SMS7621-006

Surface Mount Mixer and Detector Schottky Diodes
SKYWORKS

SMS7621-006LF

Surface Mount Mixer and Detector Schottky Diodes
SKYWORKS

SMS7621-011

Surface Mount Mixer and Detector Schottky Diodes
ALPHA

SMS7621-015

Surface Mount Mixer and Detector Schottky Diodes
ALPHA