SMS7620-109 [SKYWORKS]
Mixer Diode, Low Barrier, Silicon, HERMETIC SEALED PACKAGE-1;
| 型号： | SMS7620-109 |
| 厂家： | 
SKYWORKS SOLUTIONS INC. |
| 描述： | Mixer Diode, Low Barrier, Silicon, HERMETIC SEALED PACKAGE-1 |
| 文件： | 总8页 (文件大小：820K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
data sheet
Silicon Schottky Barrier Diodes: Packaged, Bondable Chips
and Beam-Leads
Applications
l
Detectors
Features
l
Both P-type and N-type low barrier silicon available
l
Low 1/f noise
l
Bonded junctions for reliability
l
Planar passivated beam-lead and chip construction
l
See also zero bias silicon schottky barrier detector diodes
Description
Skyworks packaged, beam-lead and chip Schottky barrier detector
diodes are designed for applications through 40 GHz in Ka band.
Applications
They are made by the deposition of a suitable barrier metal on an
These diodes are categorized by TSS (Tangential Signal Sensitivity)
epitaxial silicon substrate to form the junction. The process and
for detector applications in four frequency ranges: S, X, Ku, and Ka
choice of materials result in low series resistance along with a
band. However, they can also be used as modulators, high-speed
narrow spread of capacitance values for close impedance control.
switches and low-power limiters.
p-type silicon is used to obtain superior 1/f noise characteristics.
TSS is a parameter that describes a diode’s detector sensitivity. It
is defined as the amount of signal power, below a one-milliwatt
reference level, to produce an output pulse whose amplitude is
sufficient to raise the noise fluctuations by an amount equal to the
average noise level. TSS is approximately 4 dB above the Minimum
Detectable Signal.
n-type silicon is also available.
Packaged diodes are suitable for use in waveguide, coaxial, and
stripline applications.
Beam-lead and chip diodes can also be mounted in a variety of
packages or on special customer substrates.
Unmounted beam-lead diodes are especially well suited for use in
MIC applications. Mounted beam-lead diodes can be easily used in
MIC, stripline or other such circuitry.
The p-type Schottky diodes in this data sheet are optimized for
low noise, in the 1/f region. They require a small forward bias (to
reduce video resistance) if efficient operation is required. Bias not
only increases sensitivity but also reduces parameter variation
due to temperature change. Video impedance is a direct function
of bias and follows the 26/l (mA) relationship. This is important to
pulse fidelity, since the video impedance in conjunction with the
detector output capacitance affects the effective amplifier
bandwidth.
The “Universal Chips” are designed for a high degree of device
reliability in both commercial and industrial uses. The offset
bond pad assures that no mechanical damage will occur at the
junction during the wire bonding. Additionally the 4 mil bond pad
eliminates performance variation due to bonding and is ideal for
automated assembly, and improves efficiency during manual
operations as well.
Bias does, however, increase typical noise, particularly in the 1/f
region. Therefore, it should be kept at as low a level as possible
(typically 5–50 microamps). Typical voltage output versus power
input as a function of load resistance and bias is shown in Figures
1a and 1b.
The choice on n- and p-type silicon allows for the designer to opti-
mize the silicon material for the intended application.
l
Doppler mixers, high-sensitivity detectors will benefit from using
the low noise characteristics of the p-type silicon.
l
Low conversion loss mixers and biased detectors can be
designed using standard n-type material.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200847 Rev. A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • October 3, 2008
1
Data Sheet • Silicon Schottky Barrier DioDeS: PackageD, BonDaBle chiPS anD Beam-leaDS
Wire Bonding
Assembly and Handling Procedure
Two methods can be used to connect wire, ribbon, and wire mesh
to the chips:
Die Attach Methods
Universal chips are compatible with both eutectic and conductive
epoxy die attach methods.
l
Thermocompression
l
Ballbonding
Eutectic composition performs of Au/Sn or Au/Ge are useful when
soldering devices in circuit. Gold/silicon eutectic die attach can
be accomplished by scrubbing the chip directly to the gold plated
bonding area.
Skyworks recommends use of pure gold wire
(0.7–1.25 mil diameter).
Epoxy die attach with silver or gold filled conductive epoxies can
also be used where thermal heat sinking is not a requirement.
Beam-Lead P-Type Detector Schottky Diodes
tꢅsꢃ
eꢆꢅꢇꢃꢂꢈꢇꢀꢆ cꢉꢀꢂꢀꢇꢃꢅꢂꢈsꢃꢈꢇs
cꢊꢁdꢈꢃꢈꢊꢁs
V
F
V
B
Frꢀquꢀncy
Bꢀꢁd
Pꢀꢂꢃ
nuꢄbꢅꢂ
tss –
dBꢄ
r
(W)
c @ 0V
(pF)
@ 1 ꢄa
(ꢄv)
@ 10 ꢄa
(V)
Frꢀquꢀncy
(ghz)
ouꢃꢆꢈꢁꢅ
Dꢂꢀwꢈꢁꢋ
V
J
1,2
typ.
mꢈꢁ.
mꢀx.
mꢀx.
X
Ku
K
DDB2503–000
DDB2504–000
DDB2265–000
50
48
50
500
500
800
700
700
1200
0.15
0.10
0.10
200–350
200–350
300–450
2
2
3
10
16
24.15
491–006
491–006
491–006
3
3
3
1. Bias = 50 µA.
2. Video bandwidth = 10 MHz.
3. Bias = 30 µA.
Epoxy and Hermetic Packaged Beam-Lead P-Type Detector Schottky Diodes
epꢊxꢌ Sꢃꢂꢈpꢆꢈꢁꢅ
250
epꢊxꢌ Sꢃꢂꢈpꢆꢈꢁꢅ
230
hꢅꢂꢄꢅꢃꢈꢇ Sꢃꢂꢈpꢆꢈꢁꢅ
220
DDB2503-250
DDB2504-250
DDB2265-250
DDB2503-230
DDB2504-230
DDB2265-230
DDB2503-220
DDB2504-220
DDB2265-220
P-Type Detector Schottky Diode Universal Chips
eꢆꢅꢇꢃꢂꢈꢇꢀꢆ cꢉꢀꢂꢀꢇꢃꢅꢂꢈsꢃꢈꢇs
V
r
V
B
F
t
Frꢀquꢀncy
Bꢀꢁd
Pꢀꢂꢃ
nuꢄbꢅꢂ
tss –
dBꢄ
c @ 0V
(pF)
@ 1 ꢄa
(ꢄv)
@ 10 ꢄa
(W)
@ 10 ꢄa
(V)
ouꢃꢆꢈꢁꢅ
Dꢂꢀwꢈꢁꢋ
J
1,2,4
mꢈꢁ.
mꢀx.
mꢀx.
mꢈꢁ.
Ku
K
CDB7620–000
CDB7619–000
40
50
0.15
0.10
250–350
300–450
30
40
2
3
571–006
571–006
3
1. Bias = 50 µA.
2. Video bandwidth = 10 MHz.
3. Bias = 30 µA.
4. RV = 2800 W.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
October 3, 2008 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200847 Rev. A
2
Data Sheet • Silicon Schottky Barrier DioDeS: PackageD, BonDaBle chiPS anD Beam-leaDS
Hermetic Packaged P-Type Detector Schottky Diode Chips
Hermetic Pill
207
Hermetic Pill
203
Hermetic
109
CDB7620-207
CDB7619-207
CDB7620-203
CDB7619-203
SMS7620-109
SMS7619-109
N-Type Detector Schottky Diode Chips
eꢆꢅꢇꢃꢂꢈꢇꢀꢆ cꢉꢀꢂꢀꢇꢃꢅꢂꢈsꢃꢈꢇs
mꢀx. r
V
mꢈꢁ. V
B
@ 10 µa
(V)
ouꢃꢆꢈꢁꢅ
Dꢂꢀwꢈꢁꢋ
nuꢄbꢅꢂ
F
t
Frꢀquꢀncy
Bꢀꢁd
Pꢀꢂꢃ
nuꢄbꢅꢂ
@ 1 ꢄa
(ꢄv)
mꢀx. c @ 0V
@ 10 ꢄa
J
Bꢀꢂꢂꢈꢅꢂ
(pF)
(W)
X
K
Ku
K
CDF7623–000
CDF7621–000
CME7660–000
CDE7618–000
CDP7624–000
Low
Low
Med
Med
Med/High
240–300
270–350
350–450
375–500
450–575
0.30
0.10
0.15
0.10
0.15
10
20
10
20
15
2
2
3
3
3
571-011
571-011
571-011
571-011
571-011
Ku
Hermetic Packaged Beam-Lead N-Type Detector Schottky Diode Chips
hꢅꢂꢄꢅꢃꢈꢇ cꢅꢂꢀꢄꢈꢇ Pꢈꢆꢆ
hꢅꢂꢄꢅꢃꢈꢇ cꢅꢂꢀꢄꢈꢇ Pꢈꢆꢆ
hꢅꢂꢄꢅꢃꢈꢇ Suꢂfꢀꢇꢅ mꢊuꢁꢃ
207
203
108
CDF7623-207
CDF7621-207
CME7660-207
CDE7618-207
CDP7624-207
CDF7623-203
CDF7621-203
CME7660-203
CDE7618-203
CDP7624-203
SMS7623-108
SMS7621-108
SMS7660-108
SMS7618-108
SMS7624-108
SPICE Model Parameters
Shipping Information
Pꢀꢂꢃ nuꢄbꢅꢂ
Individual Chips
Pꢀꢂꢀꢄꢅꢃꢅꢂ Uꢁꢈꢃ cDF7620-000 cDF7621-000 cDc7623-000 cDB7619-000
Standard packaging procedures at Skyworks are for “waffle
pack” delivery. Devices can also be packaged on “Gel Pack”
carriers.
I
A
W
–
4e–08
4
9e–08
6
1.1e–7
5
3e–08
30
S
R
S
n
1.2
1.1
1.1
1.04
1e–11
0.11
0.32
0.69
0.54
2
Wafer Shipment for Whole Wafer
T
s
1e–11
0.15
0.35
0.69
0.495
2
1e–11
0.11
0.3
1e–11
0.2
D
Packaging options include delivery for devices on film frame
where wafer is sawn on wafer gel pack for uncut, unsawn wafer.
C
J0
pF
–
m
0.3
E
eV
V
0.69
0.51
2
0.69
0.51
2
G
V
J
X
–
TI
FC
–
0.5
0.5
0.5
0.5
B
V
V
10
2.5
2.5
3
I
A
1e–05
1e–05
1e–05
1e–05
BV
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200847 Rev. A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • October 3, 2008
3
Data Sheet • Silicon Schottky Barrier DioDeS: PackageD, BonDaBle chiPS anD Beam-leaDS
Typical I-V Characteristics
Typical Performance Data
10000.00
10-1
RL = 10 kW
RL = 1 MW
RL = 100 kW
RL = 1 kW
RL = 100 W
1000.00
10-2
10-3
100.00
10.00
1.00
RL = 10 W
10-4
10-5
10-6
RL = 1 W
Test Conditions:
F = 9.375 GHz
DC Bias = 0
0.10
-30
-20
-10
0
10
20
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Power Input (dBm)
VF (V)
Figure 1a. Voltage Output vs. Power Input
As a Function of Load Resistance
cDF7621-000
10000.00
1000.00
100.00
10.00
10-1
10-2
RL = 1 MW
RL = 1 kW
50 µA
50 µA
10-3
5 µA
RL = 10 W
10-4
10-5
10-6
5 µA
1.00
Test Conditions:
F = 9.375 GHz
5 µA
-20
0.10
-30
-10
Power Input (dBm)
Figure 1b. Voltage Output vs. Power Input
As a Function of Load Resistance and Bias
0
10
20
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
VF (V)
cDB7619-000
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
October 3, 2008 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200847 Rev. A
4
Data Sheet • Silicon Schottky Barrier DioDeS: PackageD, BonDaBle chiPS anD Beam-leaDS
a) Unbiased
Input
491–006
RF Bypass
0.013 (0.33 mm)
0.011 (0.28 mm)
Video Output
Load Resistor
DC Return
0.011 (0.28 mm)
0.009 (0.23 mm)
0.006 (0.15 mm)
0.004 (0.10 mm)
2 Plcs.
Bias Supply
0.009 (0.23 mm)
0.007 (0.18 mm)
0.009 (0.23 mm)
0.007 (0.18 mm)
a) Biased
Input
RF Bypass
0.006 (0.015 mm)
0.003 (0.005 mm)
Video Output
0.0025 (0.06 mm)
Max.
Load Resistor
Top View
DC Return
Schematic
Multi-Octave–High Sensitivity
a) Unbiased
Input
RF Bypass
Video Output
Load Resistor
Bias Supply
a) Biased
Input
RF Bypass
Video Output
Load Resistor
50 W
Broadband–Low Sensitivity
Figure 2. Typical Video Detector Circuits
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200847 Rev. A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • October 3, 2008
5
Data Sheet • Silicon Schottky Barrier DioDeS: PackageD, BonDaBle chiPS anD Beam-leaDS
-250
-220
Schematic
-011 (220)
Schematic
1
2
1
2
0.100 (2.54 mm)
Dia.
0.090 (2.28 mm)
0.110 (2.79 mm)
2 Plcs.
Colored Dot
Denotes Cathode
0.185 (4.70 mm)
0.145 (3.68 mm)
3 Plcs.
0.068 (1.73 mm)
0.064 (1.63 mm)
Dia.
1
2
0.018 (0.45 mm)
0.122 (0.55 mm)
2 Plcs.
50 Deg.
40 Deg.
Epoxy Encapsulation
Au-Plated Leads
0.018 (0.45 mm)
0.122 (0.55 mm)
0.022 (0.56 mm)
0.018 (0.46 mm)
3 Plcs.
Colored Dot
Denotes Cathode
0.003 (0.08 mm)
0.005 (0.13 mm)
0.070 (1.78 mm)
Sq.
0.050 (1.27 mm)
Max.
130-011
-230
0.042 (1.07 mm)
0.028 (0.71 mm)
0.005 (0.13 mm)
0.003 (0.08 mm)
3 Plcs.
Schematic
1
2
2
404-011
Colored Dot
Denotes Cathode
0.090 (2.29 mm)
Min. 2 Plcs.
-207
1
0.013 (0.33 mm)
0.017 (0.43 mm)
2 Plcs.
50 Deg.
40 Deg.
Epoxy Encapsulation
Schematic
P-type
Schematic
N-type
Au-Plated Leads
0.030
(0.76 mm)
Max.
0.003 (0.08 mm)
0.005 (0.13 mm)
0.0ꢀ6 (2.1ꢀ mm)
Max. Dia.
0.064 (1.63 mm)
0.060 (1.52 mm)
Dia. 2 Plcs.
0.008 (0.20 mm)
0.012 (0.30 mm)
Ceramic Base
0.051 (1.30 mm)
0.055 (1.40 mm)
464-011
Metal
Ceramic
-203
Schematic
N-Type
0.200 (5.0ꢀ mm)
Nom.
0.076 (2.10 mm)
0.006 (1.7ꢀ mm)
0.050 (1.27 mm)
0.040 (1.02 mm)
Metal
0.062 (1.63 mm)
0.002 (1.52 mm)
2 Plcs
0.055 (1.40 mm)
0.051 (1.30 mm)
Dia.
207-001
247-001
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
October 3, 2008 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200847 Rev. A
6
Data Sheet • Silicon Schottky Barrier DioDeS: PackageD, BonDaBle chiPS anD Beam-leaDS
-108
-109
0.35 Max. Typ.
0.35 Max. Typ.
0.43 0.05
0.43 0.05
Cathode
Indicator
0.60 Typ.
0.60 Typ.
2
1
0.35 Max. Typ.
0.35 Max. Typ.
Cathode
Pin 1 Indicator
0.45 0.05 2 ꢀPlc.
Bottom View
0.45 0.05 2 Plcꢀ.
Bottom View
1
2
2
1
1.83 0.10
1.00 (Max.)
Gold-Plated
Kovar Lid
1.83 0.10
1.00 (Max.)
Gold-Plated
Kovar Lid
X X
X X
1.43 0.10
1.43 0.10
0.15 Typ.
0.15 Typ.
Cathode Indilator
Top View
Side View
Top View
Side View
586-011
APP dimencionc in mm
All dimensions in mm
585-006
571-011
571–006
Cathode/Bonding Pad
Diameter 0.0035–0.0045
Anode/Bonding Pad
Diameter 0.0035–0.0045
0.013 (0.33 mm)
0.011 (0.28 mm)
0.013 (0.33 mm)
0.011 (0.28 mm)
0.013 (0.33 mm)
0.011 (0.28 mm)
0.013 (0.33 mm)
0.011 (0.28 mm)
0.0085 (0.216 mm)
0.0065 (0.165 mm)
0.0085 (0.216 mm)
0.0065 (0.165 mm)
Backside Contact (Andode)
Gold Metallization
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200847 Rev. A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • October 3, 2008
7
Data Sheet • Silicon Schottky Barrier DioDeS: PackageD, BonDaBle chiPS anD Beam-leaDS
Copyright © 2002, 2003, 2004, 2005, 2006, 2007, 2008, Skyworks Solutions, Inc. All Rights Reserved.
Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided
by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the
information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to
update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.
No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or
information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and
Conditions of Sale.
THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A
PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY
DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS
SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION,
LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGE.
Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury,
death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any
damages resulting from such improper use or sale.
Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of
products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for
applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters.
Skyworks, the Skyworks symbol, and “Breakthrough Simplicity” are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands
and names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com, are
incorporated by reference.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
8
October 3, 2008 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200847 Rev. A
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